Height measurement method, device and crystal bonding device

Abstract

The present invention provides a height measurement method, device, and crystal bonding device. The height measurement method includes the following steps: measuring the spot width L of an image measuring device at the initial height from the crystal bonding platform; raising the crystal bonding platform to a height H, which is the height during crystal bonding operation, and measuring the initial distance L1 between two light spots on the crystal bonding platform using an image measuring device; a spot distance measurement step: at any time, measuring the distance L2 between the left and right light spots on the substrate using an image measuring device; and a height deviation calculation step: at any time, the height deviation of the substrate height relative to the crystal bonding platform is Δh, where Δh = H*|(L1-L2) / (L-L1)|. The beneficial effects of the present invention are as follows: the present invention forms two point light spots on the substrate using two intersecting light sources, measures the distance between the two light spots using an image measuring device, and forms a reference height corresponding to the distance; by comparing and measuring different spot distances, the corresponding substrate heights or corresponding flatness can be calculated.

Description

Technical Field

[0001] The present invention relates to the field of LED COB packaging, and in particular to a height measurement method, device and die bonding device. Background Art

[0002] A COB (Chip On Board) die bonder is a device that fixes chips on a substrate. During die bonding, the bonding head is very sensitive to the distance from the substrate. Therefore, accurately and quickly measuring the height distance between the bonding head and the substrate is a technical problem that needs to be solved urgently in existing technologies. Summary of the Invention

[0003] The present invention provides a height measurement method, comprising the following steps:

[0004] Initial height measurement step: measuring the spot width L when the image measuring device is at an initial height H from the die bonding platform;

[0005] Move the die bonding platform to a height H, which is the working height of the die bonding platform. The left and right light sources emit light, forming two light spots on the die bonding platform. The initial distance L1 between the two light spots on the die bonding platform is measured by an image measuring device.

[0006] Spot distance measurement step: The left light source and the right light source emit light to form a left spot and a right spot on the substrate. At any time, the distance L2 between the left spot and the right spot on the substrate is measured by the image measuring device;

[0007] Height deviation calculation steps: At any time, the height deviation of the substrate relative to the die bonding platform is Δh, Δh = H*|(L1-L2) / (L-L1)|.

[0008] As a further improvement of the present invention, the left light source and the right light source emit laser light or red light.

[0009] As a further improvement of the present invention, the image measuring device includes a camera and a computing module.

[0010] The present invention also provides a height measuring device, comprising: an image measuring device, a left light source, a right light source, a substrate and a crystal bonding platform, wherein the image measuring device, the left light source and the right light source are all located above the substrate, the left light source and the right light source emit light to form two light spots on the crystal bonding platform, and the image measuring device is used to measure the initial distance L1 between the two light spots on the crystal bonding platform; the left light source and the right light source emit light to form a left light spot and a right light spot on the substrate, and at any time, the image measuring device is used to measure the distance L2 between the left light spot and the right light spot on the substrate; at any time, the height deviation of the substrate height relative to the crystal bonding platform is Δh, Δh=H*|(L1-L2) / (L-L1)|, H is the height of the movable crystal bonding platform, and the height at this time is the working height of the crystal bonding platform.

[0011] As a further improvement of the present invention, the left light source and the right light source emit laser light or red light.

[0012] As a further improvement of the present invention, the image measuring device includes a camera and a computing module.

[0013] The present invention further provides a die-bonding device, comprising a die-bonding head and the height measuring device, which controls the height of the die-bonding head probing down to the substrate according to Δh.

[0014] The beneficial effects of the present invention are as follows: the present invention forms two point light spots on the substrate by two cross-light beams, and uses an image measuring device to measure the distance between the two light spots, thereby forming a reference height corresponding to the distance; by comparing and measuring different light spot distances, the corresponding different substrate heights or corresponding flatness can be calculated. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a principle block diagram of the present invention. DETAILED DESCRIPTION

[0016] like Figure 1 As shown, the present invention discloses a height measurement method, comprising the following steps:

[0017] Initial height measurement step: measuring the spot width L of the image measuring device 1 at the initial height from the die-bonding platform 7;

[0018] Move the die bonding platform 7 to a height H, which is the working height of the die bonding platform 7. The left light source 3 and the right light source 2 emit light, forming two light spots on the die bonding platform 7. The initial distance L1 between the two light spots on the die bonding platform 7 is measured by the image measuring device 1.

[0019] Spot distance measurement steps: The left light source 3 and the right light source 2 emit light, forming a left light spot 5 and a right light spot 6 on the substrate 4. At any time, the image measuring device 1 measures the distance L2 between the left light spot 5 and the right light spot 6 on the substrate 4;

[0020] Height deviation calculation steps: At any time, the height deviation of the substrate 4 relative to the die-bonding platform 7 is Δh, Δh=H*|(L1-L2) / (L-L1)|.

[0021] The left light source 3 and the right light source 2 emit laser light or red light.

[0022] The image measuring device 1 includes a camera and a calculation module. The camera takes pictures of the two light spots on the die-bonding platform 7, and the calculation module calculates the initial distance L1 between the two light spots on the die-bonding platform 7; the camera takes pictures of the left light spot 5 and the right light spot 6 on the substrate 4, and the calculation module calculates the distance L2 between the left light spot 5 and the right light spot 6 on the substrate 4.

[0023] The present invention also discloses a height measuring device, comprising: an image measuring device 1, a left light source 3, a right light source 2, a substrate 4 and a crystal bonding platform 7, wherein the image measuring device 1, the left light source 3 and the right light source 2 are all located above the substrate 4, the left light source 3 and the right light source 2 emit light to form two light spots on the crystal bonding platform 7, and the initial distance L1 between the two light spots on the crystal bonding platform 7 is measured by the image measuring device 1; the left light source 3 and the right light source 2 emit light to form a left light spot 5 and a right light spot 6 on the substrate 4, and at any time, the distance L2 between the left light spot 5 and the right light spot 6 on the substrate 4 is measured by the image measuring device 1; at any time, the height deviation of the substrate 4 relative to the crystal bonding platform 7 is Δh, Δh=H*|(L1-L2) / (L-L1)|, H is the height of the movable crystal bonding platform 7, and the height at this time is the working height of the crystal bonding platform 7.

[0024] The present invention further discloses a die-bonding device, comprising a die-bonding head and the height measuring device, which controls the height of the die-bonding head probing down to the substrate 4 according to Δh.

[0025] The present invention forms two light spots on the substrate 4 by two intersecting light sources, and uses an image measuring device 1 to measure the distance between the two light spots, thereby forming a reference height corresponding to the distance. By comparing and measuring different light spot distances, the corresponding substrate heights or flatness can be calculated.

[0026] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A height measurement method, characterized in that: The steps include: Initial height measurement step: measuring the spot width L of the image measuring device (1) at the initial height from the crystal bonding platform (7); The crystal bonding platform (7) is moved to a height H, which is the working height of the crystal bonding platform (7). The left light source (3) and the right light source (2) emit light to form two light spots on the crystal bonding platform (7). The initial distance L1 between the two light spots on the crystal bonding platform (7) is measured by the image measuring device (1); Light spot distance measurement steps: the left light source (3) and the right light source (2) emit light to form a left light spot (5) and a right light spot (6) on the substrate (4); at any time, the distance L2 between the left light spot (5) and the right light spot (6) on the substrate (4) is measured by the image measuring device (1); Height deviation calculation steps: at any time, the height deviation of the substrate (4) relative to the crystal bonding platform (7) is Δh, Δh = H*|(L1-L2) / (L-L1)|; The left light source (3) and the right light source (2) emit laser light or red light; The image measuring device (1) comprises a camera and a computing module.

2. A height measuring device, characterized in that: include: An image measuring device (1), a left light source (3), a right light source (2), a substrate (4) and a crystal bonding platform (7), wherein the image measuring device (1), the left light source (3) and the right light source (2) are all located above the substrate (4); the left light source (3) and the right light source (2) emit light to form two light spots on the crystal bonding platform (7); an initial distance L1 between the two light spots on the crystal bonding platform (7) is measured by the image measuring device (1); the left light source (3) and the right light source (2) emit light to form a left light spot ( 5) and the right light spot (6), at any time, the distance L2 between the left light spot (5) and the right light spot (6) on the substrate (4) is measured by the image measuring device (1); at any time, the height deviation of the substrate (4) relative to the crystal bonding platform (7) is Δh, Δh = H*|(L1-L2) / (L-L1)|, H is the height of the movable crystal bonding platform (7), the height at this time is the working height of the crystal bonding platform (7), and L is the light spot width when measuring the initial height of the image measuring device (1) from the crystal bonding platform (7); The left light source (3) and the right light source (2) emit laser light or red light; The image measuring device (1) comprises a camera and a computing module.

3. A die bonding device, characterized in that: The device comprises a die-bonding head and the height measuring device according to claim 2, and controls the height of the die-bonding head probing down to the substrate (4) according to Δh.

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