Smt component data management method, database, medium and apparatus

Abstract

The application provides an SMT component material data management method, a database, a medium and equipment. The SMT component material data management method comprises the following steps: obtaining a material parameter modification time and / or a packaging parameter modification time; generating a material modification analysis result and / or a packaging modification analysis result; marking invalid data in the SMT component database according to the material modification analysis result and / or the packaging modification analysis result, updating material parameters and / or packaging parameters of the invalid data; and updating the invalid data based on the updated material parameters and / or the packaging parameters. The application realizes dynamic management of SMT component material data by introducing time comparison and updating a series of related times.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of surface mount technology, in particular relates to a SMT component data management method, database, medium and equipment. BACKGROUND

[0002] At present, in the PCB (Printed Circuit Board) manufacturing industry, it is necessary to use a chip mounter to assemble components to the PCB board, and the chip mounter is driven by the SMT (Surface Mount Technology) mounting program to complete the mounting operation. The production efficiency of the product is directly affected by the production efficiency of the mounting program, and the accuracy of the mounting program also directly affects the quality of the product.

[0003] Because the PCB designers and SMT programmers belong to different departments, use different software, and refer to different standards, the same component package may not be the same. In the process of making the mounting program, the component coordinates and angles in the design file cannot be directly used as the mounting point coordinates and angles in the mounting program, but they need to be confirmed one by one according to the actual PCB pads. Therefore, the debugging process of the mounting program becomes repetitive and lengthy, which occupies a lot of production time and directly leads to low production efficiency of the mounting program.

[0004] The existing chip mounter equipment system uses the software provided by itself to program the mounting program, and relies on the component database of the machine. Each time the mounting program is debugged, the coordinates of the mounting points need to be adjusted repeatedly, or the angle of rotation needs to be adjusted. Different departments may modify the related data of the component database according to different situations. If the original experience is used to refer to the data, it will cause deviation of the mounting points, resulting in errors in mounting components, even damaging the PCB board and components, causing production accidents, and causing great loss to the production line.

[0005] Therefore, how to provide a SMT component data management method, database, medium and equipment to solve the problems of low production efficiency of the SMT mounting program and mounting errors caused by different data on both sides in the PCB mounting process of the prior art has become a technical problem to be solved by the technical personnel in the field. SUMMARY

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a SMT component data management method, database, medium and equipment to solve the problems of low production efficiency of the SMT mounting program and mounting errors caused by different data on both sides in the PCB mounting process of the prior art.

[0007] To achieve the above object and other related objects, one aspect of the present application provides a management method of SMT component data, comprising: obtaining material parameter modification time in a component material database and / or package parameter modification time in a pad package library; comparing the material parameter modification time with modification time of data corresponding to the material in an SMT component database to generate material modification analysis results; and / or comparing the package parameter modification time with modification time of data corresponding to the package in the SMT component database to generate package modification analysis results; marking invalid data in the SMT component database according to the material modification analysis results and / or the package modification analysis results, updating material parameters and / or package parameters of the invalid data; performing first verification on the invalid data based on the updated material parameters and / or package parameters; in response to that the invalid data passes the first verification, changing the marking state of the invalid data, and updating modification time of the invalid data by using the time when the invalid data passes the first verification; in response to that the invalid data fails to pass the first verification, adjusting compensation parameters of the invalid data, performing second verification on the invalid data until the invalid data passes the second verification, changing the marking state of the invalid data, and updating modification time of the invalid data by using the time when the invalid data passes the second verification.

[0008] To achieve the above object and other related objects, another aspect of the present application provides an SMT component database, comprising: a material parameter module containing material code, material image parameters, machine parameters and material parameter modification time; and a package parameter module containing package name, package graphic parameters and package parameter modification time, wherein the package graphic parameters are used to identify the shape characteristics of components.

[0009] To achieve the above object and other related objects, still another aspect of the present application provides a computer readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the management method of SMT component data.

[0010] To achieve the above object and other related objects, the last aspect of the present application provides an electronic device, comprising: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory to make the electronic device execute the management method of SMT component data.

[0011] As described above, the SMT component data management method, database, medium and device of the present application have the following beneficial effects:

[0012] (1)On the basis of the existing patch machine equipment element database, through the introduction of time comparison, a series of updates of related time, the dynamic management of SMT element data is realized. Through the addition of packaging parameters in PCB design, an innovative SMT element database is formed. When making a patch program, all parameters of the material code are obtained in the SMT element database, so as to ensure the accuracy of all elements under the package, and there is no need to manually confirm the accuracy of the mounting point one by one.

[0013] (2) After the compensation parameters are verified and stored in the SMT element database, the same PCB is encountered subsequently, and the compensation parameters can be directly used without repeated adjustment, which greatly improves the production efficiency of the patch program.

[0014] (3) For new materials, the element data of new materials can be quickly created by referring to the existing element data in the SMT element database. Through continuous expansion of the SMT element database, the maximum utilization of element data is realized.

[0015] (4) The system automatically checks whether the key parameters in the database are modified at regular intervals. If there is a modification, it is marked as invalid and cannot be used until it is confirmed and can be used, so as to avoid production accidents caused by different data. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A principle flowchart showing the SMT element data management method of the present application in an embodiment is shown.

[0017] Figure 2 A specific implementation flowchart showing the SMT element data management method of the present application in an embodiment is shown.

[0018] Figure 3 A data modification schematic diagram showing the SMT element data management method of the present application in an embodiment is shown.

[0019] Figure 4 An SMT element database data modification schematic diagram showing the SMT element data management method of the present application in an embodiment is shown.

[0020] Figure 5 An SMT element database compensation and verification modification time schematic diagram showing the SMT element data management method of the present application in an embodiment is shown.

[0021] Figure 6 A principle flowchart showing the pre-generated SMT element database in the present application in an embodiment is shown.

[0022] Figure 7A package data diagram in an embodiment of the management method of SMT component data of the present application.

[0023] Figure 8 A material data diagram in an embodiment of the management method of SMT component data of the present application.

[0024] Figure 9 A compensation diagram in an embodiment of the management method of SMT component data of the present application.

[0025] Figure 10 A compensation parameter calculation diagram in an embodiment of the management method of SMT component data of the present application.

[0026] Figure 11 A structure diagram in an embodiment of the SMT component database of the present application.

[0027] Figure 12 A structure schematic diagram in an embodiment of the SMT component database of the present application.

[0028] Figure 13 A data structure diagram in an embodiment of the SMT component database of the present application.

[0029] Figure 14 A structure connection diagram in an embodiment of the electronic device of the present application.

[0030] Component number explanation

[0031] 1 electronic device

[0032] 11 processor

[0033] 12 memory

[0034] 2 SMT component database

[0035] 21 material parameter module

[0036] 22 package parameter module

[0037] 23 compensation parameter module

[0038] 24 judgment comparison module

[0039] 25 failure mark module

[0040] 26 time record module

[0041] 27 compensation parameter calculation module

[0042] 28 data verification module

[0043] 29 Key Parameter Check Module

[0044] Steps S11 to S15

[0045] S61 Step Detailed Implementation

[0046] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Without departing from the spirit of the present invention, various details in this specification can be modified or changed based on different viewpoints and applications. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0047] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0048] Existing component databases lack standardized management and automatic checking mechanisms, posing a risk of security incidents due to data asynchrony. The SMT component data management method, database, media, and equipment described in this invention achieve dynamic management of SMT component data through the introduction of time comparison and a series of updates related to time.

[0049] The following will combine Figures 1 to 14 This embodiment details the principles and implementation of an SMT component data management method, database, medium, and device, enabling those skilled in the art to understand the SMT component data management method, database, medium, and device without creative effort.

[0050] In practical applications, the data in the two databases will change in the process that the SMT programmer maintains the component database of the SMT system (i.e. component material database) and the PCB designer maintains the pad package library of the EDA (Electronic Design Automation) software, and the material parameter modification time in the component database of the SMT system and the package parameter modification time in the pad package library of the EDA software are updated to the time when the data is modified. In the present application, the component database of the SMT system and the pad package library of the EDA software are obtained; the SMT component database is created according to the component database and the pad package library, and the management method of the SMT component data is applied to the SMT component database.

[0051] Please refer to Figure 1 , which shows the principle flowchart of the management method of the SMT component data in an embodiment of the present application. As shown in Figure 1 , the management method of the SMT component data specifically includes the following steps:

[0052] S11, obtaining the material parameter modification time in the component database and / or the package parameter modification time in the pad package library.

[0053] In an embodiment, the material parameter modification time in the component database and / or the package parameter modification time in the pad package library is obtained according to a timing check mechanism. The timing check mechanism refers to that the check frequency and check time node are set in advance to set the acquisition time in advance.

[0054] In another embodiment, the material related parameter information and / or the package related parameter information that are modified in the SMT component database can also be obtained according to an instant check mechanism. The instant check mechanism refers to that in the actual process, there is an instant check, and real-time acquisition is performed.

[0055] It should be noted that the present application can use any one of the timing check mechanism or the instant check mechanism, and the two mechanisms can also be used in combination.

[0056] S12, comparing the material parameter modification time with the modification time of the corresponding material data in the SMT component database to generate a material modification analysis result; and / or comparing the package parameter modification time with the modification time of the corresponding package data in the SMT component database to generate a package modification analysis result.

[0057] In one embodiment, it is judged whether the material parameter modification time is later than the modification time of the data in which the corresponding material in the SMT component database is located. If yes, it is determined that the data in which the corresponding material in the SMT component database is located is modified, and the corresponding material modification analysis result is generated. If no, no processing is performed. Furthermore, it is judged whether the packaging parameter modification time is later than the modification time of the data in which the corresponding packaging in the SMT component database is located. If yes, it is determined that the data in which the corresponding packaging in the SMT component database is located is modified, and the corresponding packaging modification analysis result is generated. If no, no processing is performed.

[0058] Specifically, according to the timing checking mechanism, the material parameter modification time of each piece of data in the component mounter system component database and the packaging parameter modification time of each piece of data in the EDA software pad packaging library are compared with the modification time of the corresponding data in the SMT component database respectively. If the modification time in any one of the libraries is later than the modification time of the corresponding data in the current SMT component database, it is considered that the corresponding data in the SMT component database is modified, and the material modification analysis result or the packaging modification analysis result indicates that the data corresponding to the material code or the packaging name is recently modified. If the modification time in any one of the libraries is earlier than the modification time of the corresponding data in the current SMT component database or the modification times are the same, etc., it is considered that the data corresponding to the material code or the packaging name is not recently modified, and no processing is performed.

[0059] Specifically, according to the instant checking mechanism, the SMT component database instantaneously acquires the modified material parameter and / or packaging parameter in the library, directly inputs the information after the modification of the material parameter or the packaging parameter, and forcibly invalidates all the data corresponding to the material code or the packaging name, i.e. modifies the invalidation mark of all the data corresponding to the material code or the packaging name to "Y", and then executes the following step S14.

[0060] S13, according to the material modification analysis result and / or the packaging modification analysis result, invalidating the data in the SMT component database, and updating the material parameter and / or the packaging parameter of the invalidated data.

[0061] In one embodiment, according to the material modification analysis result and / or the packaging modification analysis result, invalidating the data in the SMT component database comprises judging whether the modified material parameter is a key material parameter. If yes, invalidating the data in the SMT component database according to the material modification analysis result. Furthermore, judging whether the modified packaging parameter is a key packaging parameter. If yes, invalidating the data in the SMT component database according to the packaging modification analysis result. In actual application, the invalidation mark is represented by "Y" for invalidation and "N" for validity.

[0062] In one embodiment, after generating the material modification analysis result and / or package modification analysis result, the method further includes: updating the current modification time of the data corresponding to the material in the SMT component database to the latest obtained modification time of the material parameter; and / or updating the current modification time of the data corresponding to the package in the SMT component database to the latest obtained modification time of the package parameter.

[0063] Specifically, the key parameters include key parameters of the material part and key parameters of the packaging part. The key parameters of the material part are the key material parameters mentioned above, including: length, width, thickness of the material image, polarity markings (none, top, top right, right, bottom right, bottom, bottom left, left, top left) and feeding direction (0, 90, 180, 270). The key parameters of the packaging part are the key packaging parameters mentioned above, including: length, width, number of pins, minimum pin spacing and maximum pin spacing.

[0064] If at least one of the key parameters of the material section is modified, the failure mark of all data corresponding to that material code will be changed to "Y". Any data marked as failure cannot be used. The modification time of the data of the current material in the SMT component database will be updated to the latest modification time of the corresponding material data in the component database of the pick-and-place machine system.

[0065] If at least one of the key parameters of the package section is modified, the failure mark of all data corresponding to the package name will be changed to "Y". Any data marked as failure cannot be used. The modification time of the data of the current package in the SMT component database will be updated to the latest modification time of the corresponding package data in the EDA software pad package library.

[0066] If the key parameters of the material data and package data in the SMT component database have not been modified, then the modification time of the data in the SMT component database will be updated to the latest modification time.

[0067] S14, based on the updated material parameters and / or packaging parameters, perform a first verification on the failure data.

[0068] Specifically, for data marked as invalid, since its related parameters have been modified, the modified key parameters of the packaging section and the key parameters of the material section are used as the latest packaging parameters and material parameters for data verification.

[0069] For the aforementioned real-time inspection mechanism, the failure data is first verified based on the modified material parameters and / or the packaging parameters.

[0070] S15, in response to the failure data passing the first check, changing the mark state of the failure data, updating the modification time of the failure data with the current first check passing time; in response to the failure data not passing the first check, adjusting the compensation parameter of the failure data, performing a second check on the failure data until the failure data passes the second check, changing the mark state of the failure data, and updating the modification time of the failure data with the current second check passing time. Thus, the SMT component database is dynamically managed, and the updated component data can be normally used when a new mounting program is made.

[0071] Specifically, if the first check passes, the failure mark of the data is updated to N, indicating that the data can be continuously used, and the modification time is updated to the current first check passing time; if the first check does not pass, the corresponding compensation parameter is calculated according to the latest packaging parameter and material parameter, the obtained compensation parameter is saved to the SMT component database, and the current whole data is replaced. Then, the data after the modification of the compensation parameter is subjected to a second check, if the second check passes, the failure mark of the data is updated to N, indicating that the data can be continuously used, and the modification time is updated to the current second check passing time; if the second check does not pass, the compensation parameter is recalculated until the second check passes. If the second check passes, the failure mark of the data is updated to N, indicating that the data can be used; if the check does not pass, the reason needs to be confirmed, or the original data is checked for errors, or the compensation parameter is recalculated until the second check passes; for the data that repeatedly performs the second check and cannot pass, the data is marked as abandoned or deleted.

[0072] It should be noted that the first check and the second check are only distinguished in order as the first check and the subsequent check, and the implementation manner has no substantial difference.

[0073] In an embodiment, the steps of the first check and / or the second check include:

[0074] (1) judging whether each parameter of the failure data is missing, whether the overlapping degree of each pin on the material image pattern and the pad on the packaging pattern is greater than a preset proportion, and whether the component polarity mark corresponds.

[0075] Specifically, by comparing the package pattern and the material image pattern of each material code, the geometric centers of the two patterns are first aligned. For non-polar elements, i.e. elements without direction, the polarity mark parameter is "none", and it is directly checked whether each pin on the material image overlaps each pad on the package pattern. The area of the overlapping part of the pin and the pad is the numerator, and the area of the pin is the denominator. The overlap degree is calculated. If the overlap degree is greater than a preset proportion, for example 80%, for polar elements, i.e. elements with direction, the polarity mark parameter is "polarity coordinate position: for example, upper, upper right, right, lower right, lower, lower left, left, and upper left". On the basis of checking whether the pins and pads are aligned, it is also necessary to compare whether the polarity marks on the package pattern and the material image pattern are consistent. In this way, it is determined whether the material code is fitted. As long as the direction is inconsistent or the pins are not aligned, compensation correction is needed.

[0076] (2) In response to the fact that each parameter of the failure data has no missing, the overlap degree of each pin on the material image pattern and the pad on the package pattern is greater than a preset proportion, and the element polarity mark corresponds, it is determined that the failure data passes the first check and / or the second check.

[0077] (3) In response to the fact that at least one of the conditions that each parameter of the failure data has no missing, the overlap degree of each pin on the material image pattern and the pad on the package pattern is greater than a preset proportion, and the element polarity mark corresponds is not met, it is determined that the failure data does not pass the first check and / or the second check.

[0078] In an embodiment, the step of adjusting the compensation parameter of the failure data includes: calculating a coordinate compensation parameter according to the geometric center coordinates of the package pattern and the geometric center coordinates of the material image pattern, and modifying the offset of X and Y coordinates; calculating an angle compensation parameter according to the angle formed by the direction of the package pattern and the direction of the material image pattern, and modifying the compensation angle.

[0079] Specifically, in the compensation calculation process, if the package pattern and the material image pattern directions are inconsistent, the compensation angle needs to be modified. The angle value is the angle formed by the package pattern direction and the material image pattern direction, which is compensated to the package pattern to make the directions of the package pattern and the image pattern consistent. If the geometric centers of the package pattern and the material image pattern do not overlap, the offset of the X and Y coordinates needs to be modified. The offset of the X coordinate is x-x1, where the geometric center coordinates (x, y) of the package pattern and the geometric center coordinates (x1, y1) of the material image pattern are known. The offset of the Y coordinate is y-y1, which is compensated to the package pattern. If the overlap of each pin meets the requirements at this time, the compensation parameters (X coordinate offset compensation, Y coordinate offset compensation, angle rotation compensation) of each material code + package name are obtained and saved to the SMT component library. At this time, the invalid parameters of each data are Y because they have not been verified and cannot be used temporarily. If the overlap of each pin does not meet the requirements, the geometric center of all pads of the package pattern and the geometric center of the image (or the geometric center of all pins of the image) are used for compensation calculation.

[0080] Referring to Figure 2 , a specific implementation flowchart of the SMT component data management method in an embodiment of the present application is shown. As Figure 2 shown, a specific implementation of the SMT component data management method of the present application, for example, includes the following steps (1.1)-(1.6):

[0081] (1.1) Referring to Figure 3 , a data modification schematic diagram of the SMT component data management method in an embodiment of the present application is shown. As Figure 3 shown, in the process of daily maintenance of the component library of the patch machine system, the material with the material code PN0003 is modified from nozzle model 1.3 to 1.5 on 2021 / 11 / 3; the material with the material code PN0004 is modified from the feeding direction 0 degrees to 90 degrees on 2021 / 11 / 3; therefore, the material parameter modification time of PN0003 and PN0004 is updated to 2021 / 11 / 3. In the process of daily maintenance of the EDA software pad package library, the package with the package name SOP16-B is modified from the length 10 mm to 11 mm on 2021 / 11 / 2, therefore, the corresponding package parameter modification time of SOP16-B is updated to 2021 / 11 / 2.

[0082] (1.2) Based on the timing check mechanism, set the check frequency and check time to 0 o'clock every night, read the material parameter modification time and package parameter modification time from the above patch machine system component database and EDA software pad package library respectively, compare the material parameter modification time of each data in the patch machine system component database, the package parameter modification time of each data in the EDA software pad package library with the modification time of the corresponding data in the SMT component database respectively, please continue to refer to Figure 3 , the original modification time of 8 data in the SMT component database is 2021 / 11 / 1, and the latest material parameter modification time of material code PN0003, PN0004 is 2021 / 11 / 3, and the latest package parameter modification time of package name SOP16-B is 2021 / 11 / 2, which are later than the modification time 2021 / 11 / 1 of the data in the current SMT component database, indicating that PN0003 corresponding to ID 5, 6, PN0004 corresponding to ID 7, 8, SOP16-B corresponding to ID 2, 4 data has been modified recently, and ID 1, 3 data has not been modified recently.

[0083] (1.3) For the ID 2, 4, 5, 6, 7, 8 data modified recently, judge whether the key parameters are modified, if modified, update the invalid flag, if not modified, keep the invalid flag unchanged.

[0084] The package length of package name SOP16-B has been modified, and the package length belongs to the key parameters of the package part, so the invalid flag of the data corresponding to ID 2, 4 of SOP16-B will be modified from "N" to "Y", indicating that it cannot be used again; update the modification time of the corresponding data in the SMT component database to the latest modification time 2021 / 11 / 2 of the corresponding data in the EDA software pad package library.

[0085] The nozzle of material code PN0003 has been modified, and since this parameter does not belong to the key parameters of the material part, the invalid flag of the data with ID 5, 6 remains "N", indicating that it can continue to be used; then update the modification time of this data in the SMT component database to the latest modification time 2021 / 11 / 3 of the corresponding data in the patch machine system component database.

[0086] The feeding direction of material code PN0004 has been modified, and the feeding direction belongs to the key parameters of the material part, so the invalid flag of the data with ID 7, 8 will be modified from "N" to "Y", indicating that it cannot be used again; update the modification time of the corresponding data in the SMT component database to the latest modification time 2021 / 11 / 3 of the corresponding data in the patch machine system component database. Please refer to Figure 4, shows the SMT component library data modification schematic diagram in the embodiment of the SMT component data management method of the application. As Figure 4 shown, the parameters, failure markers and modified time updated SMT component library are presented.

[0087] (1.4) The data before and after modifying the compensation parameters are listed and managed, respectively forming the compensation parameter table before modification in table 1 and the compensation parameter table after modification in table 2. For the data with ID 2, 4, 7 and 8 marked as failure, it is found that the pins on the material image pattern are no longer aligned with the pads on the packaging pattern, i.e. the first check fails, and the corresponding compensation parameters need to be calculated according to the latest, i.e. the modified packaging parameters and material parameters, and the calculation results are as follows:

[0088] The X coordinate offset compensation parameter of the data with ID 2 is changed from -0.02 to -0.01 due to the modification of the packaging length;

[0089] The X coordinate offset compensation parameter of the data with ID 4 is changed from -0.03 to -0.02 due to the modification of the packaging length;

[0090] The angle rotation compensation parameter of the data with ID 7 is changed from 270 to 0 due to the modification of the material supply direction;

[0091] The angle rotation compensation parameter of the data with ID 8 is changed from 90 to 180 due to the modification of the material supply direction.

[0092] Table 1 compensation parameter table before modification

[0093]

[0094]

[0095] Table 2 compensation parameter table after modification

[0096]

[0097] (1.5) The data with ID 2, 4, 7 and 8 after adjusting the compensation parameters are checked again for the second time, and it is found that there is no missing in each parameter of the four data, each pin on the material image pattern is aligned with the pad on the packaging pattern, and the polarity markers of ID 2 and 4 correspond (the polarity markers of ID 7 and 8 data are not considered, so they are not considered), which means that the second check is passed, and the failure markers of the four data are changed from "Y" to "N", indicating that they can continue to be used. Because it takes a long time to recalculate the compensation parameters and check the data, the actual check time is 2021 / 11 / 4, and the modification time is also updated to 2021 / 11 / 4. Please refer to Figure 5, which shows a schematic diagram of SMT component database compensation and post-modification time in the SMT component data management method of the present application in an embodiment. As shown in Figure 5 , the SMT component database after parameter, failure mark and modification time update and each piece of data passing the verification is presented.

[0098] (1.6) Normally use the updated component data in making new mounting program.

[0099] Please refer to Figure 6 , which shows a principle flow chart of pre-generating SMT component database in an embodiment of the present application. As shown in Figure 6 , the steps of pre-generating SMT component database of the present application include: S61, generating SMT component database according to SMT mounting program and ECAD (Electronic Computer Aided Design) file; or generating the SMT component database in the process of making new SMT mounting program using ECAD data. The SMT component database is used to execute the management method.

[0100] Specifically, the generating method of SMT component database of the present application includes the following (2.1) and (2.2):

[0101] (2.1) If there is no SMT program ready, the SMT component database can be obtained in the process of making new SMT mounting program using ECAD data, and continuously enriched and improved in the process of use.

[0102] (2.1.1) Read the original design ECAD data of a certain PCB product to obtain the packaging name, packaging graphic parameters (length, width, pin number, minimum pin spacing, maximum pin spacing, packaging graphic) of each component. Please refer to Figure 7 , which shows a packaging data schematic diagram of the generating method of SMT component database of the present application in an embodiment. As shown in Figure 7 , it includes component name, packaging name, packaging graphic parameters and packaging graphic.

[0103] It should be noted that the packaging name is the naming used by the PCB designer when creating the component pad packaging library before designing the PCB, and each packaging name will correspond to one or more bit numbers, indicating that the shapes of components at these positions are consistent, and each component has a unique packaging name.

[0104] (2.1.2) Read the BOM file, the BOM file contains at least material code and bit number information. It should be noted that the material code represents the number of the same type of components in PCB production, and the manufacturer will name it as a unique number when purchasing a material. Each material code will correspond to one or more bit numbers, indicating that these components will be equipped with the same material. By associating the bit number with the component in ECAD, each component will be matched to the corresponding material code. Take a BOM file instance as Table 3 below, including material code and corresponding component name:

[0105] Table 3 BOM file data table

[0106] Material code Element name PN0001 U1, U3 PN0002 U2, U4 PN0003 R1, R3 PN0004 R2, R4

[0107] (2.1.3) Select all components in the BOM, please refer to Figure 8 , which shows the material data schematic diagram of the SMT component library generation method of the present application in an embodiment. As shown in Figure 8 , the material image parameters (length, width, thickness, image pattern) of the material are obtained from the database matched with the chip mounter equipment according to the material code, and the machine parameters (feeder parameters, nozzle parameters, camera parameters, etc.).

[0108] (2.1.4) Compensation parameter calculation based on packaging pattern and material image pattern data. Compare the packaging pattern and material image pattern of each material code, first align the geometric centers of the two patterns. For non-polar components (components without direction, polar mark parameter is "none"), directly check whether each pin on the material image overlaps each pad on the packaging pattern (the overlapping area of the pin and the pad is the numerator, and the pin area is the denominator, and the overlap is greater than 80%). For polar components (components with direction, polar mark parameter is "polar coordinate position: for example, up, upper right, right, lower right, down, lower left, left, upper left"), in addition to checking whether the pin pads are aligned, it is also necessary to compare whether the polar mark on the packaging pattern is consistent with the polar mark on the material image pattern, so as to judge whether the material code is fitted. As long as the direction is inconsistent or the pin is not aligned, compensation correction is required.

[0109] Please refer to Figure 9 , which shows the compensation schematic diagram of the SMT component library generation method of the present application in an embodiment. As shown in Figure 9 , before correction, the packaging pattern and the image pattern are placed together in a vertical direction and are inconsistent. By rotating the packaging pattern by 90 degrees, it is found that the packaging pattern and the image pattern are offset. By calculating the offset coordinates, the packaging pattern and the image pattern are made consistent in direction and the pins are aligned.

[0110] Please refer to Figure 10, shows the compensation parameter calculation schematic diagram in an embodiment of the generation method of the SMT component library of the present application. As shown in Figure 10 the package name SOT23-A package library and the figure direction in the library are inconsistent, after the compensation parameter calculation, the angle compensation value R Offset is obtained as 90. The package name SOT23-B package library and the figure pin in the library are not aligned, after the compensation parameter calculation, the offset value X Offset of the X coordinate is obtained as 0.2 and the offset value Y Offset of the Y coordinate is obtained as 0.1.

[0111] The X coordinate, Y coordinate and angle compensation value of the material code + package name obtained in the compensation correction process are saved as the compensation parameters in the SMT component library, as shown in the compensation parameter table of Table 4.

[0112] Table 4 compensation parameter table

[0113]

[0114] (2.1.5) Check each piece of data again, and the judgment standard is: each parameter has no missing, the overlapping degree of each pin on the material image figure and the pad on the package figure is greater than 80%, and the polarity mark corresponds. If the check passes, update the failure mark of the data to N, indicating that it can be used, and update the modification time to the current check passing time, if the check does not pass, confirm the reason, or check whether the original data is wrong, or continue to adjust the compensation parameters, until the check passes; for the data that repeatedly checks and cannot pass, mark it as abandoned or deleted, thereby generating the SMT component library.

[0115] (2.2) If the SMT program and the original ECAD file are already done, the compensation parameters can be extracted from the produced SMT patch program to obtain the SMT component library.

[0116] (2.2.1) Read the original design ECAD data of a certain PCB product to obtain the package name, package figure parameters (length, width, pin number, minimum pin pitch, maximum pin pitch, package figure) of each component.

[0117] (2.2.2) Read the SMT patch program corresponding to the original design ECAD which has been done to obtain the material code, material image parameters (length, width, thickness, image figure), machine parameters (feeder, suction nozzle, camera, etc.) of each component.

[0118] (2.2.3) Align the Mark point mark to make the component coordinate center on the original design ECAD and the component coordinate center on the SMT patch program coincide as a whole.

[0119] (2.2.4) Calculate the differences between the X coordinate, Y coordinate, and angle of each component part number in the placement program and the X coordinate, Y coordinate, and angle of the same part number in the original design ECAD to obtain the compensation parameters for that part number. Each part number corresponds to a unique material code + package name. Through conversion, obtain the compensation parameters for the material code + package name corresponding to that part number. Only take one of multiple duplicate data records and save it to the SMT component database. At this time, the failure flag for each data record is Y because it has not been verified and cannot be used temporarily.

[0120] (2.2.5) Verify each data record. The verification criteria are as follows: no parameters are missing, the overlap degree between each pin on the material image and the pad on the package graphic meets the preset range, and the polarity marks correspond. If the verification is passed, update the failure flag of that data record to N, indicating that it can be used. If the verification fails, the reason needs to be confirmed, or check whether the original data is incorrect, or readjust the compensation parameters until the verification is passed. For data records that repeatedly fail to pass the verification, mark them as discarded or deleted, thereby generating the SMT component database.

[0121] The management method of the SMT component data described in this invention is not limited to the application scenario of the SMT component database, and its protection scope is not limited to the execution order of the steps listed in this embodiment. Any addition or subtraction of steps, replacement of steps, change or replacement of scenarios, etc. of the prior art made according to the principles of this invention are included in the protection scope of this invention.

[0122] Please refer to Figure 11 and Figure 12 , which are respectively shown as the structural schematic diagram of the SMT component database of this invention in an embodiment and the structural principle diagram of the SMT component database of this invention in an embodiment. The component database in the programming software supporting the placement machine equipment uses the material code as the primary key and includes information such as the image graphic of the material in the placement machine, feeder, nozzle, camera, etc. Generally, when the manufacturer purchases each material, corresponding data will be created in this database to ensure that it can be used when making the placement program. This database also reserves interfaces for other third-party software to read. Due to the large number of placement machine equipment models, there is no unified standard to specify the parameters of the specific component database, but the basic parameters of all placement machine systems are the same, and some machine parameters may increase or decrease slightly for different equipment. As Figure 11 and Figure 12 shown, based on the defects of the existing component database of the placement machine system, the SMT component database 2 described in this invention includes: a material parameter module 21 and a package parameter module 22, and also includes: a compensation parameter module 23, a judgment and comparison module 24, a failure flag module 25, a time record module 26, a compensation parameter calculation module 27, a data verification module 28, and a key parameter inspection module 29.

[0123] Therefore, the SMT component database can cross-connect component materials through component packaging to optimize component selection, welding analysis, and optimize pad design and machine parameters, thereby providing data support for improving production process capacity and intelligent decision-making.

[0124] Referring to Figure 13 , a data structure diagram of the SMT component database in an embodiment of the present application is shown. As Figure 13 indicated, the material parameter module 21 includes material code, material image parameter, machine parameter, and material parameter modification time. The material data in the material parameter module 21 is derived from the component database of the chip mounter system. Specifically, all components in the BOM (Bill of Material) are selected, and the material image parameter and machine parameter of the material are obtained from the database of the chip mounter device according to the material code.

[0125] The material image parameter includes the length, width, and thickness of the component body, polarity mark, feeding direction, and image pattern. The machine parameter includes the parameters of the feeder, suction nozzle, camera, and the like in the corresponding chip mounter system, which are parameters that must be used on the chip mounter. The material parameter modification time represents the last modification time of the current material parameter. The material parameter module 21 is used to accurately identify and extract the material and place it on the corresponding mounting point.

[0126] Referring to Figure 13 , the packaging parameter module 22 includes packaging name, packaging pattern parameter, and packaging parameter modification time. The packaging pattern parameter is used to identify the shape characteristics of the component. The packaging data in the packaging parameter module 22 is derived from reading the ECAD data to obtain the packaging name and packaging pattern parameter of each component.

[0127] The packaging pattern parameter includes the length, width, number of pins, maximum pin pitch, minimum pin pitch, and packaging pattern of the component body. The packaging parameter modification time represents the last modification time of the current packaging parameter.

[0128] In the specific example of Figure 13 , the material code PN0001 can correspond to multiple packages such as SOP16-A and SOP16-B, i.e., different original packaging designs, but the material used in the final mounting is the same, so their material parameters and packaging pattern parameters are consistent, while the compensation parameters are different. The material codes PN0001 and PN0002 both use the SOP16-A package, but the two material codes are different, indicating that the materials used in the final mounting are different, so the compensation parameters are different.

[0129] The compensation parameter module 23 is configured to adjust the elements to precisely fit the mounting points, including material code, package name, X coordinate offset compensation, Y coordinate offset compensation, angle rotation compensation, and modification time. The adjustment of the modification time refers to the adjustment of the latest modification time in the time recording module 26.

[0130] The judgment comparison module 24 is configured to compare the material parameter modification time of the element material database with the modification time of the corresponding material data in the SMT element library to generate a material modification analysis result, and / or compare the package parameter modification time of the pad package library with the modification time of the corresponding package data in the SMT element library to generate a package modification analysis result.

[0131] The failure marking module 25 is configured to mark the failure data in the SMT element library according to the material modification analysis result and / or the package modification analysis result, and update the material parameters and / or package parameters of the failure data.

[0132] Specifically, the failure marking module 25 is configured to mark the state of the current data to indicate whether the current data is available. Only the data that is not marked as failure can be used. The data marked as failure indicates that the data may be adjusted and cannot be used temporarily. The data marked as abandoned indicates that the data is abandoned and is prohibited from participating in inspection, verification, reference, and being referenced.

[0133] The time recording module 26 is configured to record the latest modification time of each data in the SMT element library. The modification time refers to the latest material parameter modification time or package parameter modification time used for failure discrimination, or the time when the verification is passed. For a piece of data, whether the material parameters are modified or the package parameters are modified or the verification is passed, there is only one corresponding modification time for a piece of data.

[0134] The compensation parameter calculation module 27 is configured to adjust the compensation parameters of the failure data. Specifically, the compensation parameter calculation module 27 calculates the corresponding compensation parameters according to the modified package parameter part key parameters and / or material parameter part key parameters for the data marked as failure.

[0135] The data verification module 28 is configured to perform first verification and / or second verification on the failure data. Specifically, the data verification module 28 is configured to verify the whole data after the key parameters are modified, and the whole data after the compensation parameters are calculated.

[0136] The key parameter inspection module 29 is configured to determine whether the modified material parameters are key material parameters, and whether the modified package parameters are key package parameters.

[0137] The data verification module 28 is used to verify the failure data based on the updated material parameters and / or packaging parameters; in response to the failure data passing the first verification, the failure marking module 25 is used to change the marking state of the failure data, and the time recording module 26 is used to update the modification time of the failure data with the current first verification passing time; in response to the failure data failing the first verification, the compensation parameter calculation module 27 is used to adjust the compensation parameters of the failure data, and then the data verification module 28 is used to perform the second verification on the failure data until the failure data passes the second verification, the failure marking module 25 is used to change the marking state of the failure data, and the time recording module 26 is used to update the modification time of the failure data with the current second verification passing time.

[0138] In practical applications, the use process of the SMT component database of the present application includes the following (3.1)-(3.4):

[0139] (3.1) Read the ECAD data to obtain the X coordinate, Y coordinate and angle in the original design of each component, and the packaging name and packaging graphic parameters (length, width, pin number, minimum pin pitch and maximum pin pitch), such as the packaging data table in Table 5.

[0140] Table 5 Packaging data table

[0141]

[0142]

[0143] (3.2) Read the BOM file, which at least contains material code and bit number information, such as the associated BOM data table in Table 6, and associate the components in the ECAD through the component name or bit number, and each component will be matched to a unique material code.

[0144] Table 6 Associated BOM data table

[0145] Material code Element name PN0001 U1 PN0002 U2 PN0005 U3 PN0006 U4 PN0007 U5

[0146] (3.3) Select all mounted components in the BOM to match the failure data marked as N in the component database according to the following priority:

[0147] a. search the component database by material code + package name, if the material code + package name of a component in the current PCB is consistent with the material code + package name in the component database, then apply the material code + package name and all parameters saved in the component database to the material code; if the material code + package name of the component is not consistent with the material code + package name in the component database, then execute b; specifically, search the component database by material code + package name, only U1 corresponding to PN0001 + SOP16-A matches the data in the library with ID 1.

[0148] b. search the component database by material code + package pattern parameters, if the material code + package pattern parameters of a component in the current PCB are consistent with the material code + package pattern parameters in the component database, then apply the material code + package pattern parameters and all parameters saved in the component database to the material code; if the material code + package pattern parameters are not consistent with the material code + package pattern parameters in the component database, then execute c; specifically, search the component database by material code + package pattern parameters, only U2 corresponding to PN0002 + SOP16-C matches the data in the library with ID 2.

[0149] c. search the component database by package name + package pattern parameters, if the package name + package pattern parameters of a component in the current PCB are consistent with the package name + package pattern parameters in the component database, then apply the package name + package pattern parameters and all parameters saved in the component database to the package name; if the package name + package pattern parameters are not consistent with the package name + package pattern parameters in the component database, then execute d; specifically, search the component database by package name + package pattern parameters, only U3 corresponding to PN0005 + SOP16-A matches the data in the library with ID 1.

[0150] d. search the component database by package pattern parameters, if the package pattern parameters of a component in the current PCB are consistent with the package pattern parameters in the component database, then apply the package pattern parameters and all parameters saved in the component database to the package pattern parameters, if the package pattern parameters are not consistent with the package pattern parameters in the component database, then execute e; specifically, search the component database by package pattern parameters, only U4 corresponding to PN0006 + SOP16-C matches the data in the library with ID 1.

[0151] e.If some components are not found by the above means, it means that it is a new material that has not been used before, and new data needs to be generated in the process of using ECAD data to make new SMT patch programs, and the data is updated to the SMT component database and used. Specifically, U5 corresponds to PN0007+SOP16-D, which is not found by the above four ways, and needs to be stored in the SMT component database in the process of using ECAD data to make new SMT patch programs.

[0152] After the above search and matching, the matching result table of table 7 is formed.

[0153] Table 7 Matching result table

[0154]

[0155] (3.4) According to the original design component information, that is, the X coordinate, the Y coordinate, and the angle, combined with the obtained compensation parameters, the accurate mounting point coordinates and mounting angles are directly obtained, as shown in the mounting data table of table 8. Set the Mark point, PCB thickness / flow direction and other information, output the SMT mounting program online to the mounting machine system, or output the offline mounting program file, and then import it into the mounting machine system for mounting operation.

[0156] Table 8 Mounting data table

[0157]

[0158] The embodiment provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the management method of the SMT component data.

[0159] Those skilled in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by computer program related hardware. The aforementioned computer program can be stored in a computer readable storage medium. The program is executed to perform the steps of the above-mentioned method embodiments; and the aforementioned computer readable storage medium includes ROM, RAM, magnetic disc or optical disc and various computer storage media that can store program codes.

[0160] Please refer to Figure 14 , which shows the structure connection schematic diagram of the electronic device in an embodiment of the present application. As Figure 14 shown, the embodiment provides an electronic device 1, which specifically includes a processor 11 and a memory 12; the memory 12 is used to store a computer program, and the processor 11 is used to execute the computer program stored in the memory, so that the electronic device performs each step of the management method of the SMT component data.

[0161] The processor 11 can be a general processor, including a central processing unit (CPU), a network processor (NP), etc.; or can be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component.

[0162] The memory 12 can include a random access memory (RAM) and can further include a non-volatile memory, such as at least one disk memory.

[0163] In actual application, the electronic device can be a computer including all or part of components such as a memory, a storage controller, one or more processing units (CPU), a peripheral interface, an RF circuit, an audio circuit, a speaker, a microphone, an input / output (I / O) subsystem, a display screen, other output or control devices, and an external port, etc.; and the computer can include but is not limited to personal computers such as desktop computers, notebook computers, tablet computers, smart phones, personal digital assistants (PDAs), etc. under the condition that the processing capability is allowed. In some other embodiments, the electronic device can also be a server, which can be arranged on one or more physical servers according to functions, loads, etc., or can be a cloud server composed of distributed or centralized server clusters, and the present embodiment is not limited thereto.

[0164] In summary, the SMT component data management method, database, medium and equipment of the present application realizes dynamic management of SMT component data on the basis of the existing component database of the chip mounter equipment, through the introduction of time comparison and a series of updates of relevant time. A kind of SMT component database is formed by adding packaging parameters in PCB design. When making a chip mounting program, all parameters of the material code are directly obtained in the SMT component database, thereby ensuring the accuracy of all components under the package, and there is no need to manually confirm the accuracy of the mounting point one by one. The compensation parameters checked are stored in the SMT component database, and can be directly used when encountering the same PCB subsequently, without the need for repeated adjustment, greatly improving the production efficiency of the chip mounting program. For new materials, the component data of new materials can be quickly created by referring to the existing component data in the SMT component database. Through continuous expansion of the SMT component database, the maximum utilization of component data is realized. The system automatically checks whether the key parameters in the database are modified at regular intervals, and if there is a modification, it is marked as invalid and cannot be used until it is confirmed and can be used, thereby avoiding production accidents caused by different data. The present application effectively overcomes the shortcomings of the prior art and has high industrial utilization value.

[0165] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical idea disclosed by the present application should be covered by the claims of the present application.

Claims

1. A method for managing SMT component data, characterized in that, include: Obtain the modification time of material parameters in the component material database and / or the modification time of package parameters in the pad package library; Compare the modification time of the material parameters with the modification time of the corresponding material data in the SMT component database to generate material modification analysis results; And / or compare the modification time of the package parameters with the modification time of the corresponding package data in the SMT component database to generate package modification analysis results; Based on the material modification analysis results and / or the package modification analysis results, failure data is marked in the SMT component database, and the material parameters and / or package parameters of the failure data are updated. The failure data is first verified based on the updated material parameters and / or packaging parameters; In response to the failure data passing the first verification, the marking status of the failure data is changed, and the modification time of the failure data is updated using the current time of the first verification passing. In response to the failure data failing the first verification, the compensation parameters of the failure data are adjusted, and the failure data is subjected to a second verification until the failure data passes the second verification. In this case, the marking status of the failure data is changed, and the modification time of the failure data is updated using the current time of the second verification passing. The adjustment of the compensation parameters of the failure data includes: calculating coordinate compensation parameters based on the geometric center coordinates of the packaged graphic and the geometric center coordinates of the material image graphic, and modifying the offset of the X and Y coordinates; calculating angle compensation parameters based on the angle formed by the direction of the packaged graphic and the direction of the material image graphic, and modifying the compensation angle.

2. The method for managing SMT component data according to claim 1, characterized in that: The modification time of material parameters in the component material database and / or the modification time of package parameters in the pad package library are obtained according to the timed inspection mechanism.

3. The method for managing SMT component data according to claim 1, characterized in that, The modification time of the material parameters is compared with the modification time of the corresponding material data in the SMT component database to generate material modification analysis results. And / or compare the modification time of the package parameters with the modification time of the corresponding package data in the SMT component database to generate package modification analysis results, including: Determine whether the modification time of the material parameter is later than the modification time of the corresponding material data in the SMT component database. If so, determine that the data of the corresponding material in the SMT component database has been modified, and generate the corresponding material modification analysis result; otherwise, do not process it; and / or Determine whether the modification time of the package parameter is later than the modification time of the corresponding package data in the SMT component database. If so, determine that the data of the corresponding package in the SMT component database has been modified, and generate the corresponding package modification analysis result; otherwise, do not process it.

4. The method for managing SMT component data according to claim 1, characterized in that, The step of marking failure data in the SMT component database based on the material modification analysis results and / or the package modification analysis results includes: Determine whether the modified material parameter is a critical material parameter; if it is a critical material parameter, mark the failure data in the SMT component database according to the material modification analysis results. Determine whether the modified package parameter is a critical package parameter; if it is a critical package parameter, mark the failure data in the SMT component database according to the package modification analysis results.

5. The method for managing SMT component data according to claim 1, characterized in that, After generating the material modification analysis results and / or packaging modification analysis results, the method further includes: Update the current modification time of the data for the corresponding material in the SMT component database to the latest modification time of the material parameters; and / or Update the current modification time of the data corresponding to the package in the SMT component database to the latest modification time of the package parameters.

6. The method for managing SMT component data according to claim 1, characterized in that, The steps of the first check and / or the second check include: Determine whether any parameters of the failure data are missing, whether the overlap between each pin on the material image graphic and the pad on the package graphic is greater than a preset ratio, and whether the component polarity markings correspond. In response to the absence of missing parameters in the failure data, the overlap between each pin on the material image graphic and the pad on the package graphic being greater than a preset ratio, and the corresponding component polarity markings, the failure data is determined to pass the first check and / or the second check. If at least one of the following conditions is not met: all parameters of the failure data are complete, the overlap between each pin on the material image graphic and the pad on the package graphic is greater than a preset ratio, and the component polarity mark is not corresponding, the failure data is determined to have failed the first verification and / or the second verification.

7. The method for managing SMT component data according to any one of claims 1 to 6, characterized in that, The method further includes the step of pre-generating an SMT component database, including: An SMT component database is generated based on the SMT placement program and ECAD file; or the SMT component database is generated during the process of creating a new SMT placement program using ECAD data.

8. An SMT component database, characterized in that, include: The material parameters module includes material code, material image parameters, machine parameters, and material parameter modification time; The packaging parameter module includes the packaging name, packaging graphic parameters, and packaging parameter modification time, wherein the packaging graphic parameters are used to identify the shape characteristics of the component; The comparison module is used to compare the modification time of material parameters in the component material database with the modification time of the corresponding material data in the SMT component database, and generate material modification analysis results; and / or compare the modification time of package parameters in the pad package library with the modification time of the corresponding package data in the SMT component database, and generate package modification analysis results. The failure marking module is used to mark failure data in the SMT component database according to the material modification analysis results and / or the package modification analysis results, and update the material parameters and / or package parameters of the failure data. The time recording module is used to record the latest modification time of each piece of data in the SMT component database; The compensation parameter calculation module is used to adjust the compensation parameters of the failure data; The data verification module is used to perform a first verification and / or a second verification on the failed data; The data verification module performs a first verification on the failed data based on the updated material parameters and / or packaging parameters. In response to the failed data passing the first verification, the failure marking module changes the marking status of the failed data, and the time recording module updates the modification time of the failed data using the current time of the first verification success. In response to the failed data failing the first verification, the compensation parameter calculation module adjusts the compensation parameters of the failed data, and then the data verification module performs a second verification on the failed data until the failed data passes the second verification. The failure marking module then changes the marking status of the failed data, and the time recording module updates the modification time of the failed data using the current time of the second verification success. Adjusting the compensation parameters of the failed data includes: calculating coordinate compensation parameters based on the geometric center coordinates of the packaging graphic and the geometric center coordinates of the material image graphic, and modifying the offset of the X and Y coordinates; calculating angle compensation parameters based on the angle formed by the direction of the packaging graphic and the direction of the material image graphic, and modifying the compensation angle.

9. The SMT component database according to claim 8, characterized in that, Also includes: The critical parameter checking module is used to determine whether the modified material parameters are critical material parameters and whether the modified packaging parameters are critical packaging parameters. The compensation parameter module is used to adjust the precise fit between the component and the mounting point, including material code, package name, X-coordinate offset compensation, Y-coordinate offset compensation, angle rotation compensation, and modification time.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the method for managing SMT component data as described in any one of claims 1 to 7.

11. An electronic device, characterized in that, include: Processor and memory; The memory is used to store computer programs, and the processor is used to execute the computer programs stored in the memory to cause the electronic device to perform the SMT component data management method according to any one of claims 1 to 7.

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