Electrode patch and cell division inhibiting device

Abstract

The electrode patch and the cell division inhibition device are provided. The electrode patch comprises a circuit board, a heat exchange pipeline for circulating a heat exchange medium, and at least two electrode structures. The heat exchange pipeline comprises a first heat exchange pipeline and a second heat exchange pipeline. Each electrode structure is arranged in an array on one side of the circuit board and is parallel to the circuit board, and is used for outputting a target electric field to a target biological tissue. The electrode structure is electrically connected to the circuit board, and a containing space is further arranged between the electrode structure and the circuit board. The first heat exchange pipeline is located in the containing space between the circuit board and the electrode structure and is in thermal conduction connection with the electrode structure. The second heat exchange pipeline is used for connecting the first heat exchange pipeline and a heat exchange circulating assembly. The first heat exchange pipeline of the electrode patch can circulate the heat exchange medium. The first heat exchange pipeline is arranged between the electrode structure and the circuit board, and the cooling efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and more specifically, to an electrode patch and a cell division inhibition device. Background Art

[0002] Tumor Treating Fields (TTFields) is a well-established therapeutic approach that inhibits cell proliferation by disrupting mitosis. These low-intensity, medium-frequency, alternating electric fields are used to treat a variety of tumors and are a clinically effective cancer treatment.

[0003] During tumor electric field therapy, an electric field is applied to biological tissues, such as the human body, using electrode patches. Specifically, the electrode patches are placed on the patient's lesion area, coupling the electric field into the patient's body. However, during the application of the electric field, the electrode patches tend to heat up, causing the surface temperature of the biological tissue to increase, thus affecting the physiological environment of the biological tissue.

[0004] Therefore, the electrode patch needs to be heat-dissipated. However, the existing electrode patch has a poor cooling effect on the circuit board or electrode structure of the electrode patch and a low cooling efficiency. Summary of the Invention

[0005] In response to the shortcomings of existing methods, this application proposes an electrode patch and a cell division inhibition device to solve technical problems existing in the prior art, such as poor cooling effect and low cooling efficiency of the circuit board or electrode structure of the electrode patch.

[0006] In a first aspect, an embodiment of the present application provides an electrode patch, comprising: a circuit board, a heat exchange pipe for circulating a heat exchange medium, and at least two electrode structures; the heat exchange pipe comprises: a first heat exchange pipe and a second heat exchange pipe;

[0007] Each electrode structure array is arranged on one side of the circuit board and is parallel to the circuit board, and is used to output a target electric field to the target biological tissue; the electrode structure is connected to the circuit board, and an accommodation space is provided between the electrode structure and the circuit board;

[0008] The first heat exchange pipe is located in the accommodation space between the circuit board and the electrode structure and is thermally connected to the electrode structure;

[0009] The second heat exchange pipe is used to connect the first heat exchange pipe and the heat exchange cycle component.

[0010] Optionally, the first heat exchange pipe includes: at least one first cooling portion; the second heat exchange pipe includes: a first input portion and a first reflux portion;

[0011] The first end of the first input part is connected to the heat exchange cycle component, and the second ends of the first input parts are connected to the first cooling parts; the first ends of the first reflux parts are connected to the first cooling parts; the second ends of the first reflux parts are connected to the heat exchange cycle component;

[0012] Each first cooling portion is located between the electrode structure and the circuit board.

[0013] Optionally, the heat exchange pipe includes: a connecting portion; the circuit board includes: at least two cooling areas;

[0014] At least two electrode structures are arranged in an array in each cooling area;

[0015] Each first cooling part is provided on one side of each cooling area and is located between the electrode structure and the circuit board;

[0016] The connecting portion connects the first cooling portions in the cooling areas.

[0017] Optionally, the projection of the first cooling portion on the circuit board is a polygonal ring, a circular ring, or an elliptical ring.

[0018] Optionally, the electrode patch further comprises: a thermal element;

[0019] The thermal element is electrically connected to the circuit board and is used to detect the temperature of the surface of the target biological tissue.

[0020] Optionally, the electrode structure includes: a stacked electrode layer and a dielectric layer;

[0021] The electrode layer is connected to one side of the circuit board.

[0022] Optionally, the heat exchange medium includes ammonia, ethane or fluorine-chloride compounds.

[0023] In a second aspect, an embodiment of the present application provides a cell division inhibition device, comprising: at least one pair of any one of the electrode patches provided in the first aspect above, a heat exchange circulation component, and a host;

[0024] The heat exchange pipe in the electrode patch is connected to the heat exchange cycle component;

[0025] The heat exchange circulation component and the electrode patch are both electrically connected to the host.

[0026] Optionally, the heat exchange cycle assembly includes: a compressor, a condenser, a capillary tube and an evaporator;

[0027] The compressor, condenser, capillary tube and evaporator are connected in sequence;

[0028] The evaporator is connected to the heat exchange pipe to form a loop.

[0029] Optionally, the host further includes an electric field generating module.

[0030] The beneficial technical effects brought about by the technical solution provided by the embodiment of the present application include: the first heat exchange pipe is located on the side of the circuit board close to the electrode structure, and the second heat exchange pipe is connected to the heat exchange circulation component to take out the heat from the circuit board or the electrode structure, thereby being able to cool the circuit board or the electrode structure. The electrode structure is electrically connected to the circuit board, and there is a accommodating space between the electrode structure and the circuit board. By arranging the first heat exchange pipe in the accommodating space between the electrode structure and the circuit board, heat from the electrode structure is absorbed. The heat exchange pipe circulates a heat exchange medium, which turns into gas after absorbing heat. The gas circulates in the heat exchange pipe to the heat exchange circulation component. After being processed by the heat exchange circulation component, it circulates to the first heat exchange pipe to continue to exchange heat and cool the electrode structure. The heat exchange medium can be recycled to save resources.

[0031] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0033] Figure 1 A schematic diagram of the main structure of an electrode patch provided in an embodiment of the present application;

[0034] Figure 2 A schematic structural diagram of a heat exchange pipe of an electrode patch provided in an embodiment of the present application;

[0035] Figure 3 This is a schematic diagram of the main structure of a cell division inhibition device provided in an embodiment of the present application;

[0036] Figure 4 A schematic side view of the structure of an electrode patch provided in an embodiment of the present application.

[0037] In the picture:

[0038] 1-Electrode patch;

[0039] 10-electrode structure; 11-electrode layer; 12-dielectric layer; 13-through hole;

[0040] 20-circuit board; 201-cooling area;

[0041] 30-first heat exchange pipe; 31-first cooling part;

[0042] 40 - second heat exchange pipe; 41 - first input part; 411 - first end of the first input part 41; 412 - second end of the first input part 41; 42 - first reflux part; 421 - first end of the first reflux part 42; 422 - second end of the first reflux part 42;

[0043] 50-connecting portion;

[0044] 60-Applicator;

[0045] 70-transmission line;

[0046] 80-interface;

[0047] 90-thermal element;

[0048] 2-heat exchange cycle component; 21-compressor; 22-condenser; 23-capillary tube; 24-evaporator;

[0049] 3-Cell division inhibition device. DETAILED DESCRIPTION

[0050] The present application is described in detail below. Examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. In addition, if the detailed description of the known technology is not necessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0051] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0052] It will be understood by those skilled in the art that, unless expressly stated otherwise, the singular forms "a", "an", "said" and "the" used herein may also include the plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. In addition, "connected" or "coupled" as used herein may include wireless connections or wireless couplings. The term "and / or" used herein includes all or any units and all combinations of one or more associated listed items.

[0053] The inventors of this application have discovered that during electric field therapy for tumors, patients need to wear electrode patches for extended periods of time. The electrode structure of the electrode patch is located on a circuit board. When the electrode structure is energized, it generates heat, raising the temperature of the patient's skin in contact with or near the electrode structure, which can easily cause burns and other injuries. Furthermore, the high temperature of the entire circuit board makes it difficult to dissipate the heat generated by the electrode structure, resulting in continuous high-temperature effects on the patient.

[0054] At present, in order to ensure the safety of the tumor electric field therapy process, it is necessary to control the temperature rise phenomenon. In the existing technology, the heat of the circuit board is dissipated by adding a heat dissipation structure to the circuit board. However, since there is an applicator on the back of the circuit board, the applicator needs to stick the entire circuit board on the surface of the biological tissue. The heat dissipation structure is difficult to dissipate the heat of the circuit board, and the cooling effect of the entire electrode patch is poor.

[0055] The electrode patch and cell division inhibition device provided in this application are intended to solve the above technical problems of the prior art.

[0056] The following describes in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems with specific embodiments.

[0057] This embodiment of the application provides an electrode patch 1, please refer to Figure 1 and Figure 2 The electrode patch 1 includes: a circuit board 20, a heat exchange pipe for circulating a heat exchange medium, and at least two electrode structures 10. The heat exchange pipe includes: a first heat exchange pipe 30 and a second heat exchange pipe 40.

[0058] The electrode structures 10 are arranged in an array on one side of the circuit board 20 and are arranged parallel to the circuit board 20 to output a target electric field to the target biological tissue. The electrode structures 10 are electrically connected to the circuit board 20, and a space is provided between the electrode structures 10 and the circuit board 20.

[0059] The first heat exchange pipe 30 is located in the accommodation space between the circuit board 20 and the electrode structure 10 and is thermally connected to the electrode structure 10 .

[0060] The second heat exchange pipe 40 is used to connect the first heat exchange pipe 30 and the heat exchange cycle component 2.

[0061] In this embodiment, the first heat exchange pipe 30 is located on the side of the circuit board 20 close to the electrode structure 10, and the second heat exchange pipe 40 is connected to the heat exchange circulation component 2 to remove heat from the circuit board 20 or the electrode structure 10, thereby cooling the circuit board 20 or the electrode structure 10. The electrode structure 10 is electrically connected to the circuit board 20, and there is a storage space between the electrode structure 10 and the circuit board 20. By arranging the first heat exchange pipe 30 in the storage space between the electrode structure 10 and the circuit board 20, heat from the electrode structure 10 is absorbed. A heat exchange medium flows through the heat exchange pipe, and after absorbing heat, the heat exchange medium becomes gaseous. The gaseous heat exchange medium flows through the heat exchange pipe to the heat exchange circulation component 2. After being processed by the heat exchange circulation component 2, it circulates to the first heat exchange pipe 30 to continue to exchange heat and cool the electrode structure 10. The heat exchange medium can be recycled, saving resources.

[0062] Optionally, the circuit board 20 is a flexible circuit board.

[0063] Please refer to Figure 3 The heat exchange pipe in this embodiment can conduct the heat of the electrode structure 10 to the external environment, thereby achieving the effect of cooling the electrode structure 10, so that the electrode patch 1 itself has a strong heat dissipation ability, thereby reducing the impact of the high temperature generated by the electrode patch 1 on biological tissues.

[0064] Optionally, the target biological tissue may be biological tissue requiring tumor electric field therapy.

[0065] Optionally, the electrode structure 10 and the circuit board 20 are connected by soldering, which has a simple preparation process and high stability.

[0066] Optionally, the target electric field applied by the electrode structure 10 to the target biological tissue may include a pulsed electric field to interfere with the mitosis process of cancer cells.

[0067] For some possible implementations, please refer to Figure 1The first heat exchange pipe 30 includes at least one first cooling portion 31 . The second heat exchange pipe 40 includes a first input portion 41 and a first reflux portion 42 .

[0068] The first end 411 of the first input portion 41 is connected to the heat exchange cycle assembly 2, and the second ends of the first input portion 41 are connected to the first cooling portions 31. The first ends of the first reflux portions 42 are connected to the first cooling portions 31. The second ends 422 of the first reflux portions 42 are connected to the heat exchange cycle assembly 2.

[0069] Each first cooling portion 31 is located between the electrode structure 10 and the circuit board 20 .

[0070] In this embodiment, the heat exchange pipeline is divided into three parts: a first input section 41, a first return section 42, and a first cooling section 31. The first end 411 of the first input section 41 is connected to the heat exchange cycle assembly 2. The first input section 41 also has multiple second ends, with the second ends 412 of the first input section 41 acting as multiple branches. The second end 412 of each first input section 41 is connected to each first cooling section 31, and the number of first cooling sections 31 corresponds to the number of second ends 412 of the first input section 41. Similarly, the end of the first cooling section 31 away from the first input section 41 serves as the first end of the first cooling section 31. The first end of each first cooling section 31 is further connected to the first end 421 of the first return section 42, and the number of first ends 421 of the first return section 42 also corresponds to the number of first cooling sections 31. The first ends 421 of each first return section 42 converge at the second end 422 of the first return section 42, which is then connected to the heat exchange cycle assembly 2. The heat exchange circulation component 2 transports the heat exchange medium to the first heat exchange pipe 30, and then flows back to the heat exchange circulation component 2 through the first reflux part 42. After processing, the heat exchange circulation component 2 continues to transport the heat exchange medium to the first heat exchange pipe 30, realizing the circulation flow of the heat exchange medium in the first heat exchange pipe 30, and taking away the heat generated by the electrode structure 10.

[0071] Each first cooling portion 31 in this embodiment is located between the electrode structure 10 and the circuit board 20 , and can directly cool the electrode structure 10 , thereby improving the cooling efficiency of the electrode patch 1 itself.

[0072] Since the electrode structure 10 is the main heat source in the electrode patch 1 , in some possible implementations, the heat exchange pipe further includes a connecting portion 50 . The circuit board 20 includes at least two cooling areas 201 .

[0073] At least two electrode structures 10 are arranged in an array in each cooling region 201 .

[0074] Each first cooling portion 31 is disposed on one side of each cooling region 201 and is located between the electrode structure 10 and the circuit board 20 .

[0075] The connecting portion 50 connects the first cooling portions 31 within the cooling regions 201 .

[0076] In this embodiment, the circuit board 20 includes multiple cooling regions 201, each of which houses multiple electrode structures 10 arranged side by side. A first cooling portion 31 is located between the electrode structure 10 and the circuit board 20. Since there are multiple electrode structures 10, multiple first cooling portions 31 are also provided, with the number of first cooling portions 31 corresponding to the number of electrode structures 10. Within each cooling region 201, adjacent first cooling portions 31 are connected by a connector 50. The first cooling portions 31 directly cool the electrode structures 10, dissipating the heat generated by the electrode structures 10 and rapidly reducing the surface temperature of the target biological tissue, thereby ensuring the safety of the target biological tissue.

[0077] The first cooling part 31 in this embodiment is not a ring formed by winding a pipe, but a ring pipe obtained by integral design, without any staggered parts, and without the need for overlapping and winding to squeeze the lower pipe, thereby ensuring the smooth flow of the entire heat exchange pipe.

[0078] The inventors of this application consider that the electrode structure 10 has a certain size, and the layout of the first cooling portion 31 between the electrode structure 10 and the circuit board 20 is related to the cooling efficiency of the first heat exchange pipe 30 on the electrode structure 10. Therefore, please refer to Figure 1 In some possible implementations, the projection of the first cooling portion 31 on the circuit board 20 is a polygonal ring, a circular ring, or an elliptical ring.

[0079] In this embodiment, the contact area between the first cooling portion 31 and the electrode structure 10 is large. The first cooling portion 31 is arranged in a ring shape, and occupies the space between the electrode structure 10 and the circuit board 20 as much as possible on a plane parallel to the circuit board 20, and fits the surface of the electrode structure 10 to cool the electrode structure 10, so that the area that the first cooling portion 31 can cool is enlarged, thereby improving the cooling efficiency of the electrode structure 10.

[0080] Optionally, the projection of a portion of the first cooling portion 31 on the circuit board 20 is a polygonal ring, a circular ring, or an elliptical ring.

[0081] Optionally, the first cooling portion 31 corresponds to the shape of the electrode structure 10 , thereby increasing the cooling area of ​​the electrode structure 10 and improving the cooling efficiency of the electrode structure 10 .

[0082] Optionally, the electrode structure 10 is circular, and the first cooling portion 31 is a rectangular ring. The diagonal length of a portion of the first cooling portion 31 is consistent with the diameter of the electrode structure 10. This configuration allows the first cooling portion 31 to maximize the area between the electrode structure 10 and the circuit board 20, increasing the contact area with the electrode structure 10 and thereby improving cooling efficiency.

[0083] For some possible implementations, please refer to Figure 1 The electrode patch 1 further includes: a thermal element 90 .

[0084] The thermal element 90 is electrically connected to the circuit board 20 and is used to detect the temperature of the surface of the target biological tissue.

[0085] Optionally, when the thermosensitive element 90 detects that the temperature of the target biological tissue surface is higher than a set value, the heat exchange medium in the heat exchange pipe circulates, causing the first heat exchange pipe 30 to actively absorb heat from the electrode structure 10, and then the second heat exchange pipe 40 removes the heat absorbed by the first heat exchange pipe 30. Specifically, the thermosensitive element 90 is a thermistor.

[0086] Optionally, the thermistor 90 is electrically connected to the circuit board 20, and the electric field generating module provides an electrical signal to the thermistor 90 through the circuit board 20. The cell separation inhibition device 3 can output the temperature data collected by the thermistor 90, so that the user can know the temperature of the electrode patch 1 acting on the target biological tissue in real time and make a judgment, thereby ensuring the best treatment effect and avoiding the impact of excessive temperature on the target biological tissue.

[0087] Optionally, the electrode structure 10 has a through hole 13, and the thermosensitive element 90 is placed in the through hole to directly detect the temperature of the surface of the target biological tissue.

[0088] The inventors of this application consider that the electrode structure 10 needs to achieve the effect of applying a target electric field to the target biological tissue. Figure 4 In some possible implementations, the electrode structure 10 includes: a stacked electrode layer 11 and a dielectric layer 12 .

[0089] The electrode layer 11 is connected to one side of the circuit board 20 .

[0090] In this embodiment, dielectric layer 12 serves as the medium for applying electrical signals. It is inherently non-conductive and an insulator, allowing direct contact with the surface of target biological tissue, ensuring the safety of the target tissue during electric field therapy for tumors. However, due to its high dielectric constant, dielectric layer 12 is suitable for applying alternating electrical signals, creating a capacitive effect.

[0091] The electrode layer 11 transmits an electrical signal to the dielectric layer 12 , thereby forming a target electric field in the lesion area to interfere with the mitosis of cancer cells.

[0092] In some possible implementations, the dielectric layer 12 may be made of ceramic material, which can withstand a strong electric field without being broken down and has a high dielectric constant, low dielectric loss, and an appropriate dielectric constant temperature coefficient.

[0093] Optionally, the electrode patch 1 further includes: a conductive gel, which connects the dielectric layer 12 and the target biological tissue.

[0094] Alternatively, refer to Figure 3 The electrode patch 1 further includes a transmission line 70. The electrode layer 11 is disposed on the circuit board 20 and is electrically connected to the circuitry within the circuit board 20. The transmission line 70 connects the circuitry of the circuit board 20 to the electric field generating module, which provides an electrical signal to the electrode layer 11 of the electrode structure 10, enabling the electrode layer 11 to generate the desired target electric field.

[0095] Optionally, the electric field generating module includes an AC power supply. The AC current provided by the AC power supply can enable the electrode layer 11 in the electrode patch 1 to generate a required AC electric field.

[0096] Optionally, the electric field generating module includes a pulse power supply. The pulse current provided by the pulse power supply can enable the electrode layer 11 in the electrode patch 1 to generate a required pulse electric field.

[0097] Optionally, the electrode patch 1 further includes an interface 80 . The electric field generating module can be electrically connected to the electrode patch 1 through the interface 80 .

[0098] Optionally, the projection of the electrode layer 11 on the circuit board 20 is circular or elliptical. These shapes cover a wider area, occupy a more reasonable space when arranged in an array, and are convenient for applying a target electric field to the lesion area.

[0099] Optionally, the electrode layer 11 may be polygonal, and the peripheral surface of the electrode layer 11 may have smooth chamfers, which may effectively reduce the risk of tip discharge.

[0100] In some possible embodiments, the electrode patch 1 further includes an applicator 60. The applicator 60 is disposed on a side of the circuit board 20 away from the electrode structure 10. The applicator 60 is disposed on a side of the circuit board 20 that is not covered by the circuit board 20 and is used to be applied to the surface of the target biological tissue.

[0101] In this embodiment, the applicator 60 applies the circuit board 20 with the electrode structure 10 to the surface of the target biological tissue, thereby fixing the electrode patch 1 on the surface of the target biological tissue.

[0102] Optionally, the patch 60 is a medical non-woven adhesive tape. Medical non-woven fabrics are sticky on one side. In this embodiment, the circuit board 20 provided with the electrode structure 10 is adhered to the sticky side of the medical non-woven fabric, and then the medical non-woven fabric is applied to the surface of the target biological tissue. The electrode structure 10 can directly contact the surface of the biological tissue, and it is beneficial for the electrode structure 10 and the surface of the biological tissue to maintain a relatively stable state, which is beneficial for tumor electric field therapy of the target biological tissue. Furthermore, the medical non-woven fabric also has good air permeability, which is beneficial for dissipating moisture from the part where the target biological tissue and the medical non-woven fabric are directly bonded, keeping the surface of the target biological tissue dry. It is also beneficial for dissipating heat from the circuit board 20.

[0103] In some possible implementations, the heat exchange medium includes: ammonia, ethane, or fluorine-chloride compounds.

[0104] In this embodiment, the heat exchange medium may include at least one of ammonia, ethane, or fluorine and chlorine compounds. These substances can easily absorb heat and transform into gaseous state, and then cool down and turn into liquid state, thereby achieving efficient heat conduction.

[0105] In some possible implementations, the heat exchange medium may also include liquids such as ethanol and water.

[0106] Optionally, the heat exchange pipes provided herein may be heat conductive pipes, which may include, but are not limited to, aluminum pipes, steel pipes, iron pipes, or copper pipes. For example, when the heat exchange medium contains ammonia, the heat conductive pipes may be aluminum pipes, stainless steel pipes, or mild steel pipes. When the heat exchange medium is Freon, the heat conductive pipes may be aluminum pipes or iron pipes. When the heat exchange medium is ethane, the heat conductive pipes may be copper pipes or stainless steel pipes. Based on the chemical composition of the heat exchange medium, appropriate pipes are selected to maximize the heat exchange efficiency of the heat exchange medium.

[0107] Based on the same invention concept, please refer to Figure 3 The embodiment of the present application also provides a cell division inhibition device 3, comprising: at least one pair of any electrode patch 1 provided in the first aspect above, a heat exchange circulation component 2 and a host.

[0108] The heat exchange pipe in the electrode patch 1 is connected to the heat exchange circulation component 2.

[0109] The heat exchange circulation component 2 and the electrode patch 1 are both electrically connected to the host.

[0110] In this embodiment, since cell division inhibition device 3 utilizes any of the electrode patches 1 provided in the aforementioned embodiments, the principles and technical effects thereof are described in detail in the aforementioned embodiments and will not be further elaborated upon here. Heat exchange circulation assembly 2 is connected to the heat exchange pipe, allowing a heat exchange medium to circulate within the heat exchange pipe, removing heat from electrode structure 10 or circuit board 20.

[0111] Optionally, the host is electrically connected to the heat exchange circulation component 2 and the electrode patch 1, providing electrical control functions for the heat exchange circulation component 2 and the electrode patch 1, for example, the host controls the electrode patch 1 to apply an electric field to the target biological tissue, or controls the heat exchange circulation component 2 to exchange heat with the electrode patch 1.

[0112] Optionally, the host is electrically connected to the thermosensitive element 90. The host can receive the temperature of the target biological tissue surface detected by the thermosensitive element 90 and determine whether heat exchange is required. If so, the host controls the heat exchange circulation component 2 to dissipate heat from the electrode patch 1.

[0113] For some possible implementations, please refer to Figure 3 The heat exchange cycle component 2 includes: a compressor 21, a condenser 22, a capillary tube 23 and an evaporator 24.

[0114] The compressor 21, the condenser 22, the capillary tube 23 and the evaporator 24 are connected in sequence.

[0115] The evaporator 24 is connected to the heat exchange pipe to form a loop.

[0116] In this embodiment, the compressor can change the input voltage according to the size of the load, thereby changing the compression flow rate of the heat exchange medium and compressing it into a high-temperature, high-pressure gas refrigerant. The condenser 22 acts as a heat exchanger, which can exchange heat between the heat exchange medium compressed into a gas refrigerant and the external air, and condense it into a high-temperature, high-pressure liquid refrigerant. The capillary tube 23 can reduce the pressure of the gas refrigerant into a low-temperature, low-pressure liquid refrigerant. The evaporator 24 also acts as a heat exchanger, which exchanges heat between the liquid refrigerant and the surrounding air, causing the liquid refrigerant to evaporate into a low-temperature, low-pressure gas refrigerant while generating cold air. When the compressor is driven, the gaseous heat exchange medium will be compressed, condensed, expanded, and evaporated through the compressor, condenser 22, capillary tube 23, and evaporator 24. The evaporator 24 supplies the cold air to the electrode patch 1 through the heat exchange pipe, cooling the electrode structure 10 or the circuit board 20, thereby reducing the temperature of the electrode patch 1 on the surface of the target biological tissue, thereby preventing the electrode patch 1 from being damaged by excessive temperature.

[0117] Optionally, the host further includes an electric field generating module, which is electrically connected to the circuit board 20 in the electrode patch of the above embodiment and provides an electric signal to the electrode layer 11 to apply an electric field to the lesion area of ​​the target biological tissue.

[0118] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0119] 1. The first heat exchange pipe 30 is located on the side of the circuit board 20 close to the electrode structure 10, and the second heat exchange pipe 40 is connected to the heat exchange circulation component 2 to remove heat from the circuit board 20 or the electrode structure 10, thereby cooling the circuit board 20 or the electrode structure 10. The electrode structure 10 is electrically connected to the circuit board 20, and there is a storage space between the electrode structure 10 and the circuit board 20. By arranging the first heat exchange pipe 30 in the storage space between the electrode structure 10 and the circuit board 20, heat from the electrode structure 10 is absorbed. A heat exchange medium flows through the heat exchange pipe, and after absorbing heat, the heat exchange medium becomes gaseous. The gaseous heat exchange medium flows through the heat exchange pipe to the heat exchange circulation component 2. After being processed by the heat exchange circulation component 2, it circulates to the first heat exchange pipe 30 to continue to exchange heat and cool the electrode structure 10. The heat exchange medium can be recycled, saving resources.

[0120] 2. The circuit board 20 includes multiple cooling regions 201. Multiple electrode structures 10 are arranged side by side within each cooling region 201. A first cooling portion 31 is located between the electrode structure 10 and the circuit board 20. Since there are multiple electrode structures 10, multiple first cooling portions 31 are also provided, and the number of first cooling portions 31 corresponds to the number of electrode structures 10. Within each cooling region 201, adjacent first cooling portions 31 are connected by a connector 50. The first cooling portions 31 directly cool the electrode structures 10, dissipating the heat generated by the electrode structures 10, rapidly reducing the temperature of the target biological tissue surface and ensuring the safety of the target biological tissue.

[0121] 3. The contact area between the first cooling part 31 and the electrode structure 10 is large. The first cooling part 31 is arranged in a ring shape. On a plane parallel to the circuit board 20, it occupies the space between the electrode structure 10 and the circuit board 20 as much as possible, fits the surface of the electrode structure 10, and cools the electrode structure 10, so that the area that the first cooling part 1 can cool is enlarged, thereby improving the cooling efficiency of the electrode structure 10.

[0122] 4. The heat exchange medium may include at least one of ammonia, ethane, or fluorinated or chlorinated compounds. These substances easily absorb heat and transform into gaseous form, which then cools down to liquid form, achieving efficient heat conduction.

[0123] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0124] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0125] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0126] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0127] The above description is only part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. An electrode patch, characterized in that: include: A circuit board, a heat exchange pipe for circulating a heat exchange medium, and at least two electrode structures; the heat exchange pipe includes: a first heat exchange pipe and a second heat exchange pipe; Each of the electrode structures is arrayed on one side of the circuit board and is disposed parallel to the circuit board, and is used to output a target electric field to a target biological tissue; the electrode structure is electrically connected to the circuit board, and an accommodation space is provided between the electrode structure and the circuit board; The first heat exchange pipe is located in the accommodation space between the circuit board and the electrode structure and is thermally connected to the electrode structure; The second heat exchange pipe is used to connect the first heat exchange pipe and the heat exchange cycle component; The first heat exchange pipe includes: at least one first cooling part; the second heat exchange pipe includes: a first input part and a first reflux part; The first end of the first input part is connected to the heat exchange cycle component, and the second ends of the first input parts are connected to the first cooling parts; the first ends of the first reflux parts are connected to the first cooling parts; and the second ends of the first reflux parts are connected to the heat exchange cycle component. Each of the first cooling parts is located between the electrode structure and the circuit board; The projection of part of the first cooling portion on the circuit board is a polygonal ring, a circular ring or an elliptical ring; The electrode structure comprises: a stacked electrode layer and a dielectric layer; The electrode layer is connected to one side of the circuit board; The electrode layer is polygonal, and a peripheral surface of the electrode layer has smooth chamfers.

2. The electrode patch according to claim 1, characterized in that The heat exchange pipe further includes: a connecting portion; the circuit board includes: at least two cooling areas; At least two electrode structures are arranged in an array in each of the cooling areas; Each of the first cooling parts is provided on one side of each of the cooling regions and is located between the electrode structure and the circuit board; The connecting portion connects the first cooling portions in the cooling areas.

3. The electrode patch according to claim 1, characterized in that The electrode patch further comprises: a thermal element; The thermal element is electrically connected to the circuit board and is used to detect the temperature of the surface of the target biological tissue.

4. The electrode patch according to claim 1, characterized in that The heat exchange medium includes: ammonia, ethane or fluorine and chlorine compounds.

5. A cell division inhibition device, characterized in that: include: At least one pair of electrode patches, heat exchange circulation components and host according to any one of claims 1 to 4; The heat exchange pipe in the electrode patch is connected to the heat exchange circulation component; The heat exchange circulation component and the electrode patch are both electrically connected to the host.

6. The cell division inhibition device according to claim 5, characterized in that The heat exchange cycle assembly includes: a compressor, a condenser, a capillary tube and an evaporator; The compressor, the condenser, the capillary tube and the evaporator are connected in sequence; The evaporator is connected to the heat exchange pipe to form a loop.

7. The cell division inhibition device according to claim 5, characterized in that The host includes an electric field generating module.

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