A dispensing, laminating and curing integrated machine

Abstract

The present invention discloses a dispensing, bonding and curing integrated machine, which relates to the technical field of chip production equipment. The dispensing, bonding and curing integrated machine includes a working platform, a dispensing device, a bonding device, a curing device and a handling device; the dispensing device is arranged on the working platform and is used for applying glue to the first workpiece; the bonding device is arranged on the working platform and is located on one side of the dispensing device, and the bonding device is used for bonding the first workpiece and the second workpiece that have been subjected to glue application treatment and performing pre-curing treatment, and a semi-finished product is formed after the first workpiece and the second workpiece are bonded and subjected to pre-curing treatment; the curing device is arranged on the side of the bonding device away from the dispensing device, and the curing device is used for curing the semi-finished product, and a finished product is formed after the semi-finished product is cured; the handling device is used for respectively picking up, placing and moving the first workpiece, the second workpiece, the semi-finished product and the finished product. The present invention can realize automation in the whole production and manufacturing process, improve production efficiency and reduce production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production equipment, and in particular to a dispensing, laminating and curing integrated machine. Background Art

[0002] When manufacturing chips, it is usually necessary to apply glue on the surface of the chips, then attach glass and perform UV curing treatment. Due to the small size of a single chip, in order to improve the production efficiency and lamination accuracy of the chips, the existing method is to laminate and perform UV curing treatment on the wafer with evenly distributed chips and the glass matching the size of the wafer. However, the above production steps need to be completed separately in multiple manually operated devices, and each device can only complete one of the processes, resulting in high labor costs and low production efficiency. Summary of the Invention

[0003] The purpose of the present invention is to provide a dispensing, laminating and curing integrated machine, which can integrate multiple devices required in product manufacturing, realize automation in the whole production and manufacturing process, improve production efficiency and reduce production costs.

[0004] To achieve the above technical effects, the technical solution of the present invention is as follows:

[0005] A dispensing, laminating and curing integrated machine, comprising:

[0006] A working platform;

[0007] A dispensing device, which is arranged on the working platform and is used for applying glue to a first workpiece;

[0008] A laminating device, which is arranged on the working platform and is located on one side of the dispensing device. The laminating device is used for laminating the first workpiece that has been subjected to glue application treatment and a second workpiece and performing pre-curing treatment. After the first workpiece and the second workpiece are laminated and subjected to pre-curing treatment, a semi-finished product is formed;

[0009] A curing device, which is arranged on the side of the laminating device away from the dispensing device. The curing device is used for curing the semi-finished product. After the semi-finished product is cured, a finished product is formed;

[0010] A handling device, which is used for respectively picking up, placing and moving the first workpiece, the second workpiece, the semi-finished product and the finished product.

[0011] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing, bonding and curing integrated machine further includes a storage cabinet, a first transfer chamber and a second transfer chamber. The storage cabinet is arranged between the curing device and the working platform. The first transfer chamber is located on the side of the dispensing device away from the bonding device. The second transfer chamber is arranged on the side of the storage cabinet away from the curing device and above the working platform. The handling device includes:

[0012] A first material taking mechanism, which is movably arranged on the working platform and on the side of the dispensing device away from the bonding device, and is used to take out the first workpiece from the first transfer chamber and transfer it to the intermediate transfer table;

[0013] A second material taking mechanism, which is movably arranged on the curing device. The second material taking mechanism can take out the second workpiece from the storage cabinet and transfer it to the second transfer chamber. The second material taking mechanism can also transfer the semi-finished product from the second transfer chamber into the curing device. The second material taking mechanism can also take out the finished product from the curing device and place it into the storage cabinet;

[0014] A handling and flipping mechanism, which is movably arranged on the working platform and in front of the dispensing device and the bonding device. The handling and flipping mechanism can successively transfer the first workpiece from the intermediate transfer table to the dispensing device and then to the bonding device. The handling and flipping mechanism can also take out the second workpiece from the second transfer chamber, flip it 180 degrees and then transfer it to the bonding device. The handling and flipping mechanism can also take out the semi-finished product from the bonding device and transfer it into the second transfer chamber.

[0015] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing device includes:

[0016] A stage mechanism, which is arranged on the working platform and is used to carry the first workpiece and can drive the first workpiece to rotate and lift;

[0017] A first glue coating mechanism, which is located above the stage mechanism and is used to coat frame glue on the first workpiece to form a frame glue area on the first workpiece;

[0018] A second glue coating mechanism, which is located above the stage mechanism and is used to coat surface glue in the frame glue area of the first workpiece.

[0019] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing device further includes: a cross-sectional area detection mechanism, which is arranged on one side of the stage mechanism and is used to detect the cross-sectional area of the frame glue area.

[0020] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing device further includes:

[0021] A first glue wiping mechanism, which is located below the first glue coating mechanism and is used to wipe off the glue at the glue outlet position of the first glue coating mechanism;

[0022] A second glue wiping mechanism, which is located below the second glue coating mechanism and is used to wipe off the glue at the glue outlet position of the second glue coating mechanism.

[0023] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing device further includes an ink viewing mechanism, which is arranged below the second nozzle of the second glue coating mechanism and is used to detect whether the second nozzle of the second glue coating mechanism is blocked.

[0024] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing device further includes a weighing mechanism, which is connected to the second nozzle of the second glue coating mechanism and is used to control the amount of glue for each operation of the second nozzle of the second glue coating mechanism.

[0025] As an alternative solution for a dispensing, bonding and curing integrated machine, the dispensing, bonding and curing integrated machine further includes an edge finding mechanism, which is located above the stage mechanism of the dispensing device. The edge finding mechanism can respectively perform edge finding and positioning on the first workpiece and the second workpiece.

[0026] As an alternative solution for a dispensing, bonding and curing integrated machine, the bonding device includes:

[0027] A fixed bracket, which is installed on the working platform,

[0028] An upper bonding mechanism, which is installed on the fixed bracket and can adsorb the second workpiece;

[0029] A lower bonding mechanism, which is arranged opposite to the upper bonding mechanism. The lower bonding mechanism can carry the first workpiece and adjust the relative position of the first workpiece, and the distance between the lower bonding mechanism and the upper bonding mechanism is adjustable. When the distance between the upper bonding mechanism and the lower bonding mechanism is zero, a sealed cavity can be formed so that the second workpiece and the first workpiece are bonded in the sealed cavity to form a semi-finished product;

[0030] A pre-curing mechanism, which is arranged between the upper laminating mechanism and the lower laminating mechanism, is used for pre-curing the semi-finished product.

[0031] As an alternative solution of the dispensing, laminating and curing integrated machine, the curing device includes:

[0032] A curing stage for carrying the semi-finished product;

[0033] A curing lamp, which is located on one side of the curing stage and is used for irradiating ultraviolet rays on the semi-finished product for curing treatment.

[0034] The beneficial effects of the present invention are as follows: The present invention provides a dispensing, laminating and curing integrated machine. During use, the handling device grabs and moves the first workpiece to the dispensing device for glue application treatment and then moves it to the laminating device. Then, it grabs and moves the second workpiece to the laminating device to complete the lamination and pre-curing treatment of the first workpiece and the second workpiece to form a semi-finished product. Finally, it grabs and moves the semi-finished product to the curing device for curing to form the required finished product. Compared with the prior art, the dispensing, laminating and curing integrated machine integrates multiple devices required in product manufacturing, realizes automation in the entire production and manufacturing process, improves production efficiency, and reduces production costs.

[0035] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0036] Figure 1 is a schematic structural diagram of the dispensing, laminating and curing integrated machine provided by the specific embodiment of the present invention;

[0037] Figure 2 is a schematic structural diagram of the dispensing, laminating and curing integrated machine with the cover removed provided by the specific embodiment of the present invention Figure 1 ;

[0038] Figure 3 is a schematic structural diagram of the dispensing, laminating and curing integrated machine with the cover removed provided by the specific embodiment of the present invention Figure 2 ;

[0039] Figure 4 is a schematic structural diagram of the first material taking mechanism provided by the specific embodiment of the present invention;

[0040] Figure 5 is a schematic structural diagram of the second material taking mechanism provided by the specific embodiment of the present invention;

[0041] Figure 6 is a schematic structural diagram of the handling and flipping mechanism provided by the specific embodiment of the present invention;

[0042] Figure 7 It is a schematic structural diagram of the dispensing device provided by the specific embodiment of the present invention Figure 1 ;

[0043] Figure 8 It is a schematic structural diagram of the dispensing device provided by the specific embodiment of the present invention Figure 2 ;

[0044] Figure 9 It is a schematic structural diagram of the first glue - applying mechanism provided by the specific embodiment of the present invention;

[0045] Figure 10 It is a schematic structural diagram of the second glue - applying mechanism provided by the specific embodiment of the present invention;

[0046] Figure 11 It is a schematic structural diagram of the first glue - wiping mechanism provided by the specific embodiment of the present invention;

[0047] Figure 12 It is a schematic structural diagram of the second glue - wiping mechanism and the ink - viewing mechanism provided by the specific embodiment of the present invention;

[0048] Figure 13 It is a schematic structural diagram of the weighing mechanism provided by the specific embodiment of the present invention;

[0049] Figure 14 It is a schematic structural diagram of the laminating device provided by the specific embodiment of the present invention;

[0050] Figure 15 It is a schematic structural diagram of the curing device provided by the specific embodiment of the present invention.

[0051] Reference numerals:

[0052] 1, working platform; 11, cover body;

[0053] 2, dispensing device;

[0054] 21, carrier mechanism; 211, first slide rail; 212, rotating carrier; 2121, body; 2122, lifting carrier;

[0055] 22, first glue - applying mechanism; 221, first nozzle; 222, height - measuring part; 223, fourth lifting module; 224, first camera positioning module;

[0056] 23, second glue - applying mechanism; 231, second nozzle; 232, ink - supply component; 233, fifth lifting module; 234, second camera positioning module;

[0057] 24, cross - sectional area detection mechanism; 241, first column; 242, laser detection head;

[0058] 25. First rubber coating mechanism; 251. First vertical plate; 252. First unwinding wheel; 253. First winding wheel; 254. Glue receiving cup;

[0059] 26. Second rubber coating mechanism; 261. Second vertical plate; 262. Second unwinding wheel; 263. Second winding wheel;

[0060] 27. Ink viewing mechanism;

[0061] 28. Weighing mechanism; 281. Balance;

[0062] 3. Laminating device; 31. Fixed bracket; 32. Upper laminating mechanism; 33. Lower laminating mechanism; 34. Pre-curing mechanism; 35. Positioning mechanism;

[0063] 4. Curing device; 41. Curing stage; 42. Curing lamp; 43. Second slide rail; 44. Sixth lifting module;

[0064] 51. First material taking mechanism; 511. First workpiece material taking finger; 512. First lifting module; 513. First X-axis moving module; 514. Second X-axis moving module;

[0065] 52. Second material taking mechanism; 521. Second lifting component; 522. First rotating module; 523. Third X-axis moving module; 524. Second workpiece material taking finger;

[0066] 53. Handling and flipping mechanism; 531. Fourth X-axis moving module; 532. Third lifting module; 533. Flipping module; 534. Handling finger;

[0067] 6. Storage cabinet;

[0068] 7. Intermediate transfer table;

[0069] 8. Second transition cabin;

[0070] 9. Edge finding mechanism. Detailed implementation manners

[0071] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0072] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features between them. Moreover, the first feature being "above", "above the", and "on the" of the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below the", and "under the" of the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0074] It should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise stated, the meaning of "a plurality of" is two or more. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning. Among them, the terms "first position" and "second position" are two different positions.

[0075] The technical solution of the present invention will be further described below with reference to the drawings and through specific embodiments.

[0076] Such as Figures 1 to 3As shown in the figure, this embodiment provides a dispensing, bonding and curing integrated machine, which includes a working platform 1, a dispensing device 2, a bonding device 3, a curing device 4 and a handling device. The dispensing device 2 is arranged on the working platform 1 and is used for dispensing glue on the first workpiece. The bonding device 3 is arranged on the working platform 1 and is located on one side of the dispensing device 2. The bonding device 3 is used for bonding the first workpiece and the second workpiece that have been subjected to glue dispensing treatment and performing pre-curing treatment. After the first workpiece and the second workpiece are bonded and pre-cured, a semi-finished product is formed. The curing device 4 is arranged on the side of the bonding device 3 away from the dispensing device 2. The curing device 4 is used for curing the semi-finished product. After the semi-finished product is cured, a finished product is formed. The handling device is used for picking up, placing and moving the first workpiece, the second workpiece, the semi-finished product and the finished product respectively.

[0077] During use, the handling device grabs and moves the first workpiece to the dispensing device 2 for glue dispensing treatment and then moves it to the bonding device 3. Then it grabs and moves the second workpiece to the bonding device 3 so that the first workpiece and the second workpiece are bonded and pre-cured to form a semi-finished product. Finally, it grabs and moves the semi-finished product to the curing device 4 for curing to form the required finished product. Compared with the prior art, this dispensing, bonding and curing integrated machine integrates multiple devices required in product manufacturing, realizes automation in the entire production and manufacturing process, improves production efficiency, and reduces production costs.

[0078] In this embodiment, the first workpiece is a wafer, the second workpiece is glass, and multiple chips are evenly distributed on the wafer.

[0079] Since the entire process of processing the first workpiece and the second workpiece into a finished product needs to be carried out in a sealed environment, the dispensing, bonding and curing integrated machine further includes a cover 11. The cover 11 can cover the working platform 1 and cover the dispensing device 2 and the bonding device 3 to form a sealed environment.

[0080] Specifically, the dispensing, bonding and curing integrated machine further includes a storage cabinet 6, a first transition chamber and a second transition chamber 8. The storage cabinet 6 is arranged between the curing device 4 and the working platform 1. The first transition chamber is located on the side of the dispensing device 2 away from the bonding device 3. The second transition chamber 8 is arranged on the side of the storage cabinet 6 away from the curing device 4 and above the working platform 1. The handling device includes a first material taking mechanism 51, a second material taking mechanism 52 and a handling and flipping mechanism 53. The first material taking mechanism 51 is movably arranged on the working platform 1 and is located on the side of the dispensing device 2 away from the bonding device 3, and is used to take out the first workpiece from the first transition chamber and transfer it to the intermediate transfer table 7. The second material taking mechanism 52 is movably arranged on the curing device 4. The second material taking mechanism 52 can take out the second workpiece from the storage cabinet 6 and transfer it to the second transition chamber 8. The second material taking mechanism 52 can also transfer the semi-finished product from the second transition chamber 8 into the curing device 4. The second material taking mechanism 52 can also take out the finished product from the curing device 4 and place it into the storage cabinet 6. The handling and flipping mechanism 53 is movably arranged on the working platform 1 and is located in front of the dispensing device 2 and the bonding device 3. The handling and flipping mechanism 53 can sequentially transfer the first workpiece from the intermediate transfer table 7 to the dispensing device 2 and then to the bonding device 3. The handling and flipping mechanism 53 can also take out the second workpiece from the second transition chamber 8, flip it 180 degrees and then transfer it to the bonding device 3. The handling and flipping mechanism 53 can also take out the semi-finished product from the bonding device 3 and transfer it into the second transition chamber 8.

[0081] It can be understood that first, the first material taking mechanism 51 transfers the first workpiece obtained from the previous process from the first transition chamber to the intermediate transfer table 7, and then the handling and flipping mechanism 53 moves the first workpiece from the intermediate transfer table 7 to the dispensing device 2 for glue coating treatment and then transfers it to the bonding device 3. On the other hand, the second material taking mechanism 52 takes out the second workpiece from the storage cabinet 6 and transfers it to the second transition chamber 8, and then the handling and flipping mechanism 53 flips the second workpiece 180 degrees and moves it to the bonding device 3, so that the first workpiece and the second workpiece are bonded and pre-cured to form a semi-finished product. Subsequently, the handling and flipping mechanism 53 grabs and moves the semi-finished product into the second transition chamber 8. Finally, the second material taking mechanism 52 transfers the semi-finished product from the second transition chamber 8 to the curing device 4 for curing to form the required finished product and places it into the storage cabinet 6.

[0082] That is, through the first transition chamber and the second transition chamber 8, the situation of crashing in the production process (that is, the previous process is completed before the subsequent process is completed) can be avoided, and the handling device is divided into the first material taking mechanism 51, the second material taking mechanism 52 and the handling and flipping mechanism 53 to improve the overall production efficiency. Of course, in other embodiments, a six-axis manipulator driven by a linear motor can also be used to replace the first material taking mechanism 51 and the handling mechanism, and no specific limitation is made in this embodiment.

[0083] Combined Figure 4 As shown in Figure 4 , the first material taking mechanism 51 includes a first workpiece material taking finger 511, a first lifting module 512, a first X-axis moving module 513, and a second X-axis moving module 514. The first X-axis moving module 513 is arranged on the working platform 1; the first lifting module 512 is arranged on the first X-axis moving module 513; the second X-axis moving module 514 is arranged on the first lifting module 512; the first workpiece material taking finger 511 is arranged on the second X-axis moving module 514. That is, the first X-axis module drives the first workpiece material taking finger 511 to approach the first transition chamber along the X-axis direction for rough positioning, then the first lifting module 512 is used to make the first workpiece material taking finger 511 and the first workpiece at the same height, and finally the second X-axis moving module 514 drives the first workpiece material taking finger 511 to extend into the first transition chamber along the X-axis direction and adsorb the lower surface of the first workpiece, so as to avoid contacting the upper surface (i.e., the bonding surface) of the first workpiece and affecting the subsequent bonding between it and the second workpiece. Among them, the first workpiece material taking finger 511, the first lifting module 512, the first X-axis moving module 513, and the second X-axis moving module 514 are all related existing structures in the mechanical field and will not be elaborated here.

[0084] Combined Figure 5 As shown in Figure 5 , the second material taking mechanism 52 includes a second lifting component 521, a first rotating module 522, a third X-axis moving module 523, and a second workpiece material taking finger 524 that are connected in sequence from bottom to top. Since the lifting module is arranged between the curing device 4 and the storage cabinet 6, that is, the first rotating module is used to realize the picking and placing of the second workpiece by the second workpiece material taking finger 524 between them, and the third X-axis moving module 523 is used to move along the X-axis direction to realize the picking and placing of the second workpiece material taking finger 524 between the storage cabinet 6 and the second transition chamber 8. Among them, the second lifting component 521, the first rotating module 522, the third X-axis moving module 523, and the second workpiece material taking finger 524 are all related existing structures in the mechanical field and will not be elaborated here.

[0085] Exemplarily, the second workpiece material taking finger 524 is made of ceramic provided with vacuum suction holes to ensure that the second workpiece material taking finger 524 can adsorb the lower surface of the second workpiece and avoid contacting the upper surface (i.e., the bonding surface) of the second workpiece and affecting the subsequent bonding between it and the first workpiece.

[0086] Combined Figure 6As shown in the figure, the handling and flipping mechanism 53 includes a fourth X-axis moving module 531, a third lifting module 532, a flipping module 533, and handling fingers 534 connected in sequence from bottom to top. The fourth X-axis moving module 531 is arranged on the working platform 1. That is, the fourth X-axis moving module 531 drives the handling fingers 534 to move along the X-axis direction on the working platform 1 to approach the intermediate transfer table 7, the dispensing device 2, the bonding device 3, and the second transition chamber 8. Considering that the second workpiece needs to be flipped during bonding so that its bonding surface faces downward, the flipping module 533 is used to change the state of the second workpiece from having the bonding surface facing upward when in the second transition chamber 8 to facing downward. Among them, the fourth X-axis moving module 531, the third lifting module 532, the flipping module 533, and the handling fingers 534 are all related existing structures in the mechanical field and will not be elaborated here.

[0087] Combined with Figure 7 and Figure 8 As shown in the figure, the dispensing device 2 includes a stage mechanism 21, a first dispensing mechanism 22, and a second dispensing mechanism 23. The stage mechanism 21 is arranged on the working platform 1. The stage mechanism 21 is used to carry the first workpiece and can drive the first workpiece to rotate and lift; the first dispensing mechanism 22 is located above the stage mechanism 21 and is used to coat frame glue on the first workpiece to form a frame glue area on the first workpiece; the second dispensing mechanism 23 is located above the stage mechanism 21 and is used to coat surface glue within the frame glue area of the first workpiece. That is, the first workpiece is placed on the stage mechanism 21 with its bonding surface facing upward. First, the first dispensing mechanism 22 coats frame glue on the first workpiece, and then the second dispensing mechanism 23 coats surface glue within the frame glue area. By integrating the first dispensing mechanism 22 and the second dispensing mechanism 23 together to complete the coating of frame glue and surface glue respectively, the structure of the dispensing device 2 is simplified, its layout is compact, and the integration degree and production efficiency of the dispensing device 2 are improved.

[0088] Specifically, the stage mechanism 21 includes a first slide rail 211 and a rotating stage 212. The first slide rail 211 extends along the Y direction. The rotating stage 212 is used to carry the glue-coated part and is slidably arranged on the first slide rail 211. The rotating stage 212 includes a main body and a lifting stage 2122. The main body can reciprocally slide along the Y-axis direction on the first slide rail 211. A cavity is opened in the center of the main body so that the lifting stage 2122 can be telescopically arranged vertically within the cavity. That is, by sliding the main body on the first slide rail 211 to approach or move away from the handling and flipping mechanism 53, the first dispensing mechanism 22, and the second dispensing mechanism 23, the first workpiece can be adsorbed on the lifting stage 2122 and the distance between it and the first nozzle 221 of the first dispensing mechanism 22 and the second nozzle 231 of the second dispensing mechanism 23 can be adjusted through the lifting stage 2122.

[0089] Specifically, combined with Figure 9As shown, the first glue application mechanism 22 includes a connected first nozzle 221, a height measuring component 222, a fourth lifting module 223, and a first camera positioning module 224. The fourth lifting module 223 drives the first nozzle 221 and the height measuring component 222 to always maintain an equal distance from the first workpiece along the Z-axis, thereby forming a frame glue with a uniform thickness, improving the quality of the frame glue. The first camera positioning module 224 is used to measure the distance between the first nozzle 221 and the first workpiece along the X-axis to ensure that the first nozzle 221 can be directly above the first workpiece. It should be noted that the frame glue is a rectangular frame body, including two parallel vertical sides along the X direction and two parallel horizontal sides along the Y direction.

[0090] Specifically, the first nozzle 221 is a needle head that can spray glue lines with a relatively thin width. The height measuring component 222 is a laser probe that can measure the distance from the first workpiece in real time. Of course, the height measuring component 222 can also be an infrared height measuring mechanism, etc., and this embodiment does not make specific limitations.

[0091] The first camera positioning module 224 of this embodiment is a positioning CCD, which has characteristics such as small volume and light weight, can accurately measure the distance between the first nozzle 221 and the first workpiece, and improves the moving accuracy of the first glue application mechanism 22.

[0092] Specifically, in combination with Figure 10 As shown, the second glue application mechanism 23 includes a connected second nozzle 231, an ink supply component 232, a fifth lifting module 233, and a second camera positioning module 234. The fifth lifting module 233 drives the second nozzle 231 to always maintain an equal distance from the first workpiece along the Z-axis, thereby forming a surface glue with a uniform thickness. The ink supply component 232 enables the second nozzle 231 to coat the surface glue into the frame glue area by means of inkjet printing, so that the forming quality of the glue layer of the surface glue is high. The second camera positioning module 234 is used to measure the distance between the second nozzle 231 and the first workpiece along the X-axis to ensure that the second nozzle 231 can be directly above the first workpiece.

[0093] In this embodiment, the second nozzle 231 is a printing nozzle, and the surface glue is coated into the frame glue area by means of inkjet printing, so that the surface glue is evenly coated and the forming quality of the glue layer is high. The second nozzle 231 of this embodiment has glue spraying ports distributed in an array, and the glue is evenly sprayed inside the frame glue through multiple glue spraying ports. Therefore, the inkjet printing method improves the coating efficiency and thus improves the working efficiency of the dispensing device 2.

[0094] The second camera positioning module 234 of this embodiment is a positioning CCD, which has characteristics such as small volume and light weight, can accurately measure the distance between the second nozzle 231 and the first workpiece, and improves the moving accuracy of the second glue application mechanism 23.

[0095] Combination Figure 8 As shown in Figure 8 , the dispensing device 2 further includes a cross-sectional area detection mechanism 24. The cross-sectional area detection mechanism 24 is arranged on one side of the stage mechanism 21 and is used to detect the cross-sectional area of the frame glue area to ensure that the frame glue can completely seal the display area of each chip. Specifically, the cross-sectional area detection mechanism 24 includes a first column 241 and a laser detection head 242. The first column 241 includes a connected vertical rod and a horizontal rod. The vertical rod is arranged on one side of the stage mechanism 21. One end of the horizontal rod is connected to the top of the vertical rod, and the other end extends directly above the stage mechanism 21. The laser detection head 242 is installed at the end of the horizontal rod to measure the cross-sectional area of the frame glue after pressing.

[0096] In this embodiment, considering that the first nozzle 221 and the second nozzle 231 are prone to cured residual glue after long-term use, which affects the spraying quality of the frame glue and the surface glue, the dispensing device 2 further includes a first glue wiping mechanism 25 and a second glue wiping mechanism 26. The first glue wiping mechanism 25 is located below the first glue application mechanism 22 and is used to wipe the glue at the glue outlet position of the first glue application mechanism 22. The second glue wiping mechanism 26 is located below the second glue application mechanism 23 and is used to wipe the glue at the glue outlet position of the second glue application mechanism 23.

[0097] Combination Figure 11 As shown in Figure 11 , the first glue wiping mechanism 25 includes a first vertical plate 251, a first unwinding wheel 252, a first winding wheel 253 and a glue receiving cup 254. The first vertical plate 251 is arranged below the first glue application mechanism 22. The first unwinding wheel 252 and the first winding wheel 253 are respectively rotatably arranged on the vertical plate, and the rotation directions of the first unwinding wheel 252 and the first winding wheel 253 are the same. A first cleaning part is wound around the first unwinding wheel 252 and can unwind to wipe the glue. The first winding wheel 253 can wind up the first cleaning part. The glue receiving cup 254 is installed on the first vertical plate 251. That is, before glue wiping, the first nozzle 221 pre-sprays a part of the glue to prevent external residual glue from entering the first nozzle 221. The glue receiving cup 254 is used to collect the pre-sprayed glue to prevent the glue from dripping to other positions of the dispensing device 2 and ensure the cleanliness of the dispensing device 2. The first cleaning part in this embodiment can be a common cleaning product such as a lint-free cloth, which is convenient to be wound around the first unwinding wheel 252.

[0098] Among them, the specific glue wiping process of the first glue wiping mechanism 25 is as follows: the first nozzle 221 descends in the vertical direction and abuts against the first cleaning part. Start the first glue wiping mechanism 25, the first unwinding wheel 252 and the first winding wheel 253 rotate in the same direction, the first unwinding wheel 252 starts to unwind, so that the first cleaning part wipes the first nozzle 221, and the first winding wheel 253 winds up synchronously. At the same time, the first nozzle 221 reciprocates in the X-axis direction to enhance the residual glue cleaning effect and cleaning efficiency.

[0099] Combination Figure 12As shown in the figure, the second glue wiping mechanism 26 includes a second vertical plate 261, a second unwinding wheel 262 and a second winding wheel 263. The second vertical plate 261 is arranged below the second glue coating mechanism 23. The second unwinding wheel 262 and the second winding wheel 263 are respectively rotatably arranged on the second vertical plate 261, and the rotation directions of the second unwinding wheel 262 and the second winding wheel 263 are the same. A second cleaning member is wound around the second unwinding wheel 262 and can unwind to wipe off the glue. The second winding wheel 263 can wind up the second cleaning member. The second cleaning member in this embodiment can be a common cleaning product such as a lint-free cloth, so as to be easily wound around the second unwinding wheel 262.

[0100] Among them, the specific glue wiping process of the second glue wiping mechanism 26 is as follows: the second spray head 231 descends in the vertical direction and abuts against the second cleaning member. The second glue wiping mechanism 26 is started, the second unwinding wheel 262 and the second winding wheel 263 rotate in the same direction, the second unwinding wheel 262 starts to unwind, so that the second cleaning member wipes the second spray head 231, and the second winding wheel 263 winds up synchronously. At the same time, the second spray head 231 reciprocates in the X-axis direction to enhance the residual glue cleaning effect and cleaning efficiency.

[0101] Among them, the dispensing device 2 further includes an ink viewing mechanism 27. The ink viewing mechanism 27 is arranged below the second spray head 231 of the second glue coating mechanism 23 and is used to detect whether the second spray head 231 of the second glue coating mechanism 23 is blocked. Through the ink viewing mechanism 27, the number and area of the blocked glue spraying ports in the second spray head 231 can be detected in time, so as to adjust the spraying parameters of the second spray head 231. The spraying parameters here include spraying trajectories, glue spraying amounts, etc., so as to ensure good surface glue quality. The ink viewing mechanism 27 is a mature product in the field and can be obtained by outsourcing. The specific structure and working process thereof will not be elaborated herein.

[0102] It can be understood that in this embodiment, considering that both the ink viewing mechanism 27 and the second glue wiping mechanism 26 need to be arranged below the second spray head 231, therefore, the ink viewing mechanism 27 is adjacently installed on one side of the second vertical plate 261, making the structure more compact, optimizing the structural layout of the ink viewing mechanism 27 and the second glue wiping mechanism 26, and reducing the floor area of the ink viewing mechanism 27 and the second glue wiping mechanism 26.

[0103] Furthermore, as shown in the figure Figure 13 The dispensing device 2 further includes a weighing mechanism 28. The weighing mechanism 28 is connected to the second spray head 231 of the second glue coating mechanism 23 and is used to control the amount of glue for each operation of the second spray head 231 of the second glue coating mechanism 23, so as to ensure uniform surface glue on each chip. In this embodiment, the weighing mechanism 28 includes a balance 281 to enable weighing of the weight of the glue. Since the weighing mechanism 28 is a mature product in the field and can be obtained by outsourcing, the specific structure and working process thereof will not be elaborated herein.

[0104] In this embodiment, the dispensing, laminating and curing integrated machine further includes an edge-finding mechanism 9. The edge-finding mechanism 9 is located above the stage mechanism 21 of the dispensing device 2. The edge-finding mechanism 9 can perform edge-finding and positioning on the first workpiece and the second workpiece respectively, so as to perform positioning before dispensing on the first workpiece, improve the glue coating quality, and before the second workpiece is placed on the laminating device 3, first place it on the lifting stage 2122 through the handling device for edge-finding and positioning to improve the positioning efficiency as much as possible. In addition, installing the edge-finding mechanism 9 above the stage mechanism 21 can make the structure more compact, optimize the structural layout of the entire dispensing, laminating and curing integrated machine, and reduce the floor area.

[0105] In this embodiment, the edge-finding mechanism 9 is a CCD camera, which can respectively capture images of the first workpiece and the second workpiece on the lifting stage 2122. It can be understood that the dispensing device 2 has a control unit. The edge-finding mechanism 9 transmits the captured images to the control unit. The control unit obtains the position parameters of the first workpiece and the second workpiece by analyzing the image information, and calculates the rotation angle of the rotating stage 212, so that the first workpiece and the second workpiece can respectively be in the specified positions to ensure the positioning accuracy and consistency of the first workpiece and the second workpiece respectively.

[0106] Combined Figure 14 As shown, the laminating device 3 includes a fixed bracket 31, an upper laminating mechanism 32, a lower laminating mechanism 33 and a pre-curing mechanism 34. The fixed bracket 31 is installed on the working platform 1; the upper laminating mechanism 32 is installed on the fixed bracket 31. The upper laminating mechanism 32 can adsorb the second workpiece; the lower laminating mechanism 33 is arranged opposite to the upper laminating mechanism 32. The lower laminating mechanism 33 can carry the first workpiece and adjust the relative position of the first workpiece, and the distance between the lower laminating mechanism 33 and the upper laminating mechanism 32 is adjustable. When the distance between the upper laminating mechanism 32 and the lower laminating mechanism 33 is zero, a sealed cavity can be formed, so that the first workpiece and the second workpiece are laminated in the sealed cavity to form a semi-finished product; the pre-curing mechanism 34 is arranged between the upper laminating mechanism 32 and the lower laminating mechanism 33 for pre-curing the semi-finished product.

[0107] During use, the upper bonding mechanism 32 adsorbs the second workpiece through the handling mechanism, and the lower bonding mechanism 33 carries the first workpiece. At this time, the first workpiece and the second workpiece are arranged oppositely along the Z-axis direction. Subsequently, the distance between the upper bonding mechanism 32 and the lower bonding mechanism 33 is adjusted to form a sealed cavity so that the first workpiece and the second workpiece can be bonded within the sealed cavity. Subsequently, the distance between the upper bonding mechanism 32 and the lower bonding mechanism 33 is adjusted again to separate the two. At this time, the formed semi-finished product is placed on the lower bonding mechanism 33, and then the semi-finished product is pre-cured by the pre-curing mechanism 34 to prevent relative movement between the first workpiece and the second workpiece when the semi-finished product is transferred to the curing device 4, thereby ensuring the qualification rate of the final product. Since the lower bonding mechanism 33, the upper bonding mechanism 32, and the pre-curing mechanism 34 are mature products in the art and can be obtained through outsourcing, their specific structures and working processes will not be elaborated herein.

[0108] In addition, the bonding device 3 further includes a positioning mechanism 35. The positioning mechanism 35 includes a plurality of positioning components arranged at intervals on the upper bonding mechanism 32, and the positioning components can obtain the position information of the first workpiece and the second workpiece in the sealed cavity in real time. That is, when both the first workpiece and the second workpiece are located in the sealed cavity and there is a certain distance between them, a vacuum environment is formed by evacuating the sealed cavity. Then, the position information of the first workpiece and the second workpiece is respectively obtained through the positioning mechanism 35, and the position of the second workpiece is adjusted through the alignment mechanism of the lower bonding mechanism 33 as needed, so that the first workpiece and the second workpiece are accurately positioned to complete the subsequent bonding between them.

[0109] In addition, compared with the prior art in which the position information of the first workpiece and the second workpiece is respectively obtained by two positioning components, obtaining the position information of the first workpiece and the second workpiece by one positioning component can avoid the systematic error existing in the positioning mechanism 35 itself, further ensuring the accurate positioning between the first workpiece and the second workpiece and improving the bonding effect. Since the positioning mechanism 35 is a mature product in the art and can be obtained through outsourcing, its specific structure and working process will not be elaborated herein.

[0110] Among them, the positioning component includes a CCD camera, a camera mounting base, a first moving module, and a second moving module. The camera mounting base is arranged on the upper bonding mechanism 32 and is connected to the CCD camera; the first moving module is connected to the camera mounting base and is used to move the CCD camera along the X-axis direction or the Y-axis direction; the second moving module is connected to the camera mounting base and is used to move the CCD camera along the Z-axis direction. That is, the second workpiece is first photographed and positioned by the CCD camera, and then the CCD camera is moved downward by the second moving module to photograph and position the first workpiece.

[0111] In this embodiment, the number of positioning components is set to three. That is, the first moving modules of two of the positioning components can move the CCD camera along the X-axis direction, and the first moving module of the other positioning component can move the CCD camera along the Y-axis direction. This can not only adapt to first workpieces and second workpieces of different sizes, but also ensure accurate positioning of the first workpieces and second workpieces. It can be understood that if the first workpieces and second workpieces are provided with positioning points by themselves, only two positioning components are required.

[0112] In this embodiment, in order to form a vacuum environment in the sealed cavity, the laminating device 3 further includes an air extraction mechanism. The air extraction mechanism includes a vacuum pump and a vacuum baffle valve, which are used to create a vacuum environment in the sealed cavity; the vacuum baffle valve is arranged on the upper laminating mechanism 32 and is connected to the sealed cavity and the vacuum pump respectively through vacuum bellows, so as to control the opening and closing of the vacuum pump.

[0113] In other embodiments, if the floor space occupied by the entire dispensing laminating and curing machine is not considered, the number of the first dispensing mechanism 22, the second dispensing mechanism 23 and the laminating device 3 is multiple, so as to improve the overall production efficiency.

[0114] Combined Figure 15 As shown, the curing device 4 includes a second slide rail 43, a curing stage 41, a curing lamp 42 and a sixth lifting module 44. The second slide rail 43 extends along the X-axis direction. The curing stage 41 is used to carry the semi-finished product and is slidably arranged on the second slide rail 43; the curing lamp 42 is located on one side of the curing stage 41 and is connected to the sixth lifting module 44. The curing lamp 42 is used to irradiate the semi-finished product with ultraviolet rays for curing treatment to form a finished product. That is, the semi-finished product is adsorbed by the curing stage 41 and slides on the second slide rail 43 to approach the curing lamp 42 along the X-axis direction, and then the curing lamp 42 is moved by the sixth lifting module 44 to approach the product along the Z-axis direction to complete the curing process. Since the sixth lifting module 44 is a mature product in the field and can be obtained by outsourcing, its specific structure and working process will not be described in detail.

[0115] The working process of the entire dispensing laminating and curing machine mainly includes the following steps:

[0116] First, the first workpiece is transferred from the first transfer chamber to the intermediate transfer table 7 by the first material taking mechanism 51, and then the first workpiece is transferred from the intermediate transfer table 7 to the lifting stage 2122 by the handling and flipping mechanism 53. The lifting stage 2122 is moved to below the edge finding mechanism 9 through the first slide rail 211. The position of the first workpiece is adjusted by the edge finding mechanism 9 through photographing and positioning. Subsequently, the first nozzle 221 is located above the first workpiece for frame glue coating, and then the second nozzle 231 is located above the first workpiece for surface glue coating. Subsequently, the lifting stage 2122 is moved again through the first slide rail 211 so that the handling and flipping mechanism 53 can transfer the product to the lower laminating mechanism 33.

[0117] Furthermore, the second workpiece is transferred from the storage box to the second transition chamber 8 by the second material taking mechanism 52, and then the second workpiece is transferred from the second transition chamber 8 to the lifting stage 2122 by the handling and flipping mechanism 53. The lifting stage 2122 is moved to below the edge finding mechanism 9 through the first slide rail 211. The position of the second workpiece is adjusted by photographing and positioning through the edge finding mechanism 9. Subsequently, the second workpiece is taken out from the lifting stage 2122 by the handling and flipping mechanism 53, flipped 180 degrees, and then transferred to the upper laminating mechanism 32.

[0118] Then, the lower laminating mechanism 33 is moved so that the distance between the lower laminating mechanism 33 and the upper laminating mechanism 32 is zero to form a sealed cavity. Then, the sealed cavity is evacuated, and the positioning component takes pictures and positions the first workpiece and the second workpiece, and the position of the second workpiece is adjusted through the alignment mechanism. After that, the lamination of the first workpiece and the second workpiece is completed. Then, the lower laminating mechanism 33 is moved to separate the lower laminating mechanism 33 from the upper laminating mechanism 32, and the pre-curing mechanism 34 pre-cures the laminated first workpiece and second workpiece to form a semi-finished product. Then, the semi-finished product is transferred from the lower laminating mechanism 33 to the second transition chamber 8 by the handling and flipping mechanism 53. The semi-finished product is transferred from the second transition chamber 8 to the curing stage 41 by the second material taking mechanism 52. The distance between the semi-finished product and the curing lamp 42 is adjusted through the second slide rail 43 and the sixth lifting module 44 to complete the curing process. Finally, the second material taking mechanism 52 takes out the finished product from the curing stage 41 and places it back into the storage cabinet 6.

[0119] In the description of this specification, the descriptions referring to the terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0120] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A dispensing, bonding and curing integrated machine, characterized in that, Including: A working platform (1); A dispensing device (2), which is arranged on the working platform (1) and is used for dispensing glue on the first workpiece; A laminating device (3), which is arranged on the working platform (1) and is located on one side of the dispensing device (2). The laminating device (3) is used for laminating the first workpiece and the second workpiece that have been subjected to glue dispensing treatment and performing pre-curing treatment. After the first workpiece and the second workpiece are laminated and subjected to pre-curing treatment, a semi-finished product is formed; A curing device (4), which is arranged on the side of the laminating device (3) away from the dispensing device (2). The curing device (4) is used for curing the semi-finished product. After the semi-finished product is cured, a finished product is formed; A handling device, which is used for picking up, placing, and moving the first workpiece, the second workpiece, the semi-finished product, and the finished product respectively; The dispensing, laminating, and curing integrated machine further includes a storage cabinet (6), a first transfer chamber, and a second transfer chamber (8). The storage cabinet (6) is arranged between the curing device (4) and the working platform (1); the first transfer chamber is located on the side of the dispensing device (2) away from the laminating device (3); the second transfer chamber (8) is arranged on the side of the storage cabinet (6) away from the curing device (4) and above the working platform (1). The handling device includes: A first material-taking mechanism (51), which is movably arranged on the working platform (1) and is located on the side of the dispensing device (2) away from the laminating device (3), and is used for taking out the first workpiece from the first transfer chamber and transferring it to the intermediate transfer table (7); A second material-taking mechanism (52), which is movably arranged on the curing device (4). The second material-taking mechanism (52) can take out the second workpiece from the storage cabinet (6) and transfer it to the second transfer chamber (8). The second material-taking mechanism (52) can also transfer the semi-finished product from the second transfer chamber (8) into the curing device (4). The second material-taking mechanism (52) can also take out the finished product from the curing device (4) and place it into the storage cabinet (6); A handling and flipping mechanism (53), which is movably arranged on the working platform (1) and is located in front of the dispensing device (2) and the laminating device (3). The handling and flipping mechanism (53) can sequentially transfer the first workpiece from the intermediate transfer table (7) to the dispensing device (2) and then to the laminating device (3). The handling and flipping mechanism (53) can also take out the second workpiece from the second transfer chamber (8), flip it 180 degrees, and transfer it to the laminating device (3). The handling and flipping mechanism (53) can also take out the semi-finished product from the laminating device (3) and transfer it into the second transfer chamber (8).

2. The dispensing, laminating and curing integrated machine according to claim 1, wherein The dispensing device (2) includes: A stage mechanism (21) is provided on the working platform (1). The stage mechanism (21) is used to carry the first workpiece and can drive the first workpiece to rotate and lift. A first glue application mechanism (22) is located above the stage mechanism (21) and is used to apply frame glue on the first workpiece to form a frame glue area on the first workpiece. A second glue application mechanism (23) is located above the stage mechanism (21) and is used to apply surface glue within the frame glue area of the first workpiece.

3. The dispensing, bonding and curing integrated machine according to claim 2, wherein, The dispensing device (2) further includes a cross-sectional area detection mechanism (24). The cross-sectional area detection mechanism (24) is provided on one side of the stage mechanism (21) and is used to detect the cross-sectional area of the frame glue area.

4. The dispensing, bonding and curing integrated machine according to claim 2, wherein, The dispensing device (2) further includes: A first glue wiping mechanism (25) is located below the first glue application mechanism (22) and is used to wipe the glue at the glue outlet position of the first glue application mechanism (22). A second glue wiping mechanism (26) is located below the second glue application mechanism (23) and is used to wipe the glue at the glue outlet position of the second glue application mechanism (23).

5. The dispensing, bonding and curing integrated machine according to claim 2, wherein The dispensing device (2) further includes an ink viewing mechanism (27). The ink viewing mechanism (27) is provided below the second nozzle (231) of the second glue application mechanism (23) and is used to detect whether the second nozzle (231) of the second glue application mechanism (23) is blocked.

6. The dispensing, bonding and curing integrated machine according to claim 2, wherein The dispensing device (2) further includes a weighing mechanism (28). The weighing mechanism (28) is connected to the second nozzle (231) of the second glue application mechanism (23) and is used to control the amount of glue for each operation of the second nozzle (231) of the second glue application mechanism (23).

7. The dispensing, bonding and curing integrated machine according to claim 1, wherein The dispensing, laminating and curing integrated machine further includes an edge finding mechanism (9). The edge finding mechanism (9) is located above the stage mechanism (21) of the dispensing device (2), and the edge finding mechanism (9) can perform edge finding and positioning on the first workpiece and the second workpiece respectively.

8. The dispensing, bonding and curing integrated machine according to claim 1, wherein, The laminating device (3) includes: A fixed bracket (31) is installed on the working platform (1). An upper laminating mechanism (32) is installed on the fixed bracket (31). The upper laminating mechanism (32) can adsorb the second workpiece. A lower laminating mechanism (33) is arranged opposite to the upper laminating mechanism (32). The lower laminating mechanism (33) can carry the first workpiece and adjust the relative position of the first workpiece. The distance between the lower laminating mechanism (33) and the upper laminating mechanism (32) is adjustable. When the distance between the upper laminating mechanism (32) and the lower laminating mechanism (33) is zero, a sealed cavity can be formed so that the second workpiece and the first workpiece are laminated within the sealed cavity to form a semi-finished product. The pre-curing mechanism (34) is disposed between the upper laminating mechanism (32) and the lower laminating mechanism (33) and is used for pre-curing the semi-finished product.

9. The dispensing, bonding and curing integrated machine according to claim 1, wherein, The curing device (4) includes: A curing stage (41) for carrying the semi-finished product; A curing lamp (42) which is located on one side of the curing stage (41) and is used for irradiating ultraviolet rays on the semi-finished product for curing treatment.

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