A target process task stopping method and a semiconductor process equipment

Abstract

Embodiments of the present application provide a target process task stopping method and a semiconductor process equipment. The method comprises: in the process of executing a process task, in response to a stopping instruction for a target process task, determining a first target wafer which needs to stop action in the target process task; determining whether to adjust a first transmission path of the first target wafer according to a current transmission position and a current process state of the first target wafer, if yes, generating a new scheduling action sequence according to the newly determined first transmission path, and transmitting the first target wafer to a source site according to the newly generated scheduling action sequence; if not, executing the process according to the original first transmission path and transmitting the first target wafer to a corresponding destination site. According to the embodiments of the present application, only one key operation of an operator is needed to recycle the wafer associated with the selected process task to the destination site or the source site.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a method for stopping a target process task and a semiconductor process apparatus. Background Technology

[0002] The existing process for stopping process tasks and recovering wafers includes equipment pause, equipment abort, equipment recovery, and one-click wafer collection. The user performs a pause operation, waiting for the ongoing action to stop; after the action stops, the user performs an abort operation, waiting for the equipment status to switch to the abort state; after switching to the abort state, the user performs a recovery operation, waiting for the equipment status to switch to the ready state (wafer transfer ready state); after switching to the ready state, the user performs a one-click wafer collection operation, selecting the wafers to be recovered and transferring all selected wafers back to the destination wafer cassette.

[0003] The above-mentioned equipment pause operation applies to all process tasks in the machine. If multiple tasks are running simultaneously in the current system, it is not possible to pause only one task, which leads to reduced equipment capacity and affects user experience. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a target process task stopping method and a corresponding semiconductor process apparatus to overcome or at least partially solve the above problems.

[0005] To address the aforementioned problems, this invention discloses a method for stopping a target process task, applied to semiconductor process equipment. The method includes:

[0006] During the execution of a process task, in response to a stop command for the target process task, the first target wafer in the target process task that needs to be stopped is determined;

[0007] Based on the current transmission position and current process status of the first target wafer, determine whether to adjust the original first transmission path of the first target wafer;

[0008] If so, a new scheduling action sequence is generated based on the newly determined first transmission path, and the first target wafer is transmitted to the source site according to the newly generated scheduling action sequence.

[0009] If not, the process is carried out according to the original first transmission path and the first target wafer is transmitted to the corresponding destination site.

[0010] Optionally, generating a new sequence of scheduling actions based on the newly determined first transmission path includes:

[0011] Identify a second target wafer that is affected in other process tasks besides the target process task; the second target wafer is a wafer that has not reached the destination site in the other process tasks.

[0012] Obtain the original first transport path and first process menu of the first target wafer without adjustment;

[0013] Based on the newly determined first transmission path, without adjusting the original first transmission path and first process menu of the first target wafer, and the second transmission path and second process menu of the second target wafer, a new scheduling action sequence is generated.

[0014] Optionally, after determining whether to adjust the original first transmission path of the first target wafer based on its current transmission position and current process state, the method further includes:

[0015] If the newly determined first transmission path does not include a process chamber site, delete the original first process menu of the corresponding first target wafer.

[0016] Optionally, determining the first target wafer that needs to be stopped in the target process task includes:

[0017] If the wafer in the target process task has left the source site and has not reached the destination site, then the wafer is determined to be the first target wafer.

[0018] Optionally, the semiconductor process equipment includes a vacuum robot and a loading chamber. The step of determining whether to adjust the original first transport path of the first target wafer based on its current transport position and current process state includes:

[0019] If the current transmission position of the first target wafer is a vacuum robot station and the current process state is an incomplete process state, then it is determined to adjust the original first transmission path of the first target wafer.

[0020] A transmission path is created from the vacuum manipulator station, through the loading chamber station, and back to the source station, resulting in the newly determined first transmission path.

[0021] Optionally, the semiconductor process equipment includes a loading chamber, and determining whether to adjust the original first transport path of the first target wafer based on the current transport position and current process state includes:

[0022] If the current transmission location of the first target wafer is a loading chamber site and the current process state is an incomplete process state, then it is determined to adjust the original first transmission path of the first target wafer.

[0023] A transmission path is created from the loading chamber site to the source site, resulting in the newly determined first transmission path.

[0024] Optionally, the semiconductor process equipment includes an atmospheric robot, and determining whether to adjust the original first transport path of the first target wafer based on the current transport position and current process state includes:

[0025] If the current transmission location of the first target wafer is an atmospheric robot station and the current process status is an incomplete process status, then it is determined to adjust the original first transmission path of the first target wafer.

[0026] A transmission path is created from the atmospheric manipulator station to the source station, resulting in the newly determined first transmission path.

[0027] This invention also discloses a semiconductor process apparatus, comprising:

[0028] The controller, during the execution of a process task, responds to a stop command for the target process task, determines a first target wafer in the target process task that requires a stop operation; based on the current transmission position and current process state of the first target wafer, determines whether to adjust the original first transmission path of the first target wafer; if yes, it generates a new scheduling action sequence based on the newly determined first transmission path and transmits the first target wafer to the source site according to the newly generated scheduling action sequence; if no, it performs the process according to the original first transmission path and transmits the first target wafer to the corresponding destination site.

[0029] Optionally, the controller is configured to determine a second target wafer affected in other process tasks besides the target process task; the second target wafer is a wafer in the other process tasks that has not reached its destination site; obtain the original first transmission path and first process menu of the first target wafer without adjustment; and generate a new scheduling action sequence based on the newly determined first transmission path, the original first transmission path and first process menu of the first target wafer without adjustment, and the second transmission path and second process menu of the second target wafer.

[0030] Optionally, the controller is further configured to delete the original first process menu of the corresponding first target wafer if the newly determined first transmission path does not include a process chamber site.

[0031] Optionally, the controller is configured to determine that the wafer is the first target wafer if the wafer in the target process task has left the source site and has not reached the destination site.

[0032] Optionally, the semiconductor process equipment includes a vacuum robot and a loading chamber. The controller is configured to, if the current transfer position of the first target wafer is a vacuum robot station and the current process state is an incomplete process state, determine to adjust the original first transfer path of the first target wafer; create a transfer path from the vacuum robot station through the loading chamber station back to the source station, and obtain the newly determined first transfer path.

[0033] Optionally, the semiconductor process equipment includes a loading chamber, and the controller is configured to, if the current transfer position of the first target wafer is a loading chamber site and the current process state is an incomplete process state, determine to adjust the original first transfer path of the first target wafer; create a transfer path from the loading chamber site to the source site, and obtain a newly determined first transfer path.

[0034] Optionally, the semiconductor process equipment includes an atmospheric robot, and the controller is configured to, if the current transmission position of the first target wafer is an atmospheric robot station and the current process state is an incomplete process state, determine to adjust the original first transmission path of the first target wafer; create a transmission path from the atmospheric robot station to the source station, and obtain a newly determined first transmission path.

[0035] The embodiments of the present invention have the following advantages:

[0036] In this embodiment of the invention, when a stop command is received for a target process task, the first target wafer requiring a stop operation within that task can be identified. Based on the current transport position and process state of the first target wafer, it is intelligently determined whether the transport path of the first target wafer needs to be adjusted, and the first target wafer is then recycled to the corresponding destination or source site. Using this method, an operator only needs to press a button to recycle the wafer associated with the selected process task to the destination or source site. This process requires no human intervention, automating the wafer recycling function. This method intelligently adjusts the wafer transport path based on the wafer state for wafer recycling and can transport the wafer back to the source site, reducing chip loss risk. Furthermore, when multiple tasks are running simultaneously on the machine, only wafers from one or a few tasks can be recycled, while the execution of other tasks remains unaffected, increasing equipment capacity. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of a silicon epitaxial device.

[0038] Figure 2This is a flowchart illustrating the process of stopping the execution of a process task and recycling the wafer.

[0039] Figure 3 This is a flowchart of the steps of a target process task stopping method according to an embodiment of the present invention;

[0040] Figure 4 This is a flowchart of another method for stopping a target process task according to an embodiment of the present invention;

[0041] Figure 5 This is a flowchart illustrating the creation of a transmission path according to an embodiment of the present invention;

[0042] Figure 6 This is a flowchart of a target process task stopping method according to an embodiment of the present invention;

[0043] Figure 7 This is a flowchart illustrating how a wafer can be used to generate a new sequence of actions according to an embodiment of the present invention.

[0044] Figure 8 This is a structural block diagram of a semiconductor process equipment according to an embodiment of the present invention. Detailed Implementation

[0045] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention.

[0046] Reference Figure 1 The diagram shows a schematic of a silicon epitaxial wafer fabrication (PEF) device. This device includes three LoadPort chambers (LPA, LPB, and LPC); two LoadLock chambers (LLA and LLB); one Transfer Chamber (TC); two Process Chambers (PMA and PMB); and also includes one Atmospheric Tractor (ATR), one Vacuum Tractor (VTR), and one Aligner (AL). Wafers are transferred from the LoadPort (LP) to the Process Chamber (PM) for processing, and then returned to the LoadPort (LP) after processing.

[0047] Semiconductor process equipment can be used to execute various process jobs. A process job includes attributes such as task mode, source site, destination site, associated wafer and wafer-related transport path, and process menu. When the task mode is parallel, multiple parallel tasks can be executed simultaneously.

[0048] When controlling the execution of process tasks in the software system of semiconductor process equipment, a series of actions are calculated based on the wafer-related transport paths and process menus in the process task, and the machine executes the actions in a certain sequence. The task is completed when all wafers in the process task have left the source station, completed the process, and been transported back to the destination station.

[0049] For example: Task 1 is associated with a wafer, and the transmission path of this wafer is LPA->LLA->PMA(Process1)->LLA->LPA. The task execution flow is as follows:

[0050] (1) The atmospheric robot ATR takes the wafer from the source site LPA and places it on the Aligner for calibration;

[0051] (2) After calibration, the atmospheric robot ATR removes the wafer from the Aligner and places it in the LLA;

[0052] (3) The vacuum robot VTR removes the wafer from the LLA and places it in the process chamber PMA;

[0053] (4) PMA process chamber, execute process menu Process1;

[0054] (5) After the process menu Process1 is completed, the vacuum robot VTR takes out the wafer with the completed process from the process chamber PMA and places it in LLA;

[0055] (6) The atmospheric robot ATR removes the wafer from the LLA and places it at the destination site LPA. In the above example, the source site and the destination site are the same. In practical applications, the source site and the destination site can also be set to be different.

[0056] The device software can provide tasks that can execute one or more parallel task modes simultaneously, with each process task associated with a different transmission path, to support wafers in different tasks to execute different process technologies at the same time.

[0057] During the execution of a process task, users need to monitor the performance of the process in real time to ensure it meets standard process specifications. If these specifications are not met, the task must be stopped for process performance adjustments, such as adjustments to particle size, thickness, and resistivity. After a process task is stopped, the principle of non-interference between tasks should be followed, and wafers associated with a task should be transferred back to their corresponding source sites in sequence, following the principle of "returning to where they came from." However, in actual applications, this principle is not followed for wafer recycling.

[0058] Reference Figure 2The diagram shows a flowchart of an existing process for stopping a process task and recycling wafers, which may include the following steps:

[0059] Equipment pause, equipment stop, equipment resume, one-click film capture.

[0060] 1) Device pause: The device stops after completing the currently executing action and does not continue to execute subsequent actions. The software system status is set to paused.

[0061] 2) Equipment Stop: The equipment immediately stops the currently executing action, and the software system status is set to the stopped state;

[0062] 3) Equipment recovery: The software system status is changed from the aborted state to the ready state (transferable chip state);

[0063] 4) One-click wafer collection: When the software system is in standby mode, it acquires the wafers that have left the source site in the device and displays the wafers in a pop-up interface. The user can select the wafers to be collected in this interface. After the selection is completed, the one-click wafer collection operation is performed, and all selected wafers are sent back to the destination wafer cassette. For unselected wafers, they remain at the current position.

[0064] The above-mentioned wafer recycling schemes have at least the following drawbacks:

[0065] 1. Equipment pause applies to all process tasks in the equipment. If multiple tasks are running simultaneously in the current system, it is not possible to pause only one task, resulting in reduced equipment capacity and affecting user experience.

[0066] 2. If the user executes a pause on the equipment, and the wafers in the process are not removed from the process chamber for a period of time after a successful pause, it will seriously affect the process results and reduce the value of the wafers for process performance analysis. Furthermore, because the equipment does not provide an audible notification when the pause is complete, the user must wait at the machine end for the pause to be successful before immediately executing the equipment stop function.

[0067] 3. Users need to manually select the wafer for one-click wafer receiving, increasing the uncertainty brought about by human intervention. Furthermore, in practical applications, the one-click wafer receiving function follows the principle of "whichever is idle in the loading chamber LLA or LLB" to save wafer transfer time, which does not follow the principle of wafer returning along the original path. If the wafer enters from LLA and returns to the destination site from LLB, it will increase the risk of wafer loss.

[0068] Based on this, the present invention aims to provide a target process task stopping method and a corresponding semiconductor process equipment to overcome or at least partially solve the above problems.

[0069] One of the core concepts of this invention is that when a stop command is received for a target process task, the first target wafer requiring a stop operation within that task can be identified. Based on the current transport position and process state of the first target wafer, the system intelligently determines whether its transport path needs adjustment, thus automating the wafer retrieval process. This method allows operators to retrieve wafers associated with the selected process task to the destination or source site with a single button press, eliminating the need for human intervention. By intelligently adjusting the wafer transport path based on its state and returning the wafer to the source site, this method reduces the risk of wafer loss. Furthermore, when multiple tasks are running simultaneously, only wafers from one or a few tasks can be retrieved without affecting the execution of other tasks, thus increasing equipment productivity.

[0070] Reference Figure 3 The diagram illustrates a flowchart of a target process task stopping method according to an embodiment of the present invention, applied to semiconductor process equipment, and specifically includes the following steps:

[0071] Step 301: During the execution of a process task, in response to a stop command for the target process task, determine the first target wafer in the target process task that needs to be stopped.

[0072] In this embodiment of the invention, multiple parallel process tasks can be performed simultaneously in the semiconductor process equipment. When it is necessary to debug the process performance of one or more of the ongoing process tasks, the user can press the one-click wafer recovery function button among the multiple function buttons on the equipment. The equipment software responds to this operation by displaying an interface showing the multiple process tasks currently being executed. The user can select the target process task for which the wafer recovery operation needs to be performed on the interface and generate a corresponding stop command for the target process task.

[0073] When a stop command is received for a target process task, the first target wafer that needs to be stopped can be determined based on the current transfer position of the wafer in the target process task, which means that only a portion of the wafers can be recycled.

[0074] Step 302: Determine whether to adjust the original first transmission path of the first target wafer based on the current transmission position and current process status of the first target wafer.

[0075] In the equipment's software system, process tasks have corresponding associated wafer information, and wafers have corresponding associated transmission paths and process menus.

[0076] After identifying the first target wafer that needs to be recycled, it can be determined whether the original first transport path of the first target wafer needs to be adjusted.

[0077] Step 303: If yes, then according to the newly determined first transmission path, generate a new scheduling action sequence, and transmit the first target wafer to the source site according to the newly generated scheduling action sequence.

[0078] If it is determined that the original first transmission path of the first target wafer needs to be adjusted, a new transmission path can be created to transmit the wafer back to the source site for recycling; if it is determined that the original first transmission path of the first target wafer does not need to be adjusted, the wafer can continue to be transmitted to the destination site according to the original first transmission path.

[0079] Step 304: If not, proceed with the process according to the original first transmission path and transmit the first target wafer to the corresponding destination site.

[0080] In this embodiment of the invention, the first target wafer can be transmitted to the source site according to the newly generated scheduling action sequence and the newly determined first transmission path, or the first target wafer can be transmitted to the destination site for recycling according to the original first transmission path.

[0081] In summary, in this embodiment of the invention, when a stop command is received for a target process task, the first target wafer requiring a stop operation within that task can be identified. Based on the current transport position and process state of the first target wafer, it is intelligently determined whether the transport path of the first target wafer needs to be adjusted, and the first target wafer is then recycled to the corresponding destination or source site. Using this method, only one button press by the operator is required to recycle the wafer associated with the selected process task to the destination or source site. This process requires no human intervention, automating the wafer recycling function. This method intelligently adjusts the wafer transport path based on the wafer state for wafer recycling and can transport the wafer back to the source site, reducing chip loss risk. Furthermore, when multiple tasks are running simultaneously on the machine, only wafers from one or a few tasks can be recycled, while the execution of other tasks remains unaffected, increasing equipment capacity.

[0082] Reference Figure 4 This diagram illustrates a flowchart of another target process task stopping method according to an embodiment of the present invention, applied to semiconductor process equipment, and specifically includes the following steps:

[0083] Step 401: During the execution of a process task, in response to a stop command for the target process task, determine the first target wafer in the target process task that needs to be stopped.

[0084] Semiconductor process equipment can execute one or more process tasks simultaneously. A stop command can be an operation command applied to function keys. In this embodiment of the invention, a one-click wafer recovery function is provided that can recover wafers from only one or a few process tasks. For example, when it is necessary to debug the process performance of one or more ongoing process tasks, the user can press the one-click wafer recovery function button among the multiple function keys on the equipment. The equipment software responds to this operation by displaying the task IDs of the multiple currently executing process tasks, from which the user can select. After selection, the one-click task stop function can be directly executed (the equipment stops after completing the currently executing action and does not continue with subsequent actions). That is, in response to a recovery command for a target process task, after the currently executing action in the equipment is completed, there is no need to switch the equipment state to a paused state, no need to perform equipment stop operations, and no need to perform equipment resume operations; the software system can be directly notified that the current action has stopped.

[0085] In practice, the wafers in the semiconductor process equipment have corresponding task IDs associated with the process tasks. The wafer associated with the target process task can be determined based on the consistency between the task ID selected by the user for stopping / recycling and the task ID associated with the wafer. Furthermore, the first target wafer that needs to be recycled can be determined from the wafers associated with the target process task.

[0086] In one example, the determination of whether the wafer needs to be recycled may be based on its current transport location. For step 401, the following steps may be performed:

[0087] Sub-step S11: If the wafer in the target process task has left the source site and has not reached the destination site, then the wafer is determined to be the first target wafer.

[0088] During the execution of a process task, the wafer leaves the source site and is transferred back to the destination site after the process is completed, which indicates that the wafer has completed the process task. All wafers in the equipment can be traversed, including all wafers in the loading / unloading chamber and all wafers that have left the source site. Based on the current transfer position of the wafer, the first target wafer that can participate in the calculation to generate a new scheduling action sequence is determined.

[0089] Specifically, if a wafer has left the source site but has not yet reached the destination site, it can be determined that the wafer is the first target wafer and can be set to participate in the calculation; if the wafer has not left the source site, it can be determined that the wafer is not the first target wafer and can be set not to participate in the calculation; if the wafer has left the source site and has reached the destination site, it can be determined that the wafer is not the first target wafer and can be set not to participate in the calculation.

[0090] Wafers not involved in computation remain at their current location as the semiconductor process equipment executes subsequent actions according to the newly generated scheduling sequence. That is, in the target process task, wafers that have not left the source site remain at the source site and cannot be transferred to the process chamber for processing. Wafers that have left the source site and arrived at the destination site remain at the destination site.

[0091] Step 402: Determine whether to adjust the original first transmission path of the first target wafer based on the current transmission position and current process status of the first target wafer.

[0092] Semiconductor process equipment may include process chambers, vacuum robots, loading chambers, and atmospheric robots. Regarding step 402, the following steps may be performed:

[0093] Sub-step S21: If the current transmission position of the first target wafer is a vacuum robot station and the current process state is an incomplete process state, then determine to adjust the original first transmission path of the first target wafer; create a transmission path from the vacuum robot station through the loading chamber station and back to the source station to obtain the newly determined first transmission path.

[0094] Sub-step S22: If the current transmission position of the first target wafer is a loading chamber site and the current process state is an incomplete process state, then determine to adjust the original first transmission path of the first target wafer; create a transmission path from the loading chamber site to the source site to obtain the newly determined first transmission path.

[0095] Sub-step S23: If the current transmission location of the first target wafer is an atmospheric robot station and the current process state is an incomplete process state, then determine to adjust the original first transmission path of the first target wafer; create a transmission path from the atmospheric robot station to the source station to obtain the newly determined first transmission path.

[0096] In the newly determined first transmission path, the source station, loading chamber station, vacuum robot station, and atmospheric robot station are respectively the source station, loading chamber station, vacuum robot station, and atmospheric robot station in the original first transmission path. This ensures that when the first target wafer is transmitted back to the source station, it follows the principle of returning along the original path.

[0097] In one optional embodiment, the trajectory of the first target wafer can be recorded, and a new transmission path can be dynamically created according to the current transmission position and current process state of the first target wafer, following pre-defined rules. The pre-defined rules may include:

[0098] 1) If the wafer is at the PMA or PMB site, the current wafer transfer path and process menu can be maintained and the wafer can be transferred to the destination site.

[0099] 2) If the wafer is at the VTR site and the process has been completed, the current wafer transfer path and process menu can be maintained and the wafer can be transferred to the destination site.

[0100] 3) If the wafer is at the VTR site and no process is being performed, a new transport path can be created: Current site -> Wafer via loading chamber site -> Source site;

[0101] 4) If the wafer is at an LLA or LLB site and no process has been performed, a new transport path can be created: current site -> source site;

[0102] 5) If the wafer is at an LLA or LLB site and the process has been completed, the current wafer transfer path and process menu can be maintained and the wafer can be transferred to the destination site.

[0103] 6) If the wafer is at the ATR site and no process is being performed, a new transport path can be created: current site -> source site.

[0104] In this embodiment of the invention, if the current transfer position of the first target wafer is a process chamber station, then it is determined that the original first transfer path and first process menu of the first target wafer will not be adjusted. If the current transfer position of the first target wafer is a vacuum robot station and the current process state is a completed process state, then it is determined that the original first transfer path and first process menu of the first target wafer will not be adjusted. If the current transfer position of the first target wafer is a loading chamber station and the current process state is a completed process state, then it is determined that the original first transfer path and first process menu of the first target wafer will not be adjusted.

[0105] In an optional embodiment, after determining whether to adjust the original first transmission path of the first target wafer based on its current transmission position and current process state, the method further includes:

[0106] If the newly determined first transmission path does not include a process chamber site, delete the original first process menu of the corresponding first target wafer.

[0107] If the newly created first transfer path for the first target wafer does not include a process chamber site, it means that the first target wafer does not need to undergo processing, and the original first process menu of the corresponding first target wafer can be deleted.

[0108] Step 403: If yes, then identify the second target wafer affected in other process tasks besides the target process task.

[0109] The second target wafer mentioned above refers to wafers that have not reached the destination site in other process tasks. Wafers that have not reached the destination site include wafers that have not left the source site, as well as wafers that have left the source site but have not reached the destination site.

[0110] When a portion of the wafers in a target process task are recycled, it may affect wafers in other parallel process tasks. This primarily affects wafers in other process tasks that have not yet reached their destination site, i.e., the second target wafer.

[0111] In this embodiment of the invention, the second target wafer can also participate in the calculation to generate a new scheduling action sequence. Specifically, if a wafer in other process tasks has not yet reached the destination site, it can be determined that this wafer is the second target wafer, and it can be set to participate in the calculation; if a wafer in other process tasks has already reached the destination site, it can be determined that this wafer is not the second target wafer, and it can be set not to participate in the calculation. Wafers not participating in the calculation remain at their current position as the semiconductor process equipment executes subsequent actions according to the newly generated scheduling action sequence. That is, wafers in other process tasks that have already reached the destination site continue to remain at the destination site.

[0112] While the first target wafer is subsequently recovered according to the newly generated scheduling action sequence, the process task can continue to be executed on the second target wafer. For the second target wafer, there is no need to adjust the corresponding second transport path and second process menu.

[0113] Reference Figure 5 The diagram shown is a flowchart of creating a transmission path according to an embodiment of the present invention. The specific process includes:

[0114] 1. Traverse all wafers involved in the calculation (i.e., the first target wafer and the second target wafer);

[0115] 2. Determine if the task ID associated with the wafer is the task ID that the user selected to stop / recycle;

[0116] 3. If the task ID associated with the wafer is the task ID selected by the user (first target wafer), a new transmission path can be created based on the pre-defined wafer dynamic creation rules; if the task ID associated with the wafer is not the task ID selected by the user (second target wafer), a new transmission path does not need to be set.

[0117] 4. Determine if the traversal has ended;

[0118] 5. If the traversal is complete, the process ends; if the traversal is not complete, the process continues to traverse the wafers involved in the calculation.

[0119] Step 404: Obtain the original first transfer path and first process menu of the first target wafer without adjustment.

[0120] The first target wafer includes wafers that need to have their original first transmission path adjusted and wafers that do not need to have their original first transmission path adjusted. The original first transmission path and the original first process menu of the first target wafer that does not need to be adjusted can be obtained.

[0121] Step 405: Based on the newly determined first transmission path, without adjusting the original first transmission path and first process menu of the first target wafer, and the second transmission path and second process menu of the second target wafer, generate a new scheduling action sequence.

[0122] In this embodiment of the invention, the new scheduling action sequence can be generated based on the newly determined first transmission path, without adjusting the original first transmission path and first process menu of the first target wafer, and the second transmission path and second process menu of the second target wafer. Other wafers besides the first target wafer and the second target wafer do not participate in the calculation to determine the new scheduling action sequence.

[0123] Step 406: Transmit the first target wafer to the source site according to the newly generated scheduling action sequence.

[0124] Step 407: If not, proceed with the process according to the original first transmission path and transmit the first target wafer to the corresponding destination site.

[0125] While the semiconductor process equipment recovers the first target wafer in the target process task, the second target wafer in other process tasks can continue to perform the process task.

[0126] To enable those skilled in the art to better understand steps 401 to 407 of the embodiments of the present invention, an example is provided below:

[0127] Reference Figure 6 The diagram shown is a flowchart of a target process task stopping method according to an embodiment of the present invention. The specific process includes:

[0128] 1. Users can select the one-click wafer take-up function in semiconductor process equipment. Under this one-click wafer take-up function, the currently executing process task can be stopped with one click. Specifically, it means that after the currently executing action in the equipment is completed, there is no need to switch the equipment status to the paused state, no need to perform equipment stop operation, no need to perform equipment resume operation, and the software system can be directly notified that the current action has stopped.

[0129] 2. After the equipment completes the above-mentioned stop operation, the wafers that need to participate in the calculation to determine the new scheduling action sequence can be identified. Based on the consistency between the task ID of the one-click stop process task and the task ID associated with the wafer, the first target wafer associated with the selected task, which has left the source site but has not reached the destination site, and the second target wafer not associated with the selected task, which has not reached the destination site and has not completed its process task, can be identified. The first and second target wafers are then determined as the wafers that need to participate in the calculation. (Refer to...) Figure 7 The diagram illustrates a flowchart of an embodiment of the present invention for setting a wafer to participate in the calculation to generate a new action sequence. The process involves traversing all wafers in the device, including all wafers in the loading / unloading chamber and all wafers that have already departed. If the task ID associated with a wafer is the selected task ID, and the wafer has left the source station but has not yet reached the destination station, then this wafer is set to participate in the calculation. If the task ID associated with a wafer is the selected task ID, and the wafer has not left the source station, then this wafer is set not to participate in the calculation. If the task ID associated with a wafer is the selected task ID, and the wafer has left the source station and reached the destination station, then this wafer is set not to participate in the calculation. If the task ID associated with a wafer is not the selected task ID, and the wafer has not reached the destination station, then this wafer is set to participate in the calculation. If the task ID associated with a wafer is not the selected task ID, and the wafer has reached the destination station, then this wafer is set not to participate in the calculation. After traversing all wafers in the device, the wafers in the device can be divided into two categories: one category that can participate in the calculation, and the other category that cannot participate in the calculation.

[0130] 3. Traverse all first and second target wafers that can participate in the calculation. Based on the current transfer position and current process state of the first target wafer, dynamically create a new transfer path according to pre-set rules. The transfer path of the second target wafer remains unchanged.

[0131] 4. Based on the newly determined transfer path of the first target wafer, the transfer path and process menu of the first target wafer without adjustment, and the transfer path and process menu of the second target wafer, calculate and generate a new scheduling action sequence.

[0132] 5. While the first target wafer is being recycled according to the new scheduling sequence, the second target wafer can continue to execute process tasks according to the new scheduling sequence.

[0133] In summary, in this embodiment of the invention, when a stop command is received for a target process task, the first target wafer requiring a stop operation within that task can be identified. Based on the current transport position and process status of the first target wafer, it is intelligently determined whether the transport path and process menu of the first target wafer need to be adjusted, and the first target wafer is then recycled to the corresponding destination or source site. Using this method, only one button press by the operator is required to stop the task execution and recycle the wafer associated with the selected process task to the destination or source site. This process requires no human intervention, automating the wafer recycling function. This method intelligently adjusts the wafer transport path and process menu based on the wafer status for wafer recycling and can transport the wafer back to the source site, reducing chip risk. Furthermore, when multiple tasks are running simultaneously on the machine, only wafers from one or a few tasks can be recycled, while the execution of other tasks remains unaffected, improving equipment throughput. After the wafer completes the process in the process chamber, it can be immediately removed, ensuring the performance specified by the process specifications.

[0134] In this application, the device stops after completing the currently executing action, determines the wafers that can participate in the calculation, and creates a new transmission path according to the dynamic creation rules. The wafers perform calculations based on the new transmission path to obtain a new action sequence. All wafers participating in the calculation calculate their corresponding action sequences and execute the action sequences to complete the wafer recycling scheme of this application.

[0135] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0136] Reference Figure 8 The diagram illustrates a structural block diagram of a semiconductor process apparatus according to an embodiment of the present invention. The semiconductor process apparatus 801 includes:

[0137] The controller 8011 is configured to, during the execution of a process task, respond to a stop command for the target process task, determine a first target wafer in the target process task that requires a stop operation; determine whether to adjust the original first transmission path of the first target wafer based on the current transmission position and current process state of the first target wafer; if yes, generate a new scheduling action sequence based on the newly determined first transmission path, and transmit the first target wafer to the source site according to the newly generated scheduling action sequence; if no, perform the process according to the original first transmission path and transmit the first target wafer to the corresponding destination site.

[0138] In an optional embodiment of the present invention, the controller is configured to determine a second target wafer affected in other process tasks besides the target process task; the second target wafer is a wafer in the other process tasks that has not reached the destination site; obtain the original first transmission path and first process menu of the first target wafer without adjustment; and generate a new scheduling action sequence based on the newly determined first transmission path, the original first transmission path and first process menu of the first target wafer without adjustment, and the second transmission path and second process menu of the second target wafer.

[0139] In an optional embodiment of the present invention, the controller is further configured to delete the original first process menu of the corresponding first target wafer if the newly determined first transmission path does not include a process chamber site.

[0140] In an optional embodiment of the present invention, the controller is configured to determine that the wafer is the first target wafer if the wafer in the target process task has left the source site and has not reached the destination site.

[0141] In an optional embodiment of the present invention, the semiconductor process equipment includes a vacuum robot and a loading chamber. The controller is configured to, if the current transfer position of the first target wafer is a vacuum robot station and the current process state is an incomplete process state, determine to adjust the original first transfer path of the first target wafer; create a transfer path from the vacuum robot station through the loading chamber station back to the source station, and obtain the newly determined first transfer path.

[0142] In an optional embodiment of the present invention, the semiconductor process equipment includes a loading chamber, and the controller is configured to, if the current transfer position of the first target wafer is a loading chamber site and the current process state is an incomplete process state, determine to adjust the original first transfer path of the first target wafer; and create a transfer path from the loading chamber site to the source site to obtain a newly determined first transfer path.

[0143] In an optional embodiment of the present invention, the semiconductor process equipment includes an atmospheric robot, and the controller is configured to, if the current transmission position of the first target wafer is an atmospheric robot station and the current process state is an incomplete process state, determine to adjust the original first transmission path of the first target wafer; create a transmission path from the atmospheric robot station to the source station, and obtain a newly determined first transmission path.

[0144] In summary, in this embodiment of the invention, when a stop command is received for a target process task, the first target wafer requiring a stop operation within that task can be identified. Based on the current transport position and process status of the first target wafer, it is intelligently determined whether the transport path and process menu of the first target wafer need to be adjusted, and the first target wafer is then recycled to the corresponding destination or source site. Using this method, only one button press by the operator is required to recycle the wafer associated with the selected process task to the destination or source site. This process requires no human intervention, automating the wafer recycling function. This method intelligently adjusts the wafer transport path and process menu based on the wafer status for wafer recycling and can transport the wafer back to the source site, reducing chip loss risk. Furthermore, when multiple tasks are running simultaneously on the machine, only wafers from one or a few tasks can be recycled, while the execution of other tasks remains unaffected, improving equipment productivity.

[0145] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0146] This invention also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described target process task stop method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0147] This invention also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described target process task stopping method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0148] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0149] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0150] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0151] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0152] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0153] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0154] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0155] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0156] The present invention has provided a detailed description of a target process task stopping method and a semiconductor process equipment. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for stopping a target process task, characterized in that, Applied to semiconductor process equipment, the method includes: During the execution of a process task, in response to a stop command for the target process task, the first target wafer in the target process task that needs to be stopped is determined; the stop command is generated when process performance debugging is required for one or more process tasks being executed, and a one-click wafer recovery function is provided to recover wafers in only one or a few process tasks. Based on the current transmission position and current process status of the first target wafer, determine whether to adjust the original first transmission path of the first target wafer; If so, a new scheduling action sequence is generated based on the newly determined first transmission path, and the first target wafer is transmitted to the source site according to the newly generated scheduling action sequence. If not, the process is carried out according to the original first transmission path and the first target wafer is transmitted to the corresponding destination site.

2. The method according to claim 1, characterized in that, The step of generating a new scheduling action sequence based on the newly determined first transmission path includes: Identify a second target wafer that is affected in other process tasks besides the target process task; the second target wafer is a wafer that has not reached the destination site in the other process tasks. Obtain the original first transfer path and first process menu of the first target wafer without adjustment; Based on the newly determined first transmission path, without adjusting the original first transmission path and first process menu of the first target wafer, and the second transmission path and second process menu of the second target wafer, a new scheduling action sequence is generated.

3. The method according to claim 1, characterized in that, After determining whether to adjust the original first transmission path of the first target wafer based on its current transmission position and current process state, the method further includes: If the newly determined first transmission path does not include a process chamber site, delete the original first process menu of the corresponding first target wafer.

4. The method according to claim 1, characterized in that, The process of determining the first target wafer that needs to be stopped in the target process task includes: If the wafer in the target process task has left the source site and has not reached the destination site, then the wafer is determined to be the first target wafer.

5. The method according to claim 1, characterized in that, The semiconductor process equipment includes a vacuum robot and a loading chamber. The step of determining whether to adjust the original first transport path of the first target wafer based on its current transport position and current process state includes: If the current transmission position of the first target wafer is a vacuum robot station and the current process state is an incomplete process state, then it is determined to adjust the original first transmission path of the first target wafer. A transmission path is created from the vacuum manipulator station, through the loading chamber station, and back to the source station, resulting in the newly determined first transmission path.

6. The method according to claim 1, characterized in that, The semiconductor process equipment includes a loading chamber. The step of determining whether to adjust the original first transport path of the first target wafer based on its current transport position and current process state includes: If the current transmission location of the first target wafer is a loading chamber site and the current process state is an incomplete process state, then it is determined to adjust the original first transmission path of the first target wafer. A transmission path is created from the loading chamber site to the source site, resulting in the newly determined first transmission path.

7. The method according to claim 1, characterized in that, The semiconductor process equipment includes an atmospheric robotic arm. The step of determining whether to adjust the original first transport path of the first target wafer based on its current transport position and current process state includes: If the current transmission location of the first target wafer is an atmospheric robot station and the current process status is an incomplete process status, then it is determined to adjust the original first transmission path of the first target wafer. A transmission path is created from the atmospheric manipulator station to the source station, resulting in the newly determined first transmission path.

8. A semiconductor process apparatus, characterized in that, include: The controller is used to, in response to a stop command for a target process task during the execution of a process task, determine the first target wafer in the target process task that needs to be stopped; and determine whether to adjust the original first transmission path of the first target wafer based on the current transmission position and current process state of the first target wafer. If yes, a new scheduling action sequence is generated based on the newly determined first transmission path, and the first target wafer is transmitted to the source site according to the newly generated scheduling action sequence; if no, the process is performed according to the original first transmission path and the first target wafer is transmitted to the corresponding destination site. The stop command is generated when process performance debugging is required for one or more ongoing process tasks, and provides a one-click wafer recovery function to recover wafers from only one or a few process tasks.

9. The semiconductor process equipment according to claim 8, characterized in that, The controller is configured to determine a second target wafer affected in other process tasks besides the target process task; the second target wafer is a wafer in the other process tasks that has not reached the destination site; Obtain the original first transmission path and first process menu of the first target wafer without adjustment; based on the newly determined first transmission path, the original first transmission path and first process menu of the first target wafer without adjustment, and the second transmission path and second process menu of the second target wafer, generate a new scheduling action sequence.

10. The semiconductor process equipment according to claim 8, characterized in that, The controller is further configured to delete the original first process menu of the corresponding first target wafer if the newly determined first transmission path does not include a process chamber site.

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