Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel, a manufacturing method thereof, and a display device. The display panel includes: a flexible light-emitting substrate; a first inorganic encapsulation layer disposed on the flexible light-emitting substrate, the first inorganic encapsulation layer being located within a display area and an edge area; a first interface layer disposed within the display area on the first inorganic encapsulation layer; an organic encapsulation layer, a portion of which is disposed on the first interface layer and another portion of which is disposed on the first inorganic encapsulation layer within the edge area; and a second inorganic encapsulation layer covering the organic encapsulation layer. By forming the first interface layer only within the display area on the first inorganic encapsulation layer, the present application can improve the bending resistance of the flexible display panel when the display panel is bent. The first interface layer can also increase the flow rate of ink on the first interface layer when forming the organic encapsulation layer using inkjet printing, while maintaining a lower flow rate in the edge area, thereby improving the preparation efficiency of the organic encapsulation layer and preventing excessive ink overflow.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) displays are being actively developed by major display manufacturers due to their advantages such as simple structure, self-luminescence, fast response time, ultra-light weight, and low power consumption. Currently, OLED display panels are widely used in applications ranging from small mobile phone displays to large, high-resolution flat-panel televisions.

[0003] The most common packaging method for flexible displays is thin-film packaging, which uses plasma-enhanced chemical vapor deposition (PECVD), sputtering (SPUTTER), atomic layer deposition (ALD) and other methods to produce the inorganic layer. The inorganic layer is responsible for the water and oxygen barrier in the packaging layer. Due to the large stress in the inorganic layer, an organic layer or an organic-like layer is usually added between the inorganic layers to achieve stress release and flattening. The current packaging structure of flexible display panels has the problem of packaging failure due to bending stress between the inorganic layer and the organic layer.

[0004] In addition, at present, the production of organic layers is mostly achieved by inkjet printing. Affected by the characteristics of organic materials, organic materials are prone to overflow during the coating and curing process. In the thin film packaging structure, the coverage area of the organic layer is smaller than that of the inorganic layer, that is, the organic layer is wrapped by the inorganic layer. If overflow occurs, it will affect the actual packaging reliability of the thin film packaging structure. Summary of the Invention

[0005] The present application provides a display panel and a manufacturing method thereof, and a display device to solve the problem of low efficiency and low reliability in the manufacturing process of an organic layer of a flexible packaging structure.

[0006] In one aspect, the present application provides a display panel, comprising:

[0007] A flexible light-emitting substrate, comprising a display area and an edge area;

[0008] a first inorganic encapsulation layer, disposed on the flexible light-emitting substrate, wherein the first inorganic encapsulation layer is located in the display area and the edge area;

[0009] a first interface layer, disposed on the first inorganic encapsulation layer, wherein the first interface layer is located in the display area;

[0010] an organic encapsulation layer, a portion of which is disposed on the first interface layer and another portion of which is disposed on the first inorganic encapsulation layer in the edge region;

[0011] The second inorganic encapsulation layer covers the organic encapsulation layer.

[0012] In a possible implementation of the present application, the display panel further includes:

[0013] The second interface layer is disposed between the organic encapsulation layer and the second inorganic encapsulation layer, and the second interface layer is located in the display area.

[0014] In a possible implementation of the present application, the first interface layer and / or the second interface layer is made of silicon oxide or silicon oxynitride, and the refractive index of the first interface layer and / or the second interface layer is in the range of 1.4-1.6.

[0015] In a possible implementation of the present application, the first inorganic encapsulation layer is a passivation layer, and the passivation layer is used to slow down the flow rate of the ink forming the organic encapsulation layer.

[0016] In a possible implementation of the present application, the edge area further includes a packaging area and a clearance area that are adjacently arranged;

[0017] The organic encapsulation layer is located in the encapsulation area;

[0018] The first inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the flexible light-emitting substrate in the clearance area;

[0019] The second inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the first inorganic encapsulation layer in the clearance area.

[0020] A method for manufacturing a display panel, the method comprising:

[0021] Providing a flexible light-emitting substrate, the flexible substrate comprising a display area and an edge area;

[0022] preparing a first inorganic encapsulation layer on the flexible light-emitting substrate, so that the first inorganic encapsulation layer is located in the display area and the edge area;

[0023] preparing a first interface layer on the first inorganic encapsulation layer, so that the first interface layer is located in the display area;

[0024] preparing an organic encapsulation layer on the first interface layer and the inorganic layer by inkjet printing;

[0025] A second inorganic encapsulation layer is prepared on the organic encapsulation layer.

[0026] In a possible implementation of the present application, the step of preparing a first interface layer on the first inorganic encapsulation layer so that the first interface layer is located in the display area includes:

[0027] A silicon oxide or silicon oxynitride material is deposited on the first inorganic encapsulation layer in the display area by chemical vapor deposition to form a first interface layer, wherein the refractive index of the silicon oxide or silicon oxynitride material is in the range of 1.4-1.6.

[0028] In a possible implementation of the present application, after the step of preparing the organic encapsulation layer on the first interface layer and the first inorganic encapsulation layer in the edge region by inkjet printing, the method further includes:

[0029] Depositing silicon oxide or silicon oxynitride material on the organic encapsulation layer in the display area by chemical vapor deposition to form a second interface layer;

[0030] The step of preparing a second inorganic encapsulation layer on the organic encapsulation layer comprises:

[0031] A second inorganic encapsulation layer is prepared on the second interface layer.

[0032] In a possible implementation of the present application, the step of preparing the first inorganic encapsulation layer on the flexible light-emitting substrate further includes:

[0033] The surface of the first inorganic encapsulation layer is passivated by using plasma gas formed by hydrogen or ammonia to slow down the flow rate of the ink forming the organic encapsulation layer.

[0034] On the other hand, the present application also provides a display device, comprising the display panel.

[0035] The present application provides a display panel, a manufacturing method thereof, and a display device. Based on a flexible light-emitting substrate adopting a flexible packaging structure of a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer, a first interface layer is set between the first inorganic packaging layer and the organic packaging layer, so that the first interface layer is formed in the display area on the first inorganic packaging layer, while the first interface layer is not set in the edge area. This can improve the interface bonding force between the organic packaging layer and the first inorganic packaging layer when the display panel is bent in the display area, thereby improving the bending resistance of the flexible display panel, preventing packaging failure, and helping to extend the service life of the flexible display panel. In addition, the first interface layer can also increase the flow rate of ink on the first interface layer in the display area when the organic packaging layer is formed by inkjet printing, while maintaining a lower flow rate of ink in the edge area, which is beneficial to improving the preparation efficiency of the organic packaging layer while preventing excessive overflow of ink, effectively improving the reliability of the display panel packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0037] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application.

[0038] Figure 2 This is a structural diagram of a display panel provided in yet another embodiment of the present application.

[0039] Figure 3 This is a schematic structural diagram of the second interface layer of the display panel provided in an embodiment of the present application.

[0040] Figure 4 A schematic diagram of the manufacturing process of the display panel provided in an embodiment of the present application.

[0041] Figure 5 A schematic diagram of the manufacturing process of a display panel provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0043] In the description of the present application, it should be understood that the features of the terms "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. It should be noted that, unless otherwise clearly specified and defined, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0044] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0045] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, which are respectively described in detail below.

[0046] Please refer to Figure 1-Figure 3 The embodiment of the present application first provides a display panel, including a flexible light-emitting substrate 10, a first inorganic encapsulation layer 20, a first interface layer 30, an organic encapsulation layer 40 and a second inorganic encapsulation layer 50.

[0047] The flexible light-emitting substrate 10 includes a display area 110 and an edge area 120, which are adjacent to each other. The display area 110 is used for luminous display, while the edge area 120 is non-luminous and is used to form metal traces at the edge. The edge area 120 can be formed around the display area 110 or on one side of the display area 110, without specific limitation.

[0048] The flexible light-emitting substrate 10 may include a base substrate 11, a driving circuit layer 12, and a light-emitting layer 13, which are stacked in sequence. The base substrate 11 may be a flexible base substrate made of polyimide (PI). The driving circuit layer 12 includes an array of TFT devices for driving the light-emitting layer 13 to emit light. The light-emitting layer may be an OLED light-emitting layer, a Mini LED light-emitting layer, or a Micro LED light-emitting layer, etc., without specific limitation herein.

[0049] The first inorganic encapsulation layer 20 is disposed on the flexible light-emitting substrate 10, and is located in the display area 110 and the edge area 120. The first inorganic encapsulation layer 20 can be formed by chemical vapor deposition (CVD).

[0050] The first interface layer 30 is disposed on the first inorganic encapsulation layer 20 and is located within the display area 110. The first interface layer 30 can be formed using chemical vapor deposition (CVD). The first interface layer 30 can be used to increase the flow rate of the organic ink on its surface, thereby effectively shortening the leveling time of the organic ink on the first interface layer 30, thereby improving the preparation efficiency of the organic encapsulation layer 40.

[0051] In addition, the first interface layer 30 can also increase the bonding force between the first inorganic encapsulation layer 20 and the organic encapsulation layer 40, thereby preventing the first inorganic encapsulation layer 20 and the organic encapsulation layer 40 from peeling off due to bending stress during bending, resulting in encapsulation failure.

[0052] A portion of the organic encapsulation layer 40 is disposed on the first interface layer 30, and another portion is disposed on the first inorganic encapsulation layer 20 within the edge region 120. The organic encapsulation layer 40 can be formed by inkjet printing, where the ink is an organic material, which can increase the bending resistance of the flexible encapsulation structure.

[0053] In addition, if Figure 1 As shown, a retaining wall structure 70 may be further provided in the edge area 120 . The retaining wall structure 70 may be a double retaining wall structure including a first retaining wall 71 arranged in an annular shape and a second retaining wall 72 arranged in an annular shape, for preventing ink from overflowing when preparing the organic encapsulation layer 40 .

[0054] The second inorganic encapsulation layer 50 covers the organic encapsulation layer 40. The second inorganic encapsulation layer 50 can be formed by chemical vapor deposition (CVD).

[0055] The display panel of the embodiment of the present application adopts a flexible encapsulation structure of a first inorganic encapsulation layer 20, an organic encapsulation layer 40, and a second inorganic encapsulation layer 50 on the flexible light-emitting substrate 10. By providing a first interface layer 30 between the first inorganic encapsulation layer 20 and the organic encapsulation layer 40, the first interface layer 30 is formed in the display area 110 on the first inorganic encapsulation layer 20, while the first interface layer 30 is not provided in the edge area 120. This can improve the interface bonding strength between the organic encapsulation layer 40 and the first inorganic encapsulation layer 20 when the display panel is bent in the display area 110, thereby improving the bending resistance of the flexible display panel, preventing encapsulation failure, and facilitating the extension of the service life of the flexible display panel. In addition, the first interface layer 30 can also increase the flow rate of ink on the first interface layer 30 in the display area 110 when the organic encapsulation layer 40 is formed by inkjet printing, while maintaining a lower flow rate of ink in the edge area 120. This is beneficial to improving the preparation efficiency of the organic encapsulation layer 40 while preventing excessive ink overflow, effectively improving the reliability of the display panel encapsulation.

[0056] In some embodiments, please refer to Figure 2The display panel further includes a second interface layer 60. The second interface layer 60 is disposed between the organic encapsulation layer 40 and the second inorganic encapsulation layer 50, and the second interface layer 60 is located within the display area 110. The second interface layer 60 can also increase the bonding force between the second inorganic encapsulation layer 50 and the organic encapsulation layer 40, thereby preventing the second inorganic encapsulation layer 50 and the organic encapsulation layer 40 from peeling off due to bending stress during bending, resulting in encapsulation failure, thereby further improving the service life of the flexible encapsulation structure.

[0057] In some embodiments, the first interface layer 30 and / or the second interface layer 60 are made of silicon oxide (SiOx) or silicon oxynitride (SiONx), and the refractive index of the first interface layer 30 and / or the second interface layer 60 is in the range of 1.4-1.6. By adopting an inorganic material with a low refractive index, the flow rate of the organic ink on the first interface layer 30 can be better improved, thereby further improving the preparation efficiency of the organic encapsulation layer 40. Exemplarily, the first interface layer 30 and the second interface layer 60 can be made of the same material or different materials. Exemplarily, taking the first interface layer 30 and the second interface layer 60 as an example of using different materials, the first interface layer 30 can be made of silicon oxide material and the second interface layer 60 can be made of silicon oxynitride material; or the first interface layer 30 can be made of silicon oxide material with a refractive index of 1.4 and the second interface layer 60 can be made of silicon oxide material with a refractive index of 1.6, etc., and no specific limitation is made here. Of course, in actual use, the materials and refractive indices of the first interface layer 30 and / or the second interface layer 60 may be selected and combined according to different preparation processes or preparation time requirements, and no specific limitation is made here.

[0058] In some embodiments, the first inorganic encapsulation layer 20 is a passivation layer, which is used to slow down the flow rate of the ink used to form the organic encapsulation layer 40. By passivating the surface of the first inorganic encapsulation layer 20 to increase the contact angle between the surface of the first inorganic encapsulation layer 20 and the ink, the first inorganic encapsulation layer 20 becomes a hydrophilic film layer. As a result, when the organic encapsulation layer 40 is formed by inkjet printing, the flow rate of the organic ink in the organic encapsulation layer 40 can be further slowed when flowing through the first inorganic encapsulation layer 20 within the edge region 120. This allows the ink to flow to a predetermined area within the edge region 120, thereby preventing excessive overflow of the ink and effectively improving the reliability of the display panel encapsulation.

[0059] In some embodiments, please refer to Figure 3, the edge area 120 also includes an adjacent encapsulation area 121 and a clearance area 122. The organic encapsulation layer 40 is located in the encapsulation area 121. The first inorganic encapsulation layer 20 is located in the encapsulation area 121 and the clearance area 122, and the first inorganic encapsulation layer 20 is arranged on the surface of the flexible light-emitting substrate 10 in the clearance area 122. The second inorganic encapsulation layer 50 is located in the encapsulation area 121 and the clearance area 122, and the first inorganic encapsulation layer 20 is arranged on the surface of the first inorganic encapsulation layer 20 in the clearance area 122. In this embodiment, the first inorganic encapsulation layer 20 and the second inorganic encapsulation layer 50 are stacked in the clearance area 122 outside the organic encapsulation layer 40, that is, the second inorganic encapsulation layer 50 is arranged on the surface of the first inorganic encapsulation layer 20, thereby eliminating the setting of the retaining wall. Compared with the existing encapsulation structure that requires a double retaining wall structure, this embodiment is conducive to simplifying the process and simplifying the structure.

[0060] The present application also provides a method for manufacturing a display panel. The display panel includes a display area 110 and an edge area 120. Figure 4 The method includes the following steps S101 to S501:

[0061] S101 , providing a flexible light-emitting substrate 10 .

[0062] S201 , preparing a first inorganic encapsulation layer 20 on the flexible light-emitting substrate 10 , so that the first inorganic encapsulation layer 20 is located in the display area 110 and the edge area 120 .

[0063] S301 , preparing a first interface layer 30 on the first inorganic encapsulation layer 20 , so that the first interface layer 30 is located in the display area 110 .

[0064] S401 , preparing an organic encapsulation layer 40 on the first interface layer 30 and the first inorganic encapsulation layer 20 by inkjet printing.

[0065] S501 , preparing a second inorganic encapsulation layer 50 on the organic encapsulation layer 40 .

[0066] The method for manufacturing a display panel according to an embodiment of the present application is based on a flexible light-emitting substrate 10 adopting a flexible packaging structure of a first inorganic packaging layer 20, an organic packaging layer 40, and a second inorganic packaging layer 50. By providing a first interface layer 30 between the first inorganic packaging layer 20 and the organic packaging layer 40, the first interface layer 30 is formed in the display area 110 on the first inorganic packaging layer 20, while the first interface layer 30 is not provided in the edge area 120. This can improve the interface bonding strength between the organic packaging layer 40 and the first inorganic packaging layer 20 when the display panel is bent in the display area 110, thereby improving the bending resistance of the flexible display panel, preventing packaging failure, and facilitating the extension of the service life of the flexible display panel. In addition, the first interface layer 30 can also increase the flow rate of ink on the first interface layer 30 in the display area 110 when the organic packaging layer 40 is formed by inkjet printing, while maintaining a lower flow rate of ink in the edge area 120. This is beneficial to improving the preparation efficiency of the organic packaging layer 40 while preventing excessive ink overflow, effectively improving the reliability of the display panel packaging.

[0067] In some embodiments, step S301 , preparing a first interface layer 30 on the first inorganic encapsulation layer 20 so that the first interface layer 30 is located in the display area 110 , includes the following steps S311 .

[0068] S311 , depositing silicon oxide or silicon oxynitride material on the first inorganic encapsulation layer 20 in the display area 110 by chemical vapor deposition to form a first interface layer 30 , wherein the refractive index of the silicon oxide or silicon oxynitride material is in the range of 1.4-1.6.

[0069] By using an inorganic material with a low refractive index, the flow rate of the organic ink on the first interface layer 30 can be better increased, thereby further improving the preparation efficiency of the organic encapsulation layer 40 .

[0070] In some embodiments, step S401, preparing the organic encapsulation layer 40 on the first interface layer 30 and the inorganic layer by inkjet printing, further includes the following step S411:

[0071] S411 , depositing silicon oxide or silicon oxynitride material on the organic encapsulation layer 40 in the display area 110 by chemical vapor deposition to form a second interface layer 60 .

[0072] Correspondingly, step S501, preparing a second inorganic encapsulation layer 50 on the organic encapsulation layer 40, specifically includes the following steps S511:

[0073] S511 , preparing a second inorganic encapsulation layer 50 on the second interface layer 60 .

[0074] In some embodiments, after step S201, the step of preparing the first inorganic encapsulation layer 20 on the flexible light-emitting substrate 10, the method further includes:

[0075] S512 , using plasma gas formed by hydrogen (H 2 ) or ammonia (NH 3 ) to perform passivation treatment on the surface of the first inorganic encapsulation layer 20 .

[0076] Plasma gas is used to bombard the surface of the first inorganic encapsulation layer 20, thereby changing its surface properties and forming a relatively large contact angle on the surface. This slows down the flow rate of the ink forming the organic encapsulation layer 40 and prevents ink diffusion. Specifically, hydrogen or ammonia can be ionized to form plasma gas, thereby passivating the surface of the first inorganic encapsulation layer 20.

[0077] Among them, when using plasma gas to bombard the surface of the first inorganic encapsulation layer 20, the entire surface of the first inorganic encapsulation layer 20 can be bombarded, that is, the first inorganic encapsulation layer 20 in the display area 110 and the edge area 120 are bombarded. Since the first interface layer 30 will also be formed on the surface of the first inorganic encapsulation layer 20 in the display area 110, only the surface of the first inorganic encapsulation layer 20 in the edge area 120 that has been passivated will come into contact with the ink, thereby saving one mask.

[0078] Of course, when plasma gas is used to bombard the surface of the first inorganic encapsulation layer 20 , a mask may be used to selectively perform passivation treatment only on the surface of the first inorganic encapsulation layer 20 in the edge region 120 , thereby saving materials.

[0079] By passivating the first inorganic encapsulation layer 20, the first inorganic encapsulation layer 20 becomes a hydrophilic film layer, so that when the organic encapsulation layer 40 is formed by inkjet printing, the organic ink in the organic encapsulation layer 40 can further slow down the flow speed of the ink when it flows in the first inorganic encapsulation layer 20 in the edge area 120, so that the ink can flow to the preset area in the edge area 120, which is beneficial to prevent excessive overflow of ink and effectively improve the reliability of the display panel packaging.

[0080] The embodiment of the present application also provides a display device, which includes a display panel. Since the display device has the above-mentioned display panel, it has all the same beneficial effects, and this embodiment will not be repeated here. The embodiment of the present application does not specifically limit the applicability of the display device, which can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a wearable display device (such as a smart bracelet, a smart watch, etc.), a mobile phone, a virtual reality device, an augmented reality device, a car display, an advertising light box, etc.

[0081] In the above embodiments, the description of each embodiment has its own focus. For parts not described in detail in a particular embodiment, please refer to the relevant description of other embodiments. In specific implementation, the above units or structures can be implemented as independent entities, or they can be arbitrarily combined and implemented as the same or multiple entities. The specific implementation of the above units or structures can be referred to the previous method embodiments and will not be repeated here.

[0082] The above is a detailed introduction to a display panel, a manufacturing method thereof, and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the embodiments of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and an edge area, and includes: Flexible light-emitting substrate; a first inorganic encapsulation layer, disposed on the flexible light-emitting substrate, wherein the first inorganic encapsulation layer is located in the display area and the edge area; a first interface layer, disposed in the display area on the first inorganic encapsulation layer; an organic encapsulation layer, a portion of which is disposed on the first interface layer and another portion of which is disposed on the first inorganic encapsulation layer in the edge region; a second inorganic encapsulation layer covering the organic encapsulation layer; The display panel further includes: a second interface layer, disposed between the organic encapsulation layer and the second inorganic encapsulation layer, the second interface layer being located in the display area; The edge area also includes a packaging area and a clearance area that are adjacently arranged; The organic encapsulation layer is located in the encapsulation area; The first inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the flexible light-emitting substrate in the clearance area; The second inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the first inorganic encapsulation layer in the clearance area; The plane where the top surface of the second inorganic encapsulation layer located in the clearance area is lower than the plane where the top surface of the first interface layer is located, and the clearance area of the display panel is not provided with a retaining wall.

2. The display panel according to claim 1, wherein: The first interface layer and / or the second interface layer are made of silicon oxide or silicon oxynitride, and the refractive index of the first interface layer and / or the second interface layer is in the range of 1.4-1.

6.

3. The display panel according to claim 1, wherein: The first inorganic encapsulation layer is a passivation layer, and the passivation layer is used to slow down the flow speed of the ink forming the organic encapsulation layer.

4. A method for manufacturing a display panel, characterized in that: The display panel includes a display area and an edge area, and the method includes: Providing a flexible light-emitting substrate; preparing a first inorganic encapsulation layer on the flexible light-emitting substrate, so that the first inorganic encapsulation layer is located in the display area and the edge area; preparing a first interface layer in the display area on the first inorganic encapsulation layer; preparing an organic encapsulation layer on the first interface layer and the first inorganic encapsulation layer in the edge region by inkjet printing; preparing a second inorganic encapsulation layer on the organic encapsulation layer; After the step of preparing an organic encapsulation layer on the first interface layer and the first inorganic encapsulation layer in the edge region by inkjet printing, the method further includes: Depositing silicon oxide or silicon oxynitride material on the organic encapsulation layer in the display area by chemical vapor deposition to form a second interface layer; The step of preparing a second inorganic encapsulation layer on the organic encapsulation layer comprises: preparing a second inorganic encapsulation layer on the second interface layer; The edge area also includes a packaging area and a clearance area that are adjacently arranged; The organic encapsulation layer is located in the encapsulation area; The first inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the flexible light-emitting substrate in the clearance area; The second inorganic encapsulation layer is located in the encapsulation area and the clearance area, and the first inorganic encapsulation layer is arranged on the surface of the first inorganic encapsulation layer in the clearance area; The plane where the top surface of the second inorganic encapsulation layer located in the clearance area is lower than the plane where the top surface of the first interface layer is located, and the clearance area of the display panel is not provided with a retaining wall.

5. The production method according to claim 4, characterized in that: The step of preparing a first interface layer on the first inorganic encapsulation layer so that the first interface layer is located in the display area includes: A silicon oxide or silicon oxynitride material is deposited on the first inorganic encapsulation layer in the display area by chemical vapor deposition to form a first interface layer, wherein the refractive index of the silicon oxide or silicon oxynitride material is in the range of 1.4-1.

6.

6. The manufacturing method according to claim 4, characterized in that: The step of preparing a first inorganic encapsulation layer on the flexible light-emitting substrate further includes: The surface of the first inorganic encapsulation layer is passivated by using plasma gas formed by hydrogen or ammonia to slow down the flow rate of the ink forming the organic encapsulation layer.

7. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 3.

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