Electronic device with millimeter wave and ultra-wideband antenna module

Abstract

The present disclosure relates to electronic devices with millimeter wave and ultra- wideband antenna modules. An electronic device can include first and second phased antenna arrays and a triad of first, second, and third ultra-wideband antennas. Antenna modules in the device can include a dielectric substrate. The first and second arrays and the triad can be formed on the dielectric substrate. The third and second ultra-wideband antennas can be separated by a gap. The first array can be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna can be laterally interposed between the first phased antenna array and at least some of the second arrays. An interposer can be used to mount integrated circuits to the dielectric substrate. The antenna modules can occupy a minimal amount of space within the device, and manufacturing costs can be lower relative to the case where arrays and ultra-wideband antennas are formed on separate substrates.

Description

[0001] This application claims priority to U.S. Patent Application No. 17 / 026,974, filed September 21, 2020, the entire contents of which are incorporated herein by reference. Background Technology

[0002] This disclosure relates generally to electronic devices, and more specifically to electronic devices with wireless communication capabilities.

[0003] Electronic devices such as laptops and cellular phones typically possess wireless communication capabilities. To meet consumer demand for small-form-factor wireless devices, manufacturers have been continuously striving to achieve wireless communication circuitry using compact structures, such as antenna components. Simultaneously, there is a growing expectation that wireless devices will cover an increasing number of communication frequency bands.

[0004] Because antennas can interfere with each other and with components in wireless devices, extra care must be taken when integrating antennas into electronic devices. Furthermore, it is essential to ensure that the antennas and wireless circuitry within the device exhibit satisfactory performance and have satisfactory efficiency bandwidth across a range of operating frequencies.

[0005] Therefore, there is a need to provide improved wireless communication circuits for wireless electronic devices. Summary of the Invention

[0006] The electronic device may include a wireless circuit and a housing. The housing may have housing walls. The wireless circuit may include an antenna that radiates through the housing walls. The antenna may include a first phased antenna array and a second phased antenna array, as well as a triplet of a first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna. The first phased antenna array and the second phased antenna array may radiate at a first frequency and a second frequency greater than 10 GHz. The first phased antenna array, the second phased antenna array, and the triplet ultra-wideband antenna may be formed on the same antenna module.

[0007] The antenna module may have a dielectric substrate. The first phased antenna array, the second phased antenna array, and the triplet ultra-wideband antenna may be formed on the dielectric substrate. The third ultra-wideband antenna and the second ultra-wideband antenna may be separated by a gap. The first phased antenna array may be laterally inserted between the third ultra-wideband antenna and the second ultra-wideband antenna within the gap. The third ultra-wideband antenna may be laterally inserted between at least some of the second phased antenna arrays in the first and second phased antenna arrays.

[0008] An interposer can be used to mount a radio frequency integrated circuit (RFIC) onto the dielectric substrate. The RFIC may include phase and amplitude controllers for the first and second phased antenna arrays. When configured in this way, the antenna module occupies minimal space within the device. Compared to a scenario where the phased antenna array and ultra-wideband antenna are formed on a separate antenna module, this antenna module may also require fewer interconnects and may be easier and less expensive to manufacture. Attached Figure Description

[0009] Figure 1 It is a perspective view of an exemplary electronic device based on some implementation schemes.

[0010] Figure 2 It is a schematic diagram of an exemplary circuit in an electronic device according to some implementation schemes.

[0011] Figure 3 It is a schematic diagram of an exemplary wireless circuit based on some implementation schemes.

[0012] Figure 4 This is an illustration of an exemplary electronic device that communicates wirelessly with external nodes in a network, according to some implementation schemes.

[0013] Figure 5 This is a diagram illustrating how the location (e.g., range of arrival and angle of arrival) of an external node in a network can be determined relative to an electronic device, according to some implementation schemes.

[0014] Figure 6 This is a diagram illustrating how an exemplary ultra-wideband antenna in an electronic device according to some embodiments can be used to detect the angle of arrival.

[0015] Figure 7 This is an illustration of an exemplary phased antenna array that can be adjusted using control circuitry according to some implementation schemes to guide a signal beam.

[0016] Figure 8 This is a bottom view of an exemplary antenna module with an ultra-wideband antenna and a phased antenna array, according to some implementation schemes.

[0017] Figure 9 This is a side view of an exemplary antenna module according to some implementations, which has a radio frequency integrated circuit mounted to a wiring layer using an interposer.

[0018] Figure 10 This is a side view of an exemplary antenna module according to some implementation schemes, which has a radio frequency integrated circuit mounted to a wiring layer using a flexible integrated circuit. Detailed Implementation

[0019] Electronic devices such as Figure 1 The electronic device 10 may be equipped with wireless circuitry including an antenna. The antenna can be used to transmit and / or receive wireless radio frequency signals.

[0020] Device 10 may be a portable electronic device or other suitable electronic device. For example, device 10 may be a laptop computer, tablet computer, smaller devices (such as wristwatches, wall-mounted devices, headphones, handsets, or other wearable or micro-devices), handheld devices (such as cellular phones), media players, or other small portable devices. Device 10 may also be a set-top box, desktop computer, display with integrated computer or other processing circuitry, display without integrated computer, wireless access point, wireless base station, electronic equipment integrated into a newsstand, building, or vehicle, or other suitable electronic equipment.

[0021] Device 10 may include a housing such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or combinations of these materials. In some cases, components of housing 12 may be formed of dielectric or other low-conductivity materials (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12 or at least some of the structures constituting housing 12 may be formed of metallic elements.

[0022] If desired, device 10 may have a display such as display 14. Display 14 may be mounted on the front of device 10. Display 14 may be a capacitive touch electrode or a touchscreen that is not sensitive to touch. The back of housing 12 (i.e., the side of device 10 opposite to the front of device 10) may have a substantially flat housing wall, such as a rear housing wall 12R (e.g., a planar housing wall). The rear housing wall 12R may have a gap that extends completely through the rear housing wall, thus separating portions of housing 12 from each other. The rear housing wall 12R may include conductive and / or dielectric portions. If desired, the rear housing wall 12R may include a planar metal layer covered by a thin layer or dielectric coating such as glass, plastic, sapphire, or ceramic (e.g., a dielectric overlay). Housing 12 may also have shallow grooves that do not extend completely through housing 12. The gaps or grooves may be filled with plastic or other dielectric materials. If necessary, the portions of the housing 12 that are separated from each other (e.g., by means of through slots) can be joined by internal conductive structures (e.g., metal sheets or other metal components bridging the slots).

[0023] The housing 12 may include peripheral housing structures such as peripheral structure 12W. The conductive portions of peripheral structure 12W and the conductive portions of the rear housing wall 12R are sometimes collectively referred to herein as the conductive structure of housing 12. Peripheral structure 12W may extend around the periphery of device 10 and display 14. In a configuration where device 10 and display 14 have a rectangular shape with four edges, peripheral structure 12W may be implemented using a peripheral housing structure having a rectangular ring shape with four corresponding edges and extending from the rear housing wall 12R to the front of device 10 (by way of example). In other words, device 10 may have a length (e.g., measured parallel to the Y-axis), a width less than the length (e.g., measured parallel to the X-axis), and a height less than the width (e.g., measured parallel to the Z-axis). If desired, peripheral structure 12W or a portion thereof may serve as a frame for display 14 (e.g., surrounding all four sides of display 14 and / or decorative embellishments that help hold display 14 to device 10). If necessary, the peripheral structure 12W can form the sidewall structure of the device 10 (e.g., by forming a metal strip with vertical sidewalls, curved sidewalls, etc.).

[0024] The peripheral structure 12W may be formed of a conductive material (such as a metal) and is therefore sometimes referred to as a peripheral conductive shell structure, conductive shell structure, peripheral metal structure, peripheral conductive sidewall, peripheral conductive sidewall structure, conductive shell sidewall, peripheral conductive shell sidewall, sidewall, sidewall structure, or peripheral conductive shell member (by way of example). The peripheral conductive shell structure 12W may be formed of a metal such as stainless steel, aluminum, alloy, or other suitable material. One, two, or more than two separate structures may be used to form the peripheral conductive shell structure 12W.

[0025] The peripheral conductive housing structure 12W does not necessarily have a uniform cross-section. For example, if desired, the top of the peripheral conductive housing structure 12W may have an inwardly projecting flange that helps hold the display 14 in place. The bottom of the peripheral conductive housing structure 12W may also have an enlarged lip (e.g., in the plane of the back of the device 10). The peripheral conductive housing structure 12W may have substantially straight vertical sidewalls, may have curved sidewalls, or may have other suitable shapes. In some configurations (e.g., when the peripheral conductive housing structure 12W is used as the frame of the display 14), the peripheral conductive housing structure 12W may extend around the lip of the housing 12 (i.e., the peripheral conductive housing structure 12W may only cover the edge of the housing 12 surrounding the display 14 and not the remaining sidewalls of the housing 12).

[0026] The rear housing wall 12R may be located in a plane parallel to the display 14. In the configuration of device 10, where some or all of the rear housing wall 12R is formed of metal, it may be necessary to form a portion of the peripheral conductive housing structure 12W as an integrated part of the housing structure forming the rear housing wall 12R. For example, the rear housing wall 12R of device 10 may include a planar metal structure, and a portion of the peripheral conductive housing structure 12W on the side of housing 12 may be formed as a flat or curved vertically extending integrated metal portion of the planar metal structure (e.g., housing structures 12R and 12W may be formed from a continuous sheet of metal in a monolithic configuration). If desired, housing structures such as these housing structures may be machined from a block of metal, and / or may include multiple metal pieces assembled together to form housing 12. The rear housing wall 12R may have one or more, two or more, or three or more parts. The conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R may form one or more outer surfaces of the device 10 (e.g., user-visible surfaces of the device 10), and / or may be implemented using internal structures that do not form outer surfaces of the device 10 (e.g., conductive housing structures not visible to the user of the device 10, such as conductive structures covered with layers (e.g., thin decorative layers, protective coatings, and / or other coatings that may include dielectric materials such as glass, ceramics, and plastics) or other structures that form outer surfaces of the device 10 and / or serve to conceal the conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R from being seen by the user).

[0027] Display 14 may have a pixel array forming an effective area AA, which displays an image of the user of device 10. For example, the effective area AA may include a display pixel array. The pixel array may be formed from liquid crystal display (LCD) components, electrophoretic pixel arrays, plasma display pixel arrays, organic light-emitting diode display pixels or other light-emitting diode pixel arrays, electrowetting display pixel arrays, or display pixels based on other display technologies. If desired, the effective area AA may include a touch sensor, such as a touch sensor capacitive electrode, a force sensor, or other sensors for collecting user input.

[0028] Display 14 may have invalid boundary regions extending along one or more edges of the active region AA. The invalid region IA of display 14 may lack pixels for displaying images and may overlap with circuitry and other internal device structures within housing 12. To prevent these structures from being viewed by the user of device 10, an opaque masking layer may be applied to the underside of the display overlay or to other layers in display 14 that overlap with the invalid region IA. The opaque masking layer may have any suitable color. The invalid region IA may include recessed areas, such as notches 24 extending into the active region AA. The active region AA may be defined, for example, by a lateral region of a display module of display 14 (e.g., a display module including pixel circuitry, touch sensor circuitry, etc.). The display module may have recesses or notches in the upper region 20 of device 10 that lack active display circuitry (i.e., notches 24 forming the invalid region IA). The notch 24 may be a substantially rectangular region surrounded (defined) by the active region AA on three sides and surrounded by the peripheral conductive housing structure 12W on the fourth side.

[0029] A display cover can be used to protect the display 14. The display cover may be made of a layer of clear glass, transparent plastic, clear ceramic, sapphire, or other clear crystalline material, or one or more other transparent layers. The display cover may have a planar shape, a convex curved profile, a shape with planar and curved portions, a layout including a planar main area surrounding one or more edges (part of which is bent out of the plane of the planar main area), or other suitable shapes. The display cover may cover the entire front of the device 10. In another suitable arrangement, the display cover may substantially cover all of the front of the device 10 or only a portion of the front of the device 10. Openings may be formed in the display cover. For example, openings may be formed in the display cover to accommodate buttons. Openings may also be formed in the display cover to accommodate ports such as speaker port 16 or microphone port in recess 24. If desired, openings may be formed in the housing 12 to form communication ports (e.g., audio jack ports, digital data ports, etc.) and / or audio ports for audio components, such as speakers and / or microphones.

[0030] Display 14 may include conductive structures such as capacitive electrode arrays for touch sensors, conductive lines for addressing pixels, driver circuitry, etc. Housing 12 may include internal conductive structures such as metal frame members and planar conductive housing members (sometimes referred to as conductive support plates or back plates) spanning the walls of housing 12 (e.g., a substantially rectangular sheet formed by welding or otherwise connecting one or more metal portions between opposing sides of the peripheral conductive housing structure 12W). The conductive support plate may form the outer rear surface of device 10, or may be covered by a dielectric overlay (such as a thin decorative layer, protective coating, and / or other coatings that may include dielectric materials such as glass, ceramic, or plastic) or other structures that form the outer surface of device 10 and / or serve to conceal the conductive support plate from being seen by the user (e.g., the conductive support plate may form part of the rear housing wall 12R). Device 10 may also include conductive structures such as printed circuit boards, components mounted on the printed circuit boards, and other internal conductive structures. For example, these conductive structures, which may be used to form a ground layer in device 10, may extend under the effective area AA of display 14.

[0031] In regions 22 and 20, openings may be formed within the conductive structures of device 10 (e.g., between the peripheral conductive housing structure 12W and the opposing conductive grounding structure (such as the conductive portion of the rear housing wall 12R, conductive traces on a printed circuit board, conductive electronic components in display 14, etc.)). If desired, these openings, sometimes referred to as gaps, may be filled with air, plastic, and / or other dielectrics and may be used to form slot antenna resonant elements for one or more antennas in device 10.

[0032] The conductive housing structure and other conductive structures in device 10 can be used as a ground plane for the antenna in device 10. The openings in regions 22 and 20 can be used as slots in open or closed slot antennas, as central dielectric regions surrounded by conductive paths of material in loop antennas, as spaces separating antenna resonant elements (such as strip antenna resonant elements or inverted F-shaped antenna resonant elements) from the ground plane, to aid in the performance of parasitic antenna resonant elements, or otherwise as part of the antenna structures formed in regions 22 and 20. If desired, the ground plane under the effective area AA of the display 14 and / or other metallic structures in device 10 may have a portion extending into a portion of the end of device 10 (e.g., the ground portion may extend toward the dielectric-filled openings in regions 22 and 20), thereby narrowing the slots in regions 22 and 20. Region 22 may sometimes be referred to herein as the lower region 22 or lower end 22 of device 10. Region 20 may sometimes be referred herein as the upper region 20 or upper end 20 of device 10.

[0033] Generally, device 10 may include any suitable number of antennas (e.g., one or more, two or more, three or more, four or more, etc.). The antennas in device 10 may be located along one or more edges of the device housing at opposite first and second ends of the elongated device housing (e.g., at...). Figure 1 The device 10 may be located in the lower region 22 and / or upper region 20, in the center of the device housing, in other suitable locations, or in one or more of these locations. Figure 1 The arrangement is only illustrative.

[0034] The outer conductive shell structure 12W may include an outer gap structure. For example, the outer conductive shell structure 12W may have one or more dielectric-filled gaps, such as... Figure 1 The gap 18 is shown. Gaps in the peripheral conductive housing structure 12W can be filled using dielectrics such as polymers, ceramics, glass, air, other dielectric materials, or combinations thereof. Gaps 18 divide the peripheral conductive housing structure 12W into one or more peripheral conductive segments. If desired, conductive segments formed in this way can form a portion of an antenna in device 10. Other dielectric openings can be formed in the peripheral conductive housing structure 12W (e.g., dielectric openings other than gap 18) and can serve as dielectric antenna windows for antennas mounted inside device 10. Antennas within device 10 can be aligned with dielectric antenna windows for transmitting radio frequency signals through the peripheral conductive housing structure 12W. Antennas within device 10 can also be aligned with inactive areas IA of display 14 for transmitting radio frequency signals through display 14.

[0035] To provide the end user of device 10 with the largest possible display (e.g., maximizing the area of ​​the device used for displaying media, running applications, etc.), it is desirable to increase the amount of area covered by the effective area AA of display 14 on the front of device 10. Increasing the size of the effective area AA can reduce the size of the ineffective area IA within device 10. This reduces the area behind display 14 available for antennas within device 10. For example, the effective area AA of display 14 may include conductive structures to prevent radio frequency signals processed by an antenna mounted behind the effective area AA from radiating through the front of device 10. Therefore, it is desirable to provide an antenna that occupies a small amount of space within device 10 (e.g., allowing the largest possible effective display area AA) while still allowing the antenna to communicate with wireless equipment outside device 10 with satisfactory efficiency bandwidth.

[0036] In a typical scenario, device 10 may have one or more upper antennas and one or more lower antennas. For example, an upper antenna may be formed in the upper region 20 of device 10. A lower antenna may be formed in the lower region 22 of device 10. If desired, additional antennas may be formed along the edge of the housing 12 extending between region 22 and region 20. Examples of device 10 including three or four upper antennas and five lower antennas are described herein as examples. Antennas may be used individually to cover the same communication band, overlapping communication bands, or separate communication bands. The antenna may be used to implement an antenna diversity scheme or a multiple-input multiple-output (MIMO) antenna scheme. Additional antennas for covering any other desired frequencies may also be mounted within device 10 at any desired location. Figure 1 The examples provided are merely illustrative. If desired, the housing 12 may have other shapes (e.g., square, cylindrical, spherical, combinations of these shapes, and / or different shapes, etc.).

[0037] Figure 2 A schematic diagram of an exemplary component that can be used in device 10 is shown. Figure 2 As shown, device 10 may include control circuitry 38. Control circuitry 38 may include storage devices such as storage circuitry 30. Storage circuitry 30 may include hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random access memory), etc.

[0038] Control circuitry 38 may include processing circuitry such as processing circuitry 32. Processing circuitry 32 may be used to control the operation of device 10. Processing circuitry 32 may include one or more microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application-specific integrated circuits, central processing units (CPUs), etc. Control circuitry 38 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code for performing operations in device 10 may be stored on storage circuitry 30 (e.g., storage circuitry 30 may include a non-transitory (tangible) computer-readable storage medium storing software code). This software code may sometimes be referred to as program instructions, software, data, commands, or code. The software code stored on storage circuitry 30 may be executed by processing circuitry 32.

[0039] Control circuitry 38 can be used to run software on device 10, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interaction with external equipment, control circuitry 38 can be used to implement communication protocols. Communication protocols that can be implemented using control circuitry 38 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol—sometimes referred to as...). Protocols for other short-range wireless communication links, such as This includes protocols such as WPAN protocols, IEEE 802.11ad protocols, cellular phone protocols, MIMO protocols, antenna diversity protocols, satellite navigation system protocols, antenna-based spatial ranging protocols (e.g., Radio Detection and Ranging (RADAR) protocols or other desired distance detection protocols for signals transmitted at millimeter-wave and centimeter-wave frequencies), etc. Each communication protocol may be associated with a corresponding radio access technology (RAT) that specifies the physical connection method used to implement the protocol.

[0040] Device 10 may include input-output circuitry 26. Input-output circuitry 26 may include input-output devices 28. Input-output devices 28 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output devices 28 may include user interface devices, data port devices, sensors, and other input-output components. For example, input-output devices may include touchscreens, displays without touch sensor capabilities, buttons, joysticks, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, speakers, status indicators, light sources, audio jacks, and other audio port components, digital data port devices, light sensors, gyroscopes, accelerometers, or other components capable of detecting motion and device orientation relative to the earth, capacitive sensors, proximity sensors (e.g., capacitive proximity sensors and / or infrared proximity sensors), magnetic sensors, and other sensors and input-output components.

[0041] Input-output circuitry 26 may include wireless circuitry, such as wireless circuitry 34 for wireless transmission of radio frequency signals. Although for clarity... Figure 2 In the example, control circuitry 38 is shown separately from wireless circuitry 34, but wireless circuitry 34 may include processing circuitry forming part of processing circuitry 32 and / or storage circuitry forming part of storage circuitry 30 forming part of control circuitry 38 (e.g., a portion of control circuitry 38 that may be implemented on wireless circuitry 34). For example, control circuitry 38 may include baseband processor circuitry or other control components forming part of wireless circuitry 34.

[0042] Wireless circuit 34 may include radio frequency (RF) transceiver circuitry comprising one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive radio frequency (RF) components, one or more antennas, transmission lines, and other circuitry for processing RF wireless signals. Light (e.g., infrared communication) may also be used to transmit wireless signals.

[0043] Wireless circuit 34 may include radio frequency transceiver circuitry 36 for transmitting and / or receiving radio frequency signals in various radio frequency communication bands. For example, radio frequency transceiver circuitry 36 may handle wireless local area network (WLAN) communication bands, such as 2.4 GHz and 5 GHz. (IEEE 802.11) band; Wireless Personal Area Network (WPAN) communication bands, such as 2.4 GHz. Communication frequency bands; cellular telephone communication frequency bands, such as the cellular low frequency band (LB) (e.g., 600MHz to 960MHz), the cellular low intermediate frequency band (LMB) (e.g., 1400MHz to 1550MHz), the cellular intermediate frequency band (MB) (e.g., from 1700MHz to 2200MHz), the cellular high frequency band (HB) (e.g., from 2300MHz to 2700MHz), the cellular ultra-high frequency band (UHB) (e.g., from 3300MHz to 5000MHz), or other cellular communication frequency bands between approximately 600MHz and approximately 5000MHz (e.g., 3G bands, 4G bands). LTE bands, 5G New Radio Frequency Range 1 (FR1) band below 10 GHz, 5G New Radio Frequency Range 2 (FR2) band at millimeter and centimeter wavelengths between 20 GHz and 60 GHz, etc.; Near Field Communication (NFC) bands (e.g., at 13.56 MHz); Satellite Navigation bands (e.g., L1 Global Positioning System (GPS) band at 1575 MHz, L5 GPS band at 1176 MHz, Global Navigation Satellite System (GLONASS) band, BeiDou Navigation Satellite System (BDS) band, etc.); Ultra-Wideband (UWB) communication bands supported by the IEEE 802.15.4 protocol and / or other UWB communication protocols (e.g., a first UWB communication band at 6.5 GHz and / or a second UWB communication band at 8.0 GHz); and / or any other desired communication bands. The communication bands processed by the RF transceiver circuit 36 ​​may sometimes be referred to herein as frequency bands or simply "bands" and may span corresponding frequency ranges.

[0044] The UWB communication band processed by the RF transceiver circuit 36 ​​can be based on a pulse radio signaling scheme using band-limited data pulses. RF signals in the UWB frequency band can have any desired bandwidth, such as bandwidths between 499MHz and 1331MHz, bandwidths greater than 500MHz, etc. The existence of lower frequencies in the baseband can sometimes allow ultra-wideband signals to penetrate objects such as walls. For example, in an IEEE 802.15.4 system, a pair of electronic devices can exchange wireless timestamped messages. The timestamps in the messages can be analyzed to determine the message's time of flight, thereby determining the distance (range) between the devices and / or the angle between the devices (e.g., the angle of arrival of the incoming RF signal).

[0045] The RF transceiver circuit 36 ​​may include a corresponding transceiver (e.g., a transceiver integrated circuit or chip) for processing each of these frequency bands, or any desired number of transceivers for processing two or more of these frequency bands. In scenarios where different transceivers are coupled to the same antenna, filter circuitry (e.g., duplexer circuitry, dual-signal circuitry, low-pass filter circuitry, high-pass filter circuitry, band-pass filter circuitry, band-stop filter circuitry, etc.), switching circuitry, multiplexing circuitry, or any other desired circuitry may be used to isolate the RF signals transmitted by each transceiver through the same antenna (e.g., filter circuitry or multiplexing circuitry may be inserted on the RF transmission line shared by the transceivers). The radio frequency transceiver circuit 36 ​​may include one or more integrated circuits (chips), integrated circuit packages (e.g., multiple integrated circuits mounted on a common printed circuit in a system-in-package device, one or more integrated circuits mounted on different substrates, etc.), power amplifier circuits, up-conversion circuits, down-conversion circuits, low-noise input amplifiers, passive radio frequency components, switching circuits, transmission line structures, and other circuits for processing radio frequency signals and / or for converting signals between radio frequency, intermediate frequency, and / or baseband frequencies.

[0046] Generally speaking, the RF transceiver circuit 36 ​​can cover (process) any desired frequency band. For example... Figure 2As shown, wireless circuitry 34 may include antenna 40. Radio frequency transceiver circuitry 36 may use one or more antennas 40 to transmit radio frequency signals (e.g., antenna 40 may transmit radio frequency signals for transceiver circuitry). As used herein, the term "transmit radio frequency signals" means the transmission and / or reception of radio frequency signals (e.g., for performing one-way and / or two-way wireless communication with external wireless communication equipment). Antenna 40 may transmit radio frequency signals by radiating them (or through an intermediary device structure such as a dielectric overlay) into free space. Alternatively or additionally, antenna 40 may receive radio frequency signals from free space (e.g., through an intermediary device structure such as a dielectric overlay). The transmission and reception of radio frequency signals by antenna 40 each involve the excitation or resonance of antenna currents on antenna resonant elements in the antenna by radio frequency signals within the antenna's operating frequency band.

[0047] The antenna 40 in the wireless circuit 34 can be formed using any suitable antenna type. For example, the antenna 40 may include an antenna with a resonant element, formed from a stacked patch antenna structure, a loop antenna structure, a patch antenna structure, an inverted F-shaped antenna structure, a slot antenna structure, a planar inverted F-shaped antenna structure, a waveguide structure, a monopole antenna structure, a dipole antenna structure, a helical antenna structure, a Yagi-Uda antenna structure, a mixture of these designs, etc. In another suitable arrangement, the antenna 40 may include an antenna with a dielectric resonant element, such as a dielectric resonant antenna. If desired, one or more antennas 40 may be cavity-backed antennas. If desired, two or more antennas 40 may be arranged as a phased antenna array (e.g., for transmitting centimeter and / or millimeter-wave signals). Different types of antennas may be used for different frequency bands and combinations of frequency bands.

[0048] In a suitable arrangement described herein by way of example, antenna 40 includes a first set of antennas for transmitting radio frequency signals in the UWB band and a second set of antennas forming one or more phased antenna arrays. The first set of antennas may include triplet or binary antennas (sometimes referred to herein as UWB antennas) for transmitting radio frequency signals in the UWB band. The phased antenna arrays may use millimeter-wave and / or centimeter-wave signals to transmit radio frequency signals. Millimeter-wave signals, sometimes referred to as extremely high frequency (EHF) signals, propagate at frequencies above about 30 GHz (e.g., at 60 GHz or other frequencies between about 30 GHz and 300 GHz). Centimeter-wave signals propagate at frequencies between about 10 GHz and 30 GHz. In a suitable arrangement described herein by way of example, each phased antenna array may transmit radio frequency signals in a first 5G NR FR2 band of about 24 GHz to 30 GHz and a second 5G NR FR2 band of about 37 GHz to 43 GHz. For example, each phased antenna array may include a first set of antennas transmitting radio frequency signals in a first 5G NR FR2 band and a second set of antennas transmitting radio frequency signals in a second 5G NR FR2 band.

[0049] Figure 3 A schematic diagram of wireless circuit 34 is shown. (For example...) Figure 3 As shown, wireless circuit 34 may include transceiver circuit 36, which is coupled to a given antenna 40 using a radio frequency transmission line path such as radio frequency transmission line path 50.

[0050] To provide an antenna structure such as antenna 40 with the ability to cover different frequencies of interest, antenna 40 may be provided with circuitry such as filter circuitry (e.g., one or more passive filters and / or one or more tunable filter circuits). Discrete components such as capacitors, inductors, and resistors may be incorporated into the filter circuitry. The capacitor, inductor, and resistor structures may also be formed from patterned metal structures (e.g., a portion of the antenna). If desired, antenna 40 may be provided with adjustable circuitry such as tunable components for tuning the antenna to the communication (frequency) band of interest. The tunable components may be part of a tunable filter or a tunable impedance matching network, may be part of an antenna resonant element, may span the gap between the antenna resonant element and the antenna ground, etc.

[0051] The radio frequency transmission line path 50 may include one or more radio frequency transmission lines (sometimes simply referred to herein as transmission lines). The radio frequency transmission line path 50 (e.g., transmission lines in the radio frequency transmission line path 50) may include positive signal conductors such as positive signal conductor 52 and ground signal conductors such as ground conductor 54.

[0052] The transmission lines in the RF transmission line path 50 may include, for example, coaxial cable transmission lines (e.g., ground conductor 54 may be implemented as a grounded conductive braid surrounding signal conductor 52 along its length), stripline transmission lines (e.g., where ground conductor 54 extends along both sides of signal conductor 52), microstrip transmission lines (e.g., where ground conductor 54 extends along one side of signal conductor 52), coaxial probes implemented with metallized vias, edge-coupled microstrip transmission lines, edge-coupled stripline transmission lines, coaxial probes implemented with waveguide structures (e.g., coplanar waveguides or grounded coplanar waveguides), combinations of these types of transmission lines and / or other transmission line structures, etc. In a suitable arrangement, sometimes described herein as an example, the RF transmission line path 50 may include stripline transmission lines coupled to transceiver circuitry 36 and microstrip transmission lines coupled between stripline transmission lines and antenna 40.

[0053] The transmission lines of the RF transmission line path 50 can be integrated into rigid and / or flexible printed circuit boards. In a suitable arrangement, the RF transmission line path 50 may include transmission line conductors (e.g., signal conductor 52 and ground conductor 54) integrated within a multilayer laminate structure (e.g., layers of conductive materials (such as copper) and dielectric materials (such as resin) laminated together without the intervention of adhesives). If desired, the multilayer laminate structure can be folded or bent in multiple dimensions (e.g., two-dimensional or three-dimensional) and can retain its bent or folded shape after bending (e.g., the multilayer laminate structure can be folded into a specific three-dimensional structural shape for wiring around other device components and can be rigid enough to retain its shape after folding without the need for reinforcements or other structures to hold it in place). All the multiple layers of the laminate structure can be laminated together in batches without adhesives (e.g., in a single pressing process) (e.g., in contrast to performing multiple pressing processes to laminate multiple layers together with adhesives).

[0054] The matching network may include components such as inductors, resistors, and capacitors for matching the impedance of antenna 40 to the impedance of RF transmission line path 50. Matching network components may be provided as discrete components (e.g., surface mount technology components) or may be formed from housing structures, printed circuit board structures, traces on plastic supports, etc. Components such as these may also be used to form filter circuitry in antenna 40 and may be tunable and / or fixed components.

[0055] The radio frequency transmission line path 50 can be coupled to an antenna feed structure associated with the antenna 40. For example, the antenna 40 can be formed as an inverted F-shaped antenna, a planar inverted F-shaped antenna, a patch antenna, or other antennas having an antenna feed section 44 with a positive antenna feed terminal such as positive antenna feed terminal 46 and a ground antenna feed terminal such as ground antenna feed terminal 48. The positive antenna feed terminal 46 can be coupled to the antenna resonant element of the antenna 40. The ground antenna feed terminal 48 can be coupled to the antenna ground section of the antenna 40.

[0056] Signal conductor 52 may be coupled to positive antenna feed terminal 46 and ground conductor 54 may be coupled to ground antenna feed terminal 48. Other types of antenna feed arrangements may be used if desired. For example, antenna 40 may be fed using multiple feed sections, each coupled to a corresponding port of transceiver circuitry 36 via a corresponding transmission line. If desired, signal conductor 52 may be coupled to multiple locations on antenna 40 (e.g., antenna 40 may include multiple positive antenna feed terminals of signal conductor 52 coupled to the same RF transmission line path 50). If desired, a switch may be inserted on the signal conductor between transceiver circuitry 36 and positive antenna feed terminals (e.g., selectively activating one or more positive antenna feed terminals at any given time). Figure 3 The exemplary power supply configuration is merely illustrative.

[0057] During operation, device 10 can communicate with external wireless devices. If needed, device 10 can use radio frequency signals transmitted between device 10 and the external wireless device to identify the position of the external wireless device relative to device 10. Device 10 can identify the relative position of the external wireless device by identifying the range from the external wireless device (e.g., the distance between the external wireless device and device 10) and the angle of arrival (AoA) of the radio frequency signal from the external wireless device (e.g., the angle at which device 10 receives the radio frequency signal from the external wireless device).

[0058] Figure 4 This is an illustration showing how device 10 can determine the distance D between device 10 and an external wireless device (sometimes referred to herein as wireless device 60, wireless equipment 60, external device 60, or external apparatus 60) such as a wireless network node 60. Node 60 may include devices capable of receiving and / or transmitting radio frequency signals such as radio frequency signal 56. Node 60 may include tagging devices (e.g., any suitable object already equipped with a wireless receiver and / or wireless transmitter), electronic devices (e.g., infrastructure-related devices), and / or other electronic devices (e.g., combined with...). Figure 1 The type of device described includes some or all of the same wireless communication capabilities as device 10.

[0059] For example, electronic device 60 may be a laptop computer, tablet computer, smaller devices (such as wristwatches, wristbands, headphones, handsets, headsets (e.g., virtual or augmented reality headsets), or other wearable or micro-devices), handheld devices (such as cellular phones), media players, or other small portable devices. Node 60 may also be a set-top box, a camera device with wireless communication capabilities, a desktop computer, a display with a computer or other processing circuitry integrated therein, a display without an integrated computer, or other suitable electronic devices. Node 60 may also be a key card, wallet, book, pen, or other object with a low-power transmitter (e.g., an RFID transmitter or other transmitter). Node 60 may be an electronic device such as a thermostat, smoke detector, etc. Bluetooth Low Energy (Bluetooth LE) beacons Wireless access points, wireless base stations, servers, heating, ventilation and air conditioning (HVAC) systems (sometimes referred to as temperature control systems), light sources such as light-emitting diode (LED) bulbs, light switches, power outlets, occupancy detectors (e.g., active or passive infrared detectors, microwave detectors, etc.), door sensors, humidity sensors, electronic door locks, security cameras, or other devices. Device 10 may also be one of these types of devices if desired.

[0060] like Figure 4 As shown, device 10 can communicate with node 60 using wireless radio frequency signal 56. Radio frequency signal 56 may include... Signals, near-field communication signals, wireless LAN signals such as IEEE 802.11 signals, millimeter-wave communication signals (such as 60 GHz signals), UWB signals, other radio frequency wireless signals, infrared signals, etc. In a suitable arrangement described herein by way of example, radio frequency signal 56 is a UWB signal transmitted in multiple UWB communication bands such as 6.5 GHz and 8 GHz UWB communication bands. Radio frequency signal 56 can be used to determine and / or transmit information such as location and orientation information. For example, control circuitry 38 in device 10 ( Figure 2 The position of node 60 relative to device 10 can be determined using radio frequency signal 56.

[0061] In an arrangement where node 60 can send or receive communication signals, the control circuit 38 in device 10 ( Figure 2 ) can be used Figure 4The distance D is determined using the radio frequency signal 56. The control circuitry may use a signal strength measurement scheme (e.g., measuring the signal strength of the radio frequency signal 56 from node 60), or a time-based measurement scheme (such as time-of-transit measurement, time difference of arrival measurement, angle of arrival measurement, triangulation, time-of-transit methods), a crowdsourced location database, and other suitable measurement techniques to determine the distance D. However, this is merely illustrative. If desired, the control circuitry may use information from the GPS receiver circuitry, proximity sensors (e.g., infrared proximity sensors or other proximity sensors), image data from a camera, motion sensor data from a motion sensor, and / or other circuitry within device 10 to aid in determining the distance D. In addition to determining the distance D between device 10 and node 60, the control circuitry may determine the orientation of device 10 relative to node 60.

[0062] Figure 5 This illustrates how the position and orientation of device 10 relative to nearby nodes, such as node 60, are determined. Figure 5 In the example, the control circuit in device 10 (e.g., Figure 2 The control circuit 38) uses a horizontal polar coordinate system to determine the position and orientation of the device 10 relative to the node 60. In this type of coordinate system, the control circuit can determine the azimuth angle θ and / or elevation angle. This describes the position of a nearby node 60 relative to device 10. Control circuitry may define a reference plane (such as a local ground plane 64) and a reference vector (such as a reference vector 68). Local ground plane 64 may be a plane that intersects with device 10 and is defined relative to the surface of device 10 (e.g., the front or rear of device 10). For example, local ground plane 64 may be defined relative to the display 14 of device 10. Figure 1 The reference vector 68 (sometimes referred to as the "north" direction) can be a vector in the local ground plane 64. If desired, the reference vector 68 can be parallel to or coplanar with the longitudinal axis 62 of the device 10 (e.g., along the central longitudinal direction of the device 10 and parallel to the longest rectangular dimension of the device 10, i.e., parallel to...). Figure 1 The reference vector 68 is aligned with the longitudinal axis 62 of the device 10. When the reference vector 68 is aligned with the longitudinal axis 62 of the device 10, the reference vector 68 can correspond to the direction in which the device 10 is pointing.

[0063] The azimuth θ and elevation angle can be measured relative to the local ground plane 64 and the reference vector 68. like Figure 5 As shown, the elevation angle of node 60 (Sometimes referred to as height) is the angle between node 60 and the local ground plane 64 of device 10 (e.g., the angle between vector 67 extending between device 10 and node 60 and coplanar vector 66 extending between device 10 and local ground plane 64). The azimuth θ of node 60 is the angle of node 60 about local ground plane 64 (e.g., the angle between reference vector 68 and vector 66). Figure 5 In the example, the azimuth angle θ and elevation angle of node 60 Greater than 0°.

[0064] If needed, axes other than the longitudinal axis 62 can be used to define the reference vector 68. For example, the control circuit can use a horizontal axis perpendicular to the longitudinal axis 62 as the reference vector 68. This can be used to determine when node 60 is located near the side of device 10 (e.g., when device 10 is oriented to the left or right of one of nodes 60).

[0065] After determining the orientation of device 10 relative to node 60, the control circuitry in device 10 can take appropriate actions. For example, the control circuitry can send information to node 60, request and / or receive information from 60, and can use display 14 (…). Figure 1 The device may use a display 14 to display a visual indication of wireless pairing with node 60, a speaker to generate an audio indication of wireless pairing with node 60, a vibrator, haptic actuator or other mechanical element to generate a haptic output indicating wireless pairing with node 60, a display 14 to display a visual indication of the position of node 60 relative to device 10, a speaker to generate an audio indication of the position of node 60, a vibrator, haptic actuator or other mechanical element to generate a haptic output indicating the position of node 60, and / or take other suitable actions.

[0066] In a suitable arrangement, device 10 can use two or more ultra-wideband antennas to determine the distance between device 10 and node 60, as well as the orientation of device 10 relative to node 60. The ultra-wideband antennas can receive radio frequency signals from node 60 (e.g., Figure 4 The radio frequency signal 56). The timestamp in the wireless communication signal can be analyzed to determine the transit time of the wireless communication signal, and thereby determine the distance (range) between device 10 and node 60. Additionally, angle of arrival (AoA) measurement techniques can be used to determine the orientation of electronic device 10 relative to node 60 (e.g., azimuth θ and elevation angle). ).

[0067] In the angle of arrival measurement, node 60 transmits the radio frequency signal to device 10 (e.g., Figure 4The device 10 can measure the time delay of the radio frequency signal between two or more ultra-wideband antennas. The time delay of arrival (e.g., the difference in the received phase at each ultra-wideband antenna) can be used to determine the angle of arrival of the radio frequency signal (and thus the angle of node 60 relative to device 10). Once the distance D and the angle of arrival are determined, device 10 can know the precise position of node 60 relative to device 10.

[0068] Figure 6 This is a schematic diagram illustrating how angle-of-arrival (AOA) measurement techniques can be used to determine the orientation of device 10 relative to node 60. Device 10 may include multiple antennas 40 (sometimes referred to herein as ultra-wideband antennas 40U) for transmitting radio frequency signals in one or more UWB frequency bands. Figure 6 As shown, the ultra-wideband antenna 40U in device 10 may include at least a first ultra-wideband antenna 40U-1 and a second ultra-wideband antenna 40U-2. The ultra-wideband antenna 40U-1 and ultra-wideband antenna 40U-2 can be coupled to transceiver circuit 36 ​​via corresponding RF transmission line paths 50 (e.g., first RF transmission line path 50A and second RF transmission line path 50B). Transceiver circuit 36, as well as ultra-wideband antennas 40U-1 and 40U-2, can operate at UWB frequencies (e.g., transceiver circuit 36 ​​can use ultra-wideband antennas 40U-1 and 40U-2 to transmit UWB signals).

[0069] Ultra-wideband antenna 40U-1 and ultra-wideband antenna 40U-2 can each receive radio frequency signal 56 from node 60. Figure 5 Ultra-wideband antennas 40U-1 and 40U-2 can be laterally separated by a distance d1, wherein ultra-wideband antenna 40U-1 is further away from node 60 than ultra-wideband antenna 40U-2 (in Figure 6 (In the example). Therefore, compared to the ultra-wideband antenna 40U-2, the RF signal 56 travels a greater distance to reach the ultra-wideband antenna 40U-1. The additional distance between node 60 and the ultra-wideband antenna 40U-1 is... Figure 6 The distance d2 is shown in the figure. Figure 6 Angles a and b are also shown (where a + b = 90°).

[0070] The distance d2 can be determined as a function of angle a or angle b (e.g., d2 = d1 * sin(a) or d2 = d1 * cos(b)). The distance d2 can also be determined as a function of the phase difference between the signal received by the ultra-wideband antenna 40U-1 and the signal received by the ultra-wideband antenna 40U-2 (e.g., d2 = (PD) * λ / (2 * π)), where PD is the phase difference between the signal received by the ultra-wideband antenna 40U-1 and the signal received by the ultra-wideband antenna 40U-2 (sometimes written as...). ), and λ is the wavelength of the radio frequency signal 56. Device 10 may include a phase measurement circuit coupled to each antenna to measure the phase of the received signal and identify the phase difference PD (e.g., by subtracting the phase measured for one antenna from the phase measured for the other antenna). The two equations of d2 can be set to be equal to each other (e.g., d1*sin(a)=(PD)*λ / (2*π)) and rearranged to solve for angle a (e.g., a=sin -1 ((PD)*λ / (2*π*d1)) or angle b. Therefore, the angle of arrival can be (e.g., via...) Figure 2 The control circuit 38) is determined based on the known (predetermined) distance d1 between the ultra-wideband antenna 40U-1 and the ultra-wideband antenna 40U-2, the detected (measured) phase difference PD between the signal received by the ultra-wideband antenna 40U-1 and the signal received by the ultra-wideband antenna 40U-2, and the known wavelength (frequency) of the received radio frequency signal 56. For example, it can be determined that... Figure 6 Angles a and / or b are converted to spherical coordinates to obtain Figure 5 Azimuth θ and elevation angle Control circuit 38 ( Figure 2 The azimuth angle θ and elevation angle can be calculated. One or both of these factors determine the angle of arrival of the radio frequency signal 56.

[0071] A distance d1 can be selected to facilitate the calculation of the phase difference PD between the signal received by the ultra-wideband antenna 40U-1 and the signal received by the ultra-wideband antenna 40U-2. For example, d1 can be less than or equal to half the wavelength (e.g., the effective wavelength) of the received RF signal 56 (e.g., to avoid multiple phase difference solutions).

[0072] Using two antennas to determine the angle of arrival (e.g.) Figure 6 As shown), the angle of arrival within a single plane can be determined. For example, Figure 6 The ultra-wideband antennas 40U-1 and 40U-2 can be used to determine Figure 5 The azimuth angle θ. A third ultra-wideband antenna may be included to enable determination of the angle of arrival in multiple planes (e.g., the angle of arrival can be determined). Figure 5 Azimuth θ and elevation angle Both). In this scenario, three ultra-wideband antennas can form a so-called triplet ultra-wideband antenna, where the triplet (e.g., the triplet may include) Figure 6Each of the three ultra-wideband antennas 40U-1 and 40U-2, and a third antenna positioned at a distance d1 from ultra-wideband antenna 40U-1 in a direction perpendicular to the vector between ultra-wideband antennas 40U-1 and 40U-2, is arranged approximately at the corresponding corner of a right-angled triangle, or using some other predetermined relative positioning method. The triplet ultra-wideband antenna 40U can be used to determine the angle of arrival in two planes (e.g., to determine...). Figure 5 Azimuth θ and elevation angle A triplet ultra-wideband antenna 40U and / or a binary ultra-wideband antenna 40U (e.g., a pair of antennas, such as...) can be used in device 10. Figure 6 The angle of arrival is determined by the ultra-wideband antennas 40U-1 and 40U-2. If needed, different binary antennas can be orthogonally oriented relative to each other in the device 10 to recover the angle of arrival in two dimensions (e.g., using two or more orthogonal binary ultra-wideband antennas 40U, where each antenna measures the angle of arrival in a single corresponding plane).

[0073] The antenna 40 in device 10 may also include two or more antennas 40 for transmitting radio frequency signals at frequencies greater than 10 GHz. Since the signal attenuates significantly at frequencies greater than 10 GHz, these antennas may be arranged in one or more corresponding phased antenna arrays. Figure 7 This illustrates how an antenna 40 for processing radio frequency signals at millimeter-wave and centimeter-wave frequencies can be formed in a corresponding phased antenna array 76.

[0074] like Figure 7 As shown, the phased antenna array 76 (sometimes referred to herein as array 76, antenna array 76, or array 76 of antenna 40) can be coupled to radio frequency transmission line path 50. For example, the first antenna 40-1 in the phased antenna array 76 can be coupled to the first radio frequency transmission line path 50-1, the second antenna 40-2 in the phased antenna array 76 can be coupled to the second radio frequency transmission line path 50-2, the Nth antenna 40-N in the phased antenna array 76 can be coupled to the Nth radio frequency transmission line path 50-N, and so on. Although antenna 40 is described herein as forming a phased antenna array, antennas 40 in the phased antenna array 76 may sometimes be referred to as collectively forming a single phased array antenna.

[0075] The antennas 40 in the phased antenna array 76 can be arranged in any desired number of rows and columns or in any other desired pattern (e.g., the antennas do not need to be arranged in a grid pattern with rows and columns). During signal transmission operation, the radio frequency transmission line path 50 can be used to transmit signals (e.g., radio frequency signals, such as millimeter wave and / or centimeter wave signals) from the transceiver circuit 36 ​​( Figure 2The signal is supplied to the phased antenna array 76 for wireless transmission. During signal reception operation, the RF transmission line path 50 can be used to supply the signal received at the phased antenna array 76 (e.g., received from external wireless equipment, or a transmitted signal reflected by an external object) to the transceiver circuit 36. Figure 3 ).

[0076] Using multiple antennas 40 in a phased antenna array 76 allows for beam steering arrangements by controlling the relative phase and amplitude (vibration) of the radio frequency signals transmitted by the antennas. Figure 7 In the example, each of the antennas 40 has a corresponding radio frequency phase and amplitude controller 70 (for example, the first phase and amplitude controller 70-1 inserted on the radio frequency transmission line path 50-1 can control the phase and amplitude of the radio frequency signal processed by the antenna 40-1, the second phase and amplitude controller 70-2 inserted on the radio frequency transmission line path 50-2 can control the phase and amplitude of the radio frequency signal processed by the antenna 40-2, and the Nth phase and amplitude controller 70-N inserted on the radio frequency transmission line path 50-N can control the phase and amplitude of the radio frequency signal processed by the antenna 40-N, etc.).

[0077] The phase and amplitude controllers 70 may each include circuitry for adjusting the phase of the radio frequency signal on the radio frequency transmission line path 50 (e.g., a phase shifter circuit) and / or circuitry for adjusting the amplitude of the radio frequency signal on the radio frequency transmission line path 50 (e.g., a power amplifier and / or low-noise amplifier circuitry). The phase and amplitude controllers 70 may be collectively referred to herein as beam steering circuitry (e.g., beam steering circuitry for steering the beam of the radio frequency signal transmitted and / or received by the phased antenna array 76).

[0078] The phase and amplitude controller 70 can adjust the relative phase and / or amplitude of the transmitted signals provided to each antenna in the phased antenna array 76, and can adjust the relative phase and / or amplitude of the received signals received by the phased antenna array 76. If desired, the phase and amplitude controller 70 may include phase detection circuitry for detecting the phase of the received signals received by the phased antenna array 76. The terms “beam” or “signal beam” may be used herein to uniformly refer to wireless signals transmitted and received by the phased antenna array 76 in a particular direction. A signal beam may exhibit a peak gain oriented in a particular pointing direction with a corresponding pointing angle (e.g., based on constructive and destructive interference of the signal combinations from each antenna in the phased antenna array). The term “transmit beam” may sometimes be used herein to refer to radio frequency signals transmitted in a particular direction, while the term “receive beam” may sometimes be used herein to refer to radio frequency signals received from a particular direction.

[0079] For example, if the phase and amplitude controller 70 is adjusted to generate a first set of phases and / or amplitudes of the transmitted radio frequency signal, the transmitted signal will form as follows: Figure 7 Beam B1 is a transmit beam oriented in the direction of point A. However, if the phase and amplitude controller 70 is adjusted to generate a second set of phases and / or amplitudes for the transmitted signal, the transmitted signal will form a transmit beam oriented in the direction of point B, as shown in beam B2. Similarly, if the phase and amplitude controller 70 is adjusted to generate a first set of phases and / or amplitudes, an RF signal can be received from the direction of point A (e.g., receiving an RF signal in the beam), as shown in beam B1. If the phase and amplitude controller 70 is adjusted to generate a second set of phases and / or amplitudes, an RF signal can be received from the direction of point B, as shown in beam B2.

[0080] Each phase and amplitude controller 70 can be controlled based on the corresponding control signal S received from the control circuit 38 to generate the desired phase and / or amplitude (e.g., control signal S1 can be used to control the phase and / or amplitude provided by phase and amplitude controller 70-1, control signal S2 can be used to control the phase and / or amplitude provided by phase and amplitude controller 70-2, etc.). If needed, the control circuit can actively adjust the control signal S in real time to steer the transmit or receive beam in different desired directions over time. If needed, the phase and amplitude controller 70 can provide the control circuit 38 with information identifying the phase of the received signal.

[0081] When performing wireless communication using radio frequency signals at millimeter-wave and centimeter-wave frequencies, the radio frequency signals are transmitted along the line-of-sight path between the phased antenna array 76 and the external communication equipment. If an external object is located... Figure 7 At point A, the phase and amplitude controller 70 can be adjusted to steer the signal beam toward point A (e.g., to direct the direction of the steerable signal beam toward point A). The phased antenna array 76 can transmit and receive radio frequency signals in the direction of point A. Similarly, if external communication equipment is located at point B, the phase and amplitude controller 70 can be adjusted to steer the signal beam toward point B (e.g., to direct the direction of the steerable signal beam toward point B). The phased antenna array 76 can transmit and receive radio frequency signals in the direction of point B. Figure 7 In the example, for simplicity, beam steering is shown as occurring in a single degree of freedom (e.g., in...). Figure 7 This can be performed on the page facing left and right. However, in practice, it can be performed in two or more degrees of freedom (e.g., entering and leaving the page in three dimensions and in...). Figure 7The phased antenna array 76 may have a corresponding field of view on which beam steering can be performed (e.g., in a hemispherical or hemispherical segment of the phased antenna array). If desired, the device 10 may include a plurality of phased antenna arrays, each facing a different direction to provide coverage from multiple sides of the device.

[0082] In a suitable arrangement described herein as an example, the antenna 40 in device 10 includes a triplet ultrawideband antenna for transmitting radio frequency signals at centimeter-wave and millimeter-wave frequencies, as well as a first phased antenna array and a second phased antenna array. In some scenarios, the triplet ultrawideband antenna and the phased antenna array are formed on separate respective substrates or modules. However, space is often very precious in devices (such as device 10). Forming the triplet ultrawideband antenna and the phased antenna array on separate respective substrates or modules may occupy excessive space in device 10, potentially increasing the undesirable manufacturing cost and complexity of device 10, and over time, may introduce mechanical non-uniformities into device 10.

[0083] To alleviate these problems, the triplet ultrawideband antenna and both the first phased antenna array and the second phased antenna array can be formed as part of the same integrated antenna module. Figure 8 This is a bottom view showing how a triplet ultrawideband antenna, a first phased antenna array, and a second phased antenna array are formed on the same antenna module.

[0084] like Figure 8 As shown, device 10 may include an integrated antenna module, such as antenna module 78. Antenna module 78 may include a dielectric substrate, such as dielectric substrate 80. For example, dielectric substrate 80 may be a stacked dielectric substrate having two or more vertically stacked dielectric layers.

[0085] Antenna module 78 may include a triplet ultra-wideband antenna 40U, such as ultra-wideband antenna 40U-1, ultra-wideband antenna 40U-2, and ultra-wideband antenna 40U-3. Ultra-wideband antennas 40U-1, 40U-2, and 40U-3 can transmit radio frequency signals in one or more ultra-wideband frequency bands. Each ultra-wideband antenna 40U may have a corresponding antenna resonant element. The antenna resonant element may overlap with an antenna ground portion formed by a ground trace in the dielectric substrate 80.

[0086] For example, such as Figure 8As shown, the ultra-wideband antenna 40-1 and ultra-wideband antenna 40U-2 may each have an antenna resonant element 86 formed by a conductive trace patch on a dielectric substrate 80. Therefore, the antenna resonant element 86 may be a patch antenna resonant element (sometimes referred to herein as a patch element, patch resonant element, patch radiating element, or patch radiator). A corresponding positive antenna feed terminal 46 (such as positive antenna feed terminal 46U) may be coupled to each antenna resonant element 86 for feeding the ultra-wideband antenna 40U-1 and ultra-wideband antenna 40U-2. The length of the antenna resonant element 86 may be selected (e.g., parallel to...). Figure 8 The X-axis is used to configure the ultra-wideband antennas 40U-1 and 40U-2 to radiate in their respective ultra-wideband frequency bands (e.g., the 6.5 GHz UWB band). This is merely illustrative. If desired, a return path can be coupled between the antenna resonator 86 and the ground trace to configure the antenna resonator 86 to form a planar inverted F-shaped antenna resonator. In general, any other desired antenna resonator structure (e.g., an antenna resonator having any desired shape, any desired number of curved edges and / or straight edges, any desired feed arrangement, etc.) can be used to form the antenna resonator 86.

[0087] The ultra-wideband antenna 40U-3 may have an antenna resonant element including a first antenna resonant element arm 88 and a second antenna resonant element arm 90. The antenna resonant element arm 88 and the antenna resonant element arm 90 may be formed by conductive traces on a dielectric substrate 80. The antenna resonant element arm 88 and the antenna resonant element arm 90 may each be fed by a corresponding positive antenna feed terminal 46U. The antenna resonant element arm 88 and the antenna resonant element arm 90 may be separated by a barrier of a conductive via 92, which couples the conductive traces forming the antenna resonant element arm 88 and the antenna resonant element arm 90 to a ground trace in the dielectric substrate 80. The barrier of the conductive via 92 may form a return path for the ultra-wideband antenna 40U-3. Therefore, the antenna resonant element of the ultra-wideband antenna 40U-3 may be a dual-band planar inverted F-shaped antenna resonant element (e.g., the antenna resonant element arm 88 and the antenna resonant element arm 90 may be planar inverted F-shaped antenna resonant element arms extending from opposite sides of the conductive via 92).

[0088] The length of the antenna resonator arm 88 can be selected (e.g., parallel to...). Figure 8 The X-axis can be used to configure the ultra-wideband antenna 40U-3 to radiate in a first ultra-wideband frequency band (e.g., 6.5 GHz UWB band). The length of the antenna resonant element arm 90 can be selected (e.g., parallel to the X-axis). Figure 8 The X-axis can be used to configure the ultra-wideband antenna 40U-3 to also radiate in a second ultra-wideband frequency band (e.g., the 8.0 GHz UWB band). This is merely illustrative. If desired, the ultra-wideband antenna 40U-3 can be a single-band antenna (e.g., similar to...). Figure 8 The UWB antennas 40U-1 and 40U-2. If desired, one or both of the UWB antennas 40U-1 and 40U-2 can be dual-band antennas for transmitting radio frequency signals in both the 6.5 GHz UWB and 8.0 GHz UWB bands (e.g., similar to...). Figure 8 The 40U-3 is an ultra-wideband antenna. Generally speaking, any other desired antenna resonator structure (e.g., an antenna resonator with any desired shape, any desired number of curved edges and / or straight edges, any desired feed arrangement, etc.) can be used to form the 40U-3 ultra-wideband antenna.

[0089] The three-element ultra-wideband antennas 40U-1, 40U-2, and 40U-3 can be used to determine... Figure 4 The distance D and / or the angle of arrival of the incident radio frequency signal in one or both of the 6.5 GHz UWB band and the 8.0 GHz UWB band. If necessary, the UWB antenna 40U-1, UWB antenna 40U-2 or UWB antenna 40U-3 may be omitted (e.g., antenna module 78 may include a binary UWB antenna 40U).

[0090] Antenna module 78 may also include multiple phased antenna arrays 76, such as a first phased antenna array 76A and a second phased antenna array 76B. The first phased antenna array 76A may include a first set of antennas 40H radiating in a relatively high 5G NR FR2 frequency band (e.g., at frequencies between approximately 37 GHz and 43 GHz). The first phased antenna array 76A may include any desired number of antennas 40H. Figure 8 In the example, the first phased antenna array 76A includes four antennas 40H, such as antenna 40H-1, antenna 40H-2, antenna 40H-3, and antenna 40H-4. Each antenna 40H in the first phased antenna array 76A can be separated from one or two adjacent antennas 40H of the first phased antenna array 76A by a distance 82. The distance 82 can be selected to allow the antennas 40H in the first phased antenna array 76A to perform satisfactory beamforming operation (e.g., the distance 82 can be approximately equal to half the effective operating wavelength of the antenna 40H, where the effective wavelength is equal to the free space wavelength multiplied by a constant value selected based on the dielectric constant of the dielectric substrate 80).

[0091] The first phased antenna array 76A may also include a second set of antennas 40L radiating in a relatively low 5G NR FR2 band (e.g., at frequencies between approximately 24 GHz and 30 GHz). The first phased antenna array 76A may include any desired number of antennas 40L. Figure 8In the example, the first phased antenna array 76A includes four antennas 40L, such as antenna 40L-1, antenna 40L-2, antenna 40L-3, and antenna 40L-4. Each antenna 40L in the first phased antenna array 76A can be separated from one or two adjacent antennas 40L of the first phased antenna array 76A by a distance 84. The distance 84 can be selected to allow the antennas 40L in the first phased antenna array 76A to perform satisfactory beamforming operation (e.g., the distance 84 can be approximately equal to half the effective operating wavelength of the antenna 40L).

[0092] exist Figure 8 In the example, the first phased antenna array 76A includes a first row of antennas 40H and a second row of antennas 40L. This is merely exemplary, and in general, the antennas 40H and 40L in the first phased antenna array 76A can be arranged in any desired pattern (e.g., antennas 40H can be interlaced with antennas 40L in a single row, antennas 40H can be interlaced with antennas 40L across two rows, etc.). Antennas 40H and 40L can together allow the first phased antenna array 76A to transmit radio frequency signals in both the relatively lower 5G NR FR2 band and the relatively higher 5G NR FR2 band (e.g., according to a beamforming scheme).

[0093] The second phased antenna array 76B may include a third set of antennas 40H radiating in a relatively high 5G NR FR2 band (e.g., at frequencies between approximately 37 GHz and 43 GHz). The second phased antenna array 76B may include any desired number of antennas 40H. In a suitable arrangement sometimes described herein as an example, the second phased antenna array 76B includes fewer antennas 40H than the first phased antenna array 76A (e.g., the second phased antenna array 76B may include two antennas 40H, such as antenna 40H-5 and antenna 40H-6). Antennas 40H-5 and antenna 40H-6 may be spaced apart from each other by a distance 82.

[0094] The second phased antenna array 76B may also include a fourth group of antennas 40L radiating in a relatively low 5G NR FR2 band (e.g., at frequencies between approximately 24 GHz and 30 GHz). The second phased antenna array 76B may include any desired number of antennas 40L. In a suitable arrangement sometimes described herein as an example, the second phased antenna array 76B includes fewer antennas 40L than the first phased antenna array 76B (e.g., the second phased antenna array 76B may include two antennas 40L, such as antenna 40L-5 and antenna 40L-6). Antennas 40L-5 and antenna 40L-6 may be spaced apart from each other by a distance 84.

[0095] The antennas in the second phased antenna array 76B can be located on a portion (region) of the dielectric substrate 80 not occupied by the first phased antenna array 76A and the ultra-wideband antennas 40U-1, 40U-2, and 40U-3. For example, as Figure 8 As shown, antennas 40H-5 and 40H-6 can be arranged in a column and laterally inserted between the ultra-wideband antennas 40U-3 and 40H-4 and the right edge of the dielectric substrate 80. Simultaneously, antennas 40L-5 and 40L-6 can be arranged in a row and laterally inserted between the ultra-wideband antenna 40U-3 and the upper edge of the dielectric substrate 80. This is merely illustrative, and in general, antennas 40H and 40L in the second phased antenna array 76B can be arranged in any desired pattern. Antennas 40H and 40L can collectively allow the phased antenna array 76B to transmit radio frequency signals in both the relatively lower 5G NR FR2 band and the relatively higher 5G NR FR2 band (e.g., according to a beamforming scheme).

[0096] If needed, the second phased antenna array 76B can be steered independently of the first phased antenna array 76A. For example, the first phased antenna array 76A can transmit radio frequency signals within a first signal beam, while the second phased antenna array 76B transmits radio frequency signals within a second signal beam. In a suitable arrangement described herein as an example, the first phased antenna array 76A can be the primary phased antenna array for device 10, while the second phased antenna array 76B can be an auxiliary or diversity phased antenna array for device 10.

[0097] For example, control circuit 38 ( Figure 2 The control circuit 38 can acquire sensor data, wireless performance metrics, or other data indicating the radio frequency performance of phased antenna arrays 76A and 76B over time. The control circuit 38 can use the first phased antenna array 76A to transmit radio frequency signals in the 5G NR FR2 band. When acquired data indicates that the first phased antenna array 76A is obstructed by an external object (e.g., a user's hand, a tabletop, or other external object) or otherwise exhibits unsatisfactory radio frequency performance (e.g., when the acquired wireless performance metrics fall outside a predetermined range of satisfactory wireless performance metrics values), the control circuit 38 can switch the first phased antenna array 76A to deactivate. The control circuit 38 can then switch the second phased antenna array 76B to enable, and the second phased antenna array 76B can be used to transmit radio frequency signals in the 5G NR FR2 band until the first phased antenna array 76A is no longer obstructed or will otherwise exhibit satisfactory radio frequency performance. In this way, even if an external object occasionally blocks part of the antenna module 78 over time, the antenna module 78 can continue to transmit radio frequency signals in the 5G NR FR2 band.

[0098] Antennas 40H and 40L in phased antenna arrays 76A and 76B can be formed using any desired antenna structure. In a suitable arrangement described herein as an example, antennas 40H and 40L are stacked patch antennas. For example, as Figure 8 As shown, each antenna 40H may have an antenna resonant element 100 formed from a conductive trace patch on a dielectric substrate 80 (e.g., the antenna resonant element 100 may be a patch antenna resonant element, and therefore may be referred to herein as patch element 100). The antenna 40H may have a parasitic element 102 formed from conductive trace patches stacked above the patch element 100.

[0099] The patch element 100 can be directly fed by one or more positive antenna feed terminals 46H. For example, the patch element 100 can be fed by a first positive antenna feed terminal 46HH coupled to a first edge of the patch element 100, and can be fed by a second positive antenna feed terminal 46HV coupled to a second edge of the patch element 100 (e.g., an edge orthogonal to the first edge). Using multiple positive antenna feed terminals to feed the patch element 100 allows the antenna 40H to transmit radio frequency signals with multiple polarizations. For example, the first positive antenna feed terminal 46HH can transmit radio frequency signals with a first linear (e.g., horizontal) polarization, while the second positive antenna feed terminal 46HV transmits radio frequency signals with a second linear (e.g., vertical) polarization. Circular polarization or elliptical polarization can also be used if desired.

[0100] The length of patch element 100 can be selected to radiate in the relatively high 5G NR FR2 band. The dimensions of parasitic element 102, which is not directly connected to or fed by positive antenna feed terminals 46HV and 46HH, can differ slightly from those of patch element 100. This allows parasitic element 102 to be configured to widen the bandwidth of antenna 40H. If desired, parasitic element 102 can be a cross-shaped patch (e.g., having orthogonal arms overlapping positive antenna feed terminals 46HV and 46HH). For example, this allows parasitic element 102 to perform impedance matching of antenna 40H. This example is merely illustrative, and in general, any desired antenna structure can be used to form antenna 40H.

[0101] Similarly, each antenna 40L may have an antenna resonant element 94 formed by a conductive trace patch on a dielectric substrate 80 (e.g., the antenna resonant element 94 may be a patch antenna resonant element, and is therefore sometimes referred to herein as patch element 94). The antenna 40L may have a parasitic element 96 formed by a conductive trace patch stacked above the patch element 94.

[0102] The patch element 94 can be directly fed by one or more positive antenna feed terminals 46L. For example, the patch element 94 can be fed by a first positive antenna feed terminal 46LH coupled to a first edge of the patch element 94, and can be fed by a second positive antenna feed terminal 46LV coupled to a second edge of the patch element 94 (e.g., an edge orthogonal to the first edge). Using multiple positive antenna feed terminals to feed the patch element 94 allows the antenna 40L to transmit radio frequency signals with multiple polarizations. For example, the first positive antenna feed terminal 46LH can transmit radio frequency signals with a first linear (e.g., horizontal) polarization, while the second positive antenna feed terminal 46LV transmits radio frequency signals with a second linear (e.g., vertical) polarization. If desired, an additional parasitic element 98 can be laterally wrapped around the patch element 94 and / or the parasitic element 96 (e.g., the parasitic element 98 can be formed by conductive traces on the same dielectric layer of the dielectric substrate 80 as the patch element 94 and / or by conductive traces on the same dielectric layer as the parasitic element 96). For example, parasitic element 98 may contribute to the radiation response of antenna 40L (e.g., to widen the bandwidth of antenna 40L) and / or may help to isolate antenna 40L from adjacent antennas and components in device 10.

[0103] The length of patch element 94 can be selected to radiate in a relatively low 5G NR FR2 band. The dimensions of parasitic element 96, which is not directly connected to or fed by positive antenna feed terminals 46HV and 46HH, can differ slightly from the dimensions of patch element 94. This allows parasitic element 96 to be configured to widen the bandwidth of antenna 40L. Patch element 100 in antenna 40H and patch element 94 in antenna 40L can overlap with ground traces in dielectric substrate 80 (e.g., the same ground traces used to form the antenna ground portion of ultra-wideband antenna 40U, if desired). This example is merely illustrative, and in general, any desired antenna structure can be used to form antenna 40H. If desired, a fence extending through conductive vias in dielectric substrate 80 can laterally surround one or more (e.g., all) antennas in antenna module 78. For example, the enclosure of conductive vias can help to isolate each antenna from each other and / or from interference from other components in device 10.

[0104] Generally speaking, the ultra-wideband antenna 40U-3 can be separated from the ultra-wideband antennas 40U-1 and 40U-2 by a gap 81. For example, choosing a relatively large gap 81 can allow the control circuit 38 ( Figure 2 The angle of arrival of the incoming radio frequency signal is resolved with relatively high accuracy and / or precision. To minimize space consumption within the device 10, the first phased antenna array 76A can be interleaved within the triplet ultrawideband antenna in the antenna module 78.

[0105] For example, such as Figure 8 As shown, the first phased antenna array 76A can be laterally inserted on the dielectric substrate 80 between the ultra-wideband antenna 40U-3 and the ultra-wideband antennas 40U-1 and 40U-2. Simultaneously, the ultra-wideband antenna 40U-3 can be laterally inserted on the dielectric substrate 80 between the second phased antenna array 76B and the antenna 40L in the first phased antenna array 76A. By utilizing the gap 81 in the triplet ultra-wideband antenna 40U and the required distances 82 and 84 in the phased antenna arrays 76A and 76B in this way, the antenna module 78 can perform both ultra-wideband communication and millimeter-wave and centimeter-wave frequency communication within the device 10 with the smallest possible lateral footprint. For example, this allows for as much space as possible within the device 10 for forming other device components.

[0106] Antenna module 78 can be installed at any desired location within device 10. In a suitable arrangement described herein as an example, antenna module 78 may be pressed against or stacked adjacent to the rear housing wall 12R of device 10. Figure 1 This allows the phased antenna arrays 76A and 76B, as well as the triplet ultrawideband antenna 40U, to be configured to radiate through the rear housing wall 12R. In the case where the rear housing wall 12R includes a conductive support plate, holes in the conductive support plate can be aligned with the antenna in the antenna module 78 to allow the antenna to radiate through the rear housing wall 12R. In other arrangements, the antenna in the antenna module 78 can radiate through the display 14 and / or the peripheral conductive housing structure 12W. Figure 1 ).

[0107] Figure 8 The examples provided are merely illustrative. The antennas in antenna module 78 can be implemented using any desired antenna structure having any desired shape. Antenna module 78 may include more than two phased antenna arrays 76 or only one of phased antenna arrays 76A and 76B. Phased antenna arrays 76A and 76B may include any desired number of antennas radiating in any desired frequency band. Substrate 80 may have any desired shape.

[0108] One or more electronic components, such as radio frequency integrated circuits (RFICs), for supporting the operation of phased antenna arrays 76A and 76B may be mounted on dielectric substrate 80. Figure 9 This is a side view of antenna module 78, showing how antenna module 78 can have an RFIC mounted to dielectric substrate 80.

[0109] like Figure 9As shown, the dielectric substrate 80 may include a stacked dielectric layer 104. The dielectric layer 104 may be used to form antennas 40H, 40L, and 40U (e.g., antenna resonant elements for the antennas may be formed by conductive traces patterned to one or more dielectric layers 104). The dielectric layer 104 may be referred to herein as antenna layer 104. The dielectric substrate 80 may include a ground trace 103 separating the antenna layer 104 from the stacked dielectric layer 101. The stacked dielectric layer 101 may include a path for a radio frequency transmission line 50 (…). Figure 3 The ground trace and signal trace of the antenna module 78 are used to feed antennas 40H, 40L, and 40U in the antenna module 78. Therefore, dielectric layer 101 may sometimes be referred to herein as wiring layer 101. Ground trace 103 may form part of the antenna ground portion of the antenna in antenna module 78. Openings may be formed in ground trace 103 to accommodate conductive vias extending from signal traces in wiring layer 101 to the positive antenna feed terminal in antenna layer 104.

[0110] An RFIC (such as RFIC 110) may be mounted to wiring layer 101. If desired, RFIC 110 may be mounted to interposer 106. Interposer 106 may be mounted to wiring layer 101 using solder balls 108. Interposer 106 may be used to help offload RF signal wiring from wiring layer 101 to interposer 106. For example, this can reduce the size, cost, and complexity of manufacturing wiring layer 101, thereby reducing the size, cost, and complexity of antenna module 78.

[0111] RFIC 110 may include radio frequency components that support the operation of antennas 40H and 40L in antenna module 78. For example, RFIC 110 may include at least a phase and amplitude controller 70 for phased antenna arrays 76A and 76B. Figure 7 Conductive traces and / or conductive vias in interposer 106, wiring layer 101, and antenna layer 104 can be used, and phase and amplitude controllers can be coupled to antennas in phased antenna arrays 76A and 76B via solder balls 108. RF board-to-board connector 114 can also be mounted to wiring layer 101. Flexible printed circuit 112 can be coupled to wiring layer 101 via board-to-board connector 114. For example, board-to-board connector 114 and flexible printed circuit 112 can be used in connection with ultra-wideband antenna 40U and transceiver circuit 36 ​​on antenna module 78. Figure 3 Radio frequency signals are transmitted between them. In another suitable arrangement, the interposer 106 can be omitted, and the RFIC 110 can be coupled to the wiring layer 101 via the flexible printed circuit 112 and the board-to-board connector 114, as shown. Figure 10 As shown in the example.

[0112] By integrating the phased antenna arrays 76A and 76B, along with the ultra-wideband antenna 40U, into the same antenna module 78, space consumption in the device 10 can be minimized without sacrificing RF performance. This arrangement is also more robust and less expensive to manufacture than forming the phased antenna arrays and the ultra-wideband antenna on separate corresponding modules or substrates, because, for example, the antenna module 78 requires smaller horizontal and vertical assembly tolerances and fewer board-to-board interconnects.

[0113] Device 10 may collect and / or use personally identifiable information. It is well known that the use of personally identifiable information should comply with privacy policies and practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0114] According to one embodiment, an electronic device is provided, comprising: a peripheral conductive housing structure; a display mounted to the peripheral conductive housing structure; a housing wall mounted to the peripheral conductive housing structure opposite to the display; and an antenna module having a dielectric substrate, a phased antenna array, and an ultra-wideband antenna, the phased antenna array being located on the dielectric substrate and configured to radiate through the housing wall at a frequency greater than 10 GHz, and the ultra-wideband antenna being located on the dielectric substrate and configured to radiate through the housing wall in an ultra-wideband frequency band.

[0115] According to another embodiment, the electronic device includes an antenna module comprising: a first additional ultra-wideband antenna located on a dielectric substrate; and a second additional ultra-wideband antenna located on the dielectric substrate, wherein a phased antenna array is laterally inserted between the first additional ultra-wideband antenna, the second additional ultra-wideband antenna, and the ultra-wideband antenna.

[0116] According to another embodiment, the ultra-wideband antenna is configured to radiate through the housing wall in an additional ultra-wideband frequency band, and the first additional ultra-wideband antenna and the second additional ultra-wideband antenna are configured to radiate through the housing wall in a first ultra-wideband frequency band.

[0117] According to another implementation, the ultra-wideband includes a 6.5 GHz ultra-wideband, and the additional ultra-wideband includes an 8.0 GHz ultra-wideband.

[0118] According to another embodiment, the ultra-wideband antenna includes a dual-arm planar inverted F-shaped antenna, and the first and second additional ultra-wideband antennas include patch antennas.

[0119] According to another embodiment, the phased antenna array includes a first set of stacked patch antennas configured to radiate at a frequency between 24 GHz and 30 GHz, and the phased antenna array includes a second set of stacked patch antennas configured to radiate at an additional frequency between 37 GHz and 41 GHz.

[0120] According to another embodiment, the electronic device includes an antenna module comprising an additional phased antenna array located on a dielectric substrate, the additional phased antenna array including a third set of stacked patch antennas configured to radiate at the frequency and a fourth set of stacked patch antennas configured to radiate at the additional frequency.

[0121] According to another embodiment, the ultra-wideband antenna is laterally inserted on a dielectric substrate located between the second set of stacked patch antennas and the third set of stacked patch antennas.

[0122] According to another embodiment, the first group has more stacked patch antennas than the third group, and the second group has more stacked patch antennas than the fourth group. The electronic device includes control circuitry configured to perform beam steering operations using a phased antenna array and configured to perform beam steering operations using an additional phased antenna array instead of the phased antenna array in response to the detection of an external object covering the phased antenna array.

[0123] According to another embodiment, the electronic device includes a radio frequency integrated circuit (RFIC) mounted to a dielectric substrate, the RFIC including phase and amplitude controllers for a phased antenna array.

[0124] According to one embodiment, an antenna module is provided, the antenna module comprising: a dielectric substrate; a triplet of a first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna located on the dielectric substrate, the first ultra-wideband antenna and the second ultra-wideband antenna being separated by a gap; a phased antenna array configured to radiate at a frequency greater than 10 GHz, the phased antenna array being located on the dielectric substrate within the gap; and a radio frequency integrated circuit (RFIC) mounted to the dielectric substrate, the RFIC including phase and amplitude controllers for the phased antenna array.

[0125] According to another embodiment, the dielectric substrate includes a wiring layer, an antenna layer, and a ground trace separating the wiring layer and the antenna layer, the phased antenna array, the first ultra-wideband antenna, the second ultra-wideband antenna, and the third ultra-wideband antenna are formed on the antenna layer, and the RFIC is mounted to the wiring layer.

[0126] According to another embodiment, the antenna module includes an interposer mounted to the wiring layer using solder balls, to which the RFIC is mounted.

[0127] According to another embodiment, the antenna module includes: a board-to-board connector located on a wiring layer; and a flexible printed circuit coupled to a first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna via the board-to-board connector and the wiring layer.

[0128] According to another embodiment, the antenna module includes: a board-to-board connector located on a dielectric substrate; and a flexible printed circuit coupled to the board-to-board connector, to which the RFIC is mounted.

[0129] According to another embodiment, the antenna module includes an additional phased antenna array located on a dielectric substrate, the additional phased antenna array being configured to radiate at the frequency and having fewer antennas than the phased antenna array, the additional phased antenna array being able to steer independently of the phased antenna array.

[0130] According to one embodiment, an antenna module is provided, the antenna module comprising: a dielectric substrate; a first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna located on the dielectric substrate; a first phased antenna array laterally inserted on the dielectric substrate between the third ultra-wideband antenna and the second ultra-wideband antenna; and a second phased antenna array located on the dielectric substrate, the third ultra-wideband antenna being laterally inserted on the dielectric substrate between at least some of the second phased antenna arrays of the first and second phased antenna arrays.

[0131] According to another embodiment, the first phased antenna array includes a first group of antennas configured to radiate at a first frequency greater than 10 GHz, the first phased antenna array includes a second group of antennas configured to radiate at a second frequency greater than 10 GHz, the second phased antenna array includes a third group of antennas configured to radiate at the first frequency, the second phased antenna array includes a fourth group of antennas configured to radiate at the second frequency, and the third ultra-wideband antenna is laterally inserted on the dielectric substrate located between the third group of antennas and the first phased antenna array.

[0132] According to another embodiment, the first group of antennas, the second group of antennas, and the third group of antennas are arranged in corresponding first, second, and third rows, and the fourth group of antennas is arranged in a column orthogonal to the first, second, and third rows.

[0133] According to another embodiment, the third ultra-wideband antenna is configured to radiate in a 6.5 GHz ultra-wideband and an 8.0 GHz ultra-wideband frequency band, the first ultra-wideband antenna and the second ultra-wideband antenna are configured to radiate in the 6.5 GHz ultra-wideband frequency band, and the antenna module includes: an interposer mounted to a dielectric substrate; and a radio frequency integrated circuit (RFIC) mounted to the interposer, the RFIC including phase and amplitude controllers for the first phased antenna array and the second phased antenna array.

[0134] The foregoing description is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and substance of the described embodiments. The aforementioned embodiments can be implemented independently or in any combination.

Claims

1. An electronic device, comprising: External conductive outer shell structure; The display is mounted to the peripheral conductive housing structure; The outer casing wall is mounted to the peripheral conductive outer casing structure opposite to the display. and Antenna module, the antenna module having: Dielectric substrate, A phased antenna array, located on the dielectric substrate and configured to radiate through the housing wall at a frequency greater than 10 GHz, and A first ultra-wideband antenna, the ultra-wideband antenna being located on the dielectric substrate and configured to radiate through the housing wall in a first ultra-wideband frequency band; and A second ultra-wideband antenna is located on the dielectric substrate, wherein the phased antenna array is laterally inserted between the first ultra-wideband antenna and the second ultra-wideband antenna.

2. The electronic device according to claim 1, wherein the antenna module comprises: The third ultra-wideband antenna is located on the dielectric substrate.

3. The electronic device of claim 2, wherein the second ultra-wideband antenna is configured to radiate through the housing wall in the second ultra-wideband frequency band, and the third ultra-wideband antenna is configured to radiate through the housing wall in the first ultra-wideband frequency band.

4. The electronic device according to claim 3, wherein the first ultra-wideband frequency band includes a 6.5 GHz ultra-wideband frequency band, and the second ultra-wideband frequency band includes an 8.0 GHz ultra-wideband frequency band.

5. The electronic device according to claim 4, wherein the second ultra-wideband antenna comprises a double-arm planar inverted F-shaped antenna, and the first ultra-wideband antenna and the third ultra-wideband antenna comprise patch antennas.

6. The electronic device of claim 2, wherein the phased antenna array includes a first set of stacked patch antennas configured to radiate at the frequency between 24 GHz and 30 GHz, and the phased antenna array includes a second set of stacked patch antennas configured to radiate at an additional frequency between 37 GHz and 41 GHz.

7. The electronic device according to claim 6, wherein the antenna module comprises: An additional phased antenna array is located on the dielectric substrate, wherein the additional phased antenna array includes a third set of stacked patch antennas configured to radiate at the frequency and a fourth set of stacked patch antennas configured to radiate at the additional frequency.

8. The electronic device of claim 7, wherein the second ultra-wideband antenna is laterally inserted on the dielectric substrate located between the second set of stacked patch antennas and the third set of stacked patch antennas.

9. The electronic device of claim 8, wherein the first group contains more stacked patch antennas than the third group, and the second group contains more stacked patch antennas than the fourth group, the electronic device further comprising: A control circuit, wherein the control circuit is configured to perform beam steering operation using the phased antenna array, and is configured to perform beam steering operation using the additional phased antenna array instead of the phased antenna array in response to the detection of an external object covering the phased antenna array.

10. The electronic device according to claim 1, further comprising: A radio frequency integrated circuit (RFIC) is mounted on the dielectric substrate, wherein the RFIC includes phase and amplitude controllers for the phased antenna array.

11. An antenna module, comprising: Dielectric substrate; A triplet of a first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna located on the dielectric substrate, wherein the first ultra-wideband antenna and the second ultra-wideband antenna are separated by a gap; A phased antenna array configured to radiate at a frequency greater than 10 GHz, the phased antenna array being located on the dielectric substrate within the gap; and A radio frequency integrated circuit (RFIC) is mounted on the dielectric substrate, wherein the RFIC includes phase and amplitude controllers for the phased antenna array.

12. The antenna module of claim 11, wherein the dielectric substrate includes a wiring layer, an antenna layer, and a ground trace separating the wiring layer and the antenna layer, the phased antenna array, the first ultra-wideband antenna, the second ultra-wideband antenna, and the third ultra-wideband antenna are formed on the antenna layer, and the RFIC is mounted to the wiring layer.

13. The antenna module according to claim 12, further comprising: An interposer is mounted to the wiring layer using solder balls, and the RFIC is mounted to the interposer.

14. The antenna module according to claim 13, further comprising: A board-to-board connector, wherein the board-to-board connector is located on the wiring layer; and A flexible printed circuit, which is coupled to the first ultra-wideband antenna, the second ultra-wideband antenna and the third ultra-wideband antenna via the board-to-board connector and the wiring layer.

15. The antenna module according to claim 11, further comprising: A board-to-board connector, wherein the board-to-board connector is located on the dielectric substrate; and A flexible printed circuit coupled to the board-to-board connector, wherein the RFIC is mounted to the flexible printed circuit.

16. The antenna module according to claim 11, further comprising: An additional phased antenna array is located on the dielectric substrate, wherein the additional phased antenna array is configured to radiate at the frequency and has fewer antennas than the phased antenna array, and the additional phased antenna array is capable of directional control independently of the phased antenna array.

17. An antenna module, comprising: Dielectric substrate; A first ultra-wideband antenna, a second ultra-wideband antenna, and a third ultra-wideband antenna are located on the dielectric substrate. A first phased antenna array is laterally inserted on the dielectric substrate located between the third ultra-wideband antenna and the second ultra-wideband antenna. and A second phased antenna array is located on the dielectric substrate, wherein the third ultra-wideband antenna is laterally inserted on the dielectric substrate between at least some of the second phased antenna arrays in the first and second phased antenna arrays.

18. The antenna module of claim 17, wherein the first phased antenna array includes a first group of antennas configured to radiate at a first frequency greater than 10 GHz, the first phased antenna array includes a second group of antennas configured to radiate at a second frequency greater than 10 GHz, the second phased antenna array includes a third group of antennas configured to radiate at the first frequency, the second phased antenna array includes a fourth group of antennas configured to radiate at the second frequency, and the third ultra-wideband antenna is laterally inserted on the dielectric substrate located between the third group of antennas and the first phased antenna array.

19. The antenna module of claim 18, wherein the first group of antennas, the second group of antennas and the third group of antennas are arranged in corresponding first, second and third rows, and the fourth group of antennas is arranged in columns orthogonal to the first, second and third rows.

20. The antenna module of claim 19, wherein the third ultra-wideband antenna is configured to radiate in a 6.5 GHz ultra-wideband frequency band and an 8.0 GHz ultra-wideband frequency band, the first ultra-wideband antenna and the second ultra-wideband antenna are configured to radiate in the 6.5 GHz ultra-wideband frequency band, and the antenna module comprises: An interposer, the interposer being mounted to the dielectric substrate; and A radio frequency integrated circuit (RFIC) is mounted to the interposer, wherein the RFIC includes phase and amplitude controllers for the first phased antenna array and the second phased antenna array.

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