Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium

Abstract

The present invention describes a substrate cleaning device, a substrate cleaning method, and a computer-readable storage medium that can easily and efficiently remove foreign matter attached to a support portion of a support substrate and a peripheral member thereof. The substrate cleaning device includes: a support portion configured to be able to abut against a back surface of a substrate to support the substrate; a ring-shaped member disposed in a manner surrounding a periphery of the substrate supported by the support portion, and including an inclined surface inclined with respect to a horizontal direction in a radial direction of the ring-shaped member; a rotating portion configured to be able to rotate the support portion and the ring-shaped member; a first supply portion configured to be able to supply a cleaning liquid to the back surface of the substrate supported by the support portion; and a second supply portion configured to be able to supply the cleaning liquid to the inclined surface.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus, a substrate cleaning method, and a computer-readable storage medium. Background Technology

[0002] Patent Document 1 discloses a liquid treatment apparatus for cleaning the back side of a substrate using a cleaning fluid (e.g., a pharmaceutical solution, a rinsing solution, etc.). This liquid treatment apparatus includes: a support portion for supporting the substrate; a rotating portion for rotating the substrate supported by the support portion; a supply portion for supplying cleaning fluid to the back side of the substrate supported by the support portion; and a cup-shaped body configured to surround the substrate supported by the support portion. When cleaning fluid is supplied to the back side of the rotating substrate from the supply portion, the cleaning fluid flows from the center of the back side of the substrate to the periphery due to centrifugal force. This cleans the back side of the substrate. Cleaning fluid ejected from the substrate is dispersed into the cup-shaped body, collected by the cup-shaped body, and discharged outside the liquid treatment apparatus.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-021279 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention describes a substrate cleaning apparatus, a substrate cleaning method, and a computer-readable storage medium that can easily and efficiently remove foreign matter (e.g., particles, drug residues, etc.) adhering to the support portion and surrounding components of a support substrate.

[0008] Technical solutions for solving technical problems

[0009] An example of a substrate cleaning apparatus includes: a support portion configured to abut against the back side of a substrate to support the substrate; an annular member disposed around the periphery of the substrate supported by the support portion and including an inclined surface that is radially inclined relative to the horizontal direction along the annular member; a rotating portion configured to rotate the support portion and the annular member; a first supply portion configured to supply cleaning fluid to the back side of the substrate supported by the support portion; and a second supply portion configured to supply cleaning fluid to the inclined surface.

[0010] Invention Effects

[0011] According to the substrate cleaning apparatus, substrate cleaning method and computer-readable storage medium of the present invention, foreign matter attached to the support portion and surrounding components of the support substrate can be removed easily and efficiently. Attached Figure Description

[0012] Figure 1This is a schematic cross-sectional view showing an example of a substrate cleaning apparatus.

[0013] Figure 2 It is a local representation Figure 1 A schematic cross-sectional view of the vicinity of the annular component.

[0014] Figure 3 This is a block diagram illustrating an example of the main components of a substrate cleaning apparatus.

[0015] Figure 4 This is a schematic diagram illustrating an example of the hardware configuration of a controller.

[0016] Figure 5 This is an example diagram used to illustrate the cleaning process of a substrate.

[0017] Figure 6 It is used for explanation Figure 5 The diagram shows the subsequent steps.

[0018] Figure 7 It is used for explanation Figure 6 The diagram shows the subsequent steps.

[0019] Figure 8 It is used for explanation Figure 7 The diagram shows the subsequent steps.

[0020] Figure 9 This is a flowchart illustrating an example of substrate cleaning process.

[0021] Figure 10 This is a schematic cross-sectional view showing another example of a substrate cleaning apparatus.

[0022] Explanation of reference numerals in the attached figures

[0023] 1…Substrate cleaning device; 20…Rotating part; 21…Rotating shaft; 24…Support pin (support part); 25…Annular component; 30…Lifting part; 40…Shielding part; 50…Supply part (first supply part); 60…Supply part (second supply part); 65…Nozzle; Ax…Central shaft; Ctr…Controller (control part); H1…Through hole (nozzle); RM…Storage medium; S1, S2…Inclined surfaces; W…Substrate; Wa…Back side. Detailed Implementation

[0024] In the following description, elements with the same characteristics or functions are labeled with the same reference numerals, and repeated descriptions are omitted.

[0025] [Structure of the substrate cleaning device]

[0026] First, refer to Figures 1-4The structure of one example of the substrate cleaning apparatus 1 will be described. The substrate cleaning apparatus 1 cleans the back surface Wa of a substrate W using a cleaning solution. The substrate W can be, for example, a semiconductor (silicon wafer). The diameter of the substrate W can be, for example, between 200 mm and 450 mm. The substrate W can be in the shape of a circular plate, or in the shape of a plate other than a circle, such as a polygon. The substrate W can have a partially missing notch. The notch can be, for example, a cut (a U-shaped, V-shaped, or other groove), or a straight section extending in a straight line (i.e., an orientation plane).

[0027] like Figure 1 As shown, the substrate cleaning apparatus 1 includes a housing 10, a rotating part 20 (support part), a lifting part 30, a shielding part 40, a supply part 50 (first supply part), a supply part 60 (second supply part), and a controller Ctr (control part). The housing 10 mainly houses the rotating part 20, the lifting part 30, and the shielding part 40. An inlet / outlet 12 is formed on the side wall 11 of the housing 10. The substrate W is fed into the interior of the housing 10 by a conveying mechanism (not shown, such as a robotic arm) through the inlet / outlet 12, or is fed out of the housing 10 to the outside.

[0028] The rotating part 20 includes a rotating shaft 21, a drive mechanism 22, a support plate 23, a plurality of support pins 24 (support parts), and an annular component 25. The rotating shaft 21 is a hollow tubular component extending in the vertical direction. The rotating shaft 21 is mounted on the bottom wall 13 of the housing 10 in a manner that allows it to rotate about the central axis Ax.

[0029] The drive mechanism 22 is connected to the rotating shaft 21. The drive mechanism 22 is configured to operate based on an action signal from the controller Ctr, causing the rotating shaft 21 to rotate. The drive mechanism 22 can be, for example, a power source such as an electric motor.

[0030] The support plate 23 is, for example, a flat plate in the shape of an annulus, extending horizontally. That is, a through hole is formed in the central part of the support plate 23. The inner periphery of the support plate 23 is connected to the front end of the rotating shaft 21. Therefore, the support plate 23 is configured to rotate about the central axis Ax of the rotating shaft 21 along with the rotation of the rotating shaft 21.

[0031] Multiple support pins 24 are provided on the support plate 23, protruding upward from the upper surface of the support plate 23. The multiple support pins 24 are configured to support the substrate W substantially horizontally by abutting against the back surface Wa of the substrate W at their front ends. The multiple support pins 24 may be cylindrical or frustum-shaped, for example. The multiple support pins 24 may be arranged approximately at equal intervals near the outer periphery of the support plate 23, so that they appear as a circle when viewed from above. For example, when there are 12 support pins 24, they may be arranged at approximately 30° intervals.

[0032] The annular member 25 is circular and arranged to surround the outer periphery of the support plate 23. The annular member is connected to the outer periphery of the support plate 23 by a plurality of connecting members 26. Therefore, the annular member 25 is configured to rotate about the central axis Ax of the rotation axis 21 along with the rotation of the rotation axis 21.

[0033] like Figure 1 and Figure 2 As shown, the annular member 25 may include an upper wall portion 25a and a side wall portion 25b. The upper wall portion 25a is, for example, a plate-like body in the shape of an annulus, extending in the horizontal direction. The inner periphery of the upper wall portion 25a may face the end face of the substrate W supported by a plurality of support pins 24. That is, the upper wall portion 25a may also be configured to surround the substrate W supported by a plurality of support pins 24.

[0034] The upper surface of the inner periphery of the upper wall portion 25a may include an inclined surface S1 that is inclined relative to the horizontal direction. The entire upper surface of the inner periphery of the upper wall portion 25a may be an inclined surface S1, or a portion of the upper surface of the inner periphery of the upper wall portion 25a may be an inclined surface S1. The inclined surface S1 is inclined downward as it moves radially inward.

[0035] The lower surface of the inner periphery of the upper wall portion 25a may include an inclined surface S2 that is inclined relative to the horizontal direction. The entire lower surface of the inner periphery of the upper wall portion 25a may be the inclined surface S2, or only a portion of the lower surface of the inner periphery of the upper wall portion 25a may be the inclined surface S2. The inclined surface S2 is inclined upward as it moves radially inward.

[0036] Alternatively, the inner periphery of the upper wall portion 25a may be formed into a tapered shape that narrows towards the radially inward direction due to the presence of inclined surfaces S1 and S2. Inclined surfaces S1 and S2 may each be flat or non-flat (e.g., curved). To improve the flowability of the cleaning fluid, the surface of the annular member 25 including the inclined surfaces S1 and S2 may have multiple protrusions and grooves, or radially extending grooves or protrusions, for example, through dimple processing and / or embossing. Alternatively, to improve the flowability of the cleaning fluid, the surface of the annular member 25 including the inclined surfaces S1 and S2 may be surface-treated, or a coating may be formed.

[0037] The sidewall portion 25b can be, for example, cylindrical. The upper end of the sidewall portion 25b can be integrally connected to the outer periphery of the upper wall portion 25a. The sidewall portion 25b can be formed into a thin front end shape that narrows as it goes downward.

[0038] like Figure 1As shown, the lifting unit 30 includes a shaft component 31, a drive mechanism 32, and a plurality of support pins 33. The shaft component 31 is a hollow tubular component extending in the vertical direction. The shaft component 31 is rotatable about a central axis Ax and is capable of lifting in the vertical direction. The shaft component 31 is inserted into the interior of the rotating shaft 21.

[0039] The drive mechanism 32 is connected to the shaft component 31. The drive mechanism 32 is configured to operate based on an action signal from the controller Ctr, causing the shaft component 31 to rise and fall. The drive mechanism 32 raises and lowers the shaft component 31, thereby allowing the shaft component 31 to be in an elevated position above the plurality of support pins 24 (see reference). Figure 1 The multiple support pins 33 are in a lowered position below the multiple support pins 24 (see below). Figure 7 It moves up and down between ( ). The drive mechanism 22 can be, for example, a linear actuator or other power source.

[0040] Multiple support pins 33 are disposed on the shaft member 31 such that they protrude upward from the upper end of the shaft member 31. The multiple support pins 33 are configured to support the substrate W by abutting against the back surface Wa of the substrate W with their front ends. The multiple support pins 33 may be cylindrical or frustum-shaped, for example. The multiple support pins 33 may be arranged at approximately equal intervals such that they appear as a circle when viewed from above.

[0041] The shielding part 40 is annular and is arranged to surround the outer periphery of the annular member 25 and the support plate 23. The shielding part 40 functions as a collection container for collecting the cleaning fluid supplied to the substrate W and discarded from the substrate W.

[0042] like Figure 1 and Figure 2 As shown, the shielding portion 40 may include an upper wall portion 41, a side wall portion 42, and a bottom wall portion 43. The upper wall portion 41 is, for example, a plate-like body in the shape of an annulus, extending horizontally. When viewed from above, the upper wall portion 41 at least partially overlaps with the inclined surface S1, but does not overlap with the substrate W supported by a plurality of support pins 24. A through hole H1 (nozzle) is provided in the portion of the upper wall portion 41 that overlaps with the inclined surface S1. That is, the through hole H1 is located above the inclined surface S1, and the lower end of the through hole H1 opens toward the inclined surface S1.

[0043] The sidewall portion 42 may be cylindrical, for example. The upper end of the sidewall portion 42 may be integrally connected to the outer periphery of the upper wall portion 41. The lower end of the sidewall portion 42 may be integrally connected to the outer periphery of the bottom wall portion 43. The bottom wall portion 43 may slope upwards towards the radially inward direction. A through hole H2 is provided at the bottom of the bottom wall portion 43. The through hole H2 functions as a drainage path for discharging the cleaning fluid collected in the shielding portion 40 to the outside of the substrate cleaning apparatus 1.

[0044] like Figure 1 As shown, the supply unit 50 is configured to supply cleaning fluids L1 and L2 to the back surface Wa of the substrate W through the interior of the shaft member 31. That is, the shaft member 31 functions as a nozzle for supplying cleaning fluids L1 and L2 to the back surface Wa of the substrate W. The supply unit 50 includes liquid sources 51A and 51B, pumps 52A and 52B, pumps 53A and 53B, and piping 54A and 54B.

[0045] Liquid source 51A functions as the supply source of cleaning fluid L1. Cleaning fluid L1 can be, for example, a cleaning solution (e.g., dilute hydrofluoric acid (SC1)) used to remove unwanted films such as SiN adhering to the back surface Wa of substrate W. Pump 52A is configured to operate based on an action signal from controller Ctr, drawing cleaning fluid L1 from liquid source 51A and delivering it to shaft member 31 via pump 53A and piping 54A. Pump 53A is configured to operate based on an action signal from controller Ctr, opening and closing piping 54A before and after pump 53A. Liquid source 51A, pump 52A, and pump 53A are sequentially connected to piping 54A from the upstream side.

[0046] Liquid source 51B functions as the supply source of cleaning fluid L2. Cleaning fluid L2 can be, for example, a rinsing solution (e.g., pure water (DIW)) used to wash away foreign matter (e.g., particles, drug residue, etc.). Pump 52B is configured to operate based on an action signal from controller Ctr, drawing cleaning fluid L2 from liquid source 51B and delivering it to shaft member 31 via pump 53B and pipes 54A and 54B. Pump 53B is configured to operate based on an action signal from controller Ctr, opening and closing pipe 54B before and after pump 53B. Pipe 54B is sequentially connected to liquid source 51B, pump 52B, and pump 53B from the upstream side. The downstream end of pipe 54B is connected to pipe 54A between pump 53A and shaft member 31.

[0047] The supply unit 60 is configured to supply cleaning fluids L1 and L2 to the inclined surface S1 through the interior of the through hole H1. That is, the through hole H1 functions as a nozzle for supplying cleaning fluids L1 and L2 to the inclined surface S1. The supply unit 60 includes liquid sources 61A and 61B, pumps 62A and 62B, pumps 63A and 63B, and piping 64A and 64B.

[0048] Liquid source 61A functions as the supply source of cleaning fluid L1. Pump 62A is configured to operate based on an action signal from controller Ctr, drawing cleaning fluid L1 from liquid source 61A and delivering it to through-hole H1 via pump 63A and piping 64A. Pump 63A is configured to operate based on an action signal from controller Ctr, opening and closing piping 64A before and after pump 63A. Liquid source 61A, pump 62A, and pump 63A are sequentially connected to piping 64A from the upstream side.

[0049] Liquid source 61B functions as the supply source of cleaning fluid L2. Pump 62B is configured to operate based on an action signal from controller Ctr, drawing cleaning fluid L2 from liquid source 61B and delivering it to through-hole H1 via pump 63B and pipes 64A and 64B. Pump 63B is configured to operate based on an action signal from controller Ctr, opening and closing pipe 64B before and after pump 63B. Liquid source 61B, pump 62B, and pump 63B are sequentially connected to pipe 64B from the upstream side. The downstream end of pipe 64B connects to pipe 64A between pump 63A and through-hole H1.

[0050] like Figure 3 As shown, the controller Ctr, as a functional module, includes a reading unit M1, a storage unit M2, a processing unit M3, and an indication unit M4. These functional modules are merely a convenient way of dividing the controller Ctr's functions into multiple modules and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by executing a program; it can also be implemented using dedicated circuits (e.g., logic circuits) or integrated circuits (ASICs) that integrate the aforementioned circuits.

[0051] The reading unit M1 is configured to read programs from a computer-readable storage medium RM. The storage medium RM stores programs for operating various parts of the substrate cleaning apparatus 1. For example, the storage medium RM can be a semiconductor memory, an optical disk, a magnetic disk, or a magneto-optical disk.

[0052] The storage unit M2 is configured to store various types of data. For example, the storage unit M2 can store programs read from the storage medium RM into the reading unit M1, setting data input by the operator via an external input device (not shown), etc.

[0053] The processing unit M3 is configured to process various types of data. For example, the processing unit M3 can generate operation signals for operating various parts of the substrate cleaning apparatus 1 (e.g., drive mechanisms 22, 32, pumps 52, 62A, 62B and pumps 53, 63A, 63B, etc.) based on various types of data stored in the storage unit M2.

[0054] The indicator unit M4 is configured to send the operation signals generated in the processing unit M3 to each part of the substrate cleaning apparatus 1.

[0055] The indicator unit M4 can also perform a first process of controlling the supply unit 50 to supply cleaning fluids L1 and L2 from the shaft member 31 to the back surface Wa of the substrate W supported by the support pin 24. After the first process, the indicator unit M4 can also perform a second process of controlling the drive mechanism 32 to raise the shaft member 31 to the raised position while supporting the substrate W with the support pin 33. After the second process, the indicator unit M4 can also perform a third process of controlling the supply unit 60 to supply cleaning fluids L1 and L2 from the through hole H1 to the inclined surface S1.

[0056] The indicator unit M4 can also control the supply unit 60 under different processing conditions (e.g., the first processing condition and the second processing condition) in the third processing. In this case, the indicator unit M4 can also control the supply unit 60 under the second processing condition after controlling it under the first processing condition in the third processing. The indicator unit M4 can also control the supply unit 60 in the third processing such that cleaning fluid L1 is supplied to the inclined surface S1, followed by cleaning fluid L2.

[0057] The first processing condition can be one where the cleaning fluids L1 and L2 supplied to the inclined surface S1 mainly flow radially inward toward the annular component 25. The first processing condition may include, for example, a relatively low supply flow rate of the cleaning fluids L1 and L2 from the through-hole H1 (e.g., around 100 ml / min to 200 ml / min) and a relatively low rotational speed (e.g., around 10 rpm to 100 rpm) via the rotating shaft 21 (rotating) support plate 23 and annular component 25.

[0058] The second processing condition can be one where the cleaning fluids L1 and L2 supplied to the inclined surface S1 mainly flow radially outward from the annular component 25. This second processing condition may include, for example, a relatively high supply flow rate of the cleaning fluids L1 and L2 from the through-hole H1 (e.g., 200 ml / min to 500 ml / min) and a relatively high rotational speed (e.g., 100 rpm to 300 rpm) via the rotating shaft 21 (rotating) support plate 23 and annular component 25.

[0059] The indicator unit M4 can also perform a fourth process after the third process, controlling the drive mechanism 32 to rotate the substrate W supported by the support pin 33 by a predetermined angle. The indicator unit M4 can also perform a fifth process after the fourth process, controlling the drive mechanism 32 to lower the shaft member 31 to the lowered position and support the substrate W on the support pin 24. The indicator unit M4 can also perform a sixth process after the fifth process, controlling the supply unit 50 to supply cleaning fluids L1 and L2 from the shaft member 31 to the back surface Wa of the substrate W supported by the support pin 24.

[0060] The hardware of the controller Ctr may include, for example, one or more control computers. The hardware structure of the controller Ctr may include, for example... Figure 4 The circuit Ctr1 shown is a circuit system. Circuit Ctr1 can be constructed from circuitry. For example, circuit Ctr1 may include a processor Ctr2, a memory Ctr3 (storage unit), a memory Ctr4 (storage unit), a driver Ctr5, and an input / output port Ctr6. The processor Ctr2, in cooperation with at least one of the memory Ctr3 and memory Ctr4, executes a program and performs input / output of signals via the input / output port Ctr6, thereby constituting the aforementioned functional modules. The memory Ctr3 and memory Ctr4 function as storage unit M2. The driver Ctr5 is a circuit that drives each part of the substrate cleaning apparatus 1. The input / output port Ctr6 performs signal input / output between the driver Ctr5 and each part of the substrate cleaning apparatus 1 (e.g., drive mechanisms 22, 32, pumps 52, 62A, 62B, and pumps 53, 63A, 63B, etc.).

[0061] The substrate cleaning apparatus 1 may have a single controller Ctr or a controller group (control unit) consisting of multiple controller Ctrs. In the latter case, the aforementioned functional modules may be implemented by a single controller Ctr or by a combination of two or more controller Ctrs. When the controller Ctr consists of multiple computers (circuit Ctr1), the aforementioned functional modules may be implemented by a single computer (circuit Ctr1) or by two or more computers (circuit Ctr1). Alternatively, the controller Ctr may include multiple processors Ctr2. In this case, the aforementioned functional modules may be implemented by a single processor Ctr2 or by a combination of two or more processor Ctr2s.

[0062] [Cleaning process]

[0063] Below, refer to Figures 5-9 The cleaning process of the substrate cleaning device 1 will be explained.

[0064] First, using a conveying mechanism (not shown), the substrate W is fed into the housing 10 (see reference). Figure 9 (Step S10). At this time, the controller Ctr controls the drive mechanism 32 to position the shaft component 31 in the raised position. The substrate W, which is fed into the housing 10 through the feed outlet 12, is transferred from the conveying mechanism to the support pin 33. Thus, the substrate W is placed on the support pin 33 (lifting part 30) with its back surface Wa abutting against the support pin 33.

[0065] Next, the controller Ctr controls the drive mechanism 32 to lower the shaft component 31 to the lowered position. During the descent of the shaft component 31, the substrate W is transferred from the support pin 33 to the support pin 24. Thus, the substrate W is placed on the support pin 24 with its back surface Wa abutting against the support pin 24 (rotating part 20) (see reference). Figure 9 Step S11).

[0066] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 at a specified speed (see reference). Figure 5 and Figure 9 (Step S12). At this time, the support plate 23 and the annular component 25 rotate via the rotating shaft 21, and the substrate W placed on the support pin 24 also rotates.

[0067] Next, the controller Ctr controls the supply unit 50 to supply cleaning fluids L1 and L2 (see reference) to the back surface Wa of the rotating substrate W via the shaft component 31. Figure 5 , Figure 6 and Figure 9 Step S13). Thus, as Figure 6 As illustrated, cleaning solutions L1 and L2 flow along the back surface Wa towards the outer periphery of the substrate W due to centrifugal force, and are then thrown off from the outer periphery of the substrate W. As a result, the entire back surface Wa is cleaned by cleaning solutions L1 and L2. The cleaning solutions L1 and L2 thrown off the substrate W flow between the outer periphery of the annular member 25 and the support plate 23, and between the annular member 25 and the shielding part 40. After being collected in the shielding part 40, they are discharged to the outside of the substrate cleaning apparatus 1 through the through hole H2. After a predetermined time, the controller Ctr controls the supply unit 50 to stop the supply of cleaning solutions L1 and L2.

[0068] In step S13, the controller Ctr may control the supply unit 50 to supply cleaning fluid L1 to the back surface Wa of the rotating substrate W, and then supply cleaning fluid L2 to the back surface Wa of the rotating substrate W. Alternatively, in step S13, cleaning fluid L1 may be supplied to the back surface Wa of the rotating substrate W, but cleaning fluid L2 may not be supplied.

[0069] Next, the controller Ctr controls the drive mechanism 22 to stop the rotation of the rotating shaft 21 (see reference). Figure 9Step S14). At this time, a position sensor (e.g., an encoder, not shown) can be used to stop the rotating shaft 21 so that the rotational position about the central axis Ax of the rotating shaft 21 becomes the predetermined origin position (e.g., the rotation angle of the rotating shaft 21 becomes 0°).

[0070] Additionally, during the period from the cessation of supplying cleaning solutions L1 and L2 to the back surface Wa until the rotation of the rotating shaft 21 stops, the cleaning solutions L1 and L2 adhering to the back surface Wa are partially dried due to the rotation of the substrate W. However, they are not completely dried, therefore... Figure 8 As illustrated, residual cleaning fluid L1 and L2 may be present on the back side Wa, the portion that abuts against the support pin 24, the front end portion of the support pin 24, the surface of the annular member 25, and the inner surface of the shielding portion 40.

[0071] Next, the controller Ctr controls the drive mechanism 32 to raise the shaft component 31 to the raised position. During the raising of the shaft component 31, the substrate W is transferred from the support pin 24 to the support pin 33, and the substrate W also rises (see reference). Figure 7 and Figure 9 (Step S15). Thus, the substrate W is placed on the support pin 33 with its back side Wa abutting against the support pin 33.

[0072] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 at a specified speed (see reference). Figure 7 and Figure 9 (Step S16). At this time, the support plate 23 and the annular component 25 rotate via the rotating shaft 21.

[0073] Next, the controller Ctr controls the supply unit 60 to supply cleaning fluids L1 and L2 (see reference) to the inclined surface S1 of the rotating annular component 25 through the through hole H1. Figure 8 and Figure 9 (Step S17). The controller Ctr can also control the supply unit 60 under different processing conditions. In this case, the controller Ctr can also control the supply unit 60 to supply cleaning fluid L1 and L2 from the through hole H1 to the inclined surface S1 under the first processing condition, and then control the supply unit 60 to supply cleaning fluid L1 and L2 from the through hole H1 to the inclined surface S1 under the second processing condition.

[0074] Under the first processing condition, when cleaning fluids L1 and L2 are supplied from the through hole H1 to the inclined surface S1, the cleaning fluids L1 and L2 flow downwards along the inclined surface S1 due to gravity (refer to...). Figure 8 (Ar1). As a result, the cleaning fluids L1 and L2 flowing down from the inclined surface S1 are supplied to the support pin 24, washing away the residual fluid remaining at the front end of the support pin 24.

[0075] On the other hand, under the second processing condition, when cleaning fluids L1 and L2 are supplied from the through hole H1 to the inclined surface S1, the cleaning fluids L1 and L2 flow upwards along the inclined surface S1 due to centrifugal force (see reference). Figure 8 (Ar2). As a result, the cleaning fluids L1 and L2 that have climbed onto the inclined surface S1 are supplied to the surface of the annular component 25 and the inner surface of the shielding part 40, which will remove any residual fluid remaining at the aforementioned locations. After a predetermined time, the controller Ctr controls the supply unit 60 to stop the supply of cleaning fluids L1 and L2.

[0076] In step S17, the controller Ctr may control the supply unit 60 such that after the cleaning fluid L1 is supplied to the inclined surface S1 of the rotating annular member 25, cleaning fluid L2 is also supplied to the inclined surface S1 of the rotating annular member 25. Alternatively, the controller Ctr may control the supply unit 60 under different processing conditions (e.g., a second processing condition after a first processing condition) while supplying cleaning fluid L1 to the inclined surface S1 of the rotating annular member 25. Alternatively, the controller Ctr may control the supply unit 60 under different processing conditions (e.g., a second processing condition after a first processing condition) while supplying cleaning fluid L2 to the inclined surface S1 of the rotating annular member 25. In step S17, cleaning fluid L2 may also be supplied to the inclined surface S1 of the rotating annular member 25, but cleaning fluid L1 may not be supplied.

[0077] Next, the controller Ctr controls the drive mechanism 22 to stop the rotation of the rotating shaft 21 (see reference). Figure 9 Step S18). At this time, a position sensor (e.g., an encoder, not shown) can also be used to stop the rotating shaft 21 so that the rotational position about the central axis Ax of the rotating shaft 21 becomes the specified origin position (e.g., the rotation angle of the rotating shaft 21 becomes 0°).

[0078] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 by a predetermined offset angle δ (refer to...). Figure 9 (Step S19). In the case where the 12 support pins 24 are arranged at approximately 30° intervals on the support plate 23, the offset angle δ can be approximately 15°, for example.

[0079] Next, the controller Ctr controls the drive mechanism 32 to lower the shaft component 31 to the lowered position. During the descent of the shaft component 31, the substrate W is transferred from the support pin 33 to the support pin 24. Thus, the substrate W is placed on the support pin 24 with its back surface Wa abutting against the support pin 24 (rotating part 20) (see reference). Figure 9 Step S20).

[0080] In step S13, the substrate W is located at the origin relative to the rotating part 20 (refer to step S14). However, due to the rotation of the rotating axis 21 in step S19, in step S20, the substrate W is located at a position offset by an offset angle δ relative to the rotating part 20. Therefore, in step S20, the support pin 24 contacts the area on the back surface Wa that is different from that in step S13. Therefore, even if... Figure 8 As illustrated, the presence of residual liquid on the back side Wa also prevents the support pin 24, which has been cleaned in step S17, from coming into contact with the residual liquid.

[0081] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 at a specified speed (see reference). Figure 9 Step S21). Next, the controller Ctr controls the supply unit 50 to supply cleaning fluids L1 and L2 to the back surface Wa of the rotating substrate W via the shaft component 31 (see step S21). Figure 9 Step S22). Next, the controller Ctr controls the drive mechanism 22 to stop the rotation of the rotating shaft 21 (see step S22). Figure 9 Step S23). The processing of steps S21 to S23 is the same as that of steps S12 to S14.

[0082] Next, the controller Ctr controls the drive mechanism 32 to raise the shaft component 31 to the raised position. During the raising of the shaft component 31, the substrate W is transferred from the support pin 24 to the support pin 33, and the substrate W also rises. Afterwards, a conveying mechanism (not shown) receives the substrate W from the support pin 33 and delivers the substrate W from the housing 10 (see reference). Figure 9 Step S24). Through the above method, the cleaning process of the back surface Wa of the substrate W, the support pin 24, the annular component 25, the shielding part 40, etc. is completed.

[0083] [effect]

[0084] Following the above example, the cleaning fluids L1 and L2 supplied to the inclined surface S1 move radially inward or radially outward on the inclined surface S1 under the influence of gravity, centrifugal force, etc. Therefore, without separately providing mechanisms for supplying cleaning fluids L1 and L2 to the support pin 24 and to the peripheral components of the support pin 24 (annular component 25, shielding part 40, etc.), it is possible to supply cleaning fluids L1 and L2 to the support pin 24 located radially inward or to the peripheral components located radially outward of the annular component 25. Therefore, by simply supplying cleaning fluids L1 and L2 to the inclined surface S1, foreign matter adhering to the support pin 24 and its peripheral components can be removed easily and efficiently using the cleaning fluids L1 and L2.

[0085] Following the example above, the inclined surface S1 slopes downwards towards the radially inward direction, and a through hole H1 is disposed above the inclined surface S1. Therefore, the cleaning fluids L1 and L2 supplied to the inclined surface S1 easily flow towards the radially inward direction of the annular component 25 under the influence of gravity. Thus, the support pin 24 can be cleaned more effectively.

[0086] Following the example above, when the shaft component 31 is in the raised position, that is, when the substrate W is positioned above the support pin 24, cleaning fluids L1 and L2 are supplied to the inclined surface S1. Therefore, even if cleaning fluids L1 and L2 supplied from the supply section 50 remain on the support pin 24, these residues can be washed away using cleaning fluids L1 and L2 supplied from the supply section 60. Thus, the support pin 24 can be cleaned more effectively. Furthermore, when the next substrate W is supported on the support pin 24, the transfer of these residues to the back surface Wa can be suppressed.

[0087] Following the example above, through the rotation of the rotation axis 21 in step S19, in step S20, the substrate W is positioned at a offset angle δ relative to the rotating part 20. Therefore, even if there are such features on the back side Wa... Figure 8 The residual liquid shown can also be washed away using the second cleaning liquid L1 and L2 supplied from the supply section 50 to the back surface Wa. Therefore, the back surface Wa can be cleaned more effectively.

[0088] Following the example above, in step S17, the controller Ctr can control the supply unit 60 under different processing conditions. In this case, as the processing conditions change, cleaning fluids L1 and L2 are supplied to the support pin 24 or its surrounding components. Therefore, depending on the processing conditions, it is possible to control which of the support pin 24 or its surrounding components is cleaned with particular focus.

[0089] Following the example above, in step S17, the controller Ctr can control the supply unit 60 under the first processing condition and then control the supply unit 60 under the second processing condition. In this case, after supplying cleaning fluids L1 and L2 to the support pin 24, cleaning fluids L1 and L2 are supplied to the peripheral components of the support pin 24. Therefore, even if the cleaning fluids L1 and L2 scatter from the support pin 24 to the surrounding area when the supply unit 60 is controlled under the first processing condition, the scattered cleaning fluids L1 and L2 can be washed away by controlling the supply unit 60 under the second processing condition. Therefore, the peripheral components can be cleaned more effectively.

[0090] Following the example above, in step S17, the controller Ctr can control the supply unit 60 to supply cleaning fluid L2 to the inclined surface S1 of the rotating annular component 25 after cleaning fluid L1 has been supplied to it. In this case, after the support pin 24 and its surrounding components are more thoroughly cleaned with the cleaning fluid, the cleaning fluid is washed away with a rinsing fluid. Therefore, foreign matter adhering to the support pin 24 and its surrounding components can be removed more effectively, and the cleanliness of the support pin 24 and its surrounding components after cleaning can be improved.

[0091] [Variation Example]

[0092] The invention described herein is illustrative in all respects and should not be considered limiting. Various omissions, substitutions, and modifications may be made to the above examples without departing from the scope and spirit of the claims.

[0093] (1) In the substrate cleaning apparatus 1, the through hole H1 provided in the shielding part 40 can also be replaced, and such as Figure 10 As illustrated, a nozzle 65 is provided that can be moved using a drive mechanism 66. For example, the nozzle 65 may be connected to the downstream end of the piping 64A. Alternatively, the drive mechanism 66 may be connected to the nozzle 65. The drive mechanism 66 may be configured to operate based on an action signal from the controller Ctr, causing the nozzle 65 to move radially in the annular member 25. The drive mechanism 66 may also be a power source, such as an electric motor.

[0094] In this situation, as the nozzle 65 moves, the contact positions of the cleaning fluids L1 and L2 relative to the inclined surface S1 change. Therefore, with the change in fluid position, the tendency of the cleaning fluids L1 and L2 to flow more radially inward or radially outward also changes. Thus, it is possible to control which part of the support pin 24 and its surrounding components is cleaned most effectively.

[0095] (2) Alternatively, the stopping of the rotation axis 21 at the origin position in step S14 and the rotation of the rotation axis 21 at the offset angle δ in step S19 can be omitted.

[0096] (3) When the support pin 24 is located inside the inclined surface S1 of the annular member 25, it may not be provided in the support plate 23. For example, the support pin 24 may also be provided in the inner periphery of the annular member 25.

[0097] (4) Alternatively, after the substrate W rises in step S24, until the next substrate W is placed on the support pin 24 that has been sent into the housing 10, the controller Ctr controls the supply unit 60 to supply cleaning fluid L1 and L2 to the inclined surface S1. In other words, the support pin 24 and its surrounding components can be cleaned even when the support pin 24 is not holding a substrate W.

[0098] [Other examples]

[0099] Example 1. An example of a substrate cleaning apparatus includes: a support portion configured to abut against the back surface of a substrate to support the substrate; an annular member disposed around the periphery of the substrate supported by the support portion, and including an inclined surface that is radially inclined relative to the horizontal direction along the annular member; a rotating portion configured to rotate the support portion and the annular member; a first supply portion configured to supply cleaning fluid to the back surface of the substrate supported by the support portion; and a second supply portion configured to supply cleaning fluid to the inclined surface. In this case, the cleaning fluid supplied to the inclined surface flows radially inward or radially outward on the inclined surface under the influence of gravity, centrifugal force, etc. Therefore, it is not necessary to separately provide a mechanism for supplying cleaning fluid to the support portion and a mechanism for supplying cleaning fluid to the peripheral components of the support portion, and it is possible to supply cleaning fluid to the support portion located radially inward or the peripheral components located radially outward of the annular member. Therefore, by simply supplying cleaning fluid to the inclined surface, foreign matter adhering to the support and its surrounding components can be removed easily and efficiently.

[0100] Example 2. In the apparatus of Example 1, the inclined surface may also be inclined downwards towards the radially inward direction, and the second supply unit may include a nozzle disposed above the inclined surface. In this case, the cleaning fluid supplied to the inclined surface becomes more likely to flow radially inwards towards the annular member under the influence of gravity. Therefore, the support portion can be cleaned more effectively.

[0101] Example 3. In the apparatus of Example 1 or Example 2, the second supply unit may include a nozzle that is movable radially in the annular member. In this case, as the nozzle moves, the contact position of the cleaning fluid with the inclined surface changes. Therefore, with the change in fluid position, the tendency of the cleaning fluid to flow more easily towards the radially inner side of the annular member or more easily towards the radially outer side of the annular member also changes. Therefore, it is possible to control which part, the support portion or its surrounding components, is cleaned most effectively.

[0102] Example 4. In any of the devices in Examples 1 to 3, the cleaning solution may also be a cleaning solution or a rinsing solution.

[0103] Example 5. In any of the devices in Examples 1 to 4, a lifting unit and a control unit may also be included. The lifting unit is configured to support the substrate while moving up and down between a raised position where the front end is located above the support portion and a lower position where the front end is located below the support portion. Alternatively, the control unit may perform: a first process that controls a first supply unit to supply cleaning fluid to the back side of the substrate supported by the support portion; a second process that, after the first process, controls the lifting unit to be in the raised position; and a third process that, after the second process, controls a second supply unit to supply cleaning fluid to the inclined surface. In this case, even if cleaning fluid supplied from the first supply unit to the back side of the substrate remains on the support portion, the residual fluid can be washed away using the cleaning fluid supplied from the second supply unit. Therefore, the support portion can be cleaned more effectively. Furthermore, when the next substrate is supported on the support portion, the transfer of the residual fluid to the back side of the substrate can be suppressed.

[0104] Example 6. In the apparatus of Example 5, the control unit may further perform: a fourth process, which, after the third process, controls the lifting unit to rotate the substrate by a predetermined angle; a fifth process, which, after the fourth process, controls the lifting unit to lower the lifting unit to a lowered position to support the substrate on the support; and a sixth process, which, after the fifth process, controls the first supply unit to supply cleaning fluid to the back side of the substrate. In this case, from the fourth to the sixth process, after rotating the substrate by a predetermined angle, the substrate is supported on the support again, and a second cleaning fluid is supplied to the back side of the substrate from the first supply unit. Therefore, even if the first cleaning fluid supplied from the first supply unit to the back side of the substrate remains in the area of ​​the back side of the substrate that contacts the support, the second cleaning can remove the residual fluid from the back side of the substrate. Therefore, the back side of the substrate can be cleaned more effectively.

[0105] Example 7. In the apparatus of Example 5 or Example 6, the third process may include the following: under a first processing condition where the cleaning fluid supplied to the inclined surface flows primarily radially inward toward the annular member, and under a second processing condition where the cleaning fluid supplied to the inclined surface flows primarily radially outward toward the annular member, the second supply unit is controlled. In this case, depending on the processing conditions, the cleaning fluid is supplied to the support portion or its peripheral components. Therefore, depending on the processing conditions, it is possible to control which part, the support portion or its peripheral components, is cleaned with particular focus.

[0106] Example 8. In the apparatus of Example 7, the third process may include the following process: after controlling the second supply unit under the first processing condition, the second supply unit is controlled under the second processing condition. The support portion is located inside the annular member to support the substrate; therefore, when cleaning fluid is supplied to the support portion, the cleaning fluid scatters to the surrounding area due to centrifugal force, etc. However, in the case of Example 8, cleaning fluid is supplied to the peripheral components after the support portion is supplied. Therefore, even if the cleaning fluid scatters from the support portion, the scattered cleaning fluid can be washed away after cleaning the peripheral components. Therefore, the peripheral components can be cleaned more effectively.

[0107] Example 9. In any of the apparatuses in Examples 5 to 8, the third process may include the following: controlling the second supply unit to supply rinsing liquid to the inclined surface after the cleaning solution has been supplied to the inclined surface. In this case, after the support portion and its surrounding components are more vigorously cleaned with the cleaning solution, the cleaning solution is washed away with the rinsing liquid. Therefore, foreign matter adhering to the support portion and its surrounding components can be removed more effectively, and the cleanliness of the cleaned support portion and its surrounding components can be improved.

[0108] Example 10. One example of a substrate cleaning method includes: while a support portion that abuts against the back of the substrate and supports the substrate, and an annular member arranged to surround the substrate, are rotating, a cleaning fluid is supplied to an inclined surface of the annular member, the inclined surface being inclined radially relative to the horizontal direction. In this case, the same effect as the apparatus of Example 1 can be obtained.

[0109] Example 11. In the method of Example 10, it may also include: the inclined surface tilts downwards towards the radially inward direction, and the process of supplying cleaning fluid to the inclined surface includes the process of supplying cleaning fluid to the inclined surface from above. In this case, the same effect as the apparatus of Example 2 can be obtained.

[0110] Example 12. In the method of Example 10 or Example 11, the process of supplying cleaning fluid to the inclined surface may also include the following process: while moving the nozzle supplying cleaning fluid radially in the annular member, cleaning fluid is supplied to the inclined surface. In this case, the same effect as the apparatus of Example 3 can be obtained.

[0111] Example 13. In any of the methods in Examples 10 to 12, the cleaning solution may also be a cleaning solution or a rinsing solution.

[0112] Example 14. In any of the methods in Examples 10 to 13, it may also include: a first step of supplying cleaning fluid to the back side of the substrate supported on the support while the support and the annular member are rotating; a second step of raising the substrate above the support after the first step; and a third step of supplying cleaning fluid to the inclined surface after the second step. In this case, the same effect as the apparatus in Example 5 can be obtained.

[0113] Example 15. In the method of Example 14, it may also include: a fourth step after the third step, rotating the substrate by a predetermined angle; a fifth step after the fourth step, lowering the substrate and supporting it on the support; and a sixth step after the fifth step, supplying cleaning fluid to the back of the substrate. In this case, the same effect as the apparatus of Example 6 can be obtained.

[0114] Example 16. In the method of Example 14 or Example 15, step 3 may also include the following processing: under a first processing condition in which the cleaning fluid supplied to the inclined surface flows mainly towards the radially inner side of the annular component and under a second processing condition in which the cleaning fluid supplied to the inclined surface flows mainly towards the radially outer side of the annular component, the cleaning fluid is supplied to the inclined surface. In this case, the same effect as the apparatus of Example 7 can be obtained.

[0115] Example 17. In the method of Example 16, step 3 may also include the following treatment: after supplying cleaning fluid to the inclined surface under the first treatment condition, supplying cleaning fluid to the inclined surface under the second treatment condition. In this case, the same effect as the apparatus of Example 8 can be obtained.

[0116] Example 18. In any of the methods in Examples 14 to 17, step 3 may also include the following treatment: supplying a rinsing solution to the inclined surface after supplying a cleaning solution to the inclined surface. In this case, the same effect as the apparatus in Example 9 can be obtained.

[0117] Example 19. In one example of a computer-readable storage medium, it may also store a program for causing the substrate cleaning apparatus to perform any of the methods in Examples 10 to 18. In this case, the same effect as the apparatus in Example 1 can be obtained. In this specification, a computer-readable storage medium may include a non-transitory computer recording medium (e.g., various primary or secondary storage devices) or a transitory computer recording medium (e.g., data signals that can be provided via a network).

Claims

1. A substrate cleaning apparatus, characterized in that, include: The support portion is configured to abut against the back side of the substrate to support the substrate; An annular member is configured to surround the periphery of a substrate supported by the support portion and includes an inclined surface that is radially inclined relative to the horizontal direction along the annular member. A rotating part, configured to allow the support part and the annular component to rotate; The first supply unit is configured to supply cleaning fluid to the back side of the substrate supported by the support unit. as well as The second supply unit is configured to supply cleaning fluid to the inclined surface under both a first processing condition and a second processing condition. Under the first processing condition, the cleaning fluid supplied to the inclined surface flows primarily radially inward toward the annular component, while under the second processing condition, the cleaning fluid supplied to the inclined surface flows primarily radially outward toward the annular component. The inclined surface slopes downwards as it moves radially inwards. The second supply unit includes a nozzle disposed above the inclined surface.

2. The substrate cleaning apparatus as described in claim 1, characterized in that: The second supply section includes a nozzle that is movable radially in the annular component.

3. The substrate cleaning apparatus as described in claim 1 or 2, characterized in that: The cleaning solution is a cleaning solution or a rinsing solution.

4. The substrate cleaning apparatus as described in claim 1 or 2, characterized in that, Also includes: The lifting unit is configured to support the substrate while moving up and down between a raised position where its front end is located above the support and a lower position where its front end is located below the support; and Control Department The control unit performs: The first process controls the first supply unit to supply cleaning fluid to the back side of the substrate supported by the support unit. The second process involves controlling the lifting section after the first process so that the lifting section supporting the substrate is in the raised position; and The third process, following the second process, controls the second supply unit to supply cleaning fluid to the inclined surface.

5. The substrate cleaning apparatus as described in claim 4, characterized in that: The control unit also performs: The fourth process involves controlling the lifting unit after the third process to rotate the substrate by a predetermined angle. The fifth process involves controlling the lifting unit after the fourth process to lower the lifting unit to the lowered position and support the substrate on the support unit. and The sixth process, following the fifth process, controls the first supply unit to supply cleaning fluid to the back side of the substrate.

6. The substrate cleaning apparatus as described in claim 4, characterized in that: The third process includes the following process: after controlling the second supply unit under the first processing conditions, controlling the second supply unit under the second processing conditions.

7. The substrate cleaning apparatus as described in claim 4, characterized in that: The third process includes the following process: controlling the second supply unit so that after the cleaning solution is supplied to the inclined surface, a rinsing solution is supplied to the inclined surface.

8. A substrate cleaning method, characterized in that: The process includes supplying cleaning fluid to the inclined surface of the annular member under first and second processing conditions, while the support portion supporting the substrate abuts against the back of the substrate and the annular member arranged to surround the periphery of the substrate are rotated. The first processing condition causes the cleaning fluid supplied to the inclined surface to flow primarily radially inward towards the annular member, and the second processing condition causes the cleaning fluid supplied to the inclined surface to flow primarily radially outward towards the annular member. The inclined surface is inclined radially relative to the horizontal direction along the annular component, and tilts downwards as it moves radially inwards. The process of supplying cleaning fluid to the inclined surface includes the process of supplying cleaning fluid to the inclined surface from above.

9. The substrate cleaning method as described in claim 8, characterized in that: The process of supplying cleaning fluid to the inclined surface includes the following steps: while moving the nozzle supplying the cleaning fluid radially in the annular component, the cleaning fluid is supplied to the inclined surface.

10. The substrate cleaning method as described in claim 8 or 9, characterized in that: The cleaning solution is a cleaning solution or a rinsing solution.

11. The substrate cleaning method as described in claim 8 or 9, characterized in that, include: The first step involves supplying cleaning fluid to the back side of the substrate supported by the support while the support and the annular component are rotated. After the first step, a second step is performed in which the substrate is raised above the support portion; and The third step is to supply cleaning fluid to the inclined surface after the second step.

12. The substrate cleaning method as described in claim 11, characterized in that, Also includes: After step 3, a fourth step involves rotating the substrate by a predetermined angle. After step 4, step 5 involves lowering the substrate and supporting it on the support. and Following step 5, a sixth step involves supplying cleaning fluid to the back side of the substrate.

13. The substrate cleaning method as described in claim 11, characterized in that: The third step includes the following process: after the first processing condition has been used to supply cleaning fluid to the inclined surface, the second processing condition has been used to supply cleaning fluid to the inclined surface.

14. The substrate cleaning method as described in claim 11, characterized in that: The third step includes the following process: after supplying the cleaning solution to the inclined surface, supplying the rinsing solution to the inclined surface.

15. A computer-readable storage medium, characterized in that: The device stores a program for causing the substrate cleaning apparatus to perform the substrate cleaning method according to any one of claims 8 to 14.

Images