Capacitor with base plate

Abstract

A capacitor with a seat plate is provided with a capacitor main body and a seat plate that holds the capacitor main body. The capacitor main body is provided with a capacitor element, a case having an opening for accommodating the capacitor element, a closure member that closes the opening of the case, and a plurality of lead terminals that pass through the closure member and the seat plate. The seat plate has a first surface and a second surface opposite the first surface, and holds a heat dissipation member. The heat dissipation member is exposed at the first surface and the second surface. The capacitor element is arranged on the second surface side of the seat plate. The case is in contact with the area of the heat dissipation member exposed at the second surface.

Description

Technical Field

[0001] This invention relates to plate capacitors, and more particularly to improvements in heat dissipation. Background Technology

[0002] Capacitors are typically mounted to a substrate via a mounting plate. The capacitor's leads are inserted into through holes formed in the mounting plate and then bent to run along the mounting surfaces of the mounting plate and the substrate. The leads positioned on the mounting surfaces are then used for soldering to the substrate.

[0003] Patent documents 1 and 2 propose a base plate with walls that support the sides of a capacitor. This allows the capacitor to be supported over a wider area, thereby improving vibration resistance.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2008-130774

[0007] Patent Document 2: Japanese Patent Application Publication No. 2016-076600 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] When an alternating current (AC) voltage is applied to a capacitor, an AC charging and discharging current (ripple current) flows through it. The capacitor elements that make up the capacitor have an internal resistance called ESR, and therefore generate heat due to the ripple current. However, the capacitor base is usually made of resin, so the heat generated inside the electrolytic capacitor is not easily dissipated. This heat causes the capacitor elements to deteriorate easily, making it difficult to use them for extended periods.

[0010] Methods for solving problems

[0011] In view of the above, the first aspect of the present invention relates to a plate-mounted capacitor comprising a capacitor body and a plate for holding the capacitor body. The capacitor body comprises a capacitor element, a housing having an opening for receiving the capacitor element, a sealing member for closing the opening of the housing, and a plurality of lead terminals passing through the sealing member and the plate. The plate has a first surface and a second surface opposite to the first surface, and holds a heat dissipation member. The heat dissipation member is exposed on both the first and second surfaces. The capacitor element is disposed on the second surface side of the plate. The housing contacts the area of ​​the heat dissipation member exposed on the second surface.

[0012] A second aspect of the present invention relates to a plated capacitor comprising a capacitor body and a plated base for holding the capacitor body. The capacitor body includes a capacitor element, a housing having an opening for receiving the capacitor element, a sealing member for closing the opening of the housing, and a plurality of lead terminals passing through the sealing member and the plated base. The plated base has a base having a first surface and a second surface opposite to the first surface, and a support wall extending from the base along the circumferential surface of the housing, and holds a heat dissipation member. The capacitor element is disposed on the second surface side of the plated base. A portion of the heat dissipation member is disposed on the support wall, and the heat dissipation member is exposed on the first surface of the base.

[0013] Invention Effects

[0014] According to the present invention, the heat generated inside the plate capacitor can be easily dissipated to the outside, thus achieving a long lifespan and enabling the ripple current to be set high. Attached Figure Description

[0015] Figure 1 This is a schematic perspective view of a plate capacitor according to an embodiment of the present invention.

[0016] Figure 2A This is a top view schematically illustrating an example of a seat plate as seen from the second side according to an embodiment of the present invention.

[0017] Figure 2B This is a schematic representation of the view from the first side. Figure 2A A top view of an example of a seat plate.

[0018] Figure 3A This is a top view schematically illustrating an example of another seat plate as seen from the second side according to an embodiment of the present invention.

[0019] Figure 3B This is a schematic representation of the view from the first side. Figure 3A A top view of an example of a seat plate.

[0020] Figure 4A This is a top view schematically illustrating an example of another panel as viewed from the second side according to an embodiment of the present invention.

[0021] Figure 4B This is a schematic representation of the view from the first side. Figure 4A A top view of an example of a seat plate.

[0022] Figure 5 This is a perspective view schematically illustrating a plate capacitor according to another embodiment of the present invention.

[0023] Figure 6A This is a top view schematically illustrating an example of a seat plate as seen from the second side according to another embodiment of the invention.

[0024] Figure 6B This is a schematic representation of the view from the first side. Figure 6A A top view of an example of a seat plate.

[0025] Figure 6C This is a schematic representation of the view from the first side. Figure 6A A top view of another example of a seat plate.

[0026] Figure 7 This is a top view schematically illustrating another example of a seat plate as seen from the second side, according to another embodiment of the invention.

[0027] Figure 8 This is a schematic longitudinal sectional view of a plate capacitor according to an embodiment of the present invention. Detailed Implementation

[0028] Multiple leads electrically connected to the capacitor element pass through the sealing member and the base plate and are led out to the outside of the capacitor body. These leads are typically bent along the substrate side of the base plate to engage with circuitry or the like provided on the substrate. Therefore, conventionally, heat from the capacitor element is released to the substrate or the like via the leads. However, the thickness of the leads is limited, making it difficult to achieve sufficient heat dissipation to handle high ripple currents.

[0029] The heat dissipation member is held in place by the base plate according to this embodiment, and the heat dissipation member is exposed from the surface (first surface) on the substrate side. Therefore, in addition to the lead terminals, heat dissipation is promoted by the heat dissipation member, and the heat of the capacitor is rapidly transferred to the substrate and the like via the heat dissipation member.

[0030] [First Implementation]

[0031] The capacitor with a base plate according to this embodiment includes a capacitor body and a base plate for holding the capacitor body. The capacitor body includes a capacitor element, a housing having an opening for receiving the capacitor element, a sealing member for closing the opening of the housing, and a plurality of lead terminals passing through the sealing member and the base plate.

[0032] The base plate (first base plate) according to this embodiment has a first surface and a second surface opposite to the first surface. The first base plate holds a heat dissipation member (first heat dissipation member). The first heat dissipation member is exposed on both the first surface and the second surface. A capacitor element is disposed on the second surface side of the first base plate. Furthermore, the housing containing the capacitor element and the area of ​​the first heat dissipation member exposed on the second surface are in contact. That is, the first heat dissipation member provides thermal connection to the housing and the substrate on which the capacitor is mounted. As a result, the heat of the capacitor is rapidly transferred to the substrate via the first heat dissipation member, thereby suppressing heat-induced degradation of the capacitor element.

[0033] (1st seat board)

[0034] The first mounting plate is a flat plate having a first surface and a second surface. The shapes of the first and second surfaces, when viewed from the normal direction, can be, for example, rectangular or approximately rectangular. At least one corner of the rectangular or approximately rectangular first mounting plate can be chamfered. This makes it easier to determine the orientation when assembling the capacitor body onto the mounting plate, or to determine the polarity of the lead terminals extending from the capacitor body. The first mounting plate is provided with through holes for lead terminal insertion.

[0035] A positioning part for positioning the capacitor body may be provided on the second surface of the first base plate opposite to the capacitor body. A groove for receiving lead terminals may be provided on the first surface of the first base plate opposite to the substrate, etc.

[0036] The material of the first substrate is not particularly limited. The first substrate may include, for example, thermosetting resins and thermoplastic resins such as epoxy resin, phenolic resin, silicone resin, melamine resin, urea resin, alkyd resin, polyurethane, polyimide, unsaturated polyester, polyphenylene sulfide, and polyphthalamide. Among these, polyphenylene sulfide or polyphthalamide is preferred due to its excellent heat resistance.

[0037] The thickness of the first plate, which is flat, is not particularly limited and can be set appropriately according to the size of the capacitor.

[0038] (First heat dissipation component)

[0039] The first heat dissipation component is embedded in the base plate. "Embedded in the base plate" means that the first heat dissipation component is embedded in the base plate. However, a portion of the first heat dissipation component is exposed from the first and second surfaces of the first base plate. Furthermore, the heat dissipation components exposed on the first and second surfaces are thermally connected to each other.

[0040] The shape of the first heat dissipation member is not particularly limited. From the viewpoint of miniaturization, the heat dissipation member is preferably shaped in a way that does not excessively alter the shape of the base plate. This allows for the easy replacement of the base plate used in the past with the base plate involved in this embodiment. The first heat dissipation member held in a flat first base plate may, for example, also be flat.

[0041] The exposed shape of the heat dissipation member as viewed from the first side is not particularly limited. The first heat dissipation member only needs to be slightly exposed on the first side. The first side of the first base plate is the mounting surface for mounting onto the substrate or the like. The first heat dissipation member exposed on the first side of the first base plate is, for example, configured to contact the wiring pattern of the substrate. This improves the heat dissipation effect of the first heat dissipation member. Therefore, the heat of the capacitor element is efficiently transferred to the substrate or the like through the first heat dissipation member and the lead terminals. The first heat dissipation member and the wiring pattern of the substrate are preferably joined using a conductive bonding material containing metal, such as solder or conductive adhesive. Preferably, a component with high thermal conductivity, such as a thermally conductive sheet, is placed between the first heat dissipation member and the wiring pattern of the substrate.

[0042] In order to facilitate the rapid release of heat received by the exposed portion on the second side from the exposed portion on the first side, it is preferable that the exposed shape of the first heat dissipation member viewed from the first side corresponds to the exposed shape of the first heat dissipation member viewed from the second side. As a result, the heat transfer path is easily shortened.

[0043] To facilitate efficient heat dissipation from the exposed portion on the second side through the exposed portion on the first side, it is preferable that the first heat dissipation member is exposed as wide as possible on the first side. However, to prevent short circuits, it is preferable that the first heat dissipation member in contact with the housing is exposed on the first side in a manner that does not contact the anode lead terminal. On the other hand, it is preferable that the exposed portion on the first side contacts the cathode lead terminal. This allows the heat from the capacitor transmitted via the lead terminal to be rapidly transferred to the heat dissipation member.

[0044] The exposed portion of the first heat dissipation member on its first surface can be 5% or more, or 10% or more, of the area of ​​the first surface. Preferably, the first heat dissipation member is exposed on its first surface in a relatively wide area that does not contact the anode lead terminal. From the viewpoint of preventing short circuits, the exposed portion of the first heat dissipation member on its first surface can be 70% or less, or 60% or less, of the area of ​​the first surface.

[0045] The exposed shape of the first heat dissipation member viewed from the second side is not particularly limited as long as it can contact the casing. The first base plate is disposed on the sealing member side of the capacitor body. As will be described later, when the end of the casing on the opening side (opening end) covers the periphery of the surface of the base plate side of the sealing member, the exposed shape of the first heat dissipation member viewed from the second side can be, for example, an annular shape corresponding to the opening end of the casing, or a shape corresponding to a portion of the opening end of the casing.

[0046] The material of the first heat dissipation component is not particularly limited as long as it has high thermal conductivity. For example, the first heat dissipation component may have a thermal conductivity of 100 W / m·K or higher, preferably 200 W / m·K or higher, and more preferably 300 W / m·K or higher. For better heat dissipation, it is preferable that the thermal conductivity of the first heat dissipation component is higher than that of the lead terminal. When the first heat dissipation component is in contact with the cathode lead terminal, it is preferable that the thermal conductivity of the first heat dissipation component is higher than that of the cathode lead terminal.

[0047] Materials with high thermal conductivity include metals such as aluminum, copper, iron, and stainless steel, as well as ceramics. Examples of ceramics with high thermal conductivity include silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (SiN), and alumina (Al₂O₃). Among these, Al is preferred due to its ease of molding.

[0048] The thickness of the first heat dissipation component can be set appropriately according to the thickness of the first base plate.

[0049] Figure 1 This is a schematic perspective view of the plate capacitor according to this embodiment.

[0050] The capacitor 1000A with a mounting plate according to this embodiment includes a capacitor body 100 and a first mounting plate 200 for holding the capacitor body 100. The first mounting plate 200 has a first surface 200X and a second surface 200Y opposite to the first surface 200X. The capacitor body 100 is disposed on the second surface 200Y side of the first mounting plate 200. The first mounting plate 200 is generally flat, and a positioning portion 230 for positioning the capacitor body 100 is provided on the second surface 200Y.

[0051] Figure 2A This is a top view schematically showing an example of the first base plate as viewed from the second side according to this embodiment.

[0052] The second surface 200Y of the first base plate 200A is roughly rectangular when viewed from the normal direction, with both corners chamfered. Two through holes 220 are provided on the first base plate 200A for inserting lead terminals.

[0053] A first heat dissipation member 210A is held in the first base plate 200A. The first heat dissipation member 210A is embedded in the first base plate 200A, but a portion of it is exposed from the first surface 200X side and the second surface 200Y side of the first base plate 200A, respectively. The first heat dissipation member 210A is obtained by processing a generally flat metal plate, for example, into a corrugated shape. The exposed shape of the first heat dissipation member 210A, viewed from the second surface 200Y side, corresponds to the protrusion of the corrugated metal plate, corresponding to a portion of the opening end of the housing. Thus, the first heat dissipation member 210A can contact the housing.

[0054] Figure 2B This is a schematic representation of the view from the first side. Figure 2A A top view of an example of a seat plate.

[0055] The first surface 200X of the first mounting plate 200A is the mounting surface when a mounting plate capacitor is mounted on a substrate, etc. A slot 240 for receiving lead terminals is provided on the first surface 200X.

[0056] The exposed shape of the first heat dissipation member 210A, viewed from the first surface 200X side, corresponds to the recess of a corrugated metal plate, and is another part of the opening end of the casing. The first heat dissipation member 210A exposed on the first surface 200X side is bonded to the wiring pattern of the substrate by solder or the like.

[0057] Figure 3A This is a top view schematically showing an example of another plate as viewed from the second side according to this embodiment. Figure 3B This is a schematic representation of the view from the first side. Figure 3A A top view of an example of a seat plate.

[0058] Figure 3A as well as Figure 3B The first base plate 200B shown, except for the exposed shapes of the first surface 200X side and the second surface 200Y side of the first heat dissipation member 210B, has the same shape as... Figure 2A as well as Figure 2B The first plate 200A shown has the same structure.

[0059] The first heat dissipation member 210B is obtained by bending a generally flat metal plate. For example, it is formed by punching a member having an annular body and two strips extending outward from two opposite points of the annular body from the metal plate, and bending each strip. In addition, the front ends of the strips are each broadened into a generally rectangular shape. As a result, the first heat dissipation member 210B is exposed in an annular shape on the second surface 200Y side, which corresponds to the opening end of the housing, and is exposed in two generally rectangular shapes on the first surface 200X side. The first heat dissipation member 210B covers about 20% of the area of ​​the first surface 200X. However, the first heat dissipation member 210B is exposed on the first surface 200X side in a manner that does not overlap with the grooves 240 on both sides that house the anode lead terminals.

[0060] Figure 4A This is a top view schematically showing an example of another panel as viewed from the second side according to this embodiment. Figure 4B This is a schematic representation of the view from the first side. Figure 4A A top view of an example of a seat plate.

[0061] Figure 4Aas well as Figure 4B The first base plate 200C shown, except for the exposed shapes of the first surface 200X side and the second surface 200Y side of the first heat dissipation member 210C, has the same shape as... Figure 2A as well as Figure 2B The first plate 200A shown has the same structure.

[0062] The first heat dissipation member 210C is also obtained by bending a generally flat metal sheet. For example, a member having an annular body and two strips extending outward from the annular body near it is punched from the metal sheet, and each strip is formed by bending it. Furthermore, the front ends of the strips are widened to a generally rectangular shape, and the two strips are connected. Thus, the first heat dissipation member 210C is exposed in an annular shape on the second surface 200Y side, roughly corresponding to the opening end of the housing, and is exposed in a generally rectangular shape on the first surface 200X side. The first heat dissipation member 210B covers approximately 45% of the area of ​​the first surface 200X.

[0063] However, to prevent short circuits, the first heat dissipation member 210C is exposed on the first surface 200X side in a manner that does not overlap with the groove 240 on the side housing the anode lead terminal. On the other hand, the first heat dissipation member 210C is exposed along the groove 240 on the other side housing the cathode lead terminal. Thus, the first heat dissipation member 210 and the cathode lead terminal can make contact, thereby improving the heat dissipation efficiency of the capacitor. The first heat dissipation member 210 and the cathode lead terminal make contact easier through the conductive bonding material used when mounting the capacitor on the substrate.

[0064] [Second Implementation]

[0065] The capacitor with a base plate according to this embodiment includes a capacitor body and a base plate for holding the capacitor body. The capacitor body includes a capacitor element, a housing having an opening for receiving the capacitor element, a sealing member for closing the opening of the housing, and a plurality of lead terminals passing through the sealing member and the base plate.

[0066] The base plate (second base plate) according to this embodiment has a base having a first surface and a second surface opposite to the first surface, and a support wall extending from the base along the circumferential surface of the housing. A portion of a heat dissipation member (second heat dissipation member) is disposed on the support wall of the second base plate. Another portion of the second heat dissipation member is exposed on the first surface of the second base plate. That is, the second heat dissipation member covers the housing with a wider area and thermally connects the circumferential surface of the housing and the substrate on which the capacitor is mounted. As a result, the heat of the capacitor is rapidly transferred to the substrate via the second heat dissipation member, thereby suppressing heat-induced degradation of the capacitor elements.

[0067] (2nd seat plate)

[0068] The second base plate has a base having a first surface and a second surface, and a support wall extending from the base along the circumference of the outer shell.

[0069] The base may be flat, for example. The base may also have the same shape as the first base plate. Furthermore, a through hole for inserting a lead terminal is provided in the base.

[0070] The support wall extends along the circumference of the housing, for example, in a direction from the open end of the housing toward the other end. The capacitor body is embedded in the support wall and fixed to the second base plate.

[0071] The shape of the support wall is not particularly limited. The support wall can be a cylinder covering the entire circumference of the outer casing, a cylinder covering only a portion of the circumference, or a column covering only a portion of the circumference. It is preferable to arrange multiple columnar support walls (hereinafter sometimes referred to as pillars). Preferably, the multiple pillars are arranged in a point-symmetric or approximately point-symmetric manner with respect to the center of the second surface. Approximately point-symmetric means, for example, that the center of gravity of each pillar is angularly equivalent to the center of the second surface. When the number of pillars is n, the central angle between the centers of gravity of adjacent pillars is preferably 360 / n degrees. The number of pillars can be, for example, 2 to 10. Considering the balance between the stability of the capacitor body and the ease of manufacturing the base plate, the number of pillars is preferably 2, 3, or 4. The heights of the multiple pillars can be the same or different.

[0072] The material of the second base plate is not particularly limited and can be the same as the first base plate. The base and the support wall can be separate or integrally formed. The thickness of the flat base is not particularly limited. For example, the thickness of the base can be 0.2 mm or more and 2.0 mm or less. The thickness of the support wall is also not particularly limited. For example, the thickness of the support wall can be 0.2 mm or more and 4.0 mm or less.

[0073] (Heat dissipation components)

[0074] A portion of the heat dissipation member (second heat dissipation member) held in the second base plate is disposed within the support wall. "Disposed within the support wall" means that the second heat dissipation member is contained within the support wall and not exposed therefrom, or that a portion of the second heat dissipation member is embedded in the support wall while another portion is exposed. However, in either case, the remaining portion of the second heat dissipation member is disposed in the base, and the second heat dissipation member disposed in the support wall and the second heat dissipation member disposed in the base are thermally connected. Furthermore, a portion of the second heat dissipation member disposed in the base is exposed from the first surface side.

[0075] The shape of the second heat dissipation member is not particularly limited. From the viewpoint of miniaturization, it is preferable that the heat dissipation member has a shape that does not excessively alter the shape of the support wall and the base. This allows for easy replacement of the conventionally used base plate with the base plate described in this embodiment. The second heat dissipation member disposed on the support wall, for example, has a curved surface along the circumference of the outer casing. The second heat dissipation member disposed on the base can be either an integral part of the second heat dissipation member disposed on the support wall or a separate component. When the second heat dissipation member disposed on the support wall and the base is an integral part, the second heat dissipation member disposed on the support wall can directly penetrate the base. When the second heat dissipation member disposed on the support wall and the base is a separate component, the second heat dissipation member disposed on the base can also be flat like the base.

[0076] A portion of the second heat dissipation component is exposed from the first side of the second base plate.

[0077] The exposed shape of the second heat dissipation member as viewed from the first side is not particularly limited. The exposed shape of the second heat dissipation member as viewed from the first side can also be the same as the projected shape of the second heat dissipation member disposed on the support wall projected onto the first side. That is, the support wall and the base can also be penetrated by a single second heat dissipation member. This makes it easier to shorten the heat transfer path.

[0078] In order to facilitate the efficient release of heat received by the exposed portion on the second side from the exposed portion on the first side, it is preferable that the second heat dissipation member is exposed as wide as possible on the first side. However, similarly to the first heat dissipation member, it is preferable that the second heat dissipation member is exposed on the first side in a manner that does not contact the anode lead terminal, while the exposed portion on the first side contacts the cathode lead terminal. Such an exposure shape can be achieved by making the second heat dissipation member disposed on the support wall and the second heat dissipation member disposed on the base separate.

[0079] The exposed portion of the second heat dissipation member on the first surface side can be 5% or more, or 10% or more, of the area of ​​the first surface. Preferably, the second heat dissipation member is exposed on the first surface side in a wider range without contacting the anode lead terminal. From the viewpoint of preventing short circuits, the exposed portion of the second heat dissipation member on the first surface side can be 70% or less, or 60% or less, of the area of ​​the first surface.

[0080] A portion of the second heat dissipation member may be contained within the supporting wall. In this case, the second heat dissipation member does not protrude from the supporting wall. Alternatively, a portion of the second heat dissipation member may be embedded in the supporting wall, while another portion protrudes from it. When the second heat dissipation member protrudes from the outer casing side of the supporting wall, the second heat dissipation member and the outer casing can contact each other, thereby facilitating better heat dissipation.

[0081] The material of the second heat dissipation component is not particularly limited and can be the same as that of the first heat dissipation component. The thickness of the second heat dissipation component can be appropriately set according to the thickness of the supporting wall and / or the base.

[0082] Figure 5 This is a schematic perspective view of the plate capacitor according to this embodiment.

[0083] The capacitor 1000B with a mounting plate according to this embodiment includes a capacitor body 100 and a second mounting plate 300 for holding the capacitor body 100. The second mounting plate 300 has a base 301 having a first surface 300X and a second surface 300Y opposite to the first surface 300X, and four columnar support walls 302 extending from the base 301 along the circumferential surface of the housing. The capacitor body 100 is disposed on the second surface 300Y side of the second mounting plate 300.

[0084] Each of the four support walls 302 is equipped with a second heat dissipation member 310. The second heat dissipation member 310 is a metal plate that penetrates the base 301 and the support wall 302. The metal plate preferably has a shape along the circumferential surface of the outer casing, such as a curved surface. A portion of the second heat dissipation member 310 is disposed on the support wall 302 of the second base plate 300. Another portion of the second heat dissipation member 310 is disposed within the base 301.

[0085] Figure 6A This is a top view schematically showing an example of the seat plate as viewed from the second side according to this embodiment.

[0086] The second surface 300Y of the second base plate 300A is roughly rectangular when viewed from the normal direction, with two corners chamfered. Two through holes 320 for lead wire terminals are provided on the second base plate 300A. Columnar support walls 302 are respectively disposed at the four corners of the second surface 300Y, and are arranged approximately point-symmetrically with respect to the center of the second surface 300Y. The support walls 302 are all of the same height. The second heat dissipation member 310A is contained within the support walls 302 and does not protrude from them. Furthermore, the second heat dissipation member 310A is not exposed when viewed from the second surface 300Y side.

[0087] Figure 6B This is a schematic representation of the view from the first side. Figure 6A A top view of an example of a seat plate.

[0088] The first surface 300X is the mounting surface when a capacitor with a mounting plate is mounted on a substrate, etc. Two slots 340 are provided on the first surface 300X for accommodating lead terminals.

[0089] The exposed shape of the second heat dissipation member 310A viewed from the first surface 300X side is the same as the projected shape of the second heat dissipation member 310A disposed on the support wall 302 projected onto the first surface 300X.

[0090] Figure 6C This is a schematic representation of the view from the first side. Figure 6A A top view of another example of a seat plate.

[0091] Figure 6C The second base plate 300B shown, in addition to having a flat and generally rectangular second heat dissipation member 310B disposed at the base 301, has the same... Figure 6A as well as Figure 6B The second plate 300A shown has the same structure.

[0092] The exposed shape of the second heat dissipation member 310B, viewed from the first surface 300X side, is a combination of a portion of the projected shape of the second heat dissipation member 310A, disposed on the support wall 302, projected onto the first surface 300X, and a generally rectangular shape based on the second heat dissipation member 310B. The second heat dissipation member 310B covers approximately 45% of the area of ​​the first surface 300X.

[0093] However, to prevent short circuits, the second heat dissipation member 310B is exposed on the first surface 300X side in a manner that does not overlap with the groove 340 on the side housing the anode lead terminal. On the other hand, the second heat dissipation member 310B is exposed along the groove 340 on the other side housing the cathode lead terminal. Thus, the second heat dissipation member 310B and the cathode lead terminal can make contact, thereby improving the heat dissipation efficiency of the capacitor. The second heat dissipation member 310B and the cathode lead terminal make contact easier through the conductive bonding material used when mounting the capacitor on the substrate.

[0094] Figure 7 This is a top view schematically showing another example of the seat plate as viewed from the second side according to this embodiment.

[0095] Figure 7 The second base plate 300C shown has the same characteristics as the second heat dissipation member 310C, except that the second heat dissipation member 310C is exposed from the outer casing side of the support wall 302. Figure 6A as well as Figure 6B The seat plate shown has the same structure.

[0096] A portion of the second heat dissipation member 310C is embedded in the support wall 302, but a portion protrudes from the outer casing side of the support wall 302. Therefore, the second heat dissipation member 310C and the outer casing can contact each other, thereby further improving heat dissipation.

[0097] The following describes other structural components of the plate capacitor involved in this embodiment.

[0098] (Capacitor element)

[0099] A capacitor element may include, for example, an anode having a dielectric layer, a cathode, and a solid electrolyte between the anode and cathode. In the case of a wound capacitor element, the foil-shaped anode and foil-shaped cathode are wound into a spiral shape.

[0100] (Anode)

[0101] The anode body is a metal foil containing at least one valve-acting metal such as titanium, tantalum, aluminum, or niobium. The anode body may contain the valve-acting metal in the form of an alloy or a compound containing the valve-acting metal. The thickness of the anode body is not particularly limited, but may be, for example, 15 μm or more and 300 μm or less. The thickness is the average of any five points (the same applies below). The surface of the anode body may also be roughened by etching or the like.

[0102] A dielectric layer is formed on the surface of the anode body. This dielectric layer is formed, for example, by chemically synthesizing the anode body. In this case, the dielectric layer may contain an oxide of the valve-acting metal. However, the dielectric layer is not limited to this; any material that functions as a dielectric can be used.

[0103] (Cathode)

[0104] The cathode body only needs to function as a cathode and is not particularly limited. The cathode body can be a metal foil. The type of metal is not particularly limited; it can be a valve-acting metal or an alloy containing a valve-acting metal, similar to the anode body, or a metal other than a valve-acting metal such as iron (Fe) or copper (Cu). The thickness of the cathode body is not particularly limited, for example, it can be 15 μm or more and 300 μm or less. The surface of the cathode body can be roughened or chemically treated as needed. Furthermore, an inorganic layer containing carbon, nickel, titanium, and their oxides or nitrides can be formed on the surface of the cathode body.

[0105] (Isolation component)

[0106] Alternatively, the separator can be positioned between the anode and cathode. If a sufficiently thick solid electrolyte is placed between the anode and cathode, the separator can also be omitted.

[0107] There are no particular limitations on the material of the spacer, as long as it is porous. Examples of spacers include nonwoven fabrics made of cellulose fibers, nonwoven fabrics made of glass fibers, microporous membranes made of polyolefins, woven fabrics, and nonwoven fabrics. There are no particular limitations on the thickness of the spacer, for example, it can be 10 μm or more and 300 μm or less.

[0108] (Solid electrolyte)

[0109] Solid electrolytes may contain conductive polymers, for example.

[0110] Examples of conductive polymers include polypyrrole, polythiophene, polyfuran, polyaniline, polyacetylene, polyphenylene, polyphenylene vinylidene, polyphenylene oxide, and polythiophene ethylene. They can be used alone, in combination of two or more monomers, or as copolymers of two or more monomers.

[0111] Furthermore, in this specification, polypyrrole, polythiophene, polyfuran, and polyaniline, respectively, refer to polymers with polypyrrole, polythiophene, polyfuran, and polyaniline as their basic backbones. Therefore, polypyrrole, polythiophene, polyfuran, and polyaniline can also include their respective derivatives. For example, polythiophene includes poly(3,4-ethylenedioxythiophene), etc.

[0112] Solid electrolytes may contain not only conductive polymers but also dopants. Dopants can be either monomolecular anions or polymeric anions. Specific examples of monomolecular anions include p-toluenesulfonic acid and naphthalenesulfonic acid. Specific examples of polymeric anions include polyvinylsulfonic acid, polystyrenesulfonic acid, polyallylsulfonic acid, polyacrylic acidsulfonic acid, polymethylpropylenesulfonic acid, poly(2-acrylamide-2-methylpropanesulfonic acid), polyisoprenesulfonic acid, and polyacrylic acid. They can be used alone or in combination of two or more. Furthermore, they can be polymers of a single monomer or copolymers of two or more monomers. Polymeric anions derived from polystyrenesulfonic acid are preferred.

[0113] (Lead terminal)

[0114] An anode lead terminal is connected to the anode body, and a cathode lead terminal is connected to the cathode body. The anode and cathode lead terminals pass through the sealing member and the base plate and are led out to the outside of the capacitor body. The led-out lead terminals are bent along the first surface of the base plate, for example, and are thus housed in a groove provided on the first surface of the base plate.

[0115] The material of the lead terminals is not particularly limited as long as it is electrochemically and chemically stable and has conductivity; it can be either metallic or non-metallic. Their shape is also not particularly limited.

[0116] (Sealing component)

[0117] The sealing component closes the opening of the outer shell.

[0118] The sealing component can be made of any insulating material. Elastomers are preferred as insulating materials. By using sealing components containing elastomers such as rubber, high sealing performance can be ensured. From the viewpoint of easily obtaining high heat resistance, silicone rubber, fluororubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber (such as Hypalon rubber), butyl rubber, and isoprene rubber are preferred.

[0119] (shell)

[0120] The housing has an opening for accommodating capacitor elements. The housing may include, for example, a cylindrical portion and a bottom wall that closes one end of the cylindrical portion. The other end of the cylindrical portion (the open end) is closed by a sealing member and is disposed on the base plate side. The housing may be cylindrical or substantially cylindrical in shape, for example.

[0121] The open end of the cylindrical section covers, for example, the periphery of the seat plate side of the sealing member. This open end is formed by riveting the open end and the sealing member. The portion of the heat dissipation member exposed from the second surface side contacts, for example, the aforementioned open end that covers the periphery of the seat plate side of the sealing member. Furthermore, an annular recess, reducing the inner diameter of the cylindrical section, may also be formed on the open end side of the cylindrical section. This annular recess is formed by necking or similar processes to fix the sealing member to the outer casing.

[0122] There are no particular limitations on the material of the outer casing; examples include aluminum, aluminum alloy, stainless steel, copper, iron, and brass. A surface layer with desired functionality (such as an oxide layer or resin layer) can be formed on the outer surface of the casing.

[0123] Figure 8 This is a schematic longitudinal sectional view of the plate capacitor according to this embodiment. Figure 8 The image shows a capacitor with a second base plate having a supporting wall.

[0124] The capacitor 1000B with a base plate includes a capacitor body 100 and a base plate (second base plate 300) for holding the capacitor body 100. The capacitor body 100 includes a capacitor element 10, a housing 20 having an opening for receiving the capacitor element 10, a sealing member 30 for closing the opening of the housing 20, and two lead terminals 40 extending through the sealing member 30 and the second base plate 300 to the outside of the capacitor body 100. The second base plate 300 has a base 301 and a support wall 302 extending from the base 301 along the circumferential surface of the housing 20. Heat dissipation members (not shown) are disposed on the base 301 and the support wall 302.

[0125] Industrial availability

[0126] Due to its excellent heat dissipation, this invention is particularly suitable for electrolytic capacitors carrying high ripple current.

[0127] Symbol Explanation

[0128] 1000A, 1000B: Capacitors with mounting plates;

[0129] 100: Capacitor body;

[0130] 10: Capacitor components;

[0131] 20: Outer shell;

[0132] 30: Sealing components;

[0133] 40: Lead terminal;

[0134] 200, 200A, 200B, 200C: First plate;

[0135] 200X: Page 1;

[0136] 200Y: Page 2;

[0137] 210A, 210B, 210C: First heat dissipation component;

[0138] 220: Through hole;

[0139] 230: Positioning unit;

[0140] 240: slot;

[0141] 300, 300A, 300B, 300C: Second seat plate;

[0142] 300X: Page 1;

[0143] 300Y: Page 2;

[0144] 301: Base;

[0145] 302: Support wall;

[0146] 310, 310A, 310B, 310C: Second heat dissipation component;

[0147] 320: Through hole;

[0148] 340: Slot.

Claims

1. A capacitor with a mounting plate, comprising: Capacitor body; and The base plate holds the capacitor body. The capacitor body comprises: Capacitor components; The housing has an opening for accommodating the capacitor element; A sealing component that closes the opening of the outer casing; and Multiple lead terminals penetrate the sealing member and the base plate. The base plate has a base having a first surface and a second surface opposite to the first surface, and a support wall extending from the base along the circumferential surface of the housing, and holds the heat dissipation members. The capacitor element is disposed on the second side of the base plate. The heat dissipation component is contained within the support wall and does not protrude from the support wall, or a portion of the heat dissipation component is embedded in the support wall while another portion protrudes from the support wall. The heat dissipation component is exposed on the first surface of the base.

2. The plate capacitor according to claim 1, wherein, The other portion of the heat dissipation component is in contact with the housing.

3. The plate capacitor according to claim 1 or 2, wherein, The plurality of lead terminals include cathode lead terminals. The cathode is connected to the heat dissipation component via lead terminals.

4. The plate capacitor according to claim 3, wherein, The thermal conductivity of the heat dissipation component is higher than that of the cathode lead terminal.

5. The plate capacitor according to claim 1 or 2, wherein, The capacitor element comprises an anode having a dielectric layer, a cathode having a dielectric layer, and a solid electrolyte between the anode and the cathode.

6. The plate capacitor according to claim 1 or 2, wherein, The capacitor element includes an electrolyte.

Images