Copper cladding method for PCB, copper cladding system for PCB, electronic device, and storage medium

Abstract

The application discloses a PCB copper coating method, a PCB copper coating system, an electronic device and a storage medium. The PCB includes a pattern area and a non-pattern area. The PCB copper coating method includes: obtaining a first residual copper rate of the pattern area; comparing the first residual copper rate with a preset range; and performing a copper coating operation on the non-pattern area according to a comparison result and a corresponding preset copper coating pattern, so that the first residual copper rate is equal to a second residual copper rate of the non-pattern area. The embodiment of the application can ensure that the residual copper rate of the non-pattern area is equal to the residual copper rate of the pattern area, thereby avoiding the influence on subsequent operations.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and in particular to a PCB copper plating method, a PCB copper plating system, an electronic device, and a storage medium. Background Technology

[0002] Currently, in order to adapt to the development trend of semiconductor products continuously improving performance, shrinking product area, and lower power consumption, PCBs are also gradually developing towards high density.

[0003] In related technologies, high-layer, high-density PCBs are prone to differences in residual copper content between patterned and non-patterned areas. This results in varying amounts of adhesive flow in different areas during lamination, ultimately leading to a large difference in PCB thickness after lamination (range > 0.2 mm). When patterning the outer layers, thinner areas cannot adhere tightly to the dry film, causing it to float. This can lead to dry film detachment and contamination of the developing tank during development, affecting subsequent electroplating and etching operations. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a PCB copper plating method, a PCB copper plating system, an electronic device, and a storage medium, which can ensure that the residual copper rate in non-graphic areas is equal to that in graphic areas, thereby avoiding the impact on subsequent operations.

[0005] According to a first aspect of the present invention, a PCB copper plating method is provided, wherein the PCB includes a patterned area and a non-patterned area, and the PCB copper plating method includes: obtaining a first residual copper ratio of the patterned area; comparing the first residual copper ratio with a preset range; and performing a copper plating operation on the non-patterned area according to the comparison result and a corresponding preset copper plating pattern, so that the first residual copper ratio is equal to a second residual copper ratio of the non-patterned area.

[0006] The PCB copper plating method according to the present invention has at least the following beneficial effects: by setting a preset range, PCBs with different first residual copper ratios are distinguished, and copper of different patterns is laid on the non-patterned areas of the corresponding PCBs according to the different first residual copper ratios, so that the second residual copper ratio of the non-patterned areas is equal to the first residual copper ratio of the patterned areas, thereby ensuring the uniformity of the overall PCB thickness and avoiding phenomena such as dry film peeling.

[0007] According to some embodiments of the present invention, the preset copper plating pattern includes at least a first copper plating pattern, a second copper plating pattern, and a third copper plating pattern; the step of performing copper plating operation on the non-pattern area based on the comparison result and the corresponding preset copper plating pattern includes: determining that the first residual copper rate is less than a preset range, and performing copper plating operation on the non-pattern area according to the first copper plating pattern; determining that the first residual copper rate is within the preset range, and performing copper plating operation on the non-pattern area according to the second copper plating pattern; determining that the first residual copper rate is greater than the preset range, and performing copper plating operation on the non-pattern area according to the third copper plating pattern.

[0008] According to some embodiments of the present invention, the first copper-clad pattern includes a plurality of first patterns, wherein the first pattern is circular; before comparing the first residual copper rate with a preset range, the PCB copper-clad method further includes: obtaining the initial length and initial width of the non-pattern area; the copper-clad operation on the non-pattern area according to the first copper-clad pattern includes: adjusting the first diameter of the first pattern and the first spacing between two adjacent first patterns according to the first residual copper rate, the initial length and the initial width; and performing the copper-clad operation on the non-pattern area according to the adjusted first copper-clad pattern.

[0009] According to some embodiments of the present invention, the second copper-clad pattern includes a plurality of second patterns, wherein the second pattern is rectangular; the copper-clad operation on the non-pattern area according to the second copper-clad pattern includes: adjusting the side length of the second pattern and the second spacing between two adjacent second patterns according to the first residual copper ratio, the initial length and the initial width; and performing the copper-clad operation on the non-pattern area according to the adjusted second copper-clad pattern.

[0010] According to some embodiments of the present invention, the third copper-clad pattern includes a plurality of stacked intermediate patterns; the intermediate patterns include a plurality of sequentially connected third patterns; the third pattern includes a first sub-rectangle, a second sub-rectangle, and a third sub-rectangle; wherein the first sub-rectangle and the third sub-rectangle are respectively perpendicularly disposed on both sides of the second sub-rectangle, and the extension direction of the first sub-rectangle is opposite to the extension direction of the third sub-rectangle; the copper-clad operation on the non-pattern area according to the third copper-clad pattern includes: adjusting the sub-length of the third sub-rectangle, the sub-width of the third sub-rectangle, and the third spacing between two adjacent third sub-rectangles according to the first residual copper ratio, the initial length, and the initial width; and performing the copper-clad operation on the non-pattern area according to the adjusted third copper-clad pattern.

[0011] According to some embodiments of the present invention, both the first diameter and the first spacing are greater than 3 mil.

[0012] According to some embodiments of the present invention, both the side length and the second spacing are greater than 3 mil.

[0013] According to some embodiments of the present invention, the sub-length, the sub-width, and the third spacing are all greater than 3 mil.

[0014] According to a second aspect of the present invention, a PCB copper plating system includes a patterned area and a non-patterned area. The PCB copper plating system includes: a data acquisition module for acquiring a first residual copper rate of the patterned area; and a copper plating module for comparing the first residual copper rate with a preset range, and performing copper plating operation on the non-patterned area according to the comparison result and a corresponding preset copper plating pattern, so that the first residual copper rate is equal to the second residual copper rate of the non-patterned area.

[0015] An electronic device according to a third aspect of the present invention includes: at least one processor; at least one memory for storing at least one program; and when the at least one program is executed by the at least one processor, the at least one processor implements the PCB copper-clad method as described in the first aspect.

[0016] A computer-readable storage medium according to a fourth aspect of the present invention stores processor-executable instructions, which, when executed by a processor, are used to implement the PCB copper-cladding method as described in the first aspect.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is a flowchart of a PCB copper-cladding method according to an embodiment of the present invention;

[0020] Figure 2 This is another flowchart of the PCB copper plating method according to an embodiment of the present invention;

[0021] Figure 3 This is another flowchart of the PCB copper plating method according to an embodiment of the present invention;

[0022] Figure 4A This is a schematic diagram of the structure of the first copper-clad pattern in an embodiment of the present invention;

[0023] Figure 4B This is a schematic diagram showing the arrangement of the first pattern in the first copper-clad pattern of an embodiment of the present invention;

[0024] Figure 5 This is another flowchart of the PCB copper plating method according to an embodiment of the present invention;

[0025] Figure 6A This is a schematic diagram of the structure of the second copper-clad pattern in an embodiment of the present invention;

[0026] Figure 6B This is a schematic diagram showing the arrangement of the second pattern in the second copper-clad pattern of an embodiment of the present invention;

[0027] Figure 7A This is a structural schematic diagram of the third figure in an embodiment of the present invention;

[0028] Figure 7B This is a schematic diagram of the structure of the intermediate graphic in an embodiment of the present invention;

[0029] Figure 7C This is a schematic diagram showing the arrangement of the middle pattern in the third copper-clad pattern of the present invention;

[0030] Figure 8 This is a schematic diagram of the structure of the third copper-clad pattern in an embodiment of the present invention;

[0031] Figure 9 This is another flowchart of the PCB copper plating method according to an embodiment of the present invention;

[0032] Figure 10 This is a block diagram of a PCB copper-clad system according to an embodiment of the present invention.

[0033] Figure label:

[0034] First copper-clad pattern 100, first pattern 101, second copper-clad pattern 200, second pattern 201, third pattern 300, first sub-rectangle 301, second sub-rectangle 302, third sub-rectangle 303, middle pattern 400, third copper-clad pattern 500, data acquisition module 610, copper-clad module 620. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0037] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0038] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0039] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] Reference Figure 1 This application provides a method for copper plating on a PCB. The method includes the following steps:

[0041] S110, Obtain the first residual copper rate of the graphic area;

[0042] S120. Compare the first residual copper rate with a preset range, and perform copper pouring operation on the non-pattern area according to the comparison result and the corresponding preset copper pouring pattern, so that the first residual copper rate is equal to the second residual copper rate of the non-pattern area.

[0043] Specifically, a PCB includes patterned areas and non-patterned areas. Patterned areas refer to the areas containing circuits, pads, etc., while non-patterned areas refer to the areas on the PCB surface other than the patterned areas. Therefore, patterned areas are mostly located within the PCB board, while non-patterned areas are mostly located at the board edges. A preset range and multiple preset copper plating patterns are set, with the area of ​​the preset copper plating patterns being equal to that of the non-patterned areas. Each preset copper plating pattern is formed by multiple sub-patterns, and the area ratio of the multiple sub-patterns in the preset copper plating pattern is equal to the first residual copper ratio. PCBs with different first residual copper ratios are distinguished according to this preset range. One preset copper plating pattern corresponds to a distinguishing interval. Copper plating is then performed on the PCBs located within the corresponding distinguishing interval according to the preset copper plating pattern, that is, the non-patterned areas are plating with the same pattern as the preset copper plating pattern, so that the second residual copper ratio of the non-patterned areas is equal to the first residual copper ratio of the patterned areas. This ensures the uniformity of the overall PCB thickness and avoids phenomena such as dry film peeling.

[0044] Reference Figure 2 In some embodiments, the preset copper-clad pattern includes at least a first copper-clad pattern, a second copper-clad pattern, and a third copper-clad pattern. Step S120, "performing copper-clad operations on non-pattern areas based on the comparison result and the corresponding preset copper-clad pattern," includes the following sub-steps:

[0045] S210. Determine that the first residual copper rate is less than the preset range, and perform copper pouring operation on the non-pattern area according to the first copper pouring pattern.

[0046] S220. Determine that the first residual copper rate is within the preset range, and perform copper pouring operation on the non-pattern area according to the second copper pouring pattern.

[0047] S230. Determine that the first residual copper rate is greater than the preset range, and perform copper pouring operation on the non-pattern area according to the third copper pouring pattern.

[0048] Specifically, a preset range is set based on the first and second parameters. This preset range divides PCBs with different first residual copper ratios into three distinct intervals. For example: for PCBs with a first residual copper ratio less than the first parameter, copper pouring is performed on the non-patterned areas of the PCB according to the first copper pouring pattern; for PCBs with a first residual copper ratio greater than the first parameter and less than the second parameter, copper pouring is performed on the non-patterned areas of the PCB according to the second copper pouring pattern; for PCBs with a first residual copper ratio greater than the second parameter, copper pouring is performed on the non-patterned areas of the PCB according to the third copper pouring pattern. That is, based on the different first residual copper ratios of the PCB patterned areas, copper of different patterns is poured on the non-patterned areas so that the second residual copper ratio of the non-patterned areas is equal to the first residual copper ratio of the patterned areas. It is understood that the first residual copper ratio can be calculated based on graphic design files, Genesis software, etc., and this embodiment of the application does not specifically limit this.

[0049] The first, second, and third copper-clad patterns are all formed by arranging multiple sub-patterns. When the first residual copper ratio is less than the first parameter, it indicates that the copper-clad area of ​​the PCB pattern region is low; when the first residual copper ratio is greater than the first parameter and less than the second parameter, it indicates that the copper-clad area of ​​the PCB pattern region is medium. Therefore, a pattern that can lay more copper per unit area can be selected as a sub-pattern of the second copper-clad pattern, and conversely, a pattern that can lay less copper per unit area can be selected as a sub-pattern of the first copper-clad pattern.

[0050] Secondly, when the first residual copper ratio is greater than the second parameter, it indicates that the copper coverage area of ​​the PCB pattern area is relatively high. Therefore, the sub-patterns of the third copper-clad pattern have a better resisting effect than the sub-patterns of the second copper-clad pattern. This ensures that the first residual copper ratio is equal to the second residual copper ratio, while making the amount of adhesive flow in the non-pattern area and the pattern area the same, thereby improving the uniformity of the PCB thickness.

[0051] The following explanation uses the following examples: the first copper-clad pattern's sub-graphic (i.e., the first graphic) is circular; the second copper-clad pattern's sub-graphic (i.e., the second graphic) is rectangular; and the third copper-clad pattern's sub-graphic (i.e., the third graphic) is stepped. However, it should be understood that the following explanation is merely illustrative and does not impose any specific limitations on the first, second, or third graphic.

[0052] Reference Figures 3 to 4B In some embodiments, the first pattern is circular, and the first copper-clad pattern includes multiple first patterns.

[0053] Before step S120, the PCB copper pouring method further includes the step of: obtaining the initial length and initial width of the non-graphic area;

[0054] Step S210, "Perform copper pouring operation on non-pattern areas according to the first copper pouring pattern," includes the following sub-steps:

[0055] S310. Adjust the first diameter of the first pattern and the first spacing between two adjacent first patterns according to the first residual copper ratio, the initial length and the initial width.

[0056] S320. Perform copper pouring operation on the non-pattern areas according to the adjusted first copper pouring pattern.

[0057] Specifically, such as Figure 4A and Figure 4BAs shown, multiple first graphics 101 are arranged according to a certain pattern to form a first copper-clad graphic 100. The length of the first copper-clad graphic 100 is equal to the initial length of the non-graphic area, and the width of the first copper-clad graphic 100 is equal to the initial width of the non-graphic area. Therefore, the first diameter Z1 of the multiple first graphics 101 in the first copper-clad graphic 100, the first sub-spacing X1 between two adjacent first graphics 101 in the same row, and the second sub-spacing X2 between adjacent rows and two adjacent first graphics 101 are adjusted according to the following formula (1). It can be understood that the first spacing includes the first sub-spacing X1 and the second sub-spacing X2.

[0058]

[0059] Where L represents the initial length and H represents the initial width. This indicates the number of the first graphic 101 within a unit area along the initial length direction. This indicates the number of first patterns 101 per unit area in the initial width direction. Through the above adjustments, the area ratio of the first patterns 101 in the first copper-clad pattern 100 is equal to the first residual copper ratio. Therefore, when copper-cladding operations are performed on non-pattern areas according to the first copper-clad pattern 100, that is, when the copper-clad surface of the non-pattern areas is laid as if it were the first copper-clad pattern 100, the second residual copper ratio of the non-pattern areas is equal to the first residual copper ratio of the pattern areas, thus ensuring the uniformity of the PCB thickness in each area. It is understandable that, to ensure the copper-cladding effect in non-pattern areas, the first sub-pitch X1, the second sub-pitch X2, and the first diameter Z1 can all be set to be greater than 3 mil.

[0060] Reference Figures 5 to 6B In some embodiments, the second graphic 201 is rectangular, and the second copper-clad graphic 200 includes a plurality of second graphics 201.

[0061] Step S220, "Perform copper pouring operation on non-pattern areas according to the second copper pouring pattern," includes the following sub-steps:

[0062] S510. Adjust the side length of the second graphic and the second spacing between two adjacent second graphics according to the first residual copper ratio, initial length and initial width.

[0063] S520. Perform copper pouring operation on the non-pattern area according to the adjusted second copper pouring pattern.

[0064] Specifically, such as Figure 6A and Figure 6BAs shown, taking a square as an example, multiple second shapes 201 are arranged according to a certain pattern to form a second copper-clad shape 200. The length of the second copper-clad shape 200 is equal to the initial length of the non-shape area, and the width of the second copper-clad shape 200 is equal to the initial width of the non-shape area. Therefore, the side length Y1 of the multiple second shapes 201 in the second copper-clad shape 200 and the second spacing X3 between two adjacent second shapes 201 are adjusted according to the following formula (2).

[0065]

[0066] Where L represents the initial length and H represents the initial width. This indicates the number of second figures 201 within a unit area along the initial length direction. This indicates the number of second patterns 201 per unit area in the initial width direction. Through the above adjustments, the area ratio of the second patterns 201 in the second copper-clad pattern 200 is equal to the first residual copper ratio. Therefore, when copper-cladding operations are performed on non-pattern areas according to the second copper-clad pattern 200, that is, when the copper-clad surface of the non-pattern areas is laid as shown in the second copper-clad pattern 200, the second residual copper ratio of the non-pattern areas is equal to the first residual copper ratio of the pattern areas, thus ensuring the uniformity of the PCB thickness in each area. It is understandable that, to ensure the copper-cladding effect in non-pattern areas, the side length Y1 and the second spacing X3 can both be set to be greater than 3 mil.

[0067] Reference Figures 7A to 8 In some embodiments, the third pattern 300 includes a first sub-rectangle 301, a second sub-rectangle 302, and a third sub-rectangle 303. The first sub-rectangle 301 and the third sub-rectangle 303 are respectively perpendicularly disposed on both sides of the second sub-rectangle 302, and the extending direction of the first sub-rectangle 301 is opposite to the extending direction of the third sub-rectangle 303. The intermediate pattern 400 includes a plurality of third patterns 300 connected in sequence, and the third copper-clad pattern 500 includes a plurality of stacked intermediate patterns 400.

[0068] Specifically, one end of the first sub-rectangle 301 is perpendicular to one end of the second sub-rectangle 302, and one end of the third sub-rectangle 303 is perpendicular to the other end of the second sub-rectangle 302. The wider side of the first sub-rectangle 301 closest to the longer side of the second sub-rectangle 302 is on the same horizontal plane, and the wider side of the third sub-rectangle 303 closest to the longer side of the second sub-rectangle 302 is on the same horizontal plane. The extension direction of the first sub-rectangle 301 refers to the direction in which its other end moves away from the second sub-rectangle 302, and the extension direction of the third sub-rectangle 303 refers to the direction in which its other end moves away from the second sub-rectangle 302. Therefore, the first sub-rectangle 301, the second sub-rectangle 302, and the third sub-rectangle 303 are connected sequentially to form a stepped shape. Multiple third shapes 300 are connected sequentially to form an intermediate shape 400. Multiple intermediate shapes 400 are stacked to form a third copper-clad shape 500. It is understandable that the first sub-rectangle 301, the second sub-rectangle 302, and the third sub-rectangle 303 are all the same size.

[0069] Reference Figure 9 Step S230, "perform copper pouring operation on non-pattern areas according to the third copper pouring pattern," includes the following sub-steps:

[0070] S910. Adjust the sub-length of the third sub-rectangle, the sub-width of the third sub-rectangle, and the third spacing between two adjacent third sub-rectangles according to the first residual copper ratio, the initial length, and the initial width.

[0071] S920. Perform copper pouring operation on the non-pattern areas according to the adjusted third copper pouring pattern.

[0072] Specifically, such as Figures 7A to 8 As shown, multiple intermediate graphics 400 are stacked to form a third copper-clad graphic 500. The length of the third copper-clad graphic 500 is equal to the initial length of the non-graphic area, and the width of the third copper-clad graphic 500 is equal to the initial width of the non-graphic area. Therefore, the sub-length Y2 of multiple third sub-rectangles 303 in the third copper-clad graphic 500, the sub-width Y3 of multiple third sub-rectangles 303, and the third spacing X4 between two adjacent third sub-rectangles 303 are adjusted according to the following formula (3). It can be understood that the sub-length and sub-width of the first sub-rectangle 301, and the sub-length and sub-width of the second sub-rectangle 302 are adaptively adjusted with reference to the third sub-rectangle 303.

[0073]

[0074] Where L represents the initial length and H represents the initial width. This indicates the number of intermediate figures (400) within a unit area along the initial length direction. This indicates the number of intermediate patterns 400 per unit area in the initial width direction. Through the above adjustments, the area ratio of the intermediate patterns 400 in the third copper-clad pattern 500 is equal to the first residual copper ratio. Therefore, when copper-cladding is performed on non-pattern areas according to the third copper-clad pattern 500, i.e., when the copper-clad surface of the non-pattern areas is laid as shown in the third copper-clad pattern 500, the second residual copper ratio of the non-pattern areas is equal to the first residual copper ratio of the pattern areas, thus ensuring the uniformity of the PCB thickness across different areas. It is understandable that, to ensure the copper-cladding effect in non-pattern areas, the sub-length Y2 of the third sub-rectangle 303, the sub-width Y3 of the third sub-rectangle 303, and the third spacing X4 between two adjacent third sub-rectangles 303 can all be set to be greater than 3 mil.

[0075] Reference Figures 1 to 9 In one specific embodiment, the preset range can be set to 45% to 75%. Therefore, when the second residual copper rate is <45%, copper pouring operation is performed on the non-patterned areas according to the first copper pouring pattern 100; when 45% ≤ the second residual copper rate ≤ 75%, copper pouring operation is performed on the non-patterned areas according to the second copper pouring pattern 200; when the second residual copper rate is >75%, copper pouring operation is performed on the non-patterned areas according to the third copper pouring pattern 500, thereby ensuring the uniformity of the board thickness in each area of ​​the PCB and avoiding the impact on subsequent operations.

[0076] Reference Figure 10 This application also provides a PCB copper plating system. The PCB copper plating system includes a data acquisition module 610 and a copper plating module 620. The data acquisition module 610 is used to acquire a first residual copper ratio of a patterned area. The copper plating module 620 is used to compare the first residual copper ratio with a preset range, and perform copper plating operations on non-patterned areas according to the comparison result and the corresponding preset copper plating pattern, so that the first residual copper ratio is equal to a second residual copper ratio of the non-patterned area.

[0077] It is evident that the content of the above PCB copper plating method embodiments is applicable to the embodiments of this PCB copper plating system. The specific functions implemented by this PCB copper plating system embodiment are the same as those of the above PCB copper plating method embodiments, and the beneficial effects achieved are also the same as those achieved by the above PCB copper plating method embodiments.

[0078] This application also provides an electronic device, comprising: at least one processor and a memory communicatively connected to the at least one processor. The memory stores instructions that are executed by the at least one processor to cause the at least one processor to implement the PCB copper-cladding method as described in any of the above embodiments when executing the instructions.

[0079] This application provides a computer-readable storage medium storing computer-executable instructions, which are used to perform the PCB copper-cladding method described in any of the above embodiments.

[0080] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0081] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0082] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A method of coppering PCBs, characterized in that, The PCB includes a graphic area and a non-graphic area, and the PCB copper coating method includes: Obtaining a first residual copper rate of the graphic area; Comparing the first residual copper rate with a preset range, and performing a copper coating operation on the non-graphic area according to a comparison result and a corresponding preset copper coating pattern, so that the first residual copper rate is equal to a second residual copper rate of the non-graphic area, and a copper coating area of the preset copper coating pattern is in a positive correlation with the first residual copper rate; The preset copper coating pattern at least includes a first copper coating pattern, a second copper coating pattern and a third copper coating pattern; The copper coating operation on the non-graphic area according to the comparison result and the corresponding preset copper coating pattern includes: Determine that the first residual copper rate is less than the preset range, and perform the copper coating operation on the non-graphic area according to the first copper coating pattern; Determine that the first residual copper rate is within the preset range, and perform the copper coating operation on the non-graphic area according to the second copper coating pattern; Determine that the first residual copper rate is greater than the preset range, and perform the copper coating operation on the non-graphic area according to the third copper coating pattern; The first copper coating pattern includes a plurality of first patterns, and the first pattern is a circle; Before the comparison of the first residual copper rate with the preset range, the PCB copper coating method further includes: Obtaining an initial length and an initial width of the non-graphic area; The copper coating operation on the non-graphic area according to the first copper coating pattern includes: Adjusting a first diameter of the first pattern and a first spacing between adjacent two first patterns according to the first residual copper rate, the initial length and the initial width; Performing the copper coating operation on the non-graphic area according to the adjusted first copper coating pattern; The second copper coating pattern includes a plurality of second patterns, and the second pattern is a rectangle; The copper coating operation on the non-graphic area according to the second copper coating pattern includes: Adjusting a side length of the second pattern and a second spacing between adjacent two second patterns according to the first residual copper rate, the initial length and the initial width; Performing the copper coating operation on the non-graphic area according to the adjusted second copper coating pattern; The third copper coating pattern includes a plurality of intermediate patterns arranged in a stack; the intermediate pattern includes a plurality of third patterns connected in sequence; the third pattern includes a first sub-rectangle, a second sub-rectangle and a third sub-rectangle; wherein the first sub-rectangle and the third sub-rectangle are respectively arranged on both sides of the second sub-rectangle, and the extension direction of the first sub-rectangle is opposite to the extension direction of the third sub-rectangle; The copper coating operation on the non-graphic area according to the third copper coating pattern includes: Adjusting a sub-length of the third sub-rectangle, a sub-width of the third sub-rectangle and a third spacing between adjacent two third sub-rectangles according to the first residual copper rate, the initial length and the initial width; Performing the copper coating operation on the non-graphic area according to the adjusted third copper coating pattern.

2. The PCB coppering method of claim 1, wherein, The first diameter and the first spacing are both greater than 3 mil.

3. The PCB coppering method of claim 2, wherein, The side length and the second spacing are both greater than 3 mil.

4. The PCB coppering method of claim 1, wherein, The sub-length, the sub-width and the third interval are all greater than 3 mil.

5. A PCB copper clad system characterized by, The PCB includes a graphic area and a non-graphic area, and the PCB copper coating system includes: A data acquisition module is configured to acquire a first residual copper rate of the graphic area; A copper coating module is configured to compare the first residual copper rate with a preset range, and perform a copper coating operation on the non-graphic area according to a comparison result and a corresponding preset copper coating pattern, so that the first residual copper rate is equal to a second residual copper rate of the non-graphic area, and a copper coating area of the preset copper coating pattern is in a positive correlation with the first residual copper rate; The preset copper coating pattern at least includes a first copper coating pattern, a second copper coating pattern and a third copper coating pattern; The copper coating operation on the non-graphic area according to the comparison result and the corresponding preset copper coating pattern includes: determining that the first residual copper rate is less than the preset range, and performing the copper coating operation on the non-graphic area according to the first copper coating pattern; determining that the first residual copper rate is within the preset range, and performing the copper coating operation on the non-graphic area according to the second copper coating pattern; determining that the first residual copper rate is greater than the preset range, and performing the copper coating operation on the non-graphic area according to the third copper coating pattern; The first copper coating pattern includes a plurality of first patterns, and the first pattern is a circle; Before the comparison of the first residual copper rate with the preset range, the method further includes: acquiring an initial length and an initial width of the non-graphic area; The copper coating operation on the non-graphic area according to the first copper coating pattern includes: adjusting a first diameter of the first pattern and a first interval between adjacent two first patterns according to the first residual copper rate, the initial length and the initial width; performing the copper coating operation on the non-graphic area according to the adjusted first copper coating pattern; The second copper coating pattern includes a plurality of second patterns, and the second pattern is a rectangle; The copper coating operation on the non-graphic area according to the second copper coating pattern includes: adjusting a side length of the second pattern and a second interval between adjacent two second patterns according to the first residual copper rate, the initial length and the initial width; performing the copper coating operation on the non-graphic area according to the adjusted second copper coating pattern; The third copper coating pattern includes a plurality of intermediate patterns arranged in a stack; the intermediate pattern includes a plurality of third patterns connected in sequence; the third pattern includes a first sub-rectangle, a second sub-rectangle and a third sub-rectangle; wherein the first sub-rectangle and the third sub-rectangle are respectively arranged on two sides of the second sub-rectangle, and the extension direction of the first sub-rectangle is opposite to the extension direction of the third sub-rectangle; The copper coating operation on the non-graphic area according to the third copper coating pattern includes: adjusting a sub-length of the third sub-rectangle, a sub-width of the third sub-rectangle and a third interval between adjacent two third sub-rectangles according to the first residual copper rate, the initial length and the initial width; performing the copper coating operation on the non-graphic area according to the adjusted third copper coating pattern.

6. An electronic device, characterized by The method includes: at least one processor; at least one memory storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the PCB copper coating method as claimed in any one of claims 1 to 4.

7. A computer readable storage medium having stored thereon processor executable instructions for causing a processor to perform steps comprising: The instructions executable by the processor when executed by the processor are used to implement the PCB copper coating method as claimed in any one of claims 1 to 4.

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