A local heating device and a method of manufacturing the same

Abstract

The application provides a local heating device and a manufacturing method thereof. The local heating device comprises a heat dissipation fin, a first heat conductive metal, an insulating layer on the first heat conductive metal, a heating sheet on the insulating layer, a second heat conductive metal on the heating sheet, a temperature sensor in the second heat conductive metal and a semiconductor refrigeration sheet. The first heat conductive metal has a groove, and the insulating layer, the heating sheet and the second heat conductive metal are sequentially arranged in the groove from bottom to top. The semiconductor refrigeration sheet is arranged on the first heat conductive metal. The application adopts the semiconductor refrigeration sheet or the first heat conductive metal to manufacture a cold area, and a hot area is arranged in an opening. When the heat diffused outwardly is absorbed by the cold area generated by the semiconductor refrigeration sheet and the first heat conductive metal, the temperature diffusion is prevented, the temperature of the cold area can be accurately controlled, and the application is suitable for parts which need to be heated and refrigerated.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of microfluidics, and in particular to a local heating device and a manufacturing method thereof. BACKGROUND

[0002] In the application of digital microfluidics to polymerase chain reaction, two thermal zones with large temperature difference need to be set in two regions close to each other on the same substrate. Due to heat conduction, the thermal zone with higher temperature will transfer heat to the thermal zone with lower temperature, which may cause the actual temperature of the thermal zone with lower temperature to be higher than the set temperature. The prior art is to separate the two thermal zones far apart, which requires a larger area of the substrate, is higher in cost, and also increases the complexity of operation.

[0003] Therefore, it is necessary to design a new local heating device. SUMMARY

[0004] The present application aims to provide a local heating device that prevents temperature diffusion and can accurately control the temperature of a cold zone, and a manufacturing method thereof.

[0005] The present application provides a local heating device, which comprises a heat dissipation fin, a first heat-conductive metal on the heat dissipation fin, a heat insulation layer on the first heat-conductive metal, a heating sheet on the heat insulation layer, a second heat-conductive metal on the heating sheet, a temperature sensor in the second heat-conductive metal, and a semiconductor refrigeration sheet, wherein the first heat-conductive metal has a groove, and the heat insulation layer, the heating sheet, and the second heat-conductive metal are sequentially located in the groove from bottom to top; the semiconductor refrigeration sheet is located on the first heat-conductive metal; the semiconductor refrigeration sheet has oppositely arranged heating and refrigeration surfaces, and the refrigeration surface is arranged upward.

[0006] Further, the heat insulation layer, the heating sheet, and the second heat-conductive metal each have a gap between the groove and the opening.

[0007] The present application also provides a local heating device, which comprises a heat dissipation fin, a semiconductor refrigeration sheet on the heat dissipation fin, a heat insulation layer on the semiconductor refrigeration sheet, a heating sheet on the heat insulation layer, a second heat-conductive metal on the heating sheet, a temperature sensor in the second heat-conductive metal, and a first heat-conductive metal with an opening, wherein the heat insulation layer, the heating sheet, and the second heat-conductive metal are sequentially located in the opening from bottom to top; the semiconductor refrigeration sheet has oppositely arranged heating and refrigeration surfaces, and the refrigeration surface is arranged upward.

[0008] Further, the heat insulation layer, the heating sheet, and the second heat-conductive metal each have a gap between the opening and the first heat-conductive metal.

[0009] Further, the surface of the semiconductor refrigeration sheet in contact with the heat insulation layer is planar.

[0010] Further, the first heat conductive metal has a temperature sensor inside.

[0011] The application also provides a manufacturing method of the local heating device, comprising the following steps:

[0012] S1: forming the first heat conductive metal on the heat dissipation fin;

[0013] S2: forming the groove on the first heat conductive metal;

[0014] S3: sequentially forming the heat insulation layer, the heating sheet and the second heat conductive metal with a temperature sensor in the groove;

[0015] S4: laying the semiconductor refrigeration sheet with an opening on the first heat conductive metal and above the second heat conductive metal, the refrigeration surface of the semiconductor refrigeration sheet is upwardly arranged; the opening of the semiconductor refrigeration sheet is arranged corresponding to the groove of the first heat conductive metal, the heat insulation layer, the heating sheet and the second heat conductive metal are located in the groove and the opening; the heat insulation layer, the heating sheet and the second heat conductive metal all have gaps between the groove and the opening.

[0016] The application also provides a manufacturing method of the local heating device, comprising the following steps:

[0017] S1: forming the semiconductor refrigeration sheet on the heat dissipation fin, the refrigeration surface of the semiconductor refrigeration sheet is upwardly arranged;

[0018] S2: sequentially forming the heat insulation layer, the heating sheet and the second heat conductive metal with a temperature sensor on the semiconductor refrigeration sheet;

[0019] S3: laying the first heat conductive metal with an opening on the semiconductor refrigeration sheet and above the second heat conductive metal, the heat insulation layer, the heating sheet and the second heat conductive metal are located in the opening; the heat insulation layer, the heating sheet and the second heat conductive metal all have gaps between the first heat conductive metal.

[0020] Further, the first heat conductive metal has a temperature sensor inside.

[0021] The application adopts the semiconductor refrigeration sheet or the first heat conductive metal to manufacture the cold area, the hot area is located in the opening, the heat diffused outward by the hot area is absorbed by the cold area generated by the semiconductor refrigeration sheet and the first heat conductive metal to prevent the temperature diffusion, the temperature of the cold area can be accurately controlled, and the application is suitable for the parts which need to be heated and refrigerated. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 is a perspective exploded schematic view of a first embodiment of the local heating device of the embodiments of the present application;

[0024] Figure 2 is a sectional view of the local heating device shown in Figure 1

[0025] Figure 3 is a sectional view of the local heating device shown in Figure 1

[0026] Figure 4 is a sectional view of the local heating device shown in Figure 1

[0027] Figure 5 is a sectional view of the local heating device shown in Figure 1

[0028] Figure 6 is a sectional view of the local heating device shown in

[0029] Figure 7 is a perspective exploded schematic view of a second embodiment of the local heating device of the embodiments of the present application;

[0030] Figure 8 is a sectional view of the local heating device shown in Figure 7 DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0032] ​​​​​In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, in the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0033] As shown in Figures 1 to 5 The first embodiment of the local heating device of the present application is shown in the structural diagram, which comprises a heat dissipation fin 10, a first heat-conducting metal 20 on the heat dissipation fin 10, a plurality of grooves 21 on the first heat-conducting metal 20, a heat insulation layer 31 on the first heat-conducting metal 20, a heating sheet 32 on the heat insulation layer 31, a second heat-conducting metal 33 on the heating sheet 32, a temperature sensor 34 in the second heat-conducting metal 33, and a semiconductor refrigeration sheet 40, wherein the number of the heat insulation layer 31, the heating sheet 32 and the second heat-conducting metal 33 is the same as the number of the grooves 21; the heat insulation layer 31, the heating sheet 32 and the second heat-conducting metal 33 are sequentially located in the grooves 21 from bottom to top; the first heat-conducting metal 20 is used to conduct the high temperature generated by the semiconductor refrigeration sheet 40 to the heat dissipation fin 10, that is, to conduct heat to the heat dissipation fin 10, so as to enhance heat dissipation; the semiconductor refrigeration sheet 40 is located on the first heat-conducting metal 20, and the semiconductor refrigeration sheet 40 does not contact the second heat-conducting metal 33.

[0034] Figure 3 As shown, the semiconductor refrigeration sheet 40 comprises oppositely arranged heating surface 41 and refrigeration surface 42, and semiconductor material 43 between the heating surface 41 and the refrigeration surface 42. When one side of the semiconductor refrigeration sheet 40 is refrigerated, the other side must be heated, so the heat dissipation fin 10 is needed to dissipate the temperature of the heating surface 41, otherwise it will be burned out.

[0035] As shown in Figure 2 The refrigeration surface 42 of the semiconductor refrigeration sheet 40 is arranged upward, the semiconductor refrigeration sheet 40 has an opening 44 corresponding to the groove 21 of the second heat-conducting metal 33, the width of the opening 44 is the same as the width of the groove 21, and at least part of the second heat-conducting metal 33 is located in the opening 44.

[0036] The width of the heat insulation layer 31, the width of the heating sheet 32 and the width of the second heat conductive metal 33 are the same, the width of the heat insulation layer 31, the width of the heating sheet 32 and the width of the second heat conductive metal 33 are all smaller than the width of the groove 21, the sum of the thickness of the heat insulation layer 31, the thickness of the heating sheet 32 and the thickness of the second heat conductive metal 33 is equal to the sum of the depth of the groove 21 and the depth of the opening 44; the heat insulation layer 31, the heating sheet 32 and the second heat conductive metal 33 all have a gap 00 between the groove 21 and the opening 44, that is, the heat insulation layer 31, the heating sheet 32 and the second heat conductive metal 33 do not touch the semiconductor refrigeration sheet 40, and the heat generated by the heating sheet 32 will not be conducted to the first heat conductive metal 20 and the semiconductor refrigeration sheet 40 through the side wall of the groove 21 and the side wall of the opening 44.

[0037] As shown in Figure 4 , the second heat conductive metal 33 is provided with a recess hole 331 extending along the extension direction of the groove 21, the recess hole 331 extends from the inside of the second heat conductive metal 33 to the side surface of the second heat conductive metal 33, and the temperature sensor 34 is located in the recess hole 331.

[0038] The local heating device further comprises a heat conductive glue 341 and a high-temperature sealing glue 342 located in the recess hole 331, and a temperature sensor wire 343 connected with the temperature sensor 34 and extending out of the recess hole 331, the temperature sensor 34 is located between the heat conductive glue 341 and the high-temperature sealing glue 342, the heat conductive glue 341 is located in the recess hole 331, the high-temperature sealing glue 342 is located in the recess hole 331 and is arranged close to the side surface of the second heat conductive metal 33, and the temperature sensor wire 343 passes through the high-temperature sealing glue 342 and extends out of the recess hole 33.

[0039] The temperature sensor wire 343 senses the temperature of the temperature sensor 34 by contacting the temperature sensor 34, and the temperature sensor wire 343 transmits the temperature signal of the heat conductive metal 33 obtained by the temperature sensor 34 to the controller (not shown), and the controller judges whether the target temperature is reached according to the obtained signal.

[0040] In the first embodiment, the groove 21 and the opening 44 are both provided with two corresponding.

[0041] In other embodiments, as shown in Figure 6 , the groove 21 and the opening 44 can also be arranged in an array manner, such as a 2*4 manner, that is, a 2-column and 4-row manner, and the required number of the groove 21 and the opening 44 is designed according to the required number of the local heating device.

[0042] Figure 7 And Figure 8 , the second embodiment of the local heating device of the present application is shown in the structural schematic view, which is different from the first embodiment described above:

[0043] First, the semiconductor refrigeration sheet 40 is located on the heat dissipation fin 10, the heat insulation layer 31 is located on the semiconductor refrigeration sheet 40, the heating sheet 32 ​​is located on the heat insulation layer 31, the second heat-conducting metal 33 is located on the heating sheet 32, and the heat insulation layer 31, the heating sheet 32 ​​and the second heat-conducting metal 33 are located on the semiconductor refrigeration sheet 40 in sequence; the first heat-conducting metal 20 has an opening

[0044] 24 ˊ, the heat insulating layer 31, the heating plate 32 and the second heat conducting metal 33 are sequentially located in the opening 24 ˊ; the heat insulating layer 31, the heating plate 32 and the second heat conducting metal 33 are restricted in position by the opening 24 ˊ;

[0045] Second, a temperature sensor 34 is also provided inside the first heat-conducting metal 20.

[0046] The temperature sensor 34 in 20 is located on the side of the opening 24. The structure of the temperature sensor in the first heat-conducting metal 20 is as follows: Figure 4 The structures shown are the same and will not be repeated here.

[0047] The width of the thermal insulation layer 31, the width of the heating plate 32 and the width of the second thermally conductive metal 33 are the same, and the width of the thermal insulation layer 31, the width of the heating plate 32 and the width of the second thermally conductive metal 33 are all smaller than the width of the opening 24'. The sum of the thickness of the thermal insulation layer 31, the thickness of the heating plate 32 and the thickness of the second thermally conductive metal 33 is equal to the depth of the opening 24'. There is a gap 00 between the thermal insulation layer 31, the heating plate 32 and the second thermally conductive metal 33 (the first thermally conductive metal 20'), that is, the thermal insulation layer 31, the heating plate 32 and the second thermally conductive metal 33 do not touch the side wall of the opening 24'.

[0048] The first heat-conducting metal 20 ″ is provided with a recessed hole 332 in its side surface. The recessed hole 332 extends from the inside of the first heat-conducting metal 20 ″ to the side surface of the first heat-conducting metal 20 ″. The temperature sensor 34 is located in the recessed hole 332 .

[0049] The local heating device also includes a thermally conductive adhesive (not shown) and a high-temperature sealant (not shown) located in the recessed hole 332, and a temperature sensor wire connected to the temperature sensor (not shown) and extending out of the recessed hole 332. The temperature sensor is located between the thermally conductive adhesive (not shown) and the high-temperature sealant (not shown). The thermally conductive adhesive is located inside the recessed hole 332. The high-temperature sealant is located inside the recessed hole 332 and is arranged close to the side of the first thermally conductive metal 20ˊ. The temperature sensor wire passes through the high-temperature sealant and extends out of the recessed hole.

[0050] The temperature sensor lead wire 343 senses the temperature of the temperature sensor 34 by contacting the temperature sensor 34, and transmits the temperature signal of the heat-conducting metal 33 obtained by the temperature sensor 34 to a controller (not shown in the figure), which judges whether the target temperature is reached according to the obtained signal.

[0051] The heat-insulating layer 31, the heating sheet 32 and the second heat-conducting metal 33 are stacked to form a hot zone, and the temperature sensor lead wire 343 and the temperature sensor 34 detect the temperature in the hot zone in real time. Other areas of the local heating device are cold zones, and the hot zone is surrounded by the cold zones. By locally heating the hot zone and preventing temperature diffusion in the cold zones, different heating temperature zones can be generated without affecting each other.

[0052] The present application generates a cold zone by the semiconductor refrigeration sheet, and the hot zone is located in the opening of the semiconductor refrigeration sheet or the opening of the first heat-conducting metal. At this time, the heat diffused outward from the hot zone is absorbed by the cold zone generated by the semiconductor refrigeration sheet, thereby preventing temperature diffusion. By limiting the power supplied to the semiconductor refrigeration sheet and keeping the surface temperature of the semiconductor refrigeration sheet below room temperature, it is not necessary to accurately read the temperature of the cold zone, and it is suitable for parts that only need to be heated.

[0053] The present application also discloses a manufacturing method of a local heating device, as shown in Figures 1 to 6 The present application also discloses a manufacturing method of a local heating device, as shown in

[0054] S1: forming the first heat-conducting metal 20 on the heat dissipation fin 10;

[0055] S2: forming the groove 21 on the first heat-conducting metal 20;

[0056] S3: sequentially forming the heat-insulating layer 31, the heating sheet 32 and the second heat-conducting metal 33 with the temperature sensor 34 in the groove 11;

[0057] S4: laying the semiconductor refrigeration sheet 40 with the opening 44 on the first heat-conducting metal 20 and above the second heat-conducting metal 33, and setting the refrigeration surface 42 of the semiconductor refrigeration sheet 40 upward, and setting the opening 44 of the semiconductor refrigeration sheet 40 corresponding to the groove 21 of the first heat-conducting metal 20, and setting the heat-insulating layer 31, the heating sheet 32 and the second heat-conducting metal 33 in the groove 21 and the opening 44; the heat-insulating layer 31, the heating sheet 32 and the second heat-conducting metal 33 all have a gap 00 between the groove 21 and the opening 44.

[0058] The present application also discloses a manufacturing method of a local heating device, as shown in Figures 7 to 8 The present application also discloses a manufacturing method of a local heating device, as shown in

[0059] S1: Forming a semiconductor refrigeration sheet 40' on the heat dissipation fin 10;

[0060] S2: Forming a heat insulation layer 31, a heating sheet 32 and a second heat conductive metal 33 with a temperature sensor 34 on the semiconductor refrigeration sheet 40' in sequence, with the refrigeration surface 42 of the semiconductor refrigeration sheet 40' arranged upward;

[0061] S3: Laying the first heat conductive metal 20' with the opening 24' and the temperature sensor 34 on the semiconductor refrigeration sheet 40' and above the second heat conductive metal 33, with the heat insulation layer 31, the heating sheet 32 and the second heat conductive metal 33 located in the opening 24'; the heat insulation layer 31, the heating sheet 32 and the second heat conductive metal 33 all have gaps 00 with the first heat conductive metal 20'.

[0062] The present application uses a semiconductor refrigeration sheet or a first heat conductive metal to manufacture a cold zone, with a hot zone located in the opening; when the heat diffused outward by the hot zone is absorbed by the cold zone generated by the semiconductor refrigeration sheet and the first heat conductive metal, the temperature diffusion is prevented, the temperature of the cold zone can be accurately controlled, and the present application is suitable for parts that need both heating and refrigeration.

[0063] The above only discloses one preferred embodiment of the present application, of course, cannot limit the scope of the present application, those skilled in the art can understand that the above-mentioned embodiment can be implemented by all or part of the process, and the equivalent changes made according to the claims of the present application still belong to the scope covered by the present application.

Claims

1. A local heating device, characterized by The application relates to a heat dissipation fin (10), a semiconductor refrigeration piece (40') on the heat dissipation fin (10), a heat insulation layer (31) on the semiconductor refrigeration piece (40'), a heating piece (32) on the heat insulation layer (31), a second heat conductive metal (33) on the heating piece (32), a temperature sensor (34) in the second heat conductive metal (33) and a first heat conductive metal (20') with an opening (22'), wherein the heat insulation layer (31), the heating piece (32) and the second heat conductive metal (33) are sequentially arranged in the opening (22'); the semiconductor refrigeration piece (40') has a heating surface (41) and a refrigeration surface (42) arranged oppositely, and the refrigeration surface (42) is arranged upwards; the opening (22') is arranged in a plurality of intervals; the heat insulation layer (31), the heating piece (32) and the second heat conductive metal (33) have gaps (00) with the first heat conductive metal (20'). The semiconductor refrigeration piece (40') has an opening (44) corresponding to the groove (21), and at least part of the second heat conductive metal (33) is arranged in the opening (44). The heat insulation layer (31), the heating piece (32) and the second heat conductive metal (33) have gaps (00) with the groove (21) and the opening (44).

2. A local heating device, characterized by The semiconductor refrigeration piece (40') has an opening (44) corresponding to the groove (21), and at least part of the second heat conductive metal (33) is arranged in the opening (44). The heat insulation layer (31), the heating piece (32) and the second heat conductive metal (33) have gaps (00) with the first heat conductive metal (20').

3. The local heating device of claim 2, wherein, The surface of the semiconductor refrigeration piece (40') in contact with the heat insulation layer (31) is flat.

4. The local heating device of claim 2, wherein, The first heat conductive metal (20') is internally provided with the temperature sensor (34).

5. A method of manufacturing a local heating device, characterized by, The application further relates to a manufacturing method of the semiconductor refrigeration piece (40'), and the method comprises the following steps: S1: forming the first heat conductive metal (20) on the heat dissipation fin (10); S2: forming a plurality of grooves (21) arranged in intervals on the first heat conductive metal (20); S3: sequentially forming the heat insulation layer (31), the heating piece (32) and the second heat conductive metal (33) with the temperature sensor (34) in the groove (21); and S4: forming the semiconductor refrigeration piece (40') on the second heat conductive metal (33). S4: The semiconductor cooling sheet (40) with the opening (44) is laid on the first heat-conductive metal (20) and above the second heat-conductive metal (33), and the cooling surface (42) of the semiconductor cooling sheet (40) is arranged upwardly; The opening (44) of the semiconductor cooling sheet (40) is arranged correspondingly to the groove (21) of the first heat-conductive metal (20), and the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33) are located in the groove (21) and the opening (44); the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33) all have the gap (00) between the groove (21) and the opening (44).

6. A method of manufacturing a local heating device, characterized by, The method comprises the following steps: S1: Forming the semiconductor cooling sheet (40') on the heat dissipation fin (10), and arranging the cooling surface (42) of the semiconductor cooling sheet (40') upwardly; S2: Forming the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33) with the temperature sensor (34) on the semiconductor cooling sheet (40') in sequence; S3: Laying the first heat-conductive metal (20') with the opening (24') on the semiconductor cooling sheet (40') and above the second heat-conductive metal (33), and the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33) are located in the opening (24'); the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33) all have the gap (00) between the opening (24') and the heat insulation layer (31), the heating sheet (32) and the second heat-conductive metal (33), and the opening (24') is arranged in multiple intervals.

7. The method of manufacturing a local heating device according to claim 6, wherein The first heat-conductive metal (20') has the temperature sensor (34) therein.

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