Method for manufacturing semiconductor device with electromagnetic wave shielding film and adhesive tape for protecting terminal

Abstract

The present application relates to a method for manufacturing a semiconductor device (66) with an electromagnetic wave shielding film, comprising: a step of embedding a terminal (91) of a semiconductor device with a terminal in a viscoelastic layer (12) of a tape for protecting a terminal having a viscoelastic layer; a step of forming an electromagnetic wave shielding film (10) on an exposed surface of the semiconductor device with a terminal not embedded in the viscoelastic layer (12) of the tape for protecting a terminal; and a step of stretching the tape for protecting a terminal, thereby peeling the semiconductor device with a terminal on which the electromagnetic wave shielding film (10) is formed from the tape for protecting a terminal.

Description

TECHNICAL FIELD

[0001] The present application relates to a method for manufacturing a semiconductor device with an electromagnetic wave shielding film and a tape for terminal protection.

[0002] This application claims priority based on Japanese Patent Application No. 2019-221466 filed in Japan on December 6, 2019, and the content thereof is incorporated herein. BACKGROUND

[0003] In the past, when a multi-pin LSI package for an MPU or a gate array or the like is mounted on a printed wiring board, as a semiconductor device having a plurality of electronic components, a semiconductor device in which a convex electrode (hereinafter referred to as a "terminal" in the present specification) composed of a eutectic solder, a high-temperature solder, gold, or the like is formed at a connection pad portion thereof is used. Also, an installation method in which these terminals are brought into contact with corresponding terminal portions on a chip mounting substrate and are fused and diffusion-bonded is adopted.

[0004] With the spread of personal computers, the Internet has become widespread, and currently, smart phones or tablet computers are connected to the Internet, and the use of wireless communication technology via the Internet to distribute digital images, music, photographs, text information, and the like is increasing. Further, the Internet of Things (IoT) is becoming popular, and innovative changes are being made to packaging technology for semiconductor devices used in various application fields such as home appliances and automobiles to use sensors, RFID (Radio frequency identifier), MEMS (Micro Electro Mechanical Systems), wireless components, and the like more intelligently.

[0005] In such a process of development of electronic devices, the required level of semiconductor devices is also increasing year by year. In particular, in order to respond to the demand for high performance, miniaturization, high integration, low power consumption, and low cost, two key points, heat dissipation measures and noise suppression measures, exist.

[0006] To cope with the heat dissipation measures and the noise suppression measures, for example, as disclosed in Patent Literature 1, a method of covering an electronic component module with a conductive material to form an electromagnetic wave shielding film is adopted. In Patent Literature 1, a conductive resin applied to the top surface and the side surface of a singulated electronic component module is heated to be cured, thereby forming an electromagnetic wave shielding film.

[0007] In the electronic component manufacturing method disclosed in Patent Literature 1, the external terminal electrode provided on the back surface of the collective substrate is coated with conductive resin in a state of being buried in the adhesive sheet. Since the shielding portion is provided at a prescribed position of the adhesive sheet, short-circuiting between the external terminal electrode and the electromagnetic wave shielding film can be prevented. However, the provision of the shielding portion at a prescribed position of the adhesive sheet is cumbersome in terms of the process.

[0008] Patent Literature 2 discloses an electronic component manufacturing method including: an electrode surface protection step of attaching an electrode surface having an electrode of an unshielded electronic component to a film for electronic component manufacturing having a base layer and an adhesive layer provided on one surface side of the base layer, thereby protecting the electrode surface; and a shielding film formation step of forming a shielding film that is integrated and conductive on a non-electrode surface other than the electrode surface, using a dry film formation method.

[0009] Prior Art Documents

[0010] Patent Literature

[0011] Patent Literature 1: Japanese Patent Application Publication No. 2011-151372

[0012] Patent Literature 2: Japanese Patent Application Publication No. 2017-54891 SUMMARY

[0013] Technical Problem to be Solved by the Invention

[0014] The inventors of the present application have studied the electronic component manufacturing method disclosed in Patent Literature 2 and found that it is difficult to peel the electronic component from the film for electronic component manufacturing after the formation of the conductive shielding film, and the manufacturing efficiency is low.

[0015] Therefore, the technical problem to be solved by the present application is to provide an electronic component manufacturing method and a terminal protection tape for the manufacturing method, in which the semiconductor device with the electromagnetic wave shielding film can be easily peeled in the process of peeling the semiconductor device with the formed electromagnetic wave shielding film from the terminal protection tape, and the manufacturing efficiency is high.

[0016] Technical Means for Solving the Technical Problem

[0017] That is, the present application provides the following electronic component manufacturing method and terminal protection tape for the manufacturing method.

[0018] [1] An electronic component manufacturing method including:

[0019] a step of burying a terminal of a semiconductor device with a terminal in a viscoelastic layer of a terminal protection tape having the viscoelastic layer;

[0020] a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not buried in the viscoelastic layer of the terminal-protective tape; and

[0021] a step of stretching the terminal-protective tape, thereby peeling the semiconductor device with terminals on which the electromagnetic wave shielding film is formed from the terminal-protective tape.

[0022] [2] A method of manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising:

[0023] a step of burying terminals of a semiconductor device with terminals assembly in a viscoelastic layer of a terminal-protective tape having the viscoelastic layer;

[0024] a step of cutting the semiconductor device with terminals assembly, thereby making the semiconductor device with terminals assembly into a semiconductor device with terminals of which terminals are buried in a viscoelastic layer of a terminal-protective tape;

[0025] a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not buried in the viscoelastic layer of the terminal-protective tape; and

[0026] a step of stretching the terminal-protective tape, thereby peeling the semiconductor device with terminals on which the electromagnetic wave shielding film is formed from the terminal-protective tape.

[0027] [3] The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to [1] or [2], wherein the amount of stretching of the terminal-protective tape in the step of peeling the semiconductor device with terminals on which the electromagnetic wave shielding film is formed from the terminal-protective tape is 1.0 mm or more.

[0028] [4] The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [1] to [3], wherein when a terminal with a diameter of 0.25 mm is buried in the viscoelastic layer of the terminal-protective tape, a diameter of an approximately circular projection from a bubble that appears outside the buried terminal, as viewed in a thickness direction of the terminal-protective tape, is 0.30 mm or more.

[0029] [5] The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [1] to [4], wherein an adhesive force of the terminal-protective tape to the semiconductor device with terminals after the step of burying terminals of the semiconductor device with terminals and before the step of forming an electromagnetic wave shielding film is 6.5 N / 25 mm or less.

[0030] [6] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [1] to [5], wherein a ratio of a thickness dl of the viscoelastic layer to a height ho of a terminal of the semiconductor device with a terminal or a terminal of a semiconductor device assembly with terminals satisfies 1.2 ≤ dl / ho ≤ 5.0.

[0031] [7] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [1] to [6], wherein the viscoelastic layer has a filler layer and an adhesive layer.

[0032] [8] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to [7], wherein an elastic modulus of the filler layer in the process of burying a terminal of a semiconductor device with a terminal or a terminal of a semiconductor device assembly with terminals in the viscoelastic layer of a terminal-protecting tape having the viscoelastic layer is 0.05 to 20 MPa.

[0033] [9] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to [7] or [8], wherein the adhesive layer, the filler layer, and a base material are sequentially provided.

[0034]

[10] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to [9], wherein a Young's modulus of the base material is 100 to 2000 MPa.

[0035]

[11] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [7] to

[10] , wherein the filler layer is a filler layer formed using a constitution material that is curable by energy rays.

[0036]

[12] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [7] to

[11] , wherein the adhesive layer is an adhesive layer formed using an adhesive that is curable by energy rays.

[0037]

[13] A terminal-protecting tape used in the method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of [4] to

[12] .

[0038] Effects of Invention

[0039] According to the present application, it is possible to provide a method for manufacturing a semiconductor device with an electromagnetic wave shielding film, which is easy to peel off and has high manufacturing efficiency in a process of peeling off a semiconductor device with a terminal on which an electromagnetic wave shielding film is formed from a terminal-protecting tape, and a terminal-protecting tape used in the method. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1A cross-sectional view for schematically showing one embodiment of the terminal-protective tape of the present application.

[0041] Figure 2 A cross-sectional view for schematically showing another embodiment of the terminal-protective tape of the present application.

[0042] Figure 3 A cross-sectional view for schematically showing another embodiment of the terminal-protective tape of the present application.

[0043] Figure 4 A cross-sectional view for schematically showing an example of the method for using the terminal-protective tape of the present application.

[0044] Figure 5 A cross-sectional view for schematically showing one embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present application.

[0045] Figure 6 A cross-sectional view for schematically showing another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present application.

[0046] Figure 7 A cross-sectional view for schematically showing one embodiment of the method for stretching a terminal-protective tape in the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present application. DETAILED DESCRIPTION

[0047] < Method for Manufacturing a Semiconductor Device with an Electromagnetic Wave Shielding Film >

[0048] The method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the first embodiment of the present application includes: a step of burying a terminal of a semiconductor device with a terminal in a viscoelastic layer of a terminal-protective tape having a viscoelastic layer; a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with a terminal that is not buried in the viscoelastic layer of the terminal-protective tape; and a step of stretching the terminal-protective tape, thereby peeling the semiconductor device with a terminal on which the electromagnetic wave shielding film is formed from the terminal-protective tape.

[0049] The manufacturing method of the semiconductor device with electromagnetic wave shielding film of the second embodiment of the present application includes: a step of embedding a terminal of a terminal-equipped semiconductor device assembly in a viscoelastic layer of a terminal-protecting tape having the viscoelastic layer; a step of cutting the terminal-equipped semiconductor device assembly to produce a terminal-equipped semiconductor device in which the terminal is embedded in the viscoelastic layer of the terminal-protecting tape; a step of forming an electromagnetic wave shielding film on an exposed surface of the terminal-equipped semiconductor device not embedded in the viscoelastic layer of the terminal-protecting tape; and a step of stretching the terminal-protecting tape to peel the terminal-equipped semiconductor device on which the electromagnetic wave shielding film is formed from the terminal-protecting tape.

[0050] Hereinafter, the terminal-protecting tape used in the manufacturing method of the semiconductor device with electromagnetic wave shielding film of the first and second embodiments of the present application and each step of the manufacturing method of the semiconductor device with electromagnetic wave shielding film of the present application will be described in detail.

[0051] <Terminal-protecting tape>

[0052] Figure 1 A cross-sectional view schematically showing one embodiment of the terminal-protecting tape of the present application is shown. In addition, in order to facilitate understanding of the features of the present application, important parts of the drawings used in the following description are sometimes shown enlarged for convenience, and the dimensional proportions of the respective components and the like are not necessarily the same as in reality.

[0053] Figure 1 The terminal-protecting tape 1 shown is a terminal-protecting tape 1 used in the step of forming an electromagnetic wave shielding film on a terminal-equipped semiconductor device, and has a viscoelastic layer 12. The viscoelastic layer 12 preferably contains a filler layer 13 and an adhesive layer 14, and more preferably consists of the filler layer 13 and the adhesive layer 14.

[0054] As shown in Figure 1 , the terminal-protecting tape of the present embodiment can also have a release film 21 on the outermost layer on the filler layer 13 side of the viscoelastic layer 12, and can also have a release film 20 on the outermost layer on the adhesive layer 14 side of the viscoelastic layer 12.

[0055] The terminal-protecting tape of the present embodiment is not limited to the structure shown in Figure 1 , and the partial components of the structure shown in Figure 1 may be changed, deleted, or added without impairing the effects of the present application.

[0056] Figure 1The terminal protection tape 1 shown can be used in the following process: the two release films 20, 21 are peeled off, placed on a support, and the semiconductor device with terminals is pressed from above with the terminal side facing down, thereby embedding the terminals in the viscoelastic layer 12, and further forming an electromagnetic wave shielding film thereon.

[0057] As shown in the terminal protection tape 2 of the present embodiment, the terminal protection tape can have a configuration in which the adhesive layer 14, the embedding layer 13, and the base material 11 are provided in this order, or a release film 20 can be provided on the outermost layer on the side of the adhesive layer 14 of the viscoelastic layer 12. Figure 2

[0058] Figure 2 The terminal protection tape 2 shown can be used in the following process: the release film 20 is peeled off, and the semiconductor device with terminals is pressed on the viscoelastic layer 12 of the base material 11 serving as a support with the terminal side facing down, thereby embedding the terminals in the viscoelastic layer 12, and further forming an electromagnetic wave shielding film thereon.

[0059] As shown in the terminal protection tape 3 of the present embodiment, the terminal protection tape has a configuration in which the adhesive layer 14, the embedding layer 13, and the base material 11 are provided in this order, or a release film 20 can be provided on the outermost layer on the side of the adhesive layer 14 of the viscoelastic layer 12, or a second adhesive layer 15 (i.e., a sticking adhesive layer) for sticking to a support can be provided on the side opposite the viscoelastic layer 12 of the base material 11, and further, a release film 22 can be provided on the outermost layer on the side of the second adhesive layer 15, which is a double-sided tape. Figure 3

[0060] Figure 3 The terminal protection tape 3 shown can be used in the following process: the release film 22 is peeled off, fixed to a support 30 as shown in FIG. 6B, the release film 20 is further peeled off, and the semiconductor device with terminals is pressed on the viscoelastic layer 12 with the terminal side facing down, thereby embedding the terminals in the viscoelastic layer 12, and further forming an electromagnetic wave shielding film thereon. Figure 4

[0061] The elongation at break of the terminal protection tape is preferably 10% or more, more preferably 15% or more, and further preferably 20% or more. If the elongation at break of the terminal protection tape is 10% or more, the terminal protection tape can be sufficiently stretched, and the peelability in the process of peeling the semiconductor device with terminals on which the electromagnetic wave shielding film is formed from the terminal protection tape is enhanced. The elongation at break of the terminal protection tape can be less than 45%. The elongation at break of the terminal protection tape is preferably, for example, 10% or more and less than 45%, more preferably 15% or more and less than 45%, and further preferably 20% or more and less than 45%. ​​​

[0062] The elongation at break of the terminal protection tape can be measured by the method described in Examples below.

[0063] The breaking stress of the terminal protection tape is preferably 5 MPa or more, more preferably 10 MPa or more, and further preferably 15 MPa or more. If the breaking stress of the terminal protection tape is above the lower limit, the terminal protection tape can be stretched uniformly when stretched. The breaking stress of the terminal protection tape may also be less than 30 MPa. The breaking stress of the terminal protection tape is, for example, preferably 5 MPa or more and less than 30 MPa, more preferably 10 MPa or more and less than 30 MPa, and further preferably 15 MPa or more and less than 30 MPa.

[0064] The breaking stress of the terminal protection tape can be measured by the method described in Examples below.

[0065] Next, each layer constituting the terminal protection tape of this embodiment will be described.

[0066] ◎Viscoelastic layer

[0067] In the terminal protection tape of this embodiment, the viscoelastic layer can be used to protect the terminal forming surface (in other words, the circuit surface) of the semiconductor device with terminals and the terminals provided on the terminal forming surface.

[0068] The viscoelastic layer preferably includes a filling layer and an adhesive layer.

[0069] The thickness of the viscoelastic layer is preferably 1 to 1000 μm, more preferably 5 to 800 μm, and even more preferably 10 to 600 μm.

[0070] By setting the thickness of the viscoelastic layer to be greater than the lower limit, even terminal electrodes that are prone to floating, such as solder balls, can be buried. Furthermore, by setting the thickness of the viscoelastic layer to be less than the upper limit, the terminal protection tape can be prevented from becoming excessively thick.

[0071] Here, the “thickness of the viscoelastic layer” refers to the thickness of the entire viscoelastic layer, and the thickness of the viscoelastic layer composed of a plurality of layers including a filling layer and an adhesive layer refers to the total thickness of the filling layer and the adhesive layer.

[0072] In this specification, the thickness of each layer can be measured, for example, in accordance with JIS K6783, Z1702, and Z1709 using a constant pressure thickness gauge (model: "PG-02J") manufactured by TECLOCK Co., Ltd.

[0073] When the terminal formation surface of the terminal-equipped semiconductor device is attached to the viscoelastic layer 12, it is preferable that the terminal formation surface of the terminal-equipped semiconductor device be directly attached to the adhesive layer 14 in the viscoelastic layer 12. At this time, in order to prevent the occurrence of a residue on the terminal formation surface and the terminal, it is preferable that the adhesive layer 14 be set to be harder than the embedding layer 13.

[0074] From the viewpoint of improving the peelability in the process of peeling the terminal-equipped semiconductor device on which the electromagnetic wave shielding film is formed from the terminal-protective tape, it is preferable that the adhesion between the terminal of the terminal-equipped semiconductor device and the outermost layer (for example, the adhesive layer) of the viscoelastic layer 12 be set to be equal to or less than a certain level. The adhesion between the terminal of the terminal-equipped semiconductor device and the outermost layer of the viscoelastic layer 12 can be quantitatively evaluated using, for example, the following method.

[0075] When the terminal is embedded in the viscoelastic layer 12 of the terminal-protective tape, if the embedded terminal is observed from the thickness direction of the terminal-protective tape, a projection in the shape of a circle that is approximately round, which is due to a bubble, can sometimes be confirmed on the outside of the embedded terminal. This bubble indicates a gap between the embedded terminal and the outermost layer of the viscoelastic layer 12, and the larger the area of the projection in the shape of a circle that is approximately round, the lower the adhesion between the embedded terminal and the outermost layer of the viscoelastic layer 12. In the present embodiment, when a terminal having a diameter of 0.25 mm is embedded in the viscoelastic layer 12 of the terminal-protective tape, it is preferable that the diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble and which is observed from the thickness direction of the terminal-protective tape on the outside of the embedded terminal, be 0.30 mm or greater, more preferably 0.32 mm or greater, and further preferably 0.34 mm or greater. If the diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, is equal to or greater than the lower limit value, the adhesion between the terminal of the terminal-equipped semiconductor device and the outermost layer of the viscoelastic layer 12 does not become excessively large, and the peelability in the process of peeling the terminal-equipped semiconductor device on which the electromagnetic wave shielding film is formed from the terminal-protective tape is improved. In addition, since the diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, appears on the outside of the terminal having a diameter of 0.25 mm, the diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, is necessarily greater than 0.25 mm. The diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, can be the maximum diameter of the projection. The upper limit value of the diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, is not particularly limited as long as the effects of the present application can be exhibited, and can be, for example, 1.00 mm or less. The diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, is preferably, for example, 0.30 mm or greater and 0.95 mm or less, more preferably 0.32 mm or greater and 0.90 mm or less, and further preferably 0.34 mm or greater and 0.85 mm or less.

[0076] The diameter of the projection in the shape of a circle that is approximately round, which is due to a bubble, can be measured using the method described in the Examples below.

[0077] o Adhesive layer

[0078] Hereinafter, the adhesive layer constituting the viscoelastic layer is sometimes referred to as "first adhesive layer" in distinction from the second adhesive layer to be described later for attachment to a support.

[0079] The first adhesive layer is in a sheet or film shape and contains an adhesive. In the present specification, "sheet or film shape" means a thin film shape with a small in-plane thickness deviation and flexibility.

[0080] As the adhesive, for example, an acrylic resin (an adhesive formed of a resin having a (meth) acryloyl group), a urethane resin (an adhesive formed of a resin having a urethane bond), a rubber resin (an adhesive formed of a resin having a rubber structure), a silicone resin (an adhesive formed of a resin having a siloxane bond), an epoxy resin (an adhesive formed of a resin having an epoxy group), a polyvinyl ether, a polycarbonate, or the like adhesive resin can be exemplified, with an acrylic resin being preferred.

[0081] In addition, in the present application, "adhesive resin" is a concept including both a resin having adhesiveness and a resin having tackiness, for example, including not only a resin having tackiness by itself but also a resin exhibiting adhesiveness by simultaneous use with other components such as an additive or a resin exhibiting adhesiveness due to the presence of a heat or water or the like.

[0082] The first adhesive layer can be only one layer (single layer), or can be a plurality of layers of two or more layers, and when a plurality of layers, these plurality of layers can be the same as each other or different from each other, and the combination of these plurality of layers is not particularly limited.

[0083] In addition, in the present specification, "the plurality of layers can be the same as each other or different from each other" means "all the layers can be the same, all the layers can be different, or only some of the layers can be the same", and further "the plurality of layers are different from each other" means "at least one of the constituent material and the thickness of each layer is different from each other".

[0084] The thickness of the first adhesive layer is preferably 1 to 1000 μm, more preferably 2 to 100 μm, and particularly preferably 8 to 20 μm.

[0085] Here, the "thickness of the first adhesive layer" means the thickness of the entire first adhesive layer, and for example, the thickness of the first adhesive layer composed of a plurality of layers means the total thickness of all the layers constituting the first adhesive layer.

[0086] The first adhesive layer can be formed using an energy ray-curable adhesive or a non-energy ray-curable adhesive. The first adhesive layer formed using an energy ray-curable adhesive is preferred because it can easily adjust the physical properties before and after curing.

[0087] In the present application, "energy ray" means a ray having an energy quantum in an electromagnetic wave or a charged particle beam, and examples of the energy ray include ultraviolet rays, electron beams, and the like.

[0088] For example, ultraviolet rays can be irradiated by using a high-pressure mercury lamp, a fusion lamp, a xenon lamp, or the like as an ultraviolet ray source. As an electron beam, an electron beam generated by an electron beam accelerator or the like can be irradiated.

[0089] In the present application, "energy ray-curable" means a property of being cured by irradiation of an energy ray, and "non-energy ray-curable" means a property of not being cured even if an energy ray is irradiated.

[0090] When the first adhesive layer is formed using an energy ray-curable adhesive, the elastic modulus of the first adhesive layer before curing is preferably 0.01 to 0.50 MPa, more preferably 0.02 to 0.40 MPa, and further preferably 0.03 to 0.35 MPa. If the elastic modulus of the first adhesive layer before curing is within the range, the holding property of the semiconductor device can be obtained.

[0091] When the first adhesive layer is formed using an energy ray-curable adhesive, the elastic modulus of the first adhesive layer after curing is preferably 1.0 to 50 MPa, more preferably 2.0 to 45 MPa, and further preferably 3.0 to 40 MPa. If the elastic modulus of the first adhesive layer after curing is within the range, the holding property of the semiconductor device can be obtained.

[0092] In the present specification, the "elastic modulus" is a storage modulus obtained by measuring a sample having a diameter of 8 mm and a thickness of 3 mm using a viscoelasticity measuring device (for example, manufactured by Rheometrics, Inc., device name "DYNAMIC ANALYZER RDAII") by a torsion shear method at 1 Hz and at 23°C.

[0093] The curing of the first adhesive layer can be performed in any of the steps of the method for manufacturing the semiconductor device with the electromagnetic wave shielding film according to the first and second embodiments, but is preferably performed after the step of burying the terminal of the semiconductor device (or semiconductor device assembly) with the terminal and before the step of peeling the semiconductor device with the electromagnetic wave shielding film from the terminal-protecting tape.

[0094] When the first adhesive layer is formed using an adhesive that is curable with non-energy rays, the modulus of elasticity of the first adhesive layer is preferably 0.10 to 0.50 MPa, more preferably 0.11 to 0.40 MPa, and further preferably 0.12 to 0.35 MPa. If the modulus of elasticity of the first adhesive layer is within the range, the peelability in the process of peeling the terminal-attached semiconductor device on which the electromagnetic wave shielding film is formed from the terminal-protective tape is enhanced.

[0095] {First Adhesive Composition}

[0096] The first adhesive layer can be formed using a first adhesive composition containing an adhesive. For example, by applying the first adhesive composition to the surface on which the first adhesive layer is to be formed and drying it as necessary, the first adhesive layer can be formed at the target site. In addition, by applying the first adhesive composition to a release film and drying it as necessary, a first adhesive layer of a target thickness can be formed, and the first adhesive layer can be transferred to the target site. A more specific method of forming the first adhesive layer will be described later together with the method of forming other layers. The content ratio between components that do not vaporize at ordinary temperature in the first adhesive composition is generally the same as the content ratio between the components in the first adhesive layer. In the present specification, "ordinary temperature" means a temperature at which no special cooling or heating is performed, that is, a temperature as it is, for example, a temperature of 15 to 25°C, and the like, for example, 25°C.

[0097] The application of the first adhesive composition can be performed using a publicly known method, for example, a method using various coaters such as an air knife coater, a blade coater, a rod coater, a gravure coater, a roll coater, a knife-over-roll coater, a curtain coater, a die coater, a doctor blade coater, a screen coater, a Meyer rod coater, a kiss coater, and the like.

[0098] The drying conditions of the first adhesive composition are not particularly limited, but when the first adhesive composition contains a solvent described later, heating drying is preferably performed. In this case, for example, drying is preferably performed at 70 to 130°C for 10 seconds to 5 minutes.

[0099] When the first adhesive layer is energy ray-curable, as the first adhesive composition containing an energy ray-curable adhesive, i.e., the energy ray-curable first adhesive composition, for example, there can be cited a first adhesive composition (I-1) containing a non-energy ray-curable adhesive resin (I-1a) (hereinafter sometimes abbreviated as "adhesive resin (I-1a)") and an energy ray-curable compound; a first adhesive composition (I-2) containing an energy ray-curable adhesive resin (I-2a) (hereinafter sometimes abbreviated as "adhesive resin (I-2a)") in which an unsaturated group is introduced in the side chain of the non-energy ray-curable adhesive resin (I-1a); a first adhesive composition (I-3) containing the adhesive resin (I-2a) and an energy ray-curable low-molecular compound; and the like.

[0100] {First Adhesive Composition (I-1)}

[0101] As described above, the first adhesive composition (I-1) contains a non-energy ray-curable adhesive resin (I-1a) and an energy ray-curable compound.

[0102] (Adhesive Resin (I-1a))

[0103] The adhesive resin (I-1a) is preferably an acrylic resin.

[0104] As the acrylic resin, for example, there can be cited an acrylic polymer having at least a structural unit derived from an alkyl (meth)acrylate.

[0105] The structural unit possessed by the acrylic resin can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0106] As the alkyl (meth)acrylate, for example, there can be cited an alkyl (meth)acrylate in which the number of carbon atoms of the alkyl group constituting the alkyl ester is 1 to 20, and the alkyl group is preferably linear or branched.

[0107] As the (meth)acrylic acid alkyl ester, more specifically, mention can be made of (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid n-propyl ester, (meth)acrylic acid isopropyl ester, (meth)acrylic acid n-butyl ester, (meth)acrylic acid isobutyl ester, (meth)acrylic acid sec-butyl ester, (meth)acrylic acid t-butyl ester, (meth)acrylic acid amyl ester, (meth)acrylic acid hexyl ester, (meth)acrylic acid heptyl ester, (meth)acrylic acid 2-ethylhexyl ester, (meth)acrylic acid iso-octyl ester, (meth)acrylic acid n-octyl ester, (meth)acrylic acid n-nonyl ester, (meth)acrylic acid iso-nonyl ester, (meth)acrylic acid decyl ester, (meth)acrylic acid undecyl ester, (meth)acrylic acid dodecyl ester (also called (meth)acrylic acid lauryl ester.), (meth)acrylic acid tridecyl ester, (meth)acrylic acid myristyl ester (also called (meth)acrylic acid myristyl ester.), (meth)acrylic acid pentadecyl ester, (meth)acrylic acid cetyl ester (also called (meth)acrylic acid cetyl ester.), (meth)acrylic acid heptadecyl ester, (meth)acrylic acid stearyl ester (also called (meth)acrylic acid stearyl ester.), (meth)acrylic acid nonadecyl ester, (meth)acrylic acid arachyl ester, and the like.

[0108] Further, in the present specification, "(meth)acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid, for example, "(meth)acrylic acid ester" is a concept including both "acrylic acid ester" and "methacrylic acid ester", and "(meth)acryl" is a concept including both "acryl" and "methacryl".

[0109] From the viewpoint of improving the adhesion of the first adhesive layer, the acrylic polymer preferably has a structural unit of a (meth)acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group. Further, from the viewpoint of further improving the adhesion of the first adhesive layer, the number of carbon atoms in the alkyl group is preferably 4 to 12, more preferably 4 to 8. In addition, the (meth)acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group is preferably an acrylic acid alkyl ester.

[0110] In addition to the structural unit derived from the (meth)acrylic acid alkyl ester, the acrylic polymer preferably further has a structural unit derived from a functional group-containing monomer.

[0111] As the functional group-containing monomer, for example, mention can be made of a functional group-containing monomer that forms a starting point of crosslinking by reacting with a crosslinking agent described later, or a functional group-containing monomer that enables introduction of an unsaturated group to the side chain of the acrylic polymer by reacting with a functional group in an unsaturated group-containing compound.

[0112] As the functional group in the functional group-containing monomer, for example, a hydroxyl group, a carboxyl group, an amino group, an epoxy group, and the like can be exemplified.

[0113] That is, as the functional group-containing monomer, for example, a hydroxyl group-containing monomer, a carboxyl group-containing monomer, an amino group-containing monomer, an epoxy group-containing monomer, and the like can be exemplified.

[0114] As the hydroxyl group-containing monomer, for example, a (meth)acrylic acid hydroxyl alkyl ester such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and the like; a non-(meth)acrylic acid unsaturated alcohol (i.e., an unsaturated alcohol not having a (meth)acryl skeleton) such as vinyl alcohol, allyl alcohol, and the like can be exemplified, and 2-hydroxyethyl (meth)acrylate is preferable, and 2-hydroxyethyl acrylate is more preferable.

[0115] As the carboxyl group-containing monomer, for example, an ethylenically unsaturated monocarboxylic acid (a monocarboxylic acid having an ethylenically unsaturated bond) such as (meth)acrylic acid, crotonic acid, and the like; an ethylenically unsaturated dicarboxylic acid (a dicarboxylic acid having an ethylenically unsaturated bond) such as fumaric acid, itaconic acid, maleic acid, citraconic acid, and the like; an anhydride of the ethylenically unsaturated dicarboxylic acid; a (meth)acrylic acid carboxyl alkyl ester such as 2-carboxyethyl methacrylate, and the like can be exemplified.

[0116] The functional group-containing monomer is preferably a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and more preferably a hydroxyl group-containing monomer.

[0117] The functional group-containing monomer constituting the acrylic polymer can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0118] In the acrylic polymer, the content of the structural unit from the functional group-containing monomer is preferably 1 to 35 mass%, more preferably 3 to 32 mass%, and particularly preferably 5 to 30 mass%, relative to the total amount of the structural units.

[0119] The acrylic polymer can further have a structural unit from another monomer in addition to the structural unit from the (meth)acrylic acid alkyl ester and the structural unit from the functional group-containing monomer.

[0120] The other monomer is not particularly limited as long as it is copolymerizable with the (meth)acrylic acid alkyl ester or the like.

[0121] As the other monomer, for example, styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide, and the like can be exemplified.

[0122] The other monomer constituting the acrylic polymer can be only one, or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0123] The acrylic polymer can be used as the above-mentioned non-energy ray-curable adhesive resin (I- la).

[0124] On the other hand, a substance produced by reacting an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group) with a functional group in the acrylic polymer can be used as the above-mentioned energy ray-curable adhesive resin (I-2a).

[0125] In addition, in the present application, "energy ray-polymerizability" means a property of undergoing polymerization by irradiation of energy rays.

[0126] The adhesive resin (I- la) contained in the first adhesive composition (I- 1) can be only one, or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0127] In the first adhesive composition (I- 1), the content of the adhesive resin (I- la) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass, relative to the total mass of the first adhesive composition (I- 1).

[0128] (Energy ray-curable compound)

[0129] As the energy ray-curable compound contained in the first adhesive composition (I- 1), a monomer or an oligomer having an energy ray-polymerizable unsaturated group and capable of being cured by irradiation of energy rays can be exemplified.

[0130] In the energy ray-curable compound, as the monomer, for example, a polyvalent (meth)acrylate such as trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol (meth)acrylate; a urethane (meth)acrylate; a polyester (meth)acrylate; a polyether (meth)acrylate; an epoxy (meth)acrylate, and the like can be exemplified.

[0131] In the energy ray-curable compound, as the oligomer, for example, an oligomer polymerized from the above-mentioned exemplified monomers, and the like can be exemplified.

[0132] For the purpose of reducing the storage modulus of the first adhesive layer, the energy ray-curable compound is preferably a urethane (meth)acrylate, a urethane (meth)acrylate oligomer.

[0133] In the present specification, "oligomer" means a substance (excluding monomers) having a weight average molecular weight or a formula weight of 5,000 or less.

[0134] The energy ray-curable compound contained in the first adhesive composition (I-1) can be only one, or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0135] In the first adhesive composition (I-1), the content of the energy ray-curable compound is preferably 1 to 95% by mass, more preferably 5 to 90% by mass, and particularly preferably 10 to 85% by mass, relative to the total mass of the first adhesive composition (I-1).

[0136] (Crosslinking agent)

[0137] When the acrylic polymer further having a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from an alkyl (meth)acrylate is used as the adhesive resin (I-1a), the first adhesive composition (I-1) preferably further contains a crosslinking agent.

[0138] The crosslinking agent, for example, reacts with the functional group to crosslink the adhesive resins (I-1a) to each other.

[0139] As the crosslinking agent, for example, there can be mentioned isocyanate crosslinking agents (crosslinking agents having an isocyanate group) such as toluene-2,6-diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates; epoxy crosslinking agents (crosslinking agents having a glycidyl group) such as ethylene glycol glycidyl ether and 1,3-bis(N,N-glycidylaminomethyl)cyclohexane; aziridine crosslinking agents (crosslinking agents having an aziridine group) such as hexa[1-(2-methyl)-aziridinyl]triphosphatriazine; metal chelate crosslinking agents (crosslinking agents having a metal chelate structure) such as aluminum chelate; isocyanurate crosslinking agents (crosslinking agents having an isocyanurate skeleton); and the like.

[0140] From the viewpoint of improving the cohesive force of the adhesive and thus improving the adhesive force of the first adhesive layer, and the viewpoint of easiness of obtaining, the crosslinking agent is preferably an isocyanate crosslinking agent.

[0141] The crosslinking agent contained in the first adhesive composition (I-1) can be only one or two or more. When two or more, the combination and ratio thereof can be arbitrarily selected.

[0142] In the first adhesive composition (I-1), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, relative to 100 parts by mass of the content of the adhesive resin (I-1a).

[0143] (Photo-polymerization initiator)

[0144] The first adhesive composition (I-1) can further contain a photo-polymerization initiator. The first adhesive composition (I-1) containing the photo-polymerization initiator can sufficiently perform a curing reaction even when a lower energy ray such as ultraviolet rays is irradiated.

[0145] As the photo-polymerization initiator, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl ester, benzoin dimethyl ketal, and the like can be exemplified; acetophenone, 2-hydroxy-2-methyl-l-phenyl-propane-l-one, 2,2-dimethoxy-l,2-diphenyl-ethane-l-one, and the like can be exemplified; phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, and the like can be exemplified; benzyl phenyl sulfide, tetramethyl thiuram monosulfide, and the like can be exemplified; a-keto alcohol compounds such as l-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; titanocene compounds such as titaniumocene; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as biacetyl; benzil, benzil dimethyl, benzophenone, 2,4-diethylthioxanthone, 1,2-diphenylmethane, 2-hydroxy-2-methyl-l-[4-(l-methylethenyl)phenyl]propanone, 2-chloroanthraquinone, and the like can be exemplified.

[0146] Further, as the photo-polymerization initiator, for example, quinone compounds such as l-chloroanthraquinone; photosensitizers such as amine; and the like can be used.

[0147] The photo-polymerization initiator contained in the first adhesive composition (I-1) can be only one or two or more. When two or more, the combination and ratio thereof can be arbitrarily selected.

[0148] In the first adhesive composition (I-1), the content of the photo-polymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the content of the energy ray-curable compound.

[0149] (Other additives)

[0150] The first adhesive composition (I-1) can further contain other additives other than the above-mentioned components, without impairing the effects of the present application.

[0151] As the other additives, for example, known additives such as antistatic agents, antioxidants, softening agents (plasticizers), fillers (filling agents), rust-preventive agents, coloring agents (pigments, dyes), sensitizers, tackifiers, reaction retardants, crosslinking accelerators (catalysts), and the like can be exemplified.

[0152] Further, the reaction retardant refers to a component that suppresses non-purpose crosslinking reactions in the first adhesive composition (I-1) during storage, for example, due to the action of a catalyst mixed in the first adhesive composition (I-1). As the reaction retardant, for example, a reaction retardant that forms a chelate complex by chelating with a catalyst can be exemplified, and more specifically, a reaction retardant having two or more carbonyl groups (-C(=O)-) in one molecule can be exemplified.

[0153] The other additives contained in the first adhesive composition (I-1) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0154] The content of the other additives in the first adhesive composition (I-1) is not particularly limited, and can be appropriately selected depending on the kind thereof.

[0155] (Solvent)

[0156] The first adhesive composition (I-1) can contain a solvent. The first adhesive composition (I-1) has improved coating adaptability to a coating target surface by containing a solvent.

[0157] The solvent is preferably an organic solvent, and as the organic solvent, for example, ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol, and the like can be exemplified.

[0158] As the solvent, for example, a solvent used in the production of the adhesive resin (I-1a) can be directly used in the first adhesive composition (I-1) without being removed from the adhesive resin (I-1a); or a solvent of the same kind or a different kind from the solvent used in the production of the adhesive resin (I-1a) can be separately added in the production of the first adhesive composition (I-1).

[0159] The solvent contained in the first adhesive composition (I-1) can be only one or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0160] The content of the solvent in the first adhesive composition (I-1) is not particularly limited and can be appropriately adjusted.

[0161] {First Adhesive Composition (I-2)}

[0162] As described above, the first adhesive composition (I-2) contains an energy ray-curable adhesive resin (I-2a) having an unsaturated group introduced into a side chain of the non-energy ray-curable adhesive resin (I-1a).

[0163] (Adhesive Resin (I-2a))

[0164] The adhesive resin (I-2a) can be obtained, for example, by reacting an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group with a functional group in the adhesive resin (I-1a).

[0165] The unsaturated group-containing compound is a compound having, in addition to the energy ray-polymerizable unsaturated group, a group capable of bonding to the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a).

[0166] As the energy ray-polymerizable unsaturated group, for example, (meth)acryloyl group, vinyl group (also referred to as ethylene group), allyl group (also referred to as 2-propenyl group), and the like can be exemplified, and (meth)acryloyl group is preferred.

[0167] As the group capable of bonding to the functional group in the adhesive resin (I-1a), for example, isocyanate group and glycidyl group capable of reacting with a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of reacting with a carboxyl group or an epoxy group, and the like can be exemplified.

[0168] As the unsaturated group-containing compound, for example, (meth)acryloyloxyethyl isocyanate, (meth)acryloyl isocyanate, (meth)acrylic acid glycidyl ester, and the like can be exemplified, and (meth)acryloyloxyethyl isocyanate is preferred, and 2-methacryloyloxyethyl isocyanate is particularly preferred.

[0169] The isocyanate compound can react with the hydroxyl group in the adhesive resin (I-1a), and the amount of the isocyanate compound is preferably 10 to 150 mol, more preferably 20 to 140 mol, and further preferably 30 to 130 mol, based on 100 mol of the total hydroxyl group in the adhesive resin (I-1a).

[0170] The tackifying resin (I-2a) contained in the first adhesive composition (I-2) can be only one or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0171] In the first adhesive composition (I-2), the content of the tackifying resin (I-2a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 10 to 90% by mass, relative to the total mass of the first adhesive composition (I-2).

[0172] (Cross-linking agent)

[0173] When the same acrylic polymer having a structural unit derived from a functional group-containing monomer as in the tackifying resin (I-la) is used as the tackifying resin (I-2a), the first adhesive composition (I-2) can further contain a cross-linking agent.

[0174] As the cross-linking agent in the first adhesive composition (I-2), the same cross-linking agent as in the first adhesive composition (I-l) can be exemplified.

[0175] The cross-linking agent contained in the first adhesive composition (I-2) can be only one or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0176] In the first adhesive composition (I-2), the content of the cross-linking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, relative to 100 parts by mass of the content of the tackifying resin (I-2a).

[0177] (Photo-polymerization initiator)

[0178] The first adhesive composition (I-2) can further contain a photo-polymerization initiator. The first adhesive composition (I-2) containing the photo-polymerization initiator can sufficiently perform a curing reaction even when a lower energy of energy rays such as ultraviolet rays is irradiated.

[0179] As the photo-polymerization initiator in the first adhesive composition (I-2), the same photo-polymerization initiator as in the first adhesive composition (I-l) can be exemplified.

[0180] The photo-polymerization initiator contained in the first adhesive composition (I-2) can be only one or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0181] In the first adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the content of the adhesive resin (I-2a).

[0182] (other additives)

[0183] The first adhesive composition (I-2) can also contain other additives other than the above-described components, within a range not impairing the effects of the present application.

[0184] The same additives as those in the first adhesive composition (I-1) can be exemplified as the other additives in the first adhesive composition (I-2).

[0185] The other additives contained in the first adhesive composition (I-2) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0186] The content of the other additives in the first adhesive composition (I-2) is not particularly limited, and can be appropriately selected depending on the kind thereof.

[0187] (solvent)

[0188] The first adhesive composition (I-2) can also contain a solvent, for the same purpose as in the first adhesive composition (I-1).

[0189] The same solvent as that in the first adhesive composition (I-1) can be exemplified as the solvent in the first adhesive composition (I-2).

[0190] The solvent contained in the first adhesive composition (I-2) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0191] The content of the solvent in the first adhesive composition (I-2) is not particularly limited, and can be appropriately adjusted.

[0192] {first adhesive composition (I-3)}

[0193] As described above, the first adhesive composition (I-3) contains the adhesive resin (I-2a) and the energy ray-curable low molecular compound.

[0194] In the first adhesive composition (I-3), the content of the adhesive resin (I-2a) is preferably 5 to 99 mass%, more preferably 10 to 95 mass%, and particularly preferably 15 to 90 mass%, relative to the total mass of the first adhesive composition (I-3).

[0195] (energy ray-curable low molecular compound)

[0196] As the energy ray-curable low molecular compound contained in the first adhesive composition (I-3), monomers and oligomers having an energy ray-polymerizable unsaturated group and capable of being cured by irradiation of energy rays can be cited, and the same energy ray-curable compounds as those contained in the first adhesive composition (I-1) can be cited.

[0197] The energy ray-curable low molecular compound contained in the first adhesive composition (I-3) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0198] In the first adhesive composition (I-3), the content of the energy ray-curable low molecular compound is preferably 0.01 to 300 parts by mass, more preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass, relative to 100 parts by mass of the content of the adhesive resin (I-2a).

[0199] (photo-polymerization initiator)

[0200] The first adhesive composition (I-3) can further contain a photo-polymerization initiator. The first adhesive composition (I-3) containing a photo-polymerization initiator can sufficiently perform a curing reaction even when a lower energy energy ray such as ultraviolet rays is irradiated.

[0201] As the photo-polymerization initiator in the first adhesive composition (I-3), the same photo-polymerization initiators as those in the first adhesive composition (I-1) can be cited.

[0202] The photo-polymerization initiator contained in the first adhesive composition (I-3) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0203] In the first adhesive composition (I-3), the content of the photo-polymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable low molecular compound.

[0204] (other additive)

[0205] The first adhesive composition (I-3) can further contain other additives other than the above-described components, within a range not impairing the effects of the present application.

[0206] As the other additive, the same additive as the other additive in the first adhesive composition (I-1) can be exemplified.

[0207] The other additive contained in the first adhesive composition (I-3) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0208] In the first adhesive composition (I-3), the content of the other additive is not particularly limited, and can be appropriately selected depending on the kind thereof.

[0209] (Solvent)

[0210] The first adhesive composition (I-3) can also contain a solvent for the same purpose as in the first adhesive composition (I-1).

[0211] As the solvent in the first adhesive composition (I-3), the same solvent as in the first adhesive composition (I-1) can be exemplified.

[0212] The solvent contained in the first adhesive composition (I-3) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0213] In the first adhesive composition (I-3), the content of the solvent is not particularly limited, and can be appropriately adjusted.

[0214] {First Adhesive Composition Other Than the First Adhesive Compositions (I-1) to (I-3)}

[0215] Hitherto, the first adhesive composition (I-1), the first adhesive composition (I-2), and the first adhesive composition (I-3) have been mainly described, but the components described in terms of the components contained therein can also be used in all the first adhesive compositions other than the three first adhesive compositions (in the present embodiment, referred to as "first adhesive composition other than the first adhesive compositions (I-1) to (I-3)").

[0216] As the first adhesive composition other than the first adhesive compositions (I-1) to (I-3), a first adhesive composition other than the energy ray-curable first adhesive composition can be exemplified.

[0217] As the first adhesive composition which is non-energy ray-curable, for example, a composition containing an adhesive resin such as an acrylic resin (a resin having a (meth) acryloyl group), a urethane resin (a resin having a urethane bond), a rubber-based resin (a resin having a rubber structure), a silicone-based resin (a resin having a siloxane bond), an epoxy resin (a resin having an epoxy group), a polyvinyl ether, or a polycarbonate, and the like, is exemplified, and a composition containing an acrylic resin is preferable.

[0218] The first adhesive composition other than the first adhesive compositions (I-1) to (I-3) preferably contains one or two or more crosslinking agents, and the content thereof can be set to be the same as in the case of the above-described first adhesive composition (I-1) or the like.

[0219] <Method for producing the first adhesive composition>

[0220] The first adhesive composition (I-1) to (I-3) or the like can be obtained by blending the adhesive and each component used for constituting the first adhesive composition, such as a component other than the adhesive, as necessary.

[0221] The order of addition of each component at the time of blending is not particularly limited, and two or more components can be added at the same time.

[0222] When a solvent is used, the blending component other than the solvent can be used by being previously diluted by mixing the solvent therewith, or can be used without being previously diluted by mixing the solvent therewith.

[0223] The method of mixing each component at the time of blending is not particularly limited, and can be appropriately selected from among publicly known methods such as a method of mixing by rotating a stirrer or a stirring blade, a method of mixing by using a mixer, a method of mixing by applying ultrasonic waves, and the like.

[0224] The temperature and the time at the time of adding and mixing each component are not particularly limited as long as each blending component is not deteriorated, and can be appropriately adjusted, but the temperature is preferably 15 to 30°C.

[0225] {Composition of the first adhesive layer}

[0226] The composition of the first adhesive layer in the present embodiment is the composition after removing the solvent from the above-described first adhesive layer composition.

[0227] The content ratio of the adhesive resin (I-1a) with respect to the total mass of the first adhesive layer (I-1) in the first adhesive layer (I-1) when the first adhesive layer composition is the first adhesive composition (I-1) is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and further preferably 60 to 90% by mass. Furthermore, as another aspect of the present application, the content ratio of the adhesive resin (I-1a) with respect to the total mass of the first adhesive layer (I-1) can be 25 to 80% by mass, can be 30 to 75% by mass, or can be 35 to 70% by mass. The content ratio of the energy ray-curable compound with respect to the total mass of the first adhesive layer (I-1) is preferably 1 to 50% by mass, more preferably 2 to 48% by mass, and further preferably 5 to 45% by mass. The content ratio of the crosslinking agent with respect to the total mass of the first adhesive layer (I-1) is preferably 0.1 to 10% by mass, more preferably 0.2 to 9% by mass, and further preferably 0.3 to 8% by mass, when the first adhesive layer (I-1) contains the crosslinking agent. The content ratio of the photopolymerization initiator with respect to the total mass of the first adhesive layer (I-1) is preferably 0.5 to 18.0% by mass, more preferably 0.7 to 17.5% by mass, and further preferably 1.0 to 15.0% by mass, when the first adhesive layer (I-1) contains the photopolymerization initiator.

[0228] Hereinafter in the present specification, the "content ratio" means the content ratio of the monomer itself when the object is a monomer, and means the content ratio of the structural unit derived from the monomer when the object is a polymer obtained by polymerizing the monomer.

[0229] The content ratio of the adhesive resin (I-2a) with respect to the total mass of the first adhesive layer (I-2) in the first adhesive layer (I-2) when the first adhesive layer composition is the first adhesive composition (I-2) is preferably 70.0 to 99.0% by mass, more preferably 72.5 to 97.5% by mass, and further preferably 75.0 to 95.0% by mass. The content ratio of the crosslinking agent with respect to the total mass of the first adhesive layer (I-2) is preferably 0.1 to 3.0% by mass, more preferably 0.2 to 2.5% by mass, and further preferably 0.3 to 2.0% by mass, when the first adhesive layer (I-2) contains the crosslinking agent. The content ratio of the photopolymerization initiator with respect to the total mass of the first adhesive layer (I-2) is preferably 0.5 to 18.0% by mass, more preferably 0.7 to 17.5% by mass, and further preferably 1.0 to 17.0% by mass, when the first adhesive layer (I-2) contains the photopolymerization initiator.

[0230] When the first adhesive layer composition is the first adhesive composition (I-3), the content ratio of the adhesive resin (I-2a) with respect to the total mass of the first adhesive layer (I-3) is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and further preferably 60 to 90% by mass. In addition, the content ratio of the energy ray-curable low molecular compound with respect to the total mass of the first adhesive layer (I-3) is preferably 1 to 50% by mass, more preferably 2 to 48% by mass, and further preferably 5 to 45% by mass. When the first adhesive layer (I-3) contains a crosslinking agent, the content ratio of the crosslinking agent with respect to the total mass of the first adhesive layer (I-3) is preferably 0.1 to 10% by mass, more preferably 0.2 to 9% by mass, and further preferably 0.3 to 8% by mass. When the first adhesive layer (I-3) contains a photopolymerization initiator, the content ratio of the photopolymerization initiator with respect to the total mass of the first adhesive layer (I-3) is preferably 0.5 to 18.0% by mass, more preferably 0.7 to 17.5% by mass, and further preferably 1.0 to 17.0% by mass.

[0231] In the present embodiment, the first adhesive layer (I-2) containing the adhesive resin (1-2a) and the crosslinking agent is preferably contained. At this time, the adhesive resin (1-2a) is preferably an acrylic polymer obtained by reacting an unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group with an acrylic polymer having a structural unit derived from an alkyl (meth)acrylate and a unit derived from a hydroxyl group-containing monomer. The crosslinking agent can use the compounds exemplified in the first adhesive composition (I-1), and tolylene-2,6-diisocyanate is particularly preferably used. The photopolymerization initiator can use the compounds exemplified in the first adhesive composition (I-1), and 1-hydroxycyclohexyl phenyl ketone is particularly preferably used.

[0232] The content ratio of the structural unit derived from the alkyl (meth)acrylate relative to the total mass of the adhesive resin (1-2a) is preferably 50 to 99 mass%, more preferably 60 to 98 mass%, and further preferably 70 to 97 mass%. The content ratio of the unit derived from the hydroxyl group-containing monomer relative to the total mass of the adhesive resin (1-2a) is preferably 0.5 to 15 mass%, more preferably 1.0 to 10 mass%, and further preferably 2.0 to 10 mass%. The number of carbon atoms of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (1-2a) is preferably 1 to 12, and more preferably 1 to 4. The adhesive resin (1-2a) preferably has a structural unit derived from two or more kinds of alkyl (meth)acrylates, more preferably a structural unit derived from methyl (meth)acrylate and n-butyl (meth)acrylate, and further preferably a structural unit derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (1-2a), the hydroxyl group-containing monomers exemplified in the above-described adhesive resin (I-1a) can be used, and 2-hydroxyethyl acrylate is particularly preferable. As the unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) can be used, and 2-methacryloyloxyethyl isocyanate is particularly preferable. The amount of the unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group, when the total hydroxyl group derived from the hydroxyl group-containing monomer is 100 mol, is preferably 20 to 80 mol, more preferably 25 to 75 mol, and further preferably 30 to 70 mol.

[0233] o Filling layer

[0234] In the adhesive tape for terminal protection of the present embodiment, the filling layer is a layer that fills the terminal of the semiconductor device and protects the terminal.

[0235] The filling layer is in a sheet or film shape, and the material thereof is not particularly limited as long as the above-described conditional relationship is satisfied.

[0236] For example, when the purpose is to suppress deformation of the viscoelastic layer by reflecting the shape of the terminal present on the surface of the semiconductor device on the viscoelastic layer that covers the terminal formation surface of the semiconductor device as a protection target, from the viewpoint of further improving the adhesion of the filling layer, as a preferable material of the filling layer, urethane (meth)acrylate, acrylic resin, and the like can be exemplified.

[0237] The filling layer can be only one layer (single layer), or can be a plurality of layers of two or more layers, and when it is a plurality of layers, the plurality of layers can be the same as or different from each other, and the combination of the plurality of layers is not particularly limited.

[0238] The thickness of the filling layer can be appropriately adjusted in a manner such that the thickness of the viscoelastic layer is within the above-mentioned preferable range, in accordance with the height of the terminal of the terminal-forming surface of the semiconductor device that is the object of protection, but from the viewpoint of easily eliminating the influence of a terminal having a relatively high height, the thickness of the filling layer is preferably 50 to 600 μm, more preferably 70 to 550 μm, and further preferably 80 to 500 μm. By making the thickness of the filling layer equal to or greater than the lower limit value, a viscoelastic layer having higher protection performance for a terminal can be formed. Further, by making the thickness of the filling layer equal to or less than the upper limit value, the productivity and winding adaptability under a roll shape are increased.

[0239] Here, the "thickness of the filling layer" refers to the thickness of the entire filling layer, and for example, the thickness of a filling layer composed of a plurality of layers refers to the total thickness of all the layers that constitute the filling layer.

[0240] The filling layer preferably has a soft property suitable for filling a terminal, and is preferably softer than the first adhesive layer.

[0241] The filling layer can be formed using an energy ray-curable constituent material, or can be formed using a non-energy ray-curable constituent material. The filling layer formed using an energy ray-curable constituent material is preferable because it is easy to adjust the physical properties before and after curing.

[0242] When the filling layer is formed using an energy ray-curable constituent material, the elastic modulus of the filling layer before curing is preferably 0.01 to 1.0 MPa, more preferably 0.02 to 0.9 MPa, and further preferably 0.03 to 0.8 MPa. If the elastic modulus of the filling layer before curing is within the above-mentioned range, the holding property of the semiconductor device can be obtained.

[0243] When the filling layer is formed using an energy ray-curable constituent material, the elastic modulus of the filling layer after curing is preferably 1.0 to 100 MPa, more preferably 2.0 to 95 MPa, and further preferably 3.0 to 90 MPa. If the elastic modulus of the filling layer after curing is within the above-mentioned range, the holding property of the semiconductor device can be obtained.

[0244] When the filling layer is a filling layer (I) formed using the filling layer-forming composition (I) containing the acrylic resin described later, the curing of the filling layer (I) can be performed in any of the processes in the method for manufacturing the semiconductor device of the electromagnetic wave-shielding film according to the first and second embodiments, but is preferably performed after the process of burying the terminal of the semiconductor device (or semiconductor device assembly) with a terminal and before the process of peeling the semiconductor device with a formed electromagnetic wave-shielding film from the terminal-protecting tape.

[0245] When the embedding layer is an embedding layer (II) formed using the embedding layer-forming composition (II) containing the urethane (meth) acrylate described later, the curing of the embedding layer (II) can be performed in any of the processes in the manufacturing method of the semiconductor device with the electromagnetic wave shielding film of the first and second embodiments described above, but is preferably performed before the process of embedding the terminal of the semiconductor device (or semiconductor device assembly) with the terminal.

[0246] (embedding layer-forming composition)

[0247] The embedding layer can be formed using an embedding layer-forming composition containing the constituent material of the embedding layer.

[0248] For example, the embedding layer can be formed at the target site by applying the embedding layer-forming composition to the surface of the object on which the embedding layer is to be formed and drying it as necessary, and curing it by irradiation of energy rays. Further, the embedding layer of the target thickness can be formed and the embedding layer can be transferred to the target site by applying the embedding layer-forming composition to a release film and drying it as necessary, and curing it by irradiation of energy rays. A more specific method of forming the embedding layer will be described in detail later together with the method of forming other layers. The content ratio between the components of the embedding layer-forming composition that do not vaporize at ordinary temperature is generally the same as the content ratio between the components of the embedding layer.

[0249] The application of the embedding layer-forming composition can be performed using a publicly known method, and for example, methods using various coaters such as air-knife coaters, blade coaters, bar coaters, gravure coaters, roll coaters, roll-knife coaters, curtain coaters, die coaters, doctor blade coaters, screen coaters, Meyer bar coaters, kiss coaters, and the like can be exemplified.

[0250] The drying conditions of the embedding layer-forming composition are not particularly limited, and when the embedding layer-forming composition contains the solvent described later, heating drying is preferably performed, and in this case, for example, drying is preferably performed under conditions of 70 to 130°C for 10 seconds to 5 minutes.

[0251] When the embedding layer-forming composition has energy ray-curing properties, it is preferably cured by irradiation of energy rays.

[0252] As the embedding layer-forming composition, for example, the embedding layer-forming composition (I) containing an acrylic resin, the embedding layer-forming composition (II) containing a urethane (meth) acrylate, and the like can be exemplified.

[0253] {embedding layer-forming composition (I)}

[0254] The landfill layer-forming composition (I) contains an acrylic resin.

[0255] As the landfill layer-forming composition (I), the composition containing the energy ray-curable compound and the adhesive resin (I-1a) as the acrylic resin in the above-described first adhesive composition (I-1), the composition containing the energy ray-curable adhesive resin (I-2a) having the unsaturated group introduced in the side chain of the adhesive resin (I-1a) as the acrylic resin in the first adhesive composition (I-2) can be used as the landfill layer-forming composition (I).

[0256] The adhesive resin (I-1a) and the energy ray-curable compound used in the landfill layer-forming composition (I) are the same as the adhesive resin (I-1a) and the energy ray-curable compound used in the above-described first adhesive composition (I-1).

[0257] The adhesive resin (I-2a) used in the landfill layer-forming composition (I) is the same as the adhesive resin (I-2a) used in the above-described first adhesive composition (I-2).

[0258] The landfill layer-forming composition (I) preferably further contains a crosslinking agent. The crosslinking agent used in the landfill layer-forming composition (I) is the same as the crosslinking agent used in the above-described first adhesive composition (I-1), the first adhesive composition (I-2).

[0259] The landfill layer-forming composition (I) can further contain a photopolymerization initiator, other additives. The photopolymerization initiator, the other additives used in the landfill layer-forming composition (I) are the same as the photopolymerization initiator, the other additives used in the above-described first adhesive composition (I-1), the first adhesive composition (I-2).

[0260] The landfill layer-forming composition (I) can also contain a solvent. The solvent used in the landfill layer-forming composition (I) is the same as the solvent used in the above-described first adhesive composition (I-1), the first adhesive composition (I-2).

[0261] The landfill layer can be designed to have a soft property suitable for a landfill terminal by adjusting the molecular weight of the adhesive resin (I-1a) and / or the energy ray-curable compound in the landfill layer-forming composition (I).

[0262] Further, the landfill layer can be designed to have a soft property suitable for a landfill terminal by adjusting the content of the crosslinking agent in the landfill layer-forming composition (I).

[0263] {Composition of the landfill layer (I)}

[0264] The composition of the landfill layer in the present embodiment is the composition after removal of the solvent from the above-mentioned composition (I) for forming a landfill layer.

[0265] When the composition (I) for forming a landfill layer is the above-mentioned first adhesive composition (I-1) containing the adhesive resin (I-1a) as an acrylic resin and the energy ray-curable compound, the content ratio of the adhesive resin (I-1a) as an acrylic resin in the landfill layer (I) with respect to the total mass of the landfill layer (I) is preferably 50 to 99 mass%, more preferably 55 to 95 mass%, and further preferably 60 to 90 mass%. As another aspect of the present application, the content ratio of the adhesive resin (I-1a) as an acrylic resin with respect to the total mass of the landfill layer (I) can be 45 to 90 mass%, or 50 to 85 mass%. Furthermore, the content ratio of the energy ray-curable compound with respect to the total mass of the landfill layer (I) is preferably 0.5 to 50 mass%, and further preferably 5 to 45 mass%. When the landfill layer (I) contains a crosslinking agent, the content ratio of the crosslinking agent with respect to the total mass of the landfill layer (I) is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and further preferably 0.3 to 8 mass%. When the landfill layer (I) contains a photopolymerization initiator, the content ratio of the photopolymerization initiator with respect to the total mass of the landfill layer (I) is preferably 0.5 to 18.0 mass%, more preferably 0.7 to 17.5 mass%, and further preferably 1.0 to 17.0 mass%.

[0266] When the composition (I) for forming a land layer is a composition containing an energy ray-curable adhesive resin (1-2a) having an unsaturated group introduced into a side chain of an adhesive resin (I- la) as an acrylic resin, the content ratio of the energy ray-curable adhesive resin (1-2a) having an unsaturated group introduced into a side chain with respect to the total mass of the land layer (I) is preferably 10 to 70% by mass, more preferably 15 to 65% by mass, and further preferably 20 to 60% by mass. When the land layer (I) contains a crosslinking agent, the content ratio of the crosslinking agent with respect to the total mass of the land layer (I) is preferably 0.1 to 10% by mass, more preferably 0.2 to 9% by mass, and further preferably 0.3 to 8% by mass. When the land layer (I) contains a photopolymerization initiator, the content ratio of the photopolymerization initiator with respect to the total mass of the land layer (I) is preferably 0.5 to 18.0% by mass, more preferably 0.7 to 17.5% by mass, and further preferably 1.0 to 17.0% by mass. The land layer (I) of the present embodiment can further contain the adhesive resin (I- la) as the acrylic resin. In this case, the content ratio of the adhesive resin (I- la) as the acrylic resin with respect to the total mass of the land layer (I) is preferably 20.0 to 60.0% by mass, more preferably 22.5 to 57.5% by mass, and further preferably 25.0 to 55.0% by mass. Furthermore, when the land layer (I) of the present embodiment further contains the adhesive resin (I- la) as the acrylic resin, the content of the adhesive resin (I- la) with respect to 100 parts by mass of the adhesive resin (1-2a) is preferably 70.0 to 99.0 parts by mass, more preferably 72.5 to 97.5 parts by mass, and further preferably 75.0 to 95.0 parts by mass.

[0267] The composition, etc. of the adhesive resin (I- la) as the acrylic resin, the energy ray-curable compound, or the energy ray-curable adhesive resin (1-2a) having an unsaturated group introduced into a side chain of the adhesive resin (I- la) contained in the land layer (I) can be the same as the description of the adhesive resin (I- la) as the acrylic resin, the energy ray-curable compound, or the energy ray-curable adhesive resin (1-2a) having an unsaturated group introduced into a side chain of the adhesive resin (I- la) used in the above-described first adhesive composition (I- 1).

[0268] In the present embodiment, the underlayer (I) containing the adhesive resin (1-2a), the adhesive resin (1-1a), the crosslinking agent, and the photopolymerization initiator is preferred. At this time, the adhesive resin (1-1a) is preferably an acrylic polymer having a structural unit derived from an alkyl (meth)acrylate and a unit derived from a carboxyl group-containing monomer. Further, the adhesive resin (1-2a) is preferably an acrylic polymer obtained by reacting an unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group with an acrylic polymer having a structural unit derived from an alkyl (meth)acrylate, a unit derived from a hydroxyl group-containing monomer. The crosslinking agent can use the compounds exemplified in the above-described first adhesive composition (I-1), and particularly preferably toluene-2, 6-diisocyanate, 1, 3-bis (N, N-diglycidyl aminomethyl) cyclohexane. The crosslinking agent can use the compounds exemplified in the above-described first adhesive composition (I-1), and particularly preferably 1-hydroxycyclohexyl phenyl ketone.

[0269] The content ratio of the structural unit derived from an alkyl (meth)acrylate with respect to the total mass of the adhesive resin (1-1a) is preferably 75 to 99 mass%, more preferably 80 to 98 mass%, and further preferably 85 to 97 mass%. The content ratio of the structural unit of the carboxyl group-containing monomer with respect to the total mass of the adhesive resin (1-1a) is preferably 1.0 to 30 mass%, more preferably 2.0 to 25 mass%, further preferably 3.0 to 20 mass%, and particularly preferably 5.0 to 15 mass%. The number of carbon atoms of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (1-1a) is preferably 4 to 12, and more preferably 4 to 8. Further, in the adhesive resin (1-1a), an alkyl acrylate is preferred. Among them, the alkyl (meth)acrylate is particularly preferably n-butyl acrylate. Further, as the carboxyl group-containing monomer in the adhesive resin (1-1a), an ethylenically unsaturated monocarboxylic acid, an ethylenically unsaturated dicarboxylic acid, an acid anhydride of an ethylenically unsaturated dicarboxylic acid, or the like can be exemplified, and an ethylenically unsaturated monocarboxylic acid is preferred, and a (meth)acrylic acid is more preferred, and an acrylic acid is particularly preferred.

[0270] The weight average molecular weight of the adhesive resin (1-1a) of the present embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and further preferably 200,000 to 600,000.

[0271] In addition, in the present specification, unless otherwise specified, the "weight average molecular weight" means a polystyrene conversion value measured by a gel permeation chromatography (GPC) method.

[0272] The content ratio of the structural unit derived from the alkyl (meth)acrylate with respect to the total mass of the adhesive resin (1-2a) is preferably 1.0 to 95 mass%, more preferably 2.0 to 90 mass%, and further preferably 3.0 to 85 mass%. The content ratio of the unit derived from the hydroxyl group-containing monomer with respect to the total mass of the adhesive resin (1-2a) is preferably 1.0 to 50 mass%, more preferably 2.0 to 45 mass%, and further preferably 3.0 to 40 mass%. The number of carbon atoms of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (1-2a) is preferably 1 to 12, and more preferably 1 to 4. The adhesive resin (1-2a) preferably has a structural unit derived from two or more kinds of alkyl (meth)acrylates, more preferably a structural unit derived from methyl (meth)acrylate and n-butyl (meth)acrylate, and further preferably a structural unit derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (1-2a), the hydroxyl group-containing monomers exemplified in the first adhesive composition (I-1) described later can be used, and 2-hydroxyethyl acrylate is particularly preferable. As the unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) described later can be used, and 2-methacryloyloxyethyl isocyanate is particularly preferable. When the total hydroxyl group derived from the hydroxyl group-containing monomer is 100 mol, the amount of the unsaturated group-containing compound having an isocyanate group and an energy ray-polymerizable unsaturated group is preferably 20 to 200 mol, more preferably 30 to 190 mol, and further preferably 30 to 180 mol.

[0273] The weight average molecular weight of the adhesive resin (1-2a) of the present embodiment is preferably 50,000 to 1,000,000, more preferably 60,000 to 900,000, and further preferably 70,000 to 800,000.

[0274] {Landfill layer-forming composition (II)}

[0275] The landfill layer-forming composition (II) contains a urethane (meth)acrylate.

[0276] (Urethane (meth)acrylate)

[0277] The urethane (meth)acrylate is a compound having at least a (meth)acryloyl group and a urethane bond in one molecule, and has energy ray-polymerizability.

[0278] The urethane (meth) acrylate can be a monofunctional compound (a compound having only one (meth) acryloyl group in one molecule), a difunctional or higher compound (a compound having two or more (meth) acryloyl groups in one molecule), i.e., a polyfunctional compound, but it is preferable to use at least a monofunctional compound.

[0279] In addition, among the above-mentioned adhesive resin (1-2a), the energy ray-curable compound, and the energy ray-curable low-molecular compound, a compound or a resin having at least a (meth) acryloyl group and a urethane bond in one molecule does not belong to the urethane (meth) acrylate in the land layer-forming composition (II).

[0280] As the urethane (meth) acrylate contained in the land layer-forming composition, for example, a compound obtained by reacting a (meth) acrylic compound having a hydroxyl group and a (meth) acryloyl group with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound with a polyisocyanate compound can be exemplified. Here, the "terminal isocyanate urethane prepolymer" refers to a prepolymer having a urethane bond and an isocyanate group at a terminal portion of the molecule.

[0281] The urethane (meth) acrylate contained in the land layer-forming composition (II) can be only one, or two or more, and in the case of two or more, the combination and the ratio thereof can be arbitrarily selected.

[0282] (A) Polyol compound

[0283] The polyol compound is not particularly limited as long as it is a compound having two or more hydroxyl groups in one molecule.

[0284] The polyol compound can be used alone or two or more can be used at the same time, and in the case of two or more, the combination and the ratio thereof can be arbitrarily selected.

[0285] As the polyol compound, for example, an alkylene glycol, a polyether type polyol, a polyester type polyol, a polycarbonate type polyol, or the like can be exemplified.

[0286] The polyol compound can be any one of a diol of 2 functionality, a triol of 3 functionality, a polyol of 4 functionality or more, and among these, a diol is preferable in terms of easiness of availability and excellent versatility and reactivity.

[0287] • Polyether type polyol

[0288] The polyether polyol is not particularly limited, but a polyether diol is preferred, and as the polyether diol, for example, a compound represented by the following formula (1) can be mentioned.

[0289] [Chemical Formula 1]

[0290]

[0291] In the above formula (1), n is an integer of 2 or more; and R is a divalent hydrocarbon group, and a plurality of R can be the same as or different from each other.

[0292] In the above formula (1), n represents the number of repeating units of the group represented by the formula "-R-O-," and n is not particularly limited as long as it is an integer of 2 or more. Among them, n is preferably 10 to 250, more preferably 25 to 205, and particularly preferably 40 to 185.

[0293] In the above formula (1), R is not particularly limited as long as it is a divalent hydrocarbon group, and is preferably an alkylene group, more preferably an alkylene group having 1 to 6 carbon atoms, and further preferably an ethylene group, a propylene group, or a tetramethylene group, and particularly preferably a propylene group or a tetramethylene group.

[0294] The compound represented by the above formula (1) is preferably a polyethylene glycol, a polypropylene glycol, or a polytetramethylene ether glycol, and more preferably a polypropylene glycol or a polytetramethylene ether glycol.

[0295] By reacting the polyether diol with the polyisocyanate compound, a terminal isocyanate urethane prepolymer having an ether bond portion represented by the following formula (1a) can be obtained as the terminal isocyanate urethane prepolymer. And, by using this terminal isocyanate urethane prepolymer, the urethane (meth)acrylate is formed as a urethane (meth)acrylate having the ether bond portion, that is, as a urethane (meth)acrylate having a structural unit derived from the polyether diol.

[0296] [Chemical Formula 2]

[0297]

[0298] In the above formula (1a), R and n are the same as the above R and n.

[0299] • Polyester polyol

[0300] The polyester polyol is not particularly limited, and examples thereof include a polyester polyol obtained by performing an esterification reaction using a polybasic acid or a derivative thereof. In addition, unless otherwise specified, "derivative" in the present embodiment means a compound in which one or more groups of the original compound are replaced with groups other than the original groups (substituents). Among them, "groups" include not only atomic groups in which a plurality of atoms are bonded, but also a single atom.

[0301] As the polybasic acid and the derivative thereof, polybasic acids and derivatives thereof that are generally used as raw materials for the production of polyesters can be exemplified.

[0302] As the polybasic acid, for example, saturated aliphatic polybasic acids, unsaturated aliphatic polybasic acids, aromatic polybasic acids, and the like can be exemplified, and a dimer acid belonging to any of these can also be used.

[0303] As the saturated aliphatic polybasic acid, for example, saturated aliphatic dibasic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacic acid can be exemplified.

[0304] As the unsaturated aliphatic polybasic acid, for example, unsaturated aliphatic dibasic acids such as maleic acid and fumaric acid can be exemplified.

[0305] As the aromatic polybasic acid, for example, aromatic dibasic acids such as phthalic acid, isophthalic acid, terephthalic acid, and 2,6-naphthalene dicarboxylic acid; aromatic tribasic acids such as 1,2,4-benzene tricarboxylic acid; and aromatic tetrabasic acids such as pyromellitic acid can be exemplified.

[0306] As the derivative of the polybasic acid, for example, acid anhydrides of the above-mentioned saturated aliphatic polybasic acids, unsaturated aliphatic polybasic acids, and aromatic polybasic acids, and hydrogenated dimer acids can be exemplified.

[0307] Either one of the polybasic acid or the derivative thereof can be used alone, or two or more of them can be used simultaneously. When two or more of them are used simultaneously, the combination and the ratio thereof can be arbitrarily selected.

[0308] From the viewpoint of appropriately forming a landfill layer having an appropriate hardness, the polybasic acid is preferably an aromatic polybasic acid.

[0309] In the esterification reaction for obtaining a polyester polyol, a publicly known catalyst can also be used as necessary.

[0310] As the catalyst, for example, tin compounds such as dibutyltin oxide and stannous octoate; and alkoxyl titanates such as tetrabutyl titanate and tetrapropyl titanate can be exemplified.

[0311] • Polycarbonate polyol

[0312] The polycarbonate polyol is not particularly limited, and examples thereof include a polyol obtained by reacting a diol represented by the above (1) with an alkylene carbonate.

[0313] Either one of the diol and the alkylene carbonate can be used alone, or two or more kinds thereof can be used simultaneously. When two or more kinds are used simultaneously, the combination and ratio thereof can be selected arbitrarily.

[0314] The number average molecular weight calculated from the hydroxyl value of the polyol compound is preferably from 1000 to 10000, more preferably from 2000 to 9000, and particularly preferably from 3000 to 7000. By making the number average molecular weight 1000 or more, the excessive generation of urethane bonds can be suppressed, and the viscoelastic properties of the cushion layer can be controlled more easily. Further, by making the number average molecular weight 10000 or less, the excessive softening of the cushion layer can be suppressed.

[0315] The number average molecular weight calculated from the hydroxyl value of the polyol compound refers to a value calculated from the following formula.

[0316] [Number average molecular weight of polyol compound] = [Number of functional groups of polyol compound] x 56.11 x 1000 / [Hydroxyl value of polyol compound (unit: mgKOH / g)]

[0317] The polyol compound is preferably a polyether polyol, and more preferably a polyether diol.

[0318] (B) Polyisocyanate compound

[0319] The polyisocyanate compound to be reacted with the polyol compound is not particularly limited as long as it has two or more isocyanate groups.

[0320] Either one of the polyisocyanate compounds can be used alone, or two or more kinds thereof can be used simultaneously. When two or more kinds are used simultaneously, the combination and ratio thereof can be selected arbitrarily.

[0321] As the polyisocyanate compound, examples thereof include chain aliphatic diisocyanates such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and the like; cyclic aliphatic diisocyanates such as isophorone diisocyanate, norbornane diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, ω,ω'-diisocyanate dimethylcyclohexane, and the like; aromatic diisocyanates such as 4,4'-diphenylmethane diisocyanate, toluene diisocyanate, xylylene diisocyanate, dimethyl diphenyl diisocyanate, tetramethylene xylylene diisocyanate, naphthalene-1,5-diisocyanate, and the like.

[0322] Among them, from the viewpoint of operability, the polyisocyanate compound is preferably isophorone diisocyanate, hexamethylene diisocyanate, or xylylene diisocyanate.

[0323] (C) (Meth)acrylic compound

[0324] The (meth)acrylic compound to be reacted with the terminal isocyanate urethane prepolymer is not particularly limited as long as it is a compound having at least a hydroxyl group and a (meth)acryloyl group in one molecule.

[0325] The (meth)acrylic compound can be used alone or two or more kinds can be used at the same time, and the combination and ratio thereof can be arbitrarily selected when two or more kinds are used at the same time.

[0326] As the (meth)acrylic compound, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 4-hydroxycyclohexyl (meth)acrylate, 5-hydroxycyclooctyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, pentaerythritol tri(meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and the like hydroxyl group-containing (meth)acrylates; N-methylol (meth)acrylamide and the like hydroxyl group-containing (meth)acrylamides; reaction products obtained by reacting (meth)acrylic acid with vinyl alcohol, vinyl phenol, or bisphenol A diglycidyl ether, and the like.

[0327] Among them, the (meth)acrylic compound is preferably a hydroxyl group-containing (meth)acrylate, more preferably a hydroxyl group-containing (meth)acrylate alkyl ester, and particularly preferably 2-hydroxyethyl (meth)acrylate.

[0328] The reaction between the terminal isocyanate urethane prepolymer and the (meth)acrylic compound can use a solvent, a catalyst, and the like as needed.

[0329] The conditions at the time of reacting the terminal isocyanate urethane prepolymer with the (meth)acrylic compound are appropriately adjusted, and for example, the reaction temperature is preferably 60 to 100°C, and the reaction time is preferably 1 to 4 hours.

[0330] The urethane (meth)acrylate can be any one of an oligomer, a polymer, and a mixture of an oligomer and a polymer, and is preferably an oligomer.

[0331] For example, the weight average molecular weight of the urethane (meth) acrylate is preferably 1000 to 100000, more preferably 3000 to 80000, and particularly preferably 5000 to 65000. By making the weight average molecular weight 1000 or more, the hardness of the buried layer is easily optimized due to the molecular force between the structures from the urethane (meth) acrylate in the polymer between the urethane (meth) acrylate and the polymerizable monomer described later.

[0332] (Polymerizable monomer)

[0333] From the viewpoint of further improving film formability, the buried layer-forming composition (II) can contain a polymerizable monomer in addition to the urethane (meth) acrylate.

[0334] The polymerizable monomer is a compound having an energy ray polymerizability, a weight average molecular weight of less than 1000, and at least one (meth) acryloyl group in one molecule.

[0335] As the polymerizable monomer, for example, there can be mentioned an alkyl (meth) acrylate having a chain-like alkyl group having a carbon number of 1 to 30 constituting an alkyl ester; a functional group-containing (meth) acrylate compound having a functional group such as a hydroxyl group, an amido group, an amino group, or an epoxy group; a (meth) acrylate having an aliphatic cyclic group; a (meth) acrylate having an aromatic hydrocarbon group; a (meth) acrylate having a heterocyclic group; a compound having a vinyl group; a compound having an allyl group; and the like.

[0336] As the alkyl (meth) acrylate having a chain-like alkyl group having a carbon number of 1 to 30, for example, there can be mentioned methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate (lauric acid (meth) acrylate), tridecyl (meth) acrylate, myristic acid (meth) acrylate, pentadecyl (meth) acrylate, palmitic acid (meth) acrylate, heptadecyl (meth) acrylate, stearyl (meth) acrylate (stearic acid (meth) acrylate), isostearyl (meth) acrylate, nonadecyl (meth) acrylate, arachidyl (meth) acrylate, and the like.

[0337] As the functional group-containing (meth)acrylic acid derivative, for example, there can be mentioned hydroxyl group-containing (meth)acrylates such as (meth)acrylic acid 2-hydroxyethyl ester, (meth)acrylic acid 2-hydroxypropyl ester, (meth)acrylic acid 3-hydroxypropyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 3-hydroxybutyl ester, (meth)acrylic acid 4-hydroxybutyl ester, etc.; (meth)acrylamides and derivatives thereof such as (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-butyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-hydroxymethylpropane (meth)acrylamide, N-methoxymethyl (meth)acrylamide, N-butoxymethyl (meth)acrylamide, etc.; (meth)acrylates having an amino group (hereinafter sometimes referred to as "amino group-containing (meth)acrylates"); (meth)acrylates having a 1-substituted amino group in which one hydrogen atom in the amino group is replaced with a group other than hydrogen atom (hereinafter sometimes referred to as "1-substituted amino group-containing (meth)acrylates"); (meth)acrylates having a 2-substituted amino group in which both hydrogen atoms in the amino group are replaced with groups other than hydrogen atom (hereinafter sometimes referred to as "2-substituted amino group-containing (meth)acrylates"); (meth)acrylates having an epoxy group (hereinafter sometimes referred to as "epoxy group-containing (meth)acrylates") such as glycidyl (meth)acrylate, methyl glycidyl (meth)acrylate, etc., with 2-hydroxypropyl (meth)acrylate being preferred, and 2-hydroxypropyl acrylate being more preferred.

[0338] In the present specification, the "amino group-containing (meth)acrylate" means a compound in which one or more hydrogen atoms of the (meth)acrylate is replaced with an amino group (-NH2). Similarly, the "1-substituted amino group-containing (meth)acrylate" means a compound in which one or more hydrogen atoms of the (meth)acrylate is replaced with a 1-substituted amino group, and the "2-substituted amino group-containing (meth)acrylate" means a compound in which one or more hydrogen atoms of the (meth)acrylate is replaced with a 2-substituted amino group.

[0339] As the group other than hydrogen atom which replaces the hydrogen atom in the "1-substituted amino group" and the "2-substituted amino group", for example, there can be mentioned an alkyl group, etc.

[0340] As the (meth)acrylate having an aliphatic cyclic group, for example, there can be mentioned isobornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, cyclohexyl (meth)acrylate, adamantyl (meth)acrylate, etc., with isobornyl (meth)acrylate being preferred, and isobornyl acrylate being more preferred.

[0341] As the (meth)acrylate having an aromatic hydrocarbon group, for example, (meth)acrylic acid phenylhydroxypropyl ester, benzyl methacrylate, (meth)acrylic acid 2-hydroxy-3-phenoxypropyl ester, and the like can be exemplified.

[0342] The heterocyclic group in the (meth)acrylate having a heterocyclic group can be either of an aromatic heterocyclic group or an aliphatic heterocyclic group.

[0343] As the (meth)acrylate having a heterocyclic group, for example, (meth)acrylic acid tetrahydrofurfuryl ester, (meth)acryloyl morpholine, and the like can be exemplified.

[0344] As the compound having a vinyl group, for example, styrene, hydroxyethyl vinyl ether, hydroxybutyl vinyl ether, N-vinyl formamide, N-vinyl pyrrolidone, N-vinyl caprolactam, and the like can be exemplified.

[0345] As the compound having an allyl group, for example, allyl glycidyl ether and the like can be exemplified.

[0346] From the viewpoint of good compatibility with the urethane (meth)acrylate, the polymerizable monomer is preferably a compound having a relatively large volume group, and as such a compound, a (meth)acrylate having an aliphatic cyclic group, a (meth)acrylate having an aromatic hydrocarbon group, a (meth)acrylate having a heterocyclic group, more preferably a (meth)acrylate having an aliphatic cyclic group can be exemplified.

[0347] The polymerizable monomer contained in the landfill layer-forming composition (II) can be only one, or two or more, and in the case of two or more, the combination and ratio thereof can be arbitrarily selected.

[0348] In the landfill layer-forming composition (II), the content of the polymerizable monomer is preferably 10 to 99% by mass, more preferably 15 to 95% by mass, further preferably 20 to 90% by mass, particularly preferably 25 to 80% by mass.

[0349] (Photo-polymerization initiator)

[0350] The landfill layer-forming composition (II) can contain a photo-polymerization initiator in addition to the urethane (meth)acrylate and the polymerizable monomer. The landfill layer-forming composition (II) containing a photo-polymerization initiator can sufficiently perform a curing reaction even when a low-energy energy ray such as ultraviolet rays is irradiated.

[0351] As the photo-polymerization initiator in the landfill layer-forming composition (II), the same photo-polymerization initiator as that in the first adhesive composition (I-1) can be exemplified.

[0352] The photopolymerization initiator contained in the underlayer-forming composition (II) can be only one or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0353] In the underlayer-forming composition (II), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the total content of the urethane (meth)acrylate and the polymerizable monomer.

[0354] (resin component other than urethane (meth)acrylate)

[0355] The underlayer-forming composition (II) can contain a resin component other than the urethane (meth)acrylate, within a range not impairing the effects of the present application.

[0356] The kind of the resin component and the content thereof in the underlayer-forming composition (II) can be appropriately selected according to the purpose, and are not particularly limited.

[0357] (other additive)

[0358] The underlayer-forming composition (II) can further contain an other additive not belonging to any of the above components, within a range not impairing the effects of the present application.

[0359] As the other additive, for example, known additives such as a crosslinking agent, an antistatic agent, an antioxidant, a chain transfer agent, a softening agent (plasticizer), a filler, a rust preventive, a coloring agent (pigment, dye), and the like can be exemplified.

[0360] As the chain transfer agent, for example, a mercaptan compound having at least one mercaptan group (thiol group) in one molecule can be exemplified.

[0361] As the mercaptan compound, for example, nonanethiol, 1-dodecanethiol, 1,2-ethanedithiol, 1,3-propanedithiol, triazine mercaptan, triazine dithiol, triazine trithiol, 1,2,3-propanetriol, tetraethylene glycol-bis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetra(3-mercaptopropionate), pentaerythritol tetramercaptoacetate, dipentaerythritol hexa(3-mercaptopropionate), tris[(3-mercaptopropionyloxy)-ethyl]isocyanurate, 1,4-bis(3-mercaptopropionyloxy)butane, pentaerythritol tetra(3-mercaptobutyrate), 1,3,5-tris(3-mercaptopropionyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and the like can be exemplified, and pentaerythritol tetra(3-mercaptobutyrate) is preferred.

[0362] The other additive contained in the underlayer-forming composition (II) can be only one or two or more. When two or more, the combination and ratio thereof can be arbitrarily selected.

[0363] The content of the other additive in the underlayer-forming composition (II) is not particularly limited and can be appropriately selected depending on the kind thereof.

[0364] (Solvent)

[0365] The underlayer-forming composition (II) can contain a solvent. By containing a solvent in the underlayer-forming composition (II), the coating adaptability to the coating target surface is improved.

[0366] {Composition of underlayer (II)}

[0367] The composition of the underlayer (II) in the present embodiment is the composition after removal of the solvent from the above underlayer-forming composition (II).

[0368] The content ratio of the urethane (meth)acrylate relative to the total mass of the underlayer (II) is preferably 20.0 to 60.0 mass%, more preferably 22.5 to 57.5 mass%, and further preferably 25.0 to 55.0 mass%.

[0369] When the underlayer (II) contains a polymerizable monomer, the content ratio of the polymerizable monomer relative to the total mass of the underlayer (II) is preferably 40.0 to 80.0 mass%, more preferably 42.5 to 77.5 mass%, and further preferably 45.0 to 75.0 mass%. As the polymerizable monomer, either or both of isobornyl acrylate and 2-hydroxypropyl acrylate is preferably contained.

[0370] When the underlayer (II) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the underlayer (II) is preferably 0.1 to 5.0 mass%, more preferably 0.2 to 4.5 mass%, and further preferably 0.3 to 4.0 mass%.

[0371] When the underlayer (II) contains a photopolymerization initiator, the content ratio of the photopolymerization initiator relative to the total mass of the underlayer (II) is preferably 0.1 to 10.0 mass%, more preferably 0.2 to 9.0 mass%, and further preferably 0.3 to 8.0 mass%. As the photopolymerization initiator, 2-hydroxy-2-methyl-1-phenyl-propan-1-one is preferably contained.

[0372] When the filler layer (II) contains the mercaptan compound, the content ratio of the mercaptan compound with respect to the total mass of the filler layer (II) is preferably 0.5 to 10.0 mass%, more preferably 0.6 to 9.0 mass%, and further preferably 0.7 to 8.0 mass%. As the mercaptan compound, pentaerythritol tetra(3-mercaptobutyrate) is preferable.

[0373] <Method for producing filler layer-forming composition>

[0374] The filler layer-forming composition (I), (II), and the like can be obtained by blending the respective components used for constituting these compositions.

[0375] The order of addition of the respective components at the time of blending is not particularly limited, and two or more components can be added at the same time.

[0376] When a solvent is used, the blending component other than the solvent can be used by being previously diluted by mixing the solvent therewith, or the blending component other than the solvent can be used without being previously diluted, by mixing the solvent therewith.

[0377] The method of mixing the respective components at the time of blending is not particularly limited, and can be appropriately selected from the following publicly known methods: a method of mixing by rotating a stirrer or a stirring blade, or the like; a method of mixing by using a mixer; a method of mixing by applying ultrasonic waves; and the like.

[0378] The temperature and the time at the time of adding and mixing the respective components are not particularly limited as long as the respective blending components are not deteriorated, and can be appropriately adjusted, but the temperature is preferably 15 to 30°C.

[0379] ◎Substrate

[0380] The substrate is in a sheet or film shape, and as the material constituting the substrate, various resins can be exemplified.

[0381] As the resin, for example, low-density polyethylene (also referred to as LDPE), linear low-density polyethylene (also referred to as LLDPE), high-density polyethylene (also referred to as HDPE), and the like polyethylenes; polypropylene, polybutylene, polybutadiene, polymethylpentene, norbornene resin, and the like polyolefins other than polyethylenes; ethylene-vinyl acetate copolymer (also referred to as EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic ester copolymer, ethylene-norbornene copolymer, and the like ethylene-based copolymers (i.e., copolymers obtained using ethylene as a monomer); polyvinyl chloride, vinyl chloride copolymer, and the like vinyl chloride-based resins (i.e., resins obtained using vinyl chloride as a monomer); polystyrene; polycycloolefin; polyethylene terephthalate (also referred to as PET), polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene 2,6-naphthalate, all-aromatic polyester having an aromatic ring group as a structural unit, and the like polyesters; copolymer of two or more of the polyesters; poly(meth)acrylate; polyurethane; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; modified polyphenylene ether; polyphenylene sulfide; polysulfone; polyether ketone; and the like can be exemplified.

[0382] Further, as the resin, for example, a mixture of the polyesters and a resin other than the polyesters, and the like polymer alloy can also be exemplified. As the polymer alloy of the polyesters and a resin other than the polyesters, the amount of the resin other than the polyesters is preferably small.

[0383] Further, as the resin, for example, a crosslinked resin crosslinked by one or two or more of the resins exemplified above; a modified resin such as an ionomer using one or two or more of the resins exemplified above can also be exemplified.

[0384] The resin constituting the base material can be only one, or two or more, and the combination and ratio thereof can be arbitrarily selected.

[0385] The base material can be only one layer (single layer), or two or more layers, and when it is two or more layers, the layers can be the same as or different from each other, and the combination of the layers is not particularly limited.

[0386] The thickness of the base material is preferably 5 to 1000 μm, more preferably 10 to 500 μm, further preferably 15 to 300 μm, and particularly preferably 20 to 150 μm.

[0387] Here, the "thickness of the base material" refers to the thickness of the entire base material, and for example, the thickness of a base material composed of a plurality of layers refers to the total thickness of all the layers constituting the base material.

[0388] The base material is preferably a base material having high accuracy in thickness, that is, a base material in which the thickness of any part can be inhibited from deviating. Among the above-mentioned constituent materials, as a material that can be used to constitute the base material having high accuracy in thickness, for example, polyethylene, a polyolefin other than polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer (EVA), and the like can be listed.

[0389] In addition to the above-mentioned resin and the like as the main constituent material, the base material can contain various additives such as a filler, a colorant, an antistatic agent, an antioxidant, an organic lubricant, a catalyst, a softening agent (plasticizer), and the like.

[0390] The Young's modulus of the base material is preferably 100 to 2000 MPa, more preferably 150 to 1500 MPa, and further preferably 200 to 1000 MPa. If the Young's modulus of the base material is equal to or higher than the lower limit value of the above-mentioned range, the dimensional stability can be ensured when the electromagnetic wave shielding film is formed. If the Young's modulus of the base material is equal to or lower than the upper limit value of the above-mentioned range, the stretchability of the terminal protection tape can be improved.

[0391] The Young's modulus of the base material can be measured by the method described in the Examples described later.

[0392] The elongation at break of the base material is preferably 50 to 2000%, more preferably 70 to 1600%, and further preferably 90 to 1200%. If the elongation at break of the base material is within the above-mentioned range, the terminal protection tape can be stretched by the method of grabbing the outer peripheral part of the terminal protection tape using a holding member and the like and pulling it (biaxial stretching) described in <Stretching Method 1 of Terminal Protection Tape> described later and the method using a ring-shaped frame described in <Stretching Method 2 of Terminal Protection Tape>.

[0393] The elongation at break of the base material can be measured by the method described in the Examples described later.

[0394] The stress at break of the base material is preferably 10 to 300 MPa, more preferably 20 to 250 MPa, and further preferably 30 to 200 MPa. If the stress at break of the base material is within the above-mentioned range, the terminal protection tape can be stretched by the method of grabbing the outer peripheral part of the terminal protection tape using a holding member and the like and pulling it (biaxial stretching) described in <Stretching Method 1 of Terminal Protection Tape> described later and the method using a ring-shaped frame described in <Stretching Method 2 of Terminal Protection Tape>.

[0395] The stress at break of the base material can be measured by the method described in the Examples described later.

[0396] The base material can be transparent, can be opaque, can be colored according to the purpose, and can be vapor-deposited with other layers.

[0397] When the viscoelastic layer is energy ray-curable, the substrate is preferably transmissive to the energy ray.

[0398] The substrate can be manufactured by a publicly known method. For example, the substrate containing the resin can be manufactured by molding a resin composition containing the resin.

[0399] ◎ Release Film

[0400] The release film can be a publicly known release film.

[0401] As the preferred release film, for example, a release film in which at least one surface of a resin film made of polyethylene terephthalate or the like is subjected to release treatment using silicone treatment or the like; a release film in which at least one surface of the film is a release surface composed of a polyolefin; and the like can be exemplified.

[0402] The thickness of the release film is preferably the same as the thickness of the substrate.

[0403] ◎ Second Adhesive Layer

[0404] The second adhesive layer (i.e., the adhering adhesive layer) is an adhesive layer for adhering the terminal protection tape of the present embodiment to a support.

[0405] The second adhesive layer can be a publicly known adhesive layer, and can be appropriately selected from the adhesive layers described above with respect to the first adhesive layer.

[0406] The second adhesive composition used for forming the second adhesive layer is the same as the first adhesive composition, and the method for producing the second adhesive composition is the same as the method for producing the first adhesive composition.

[0407] Method for Manufacturing Terminal Protection Tape

[0408] The terminal protection tape can be manufactured by sequentially stacking the above-described layers and forming the corresponding positional relationship. The method for forming each layer is as described above.

[0409] For example, the above-described composition for forming the burying layer is applied to the release-treated surface of a release film, and dried as necessary, thereby stacking the burying layer. The above-described first adhesive composition is applied to the release-treated surface of another release film, and dried as necessary, thereby stacking the first adhesive layer. By adhering the burying layer on the release film to the first adhesive layer on the other release film, a terminal protection tape in which a release film, a burying layer, a first adhesive layer, and a release film are sequentially stacked is obtained. The release film is removed when the terminal protection tape is used.

[0410] Alternatively, a terminal protection tape can be produced by the following method, in which the embedding layer and the first adhesive layer are sequentially laminated on the base material in the thickness direction thereof.

[0411] For example, by peeling off the release film on the embedding layer side of the terminal protection tape in which the release film, embedding layer, first adhesive layer, and release film are sequentially laminated, and then laminating the release film to a substrate, a terminal protection tape in which the embedding layer, first adhesive layer, and release film are sequentially laminated on the substrate can be obtained. The release film can be removed when the terminal protection tape is used.

[0412] <Method 1 for manufacturing a semiconductor device with an electromagnetic wave shielding film>

[0413] A method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to one embodiment of the present invention includes: a step of embedding the terminals of the semiconductor device with terminals in the viscoelastic layer of a terminal protection tape having a viscoelastic layer; a step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the terminal protection tape; and a step of stretching the terminal protection tape to peel off the semiconductor device with terminals on which the electromagnetic wave shielding film is formed from the terminal protection tape. Figure 5 A method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to this embodiment will be described.

[0414] Figure 5 This is a cross-sectional view schematically showing a method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present embodiment. In the method for manufacturing a semiconductor device with an electromagnetic wave shielding film, a terminal protection tape 3 having an adhesive layer 14, a filling layer 13, and a base material 11 in this order is provided. Figure 4 The method shown is fixed to the support body 30.

[0415] First, if Figure 5 As shown in (a) and (b), the semiconductor device 65 with terminals is pressed onto the viscoelastic layer 12 of the terminal protection tape with the terminal 91 side, i.e., the terminal forming surface 63a of the circuit substrate 63, facing downward, thereby burying the terminal 91 in the viscoelastic layer 12.

[0416] At this point, terminals 91 of semiconductor device 65 with terminals are brought into contact with viscoelastic layer 12, and semiconductor device 65 with terminals is pressed against the terminal protection tape. This causes the outermost surface of viscoelastic layer 12, on the adhesive layer 14 side, to be press-bonded sequentially with the surface of terminals 91 and terminal-forming surface 63a of circuit board 63. At this point, viscoelastic layer 12 is heated to soften, extending between terminals 91 to cover them. While closely adhering to terminal-forming surface 63a, it covers the surface of terminals 91, particularly the area near terminal-forming surface 63a, thereby embedding terminals 91.

[0417] As a method for press-bonding the semiconductor device 65 with terminals to the terminal protection tape, a known method of pressing various sheets onto an object and attaching them can be appropriately adopted, and examples thereof include a method using a laminating roll or a vacuum laminator.

[0418] The pressure applied when pressing the semiconductor device 65 with terminals against the terminal protection tape is not particularly limited, but is preferably 0.1 to 1.5 MPa, more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. Furthermore, the first adhesive layer 14 of the viscoelastic layer 12 is preferably bonded to the terminal-forming surface 63a.

[0419] During the process of embedding the terminals of a semiconductor device with terminals in the viscoelastic layer 12 of the terminal protection tape, the elastic modulus of the embedding layer 13 is preferably 0.05 to 20 MPa, more preferably 0.07 to 18 MPa, and even more preferably 0.09 to 16 MPa. When the elastic modulus is within this range, embedding the semiconductor device with terminals in the terminal protection tape is facilitated.

[0420] The conductive resin 101 is applied to the exposed surface of the semiconductor device 65 with terminals which is not embedded in the viscoelastic layer 12 of the terminal protection tape ( Figure 5 (c)) is further thermally cured to form an electromagnetic wave shielding film 10 ( Figure 5 (d) As a method for forming the electromagnetic shielding film 10 by coating with a conductive material, a method such as sputtering, ion plating, and spraying can be used.

[0421] The adhesion of the terminal protection tape 3 to the semiconductor device 65 with terminals after the process of burying the semiconductor device 65 with terminals and before the process of forming the electromagnetic wave shielding film is preferably 1.0 to 6.5 N / 25 mm, more preferably 1.1 to 6.0 N / 25 mm, and further preferably 1.2 to 5.5 N / 25 mm.

[0422] If the adhesion force is within the range, the peelability in the process of peeling the semiconductor device with the terminal formed with the electromagnetic wave shielding film from the terminal-protecting tape is enhanced. The method of measuring the adhesion force is described in detail in the examples.

[0423] By stretching the terminal-protecting tape 3, the area of adhesion between the semiconductor device with the terminal formed with the electromagnetic wave shielding film and the viscoelastic layer 12 is reduced, and thus the semiconductor device with the terminal formed with the electromagnetic wave shielding film is peeled from the terminal-protecting tape 3 (e) of (f). Figure 5 At the time of peeling, it is preferable to pick up the buried terminal from the upper side of the terminal-protecting tape 3 by using a pin or the like from the side of the base material 11 of the terminal-protecting tape 3.

[0424] The height u1 of the pick-up at the time of picking up is preferably higher than the height hi of the terminal 91, and is preferably 2.0 ≤ u1 / h1 ≤ 10.

[0425] In the present specification, the "height of the terminal" means the height of the highest position of the terminal from the surface on which the terminal is formed.

[0426] The stretching amount at the time of stretching the above terminal-protecting tape is preferably 1.0 mm or more, more preferably 2.0 mm or more, and further preferably 3.0 mm or more. If the stretching amount is the lower limit value or more, the area of adhesion between the semiconductor device with the terminal formed with the electromagnetic wave shielding film and the viscoelastic layer 12 is sufficiently reduced, and thus the semiconductor device with the terminal formed with the electromagnetic wave shielding film is easily peeled from the terminal-protecting tape 3. The upper limit value of the stretching amount is not particularly limited as long as the effect of the present application is exhibited, and for example, can be 20.0 mm or less. The stretching amount is preferably, for example, 1.0 mm or more and 19.0 mm or less, more preferably 2.0 mm or more and 18.0 mm or less, and further preferably 3.0 mm or more and 17.0 mm or less.

[0427] In the present specification, the "stretching amount" means the length of the terminal-protecting tape in the stretching direction after stretching - the length of the terminal-protecting tape in the stretching direction before stretching. When the terminal-protecting tape is stretched in a plurality of directions, the stretching amount in the direction in which the stretching amount is the largest can be used.

[0428] Thus, by picking up the semiconductor device 66 with the electromagnetic wave shielding film from the terminal-protecting tape 3 having the viscoelastic layer 12, the semiconductor device 65 with the terminal covered with the electromagnetic wave shielding film 10 can be taken out (f) of (e). Figure 5

[0429] ​When either or both of the filling layer 13 and the adhesive layer 14 is energy ray-curable, it is preferable to perform curing before the step of burying the terminal of the semiconductor device with a terminal in the viscoelastic layer 12 of the terminal-protecting tape, or after the step of burying the terminal of the semiconductor device with a terminal in the viscoelastic layer 12 of the terminal-protecting tape and before the step of forming the electromagnetic wave shielding film on the exposed surface of the semiconductor device with a terminal that is not buried in the viscoelastic layer 12 of the terminal-protecting tape.

[0430] In Figure 5 In the method of manufacturing the semiconductor device with an electromagnetic wave shielding film illustrated in FIG. 6, the semiconductor device with a terminal 65 that is the object of shielding electromagnetic waves can be a semiconductor device with a terminal 65 that is manufactured separately, or a semiconductor device with a terminal 65 that is singulated by a cutting method.

[0431] In the method of manufacturing the semiconductor device with an electromagnetic wave shielding film illustrated in FIG. 6, the semiconductor device with a terminal 65 that is the object of shielding electromagnetic waves can be a semiconductor device with a terminal 65 that is manufactured separately, or a semiconductor device with a terminal 65 that is singulated by a cutting method. Figure 5 In the method of manufacturing the semiconductor device with an electromagnetic wave shielding film illustrated in FIG. 6, the semiconductor device with a terminal 65 that is the object of shielding electromagnetic waves can be a semiconductor device with a terminal 65 that is manufactured separately, or a semiconductor device with a terminal 65 that is singulated by a cutting method.

[0432] <Method of manufacturing semiconductor device with electromagnetic wave shielding film 2>

[0433] The method of manufacturing the semiconductor device with an electromagnetic wave shielding film according to another embodiment of the present application includes a step of burying a terminal of a semiconductor device assembly in a viscoelastic layer of a terminal-protecting tape having the viscoelastic layer; a step of cutting the semiconductor device assembly with a terminal, and making the semiconductor device assembly with a terminal in which the terminal is buried in the viscoelastic layer of the terminal-protecting tape; a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with a terminal that is not buried in the viscoelastic layer of the terminal-protecting tape; and a step of stretching the terminal-protecting tape, and thereby peeling the semiconductor device with an electromagnetic wave shielding film from the terminal-protecting tape. Hereinafter, the method of manufacturing the semiconductor device with an electromagnetic wave shielding film according to this embodiment will be described with reference to FIG. 7. Figure 6 The method of manufacturing the semiconductor device with an electromagnetic wave shielding film according to this embodiment will be described.

[0434] Figure 6 To schematically show a cross-sectional view of the method of manufacturing the semiconductor device with an electromagnetic wave shielding film according to this embodiment, in the method of manufacturing the semiconductor device with an electromagnetic wave shielding film, the terminal-protecting tape 3 having the adhesive layer 14, the filling layer 13, and the substrate 11 in this order is used to bury the terminal of the semiconductor device assembly 6 with a terminal in the viscoelastic layer of the terminal-protecting tape 3. Figure 4The method shown is fixed to the support body 30.

[0435] First, if Figure 6 As shown in (a) and (b), the semiconductor device assembly 6 with terminals connected via the circuit substrate 63 is pressed onto the viscoelastic layer 12 of the terminal protection tape with the terminal 91 side, i.e., the terminal forming surface 63a of the circuit substrate 63, facing downward. Figure 5 Similarly to (a) and (b), the terminal 91 is embedded in the viscoelastic layer 12 .

[0436] At this time, while applying pressure to the semiconductor device assembly 6 with terminals from the upper side, Figure 5 In the same manner as in (a) and (b), the terminal 91 is embedded in the viscoelastic layer 12 of the terminal protection tape.

[0437] Furthermore, by heating the viscoelastic layer 12 while laminating, the viscoelastic layer 12 can be softened, allowing the viscoelastic layer 12 to adhere closely to the terminal-forming surface 63a of the circuit board 63. The pressure applied when the semiconductor device assembly 6 with terminals is pressed against the terminal protection tape is not particularly limited, but is preferably 0.1 to 1.5 MPa, more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. Furthermore, the first adhesive layer 14 of the viscoelastic layer 12 is preferably laminated to the terminal-forming surface 63a.

[0438] Next, the semiconductor device assembly 6 with terminals is cut to produce semiconductor devices 65 with terminals ( Figure 6 (c)). The terminal protection tape of the present invention used in the process of forming the electromagnetic wave shielding film can also be used as a dicing tape for the semiconductor device assembly 6 with terminals. Figure 5 In the method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown in FIG, when the semiconductor device with terminals 65 to be shielded from electromagnetic waves is singulated by dicing, it is necessary to pick up the semiconductor device with terminals on the dicing tape and replace the terminal protection tape affixed thereto ( Figure 5 (a)), but in Figure 6 In the method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown, the operation of replacing the semiconductor device with terminals 65 on the dicing tape with the terminal protection tape can be omitted.

[0439] The conductive resin 101 is applied to the exposed surface of the semiconductor device 65 with terminals which is not embedded in the viscoelastic layer 12 of the terminal protection tape. Figure 6(d)). At this time, when the conductive resin 101 at the boundary portion of the semiconductor device 65 of each of the tape-terminated semiconductor device assemblies 6 is not sufficiently separated, an extension device or the like can be used to stretch the terminal protection tape. It is also possible to singulate the tape-terminated semiconductor devices 65 while the conductive resin 101 is applied to the side surfaces of each of the singulated tape-terminated semiconductor devices 65. Further, the conductive resin 101 applied to the top surface and the side surfaces of the singulated tape-terminated semiconductor devices 65 is heated to cure, thereby forming the electromagnetic wave shielding film 10 composed of a conductive material on the exposed surface of the tape-terminated semiconductor device 65 that is not buried in the viscoelastic layer 12 of the terminal protection tape Figure 6 (e)). It is also possible to directly sputter a conductive material to the tape-terminated semiconductor devices 65 Figure 6 (c)) to form the electromagnetic wave shielding film 10 Figure 6 (e)).

[0440] By stretching the terminal protection tape 3, the area of adhesion between the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed and the viscoelastic layer 12 can be reduced, thereby peeling the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed from the terminal protection tape 3 Figure 6 (f)). At the time of peeling, it is preferable to pick up the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed by pushing up the base material 11 of the terminal protection tape 3 from the side of the base material 11.

[0441] By picking up the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed from the terminal protection tape having the viscoelastic layer 12, the tape-terminated semiconductor device 65 covered with the electromagnetic wave shielding film 10 can be taken out Figure 6 (g)).

[0442] When either or both of the fill layer 13 and the adhesive layer 14 are energy ray-curable, it is preferable to perform curing before the step of burying the terminals of the tape-terminated semiconductor assembly in the viscoelastic layer 12 of the terminal protection tape or after the step of burying the terminals of the tape-terminated semiconductor assembly in the viscoelastic layer 12 of the terminal protection tape and before the step of singulation.

[0443] The method of stretching the terminal protection tape 3 in the process of the above-described manufacturing method 1 of the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed and the manufacturing method 2 of the tape-terminated semiconductor device on which the electromagnetic wave shielding film is formed Figure 5 (e), Figure 6 (f)) is not particularly limited, and, for example, the following two methods can be listed.

[0444] <Method 1 of Stretching the Terminal Protection Tape>

[0445] The stretching method of the terminal protection tape according to the present embodiment is a method in which the outer peripheral portion of the terminal protection tape is gripped by a gripping member or the like and pulled.

[0446] In the present embodiment, the terminal protection tape is preferably stretched by at least biaxial stretching.

[0447] At this time, the terminal protection tape is pulled by applying tension to four directions, for example, the +X-axis direction, -X-axis direction, +Y-axis direction, and -Y-axis direction in the X-axis and Y-axis directions that are perpendicular to each other.

[0448] The biaxial stretching can be performed using, for example, a separation device that applies tension to the X-axis and Y-axis directions. In this case, the X-axis and Y-axis are set to be perpendicular to each other, one of the directions parallel to the X-axis direction is set to be the +X-axis direction, and the direction opposite to the +X-axis direction is set to be the -X-axis direction. Also, one of the directions parallel to the Y-axis direction is set to be the +Y-axis direction, and the direction opposite to the +Y-axis direction is set to be the -Y-axis direction.

[0449] The separation device applies tension to the terminal protection tape in the four directions of the +X-axis direction, -X-axis direction, +Y-axis direction, and -Y-axis direction, and preferably has a plurality of holding devices and a plurality of tension applying devices corresponding to the holding devices for each of the four directions. The number of holding devices and tension applying devices in each direction depends on the size of the terminal protection tape, but can be, for example, 3 or more and 10 or less.

[0450] Stretching method 2 of terminal protection tape

[0451] The stretching method of the terminal protection tape according to the present embodiment is a method in which the outer peripheral portion of the terminal protection tape is gripped by a gripping member or the like and pulled.

[0452] Reference Figure 7 Examples of the stretching method of the terminal protection tape according to the present embodiment will be described. In the present embodiment, the viscoelastic layer 12 is attached to the annular frame 17 via the third adhesive layer 16.

[0453] The third adhesive layer can be any publicly known adhesive layer, and can be appropriately selected from the adhesive layers described above for the first adhesive layer and second adhesive layer, depending on the material of the annular frame 17.

[0454] The third adhesive composition used to form the third adhesive layer is the same as the first adhesive composition and second adhesive composition, and the method of producing the third adhesive composition is the same as the method of producing the first adhesive composition and second adhesive composition.

[0455] Thus, the cylindrical expander 18 is pushed from the substrate 11 side and is lifted upward to fix the terminal protection tape of which the outer peripheral portion is in a ring frame, whereby the terminal protection tape is pulled.

[0456] In the terminal protection tape of the present application, the height h0 of the terminal 91 is preferably less than the thickness d1 of the viscoelastic layer 12, and 1.2 ≤ d1 / h0 ≤ 5.0 is preferable. Specifically, the height of the terminal 91 is preferably 20 to 300 μm, more preferably 30 to 270 μm, and particularly preferably 40 to 240 μm. By making the height of the terminal 91 be the lower limit value or more, the function of the terminal 91 can be further improved. Further, by making the height of the terminal 91 be the upper limit value or less, the effect of suppressing the viscoelastic layer 12 from remaining on the upper portion of the terminal 91 becomes higher.

[0457] In the present specification, the "height of the terminal" refers to the height of the portion of the terminal that is in the highest position from the terminal formation surface. When the semiconductor device assembly with terminals and the semiconductor device 65 with terminals have a plurality of terminals 91, the height h0 of the terminal 91 can be set to the average value thereof. The height of the terminal can be measured using, for example, a non-contact three-dimensional optical interference type surface roughness tester (manufactured by Veeco Instruments Inc., product name: Wyko NT1100).

[0458] The width of the terminal 91 is not particularly limited, and is preferably 170 to 350 μm, more preferably 200 to 320 μm, and particularly preferably 230 to 290 μm. By making the width of the terminal 91 be the lower limit value or more, the function of the terminal 91 can be further improved. Further, by making the width of the terminal 91 be the upper limit value or less, the effect of suppressing the viscoelastic layer 12 from remaining on the upper portion of the terminal 91 becomes higher.

[0459] In the present specification, the "width of the terminal" refers to the maximum value of the line segment obtained by connecting different two points on the terminal surface in a straight line when the terminal is viewed downward from the direction perpendicular to the terminal formation surface. When the terminal is spherical or hemispherical, the "width of the terminal" refers to the maximum diameter (terminal diameter) of the terminal when the terminal is viewed downward.

[0460] The distance between the adjacent terminals 91 (i.e., the terminal pitch) is not particularly limited, and is preferably 250 to 800 μm, more preferably 300 to 600 μm, and particularly preferably 350 to 500 μm. By making the distance be the lower limit value or more, the burying property of the terminal 91 can be further improved. Further, by making the distance be the upper limit value or less, the effect of suppressing the viscoelastic layer 12 from remaining on the upper portion of the terminal 91 becomes higher.

[0461] Further, in the present specification, the "distance between adjacent terminals" means the minimum value of the distance between the surfaces of the adjacent terminals.

[0462] Embodiments

[0463] Hereinafter, the present application will be described in more detail by specific embodiments. However, the present application is not limited by the following embodiments.

[0464] Method for measuring physical properties

[0465] The Young's modulus of the substrate, the amount of bubbles when embedding the terminal in the viscoelastic layer of the terminal protection tape, the adhesion of the terminal protection tape to the semiconductor device with the terminal, the elastic modulus of the first adhesive layer and the landfill layer, the breaking stress of the substrate and the terminal protection tape, and the breaking elongation of the substrate and the terminal protection tape were measured by the following methods.

[0466] (Young's modulus of the substrate)

[0467] The tensile elastic modulus of the substrate at 23°C was measured according to JIS K7161:2014 and was set as the Young's modulus. At the time of measurement, the width of the substrate was set to 15 mm, the distance between the clamps was set to 10 mm, and the tensile speed was set to 50 mm / minute.

[0468] (Amount of bubbles when embedding the terminal in the viscoelastic layer of the terminal protection tape)

[0469] A terminal with a diameter of 0.25 mm was embedded in the viscoelastic layer of the terminal protection tape. The diameter of the circular gap generated outside the terminal was measured from the substrate side using a digital optical microscope (manufactured by KEYENCE CORPORATION, product name "VHX-1000"). In addition, this measurement was performed when peeling after irradiating ultraviolet rays in the evaluation of the peelability described later. That is, when the terminal protection tape was stretched at the time of peeling, the terminal protection tape after stretching was measured.

[0470] (Adhesion of the terminal protection tape to the semiconductor device with the terminal)

[0471] It was measured according to JIS Z0237:2009 as follows. The terminal protection tape was cut to a width of 25 mm and a length of 250 mm, and the release sheet was peeled off, and the exposed adhesive layer was attached to the semiconductor device as the adherend using a 2 kg rubber roll in an environment of 23°C, 50% RH, and was left for 24 hours in the same environment. Furthermore, after ultraviolet irradiation (irradiance 230 mW / cm 2 , light amount 190 mJ / cm 2After that, a terminal protection tape was peeled from the semiconductor device at a peeling angle of 180° and a peeling speed of 300 mm / min using a universal tensile tester (manufactured by ORIENTEC CORPORATION, product name "TENSILON UTM-4-100"), whereby the adhesive force was measured.

[0472] (Elastic modulus of first adhesive layer and landfill layer)

[0473] A sample having a diameter of 8 mm and a thickness of 3 mm was measured using a viscoelasticity measuring device (manufactured by Rheometrics, device name "DYNAMIC ANALYZER RDAII") by a torsion shear method at 1 Hz and 23°C.

[0474] (Breaking stress and breaking elongation of substrate and terminal protection tape)

[0475] A sample having a width of 10 mm and a length of 75 mm was cut out from the substrate or terminal protection tape. The sample was mounted on a tensile tester (manufactured by ORIENTEC CORPORATION, product name "TENSILON") so that the sample measurement site had a width of 10 mm and a length of 25 mm (elongation direction), and the sample was stretched at a stretching speed of 200 mm / min using the tensile tester in an environment of 23°C and 50% RH. The elongation amount until the sample broke, the breaking elongation (%) and the breaking stress (MPa) were measured.

[0476] (Monomer)

[0477] The formal names of the monomers shown in the abbreviations are shown below.

[0478] HEA: 2-hydroxyethyl acrylate

[0479] BA: n-butyl acrylate

[0480] MMA: methyl methacrylate

[0481] AAc: acrylic acid

[0482] (Preparation of adhesive layer-forming composition A)

[0483] A solution (adhesive main agent, solid content 35 mass%) of a resin in which 2-methacryloyloxyethyl isocyanate (about 50 mol% with respect to HEA) was added to an acrylic copolymer composed of 74 mass parts of BA, 20 mass parts of MMA, and 6 mass parts of HEA was prepared. To 100 mass parts of the adhesive main agent, 3 mass parts of 1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Corporation, product name "IRGACURE 184", solid content concentration 100%) as a photopolymerization initiator, 0.5 mass parts of toluene-2,6-diisocyanate (manufactured by TOYO CHEM CO., LTD., product name "BHS 8515", solid content concentration: 37.5%) as a crosslinking agent were added, and stirred for 30 minutes, whereby an adhesive layer-forming composition A was prepared.

[0484] (Manufacture of Adhesive Layer A)

[0485] On a release-treated surface of a release film (manufactured by LINTEC Corporation, "SP-PET381031", thickness 38 μm) in which one surface of a polyethylene terephthalate film was subjected to release treatment by silicone treatment, the adhesive layer-forming composition A was applied, and heated and dried at 100°C for 1 minute, whereby an adhesive layer A having a thickness of 10 μm and 20 μm, respectively, was manufactured.

[0486] The elastic modulus of the adhesive layer A before energy ray curing was 0.05 MPa, and the elastic modulus after curing was 24 MPa.

[0487] (Preparation of Backfill Layer-Forming Composition A)

[0488] A solution of 100 parts by mass of an acrylic copolymer composed of 91 parts by mass of BA, 9 parts by mass of AAc (weight average molecular weight (Mw) 400,000, adhesive base, solid content concentration 33.6%, manufactured by NIPPON CARBIDE INDUSTRIES CO., INC., product name "Nissetsu PE-121"), 93.5 parts by mass of a resin solution (weight average molecular weight (Mw) 100,000, adhesive base, solid content concentration 45%, manufactured by Nippon Chemical Industrial Co., Ltd., product name "COPONYL UN-2528LM1"), 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator (manufactured by BASF Corporation, product name "IRGACURE 184", solid content concentration 100%), 2.5 parts by mass of toluene-2,6-diisocyanate as a crosslinking agent (manufactured by TOYO CHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%), and 2.5 parts by mass of 1,3-bis(N,N-diglycidyl aminomethyl) cyclohexane as a crosslinking agent (manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., product name "TETRAD-C", solid content concentration: 5%) was stirred for 30 minutes to prepare a composition A for forming a land layer, wherein the resin was obtained by adding 2-methacryloyloxyethyl isocyanate to an acrylic copolymer formed of 62 parts by mass of BA, 10 parts by mass of MMA, and 28 parts by mass of HEA at an addition rate of 80 mol% relative to 100 mol% of HEA.

[0489] (Preparation of a composition B for forming a land layer)

[0490] A composition B for forming a land layer was prepared by blending 40 parts by mass of a monofunctional urethane acrylate, 45 parts by mass of isobornyl acrylate (IBXA), 15 parts by mass of 2-hydroxypropyl acrylate (HPA), 3.5 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (manufactured by SHOWA DENKO K.K., "KARENZ MT PE1", tetrafunctional secondary thiol compound, solid content concentration 100 mass%), 1.8 parts by mass of a crosslinking agent, and 1.0 part by mass of 2-hydroxy-2-methyl-1-phenyl-propan-1-one as a photopolymerization initiator (manufactured by BASF Corporation, product name "Darocur 1173", solid content concentration 100 mass%).

[0491] (Substrate)

[0492] A polyethylene film having a thickness of 80 μm was used as a substrate A.

[0493] The Young's modulus of the substrate A was 340 MPa, the elongation at break was 950%, and the stress at break was 45 MPa.

[0494] (Preparation of semiconductor device with terminal)

[0495] In evaluating the peelability of the terminal-protective tape of the evaluation examples and the comparative examples, a semiconductor device with terminal was prepared as follows.

[0496] • Semiconductor device with terminal

[0497] Size of semiconductor device: 10 mm x 10 mm

[0498] Height of terminal: 250 μm

[0499] Diameter of terminal: 250 μm

[0500] Pitch of terminal: 400 μm

[0501] Number of terminals: 10 x 10 = 100

[0502] <Evaluation of peelability>

[0503] The terminal side of the semiconductor device with terminal was made to face downward, and was laminated to the terminal-protective tape under a press pressure (load 1.1 MPa), a press time of 40 s, and a heating time of 50°C. Then, after standing at normal temperature for 24 hours, ultraviolet irradiation (intensity 230 mW / cm 2 , light amount 190 mJ / cm 2 ) was performed, and the terminal-protective tape was stretched as necessary, and was picked up, and whether or not the terminal-protective tape could be peeled from the semiconductor device was evaluated. For the evaluation results, O was set as peelable, and X was set as non-peelable.

[0504] [Example 1]

[0505] The burying layer-forming composition A was applied to the release-treated surface of a release film (manufactured by LINTEC Corporation, "SP-PET381031", thickness 38 μm) on which one surface of a polyethylene terephthalate film was subjected to release treatment by silicone treatment, and after heating and drying at 100°C for 1 minute, the release-treated surface of a release film (manufactured by LINTEC Corporation, "SP-PET382150", thickness 38 μm) on which one surface of a polyethylene terephthalate film was subjected to release treatment by silicone treatment was laminated on the burying layer-forming composition A, thereby producing a burying layer having a thickness of 50 μm.

[0506] The release film laminated on the filler layer was peeled off, and the thus obtained surfaces were adhered to each other, thereby producing a filler layer having a thickness of 100 μm. The filler layers were adhered and laminated in the same manner, thereby producing a filler layer A having a thickness of 300 μm.

[0507] The elastic modulus of the filler layer A before energy ray curing was 0.06 MPa, and the elastic modulus after curing was 65 MPa.

[0508] The filler layer A having a thickness of 300 μm was adhered to the adhesive layer A having a thickness of 10 μm. Further, the release film on the filler layer A side was peeled off, and adhered to the easy-adhesion treated side of the base material A, thereby producing a terminal-protecting tape 1 having a form of base material 11 / filler layer 13 / adhesive layer 14 as shown in Figure 2 The constitution and properties of the terminal-protecting tape 1 are shown in Tables 1 and 2 (the same hereinafter).

[0509] The terminal-protecting tape 1 was used to evaluate the peelability. The peeling conditions and the evaluation results are shown in Table 3.

[0510] [Example 2]

[0511] The terminal-protecting tape 2 was produced in the same manner as in the production example, except that the adhesive layer A having a thickness of 20 μm was used instead of the adhesive layer A having a thickness of 10 μm.

[0512] The terminal-protecting tape 2 was used to evaluate the peelability. The peeling conditions and the evaluation results are shown in Table 3.

[0513] [Example 3]

[0514] The filler layer-forming composition A was applied to the release-treated surface of a release film (LINTEC Corporation, "SP-PET381031", thickness 38 μm) on which one surface of a polyethylene terephthalate film was subjected to release treatment by silicone treatment, by fountain die coating (fountain die) to obtain a coated film.

[0515] The coated film was irradiated with ultraviolet rays to form a semi-cured layer. As the ultraviolet irradiation device, a conveyer belt type ultraviolet irradiation device (EYE GRAPHICS CO., LTD., product name "ECS-401GGX") was used, and as the ultraviolet source, a high-pressure mercury lamp (EYE GRAPHICS CO., LTD., product name "H04-L41") was used. The irradiation conditions were as follows: light wavelength, 365 nm; illuminance, 112 mW / cm 2 ; light amount, 117 mJ / cm 2(Ultraviolet irradiation was performed under the irradiation conditions shown in Table 1.)

[0516] A base material A was laminated on the formed semi-cured layer, and further ultraviolet irradiation was performed (using the ultraviolet irradiation device described above, an ultraviolet source, and the irradiation conditions of illuminance 271 mW / cm 2 , light quantity 1,200 mJ / cm 2 ), so that the landfill layer-forming composition B was completely cured, thereby forming a landfill layer B having a thickness of 300 μm on the base material A, and obtaining a laminate of the base material A and the landfill layer B.

[0517] A release film was peeled off, and an adhesive layer A having a thickness of 10 μm was attached to the surface on the opposite side of the base material A from the landfill layer B, thereby manufacturing a terminal-protecting tape 3 in the form of a base material 11 / landfill layer 13 / adhesive layer 14 as shown in Figure 2 .

[0518] The terminal-protecting tape 3 was used to evaluate the peelability. The peeling conditions and the evaluation results are shown in Table 3.

[0519] [Comparative Example 1]

[0520] The terminal-protecting tape 1 was used to evaluate the peelability. The peeling conditions and the evaluation results are shown in Table 3.

[0521] [Table 1]

[0522]

[0523] [Table 2]

[0524]

[0525] [Table 3]

[0526]

[0527] From the results shown in Table 3, it was confirmed that the manufacturing method of the semiconductor device with the electromagnetic wave shielding film of the present application is easy to peel in the process of peeling the semiconductor device with a terminal formed with an electromagnetic wave shielding film from the terminal-protecting tape, and is high in manufacturing efficiency.

[0528] Industrial Applicability

[0529] The manufacturing method of the semiconductor device with the electromagnetic wave shielding film according to the present application can shield electromagnetic waves for a semiconductor device with a terminal, and can manufacture a semiconductor device with an electromagnetic wave shielding film.

[0530] Explanation of Reference Numerals

[0531] 1, 2, 3: adhesive tape for terminal protection; 10: electromagnetic wave shielding film; 11: base material; 12: viscoelastic layer; 13: embedding layer; 14: adhesive layer; 15: second adhesive layer (adhering adhesive layer); 16: third adhesive layer; 17: annular frame; 18: extender; 30: support; 6: semiconductor device assembly with terminal; 60: semiconductor device assembly; 60a: terminal formation surface; 61, 62: electronic component; 63: circuit substrate; 63a: terminal formation surface; 64: sealing resin layer; 65: semiconductor device with terminal; 66: semiconductor device with electromagnetic wave shielding film; 91: terminal; 101: conductive resin; 20, 21, 22: release film.

Claims

1. A method of manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding a terminal of a semiconductor device with a terminal in a viscoelastic layer of a terminal-protective tape having the viscoelastic layer; a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with a terminal that is not embedded in the viscoelastic layer of the terminal-protective tape; and a step of stretching the terminal-protective tape to peel the semiconductor device with a terminal on which the electromagnetic wave shielding film is formed from the terminal-protective tape, wherein when a terminal with a diameter of 0.25 mm is embedded in the viscoelastic layer of the terminal-protective tape, a diameter of an approximately circular projection from a bubble that appears outside the embedded terminal, as viewed in a thickness direction of the terminal-protective tape, is 0.30 mm or more.

2. A method of manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding terminals of a semiconductor device assembly with terminals in a viscoelastic layer of a terminal-protective tape having the viscoelastic layer; a step of cutting the semiconductor device assembly with terminals to make a semiconductor device with a terminal embedded in the viscoelastic layer of the terminal-protective tape; a step of forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with a terminal that is not embedded in the viscoelastic layer of the terminal-protective tape; and a step of stretching the terminal-protective tape to peel the semiconductor device with a terminal on which the electromagnetic wave shielding film is formed from the terminal-protective tape, wherein when a terminal with a diameter of 0.25 mm is embedded in the viscoelastic layer of the terminal-protective tape, a diameter of an approximately circular projection from a bubble that appears outside the embedded terminal, as viewed in a thickness direction of the terminal-protective tape, is 0.30 mm or more.

3. The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 1 or 2, wherein a stretching amount of the terminal-protective tape in the step of peeling the semiconductor device with a terminal on which the electromagnetic wave shielding film is formed from the terminal-protective tape is 1.0 mm or more.

4. The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 1 or 2, wherein an adhesive force of the terminal-protective tape to the semiconductor device with a terminal after the step of embedding the terminal of the semiconductor device with a terminal and before the step of forming an electromagnetic wave shielding film is 6.5 N / 25 mm or less.

5. The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 1 or 2, wherein a ratio of a thickness dl of the viscoelastic layer to a height ho of the terminal of the semiconductor device with a terminal or the semiconductor device assembly with terminals satisfies 1.2 ≤ dl / hO ≤ 5.

0.

6. The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 1 or 2, wherein the viscoelastic layer has a backfill layer and an adhesive layer.

7. The method of manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 6, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The elastic modulus of the filling layer in the process of embedding the terminal of the semiconductor device with a terminal or the terminal of the semiconductor device assembly with a terminal in the viscoelastic layer of the adhesive tape for terminal protection is 0.05-20 MPa.

8. The method of producing a semiconductor device with an electromagnetic wave shielding film according to claim 6, wherein The adhesive layer, the filling layer, and the substrate are sequentially provided.

9. The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 8, wherein the Young's modulus of the substrate is 100-2000 MPa.

10. The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 6, wherein the filling layer is a filling layer formed using a constitution material that is energy ray-curable.

11. The method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to claim 6, wherein the adhesive layer is an adhesive layer formed using an adhesive that is energy ray-curable.

12. An adhesive tape for terminal protection used in the method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to any one of claims 4-11. ​ ​ ​

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