Substrate processing device

Abstract

The present invention provides a substrate processing apparatus. In one example, the substrate processing apparatus includes: a housing having a processing space for processing a substrate, and the housing having an entrance / exit for allowing the substrate to enter and exit; a support unit located within the processing space and supporting the substrate; a baffle member having a door for opening and closing the entrance / exit; and a heater for heating the door, the heater being disposed adjacent to the door within the processing space, and the baffle member further includes: a driver for moving the door between a closed position when the door closes the entrance / exit and an open position when the door opens the entrance / exit.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus for compensating for the temperature drop around the inlet / outlet caused by the opening and closing of the inlet / outlet. Background Technology

[0002] Liquid crystal display (LCD) elements, plasma display panel (PDP) elements, and the like have recently been used in the manufacture of image display devices, and they also use the substrates of flat panel display devices (FPD).

[0003] The manufacturing process of flat panel display devices involves numerous processes, including substrate manufacturing, cell manufacturing, and module manufacturing. In particular, the substrate manufacturing process includes photolithography, a process used to form various patterns on the substrate. This photolithography process involves sequentially applying a photoresist or other photosensitive liquid to the substrate, an exposure process to form specific patterns on the coated photosensitive film, and a development process to develop the area corresponding to the exposed photosensitive film. Before and after the coating and development processes, a baking process is performed to heat-treat the substrate.

[0004] The baking process takes place inside a baking chamber that is sealed from the outside. However, when the substrate is placed into the baking chamber, external airflow is introduced into the baking chamber to lower the internal temperature. In particular, the temperature around the inlet and outlet provided in the baking chamber for the substrate to enter and exit is lowered.

[0005] To compensate for the temperature around the entrance and exit, a temperature compensation device is installed inside the baffle used to open and close the entrance and exit. Figure 1 This illustrates a typical baking chamber with baffles equipped with temperature compensation devices. (See reference...) Figure 1 An inlet / outlet 2 for the substrate to enter and exit is provided on one side of the baking chamber 1. A baffle 3 rotates around a hinge 4 to open and close the inlet / outlet 2. A nickel-chromium alloy heating wire 5 is provided inside the baffle 3 as a temperature compensation device. In addition, a temperature sensor 6 for measuring the temperature of the nickel-chromium alloy heating wire 5 and an interlocking device 7 for preventing baffle malfunction are provided inside the baffle.

[0006] However, since the nickel-chromium alloy heating wire 5, temperature sensor 6, and interlocking device 7 are powered and receive electrical operation signals via wires 8 extending from the inside of the baffle 3 to the outside, the wires 8 extending to the outside of the baffle 3 are repeatedly folded and unfolded depending on the operation of the baffle 3. Therefore, stress is applied to the wires 8, and the coating of the wires 8 is scattered in powder form to generate particles, and in some cases, breakage occurs. Summary of the Invention

[0007] The problem to be solved

[0008] One object of the present invention is to provide a substrate processing apparatus that compensates for the temperature of the inlet and outlet by means of a heating baffle.

[0009] The object of the present invention is to provide a substrate processing apparatus that does not cause problems such as breakage or disconnection of the wires used to supply power to the heater.

[0010] The purpose of this invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art through the following description.

[0011] Solutions to the problem

[0012] The present invention provides a substrate processing apparatus. In one example, the substrate processing apparatus includes: a housing having a processing space for processing a substrate, and the housing having an entrance / exit for allowing the substrate to enter and exit; a support unit located within the processing space and supporting the substrate; a baffle member having a door for opening and closing the entrance / exit; and a heater for heating the door, the heater being disposed adjacent to the door within the processing space, and the baffle member may further include: a actuator for moving the door between a closed position when the door closes the entrance / exit and an open position when the door opens the entrance / exit.

[0013] In one example, the baffle component also includes a rotation axis that serves as the rotation center of the door, and the actuator can rotate the door about the rotation axis.

[0014] In one example, the rotation axis can be set within the processing space.

[0015] In one example, the heater can be located in the rotating shaft.

[0016] In one example, the heater can be located between the support unit and the door.

[0017] In one example, the baffle member may also include a reflective member disposed on the side surface of the door facing the processing space.

[0018] In one example, the baffle member may also include an absorption member disposed on the side surface of the door facing the processing space.

[0019] In one example, the heater can be set as one or more infrared lamps.

[0020] In one example, the door may have a curved cross-section that protrudes outward toward the outside of the housing.

[0021] In one example, the cross-section of the door can be set to an arc shape.

[0022] In one example, the heater could be positioned at the center of the arc.

[0023] In one example, the door can be moved between an open and closed position by rotating along the length of the arc.

[0024] In one example, the substrate processing could be a heating process.

[0025] In one example, the apparatus may further include a substrate heating unit configured to heat a substrate within a processing space, the substrate heating unit being disposed at at least one of a position corresponding to the upper surface of the substrate and a position corresponding to the lower surface of the substrate.

[0026] Furthermore, a substrate processing apparatus includes: a housing having a processing space for processing a substrate, and the housing having an entrance / exit for allowing the substrate to enter and exit; a support unit located within the processing space and supporting the substrate; a substrate heating unit for heating the substrate; a baffle member having a door for opening and closing the entrance / exit; and a heater for heating the door, the heater being disposed adjacent to the door within the processing space. The baffle member further includes: a driver for moving the door between a closed position when the door closes the entrance / exit and an open position when the door opens the entrance / exit, and the cross-section of the door is configured as an arcuate shape, the driver causing the door to move between the open and closed positions by rotating along the length direction of the arcuate shape.

[0027] In one example, the baffle member may also include a rotation axis that serves as the rotation center of the door, and the actuator may cause the door to rotate about the rotation axis.

[0028] In one example, the rotation axis can be set within the processing space.

[0029] In one example, the heater can be located in the rotating shaft.

[0030] In one example, the substrate can be set as a rectangular substrate.

[0031] In one example, the substrate heating unit may be located at at least one position corresponding to the upper surface of the substrate and at a position corresponding to the lower surface of the substrate.

[0032] Invention Effects

[0033] According to an embodiment of the present invention, the temperature at the inlet and outlet can be compensated by heating a baffle.

[0034] Furthermore, according to embodiments of the present invention, problems such as breakage or disconnection of the wires used to supply power to the heater can be prevented.

[0035] The effects of the present invention are not limited to those described above. Those skilled in the art will clearly understand from this specification and the accompanying drawings any effects not mentioned. Attached Figure Description

[0036] Figure 1 This is a cross-sectional view of a typical baking chamber.

[0037] Figure 2 This is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0038] Figure 3 It is shown Figure 2 A perspective view of the coating unit.

[0039] Figure 4 It is shown Figure 2 A cross-sectional view of the drying unit.

[0040] Figure 5 It is shown Figure 2 A perspective view of the baking unit.

[0041] Figure 6 It is shown Figure 2 A cross-sectional view of an example baking chamber.

[0042] Figure 7 It is shown Figure 2 A perspective view of an example baking room.

[0043] Figure 8 It is shown Figure 6 A perspective view of an example heater.

[0044] Figures 9 to 10 This is a diagram schematically illustrating the state of the baffle operation according to an embodiment of the present invention. Detailed Implementation

[0045] In the following description, embodiments of the invention will be presented in more detail with reference to the accompanying drawings. The embodiments of the invention may be modified in various ways, and the scope of the invention should not be construed as limited to the following embodiments. These embodiments are provided to illustrate the invention more completely to those skilled in the art. Therefore, the shapes of the elements in the figures are exaggerated for clearer illustration.

[0046] Furthermore, in this embodiment of the invention, an apparatus for baking a substrate during a photolithography process is described as an example. However, this embodiment is not limited to this, and various other processes that perform heat treatment on a substrate can be applied.

[0047] Furthermore, in this embodiment of the invention, a rectangular substrate used for manufacturing a flat panel display will be used as an example for description. However, this embodiment is not limited to this and can be applied to circular wafers.

[0048] The following will refer to Figures 2 to 10 This embodiment will be described in detail. Figure 2This is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention. (Refer to...) Figure 2 The substrate processing apparatus includes a transposition unit 100, a cleaning unit 110, multiple baking units 400, a coating unit 200, a drying unit 300, a buffer unit 130, an interface 140, an exposure unit 180, an edge exposure machine 150, a developing unit 160, and an inspection unit 170. Each processing unit is arranged to perform line-type processing, and the transposition unit 100, cleaning unit 110, coating unit 200, drying unit 300, buffer unit 130, interface 140, edge exposure machine 150, developing unit 160, and inspection unit 170 are arranged sequentially.

[0049] Multiple baking units 400 are respectively arranged before and after the coating unit 200 and before and after the developing unit 160. An exposure unit 180 is arranged on one side of the interface 140. Transfer robots are respectively installed between these processing units, and the transfer robots can transfer the substrate S between adjacent processing units. In this embodiment, only the coating unit 200, drying unit 300, and baking unit 400 will be described; detailed descriptions of other processing units will be omitted.

[0050] The coating unit 200 coats a film on the substrate S. Figure 3 It is shown Figure 2 A perspective view of the coating unit. (Refer to...) Figure 3 The coating unit 200 includes a plate 210, a substrate moving member 220, a coating nozzle 230, and a nozzle moving member 240. Hereinafter, the width direction of the plate 210 is referred to as the first direction 12, and the length of the plate 210 is referred to as the second direction 14. When viewed from above, the first direction 12 and the second direction 14 are set to be perpendicular to each other.

[0051] A vent 212 is formed on the upper surface of the plate 210. The vent 212 receives and ejects gas from a gas supply line (not shown) connected thereto. Optionally, the vent 212 can provide air pressure or vacuum pressure on the plate 210. The gas ejected from the vent 212 causes the substrate S placed on the plate 210 to float.

[0052] The substrate moving member 220 is mounted on both sides of the plate 210 facing the first direction 12. The substrate moving member 220 includes a substrate moving track 222 and a clamping member 224. The substrate moving track 222 is configured to extend along the second direction 14 on each of the two sides of the plate 210. Each substrate moving track 222 is provided with a clamping member 224.

[0053] The clamping member 224 clamps the substrate S that is lifted from the plate 210. The clamping member 224 is configured to move along the substrate moving track 222 in the second direction 14. The clamping member 224 can move together with the substrate S in the second direction 14 while supporting the lifted substrate S.

[0054] The coating nozzle 230 supplies a first processing liquid or a second processing liquid to the substrate S. The coating nozzle 230 has a length direction facing a first direction 12. A slit-shaped spray hole is formed on the bottom surface of the coating nozzle 230, with the length direction of the spray hole facing the first direction 12. The length of the spray hole facing the first direction 12 can correspond to the width of the substrate S or can be longer than that width. For example, the first processing liquid can be photoresist, and the second processing liquid can be a solvent. The photoresist can be photoresist, and the solvent can be a diluent. The photoresist and solvent can be sprayed from one coating nozzle 230 or from each of multiple coating nozzles 230.

[0055] The nozzle moving member 240 includes a support member 242, a vertical frame 244, a guide rail 246, and a drive unit (not shown). The support member 242 is connected to the coating nozzle 230 at the top of the plate 210. The support member 242 is configured such that its length direction faces a first direction 12. Both ends of the support member 242 are connected to the vertical frame 244. The vertical frame 244 is configured to extend downward from both ends of the support member 242. The lower end of the vertical frame 244 is mounted on the guide rail 246. The guide rail 246 is located on both sides of the substrate moving guide rail 222. The guide rail 246 is configured such that its length direction faces a second direction 14. The drive unit moves the vertical frame 244 along the second direction 14 on the guide rail 246. As the vertical frame 244 moves in the second direction 14, the support member 242 and the coating nozzle 230 move together in the second direction 14.

[0056] The drying unit 300 dries the substrate in a vacuum atmosphere. Figure 4 It is shown Figure 2 Cross-sectional view of drying unit 300. (Refer to...) Figure 4 The drying unit 300 includes a drying chamber 310, a platform 320, and a pressure reducing component 314.

[0057] An exhaust port 312 is formed at the bottom edge region of the drying chamber 310. A stage 320 supports a substrate inside the drying chamber 310. A plurality of support pins 322 are mounted on the upper surface of the stage 320. The plurality of support pins 322 are mounted to protrude from the upper surface of the stage 320. Each support pin 322 can support the substrate, such that the substrate is spaced apart from the stage 320. A pressure reducing member 314 is connected to the exhaust port 312 to create a vacuum atmosphere inside the drying chamber 310.

[0058] The baking unit 400 performs heat treatment on the substrate S. Figure 5It is shown Figure 1 A cross-sectional view of an example baking unit. Figures 6 to 7 It shows the setting Figure 5 Cross-sectional view of the baffle and heater in the baking unit.

[0059] In the following text, reference will be made to Figures 5 to 7 The baking unit 400 of the present invention is described. Figure 5 It is shown Figure 2 A perspective view of the baking unit 400. Figure 6 It is shown Figure 2 A cross-sectional view of an example baking chamber 401. Figure 7 It is shown Figure 2 An example perspective view of baking chamber 401.

[0060] Reference Figure 5 Multiple baking chambers 401a, 401b, 401c, and 401d can be provided in the baking unit 400. In one example, four baking chambers 401a, 401b, 401c, and 401d can be stacked. Each baking chamber 401a, 401b, 401c, and 401d can have the same dimensions and internal structure. Alternatively, the dimensions or internal structure of each baking chamber 401a, 401b, 401c, and 401d can be set differently.

[0061] Reference Figures 6 to 7 The baking unit 400 includes a housing 410, a support unit 430, a substrate heating unit 450, a baffle member 480, and a heater 490. The housing 410 is configured to have a cuboid shape.

[0062] The housing 410 provides a processing space 402 within it. An inlet / outlet 414 is formed on one side wall of the housing 410. The inlet / outlet 414 serves as the entrance / exit for the substrate S. In one example, an vent 416 is formed on a side surface of the housing 410. Optionally, the vent 416 may be located on the bottom surface of the housing 410. The vent 416 is connected to an venting member 418. The venting member 418 discharges processing byproducts generated in the processing space 402 through the vent 416. In one example, the venting member 417 is configured as a pressure-reducing member. In one example, during the venting process of the processing space 402 through the venting member 418, the processing space 402 may be configured to operate at a pressure below atmospheric pressure.

[0063] The support unit 430 supports the substrate S within the housing 410. In one example, a plurality of adsorption holes (not shown) and pin holes (not shown) may be formed on the upper surface of the support unit 430. The adsorption holes (not shown) may be connected to a pressure-reducing member (not shown) to vacuum adsorb the substrate S placed on the support unit 430. The vacuum-adsorbed substrate S may be fixed to the support unit 430.

[0064] A lifting pin 432 is disposed in each pin hole (not shown). In one example, the lifting pin 432 can be moved to a raised position and a lowered position by a pin drive member. Here, the raised position is the position where the upper end of the lifting pin 432 protrudes from the pin hole, and the lowered position is the position where the upper end of the lifting pin 432 is disposed in the pin hole. For example, the raised position can be set to the position where the upper end of the lifting pin 432 is at a height opposite to the inlet / outlet 414.

[0065] In one example, the substrate heating unit 450 is located inside the support unit 430. The substrate heating unit 450 heats the substrate S placed on the support unit 430. In one example, the substrate heating unit 450 is configured as a heating wire or a lamp. Furthermore, the substrate heating unit 450 heats the processing space 402 to create a process atmosphere above room temperature within the processing space 402. The substrate heating unit 450 can form the processing space 402 into a heating atmosphere before the substrate S is placed into the processing space 402.

[0066] In one embodiment, the substrate heating unit 450 may also be disposed on the upper part of the processing space 402. For example, the housing 440 may be disposed on the upper part of the processing space 402, and the substrate heating unit 450 may be disposed inside the housing 440. In one example, the substrate heating unit 450 disposed inside the support unit 430 and the substrate heating unit 450 disposed inside the housing 440 may be combined to heat the processing space 402 to a desired set temperature. Optionally, the substrate heating unit 450 may be disposed on at least one of the support unit 430 and the upper part of the processing space 402.

[0067] Baffle member 480 opens and closes entrance 414. In one example, baffle member 480 includes door 460 and drive member 470. Door 460 opens and closes entrance 414. In one example, the cross-section of door 460 may be configured as a curved shape. In one example, the cross-section of door 460 may have a curved shape protruding outward toward the housing 410. In one example, the cross-section of door 460 is configured as an arcuate shape.

[0068] A drive member 470 moves a door 460. In one example, the drive member 470 includes a rotation shaft 474 and a drive (not shown). The drive (not shown) moves the door 460 between a closed position where the door 460 closes the entrance 414 and an open position where the door 460 opens the entrance 414. In one example, the drive (not shown) rotates the door 460 about the rotation shaft 474. The drive (not shown) is connected to the rotation shaft 474 and transmits power to the rotation shaft 474. In one example, the rotation shaft 474 is disposed within a processing space 402. Optionally, the drive (not shown) can make the rotation radius of the door 460 different from the rotation radius of the rotation shaft 474. For example, the drive (not shown) may be provided with a rotary cylinder that deflects the rotation center of the door 460 and the rotation center of the rotation shaft 474.

[0069] In one example, the drive member 470 may further include a connecting member (not shown) connecting the rotating shaft 474 and the door 460. In one example, the connecting member (not shown) may be disposed outside the housing 410. Alternatively, the connecting member (not shown) may be disposed inside the housing 410.

[0070] Door 460 can rotate along its arc-shaped length to move between an open position and a closed position. The open position is when door 460 is configured to allow the substrate S to enter and exit through inlet 414. In one example, the upper end of door 460 is positioned at the same height as the upper end of the lifting pin or at a height lower than that. In one example, the open position can be configured such that the lower end of door 460 in the open position does not collide with housing 410.

[0071] The closed position is when the door 460 completely blocks the entrance 414. In one embodiment, a shielding plate 412 may be provided between the housing 410 and the lower end of the door 460, so that the processing space 402 can be sealed in the closed position. The shielding plate 412 shields the lower end of the housing 410 and the door 460, so that the processing space 402 is not affected by external factors when processing the substrate S. In one example, the closed position may be configured such that the upper end of the door 460 in the closed position does not collide with the housing 410.

[0072] Heater 490 heats baffle member 480. When substrate S is inserted into processing space 402, the temperature of the area adjacent to baffle member 480 in processing space 402 is lower than the temperature of other areas due to the opening and closing of baffle member 480. Heater 490 heats baffle member 480 to compensate for the temperature of the area adjacent to baffle member 480 in processing space 402 during processing.

[0073] In one example, heater 490 is disposed within processing space 402. In another example, heater 490 is located between support unit and door 460. For example, heater 490 is positioned adjacent to door 460 to compensate for temperature near door 460. In one example, a rotating shaft 474 is provided. For example, as... Figure 8 As shown, heater 490 is disposed inside rotating shaft 474. Alternatively, heater 490 may be mounted outside rotating shaft 474.

[0074] Heater 490 can be configured as one or more infrared lamps. Alternatively, heater 490 can be configured as another type of lamp, such as a halogen lamp. Alternatively, heater 490 can be configured as a heating wire.

[0075] The baffle member 480 may include a reflective member 464. In one example, the reflective member 464 may be disposed on the side surface of the door 460 facing the processing space 402. The door panel may be disposed on the rear surface of the reflective member 464. In one example, the reflective member 464 may be configured as a reflective plate made of a reflective material. Alternatively, the reflective member 464 may be coated on the side surface of the door 460 facing the processing space 402. The reflective member 464 reflects heat generated from the heater 490 into the interior of the processing space 402, thereby dissipating the heat. Because the door 460 is configured as an outwardly convex shape, the heat reflected by the reflective member 464 can be transferred into the interior of the processing space 402.

[0076] Optionally, the baffle member 480 may include an absorbing member instead of a reflective member 464. Like the reflective member 464, the absorbing member may be disposed on the side surface of the door 460 facing the processing space 402. The absorbing member absorbs heat supplied by the heater 490 to prevent the temperature of the door 460 from dropping. The heat generated by the heater 490 when the door 460 is provided with the absorbing member can be greater than when the door 460 is provided with the reflective member 464. The reflective member reduces the temperature difference between the area adjacent to the heating unit of the substrate S and the area adjacent to the entrance / exit 414 in the processing space 402. In one example, the absorbing member may be made of a metal with high thermal conductivity. For example, the absorbing member may be made of aluminum, copper, etc.

[0077] Figures 9 to 10 This is a schematic diagram illustrating the operational state of the baffle member 480 according to an embodiment of the present invention. (Refer to...) Figure 9 The door 460 is opened to process the substrate S in the baking chamber 401. A rotation shaft 474 is rotated by a driver (not shown), thereby rotating the door 460 along with the rotation shaft 474 and the connecting member (not shown) attached to the door 460. In one example, the processing space 402 can be heated to a preset temperature by the substrate S heating unit before the door 460 is in the open position. (Refer to...) Figure 10 The door 460 is closed to heat-treat the substrate S in the baking chamber 401. The rotating shaft 474 is rotated by a driver (not shown), thus the connecting member (not shown) rotates, causing the door 460 to rotate.

[0078] According to the invention, the door 460 is rotatably configured to prevent impact and vibration in the baking chamber 401 and the generation of particles due to collision between the door 460 and the housing 410.

[0079] Furthermore, according to the present invention, the drive member 470 of the door 460 is disposed inside the processing space 402, thereby preventing interference between the drive member 470 and cables, wires, etc., used in the prior art to operate the heater 490 mounted on the door 460 to compensate for the temperature of the door 460. Therefore, breakage or disconnection of cables, wires, etc., is prevented.

[0080] Furthermore, according to the present invention, a heater 490 is provided on the rotating shaft 474 to prevent interference between the drive member 470 and the cables, wires, etc., used in the prior art to operate the heater 490 mounted on the door 460 to compensate for the temperature of the door 460. Therefore, breakage or disconnection of the cables, wires, etc., is prevented.

[0081] Furthermore, according to the present invention, since the heater 490 is provided inside the processing space 402, the temperature drop near the door 460 can be prevented even when the entrance 414 is open.

[0082] Furthermore, according to the present invention, by providing a reflective member 464 on the inside of the door 460, the temperature deviation in the processing space 402 and the processing byproducts generated due to temperature drop can be reduced.

[0083] The above detailed description is illustrative of the invention. Furthermore, while the above description illustrates and describes preferred embodiments of the invention, the invention can be used in various other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed herein, within the scope of equivalence to the described disclosure, and / or within the scope of skill or knowledge in the art. The described embodiments depict the optimal state for implementing the technical idea of ​​the invention, and various variations of the invention are possible in specific application areas and uses. Therefore, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Furthermore, the appended claims should be interpreted to include other embodiments.

[0084] [Explanation of Labels in the Attached Image]

[0085] 430: Support Unit

[0086] 460: Door

[0087] 470: Driving component

[0088] 480: Baffle component.

Claims

1. A substrate processing apparatus, comprising: A housing having an internal processing space for processing a substrate, and the housing having an inlet and outlet for allowing the substrate to enter and exit. A support unit located within the processing space and supporting the substrate; A baffle member having a door for opening and closing the entrance / exit; as well as A heater, which is used to heat the door. The heater is disposed within the processing space adjacent to the door, and The baffle component further includes: A actuator that moves the door between a closed position when the door is closed at the entrance / exit and an open position when the door is open at the entrance / exit; and The rotation axis serving as the center of rotation of the door, The actuator causes the door to rotate about the rotation axis, and The heater is disposed in the rotating shaft.

2. The substrate processing apparatus according to claim 1, wherein, The rotating shaft is located within the processing space.

3. The substrate processing apparatus according to claim 1, wherein, The heater is located between the support unit and the door.

4. The substrate processing apparatus according to claim 1, wherein, The baffle component also includes a reflective component disposed on the side surface of the door facing the processing space.

5. The substrate processing apparatus according to claim 1, wherein, The baffle component also includes an absorption component disposed on the side surface of the door facing the processing space.

6. The substrate processing apparatus according to claim 1, wherein, The heater is configured with one or more infrared lamps.

7. The substrate processing apparatus according to claim 1, wherein, The door has a curved cross-section that protrudes outward toward the outer side of the housing.

8. The substrate processing apparatus according to claim 1, wherein, The cross-section of the door is set to an arc shape.

9. The substrate processing apparatus according to claim 8, wherein, The heater is positioned at the center of the arc.

10. The substrate processing apparatus according to claim 8, wherein, The door moves between the open position and the closed position by rotating along the length of the arc.

11. The substrate processing apparatus according to any one of claims 1 to 10, wherein, The processing of the substrate is a process of heating the substrate.

12. The substrate processing apparatus according to claim 8, further comprising: A substrate heating unit configured to heat the substrate within the processing space. The substrate heating unit is disposed at at least one of a position corresponding to the upper surface of the substrate and a position corresponding to the lower surface of the substrate.

13. A substrate processing apparatus, comprising: The housing has an internal processing space for processing a substrate, and the housing has an inlet and outlet for allowing the substrate to enter and exit. A support unit located within the processing space and supporting the substrate; A substrate heating unit for heating the substrate; A baffle member having a door for opening and closing the entrance / exit; and A heater, which is used to heat the door. The heater is arranged within the processing space adjacent to the door. The baffle component further includes: A actuator that moves the door between a closed position when the door is closed at the entrance / exit and an open position when the door is open at the entrance / exit; and The rotation axis serving as the center of rotation of the door, The actuator causes the door to rotate about the rotation axis. The heater is disposed in the rotating shaft. The cross-section of the door is set to an arc shape, and The actuator causes the door to move between the open position and the closed position by rotating along the length of the arc.

14. The substrate processing apparatus according to claim 13, wherein, The rotating shaft is located within the processing space.

15. The substrate processing apparatus according to claim 13 or 14, wherein, The substrate is configured as a rectangular substrate.

16. The substrate processing apparatus according to claim 15, wherein, The substrate heating unit is disposed at at least one of a position corresponding to the upper surface of the substrate and a position corresponding to the lower surface of the substrate.

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