Endoscope and its tip device

Abstract

This invention provides an endoscope and its headpiece device, comprising: a circuit board assembly, an illumination circuit board, an image acquisition unit, and an illumination unit; the connection end of the image acquisition unit and an image acquisition cable are respectively fixedly connected to the circuit board assembly, and the image acquisition unit and the image acquisition cable are electrically connected through a conductive material disposed on the circuit board assembly; the illumination circuit board has a groove edge for forming a first groove, the image acquisition unit passes through the first groove and is assembled with part or all of the groove edge, the illumination unit is disposed on a first surface of the illumination circuit board, the illumination cable is located on one side of a second surface of the illumination circuit board, the second surface and the first surface are distributed along a first direction, the first direction being the orientation of the image acquisition end of the image acquisition unit, and the illumination unit and the illumination cable are electrically connected through a conductive material disposed on the illumination circuit board.

Description

Technical Field

[0001] This invention relates to the field of medical devices, and more particularly to an endoscope and its tip device. Background Technology

[0002] With the development of science and technology, flexible tube-based endoscopy technology has been widely used in the medical field. It can help medical personnel examine internal organs by inserting an endoscope into the human body.

[0003] In existing related technologies, endoscopes may include a flexible, controllable bending tube and a headpiece formed at one end of the controllable bending tube. The headpiece includes an image acquisition unit and an illumination source, and the terminals of the image acquisition unit and the illumination source can be soldered to other wires to achieve electrical transmission.

[0004] However, due to the small size of the image acquisition unit, the size of its wires is also small. The welding of the image acquisition unit to other wires must be parallel to the image acquisition direction and cannot increase the radial dimension. The welding process is very inconvenient to operate and will generate thermal interference. At the same time, it is difficult to ensure the welding effect during movement. For example, the wires of the image acquisition unit are prone to breakage when moving with other wires. Summary of the Invention

[0005] This invention provides an endoscope and its tip device to solve the problems of inconvenient operation and difficulty in ensuring welding effect during the welding process.

[0006] According to a first aspect of the present invention, an endoscope head end device is provided, comprising: a circuit board assembly, an illumination circuit board, an image acquisition unit, an illumination unit, an image acquisition cable, and an illumination cable;

[0007] The connection end of the image acquisition unit and the image acquisition cable are respectively fixedly connected to the circuit board assembly, and the image acquisition unit and the image acquisition cable are electrically connected through a conductive material provided on the circuit board assembly;

[0008] The lighting circuit board has a groove edge for forming a first groove. The image acquisition unit passes through the first groove and is assembled with part or all of the groove edge. The lighting unit is disposed on a first surface of the lighting circuit board. The lighting cable is located on one side of a second surface of the lighting circuit board. The second surface and the first surface are distributed along a first direction, which is the orientation of the image acquisition end of the image acquisition unit. The lighting unit and the lighting cable are electrically connected through a conductive material disposed on the lighting circuit board.

[0009] Optionally, the circuit board assembly includes a main circuit board and an image acquisition circuit board that are perpendicularly connected to each other;

[0010] The surface of the main circuit board is provided with a first conductive material, and the two surfaces of the image acquisition circuit board are provided with a second conductive material, and the second conductive materials on the two surfaces are interconnected.

[0011] The connection end of the image acquisition unit is electrically connected to the second conductive material on the first surface of the image acquisition circuit board. The second surface of the image acquisition circuit board is mated to the edge of the main circuit board, and the second conductive material on the second surface of the image acquisition circuit board is electrically connected to the first conductive material of the main circuit board. The first conductive material of the main circuit board is electrically connected to the image acquisition cable.

[0012] Optionally, the first conductive material is distributed on both surfaces of the main circuit board, and the first conductive materials on different surfaces of the main circuit board are not interconnected, and the image acquisition cables electrically connected to different surfaces of the main circuit board are also not interconnected.

[0013] Optionally, the main circuit board includes at least two extensions for forming a second groove, the extensions extending along the first direction, and the image acquisition circuit board snapping into the second groove.

[0014] Optionally, the at least two extensions include a first extension and a second extension;

[0015] The first extension and the second extension are distributed along a second direction, and the second groove is formed between the first extension and the second extension, wherein the first direction is perpendicular to the second direction;

[0016] The edge of the image acquisition circuit board is provided with a first slot that engages with the first extension body and a second slot that engages with the second extension body. The first slot and the second slot are configured to restrict the movement of the image acquisition circuit board relative to the first extension body and the second extension body in a third direction.

[0017] Optionally, the width of the image acquisition circuit board along the third direction is adapted to the dimension of the image acquisition part connection end along the third direction; the width between the bottom of the first slot and the bottom of the second slot is adapted to the dimension of the image acquisition part connection end along the second direction.

[0018] Optionally, the two surfaces of the lighting circuit board are provided with a third conductive material, and the third conductive materials on the two surfaces are interconnected. The surface of the main circuit board is also provided with a fourth conductive material, which is disposed on the extension.

[0019] The second surface of the lighting circuit board is mated to the extension body, and the third conductive material of the second surface of the lighting circuit board is electrically connected to the fourth conductive material.

[0020] Optionally, the image acquisition circuit board is connected to the main circuit board by adhesive, the first conductive material and the second conductive material are connected by solder, and the main circuit board is connected to the image acquisition unit via SMT after being connected to the image acquisition circuit board.

[0021] Optionally, the lighting circuit board and the image acquisition unit are also connected by adhesive.

[0022] Optionally, the head-end device further includes a lens mount, and the circuit board assembly, the illumination circuit board, the image acquisition unit, and the illumination unit are disposed on the lens mount.

[0023] According to a second aspect of the invention, an endoscope is provided, including the tip device involved in the first aspect and its alternatives.

[0024] In the endoscope and its head end device provided by the present invention, the connection end of the image acquisition unit and the image acquisition cable are electrically connected through the conductive material of the circuit board assembly. Because the electrical connection is based on the conductive material, the direct welding of the cable and the detection component is avoided. Therefore, the present invention reduces the difficulty of welding operation, improves the strength and reliability of welding, and meets the welding stability under various motion conditions. In a further embodiment, it also solves the problem of turning the vertical welding of the cable welding position into a simple planar welding.

[0025] The feature of connecting the main circuit board to the image acquisition circuit board and then to the image acquisition unit via a patch connection can extend the distance between the cable and the image acquisition unit, thereby reducing crosstalk issues caused by soldering to the image acquisition unit.

[0026] The present invention also helps to reduce the overall radial dimension of the device and ensure the positional stability of the lighting part by introducing the lighting circuit board and the edge of the groove therein, as well as the first groove. Furthermore, it can also solve the problems of inconvenient welding, complex process, unreliable welding, and weak stress.

[0027] In the specific solution, the three-dimensional circuit board combination formed by the main circuit board, the lighting circuit board, and the image acquisition circuit board solves the problem of too many solder points in the camera, which is prone to thermal interference. The welding is convenient and reliable, and the stress is stronger. In addition, it can also be more compact in size, form a module, and facilitate production. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the endoscope tip device in one embodiment of the present invention. Figure 1 ;

[0030] Figure 2 This is a schematic diagram of the endoscope tip device in one embodiment of the present invention. Figure 2 ;

[0031] Figure 3 This is a schematic diagram of the endoscope tip device in one embodiment of the present invention. Figure 3 ;

[0032] Figure 4 This is a partial structural diagram of the endoscope tip device in one embodiment of the present invention. Figure 1 ;

[0033] Figure 5 This is a partial structural diagram of the endoscope tip device in one embodiment of the present invention. Figure 2 ;

[0034] Figure 6 This is a schematic diagram of the circuit board assembly in one embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of the main circuit board in one embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of an image acquisition circuit board in one embodiment of the present invention;

[0037] Figure 9 This is a schematic diagram of the structure of the lighting circuit board and the lighting unit in one embodiment of the present invention;

[0038] Figure 10 This is a schematic diagram of the structure of a lighting circuit board in one embodiment of the present invention;

[0039] Figure 11 This is a schematic diagram of the endoscope in one embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10 - Image Acquisition Unit;

[0042] 11-Base;

[0043] 12-Main body;

[0044] 20-Lighting Department;

[0045] 30 - Lighting circuit board;

[0046] 31-First groove;

[0047] 32-Third conductive material;

[0048] 40 - Image acquisition circuit board;

[0049] 41-Second conductive material;

[0050] 42 - Second conductive material;

[0051] 43-First card slot;

[0052] 44 - Second card slot;

[0053] 50 - Main circuit board;

[0054] 51-First conductive material;

[0055] 52 - Fourth conductive material;

[0056] 53 - Second groove;

[0057] 54-Extension;

[0058] 60 - Image acquisition cable;

[0059] 70 - Lighting cables;

[0060] 80-Lens mount;

[0061] 90 - Instrument access;

[0062] 100-Flexible tube. Detailed Implementation

[0063] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] In the description of this invention, it should be understood that the terms "upper part", "lower part", "upper end", "lower end", "lower surface", "upper surface", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0065] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0066] In the description of this invention, "a plurality of" means multiple, such as two, three, four, etc., unless otherwise explicitly specified.

[0067] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" and other such terms should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0068] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0069] Please refer to Figures 1 to 10 An endoscope head end device is provided, including: a circuit board assembly (specifically including a main circuit board 50 and an image acquisition circuit board 40), an illumination circuit board 30, an image acquisition unit 10, an illumination unit 20, an image acquisition cable 60, and an illumination cable 70.

[0070] The image acquisition unit 10 can be any component or combination of components capable of image acquisition in the art. In one illustrated example, the image acquisition unit 10 may include a base 11 and a main body 12, with a plane perpendicular to the first direction as the projection surface. The area of ​​the projection region of the main body 12 on the projection surface is smaller than the area of ​​the projection region of the base 11 on the projection surface, and the projection region of the main body 12 on the projection surface covers the projection region of the base 11 on the projection surface. The connection end of the image acquisition unit 10 may refer to the end of the base 11 facing away from the main body 12, and the image acquisition end of the image acquisition unit 10 may refer to the end of the main body 12 facing away from the base 11. The base 11 and the main body 12 extend along the first direction.

[0071] The connection end of the image acquisition unit 10 and the image acquisition cable 60 are respectively fixedly connected to the circuit board assembly, for example, a camera. The image acquisition unit 10 and the image acquisition cable 60 are electrically connected through a conductive material provided on the circuit board assembly.

[0072] The conductive material can refer to any material that can achieve contact conductivity. Specifically, the conductive material can be formed into a surface for contact conductivity.

[0073] The image acquisition cable 60 can be understood as any cable used to transmit electrical signals to the image acquisition unit 10. It can be a cable that supplies power to the image acquisition unit or a cable that interacts with the image acquisition unit to exchange information.

[0074] Please refer to Figures 1 to 5 and combined Figure 9 The lighting circuit board 30 has a groove edge for forming a first groove 31, and the image acquisition unit 10 (e.g., its main body 12) passes through the first groove 31 and is assembled with part or all of the groove edge.

[0075] Specifically, the first groove 31 and its groove edge can be, for example, trapezoidal or rectangular (or other polygonal, arc-shaped) edges; the shape of the first groove 31 and its groove edge can be adapted to be assembled with the image acquisition unit 10 (e.g., its main body 12). Figure 9 In the example shown, the edge of the groove is trapezoidal. In some embodiments, the lighting circuit board and the image acquisition unit are also connected by adhesive.

[0076] For the assembly between the first groove and its edge and the image acquisition unit 10, for example, the structural part between the lighting circuit board 30 and the image acquisition unit 10 can be connected with the camera's own structural shape by positioning the positioning card provided on the lighting circuit board and the camera itself using glue.

[0077] The lighting unit 20 is disposed on the first surface of the lighting circuit board 30, and the lighting cable 70 is located on one side of the second surface of the lighting circuit board 30. The second surface and the first surface are distributed along a first direction, which is the orientation of the image acquisition end of the image acquisition unit (or the direction from the base 11 to the main body 12 of the image acquisition unit 10). The lighting unit 20 and the lighting cable are electrically connected through a conductive material disposed on the lighting circuit board. This can be indirect conductivity (e.g., sequential conductive connection between the lighting unit, the conductive material of the lighting circuit board, the conductive material of the main circuit board, and the lighting cable) or direct conductivity (e.g., sequential conductive connection between the lighting unit, the conductive material of the lighting circuit board, and the lighting cable).

[0078] In the above solution, the electrical connection between the connection end of the image acquisition unit and the image acquisition cable is achieved through the conductive material of the circuit board assembly. Since the electrical connection is achieved based on the conductive material, the direct welding of the cable and the detection component is avoided. Therefore, the present invention reduces the difficulty of welding operation, improves the strength and reliability of welding, and meets the welding stability under various motion conditions. Furthermore, the solution also solves the problem of turning the vertical welding of the cable welding position into a simple planar welding.

[0079] The present invention also helps to reduce the overall radial dimension of the device and ensure the positional stability of the lighting part by introducing the lighting circuit board and the edge of the groove therein, as well as the first groove. Furthermore, it can also solve the problems of inconvenient welding, complex process, unreliable welding, and weak stress.

[0080] In one embodiment, the circuit board assembly includes a main circuit board 50 and an image acquisition circuit board 40 that are perpendicularly connected to each other.

[0081] The surface of the main circuit board 50 is provided with a first conductive material 51. The first conductive material 51 may be distributed only on one side of the main circuit board 50, or it may be distributed on both sides of the main circuit board 50 (i.e., the first surface and the second surface of the main circuit board 50).

[0082] The image acquisition circuit board 40 has a second conductive material 41 on two surfaces, and the second conductive materials 41 on the two surfaces are interconnected.

[0083] The connection end of the image acquisition unit 10 is electrically connected to the second conductive material 42 (e.g., on the first surface of the image acquisition circuit board 40). Figure 6 The second conductive material 42 shown, the second surface of the image acquisition circuit board 40 is mated to the edge of the main circuit board 50 (e.g., the end edge of the extension 54 of the main circuit board 50), and the second conductive material of the second surface of the image acquisition circuit board 40 (e.g., the second conductive material 42 shown), the second surface of the image acquisition circuit board 40 is mated to the edge of the main circuit board 50 (e.g., the end edge of the extension 54 of the main circuit board 50), and the second conductive material of the second surface of the image acquisition circuit board 40 (e.g., the second conductive material 42 shown) Figure 1 , Figure 2 , Figure 4 , Figure 5 The second conductive material 42 shown is electrically connected to the first conductive material 51 of the main circuit board 50. The first conductive material 51 of the main circuit board 50 is electrically connected to the image acquisition cable 60. The first conductive material 51 and the image acquisition cable 60 can achieve line contact and surface contact, thereby achieving conductive and fixed connection.

[0084] Furthermore, in the above solution, the three-dimensional circuit board formed by the combination of the main circuit board 50 and the image acquisition circuit board 40 (which can be regarded as a T-shaped component, i.e., the main circuit board 50 and the image acquisition circuit board 40 are connected in a T-shape) can solve the problem of too many solder points in the image acquisition part, which easily leads to thermal crosstalk (this problem can be seen in the prior art, where the image acquisition part is too small and there are many solder points that need to be connected. The close proximity between the solder points can easily cause thermal crosstalk, affecting the welding quality, especially in the case of high-pixel cameras with a large number of solder points). It also solves the problem of transforming the vertical welding of the cable welding position into simple planar welding, making welding convenient and reliable, and stronger in terms of stress. In addition, in the specific solution, the circuit boards form a three-dimensional circuit board, which is more compact and modular, making it easier to manufacture.

[0085] In the above scheme, a combination of main circuit board 50 and image acquisition circuit board 40 is used. In other examples, an integrally molded structure can also be used to realize the functions of main circuit board 50 and image acquisition circuit board 40.

[0086] Furthermore, when the first conductive material is distributed on both surfaces of the main circuit board, the first conductive materials on different surfaces of the main circuit board are not interconnected, and the image acquisition cables electrically connected to different surfaces of the main circuit board are also not interconnected.

[0087] In one implementation method, please refer to Figure 6 , Figure 7 In conjunction with other accompanying drawings, the main circuit board 50 includes at least two extensions 54 for forming a second recess 53, the extensions 54 extending along the first direction, and the image acquisition circuit board 40 snapping into the second recess 53.

[0088] Specifically, the at least two extensions include a first extension and a second extension, i.e., as shown in the figure. Figure 6 , Figure 7 The two extensions 54 shown are distributed along the second direction.

[0089] The first extension and the second extension are distributed along a second direction, and the second groove is formed between the first extension and the second extension, wherein the first direction is perpendicular to the second direction;

[0090] Please refer to Figure 6 , Figure 8 In conjunction with other accompanying drawings, the edge of the image acquisition circuit board 40 is provided with a first slot 43 that engages with the first extension body, and a second slot 44 that engages with the second extension body. The first slot 43 and the second slot 44 are configured to restrict the movement of the image acquisition circuit board relative to the first extension body and the second extension body along a third direction. The third direction is perpendicular to the first direction and the second direction, respectively.

[0091] In other examples, the number of extensions may include two groups, with the two groups of extensions distributed along the second direction. Each group may contain multiple extensions. Correspondingly, the number of the first slot and the second slot may also be multiple, with each slot corresponding to one extension.

[0092] In one example, to save space, the width of the image acquisition circuit board 40 along the third direction is adapted to the size of the image acquisition unit connection end along the third direction (e.g., the width of the base 11 of the image acquisition unit along the third direction); the adaptation may mean that the difference between the width of the image acquisition circuit board 40 along the third direction and the size of the image acquisition unit connection end along the third direction is less than a preset threshold, and further, the two may be the same.

[0093] In one example, to save space, the width between the bottom of the first card slot 43 and the bottom of the second card slot 44 is adapted to the dimension of the image acquisition unit connection end along the second direction. This adaptation may mean that the difference between the width between the bottom of the first card slot 43 and the bottom of the second card slot 44 and the dimension of the image acquisition unit connection end along the second direction is less than a preset threshold. Simultaneously, the width between the bottom of the first card slot 43 and the bottom of the second card slot 44 may be less than or equal to the dimension of the image acquisition unit connection end along the second direction (e.g., the width of the base 11 of the image acquisition unit along the second direction). Furthermore, the distribution positions of the first card slot 43 and the second card slot 44 along the third direction may be offset from the second conductive material.

[0094] Furthermore, in a specific example, the size of the image acquisition circuit board is similar to that of the image acquisition unit. It has conductive materials (i.e., second conductive materials 41) on both sides for external connection. The shape and position of one conductive material (i.e., the second conductive material 41 on its first surface) matches the shape and position of the solder joints of the image acquisition unit. The shape and position of the other conductive material (i.e., the second conductive material 41 on its second surface) matches the shape and position of the conductive material (i.e., the first conductive material 51) on the main circuit board. The conductive materials on both sides are internally interconnected. The main circuit board 50 has conductive materials (i.e., the first conductive material 51) on both sides for external connection, but the conductive materials on both sides are not internally connected.

[0095] The image acquisition circuit board is connected to the main circuit board by adhesive, and the first conductive material and the second conductive material are connected by solder.

[0096] Furthermore, the image acquisition circuit board and the main circuit board are structurally connected by positioning slots and adhesive on the two circuit boards; the electrical components are interconnected by soldering different conductive materials on the circuit boards to form a "T-shaped assembly". The conductive material on the first surface of the image acquisition circuit board can be soldered to the solder points on the image acquisition unit using SMT (Surface Mount Technology).

[0097] In one implementation method, please refer to Figure 6 , Figure 7 , Figure 10 In conjunction with other accompanying drawings, the two surfaces of the lighting circuit board 30 are provided with a third conductive material 32, and the third conductive materials on the two surfaces are interconnected. The surface of the main circuit board 50 is also provided with a fourth conductive material 52, and the fourth conductive material 52 is disposed on the extension body 54.

[0098] The second surface of the lighting circuit board 30 is mated to the extension body 54 (specifically, it can be mated to the end of the extension body 54, that is, the end close to the image acquisition end of the image acquisition unit), and the third conductive material 32 of the second surface of the lighting circuit board 30 is electrically connected to the fourth conductive material 52.

[0099] The lighting circuit board has conductive materials (i.e., third conductive material 32) on both sides for external connection. The shape and position of the conductive material on the first surface match the shape and position of the solder joints of the lighting unit (e.g., LED), and the shape and position of the conductive material on the second surface match the shape and position of the conductive material (i.e., fourth conductive material 52) on the main circuit board. The conductive materials on both sides are interconnected internally. The lighting unit (e.g., LED) can be electrically connected to the lighting circuit board using SMT surface mount technology.

[0100] In one implementation method, please refer to Figure 11 The headpiece device further includes a lens mount 80. The circuit board assembly, the illumination circuit board 30, the image acquisition unit 10, and the illumination unit 20 are disposed on the lens mount 80. Specifically, the image acquisition circuit board 40, the main circuit board 50, the illumination circuit board 30, the image acquisition unit 10, and the illumination unit 20 are connected by solder and glue to form a "CMOS assembly". The cable is connected to the CMOS assembly by solder and then installed in the lens mount 80 to become the headpiece device of the endoscope.

[0101] The conductive materials mentioned above (such as the first conductive material, the second conductive material, the third conductive material, the fourth conductive material) can be the same conductive material or different conductive materials. Each conductive material can form a conductive material surface, thereby forming a conductive connection with the outside world through line contact or surface contact.

[0102] This invention also provides an endoscope, including the head end device mentioned in the above optional solutions.

[0103] In one embodiment, the endoscope further includes an instrument channel 90 and a flexible tube 100, with a head end device connected to one end of the flexible tube 100, and the instrument channel 90 passing through the flexible tube 100 and the head end device.

[0104] In a further example, the instrument channel 90 may be located on one side of the "CMOS component" formed by the image acquisition circuit board 40, the main circuit board 50, the illumination circuit board 30, the image acquisition unit 10, the illumination unit 20, solder, and glue, along a third direction.

[0105] As can be seen from the above specific solutions, the present invention features an ingenious design, a small number of parts, efficient use of space, simplicity, reliability, and ease of manufacture, and uses common standard parts at low cost. The image acquisition circuit board and the main circuit board are first connected to form a three-dimensional circuit structure "T-shaped assembly" before being connected to the camera (i.e., the image acquisition unit) via surface mount circuitry. This approach extends or avoids soldering at the solder points closest to the camera, solving the long-standing problem of poor soldering caused by excessive solder points and thermal runaway in miniature cameras due to their small size. Simultaneously, the positioning slots on each circuit board are used to position related parts, effectively controlling the radial package size of the camera and LED (i.e., the illumination unit) and ensuring that the LED is as close as possible to the same plane as the camera tip, resulting in more uniform illumination. Furthermore, all solder joints connected to the cable are changed from being perpendicular to the camera's shooting direction to being parallel to it, preventing the camera from being affected by external forces after assembly. This improves the welding strength and reliability of the camera, LED, and cable, and reduces the risk of short circuits due to excessively large solder joints and the outer tube. Furthermore, the lens mount is made of transparent plastic, which not only facilitates the assembly of related parts but also improves the insertion passage of the endoscope insertion part due to its beveled semi-circular shape. Based on the specific solution of this invention, an electronic endoscope packaging method that can effectively control the outer diameter, has illumination, is securely and reliably packaged, reduces thermal crosstalk, and is low in cost can be achieved. Utilizing this invention and its variations, a headpiece device for a miniature camera endoscope with a beveled edge and a diameter of less than 3mm can be packaged, greatly expanding the application range of miniature cameras in the field of endoscopy.

[0106] In the description of this specification, the references to terms such as "an embodiment," "an example," "a specific implementation process," and "an example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A tip device for an endoscope, comprising: Circuit board assembly, lighting circuit board, image acquisition unit, lighting unit; The connection end of the image acquisition unit and the image acquisition cable are respectively fixedly connected to the circuit board assembly, and the image acquisition unit and the image acquisition cable are electrically connected through a conductive material provided on the circuit board assembly; The lighting circuit board has a groove edge for forming a first groove. The image acquisition unit passes through the first groove and is assembled with part or all of the groove edge. The lighting unit is disposed on a first surface of the lighting circuit board. The lighting cable is located on one side of a second surface of the lighting circuit board. The second surface and the first surface are distributed along a first direction, which is the orientation of the image acquisition end of the image acquisition unit. The lighting unit and the lighting cable are electrically connected through a conductive material disposed on the lighting circuit board. The circuit board assembly includes a main circuit board and an image acquisition circuit board that are perpendicularly connected to each other; the lighting circuit board is arranged parallel to the image acquisition circuit board, and the image acquisition circuit board and the lighting circuit board are distributed sequentially along the first direction; The main circuit board includes at least two extensions for forming a second groove, the extensions extending along the first direction, and the image acquisition circuit board snapping into the second groove; the second surface of the lighting circuit board abuts against the extensions, and the lighting circuit board is electrically connected to the extensions through a conductive material.

2. The head-end device according to claim 1, characterized in that, The surface of the main circuit board is provided with a first conductive material, and the two surfaces of the image acquisition circuit board are provided with a second conductive material, and the second conductive materials on the two surfaces are interconnected. The connection end of the image acquisition unit is electrically connected to the second conductive material on the first surface of the image acquisition circuit board. The second surface of the image acquisition circuit board is mated to the edge of the main circuit board, and the second conductive material on the second surface of the image acquisition circuit board is electrically connected to the first conductive material of the main circuit board. The first conductive material of the main circuit board is electrically connected to the image acquisition cable.

3. The head-end device according to claim 2, characterized in that, The first conductive material is distributed on both surfaces of the main circuit board, and the first conductive materials on different surfaces of the main circuit board are not interconnected. The image acquisition cables electrically connected to different surfaces of the main circuit board are also not interconnected.

4. The head-end device according to claim 2, characterized in that, The at least two extensions include a first extension and a second extension; The first extension and the second extension are distributed along a second direction, and the second groove is formed between the first extension and the second extension, wherein the first direction is perpendicular to the second direction; The edge of the image acquisition circuit board is provided with a first slot that engages with the first extension body and a second slot that engages with the second extension body. The first slot and the second slot are configured to restrict the movement of the image acquisition circuit board relative to the first extension body and the second extension body in a third direction.

5. The head-end device according to claim 4, characterized in that, The width of the image acquisition circuit board along the third direction is adapted to the dimension of the image acquisition part connection end along the third direction; the width between the bottom of the first slot and the bottom of the second slot is adapted to the dimension of the image acquisition part connection end along the second direction.

6. The head-end device according to claim 2, characterized in that, The lighting circuit board has a third conductive material on two surfaces, and the third conductive materials on the two surfaces are interconnected. The main circuit board surface is also provided with a fourth conductive material, which is disposed on the extension. The second surface of the lighting circuit board is mated to the extension body, and the third conductive material of the second surface of the lighting circuit board is electrically connected to the fourth conductive material.

7. The head-end device according to any one of claims 2 to 6, characterized in that, The image acquisition circuit board is connected to the main circuit board by adhesive, the first conductive material and the second conductive material are connected by solder, the main circuit board is connected to the image acquisition unit via SMT after being connected to the image acquisition circuit board, and the lighting circuit board is connected to the image acquisition unit via adhesive.

8. The head-end device according to any one of claims 1 to 6, characterized in that, It also includes a lens mount, and the circuit board assembly, the illumination circuit board, the image acquisition unit and the illumination unit are disposed on the lens mount.

9. An endoscope, characterized in that, Includes the head end device as described in any one of claims 1 to 8.

Images