Component assembly method and electronic device

Abstract

The present invention provides a component assembly method and an electronic device. A film layer that has different warpage degrees under different conditions is selected as at least a part of the movable component, and at least the part of the movable component that extends into the gap of the fixing component of the first component undergoes sufficient warpage deformation under a first preset triggering condition to achieve a temporary "locking" effect (i.e., temporary fixation) between the movable component and the fixing component, ensuring that the movable component does not move during the process of assembling the second component to the movable component, thereby guaranteeing the stability of the assembly of the second component; after the second component is assembled, the warpage deformation of the movable component can be restored to the required degree by removing the first preset triggering condition or changing to a second preset triggering condition to release the temporary fixation and make the movable component "movable" relative to the fixing component again.

Description

Technical Field

[0001] The present invention relates to the technical field of module assembly of electronic products, and particularly to a component assembly method and an electronic device. Background Art

[0002] With the development of MicroElectroMechanical System (MEMS) technology, and with the trend of electronic products, intelligent devices, etc. towards smaller size and higher performance, assembling other components on the movable parts of MEMS actuators and then realizing the movement of these other components has become one of the means for realizing module assembly of some electronic products. This component assembly method generally requires physical connection of structural adhesive between the movable parts of the MEMS actuator and the other components, and electrical connection of wire bonding between the other components and the MEMS actuator.

[0003] However, whether it is to achieve the above-mentioned physical connection of structural adhesive or electrical connection of wire bonding, it is necessary that the positions of the movable parts of the MEMS actuator and the other components remain stable during the assembly process, which is obviously contradictory to the movable nature of the movable parts of the MEMS actuator itself.

[0004] Therefore, how to keep the positions of the movable parts and the other components to be assembled stable during the process of assembling other components onto the movable parts of components such as MEMS, and still keep the movable parts movable after the assembly is completed, has become one of the technical problems that need to be urgently solved by those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a component assembly method and an electronic device, which can keep the positions of the movable parts and the other components to be assembled stable during the process of assembling other components onto the movable parts of components such as MEMS, and still keep the movable parts movable after the assembly is completed.

[0006] To achieve the above purpose, the present invention provides a component assembly method, including:

[0007] Providing a first component, the first component having a fixed part and a movable part, a void being provided in the fixed part, at least part of the movable part extending into the void and being movable relative to the fixed part in at least one direction in the void, wherein at least the part of the movable part extending into the void is made of a material that can warp and deform under a first preset triggering condition;

[0008] Apply the first preset triggering condition at least to the part of the movable component extending into the gap, so as to at least warp and deform the part of the movable component extending into the gap towards the fixed component until it contacts or presses against the fixed component for temporary fixation;

[0009] Provide a second component and assemble the second component onto the movable component;

[0010] Remove the first preset triggering condition or replace the first preset triggering condition with a second preset triggering condition, so that the warping deformation of the movable component returns to the required degree to release the temporary fixation, enabling the movable component to be movable relative to the fixed component again.

[0011] The present invention also provides an electronic device, which includes:

[0012] A first component, the first component having a fixed component and a movable component, with a gap provided in the fixed component, at least a part of the movable component extending into the gap and being movable relative to the fixed component in at least one direction within the gap;

[0013] A second component, the second component being assembled onto the movable component and capable of moving along with the movement of the movable component;

[0014] Wherein, at least the part of the movable component extending into the gap is made of a material that can warp and deform under the first preset triggering condition, and the material can warp and deform to contact or press against the fixed component under the first preset triggering condition for temporary fixation to the fixed component, and when the first preset triggering condition is removed or replaced with a second preset triggering condition, the warping deformation of the material can return to the required degree.

[0015] Compared with the prior art, the technical solution of the present invention has one of the following beneficial effects:

[0016] 1. Select a film layer that can have different warping degrees under different conditions as at least a part of the movable component, and at least make the part of the movable component extending into the gap of the fixed component of the first component warp and deform sufficiently under the first preset triggering condition to achieve a temporary "locking" effect (i.e., temporary fixation) between the movable component and the fixed component, ensuring that the movable component does not move during the process of assembling the second component onto the movable component, thereby guaranteeing the stability of the assembly of the second component; after the second component is assembled, the warping deformation of the movable component can be restored to the required degree by removing the first preset triggering condition or changing to the second preset triggering condition to release the temporary fixation and make the movable component "movable" relative to the fixed component again.

[0017] 2. This solution does not require additional structures, has a simple process, and is easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flowchart of a method for assembling components according to an embodiment of the present invention.

[0019] Figures 2 to 5 is a schematic cross-sectional view of a device structure in a method for assembling components according to an embodiment of the present invention.

[0020] The reference numerals therein are as follows:

[0021] 10 - First component; 100 - Fixing member; 100a - First limiting structure; 100b - Second limiting structure; 101 - Movable member; 101a - Central region of the movable member; 101b - Edge of the movable member; 102 - Gap; 103 - Opening; 11 - Connecting structure; 12 - Second component. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The technical solutions proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the objectives of the embodiments of the present invention. The meaning of "and / or" herein is either one or both.

[0023] Please refer to Figure 1 , an embodiment of the present invention provides a method for assembling components, including the following steps:

[0024] S1. Provide a first component, the first component having a fixing member and a movable member, the fixing member having a gap therein, at least a part of the movable member extending into the gap and being movable relative to the fixing member in at least one direction within the gap, wherein at least the part of the movable member extending into the gap is made of a material that can warp and deform under a first preset triggering condition;

[0025] S2. Apply the first preset triggering condition to at least the part of the movable member extending into the gap, so that at least the part of the movable member extending into the gap warps and deforms towards the fixing member until it contacts or presses against the fixing member for temporary fixation;

[0026] S3. Provide a second component and assemble the second component onto the movable member;

[0027] S4. Remove the first preset trigger condition or replace the first preset trigger condition with a second preset trigger condition, so that the warping deformation of the movable part is restored to the required degree to release the temporary fixation, so that the movable part can move relative to the fixed part again.

[0028] Please refer to Figure 2 , in step S1, provide a first element 10, the first element 10 has a fixed part 100 and a movable part 101, a gap 102 is provided in the fixed part 100, at least a part of the movable part 101 extends into the gap 102, and in the gap 102, it is movable relative to the fixed part 100 along at least one direction. Wherein, the way the movable part 101 moves relative to the fixed part 100 includes at least one of horizontal movement, vertical movement, and rotation. In this embodiment, the gap 102 includes three parts: the space between the peripheral side walls of the movable part 101 and a part of the fixed part 100, the space between the top of the movable part 101 and a part of the fixed part 100 above it, and the space between the bottom of the movable part and a part of the fixed part 100 below it.

[0029] As an example, the first element 10 is a MEMS element, only a small part of the movable part 101 is arranged in the gap 102 of the fixed part 100, and a plurality of openings 103 are provided in the upper surface of the fixed part 100 at the gap 102, and the openings 103 communicate with the gap 102.

[0030] As another example, the first element 10 is a MEMS element, the fixed part 100 has a gap 102 (i.e., a cavity), and except for the part that needs to be fixed to the outside, the rest of the movable part 101 is arranged in the gap 102, and the movable part 101 can move and / or rotate in the gap 102, so that the movable part 101 is movable relative to the fixed part 100. A plurality of openings 103 exposing a part of the surface of the movable part 101 are provided on the upper surface of the fixed part 100, and each opening 103 communicates with the gap 102.

[0031] Optionally, the fixed component 100 has a first limiting structure 100a and a second limiting structure 100b. The first limiting structure 100a can limit the maximum moving position of the movable component 101 in a direction other than the movable direction, and the second limiting structure 100b can limit the movable range of the movable component 101 in the movable direction. As an example, the movable component 101 can move horizontally relative to the fixed component 100. The second limiting structure 100b is the side wall around the gap 102, which can limit the movable range of the movable component 101 in the horizontal direction. The first limiting structure 100a is the top wall of the gap 102, which can limit the maximum moving position of the movable component 101 in the vertical direction.

[0032] In this embodiment, at least a part of the movable component 101 extending into the gap 102 is made of a material that can warp and deform under a first preset triggering condition. And the warping deformation of the movable component 101 can return to the required degree after the first preset triggering condition is removed subsequently or replaced with a second preset triggering condition. That is to say, the warping deformation of the movable component 101 is "reversible".

[0033] Optionally, the first preset trigger condition may include at least one of current change, voltage change, light change, magnetic change, chemical change, and temperature change. Among them, when the first preset trigger condition is a current change and / or a voltage change, at least a part of the movable member extending into the gap is an electro-deformable material, and the electro-deformable material includes piezoelectric ceramics, etc.; when the first preset trigger condition is a light change, at least a part of the movable member extending into the gap is a photo-deformable material, and the photo-deformable material includes ferroelectric ceramics, etc., such as lanthanum lead zirconate titanate (PLZT) ferroelectric ceramics.; when the first preset trigger condition is a chemical change, at least a part of the movable member extending into the gap is a material that can deform after undergoing a chemical change with a first specified reagent, and after the first preset trigger condition is removed subsequently and replaced with a second specified reagent (i.e., replaced with a second preset trigger condition), this material can react chemically with the second specified reagent again, thereby enabling the warping deformation of the movable member 101 to recover to the required degree; when the first preset trigger condition is a magnetic change, at least a part of the movable member extending into the gap is a magneto-deformable material, and the magneto-deformable material includes permanent magnet-like ferrite materials, etc. or soft magnetic materials such as iron-silicon alloys; when the first preset trigger condition is a temperature change, at least a part of the movable member extending into the gap is various single-layer films or composite film structures with various stresses varying with temperature, such as a single-layer silicon oxide film, or a composite film of silicon oxide stacked with silicon nitride, etc., which can deform when heated and can also deform when cooled. The normal operating temperature range of the movable member 101 depends on the use of the device. For example, for commonly used civilian electronic components, the normal operating temperature of its movable member 101 can be set from minus 20 degrees Celsius to plus 50 degrees Celsius.

[0034] In the normal operating environment of the first element 10, the movable member 101 can be a flat planar structure or a curved surface structure with a certain degree of warping. And the warping degree of the movable member 101 in the normal environment depends on the size of the gap 102. When the warping of the movable member 101 is not greater than the critical warping degree allowed by the gap 102, it is considered that the movable member 101 can move freely and the device operates normally. However, when the warping of the movable member 101 is greater than the critical warping degree allowed by the gap 102, the movable member 101 will come into contact with the surrounding adjacent interfaces. Further, when the frictional resistance caused by this contact is too large, it will cause the movable member 101 to be unable to move, and at this time, it is considered that the device cannot operate normally.

[0035] In addition, in this step, the forming process of the first element 10 is not the focus of the present invention, and it can be any suitable process well-known to those skilled in the art, and will not be elaborated herein.

[0036] Please refer to Figure 3, in step S2, apply the first preset triggering condition at least on at least a part of the movable member 101 extending into the gap 102, so that at least a part of the movable member 101 extending into the gap 102 warps and deforms towards the fixed member 100 until it contacts or presses against the fixed member 100, generating sufficient static friction between the movable member 101 and the fixed member 100 to be sufficient to keep the movable member 101 stationary relative to the fixed member 100, thereby realizing the temporary fixation of the movable member 101 and the fixed member 100. As an example, the central region 101a of the movable member 101 extending into the gap 102 bulges upward until it contacts or presses against the first limiting structure 100a, and the edge region 101b of the movable member 101 extending into the gap 102 warps and deforms downward until it contacts or presses against the bottom wall of the gap 102, thereby realizing the temporary fixation of the movable member 101 and the fixed member 100.

[0037] Please refer to Figure 4 , in step S3, first, provide a second element 12, and the second element 12 can be any suitable element well-known to those skilled in the art, such as including at least one of a photosensitive chip, a CMOS image sensor, a full-transmission mirror, a reflector, a semi-transmission mirror, a camera lens group, etc. Then, in an environment where the first preset triggering condition is applied, an adhesive layer 11 can be formed on the bonding surface of the second element 12 and / or the bonding surface of the movable member 101 by means of dispensing, drip irrigation, gluing, etc.; then, the second element 12 is adhered to the adhesive layer 11, and the adhesive layer 11 can be further cured to enhance the mechanical properties between the first element 10 and the second element 12. In this embodiment, an opening 103 is provided in the fixed member 100 above the movable member 101 in the gap 102, and the adhesive layer 11 also fills the opening 103.

[0038] It should be noted that when at least a part of the movable member 101 extending into the gap 102 is made of a thermally deformable material, the material of the adhesive layer 11 can be selected as a thermosetting adhesive, so that the curing process of the adhesive layer 11 and the process of releasing the temporary fixation in step S4 can be combined into one, thereby simplifying the process and reducing costs. Of course, when at least a part of the movable member 101 extending into the gap 102 is made of a thermally deformable material, the material of the adhesive layer 11 can be selected as a photo-curing adhesive. Thus, the adhesive layer 11 can be cured by light irradiation to avoid adverse effects on the operation of releasing the temporary fixation in subsequent step S4. In addition, it should be noted that for the curing of the adhesive layer 11, whether it is thermosetting, photo-curing or natural curing at room temperature, it is required that the deformation caused by the curing of the adhesive layer 11 does not affect the cancellation of the first preset trigger condition or the restoration of the movable member to the required degree after applying the second preset trigger condition, that is, the influence caused by the curing of the adhesive layer 11 can be ignored relative to the required restoration of the movable member.

[0039] Please refer to Figure 5 , in step S4, according to the material properties of the movable member 101 and the specific situation of the first preset trigger condition, appropriate means can be selected to restore the warping deformation of the movable member 101 to the required degree. At this time, the movable member 101 in the gap 102 no longer contacts the upper first limiting structure 100a or the contact friction force can be ignored, and the movable member 101 in the gap 102 no longer contacts the lower fixing member 100 or the contact friction force can be ignored, so as to release the temporary fixation between the movable member 101 and the fixing member 100, so that the movable member 101 can be movable relative to the fixing member 100 again. In this step, when the warping deformation of the movable member 101 is restored to the required degree, the movable member 101 can be flat or have a certain warping degree, but the adverse effects caused by this warping degree can be ignored compared with the improvement of the assembly accuracy of the first element 10 and the second element 12 to release the temporary fixation, so that the movable member 101 can be movable relative to the fixing member 100 again.

[0040] As an example, in step S4, the first preset trigger condition applied in step S2 is removed to restore the warping deformation of the movable member 101 to the required degree, so as to release the temporary fixation, so that the movable member 101 can be movable relative to the fixing member 100 again.

[0041] As another example, in step S4, the first preset trigger condition applied in step S2 is replaced with a second preset trigger condition to restore the warping deformation of the movable member 101 to the required degree, so as to release the temporary fixation, enabling the movable member 101 to be movable relative to the fixed member 100 again. Wherein, the second preset trigger condition may include at least one of current change, voltage change, light change, magnetic force change, chemical change, and temperature change. And when the second preset trigger condition and the first preset trigger condition are change conditions of the same nature, the value ranges of the second preset trigger condition and the first preset trigger condition are different. For example, when both the second preset trigger condition and the first preset trigger condition are temperature changes, the first preset trigger condition may be a temperature that rises from the normal ambient temperature to a temperature exceeding the normal ambient temperature, and the second preset trigger condition is a temperature that returns from a temperature exceeding the normal ambient temperature to the normal ambient temperature.

[0042] Next, in conjunction with Figures 1 to 5 , and a specific application example will be used to further illustrate the technical solution of this embodiment. The component assembly method of this application example adopts the above steps S1 to S4 process, and is specifically as follows:

[0043] In step S1, the provided first element 10 is a MEMS element. The first element 10 has a fixed part 100 and a movable part 101. A void 102 is provided in the fixed part 100. Only a part of the movable part 101 is arranged in the void 102 of the fixed part 100. A plurality of openings 103 are provided in the upper surface of the fixed part 100 at the void 102. The openings 103 communicate with the void 102. The movable part 101 in the void 102 can move horizontally relative to the fixed part 100. The movable part 101 is integrally made of a thermally deformable material. At normal ambient temperature, the movable part 101 has a certain degree of warpage as a whole, so that the part of the movable part 101 arranged in the void 102 of the fixed part 100 bulges upward. The warpage deformation of the movable part 101 is "reversible" within a specified temperature range. The lowest temperature value of the specified temperature range is lower than the lowest temperature value of the normal operating temperature range, and the highest temperature value of the specified temperature range is higher than the highest temperature value of the normal operating temperature range. Specifically, for example, the specified temperature range is -50 °C to +60 °C, and the normal operating temperature range is -10 °C to +45 °C. For the first element 10 within the normal operating temperature range, through the selection of its material and the design of the film layer geometry, it can be realized that within the normal operating temperature range, after the movable part 101 in the void 102 undergoes warpage deformation caused by temperature change, they still do not contact each other, or after contact, the frictional force generated at the contact surface can be ignored. Among them, when the warpage of the movable part 101 is not greater than the critical warpage degree allowed by the void 102, it is considered that the movable part 101 can move freely and the device operates normally. However, when the warpage of the movable part 101 is greater than the critical warpage degree allowed by the void 102, the movable part 101 will contact the surrounding adjacent interfaces. Further, when the frictional resistance caused by this contact is too large, it will cause the movable part 101 to be unable to move, and at this time the device cannot operate normally.

[0044] In step S2, the ambient temperature of the first element 10 is changed to a non-operating temperature range T1. T1 is not within the normal operating temperature range of the first element 10, but is still within the above-mentioned specified temperature range. At this time, the movable part 101 is warped and deformed as a whole under the influence of temperature change. The central region 101a of the movable part 101 in the void 102 bulges upward to contact the upper fixed part 101, and the edge region 101b of the movable part 101 in the void 102 is stretched downward to contact the lower fixed part 101, so as to generate sufficient static frictional force between the movable part 101 and the fixed part 100, which is sufficient to make the movable part 101 fixed relative to the fixed part 100, thereby realizing the temporary fixation of the movable part 101 and the fixed part 100.

[0045] In step S3, the provided second element 12 is a photosensitive chip, a CMOS image sensor, a full-transmission mirror, a reflecting mirror, a semi-transmission mirror or a camera lens group. Then, at temperature T1, an adhesive layer 11 is formed on the surface of the movable part 101 exposed by the opening 103 by means of dispensing, dripping, coating, etc. The adhesive layer 11 can be a photo-curing adhesive or a heat-curing adhesive. Then, the second element 12 is adhered to the adhesive layer 11.

[0046] In step S4, the ambient temperature is restored from T1 to the normal operating temperature range of the first element 10. Due to the reversibility of the warping deformation of the movable part 101, the movable part 101 gradually returns to the state in step S1. At this time, the central region 101a of the movable part 101 in the gap 102 no longer contacts or the contact friction force is negligible with the upper first limiting structure 100a, and the edge region 101b of the movable part 101 in the gap 102 no longer contacts or the contact friction force is negligible with the lower fixed part 100. The movable part 101 in the gap 102 is separated from the fixed part 101. At this time, the movable part 101 after assembling the second element 12 is "movable" relative to the fixed part 100 again.

[0047] Please refer to Figure 5 , this embodiment also provides an electronic device formed by using the element assembling method of this embodiment. The electronic device includes: a first element 10, an adhesive layer 11 and a second element 12.

[0048] The first element 10 has a fixed part 100 and a movable part 101. The second element 12 is adhered to the surface of the movable part 101 of the first element 10 through the adhesive layer 11. A gap 102 is provided in the fixed part 100, and at least part of the movable part 101 extends into the gap 102 and is movable relative to the fixed part 100 in at least one direction in the gap 102. Among them, the way that the movable part 101 is movable relative to the fixed part 100 includes at least one of horizontal movement, vertical movement and rotation. In this embodiment, the gap 102 includes three parts: the space between the peripheral side walls of the movable part 101 and the partial fixed part 100, the space between the top of the movable part 101 and the partial fixed part 100 above it, and the space between the bottom of the movable part and the partial fixed part 100 below it.

[0049] As an example, the first element 10 is a MEMS element. Only a small part of the movable part 101 is arranged in the gap 102 of the fixed part 100, and a plurality of openings 103 are provided in the upper surface of the fixed part 100 at the gap 102, and the openings 103 communicate with the gap 102. The adhesive layer 11 also fills the openings 103.

[0050] As another example, the first element 10 is a MEMS element. The fixing member 100 has a gap 102 (i.e., a cavity). Except for the part that needs to be fixed to the outside world, the rest of the movable member 101 is disposed in the gap 102, and the movable member 101 can move and / or rotate in the gap 102, so that the movable member 101 is movable relative to the fixing member 100. The upper surface of the fixing member 100 is provided with a plurality of openings 103 that expose a partial surface of the movable member 101, and each opening 103 communicates with the gap 102. The adhesive layer 11 also fills in the openings 103.

[0051] Optionally, the fixing member 100 has a first limiting structure 100a and a second limiting structure 100b. The first limiting structure 100a can limit the maximum movement position of the movable member 101 in a direction other than the movable direction, and the second limiting structure 100b can limit the movable amplitude range of the movable member 101 in the movable direction. As an example, the movable member 101 can move horizontally relative to the fixing member 100. The second limiting structure 100b is the side wall around the gap 102, which can limit the movable amplitude range of the movable member 101 in the horizontal direction. The first limiting structure 100a is the top wall of the gap 102, which can limit the maximum movement position of the movable member 101 in the vertical direction.

[0052] In this embodiment, at least a part of the movable member 101 extending into the gap 102 is made of a material that can warp and deform under a first preset triggering condition. And the warping deformation of the movable member 101 can return to the required degree after the first preset triggering condition is removed subsequently or replaced with a second preset triggering condition. That is to say, the warping deformation of the movable member 101 is "reversible" under specified conditions.

[0053] Optionally, the first preset trigger condition may include at least one of current change, voltage change, light change, magnetic change, chemical change, and temperature change. Among them, when the first preset trigger condition is current change and / or voltage change, at least a part of the movable component extending into the gap is an electro-deformable material, and the electro-deformable material includes piezoelectric ceramics, etc.; when the first preset trigger condition is light change, at least a part of the movable component extending into the gap is a photo-deformable material, and the photo-deformable material includes lanthanum lead zirconate titanate (PLZT) ferroelectric ceramics, etc.; when the first preset trigger condition is chemical change, at least a part of the movable component extending into the gap is a material that can deform after undergoing a chemical change with a specified reagent; when the first preset trigger condition is magnetic change, at least a part of the movable component extending into the gap is a magneto-deformable material, and the magneto-deformable material includes permanent magnet-like ferrite materials, etc. or soft magnetic materials such as iron-silicon alloys; when the first preset trigger condition is temperature change, at least a part of the movable component extending into the gap is various single-layer films or composite film structures with various stresses changing with temperature, such as a single-layer silicon oxide film, or a composite film of silicon oxide stacked with silicon nitride, etc., which can deform when heated and can also deform when cooled. The normal operating temperature range of the movable component 101 depends on the use of the device. For example, for commonly used electronic components in civil use, the normal operating temperature of the movable component 101 can be set from minus 20 degrees Celsius to plus 50 degrees Celsius.

[0054] In the normal operating environment of the first element 10, the movable component 101 can be a flat planar structure or a curved surface structure with a certain degree of warping. The warping degree of the movable component 101 in the normal environment depends on the size of the gap 102. When the warping of the movable component 101 is not greater than the critical warping degree allowed by the gap 102, it is considered that the movable component 101 can move freely and the device operates normally. However, when the warping of the movable component 101 is greater than the critical warping degree allowed by the gap 102, the movable component 101 will come into contact with the surrounding adjacent interfaces. Further, when the frictional resistance caused by this contact is too large, it will cause the movable component 101 to be unable to move, and at this time, it is considered that the device cannot operate normally.

[0055] Optionally, the electronic device is a lens module or an electronic product integrated with a lens module, the first element is a MEMS element, and the second element 12 can be any suitable element well-known to those skilled in the art, such as including at least one of a photosensitive chip, a CMOS image sensor, a full-transmission lens, a reflector, a semi-transmission lens, a camera lens group, etc.

[0056] In summary, the technical solution of the present invention selects a film layer that can have different degrees of warping under different conditions as at least a part of the movable component, and at least makes the part of the movable component that extends into the gap of the fixed component of the first element to be warped and deformed enough under the first preset trigger condition, so as to achieve a temporary "locking" effect (i.e. temporary fixation) between the movable component and the fixed component, and ensure that the movable component will not move during the assembly of the second component to the movable component, thereby ensuring the stability of the assembly of the second component; after the second component is assembled, the warping deformation of the movable component can be restored to the required degree by removing the first preset trigger condition or using the second preset trigger condition, so as to release the temporary fixation and make the movable component "movable" relative to the fixed component again. This solution does not require the addition of additional structures, and the process is simple and easy to implement.

[0057] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of the technical solution of the present invention.

Claims

1. A component assembly method, characterized in that, Comprising: Providing a first element, the first element having a fixed part and a movable part, a void being provided in the fixed part, at least a part of the movable part extending into the void and being movable relative to the fixed part in at least one direction within the void, wherein the part of the movable part extending into the void is made of a material that can warp under a first preset triggering condition; Applying the first preset triggering condition to the part of the movable part extending into the void, so that the part of the movable part extending into the void warps towards the fixed part until it contacts or presses against the fixed part for temporary fixation; Providing a second element and assembling the second element onto the movable part; Removing the first preset triggering condition, or replacing the first preset triggering condition with a second preset triggering condition, to restore the warping deformation of the movable part to a required degree to release the temporary fixation, such that the movable part can be movable relative to the fixed part again.

2. The component assembly method according to claim 1, characterized in that, The first preset triggering condition includes at least one of a current change, a voltage change, a light change, a magnetic force change, a chemical change, and a temperature change.

3. The component assembly method according to claim 2, characterized in that, The second preset triggering condition includes at least one of a current change, a voltage change, a light change, a magnetic force change, a chemical change, and a temperature change, and when the second preset triggering condition and the first preset triggering condition are change conditions of the same nature, the value ranges of the second preset triggering condition and the first preset triggering condition are different.

4. The component assembly method according to claim 2, characterized in that, When the first preset triggering condition is a current change and / or a voltage change, the part of the movable part extending into the void is an electro-deformable material, and the electro-deformable material includes piezoelectric ceramics; when the first preset triggering condition is a light change, the part of the movable part extending into the void is a photo-deformable material, and the photo-deformable material includes ferroelectric ceramics; when the first preset triggering condition is a chemical change, the part of the movable part extending into the void is a material that can deform after undergoing a chemical change with a specified reagent; When the first preset triggering condition is a magnetic force change, the part of the movable part extending into the void is a magneto-deformable material, and the magneto-deformable material includes permanent magnet-like ferrite materials or iron-silicon alloy soft magnetic materials.

5. The component assembly method according to claim 2, characterized in that, When the first preset triggering condition is a temperature change, the part of the movable part extending into the void is various single-layer films or composite film structures with various stresses changing with temperature.

6. The component assembly method according to claim 5, characterized in that, The normal operating temperature range of the movable part is from minus 20 degrees Celsius to plus 50 degrees Celsius.

7. The component assembly method according to any one of claims 1 to 6, characterized in that, Under the normal operating environment of the first element, the warping degree of the movable part depends on the size of the void.

8. The method for assembling components according to any one of claims 1 to 6, characterized in that, The movable manner of the movable part relative to the fixed part includes horizontal movement, vertical movement, or rotation.

9. The component assembly method according to any one of claims 1 to 6, characterized in that, The fixed part has a first limiting structure and / or a second limiting structure, the first limiting structure being capable of limiting the maximum movement position of the movable part in a direction other than the movable direction, and the second limiting structure being capable of limiting the movable amplitude range of the movable part in the movable direction.

10. The component assembling method according to claim 1, characterized in that, The steps of assembling the second element onto the movable part include: forming an adhesive layer at corresponding positions of the movable part and / or corresponding positions of the second element; and bonding the second element onto the surface of the movable part through the adhesive layer.

11. The component assembly method according to claim 1, characterized in that, The first element is a MEMS element, and the second element includes a photosensitive chip.

12. An electronic device, characterized in that, The electronic device is formed by using the element assembling method according to any one of claims 1-11, and includes: A first element having a fixed part and a movable part, wherein a void is provided in the fixed part, at least a part of the movable part extends into the void, and is movable relative to the fixed part in at least one direction within the void; A second element assembled onto the movable part and capable of moving along with the movement of the movable part; Wherein, the part of the movable part extending into the void is made of a material that can warp and deform under a first preset triggering condition, and the material can warp and deform to contact or press against the fixed part under the first preset triggering condition so as to be temporarily fixed to the fixed part, and when the first preset triggering condition is removed, or the first preset triggering condition is replaced with a second preset triggering condition, the warping deformation of the material can recover to the required degree.

13. The electronic device according to claim 12, characterized in that, The first preset triggering condition includes at least one of current change, voltage change, light change, magnetic force change, chemical change, and temperature change.

14. The electronic device according to claim 13, wherein The second preset triggering condition includes at least one of current change, voltage change, light change, magnetic force change, chemical change, and temperature change, and when the second preset triggering condition and the first preset triggering condition are change conditions of the same nature, the value ranges of the second preset triggering condition and the first preset triggering condition are different.

15. The electronic device according to claim 12, wherein When the first preset triggering condition is a current and / or voltage change, the part of the movable part extending into the void is an electro-deformable material, and the electro-deformable material includes piezoelectric ceramics; when the first preset triggering condition is a light change, the part of the movable part extending into the void is a photo-deformable material, and the photo-deformable material includes ferroelectric ceramics; when the first preset triggering condition is a chemical change, the part of the movable part extending into the void is a material that can deform after undergoing a chemical change with a specified reagent; When the first preset triggering condition is a magnetic force change, the part of the movable part extending into the void is a magneto-deformable material, and the magneto-deformable material includes permanent magnet-like ferrite materials or iron-silicon alloy soft magnetic materials; when the first preset triggering condition is a temperature change, the part of the movable part extending into the void is various single-layer films or composite film structures whose stress changes with temperature.

16. The electronic device according to claim 12, wherein The normal operating temperature range of the movable part is from -20 degrees Celsius to 50 degrees Celsius.

17. The electronic device according to claim 12, wherein The fixed component has a first limiting structure and / or a second limiting structure. The first limiting structure can limit the maximum moving position of the movable component in a direction other than the movable direction, and the second limiting structure can limit the movable amplitude range of the movable component in the movable direction.

18. The electronic device according to claim 12, wherein The second element is bonded to the surface of the movable component through an adhesive layer.

19. The electronic device according to claim 12, wherein The electronic device is a lens module or an electronic product integrated with a lens module. The first element is a MEMS element, and the second element includes a photosensitive chip.

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