A resource treatment analysis method, device, equipment and medium

Abstract

The present disclosure relates to a resource treatment analysis method, device, equipment and medium, the method comprising: obtaining historical production records of different batches of lot wafers in production equipment; taking the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number; after the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, obtaining the level of each lot wafer processed by the production equipment, taking the lot number higher than the level of the lot wafer to be analyzed as the conflict number; according to the treatment number and conflict number of the lot wafer to be analyzed, determining whether the lot wafer to be analyzed meets the treatment requirements matching the level of the lot wafer to be analyzed during the processing. The present disclosure can realize production control and capacity early warning control, and improve production efficiency.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a resource treatment analysis method, device, equipment and medium. Background Art

[0002] For many years, grade management has been the most basic and effective tool for controlling the production speed of individual lots in semiconductor production management. Different waiting processing times are given to different grades in production management practice so that the lots can get support from processing and engineering resources with different response times. In actual production, a specific analysis and evaluation plan is urgently needed to determine whether the processing and engineering resource support given to each lot during the production process is reasonable and whether the productivity of the production equipment is fully guaranteed. Summary of the invention

[0003] The present invention provides a resource treatment analysis method, device, equipment and medium, which can realize production control and capacity early warning control, and improve production efficiency.

[0004] According to a first aspect of an embodiment of the present disclosure, a resource treatment analysis method is provided, the method comprising:

[0005] Obtain historical production records of different batches of wafers in production equipment;

[0006] The batch number of the lot wafer to be analyzed after arriving at the production equipment and being processed is used as the treatment number;

[0007] After the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, the level of each lot wafer processed by the production equipment is obtained, and the number of lots higher than the level of the lot wafer to be analyzed is used as the number of conflicts;

[0008] According to the treatment number and conflict number of the lot wafer to be analyzed, it is determined whether the lot wafer to be analyzed meets the treatment requirement matching the grade of the lot wafer to be analyzed during the processing.

[0009] In a possible implementation, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing includes:

[0010] Determine, according to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when they arrive at any production equipment, whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment;

[0011] or

[0012] According to the corresponding average number of treatments and average number of conflicts when the lot of wafers to be analyzed arrives at different production equipment, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process.

[0013] In a possible implementation, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing includes:

[0014] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing;

[0015] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably;

[0016] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

[0017] In a possible implementation, the method further includes:

[0018] When it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing, the treatment number of the corresponding lot of wafers to be analyzed in the corresponding production equipment in the next production and processing cycle is adjusted.

[0019] In a possible implementation, the method further includes:

[0020] The production process of the current lot of wafers to be processed is simulated by dynamic estimation, the historical production records of the simulation are obtained, and the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment are re-determined;

[0021] According to the treatment number and conflict number of the simulation lot wafer to be analyzed, determine whether to adjust the treatment number of the simulation lot wafer to be analyzed until the simulation lot wafer to be analyzed meets the treatment requirements matching its grade during the entire simulation processing process or all lot wafers to be processed meet the treatment requirements matching their grade during the entire simulation processing process.

[0022] In a possible implementation, after obtaining the historical production records of different lots of wafers, the lot of wafers to be analyzed and the production equipment are determined in the following manner:

[0023] According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step;

[0024] Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer;

[0025] The lot wafers with increased slope in the trajectory are taken as lot wafers to be analyzed, and the target production step corresponding to the position of increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0026] In a possible implementation, after obtaining the simulated historical production records, the simulated lot wafer to be analyzed and the corresponding production equipment are re-determined in the following manner:

[0027] According to the corresponding production steps of different lot wafers in the simulation processing process, the simulated cumulative production time of different simulated lot wafers at the end of each production step is determined;

[0028] The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer;

[0029] The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0030] In a possible implementation, the obtaining of historical production records of wafers in different lots in a production device includes:

[0031] Obtain the time when wafers from different lots arrive at the production equipment and the time when they are processed by the production equipment.

[0032] In a possible implementation, the process of using the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number includes:

[0033] Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment;

[0034] According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period;

[0035] The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

[0036] According to a second aspect of an embodiment of the present disclosure, a resource treatment analysis device is provided, the device comprising:

[0037] The historical production record acquisition module is used to obtain the historical production records of different lot wafers in the production equipment;

[0038] A treatment number determination module, used to use the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number;

[0039] A conflict number determination module, used for obtaining the level of each lot of wafers processed by the production equipment after the lot of wafers to be analyzed arrives at the production equipment and before being processed by the production equipment, and taking the number of lots higher than the level of the lot of wafers to be analyzed as the conflict number;

[0040] The treatment analysis module is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing according to the treatment number and conflict number of the lot of wafers to be analyzed.

[0041] According to a third aspect of an embodiment of the present disclosure, there is provided an electronic device comprising: a processor; and a memory for storing processor executable instructions; wherein the processor implements the steps of the above-mentioned resource treatment analysis method by running the executable instructions.

[0042] According to a fourth aspect of an embodiment of the present disclosure, there is provided a computer-readable storage medium having computer instructions stored thereon, which, when executed by a processor, implement the steps of the above-mentioned high-resource treatment analysis method.

[0043] In addition, the technical effects brought about by any implementation method in the second to fourth aspects can refer to the technical effects brought about by different implementation methods in the first aspect, and will not be repeated here.

[0044] The technical solution provided by the embodiments of the present disclosure brings at least the following beneficial effects:

[0045] The present invention achieves the purpose of production control and capacity early warning control by expanding the data for multi-dimensional analysis and combining it with the actual status of the production line, and can also achieve a dynamic balance in the load of the entire production system, improve production efficiency, improve operational performance, and enhance the overall performance of the entire production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0047] Figure 1 is a schematic diagram of an application scenario according to an exemplary embodiment;

[0048] Figure 2 is a flow chart of a resource treatment analysis method according to an exemplary embodiment;

[0049] Figure 3 is a flow chart showing the processing of 2 lot wafers in 3 production equipments according to an exemplary embodiment;

[0050] Figure 4 It is a flow chart showing the processing of 3 lot wafers in 1 production equipment according to an exemplary embodiment;

[0051] Figure 5 is a flow chart showing the processing of 4 lot wafers in 1 production equipment according to an exemplary embodiment;

[0052] Figure 6 is a schematic diagram of a module structure of a resource treatment analysis device according to an exemplary embodiment;

[0053] Figure 7 is a schematic diagram of an electronic device showing a resource treatment analysis method according to an exemplary embodiment;

[0054] Figure 8 The present invention is a schematic diagram of a program product of a resource treatment analysis method according to an exemplary embodiment. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0056] The following are explanations of some of the terms that appear in the text:

[0057] 1. In the embodiments of the present disclosure, the term "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0058] 2. The term "dynamic estimation method" in the embodiments of the present disclosure means that when performing Fab (factory) production simulation, production resources are established in the system, such as a list of equipment, product processing flow sequence and standard processing time (Process Time), so that materials can be processed in a virtual production environment similar to the real world, entering and exiting the equipment, and when there are a lot of materials, they will automatically queue in front of the equipment for processing.

[0059] The application scenarios described in the embodiments of the present disclosure are intended to more clearly illustrate the technical solutions of the embodiments of the present disclosure, and do not constitute a limitation on the technical solutions provided by the embodiments of the present disclosure. It is known to those skilled in the art that with the emergence of new application scenarios, the technical solutions provided by the embodiments of the present disclosure are also applicable to similar technical problems. In the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more.

[0060] At present, different levels are usually set for different lots according to the processing requirements of the materials to be processed in different lots, the productivity requirements of the production equipment and the load of the entire production system, so as to ensure that the processing requirements of different lots are met, the productivity of the equipment is maximized and the relative balance of the load of the entire production system is achieved. However, after the actual production is put into operation, there is currently no specific analysis and evaluation plan for whether the support of processing and engineering resources given to each lot during the production process is reasonable and whether the productivity of the production equipment is fully guaranteed.

[0061] In order to solve the above problems, the present disclosure provides a hierarchical resource conflict analysis method, device, equipment and medium to achieve the purpose of production control and capacity early warning control.

[0062] First reference Figure 1 , which is a schematic diagram of an application scenario of an embodiment of the present disclosure. The production equipment 10 and the network server 11 are connected to each other through a communication network, which can be a local area network, a wide area network, etc. During the entire production process, each production equipment 10 (such as production equipment 1, production equipment 2 or production equipment 3) provides the historical production records of each lot of wafers in the production equipment to the network server 11.

[0063] In the disclosed embodiment, the network server 11 obtains the historical production records of different lot wafers provided by the production equipment 10 in the production equipment; takes the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number; after the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, obtains the grade of each lot wafer processed by the production equipment, and takes the number of lots higher than the grade of the lot wafer to be analyzed as the conflict number; based on the treatment number and conflict number of the lot wafer to be analyzed, determines whether the lot wafer to be analyzed meets the treatment requirements matching the grade of the lot wafer to be analyzed during the processing.

[0064] Example 1

[0065] The following is a description of a resource treatment analysis method provided by the present disclosure through a specific embodiment. Figure 2 As shown, including:

[0066] Step 201, obtaining historical production records of different batches of lot wafers in production equipment;

[0067] The disclosed embodiment obtains the historical production records of different lots of wafers during the period from when different lots of wafers arrive at the production equipment to when they are processed by the production equipment. Figure 3 As shown in FIG. 1 , during the production process, the transportation time and production time of lotA wafers and lotB wafers are similar when they are processed by three production equipments, but the waiting time is quite different. Therefore, the above historical production records include the time when different lot wafers arrive at the production equipments and the time when they are processed by the production equipments.

[0068] In production management practice, different lot wafers will have different levels, and different levels mean that lot wafers have different treatments, that is, the waiting time from the lot wafers arriving at the production equipment to being processed by the production equipment is different. The levels of different lot wafers are set according to integers greater than or equal to 0, and the level is inversely proportional to the level number. In one embodiment of the present disclosure, four levels are taken as an example, and level 0, level 1, level 2 and level 3 are sequentially reduced, where level 0 means that when the lot wafer arrives at the production equipment, there are no other lot wafers waiting in line in front, and the lot wafer is directly produced by the production equipment; the other levels mean that after the lot wafer arrives at the production equipment, it will be queued for production according to the level.

[0069] like Figure 4As shown, when 3 lot wafers are processed in one production equipment, the grade of lotA wafer is grade 0, and lotA wafer is directly produced by the production equipment, while the grade of lotB wafer is grade 1, and the grade of lotC wafer is grade 2, both of which are lower than the grade of lotA wafer, but the grade of lotB wafer is higher than the grade of lotC wafer, so lotB wafer and lotC wafer wait in turn after lotA wafer.

[0070] Step 202, taking the batch number of the lot wafer to be analyzed after arriving at the production equipment and being processed as the treatment number;

[0071] The production equipment and the lot wafers to be analyzed can be determined based on the importance of the production equipment and the lot wafers, or based on the busyness of the production equipment, or based on the trajectory of each lot wafer in the entire processing process.

[0072] In a fully loaded Fab, one of the factors that greatly affects the CT (Cycle time, cycle time or production time) of lot wafers is the waiting time of lot wafers. The order of the queue can be understood as the level of treatment. The essence of the level of treatment is which batch of lot wafers is processed by the production equipment, which is the number of treatments.

[0073] The above-mentioned batch number refers to the batch number obtained by screening and counting the lot wafers processed by the production equipment in the corresponding time period after the lot wafers to be analyzed arrive at the production equipment and before being processed by the production equipment. The batch number of the lot wafers to be analyzed processed after arriving at the production equipment is the count value plus 1.

[0074] like Figure 5 As shown, after lotD wafer arrives at the production equipment and before being processed by the production equipment, lotA wafer, lotB wafer and lotC wafer have been processed by the production equipment, and the count value is 3, then the batch number of lotD wafer is 4.

[0075] Step 203, after the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, the level of each lot wafer processed by the production equipment is obtained, and the number of lots higher than the level of the lot wafer to be analyzed is used as the number of conflicts;

[0076] The above-mentioned levels include four, which are level 0, level 1, level 2 and level 3. According to the obtained levels of each lot of wafers after the lot of wafers to be analyzed arrives at the production equipment and before being processed by the production equipment, the number of other lot wafers with higher levels than the lot wafer to be analyzed is determined as the conflict number, such as Figure 5As shown, after lotD wafer arrives at the production equipment and before being processed by the production equipment, lotA wafer, lotB wafer and lotC wafer are processed by the production equipment, and their levels are level 0, level 1 and level 1 respectively, which are all higher than the level of lotD wafer. Therefore, the conflict number of lotD wafer is 3.

[0077] Step 204 , determining whether the lot of wafers to be analyzed meets the treatment requirements that match the grade of the lot of wafers to be analyzed during processing, based on the treatment number and conflict number of the lot of wafers to be analyzed.

[0078] The present invention achieves the purpose of production control and capacity early warning control by expanding the data for multi-dimensional analysis and combining it with the actual status of the production line, and can make the load of the entire production system reach a dynamic balance, thereby improving production efficiency, improving operational performance, and having a certain improvement on the overall performance of the entire production line.

[0079] In this embodiment, the production equipment and the lot wafers to be analyzed can be determined according to the importance of the production equipment and the lot wafers, or according to the busyness of the production equipment, or according to the trajectory of each lot wafer in the entire processing process.

[0080] As an optional implementation, after obtaining the historical production records of different lot wafers in the production equipment, the lot wafers and the production equipment to be analyzed can be determined in the following manner according to the time when the different lot wafers arrive at the production equipment and the time when they are processed by the production equipment:

[0081] According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step;

[0082] Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer;

[0083] The lot wafer with an increased slope in the trajectory line is taken as the lot wafer to be analyzed, and the target production step corresponding to the position where the slope increases is determined, and the production equipment corresponding to the target production step is determined. The situation where the slope increases in the trajectory line means that the CT of the lot wafer is very long.

[0084] After determining the lot of wafers to be analyzed and the production equipment, the treatment number and conflict number of the lot of wafers to be analyzed are determined based on the production records obtained within the corresponding time period after the lot of wafers to be analyzed arrives at the production equipment and before being processed by the production equipment.

[0085] The number of wafers to be analyzed can be determined by:

[0086] Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment;

[0087] According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period;

[0088] The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

[0089] The conflict number of the lot wafer to be analyzed can be determined in the following manner:

[0090] Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment;

[0091] Screening out each lot of wafers processed by the production equipment within the time period;

[0092] Obtaining the grade of each lot of wafers screened out;

[0093] The number of lots that are higher than the wafer level of the lot to be analyzed is taken as the number of conflicts.

[0094] The disclosed embodiment takes four levels as an example, and decreases in order from level 0, level 1, level 2 and level 3. If the level of the lot wafer to be analyzed is level 2, after the lot wafer to be analyzed arrives at production equipment A and before being processed by production equipment A, there is one lot wafer with a level of level 0, and three lot wafers with a level of level 1, then the number of conflicts of the lot wafer to be analyzed is 4.

[0095] Each lot of wafers needs to be processed by multiple production equipment during the entire processing process. The matching of the treatment requirements and grades of each lot of wafers by each production equipment or in the entire processing process can be determined based on the corresponding treatment number and conflict number when each lot of wafers arrives at each production equipment during the entire processing process. Based on the determined treatment number and conflict number of the lot of wafers to be analyzed, it can be determined whether the lot of wafers to be analyzed meet the treatment requirements that match the grade of the lot of wafers to be analyzed during the processing process in the following two ways:

[0096] Method 1, according to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when arriving at any production equipment, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment;

[0097] Method 2, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process based on the average number of treatments and the average number of conflicts corresponding to the lot of wafers to be analyzed when the lot of wafers to be analyzed arrives at different production equipment, wherein the average number of treatments of the lot of wafers to be analyzed is obtained by the ratio of the number of treatments of the lot of wafers to be analyzed in different production equipment to the number of production equipment in the entire processing process, and the average number of conflicts of the lot of wafers to be analyzed is obtained by the ratio of the number of conflicts of the lot of wafers to be analyzed in different production equipment to the number of production equipment in the entire processing process.

[0098] When the above method 1 or method 2 is adopted, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process, including three situations:

[0099] In the first case, if the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing;

[0100] In the second case, if the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably;

[0101] In the third case, if the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

[0102] Among the above situations, the third situation is treated unreasonably. When it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing, the treatment number of the corresponding lot of wafers to be analyzed in the corresponding production equipment in the next production and processing cycle is adjusted, or the grade of the lot of wafers to be analyzed can be adjusted.

[0103] The above method 1 can be used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment, as shown in the following Table 1:

[0104] Table 1

[0105]

[0106]

[0107] When the treatment number is 1 and the conflict number is 0, the lot wafer to be analyzed is processed first, and there is no other lot wafer waiting in front. This belongs to the first situation mentioned above. The lot wafer to be analyzed is treated reasonably during the processing of this production equipment;

[0108] When the treatment number is 2 and the conflict number is 0, the lot of wafers to be analyzed is processed second, and the level of the previous lot of wafers is lower than itself, which belongs to the third situation mentioned above. The lot of wafers to be analyzed is treated unreasonably during the processing of this production equipment;

[0109] When the treatment number is 2 and the conflict number is 1, the lot of wafers to be analyzed is processed second, and the level of the previous lot of wafers is higher than that of the lot of wafers. This belongs to the first situation mentioned above. The lot of wafers to be analyzed is treated reasonably during the processing of this production equipment.

[0110] When the treatment number is 3 and the conflict number is 0, the lot of wafers to be analyzed is the third one to be processed, and the grades of the previous lot of wafers are all lower than itself, which belongs to the third situation mentioned above. The lot of wafers to be analyzed is treated unreasonably during the processing of this production equipment;

[0111] When the treatment number is 3 and the conflict number is 1, the lot wafer to be analyzed is the third one to be processed, and one of the previous lot wafers has a higher grade than itself, which belongs to the third situation mentioned above. The lot wafer to be analyzed is treated unreasonably during the processing of this production equipment;

[0112] When the treatment number is 3 and the conflict number is 2, the lot wafer to be analyzed is the third to be processed, and the two levels of the previous lot wafers are higher than itself, which belongs to the first situation mentioned above. The lot wafer to be analyzed is treated reasonably during the processing of this production equipment;

[0113] When the treatment number is 3 and the conflict number is 3, the lot wafer to be analyzed is the third one to be processed. The three lot wafers in front of it have higher levels than itself and occupy the lot wafers with higher levels than itself. This belongs to the second situation mentioned above. The lot wafer to be analyzed has a resource conflict during the processing of this production equipment and is treated reasonably.

[0114] The above method 2 can be used to determine whether the lot of wafers to be analyzed meets the treatment requirements that match the level of the lot of wafers to be analyzed during the processing. For example, the level of a lot of wafers to be analyzed is level 2. During the entire processing process, the average treatment number of the lot of wafers to be analyzed is 1.7, indicating that the lot of wafers to be analyzed are processed in the first or second batch position on average, which meets the treatment requirements of the level of the lot of wafers to be analyzed; the average conflict number of the lot of wafers to be analyzed is 1.27, indicating that the lot of wafers to be analyzed is not the first batch of production, and most of them are because the level of the previous lot of wafers is higher than it. Therefore, the lot of wafers to be analyzed are basically treated reasonably.

[0115] During the production process, the number of treatments of each lot of wafers in the corresponding production equipment in the current production and processing cycle can be adjusted according to the historical production records; or after or directly adjusting the number of treatments of each lot of wafers in the corresponding production equipment in the current production and processing cycle according to the historical production records, the production process of each lot of wafers can be simulated by dynamic simulation to obtain simulated historical production records, and the number of treatments of each lot of wafers can be adjusted. The production process of each lot of wafers can be simulated by dynamic simulation to obtain simulated historical production records, and the number of treatments of each lot of wafers can be adjusted, including:

[0116] The production process of the current lot of wafers to be processed is simulated by dynamic estimation, the historical production records of the simulation are obtained, and the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment are re-determined;

[0117] Determine whether to adjust the treatment number of the simulation lot wafer to be analyzed according to the treatment number and conflict number of the simulation lot wafer to be analyzed, until the simulation lot wafer to be analyzed meets the treatment requirements matching its grade during the entire simulation processing;

[0118] Alternatively, the above steps are repeated until all lot wafers to be processed meet the treatment requirements matching their grades during the entire simulation processing process.

[0119] In the above process, the grade of the simulated lot wafer to be analyzed may also be adjusted until the simulated lot wafer to be analyzed meets the treatment requirements that match its grade during the entire simulation processing process.

[0120] The above-mentioned simulated lot wafers to be analyzed and the corresponding production equipment can be determined according to the importance of the production equipment and the simulated lot wafers, or according to the busyness of the production equipment, or according to the trajectory of each simulated lot wafer in the entire processing process.

[0121] As an optional implementation, after simulating the production process of the current lot wafer to be processed by dynamic estimation and obtaining the simulated historical production record, the simulated lot wafer to be analyzed and the corresponding production equipment can be determined in the following manner:

[0122] According to the corresponding production steps of different lot wafers in the simulation processing process, the simulated cumulative production time of different simulated lot wafers at the end of each production step is determined;

[0123] The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer;

[0124] The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0125] Example 2

[0126] Based on the same inventive concept, the embodiment of the present disclosure also provides a resource treatment analysis device. Since the device is the device in the method in the embodiment of the present disclosure, and the principle of solving the problem by the device is similar to that of the method, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0127] like Figure 6 As shown, the above device includes the following modules:

[0128] The historical production record acquisition module 601 is used to acquire the historical production records of different batches of wafers in the production equipment;

[0129] The treatment number determination module 602 is used to use the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number;

[0130] The conflict number determination module 603 is used to obtain the level of each lot of wafers processed by the production equipment after the lot of wafers to be analyzed arrives at the production equipment and before being processed by the production equipment, and take the lot number higher than the level of the lot of wafers to be analyzed as the conflict number;

[0131] The treatment analysis module 604 is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing according to the treatment number and conflict number of the lot of wafers to be analyzed.

[0132] As an optional implementation manner, the treatment analysis module is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process, including:

[0133] Determine, according to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when they arrive at any production equipment, whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment;

[0134] or

[0135] According to the corresponding average number of treatments and average number of conflicts when the lot of wafers to be analyzed arrives at different production equipment, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process.

[0136] As an optional implementation manner, the treatment analysis module is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process, including:

[0137] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing;

[0138] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably;

[0139] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

[0140] As an optional implementation, the device further includes:

[0141] The treatment adjustment module is used to adjust the treatment number of the corresponding lot of wafers to be analyzed in the next production and processing cycle in the corresponding production equipment when it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing.

[0142] As an optional implementation, the device further includes:

[0143] The simulation module is used to simulate the production process of the current lot of wafers to be processed by dynamic estimation, obtain the simulated historical production records, and re-determine the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment;

[0144] The treatment adjustment module is used to determine whether to adjust the treatment number of the simulated lot wafer to be analyzed according to the treatment number and conflict number of the simulated lot wafer to be analyzed, until the simulated lot wafer to be analyzed meets the treatment requirements matching its level during the entire simulation processing process or all lot wafers to be processed meet the treatment requirements matching their level during the entire simulation processing process.

[0145] As an optional implementation, the historical production record acquisition module is used to obtain the historical production records of different lot wafers and then determine the lot wafer to be analyzed and the production equipment in the following manner:

[0146] According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step;

[0147] Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer;

[0148] The lot wafers with increased slope in the trajectory are taken as lot wafers to be analyzed, and the target production step corresponding to the position of increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0149] As an optional implementation, the treatment adjustment module is used to re-determine the simulated lot wafer to be analyzed and the corresponding production equipment in the following manner after obtaining the simulated historical production records:

[0150] According to the corresponding production steps of different lot wafers in the simulation processing process, the simulated cumulative production time of different simulated lot wafers at the end of each production step is determined;

[0151] The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer;

[0152] The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0153] As an optional implementation, the historical production record acquisition module is used to acquire the historical production records of different lot wafers, including:

[0154] Obtain the time when wafers from different lots arrive at the production equipment and the time when they are processed by the production equipment.

[0155] As an optional implementation, the treatment number determination module is used to use the batch number of the lot wafer to be analyzed after arriving at the production equipment and being processed as the treatment number, including:

[0156] Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment;

[0157] According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period;

[0158] The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

[0159] Example 3

[0160] Based on the same inventive concept, a resource treatment analysis electronic device is also provided in the embodiment of the present disclosure. Since the electronic device is the electronic device in the method in the embodiment of the present disclosure, and the principle of solving the problem by the electronic device is similar to that of the method, the implementation of the electronic device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0161] Refer to the following Figure 7 An electronic device 70 according to this embodiment of the present disclosure will be described. Figure 7 The electronic device 70 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present disclosure.

[0162] like Figure 7 As shown, the electronic device 70 may be in the form of a general-purpose computing device, for example, it may be a terminal device. The components of the electronic device 70 may include, but are not limited to: the at least one processor 71, the at least one memory 72 storing executable instructions of the processor 71, and a bus 73 connecting different system components (including the memory 72 and the processor 71), and the processor 71 is a processor of a smart device.

[0163] The processor 71 implements the following steps by running the executable instructions:

[0164] Obtain historical production records of different batches of wafers in production equipment;

[0165] The batch number of the lot wafer to be analyzed after arriving at the production equipment and being processed is used as the treatment number;

[0166] After the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, the level of each lot wafer processed by the production equipment is obtained, and the number of lots higher than the level of the lot wafer to be analyzed is used as the number of conflicts;

[0167] According to the treatment number and conflict number of the lot wafer to be analyzed, it is determined whether the lot wafer to be analyzed meets the treatment requirement matching the grade of the lot wafer to be analyzed during the processing.

[0168] As an optional implementation manner, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process includes:

[0169] Determine, according to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when they arrive at any production equipment, whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment;

[0170] or

[0171] According to the corresponding average number of treatments and average number of conflicts when the lot of wafers to be analyzed arrives at different production equipment, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process.

[0172] As an optional implementation manner, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process includes:

[0173] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing;

[0174] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably;

[0175] If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

[0176] As an optional implementation, the processor 71 further executes:

[0177] When it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing, the treatment number of the corresponding lot of wafers to be analyzed in the corresponding production equipment in the next production and processing cycle is adjusted.

[0178] As an optional implementation, the processor 71 further executes:

[0179] The production process of the current lot of wafers to be processed is simulated by dynamic estimation, the historical production records of the simulation are obtained, and the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment are re-determined;

[0180] According to the treatment number and conflict number of the simulation lot wafer to be analyzed, determine whether to adjust the treatment number of the simulation lot wafer to be analyzed until the simulation lot wafer to be analyzed meets the treatment requirements matching its grade during the entire simulation processing process or all lot wafers to be processed meet the treatment requirements matching their grade during the entire simulation processing process.

[0181] As an optional implementation, after obtaining the historical production records of different lot wafers, the lot wafers to be analyzed and the production equipment are determined in the following manner:

[0182] According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step;

[0183] Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer;

[0184] The lot wafers with increased slope in the trajectory are taken as lot wafers to be analyzed, and the target production step corresponding to the position of increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0185] As an optional implementation, after obtaining the simulated historical production records, the simulated lot wafer to be analyzed and the corresponding production equipment are re-determined in the following manner:

[0186] According to the corresponding production steps of different lot wafers in the simulation processing process, the simulated cumulative production time of different simulated lot wafers at the end of each production step is determined;

[0187] The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer;

[0188] The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

[0189] As an optional implementation manner, the obtaining of historical production records of different batches of lot wafers in production equipment includes:

[0190] Obtain the time when wafers from different lots arrive at the production equipment and the time when they are processed by the production equipment.

[0191] As an optional implementation manner, the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is used as the treatment number, including:

[0192] Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment;

[0193] According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period;

[0194] The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

[0195] Bus 73 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, a processor or local bus using any of a variety of bus architectures.

[0196] The memory 72 may include a readable medium in the form of a volatile memory, such as a random access memory (RAM) 721 and / or a cache memory 722 , and may further include a read-only memory (ROM) 723 .

[0197] The memory 72 may also include a program / utility 725 having a set (at least one) of program modules 724, such program modules 724 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0198] The electronic device 70 may also communicate with one or more external devices 74 (e.g., keyboards, pointing devices, etc.), may also communicate with one or more devices that enable a user to interact with the electronic device 70, and / or may communicate with any device that enables the electronic device 70 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 75. Furthermore, the electronic device 70 may also communicate with one or more networks (e.g., local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via a network adapter 76. As shown, the network adapter 76 communicates with other modules of the electronic device 70 via a bus 73. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with the electronic device 70, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0199] Example 4

[0200] In some possible embodiments, various aspects of the present disclosure may also be implemented in the form of a program product, which includes a program code. When the program product runs on a terminal device, the program code is used to enable the terminal device to execute the steps of each module in the resource treatment analysis device according to various exemplary embodiments of the present disclosure described in the above "Exemplary Method" section of this specification. For example, the terminal device can be used to obtain historical production records of different batches of lot wafers in production equipment; use the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number; after the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, obtain the grade of each lot wafer processed by the production equipment, and use the lot number higher than the grade of the lot wafer to be analyzed as the conflict number; determine whether the lot wafer to be analyzed meets the treatment requirements matching the grade of the lot wafer to be analyzed during the processing according to the treatment number and conflict number of the lot wafer to be analyzed, and other operations.

[0201] The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0202] like Figure 8 As shown, a program product 80 for resource treatment analysis according to an embodiment of the present disclosure is described, which can be in a portable compact disk read-only memory (CD-ROM) and includes program code, and can be run on a terminal device, such as a personal computer. However, the program product of the present disclosure is not limited thereto, and in this document, a readable storage medium can be any tangible medium containing or storing a program, which can be used by or in combination with an instruction execution system, an apparatus or a device.

[0203] A readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, wherein readable program code is carried. Such propagated data signals may take a variety of forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination of the foregoing. A readable signal medium may also be any readable medium other than a readable storage medium, which may transmit, propagate, or transfer a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0204] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0205] Program code for performing the operations of the present disclosure may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device may be connected to the user computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0206] It should be noted that although several modules or submodules of the system are mentioned in the above detailed description, this division is merely exemplary and not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules described above can be embodied in one module. Conversely, the features and functions of one module described above can be further divided into multiple modules to be embodied.

[0207] In addition, although the operations of the modules of the disclosed system are described in a specific order in the drawings, this does not require or imply that the operations must be performed in this specific order, or that all the operations shown must be performed to achieve the desired results. Additionally or alternatively, some operations may be omitted, multiple operations may be combined into one operation, and / or one operation may be decomposed into multiple operations.

[0208] Those skilled in the art will appreciate that the embodiments of the present disclosure may be provided as methods, systems, or computer program products. Therefore, the present disclosure may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present disclosure may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage and optical storage, etc.) containing computer-usable program code.

[0209] The present disclosure is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present disclosure. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that has the functions specified in one or more boxes.

[0210] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0211] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0212] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0213] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A resource treatment analysis method, characterized in that: The method includes: Obtain historical production records of different batches of wafers in production equipment; The batch number of the wafer lot to be analyzed after it arrives at the production equipment and is processed is used as the treatment number; After the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment, the level of each lot wafer processed by the production equipment is obtained, and the number of lots higher than the level of the lot wafer to be analyzed is used as the number of conflicts; Determine, according to the treatment number and conflict number of the lot wafer to be analyzed, whether the lot wafer to be analyzed meets the treatment requirements matching the grade of the lot wafer to be analyzed during processing; The determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process includes: According to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when arriving at any production equipment, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment; or According to the corresponding average number of treatments and average number of conflicts when the lot of wafers to be analyzed arrives at different production equipment, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process.

2. The method according to claim 1, characterized in that The determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process includes: If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing; If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably; If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

3. The method according to claim 1, characterized in that The method further comprises: When it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing, the treatment number of the corresponding lot of wafers to be analyzed in the corresponding production equipment in the next production and processing cycle is adjusted.

4. The method according to claim 1, characterized in that The method further comprises: The production process of the current lot of wafers to be processed is simulated by dynamic estimation, the historical production records of the simulation are obtained, and the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment are re-determined; According to the treatment number and conflict number of the simulation lot wafer to be analyzed, determine whether to adjust the treatment number of the simulation lot wafer to be analyzed until the simulation lot wafer to be analyzed meets the treatment requirements matching its grade during the entire simulation processing process or all lot wafers to be processed meet the treatment requirements matching their grade during the entire simulation processing process.

5. The method according to claim 1, characterized in that After obtaining the historical production records of different lot wafers, the lot wafers to be analyzed and the production equipment are determined in the following manner: According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step; Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer; The lot wafers with increased slope in the trajectory are taken as lot wafers to be analyzed, and the target production step corresponding to the position of increased slope is determined, and the production equipment corresponding to the target production step is determined.

6. The method according to claim 4, characterized in that After obtaining the simulated historical production records, the simulated lot wafer to be analyzed and the corresponding production equipment are re-determined in the following manner: According to the corresponding production steps of different lot wafers in the simulation processing process, the simulation cumulative production time of different simulation lot wafers at the end of each production step is determined; The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer; The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

7. The method according to claim 1, characterized in that The obtaining of historical production records of wafers in different lots in the production equipment includes: Obtain the time when wafers from different lots arrive at the production equipment and the time when they are processed by the production equipment.

8. The method according to claim 7, characterized in that The batch number of the lot wafer to be analyzed after arriving at the production equipment and being processed is used as the treatment number, including: Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment; According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period; The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

9. A resource treatment analysis device, characterized in that: The device comprises: The historical production record acquisition module is used to obtain the historical production records of different batches of wafers in the production equipment; The treatment number determination module is used to use the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number; A conflict number determination module, used for obtaining the level of each lot of wafers processed by the production equipment after the lot of wafers to be analyzed arrives at the production equipment and before being processed by the production equipment, and taking the number of lots higher than the level of the lot of wafers to be analyzed as the conflict number; A treatment analysis module, used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing according to the treatment number and conflict number of the lot of wafers to be analyzed; The treatment analysis module is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process, including: According to the treatment number and conflict number corresponding to the lot of wafers to be analyzed when arriving at any production equipment, determining whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during processing by the production equipment; or According to the corresponding average number of treatments and average number of conflicts when the lot of wafers to be analyzed arrives at different production equipment, it is determined whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the entire processing process.

10. The device according to claim 9, characterized in that The treatment analysis module is used to determine whether the lot of wafers to be analyzed meets the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing process, including: If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is 1, it is determined that the lot wafer to be analyzed is treated reasonably during the processing; If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is less than 1, it is determined that the lot wafer to be analyzed has a resource conflict during the processing and is treated reasonably; If the difference between the treatment number and the conflict number of the lot wafer to be analyzed is greater than 1, it is determined that the lot wafer to be analyzed is treated unreasonably during the processing.

11. The device according to claim 9, characterized in that The device also includes: The treatment adjustment module is used to adjust the treatment number of the corresponding lot of wafers to be analyzed in the next production and processing cycle in the corresponding production equipment when it is determined that the lot of wafers to be analyzed does not meet the treatment requirements matching the grade of the lot of wafers to be analyzed during the processing.

12. The device according to claim 9, characterized in that The device also includes: The simulation module is used to simulate the production process of the current lot of wafers to be processed by dynamic estimation, obtain the simulated historical production records, and re-determine the number of treatments and conflicts of the simulated lot of wafers to be analyzed and the corresponding production equipment; The treatment adjustment module is used to determine whether to adjust the treatment number of the simulated lot wafer to be analyzed according to the treatment number and conflict number of the simulated lot wafer to be analyzed, until the simulated lot wafer to be analyzed meets the treatment requirements matching its level during the entire simulation processing process or all lot wafers to be processed meet the treatment requirements matching their level during the entire simulation processing process.

13. The device according to claim 9, characterized in that The historical production record acquisition module is used to acquire the historical production records of different batches of lot wafers, and then determine the lot wafers to be analyzed and the production equipment in the following manner: According to the corresponding production steps of different lot wafers in the processing process, determine the cumulative production time of each lot wafer at the end of each production step; Mark the production steps in order at equal distances on the horizontal axis as the horizontal axis, and use the corresponding cumulative production time as the vertical axis to obtain the trajectory line of each lot wafer; The lot wafers with increased slope in the trajectory are taken as lot wafers to be analyzed, and the target production step corresponding to the position of increased slope is determined, and the production equipment corresponding to the target production step is determined.

14. The device according to claim 12, characterized in that The treatment adjustment module is used to obtain the historical production records of the simulation and then re-determine the simulation lot wafer to be analyzed and the corresponding production equipment in the following manner: According to the corresponding production steps of different lot wafers in the simulation processing process, the simulation cumulative production time of different simulation lot wafers at the end of each production step is determined; The production steps are marked in order at equal distances on the horizontal axis as the horizontal axis, and the corresponding simulation cumulative production time is used as the vertical axis to obtain the simulation trajectory line of each lot wafer; The lot wafer with an increased slope in the simulation trajectory is used as the simulation lot wafer to be analyzed, and the target production step corresponding to the position of the increased slope is determined, and the production equipment corresponding to the target production step is determined.

15. The device according to claim 9, characterized in that The historical production record acquisition module is used to obtain the historical production records of different batches of wafers, including: Obtain the time when wafers from different lots arrive at the production equipment and the time when they are processed by the production equipment.

16. The device according to claim 15, characterized in that The treatment number determination module is used to use the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment as the treatment number, including: Obtaining a time period corresponding to when the lot wafer to be analyzed arrives at the production equipment and before being processed by the production equipment; According to the time when the remaining lot wafers are processed by the production equipment, filter out the lot wafers processed by the production equipment within the time period; The screened lot wafers are counted to obtain a count value, and the batch number of the lot wafer to be analyzed and processed after arriving at the production equipment is determined to be the count value plus 1.

17. An electronic device, characterized in that: include: processor; A memory for storing processor-executable instructions; wherein the processor implements the steps of the method according to any one of claims 1 to 8 by running the executable instructions.

18. A computer readable and writable storage medium having computer instructions stored thereon, characterized in that: When the instruction is executed by a processor, the steps of the method according to any one of claims 1 to 8 are implemented.

Images