Display panel, method for manufacturing display panel, and display device

Abstract

The present application provides a display panel, a method for preparing a display panel, and a display device, which relate to the field of display technology and aim to solve the problem of Mura (poor display) formed during the preparation of the display panel. The display panel includes a display area and a functional area arranged adjacent to each other, the display panel includes an opening arranged in the functional area, and a partition structure surrounding at least part of the opening; along the direction from the opening to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure away from the light-emitting surface, and a channel is formed on at least one side wall of the partition structure; a through hole is provided on the partition structure, and along the direction from the opening to the display area, the through hole passes through the partition structure and is connected to the channel. The present application can avoid the problem of Mura formed during the preparation of the display panel, and improve the display effect of the display panel and the display device using the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] With the rapid development of electronic devices, users have higher and higher requirements for screen-to-body ratio, and full-screen technology combining main and secondary screens has emerged.

[0003] In full-screen technology, the display panel consists of a display area and a secondary screen area. The display area is used for light emission and display. The functional area is used to integrate the functional components under the screen. Openings are formed on the display panel in the functional area to cooperate with the functional components under the screen. Typically, during the display panel manufacturing process, a blocking structure is installed around the opening to prevent water and oxygen from corroding the internal structures of the display panel.

[0004] However, the aforementioned blocking structure is prone to causing the problem of mura (display defects). Summary of the Invention

[0005] In view of the above problems, the present application provides a display panel, a method for manufacturing a display panel, and a display device, which can avoid the problem of Mura formation during the manufacturing process of the display panel and improve the display effect of the display panel and the display device using the display panel.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides a display panel having a functional area and a display area surrounding at least part of the functional area. The display panel includes an opening arranged in the functional area and a partition structure surrounding at least part of the opening.

[0008] Along the direction from the opening to the display area, the width of the partition structure close to the light emitting surface of the display panel is greater than the width of the partition structure away from the light emitting surface, and a channel is formed on at least one side wall of the partition structure.

[0009] A through hole is opened on the partition structure. Along the direction from the opening to the display area, the through hole passes through the partition structure and is communicated with the channel.

[0010] The embodiments of the present application provide a display panel that, through through-holes formed in a partition structure, provides an escape path for air that cannot be released promptly during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process). This allows air to escape through the through-holes, preventing the formation of air bubbles in the channels near the partition structure, preventing the generation of mura problems, and improving the reliability and display quality of the display panel and the display device using the display panel. Furthermore, the side of the partition structure near the light-emitting surface can provide a continuous extended surface surrounding the opening, providing the necessary support for the formation of an encapsulation layer. This allows the encapsulation layer to be formed between the partition structure and the display panel within the display area and fill the through-holes, thereby preventing water and oxygen from corroding the internal structure of the display panel.

[0011] In a feasible embodiment, there are a plurality of partition structures, and the plurality of partition structures are arranged at intervals along the direction from the opening to the display area, and each of the partition structures is provided with the through hole.

[0012] The through holes on adjacent partition structures are staggered with each other.

[0013] In this way, a closed barrier consisting of multiple partition structures is formed around the opening, which improves the barrier effect of the partition structure on preventing water and oxygen corrosion.

[0014] In a feasible embodiment, the through holes on the partition structures of adjacent circles are staggered with each other.

[0015] In this way, staggered escape paths can be provided for air that cannot be released in time, facilitating the escape of air in different directions, and increasing the path length for external water and oxygen to enter the openings, thereby improving the barrier effect against water and oxygen.

[0016] In a feasible embodiment, the same partition structure is provided with a plurality of the through holes, and the plurality of through holes are arranged at intervals along the extension direction of the partition structure.

[0017] In this way, the multiple through holes can provide escape paths for escaping air, making it easier for the air to be discharged in a timely manner.

[0018] In a feasible embodiment, the distribution density of the through holes in the extension direction of the partition structure ranges from 1 / mm to 500 / mm.

[0019] This arrangement, on the one hand, prevents the formation of bubbles in the channels near the partition structure and the resulting mura, caused by a low density of through-holes that fails to provide sufficient escape paths for air. On the other hand, it prevents the formation of excessive through-holes that can lead to insufficient support on the side of the partition structure near the light-emitting surface, resulting in poor fabrication.

[0020] In a feasible embodiment, the partition structure includes a partition support layer and a partition layer that are stacked, and the partition layer is located on a side of the partition support layer close to the light emitting surface.

[0021] Along the direction from the opening to the display area, the width of the partition layer is greater than the width of the partition support layer, and the surface of the partition layer away from the light emitting surface and the side surface of the partition support layer form the channel.

[0022] The through hole is located in the partition support layer.

[0023] In this way, different materials can be selected to form the partition support layer and the partition layer, which facilitates processing the partition support layer to form channels. The through holes are set in the partition support layer so that the partition layer forms a continuous extension surface, which facilitates forming effective support for the packaging layer.

[0024] In one possible embodiment, the insulating layer includes a first section and a second section connected to each other.

[0025] Along a direction from the opening to the display area, a width of the first segment is greater than a width of the second segment.

[0026] The orthographic projection of the second segment on the partition support layer at least partially overlaps with the through hole.

[0027] Thus, on the one hand, based on considerations of the manufacturing method, the width of the first section is greater than that of the second section, which is more conducive to forming a through hole in the partition support layer at the second section. On the other hand, the width of the second section is smaller than that of the first section, and the through hole is formed in the second section, providing a larger escape space for air, facilitating the timely discharge of air.

[0028] In a feasible implementation, the display panel further includes a pixel layer and a driving array layer, and the pixel layer is located on a side of the driving array layer close to the light emitting surface.

[0029] The pixel layer includes an anode layer, a light-emitting layer and a cathode layer stacked in sequence; the light-emitting layer includes a common layer, and at least part of the common layer and the cathode layer extend to the opening and are separated by the partition structure.

[0030] Preferably, the driving array layer includes thin film transistors, and the partition structure and the source / drain electrodes of the thin film transistors are arranged in the same layer.

[0031] In this way, the partition structure uses the channel formed on the side to partition the common layer and the cathode layer, thereby preventing the two layers from being corroded by water and oxygen, which may cause display failure of the display panel.

[0032] In a feasible embodiment, the display panel further includes an encapsulation layer, the encapsulation layer is located on a side of the pixel layer close to the light emitting surface, and the encapsulation layer fills the through hole.

[0033] In this way, the encapsulation layer blocks water and oxygen on the side of the partition structure close to the opening, which can effectively prevent water and oxygen from corroding the internal structure of the display panel.

[0034] A second aspect of an embodiment of the present application provides a method for preparing a display panel, wherein the display panel has a functional area and a display area surrounding at least a portion of the functional area, wherein the functional area has an opening area.

[0035] The method for preparing the display panel includes:

[0036] A partition structure is formed; wherein, the partition structure surrounds at least a portion of the opening area, and along the direction from the opening area to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure on the side away from the light-emitting surface, and a groove is formed on the side wall of the partition structure.

[0037] A through hole is opened on the partition structure, and along the direction from the opening area to the display area, the through hole passes through the partition structure and is connected with the channel.

[0038] The method for preparing a display panel provided in an embodiment of the present application comprises an opening area located in a functional area, the opening area being used to form an opening, and a partition structure surrounding at least part of the opening; along the direction from the opening area to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure on the side away from the light-emitting surface, and a channel is formed on at least one side wall of the partition structure; a through hole is provided on the partition structure, and along the direction from the opening area to the display area, the through hole passes through the partition structure and is connected to the channel. In this way, the through hole provided on the partition structure provides an escape path for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process), so that the air can escape through the through hole, avoiding the formation of bubbles in the channel close to the partition structure, preventing the generation of Mura problems, and improving the reliability and display effect of the display panel and the display device using the display panel. Moreover, the side of the partition structure close to the light-emitting surface can provide a continuous extension surface surrounding the opening, which is necessary support for forming the encapsulation layer, so that the encapsulation layer can be formed between the partition structure and the display panel in the display area and fill the through hole, thereby preventing water and oxygen from corroding the internal structure of the display panel.

[0039] In one feasible embodiment, the step of opening a through hole in the partition structure specifically includes:

[0040] A partition structure is provided, comprising a stacked partition support layer and a partition layer; the partition layer is located on a side of the partition support layer close to the light-emitting surface; along the direction from the opening area to the display area, the width of the partition layer is greater than the width of the partition support layer, and the surface of the partition layer away from the light-emitting surface and the side surface of the partition support layer form the channel.

[0041] A through hole is opened on the partition support layer; and the through hole penetrates the partition support layer along a direction from the opening area to the display area.

[0042] In this way, different materials can be selected to form the partition support layer and the partition layer, and the partition support layer can be processed to form the channels and through holes.

[0043] A third aspect of the embodiments of the present application provides a display device including the above-mentioned display panel.

[0044] The display device provided by the embodiment of the present application includes the above-mentioned display panel. The display panel includes an opening arranged in a functional area, and a partition structure surrounding at least part of the opening; along the direction from the opening to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure on the side away from the light-emitting surface, and a channel is formed on at least one side wall of the partition structure; a through hole is provided on the partition structure, and along the direction from the opening to the display area, the through hole passes through the partition structure and is connected to the channel. In this way, by providing a through hole on the partition structure, an escape path is provided for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process), so that air can escape through the through hole, avoiding the formation of bubbles in the channel near the partition structure, preventing the occurrence of Mura problems, and improving the reliability and display effect of the display panel and the display device using the display panel. Moreover, the side of the partition structure close to the light-emitting surface can provide a continuous extension surface surrounding the opening, which is necessary support for forming the encapsulation layer, so that the encapsulation layer can be formed between the partition structure and the display panel in the display area and fill the through hole, thereby preventing water and oxygen from corroding the internal structure of the display panel.

[0045] The construction of the present application as well as other objects and advantageous effects will become more apparent through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0047] Figure 1 A schematic diagram of the structure of a display panel in related art;

[0048] Figure 2 Schematic diagram of the structure of a blocking structure (without opening) on a display panel in the related art;

[0049] Figure 3 for Figure 2 AA view;

[0050] Figure 4 A schematic diagram of a process for coating a photoresist material on a blocking structure in the related art;

[0051] Figure 5 for Figure 2 Schematic diagram of the structure of the display panel after the hole is opened;

[0052] Figure 6 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0053] Figure 7 Another structural schematic diagram of a display panel provided in an embodiment of the present application;

[0054] Figure 8 A schematic structural diagram of a partition structure (without holes) on a display panel provided in an embodiment of the present application;

[0055] Figure 9 for Figure 8 BB view;

[0056] Figure 10 for Figure 8 A partial enlarged view of point C;

[0057] Figure 11 for Figure 8 Schematic diagram of the structure of the display panel after the hole is opened;

[0058] Figure 12 Another structural schematic diagram of a partition structure (without holes) on a display panel provided in an embodiment of the present application;

[0059] Figure 13 for Figure 12 Schematic diagram of the structure after the display panel is opened;

[0060] Figure 14 A schematic diagram of a process flow for manufacturing a display panel according to an embodiment of the present application;

[0061] Figure 15 A schematic diagram of a process flow for preparing a partition structure of a display panel provided in an embodiment of the present application;

[0062] Figure 16A schematic diagram of the steps of a process for preparing a partition structure of a display panel provided in an embodiment of the present application;

[0063] Figure 17 A cross-sectional view of a display panel provided in an embodiment of the present application.

[0064] Description of reference numerals:

[0065] 10-blocking structure;

[0066] 11-blocking layer; 12-channel; 13-photoresist layer; 14-bubble; 15-protrusion; 16-depression;

[0067] 100-display panel;

[0068] 101-display area; 102-functional area; 1020-opening area; 1021-opening; 103-non-display area;

[0069] 110-partition structure;

[0070] 111 - partition support layer; 1111 - through hole; 112 - partition layer; 1121 - first section; 1122 - second section; 114 - intermediate photoresist layer; 115 - mask; 116 - exposure area; 117 - exposure light;

[0071] 120- driver array layer;

[0072] 121 - channel layer; 122 - gate electrode; 123 - source electrode; 124 - drain electrode;

[0073] 130-pixel layer;

[0074] 131 - anode layer; 132 - light-emitting layer; 1321 - common layer; 133 - cathode layer;

[0075] 140-pixel limiting layer;

[0076] 150-support layer;

[0077] 160-substrate;

[0078] 170-encapsulation layer;

[0079] 171 - first inorganic layer; 172 - second inorganic layer; 173 - organic layer. DETAILED DESCRIPTION

[0080] In the related art, refer to Figure 1-Figure 3 Combined with Figure 5As shown, the display panel 100 may have a display area 101 and a functional area 102 adjacent to each other. The display panel 100 located in the display area 101 is used for emitting light and displaying. The functional area 102 has an opening area 1020, which is used to form an opening 1021. The opening 1021 is used to cooperate with under-screen functional devices such as the under-screen camera, under-screen fingerprint recognition, and under-screen distance sensor to realize specific auxiliary functions of the display panel 100.

[0081] The display panel 100 includes a substrate 160 , a driving array layer 120 , a pixel defining layer 140 , a supporting layer 150 , a pixel layer 130 , and an encapsulation layer 170 .

[0082] The drive array layer 120 is formed on the substrate 160. The drive array layer 120 includes thin film transistors, which are used to form a drive circuit for driving the pixel layer 130 to emit light. Specifically, it includes a channel layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124. The source electrode 123 and the drain electrode 124 can include two or three stacked metal layers.

[0083] The pixel defining layer 140 is formed on the side of the driving array layer 120 away from the substrate 160 and has an opening area and a non-opening area. The support layer 150 is located on the side of the non-opening area of the pixel defining layer 140 away from the substrate 160.

[0084] The pixel layer 130 includes an anode layer 131, a light-emitting layer 132, and a cathode layer 133 stacked in sequence, and the anode layer 131 is located on the side of the light-emitting layer 132 close to the substrate 160. The light-emitting layer 132 includes a common layer 1321, and the common layer 1321 can be a stack of multiple layer structures, including but not limited to an electron transport layer and a hole transport layer. Among them, the layers of the pixel layer 130 are formed in the opening area, and the anode layer 131 of the pixel layer 130 is connected to the source electrode 123 or the drain electrode 124 in the drive array layer 120. Since the common layer 1321 and the cathode layer 133 are a whole layer structure, the two layers extend on the side of the pixel defining layer 140 and the support layer 150 away from the substrate 160, and at least part of the common layer 1321 and the cathode layer 133 extend to the opening 1021.

[0085] The encapsulation layer 170 may be an inorganic thin film encapsulation layer, which covers the side of the pixel layer 130 away from the substrate 160 .

[0086] Because the display panel is provided with openings 1021 after the encapsulation layer is formed, the walls of openings 1021 may expose the common layer 1321 and cathode layer 133 of the light-emitting layer 130, thereby exposing them to water and oxygen corrosion, leading to display failure of the display panel 100. In the related art, a blocking structure 10 is formed around the openings 1021 to block the common layer 1321 and cathode layer 133, preventing water and oxygen from corroding the display panel 100 through the sidewalls of the openings 1021.

[0087] A plurality of blocking structures 10 are arranged around the opening 1021, and the plurality of blocking structures 10 are arranged at intervals. The blocking structure 10 includes a stacked partition support layer 111 and a blocking layer 11, and the blocking layer 11 is located on the side of the partition support layer 111 close to the light-emitting surface of the display panel 100. Along the direction from the opening 1021 to the display area, the width of the blocking layer 11 is greater than the width of the partition support layer 111, and channels 12 are formed on both sides of the partition support layer 111 and the side of the blocking layer 11 facing away from the light-emitting surface. During the formation of the common layer 1321 and the cathode layer 133, the provision of the channel 12 prevents the common layer 1321 and the cathode layer 133 from being deposited on the side of the blocking structure 10, thereby forming a blockage for the common layer 1321 and the cathode layer 133. In some embodiments, the channel 12 of the blocking structure 10 may be formed only on one side of the blocking structure 10, or on the side of the partition support layer 111 close to the substrate 160.

[0088] The blocking structure 10 may be formed on the same layer as some layers of the substrate 160 , or may be formed on the same layer as the source electrode 123 and the drain electrode 124 . In some embodiments, the blocking structure 10 may be formed on the same layer as the anode layer 131 .

[0089] During the manufacturing process of the display panel 100 , when other patterned layers (such as the pixel defining layer 140 and the supporting layer 150 ) are formed on the stacked layer having the blocking structure 10 , Mura display defects may be generated.

[0090] For example, Figure 4As shown, in the process of forming other patterned film layers, it is necessary to coat the stack layer with a photoresist material and perform reduced pressure drying. Among them, when the photoresist material is coated on the side of the stack layer close to the light-emitting surface, due to the presence of a channel 12 on the side of the blocking structure 10, part of the air will be trapped in the channel 12, resulting in the air that cannot be effectively released in time forming bubbles 14 in the photoresist layer 13. In the subsequent reduced pressure drying process, the vacuum reduced pressure environment causes the bubbles 14 to rupture, and the photoresist material at the bubbles 14 splashes during the rupture process. The photoresist material is in a depression 16 near the bubble, and a circular protrusion 15 is formed around the bubble 14. The formation of the protrusion 15 and the depression 16 makes the thickness of the patterned photoresist layer 13 uneven. In the subsequent patterning process, the patterning of the area with the protrusion 15 may not be able to be etched to the set depth, and the patterning of the area with the depression 16 may form over-etching, thereby affecting the function of the display panel 100 and causing poor display of the display panel 100.

[0091] In response to the above technical problems, the embodiments of the present application provide a display panel, a method for preparing a display panel, and a display device. The display panel includes a display area and a functional area, the display panel includes an opening arranged in the functional area, and a partition structure surrounding at least part of the opening; along the direction from the opening to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure away from the light-emitting surface, and a channel is formed on at least one side wall of the partition structure; a through hole is provided on the partition structure, and along the direction from the opening to the display area, the through hole passes through the partition structure and is connected to the channel. In this way, by providing a through hole on the partition structure, an escape path is provided for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process), so that air can escape through the through hole, avoiding the formation of bubbles in the channel close to the partition structure, preventing the generation of Mura problems, and improving the reliability and display effect of the display panel and the display device using the display panel. Moreover, the side of the partition structure close to the light-emitting surface can provide a continuous extension surface surrounding the opening, which is necessary support for forming the encapsulation layer, so that the encapsulation layer can be formed between the partition structure and the display panel in the display area and fill the through hole, thereby preventing water and oxygen from corroding the internal structure of the display panel.

[0092] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0093] Reference Figures 6-17 As shown, in a first aspect, an embodiment of the present application provides a display panel 100, comprising a display area 101, a functional area 102, and a non-display area 103. The display area 101 and the functional area 102 are adjacently arranged, and the non-display area 103 surrounds the periphery of the area formed by the display area 101 and the functional area 102. The display panel 100 includes an opening 1021 disposed in the functional area 102, and a partition structure 110 surrounding at least a portion of the opening 1021.

[0094] Along the direction from the opening 1021 to the display area 101 , the width of the partition structure 110 close to the light emitting surface of the display panel 100 is greater than the width of the partition structure 110 away from the light emitting surface, and a channel 12 is formed on at least one side wall of the partition structure 110 .

[0095] A through hole 1111 is defined in the partition structure 110 . The through hole 1111 passes through the partition structure 110 along a direction from the opening 1021 to the display area 101 and is connected to the channel 12 .

[0096] In the embodiment of the present application, the display panel 100 may be an organic light emitting diode display panel, and includes a substrate 160 , a drive array layer 120 , a pixel defining layer 140 , a support layer 150 , a pixel layer 130 , and an encapsulation layer 170 .

[0097] Reference Figure 6 and Figure 7 As shown, the display area 101 occupies most of the display panel 100 and is used for emitting light and displaying images. A functional area 102 is formed in a specific area on the display panel 100, which is used to cooperate with under-screen functional devices such as the under-screen camera, under-screen fingerprint recognition, and under-screen distance sensor to realize specific auxiliary functions of the display panel 100.

[0098] It is understandable that in order to ensure the photosensitivity of the photosensitive device, the functional area 102 needs to meet a certain light transmittance, so the display panel 100 located in the functional area 102 usually ensures the light transmittance requirement by opening holes.

[0099] According to the actual light transmittance or design requirements, the opening 1021 of the functional area 102 can be as follows: Figure 7 The hole shown is round, but it can also be Figure 6 The number of openings 1021 can be one or more; the position of the openings 1021 can be as shown. Figure 7 As shown, it is located in the middle of the display panel 100, and can also be as shown in FIG. Figure 6 The shown position is close to the edge of the display panel 100. In the embodiment of the present application, the shape, number and position of the openings in the functional area 102 are not limited.

[0100] The provision of the opening 1021 affects the encapsulation effect of the display panel. Since the common layer 1321 and the cathode layer 133 of the light-emitting layer 132 are a solid-surface structure, these two layers extend on the side of the pixel-defining layer 140 and the supporting layer 150 away from the substrate 160, and at least part of the common layer 1321 and the cathode layer 133 extend to the opening 1021. Because the encapsulation layer 170 cannot completely encapsulate the common layer 1321 and the cathode layer 133, the side surfaces of these layers at the opening 1021 may be exposed outside the protection of the encapsulation layer 170, thereby being corroded by water and oxygen, causing failure of the display panel.

[0101] In the related art, a blocking structure 10 is formed around the opening 1021 to block the common layer 1321 and the cathode layer 133. During the preparation of the display panel 100, when other patterned film layers are formed on the stack layer having the blocking structure 10, it is necessary to coat the stack layer with a photoresist material and perform reduced pressure drying. Due to the presence of a channel 12 on the side of the blocking structure 10, some air will be trapped in the channel 12, resulting in the formation of bubbles 14 in the photoresist layer 13 due to the air that cannot be effectively released in time. In the subsequent reduced pressure drying process, the vacuum reduced pressure environment causes the bubbles 14 to burst, resulting in a mura problem.

[0102] The display panel 100 provided in the embodiment of the present application provides an escape path for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process) through the through-holes 1111 opened on the partition structure 110. This allows air to escape through the through-holes 1111, preventing the formation of air bubbles near the partition structure 110 and the occurrence of mura problems, thereby improving the reliability and display effect of the display panel 100 and the display device using the display panel 100. In addition, the side of the partition structure 110 near the light-emitting surface can provide a continuous extension surface surrounding the opening 1021, providing the necessary support for forming the encapsulation layer, allowing the encapsulation layer to be formed between the partition structure 110 and the display panel 100 in the display area 101 and filling the through-holes, thereby preventing water and oxygen from corroding the internal structure of the display panel 100.

[0103] It is understood that during the preparation process of forming other film layers on the stacked layer having the partition structure 110, the coating process of the photoresist material layer 13 can be performed, and the coating of the functional film layer structure can also be performed. The partition structure of the embodiment of the present application can avoid the problem of mura formation during the coating process of any layer, and combined with the encapsulation layer, it can prevent water and oxygen from corroding the internal structure of the display panel 100, thereby improving the reliability and display effect of the display panel and the display device using the display panel.

[0104] In one possible implementation, referring to Figures 8-13 As shown, there are multiple partition structures 110 , which are arranged at intervals along the direction from the opening 1021 to the display area 101 , and each partition structure is provided with a through hole 1111 .

[0105] Among them, Figure 12 and Figure 13 As shown, at least all or part of the outermost partition structure 110 is located outside the edge of the opening 1021.

[0106] In this way, through holes 1111 are provided on the plurality of partition structures 110, providing an escape path for air that cannot be released in time during the subsequent preparation of the structural film layer, so that the air can escape through the through holes 1111, thereby preventing the air from forming bubbles in the channel 12 near the partition structure 110, preventing the occurrence of Mura problems, and improving the reliability and display effect of the display panel 100 and the display device using the display panel 100. The longer path formed by the plurality of partition structures 110 can enhance the blocking effect against water and oxygen corrosion. The side of the plurality of partition structures 110 close to the light-emitting surface can provide a continuous extension surface surrounding the opening 1021, which can provide the necessary support for forming the encapsulation layer 170, so that the encapsulation layer 170 can be formed between the partition structure 110 and the display panel 100 in the display area 101 and fill the through holes, so as to play a role in blocking water and oxygen from corroding the internal structure of the display panel 100.

[0107] In one possible embodiment, referring to Figure 8 and Figure 11 As shown, the through holes 1111 on adjacent partition structures 110 are staggered with each other.

[0108] In this way, the staggered through holes 1111 can provide staggered escape paths for air that cannot be released in time during the subsequent structural film layer preparation process, facilitating the escape of air in different directions, avoiding the formation of bubbles 14 in the channel 12 near the partition structure 110, preventing the occurrence of Mura problems, and increasing the path length for external water and oxygen to enter the display area, thereby improving the barrier effect against water and oxygen, and improving the reliability and display effect of the display panel 100 and the display device using the display panel 100.

[0109] In one possible implementation, Figure 12 and Figure 13 As shown, the through holes 1111 on adjacent partition structures 110 are arranged opposite to each other.

[0110] In this way, the relatively arranged through holes 1111 can provide an escape path for air that cannot be released in time during the subsequent structural film layer preparation process, facilitate air escape, avoid the formation of bubbles in the channel 12 near the partition structure 110, prevent the occurrence of Mura problems, and improve the reliability and display effect of the display panel 100 and the display device using the display panel 100.

[0111] In some embodiments, only one partition structure 110 may be provided, and all or part of the partition structure 110 is located outside the edge of the opening 1021 .

[0112] In one possible implementation, referring to Figures 8-13 As shown, a plurality of through holes 1111 are provided on the same partition structure 110 , and the plurality of through holes 1111 are arranged at intervals along the extension direction of the partition structure 110 .

[0113] In this way, multiple through holes 1111 can provide escape paths for escaping air, facilitate timely discharge of air, avoid the formation of air bubbles near the partition structure, prevent the occurrence of Mura problems, and improve the reliability and display effect of the display panel 100 and the display device using the display panel 100.

[0114] In a feasible embodiment, the distribution density of the through holes 1111 in the extension direction of the partition structure 110 ranges from 1 hole / mm to 500 holes / mm. For example, the distribution density of the through holes 1111 in the extension direction of the partition structure 110 can range from 1 hole / mm, 100 holes / mm, 300 holes / mm, or 500 holes / mm.

[0115] This arrangement, on the one hand, prevents the inability to provide sufficient escape paths for air due to the distribution density of through holes 1111 being too low, resulting in the formation of bubbles and mura during the subsequent fabrication of the structural film layer. On the other hand, it prevents the formation of too many through holes 1111 due to the distribution density of through holes 1111 being too high, resulting in insufficient support on the side of the partition structure 110 near the light-emitting surface and poor fabrication.

[0116] In the embodiment of the present application, the distribution density of the through holes 1111 on the partition structure 110 can be reasonably selected according to the extension length of the partition structure 110, so as to provide as many escape paths as possible for escaping air, facilitate timely discharge of air, avoid the formation of air bubbles in the channel 12 near the partition structure 110, prevent the occurrence of Mura problems, and improve the reliability and display effect of the display panel 100 and the display device using the display panel 100.

[0117] In one possible implementation, referring to Figure 9 As shown, the partition structure 110 includes a partition support layer 111 and a partition layer 112 that are stacked. The partition layer 112 is located on a side of the partition support layer 111 close to the light emitting surface.

[0118] Along the direction from the opening 1021 to the display area 101 , the width of the partition layer 112 is greater than that of the partition support layer 111 . The surface of the partition layer 112 away from the light emitting surface and the side surface of the partition support layer 111 form a channel 12 .

[0119] The through hole 1111 is located in the partition support layer 111 .

[0120] In this way, different materials can be selected to form the partition support layer 111 and the partition layer 112, so as to facilitate the processing of the partition support layer 111 to form a channel. Exemplarily, the material of the partition support layer 111 includes one or more of silver, aluminum, and copper. The material of the partition layer 112 includes one or more of titanium, molybdenum, and nickel. In this way, according to the etching resistance of different materials, the channel 12 can be formed by removing part of the partition support layer 111 in a wet etching process, and the channel 12 is formed on the side of the partition layer 112 away from the light-emitting surface, which can effectively isolate the common layer 1321 and the cathode layer 133.

[0121] The through hole 1111 is set in the partition support layer 111 so that the partition layer 112 forms a continuous extension surface, ensuring effective isolation of the common layer 1321 and the cathode layer 133, and at the same time facilitating the formation of effective support for the encapsulation layer 170, so that the encapsulation layer 170 can be formed between the partition structure 110 and the display panel 100 in the display area 101 and fill the through hole, so as to prevent water and oxygen from corroding the internal structure of the display panel 100.

[0122] In one possible embodiment, referring to Figure 9As shown, the thickness h of the partition support layer ranges from 0.1 μm to 2 μm. Exemplarily, the thickness h of the partition support layer can be 0.1 μm, 0.5 μm, 1 μm or 2 μm. This arrangement, on the one hand, can avoid the situation where the thickness of the through hole 1111 formed is too small due to the thickness of the partition support layer 111 being too small, which is not conducive to air escape. On the other hand, it can avoid the situation where the thickness of the through hole 1111 formed is too large due to the thickness of the partition support layer 111 being too large, which causes the thickness of the display panel 100 to increase.

[0123] In one possible implementation, referring to Figures 8-13 As shown, the barrier layer 112 includes a first segment 1121 and a second segment 1122 connected to each other.

[0124] Along the direction from the opening 1021 to the display area 101 , the width of the first segment 1121 is greater than the width of the second segment 1122 .

[0125] The orthographic projection of the second segment 1122 on the partition support layer 111 at least partially overlaps with the through hole 1111 .

[0126] Thus, on the one hand, based on considerations of the manufacturing method, the width of the first section 1121 is greater than that of the second section 1122, which is more conducive to forming the through hole 1111 in the partition support layer 111 at the second section 1122 (see the manufacturing method below for details). On the other hand, the width of the second section 1122 is smaller than that of the first section 1121, and the through hole formed in the second section 1122 provides a larger escape space for air, facilitating the timely discharge of air.

[0127] In one possible embodiment, referring to Figure 10 As shown, the width c of the first segment 1121 ranges from 0.5 μm to 10 μm. For example, the width c of the first segment 1121 may be 0.5 μm, 1 μm, 5 μm, or 10 μm.

[0128] In one possible embodiment, referring to Figure 10 As shown, the width a of the second segment 1122 ranges from 0.1 μm to 2 μm. For example, the width a of the second segment 1122 may be 0.1 μm, 1 μm, 1.5 μm, or 2 μm.

[0129] This arrangement, on the one hand, can prevent the first segment 1121 and the second segment 1122 from being too narrow, thereby preventing the common layer 1321 and the cathode layer 133 from being effectively separated and providing effective support for the encapsulation layer 170. On the other hand, it can prevent the first segment 1121 and the second segment 1122 from being too wide, thereby preventing the air from having an excessively long escape path and increasing the area of the functional area 102 of the display panel 100, thereby causing the aperture frame to be too large and affecting the screen-to-body ratio of the display panel.

[0130] In one possible embodiment, referring to Figure 10 As shown, the extension length b of the second segment 1122 ranges from 0.1 μm to 2 μm. For example, the extension length b of the second segment 1122 may be 0.1 μm, 1 μm, 1.5 μm, or 2 μm.

[0131] In this way, on the one hand, it can be avoided that the extension length of the second section 1122 is too small to provide sufficient escape space for air. On the other hand, it can be avoided that the extension length of the second section 1122 is too large to form a too large through hole 1111, causing the extension length of the first section 1121 to be too small, thereby avoiding possible poor preparation.

[0132] In one possible embodiment, referring to Figures 8-13 As shown, there are multiple first sections 1121 and multiple second sections 1122, which are alternately connected end to end along the extension direction of the partition structure 110. The second section 1122 is connected to the middle of the first section 1121 in the width direction.

[0133] In this way, air escape space is formed on both sides of the second section 1122, providing more escape paths for escaping air, facilitating timely discharge of air, avoiding the formation of bubbles in the channel 12 of the partition structure 110, preventing the occurrence of Mura problems, and improving the reliability and display effect of the display panel 100 and the display device using the display panel 100.

[0134] In one possible implementation, referring to Figure 17 As shown, the display panel 100 further includes a pixel layer 130 and a driving array layer 120 . The pixel layer 130 is located on a side of the driving array layer 120 close to the light emitting surface.

[0135] The pixel layer 130 includes an anode layer 131, a light emitting layer 132, and a cathode layer 133 stacked in sequence. The light emitting layer 132 includes a common layer 1321. At least a portion of the common layer 1321 and the cathode layer 133 extend to the opening 1021 and are separated by the partition structure 110.

[0136] In this way, the partition structure 110 uses the trench 12 formed on the side to partition the common layer 1321 and the cathode layer 133, thereby preventing the two layers from being corroded by water and oxygen, which may cause display failure of the display panel.

[0137] In one possible embodiment, referring to Figure 17 As shown, the driving array layer 120 includes thin film transistors, and the partition structure 110 and the source electrode 123 and the drain electrode 124 of the thin film transistor are arranged in the same layer.

[0138] In this way, the partition structure 110 can be formed in the same layer using the materials of the source electrode 123 and the drain electrode 124 while the source electrode 123 and the drain electrode 124 are formed, thereby simplifying the manufacturing process.

[0139] It can be understood that when the partition structure 110 is arranged in the same layer as the source electrode 123 and the drain electrode 124, the partition support layer and the partition layer can be a two-layer metal layer structure of the source electrode 123 and the drain electrode 124. In some embodiments, it can also be a three-layer metal layer structure of the source electrode 123 and the drain electrode 124, that is, a metal layer is also provided on the side of the partition support layer 111 close to the substrate 160.

[0140] In one possible implementation, referring to Figure 17 As shown, the display panel 100 further includes an encapsulation layer 170 . The encapsulation layer 170 is located on a side of the pixel layer 130 close to the light emitting surface. The encapsulation layer 170 fills the through hole 1111 .

[0141] Among them, the material of the encapsulation layer 170 can be an inorganic material or an organic material, or a combination of an inorganic material and an organic material. Exemplarily, the encapsulation layer 170 may include a first inorganic layer 171, an organic layer 173, and a second inorganic layer 172 that are stacked. The first inorganic layer 171 is located on the side of the organic layer 173 away from the light-emitting surface. The first inorganic layer 171 may include one or more layers of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, or aluminum nitride with high water resistance. The first inorganic layer 171 can be realized by chemical vapor deposition or atomic layer deposition, has good graphic coverage, can fill the trench and through-hole 1111, can form a barrier to water and oxygen on the side of the partition structure 110 close to the opening 1021, and can effectively prevent water and oxygen from corroding the internal structure of the display panel 100.

[0142] Reference Figure 14-17 Combined with Figure 6-Figure 13 As shown, in a second aspect, an embodiment of the present application provides a method for preparing a display panel 100 , wherein the display panel 100 has a functional area 102 and a display area 101 surrounding at least a portion of the functional area 102 , and the functional area has an opening area 1020 .

[0143] Reference Figure 14 As shown, the method for preparing the display panel 100 includes:

[0144] S1: forming a partition structure.

[0145] In which, the partition structure 110 surrounds at least part of the opening area 1020, and along the direction from the opening area 1020 to the display area 101, the width of the partition structure 110 on the side close to the light-emitting surface of the display panel 100 is greater than the width of the partition structure 110 on the side away from the light-emitting surface, and a channel 12 is formed on the side wall of the partition structure 110.

[0146] S2: Open a through hole in the partition structure.

[0147] In the direction from the opening area 1020 to the display area 101 , the through hole 1111 passes through the partition structure 110 and is connected to the channel 12 .

[0148] Reference Figure 15 As shown, S2, i.e., the step of opening a through hole in the partition structure, specifically includes:

[0149] S21: providing a partition structure including a partition support layer and a partition layer that are stacked.

[0150] Among them, the partition layer 112 is located on the side of the partition support layer 111 close to the light-emitting surface; along the direction from the opening area 1020 to the display area 101, the width of the partition layer 112 is greater than the width of the partition support layer 111, and the surface of the partition layer 112 away from the light-emitting surface and the side surface of the partition support layer 111 form a channel 12.

[0151] Specifically, such as Figure 16 As shown, a first barrier layer and a second barrier layer are sequentially stacked on a substrate 160 .

[0152] An intermediate photoresist layer 114 is coated on the second barrier layer. The intermediate photoresist layer 114 may be made of a light-sensitive organic material.

[0153] A mask 115 is placed on the side of the intermediate photoresist layer 114 facing away from the substrate 160 and exposed to light. Exposure light 117 forms an exposed area 116 in the portion of the intermediate photoresist layer 114 not covered by the mask 115. The shape of the mask 115 is identical to that of the barrier layer 112 of the barrier structure 110. Specifically, the mask 115 includes a wide area corresponding to the first segment 1121 and a narrow area corresponding to the second segment 1122. The wide and narrow areas are interconnected.

[0154] The exposed area 116 of the intermediate photoresist layer 114 is dissolved and removed by a chemical developer to form a pattern.

[0155] The materials of the first and second barrier layers covered by the orthographic projection of the pattern are removed by dry etching, and the partially stacked first and second barrier layers in the preset area of the substrate 160 are retained. The first barrier layer forms the isolation support layer 111, and the second barrier layer forms the isolation layer 112.

[0156] S22: forming a through hole on the partition support layer.

[0157] In the direction from the opening area 1020 to the display area 101 , the through hole 1111 penetrates the partition support layer 111 .

[0158] Specifically, continue as Figure 16 As shown, the remaining photoresist layer 114 and part of the partition support layer 111 are removed by wet etching with an etching solution. Since the etching resistance of the partition support layer and the partition layer is different, and the line widths of the narrow line area and the wide line area are different, the etching time of the etching solution is controlled so that only a portion of the outer periphery of the partition support layer 111 in the wide line area is etched to form the trench 12, and the partition support layer 111 in the narrow line area is completely etched to form the through hole 1111.

[0159] The method for manufacturing the display panel also includes forming a drive array layer 120 on a substrate 160. The drive array layer 120 includes thin-film transistors. The partition structure 110 can be formed on the same layer as the source electrode 123 or the drain electrode 124 of the thin-film transistor. A pixel defining layer 140 is formed on the side of the drive array layer 120 facing away from the substrate 160. A support layer 150 is formed on the side of the pixel defining layer 140 facing away from the substrate 160. A pixel layer 130 is formed within the opening region of the pixel defining layer 140. The pixel layer 130 includes an anode layer 131, a light-emitting layer 132, and a cathode layer 133. The anode layer 131 is located on the side of the light-emitting layer 132 closer to the substrate 160. The light-emitting layer 132 includes a common layer 1321. The partition structure 110 is used to separate the common layer 1321 from the cathode layer 133, thereby isolating the path of water and oxygen intrusion from the aperture region 1020 to the display region 101, thereby ensuring the display reliability of the display panel 100. An encapsulation layer 170 is formed on a side of the pixel layer 130 facing away from the substrate 160 , and an opening 1021 is formed in the opening region 1020 of the display panel where the encapsulation layer 170 is formed.

[0160] The method for preparing a display panel provided in an embodiment of the present application comprises a display panel 100 prepared including an opening area 1020 located in a functional area 102, the opening area 1020 being used to form an opening 1021, and a partition structure 110 surrounding at least a portion of the opening 1021; along the direction from the opening area to the display area 101, the width of the partition structure 110 on the side close to the light-emitting surface of the display panel 100 is greater than the width of the partition structure 110 on the side away from the light-emitting surface, and a channel 12 is formed on at least one side wall of the partition structure 110; a through hole 1111 is provided on the partition structure 110, and along the direction from the opening area to the display area 101, the through hole 1111 passes through the partition structure 110 and is connected to the channel 12. In this way, the through-holes 1111 formed on the partition structure 110 provide an escape path for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process). This allows air to escape through the through-holes 1111, preventing the formation of bubbles near the partition structure 110 and the occurrence of mura problems, thereby improving the reliability and display effect of the display panel 100 and the display device using the display panel 100. In addition, the side of the partition structure 110 close to the light-emitting surface can provide a continuous extension surface surrounding the opening 1021, providing the necessary support for the formation of the encapsulation layer. This allows the encapsulation layer to be formed between the partition structure 110 and the display panel 100 in the display area 101 and fill the through-holes, thereby preventing water and oxygen from corroding the internal structure of the display panel 100.

[0161] In a third aspect, an embodiment of the present application provides a display device, comprising the above-mentioned display panel 100 .

[0162] The display device may be a mobile or fixed terminal such as a mobile phone, a television, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a personal digital assistant (PDA), a virtual reality device, or the like.

[0163] Other technical features of the display device are the same as those of the above-mentioned display panel 100 and can achieve the same technical effects, which will not be described in detail here.

[0164] The display device provided in the embodiments of the present application is fabricated from the aforementioned display panel 100. The display panel 100 includes an opening 1021 disposed in the functional area 102, and a partition structure 110 surrounding at least a portion of the opening 1021. Along the direction from the opening 1021 to the display area 101, the width of the partition structure 110 on the side closest to the light-emitting surface of the display panel 100 is greater than the width of the partition structure 110 on the side away from the light-emitting surface. Furthermore, a channel 12 is formed on at least one sidewall of the partition structure 110. A through hole 1111 is formed in the partition structure 110, extending from the opening 1021 to the display area 101 and communicating with the channel 12. In this way, the through-holes 1111 formed on the partition structure 110 provide an escape path for air that cannot be released in time during the subsequent structural film layer preparation process (including but not limited to the photoresist material layer coating process). This allows air to escape through the through-holes 1111, preventing the formation of bubbles near the partition structure 110 and the occurrence of mura problems, thereby improving the reliability and display effect of the display panel 100 and the display device using the display panel 100. In addition, the side of the partition structure 110 close to the light-emitting surface can provide a continuous extension surface surrounding the opening 1021, providing the necessary support for the formation of the encapsulation layer. This allows the encapsulation layer to be formed between the partition structure 110 and the display panel 100 in the display area 101 and fill the through-holes, thereby preventing water and oxygen from corroding the internal structure of the display panel 100.

[0165] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0166] In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present application. In the description of the present application, "plurality" means two or more, unless otherwise specified.

[0167] The terms "first," "second," "third," "fourth," etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential sequence. It should be understood that the numbers used in this way are interchangeable where appropriate so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or apparatus.

[0168] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a functional area and a display area surrounding at least a portion of the functional area, wherein the display panel comprises an opening provided in the functional area and a partition structure surrounding at least a portion of the opening; Along the direction from the opening to the display area, the width of the partition structure on the side close to the light-emitting surface of the display panel is greater than the width of the partition structure on the side away from the light-emitting surface, and a groove is formed on at least one side wall of the partition structure; A through hole is opened on the partition structure. Along the direction from the opening to the display area, the through hole passes through the partition structure and is communicated with the channel.

2. The display panel according to claim 1, wherein: There are multiple partition structures, and along the direction from the opening to the display area, the multiple partition structures are arranged at intervals, and each of the partition structures is provided with the through hole; The through holes on adjacent partition structures are staggered with each other.

3. The display panel according to claim 2, wherein: The same partition structure is provided with a plurality of through holes, and the plurality of through holes are arranged at intervals along the extension direction of the partition structure.

4. The display panel according to claim 3, wherein: The distribution density of the through holes in the extension direction of the partition structure ranges from 1 hole / mm to 500 holes / mm.

5. The display panel according to any one of claims 1 to 3, wherein: The partition structure includes a partition support layer and a partition layer that are stacked, and the partition layer is located on a side of the partition support layer close to the light emitting surface; Along the direction from the opening to the display area, the width of the partition layer is greater than the width of the partition support layer, and the surface of the partition layer away from the light emitting surface and the side surface of the partition support layer form the channel; The through hole is located in the partition support layer.

6. The display panel according to claim 5, wherein: The isolation layer includes a first section and a second section connected to each other; Along the direction from the opening to the display area, the width of the first segment is greater than the width of the second segment; The orthographic projection of the second segment on the partition support layer at least partially overlaps with the through hole.

7. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further comprises a pixel layer and a drive array layer, wherein the pixel layer is located on a side of the drive array layer close to the light emitting surface; The pixel layer includes an anode layer, a light-emitting layer and a cathode layer stacked in sequence; the light-emitting layer includes a common layer, and at least part of the common layer and the cathode layer extend to the opening and are separated by the partition structure.

8. The display panel according to claim 7, wherein: The driving array layer includes thin film transistors, and the partition structure and the source / drain electrodes of the thin film transistors are arranged in the same layer.

9. The display panel according to claim 7, wherein: The display panel further includes an encapsulation layer, which is located on a side of the pixel layer close to the light-emitting surface and fills the through hole.

10. A method for preparing a display panel, characterized in that: The display panel comprises a functional area and a display area surrounding at least a portion of the functional area, wherein the functional area comprises an opening area; The method for preparing the display panel includes: forming a partition structure; wherein the partition structure surrounds at least a portion of the opening area, and along the direction from the opening area to the display area, the width of the partition structure on a side close to the light-emitting surface of the display panel is greater than the width of the partition structure on a side away from the light-emitting surface, and a channel is formed on a sidewall of the partition structure; A through hole is opened on the partition structure, and along the direction from the opening area to the display area, the through hole passes through the partition structure and is connected with the channel.

11. The method for manufacturing a display panel according to claim 10, wherein: The step of opening a through hole in the partition structure specifically includes: A partition structure is provided, comprising a stacked partition support layer and a partition layer; the partition layer is located on a side of the partition support layer close to the light-emitting surface; along a direction from the opening area to the display area, the width of the partition layer is greater than the width of the partition support layer; a surface of the partition layer away from the light-emitting surface and a side surface of the partition support layer form the channel; A through hole is opened on the partition support layer; and the through hole penetrates the partition support layer along a direction from the opening area to the display area.

12. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 9.

Images