Method and device for heat dissipation of electronic devices for preventing condensation

Abstract

The present invention provides a method and device for heat dissipation of electronic devices for preventing condensation, the method comprising: obtaining a first medium flow in a first pipeline, a second medium flow in a second pipeline, and mixing them in a water tank to form a mixed medium; in response to a cooling signal of the electronic device, obtaining the temperature of the mixed medium and making a judgment; if it is determined that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water tank to the liquid cooling plate to achieve cooling of the electronic device. The present invention provides a method and device for heat dissipation of electronic devices for preventing condensation, by connecting the liquid cooling plate circuit of the electronic device with a cooling medium circulation circuit, and obtaining a mixed medium with a temperature higher than the ambient temperature from the circulation circuit, thereby fundamentally solving the risk of condensation on the liquid cooling plate.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a method and device for heat dissipation of electronic devices for preventing condensation. Background Art

[0002] At present, with the development of micro-electromechanical system technology, the integration and high frequency of electronic devices are constantly improving, the characteristic size is constantly decreasing, the heat generation per unit volume is constantly increasing, and the compact design of the equipment makes heat dissipation more difficult. Therefore, it is urgent to solve the problem of efficient heat dissipation technology. Micro-channel liquid cooling technology is an efficient heat exchange method. Compared with traditional air cooling and large-size pipeline liquid convection heat exchange, the micro-channel has a large heat transfer area under the same volume due to its small channel size, and the heat transfer efficiency and heat transfer coefficient are significantly improved. However, since the micro-channel adopts liquid cooling, if the temperature of the coolant is lower than the ambient temperature, it may cause the surface temperature of the liquid cooling plate to be too low. In the case of high ambient humidity, condensation is very likely to occur on the surface of the liquid cooling plate. Condensation will not only cause corrosion to the material of the liquid cooling plate, but long-term condensation may also breed bacteria, etc., and it is even likely to cause more serious problems such as short circuits to the electronic components it cools.

[0003] Existing anti-condensation methods mostly use dehumidification, blowing, surface heating and coating. However, the dehumidification, blowing and surface heating methods require the additional installation of dehumidifiers, fans or electric heaters and other equipment, while the anti-condensation effect of the coating method is general, and condensation will still appear on the coating surface when the air humidity is high. Summary of the invention

[0004] The present invention provides a heat dissipation method for electronic devices for preventing condensation, so as to solve the problem that the anti-condensation methods in the prior art mostly adopt dehumidification, blowing, surface heating, coating and the like. However, the dehumidification, blowing and surface heating methods require the additional installation of dehumidifiers, fans or electric heaters and other equipment, and the anti-condensation effect of the coating method is general. When the air humidity is high, condensation defects will still appear on the coating surface. By connecting the liquid cooling plate loop of the electronic device with the cooling medium circulation loop, and obtaining a mixed medium with a temperature higher than the ambient temperature from the circulation loop, the risk of condensation on the liquid cooling plate is fundamentally solved.

[0005] The invention also provides an electronic device heat dissipation device for preventing condensation.

[0006] According to a first aspect of the present invention, a method for heat dissipation of electronic devices for preventing condensation is provided, comprising: a first pipeline, a second pipeline, a water storage tank and a liquid cooling plate;

[0007] The first pipeline and the second pipeline form a circulation loop of the cooling medium;

[0008] The water storage tank is respectively connected to the first pipeline, the second pipeline and the liquid cooling plate;

[0009] The liquid cooling plate is provided with electronic components;

[0010] The method comprises: obtaining a first medium flow in the first pipeline and a second medium flow in the second pipeline, and mixing them in the water storage tank to form a mixed medium;

[0011] In response to the cooling signal of the electronic device, obtaining the temperature of the mixed medium and making a judgment;

[0012] If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device.

[0013] According to an embodiment of the present invention, the step of obtaining the first medium flow in the first pipeline, the second medium flow in the second pipeline, and mixing them in the water storage tank to form a mixed medium specifically includes:

[0014] Obtaining the liquid level of the mixed medium in the water storage tank and making a judgment;

[0015] Determining that the liquid level of the mixed medium in the water storage tank is lower than a preset liquid level, continuously obtaining a first medium flow from the first pipeline, and obtaining a second medium flow from the second pipeline;

[0016] When it is determined that the liquid level of the mixed medium in the water storage tank is greater than or equal to a preset liquid level, obtaining the first medium flow from the first pipeline and obtaining the second medium flow from the second pipeline are stopped.

[0017] Specifically, this embodiment provides an implementation method for mixing a mixed medium in the water tank. By obtaining the liquid level height in the water tank, it is convenient to provide sufficient mixed medium for cooling the liquid cooling plate. It is also convenient to replenish the mixed medium in the water tank in time when the liquid level in the water tank is too low.

[0018] According to one embodiment of the present invention, it also includes: a cooler and a user end;

[0019] The first pipeline is respectively connected to the liquid outlet of the cooler and the liquid inlet of the user end;

[0020] The second pipeline is respectively connected to the liquid outlet of the user end and the liquid inlet of the cooler.

[0021] Specifically, this embodiment provides an implementation method of a cooler and a user end, by connecting the liquid cooling plate loop of the electronic device with the cooling medium circulation loop of the cooler and the user end, and obtaining a mixed medium with a temperature higher than the ambient temperature from the circulation loop, thereby fundamentally solving the risk of condensation on the liquid cooling plate.

[0022] In a possible implementation, the user end is a device in the water mechanical equipment that needs to be cooled. By coupling the anti-condensation electronic device heat dissipation system with the cooling system of the user end, and using the fresh water in the fresh water pipeline as the cooling water for the micro-channel liquid cooling plate, there is no need to design a separate cooling circuit for the micro-channel liquid cooling plate. The functional integration design of the equipment is realized in the design, making the system simpler and effectively saving the space for cooling equipment on the water mechanical equipment.

[0023] According to an embodiment of the present invention, the step of obtaining the temperature of the mixed medium in response to the cooling signal of the electronic device and making a judgment specifically includes:

[0024] If it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline is increased until the temperature of the mixed medium is higher than the ambient temperature.

[0025] Specifically, this embodiment provides an implementation method for determining that the temperature of the mixed medium is less than or equal to the ambient temperature. When it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, there is a risk of condensation forming on the liquid cooling plate. Therefore, it is necessary to adjust the flow rate of the first medium flow in the first pipeline and / or the flow rate of the second medium flow in the second pipeline accordingly to ensure that the temperature of the mixed medium is higher than the ambient temperature.

[0026] In a possible embodiment, the temperature of the mixed medium is 1 to 2° C. above the ambient temperature.

[0027] According to an embodiment of the present invention, after the step of determining that the temperature of the mixed medium is higher than the ambient temperature, then transferring the mixed medium from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, the method further includes:

[0028] Continuously obtaining the temperature of the mixed medium delivered to the liquid cooling plate and making a judgment;

[0029] If it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline is increased, and the mixed medium is continuously delivered to the liquid cooling plate;

[0030] If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline and the flow rate of the second medium flow obtained from the second pipeline are maintained, and the mixed medium is continuously delivered to the liquid cooling plate.

[0031] Specifically, this embodiment provides an implementation method for continuously obtaining the temperature of the mixed medium delivered to the liquid cooling plate and making a judgment. After the mixed medium is delivered to the liquid cooling plate, the temperature of the delivered mixed medium needs to be continuously obtained. When it is identified that the temperature of the mixed medium is higher than the ambient temperature, the flow rate of the first medium flow in the first pipeline and / or the flow rate of the second medium flow in the second pipeline is adjusted in time to achieve dynamic adjustment of the temperature of the mixed medium and avoid the formation of condensation on the surface of the liquid cooling plate.

[0032] According to an embodiment of the present invention, after the step of determining that the temperature of the mixed medium is higher than the ambient temperature, then transferring the mixed medium from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, the method further includes:

[0033] Obtaining a temperature difference parameter between the temperature of the mixed medium delivered to the liquid cooling plate and the ambient temperature, and making a judgment;

[0034] If it is determined that the temperature value corresponding to the temperature difference parameter is higher than a preset temperature value, the flow rate of the first medium flow obtained from the first pipeline is increased, and / or the flow rate of the second medium flow obtained from the second pipeline is reduced, and the mixed medium is continuously delivered to the liquid cooling plate;

[0035] If it is determined that the temperature value corresponding to the temperature difference parameter is within a preset temperature value range, the flow rate of the first medium flow obtained from the first pipeline and the flow rate of the second medium flow obtained from the second pipeline are maintained, and the mixed medium is continuously delivered to the liquid cooling plate.

[0036] Specifically, this embodiment provides an implementation method for judging the temperature difference parameter between the mixed medium temperature of the liquid cooling plate and the ambient temperature. After the mixed medium is transported to the liquid cooling plate, it is necessary to continuously obtain the temperature of the transported mixed medium. If the temperature of the mixed medium is higher than the ambient temperature and the temperature difference with the ambient temperature is too large, the cooling effect of the liquid cooling plate cannot be achieved. Therefore, it is necessary to adjust the flow rate of the first medium flow and / or the second medium flow.

[0037] According to an embodiment of the present invention, it further comprises: a circulation pump, wherein the circulation pump is arranged on a path connecting the liquid outlet of the water storage tank and the liquid cooling plate;

[0038] The step of determining that the temperature of the mixed medium is higher than the ambient temperature, then transferring the mixed medium from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, specifically includes:

[0039] Continuously obtaining the operating parameters of the circulation pump and making judgments;

[0040] If it is determined that the circulating pump is in a stopped operation state or a faulty operation state, the second pipeline is closed, the first medium flow is continuously obtained from the first pipeline, and the mixed medium is transported to the liquid cooling plate.

[0041] Specifically, this embodiment provides an implementation of a circulation pump, and the flow of the mixed medium is achieved by setting up the circulation pump.

[0042] In a possible implementation, the operating parameters of the circulation pump are continuously obtained. When the circulation pump fails and cannot provide circulation power for the mixed medium to the entire system, the second pipeline is closed and the first pipeline is continuously opened. The cooling medium is continuously obtained through the cooling medium water inlet pipeline to achieve cooling of the electronic components on the liquid cooling plate, thereby avoiding the problem of failure of the electronic component cooling system due to damage to the circulation pump.

[0043] It should be noted that, in the present embodiment, the first pipeline is kept open and the second pipeline is closed. Since the pressure in the first pipeline is greater than the pressure in the second pipeline, that is, there is a pressure difference between the first pipeline and the second pipeline, the cooling medium in the first pipeline will continue to flow to the water tank under the action of pressure, and then enter the liquid cooling plate to realize automatic cooling of the electronic components, thereby realizing cooling of the electronic components on the liquid cooling plate when the circulating pump cannot work normally, and the cooling medium flowing out of the liquid cooling plate enters the second pipeline for circulation.

[0044] In a possible implementation manner, it also includes: a fifth pipeline, a third valve body, a fourth valve body and a fifth valve body; one end of the fifth pipeline is connected to the first pipeline, the other end of the fifth pipeline is connected to the liquid cooling plate, the third valve body is arranged between the circulation pump and the water tank, the fourth valve body is arranged between the circulation pump and the liquid cooling plate, and the fifth valve body is arranged in the fifth pipeline.

[0045] In a possible implementation manner, when the circulating pump stops running or the flow rate is lower than 70% of the preset flow rate, the circulating pump is deemed to be in a faulty state. At this time, the second valve body is closed, the second pipeline stops supplying cooling medium to the water tank, the third valve body and the fourth valve body are switched from an open state to a closed state, and the fifth valve body is switched from a closed state to an open state. After this adjustment, the cooling medium in the first pipeline flows into the liquid cooling plate through the fifth pipeline to ensure the cooling of the electronic components on the liquid cooling plate. At this time, the maintenance personnel can maintain the circulating pump. If the water tank also fails, the first valve body can also be closed so that the water tank can be maintained at the same time.

[0046] According to one embodiment of the present invention, a plurality of micro channels for the mixed medium to flow are arranged inside the liquid cooling plate.

[0047] Specifically, this embodiment provides an implementation method of a liquid cooling plate. Micro-channel liquid cooling technology is an efficient heat exchange method. Compared with traditional air cooling and large-size pipe liquid convection heat exchange, the micro-channel has a large heat transfer area under the same volume due to its small channel size, and the heat exchange efficiency and heat exchange coefficient are significantly improved. However, since the micro-channel adopts liquid cooling, if the temperature of the coolant is lower than the ambient temperature, it is possible to cause the surface temperature of the liquid cooling plate to be too low. In the case of high ambient humidity, condensation is very likely to occur on the surface of the liquid cooling plate. Condensation will not only cause corrosion to the material of the liquid cooling plate, but long-term condensation may also breed bacteria, etc., and it is even likely to cause more serious problems such as short circuits to the electronic components it cools.

[0048] In a possible implementation, since the temperature of the cooling water flowing into the microchannels of the liquid cooling plate is higher than the ambient temperature, the microchannel liquid cooling plate will not have the risk of condensation, thereby fundamentally preventing the occurrence of condensation.

[0049] According to one embodiment of the present invention, it further comprises: a third pipeline and a fourth pipeline;

[0050] The third pipeline is connected to the cooler to form a passage for seawater to enter the cooler;

[0051] The fourth pipeline is connected to the cooler to form a passage for the seawater to be discharged from the cooler.

[0052] Specifically, this embodiment provides an implementation method of a third pipeline and a fourth pipeline, wherein the third pipeline forms a passage for seawater to enter the cooler, and the fourth pipeline forms a pipeline for seawater to discharge from the cooler. By utilizing the cooler of water-based mechanical equipment, such as a ship, the heat of the heat source is transferred to the ship cooler through cooling fresh water, and is uniformly cooled through external seawater, thereby reducing the number of coolers in the micro-channel liquid cooling system and achieving a streamlined design in system design.

[0053] In a possible implementation, the existing cooling fresh water circuit on the ship is used to draw a stream of cooling fresh water with a lower temperature from the fresh water inlet passage, and at the same time draw a stream of fresh water with a higher temperature from the fresh water return passage, and the two streams of high and low temperature fresh water are fully mixed in the water storage tank, and finally cooling water with a temperature 1 to 2°C higher than the ambient temperature is obtained. The micro-circulation pump draws cooling water from the water storage tank and supplies it to the micro-channel liquid cooling plate. The liquid cooling plate with micro-channels fits tightly with the heat source, and finally achieves the purpose of cooling the heat source. The cooling water after absorbing the heat from the heat source flows out from the outlet of the micro-channel in the liquid cooling plate and returns to the fresh water return pipeline, thereby achieving the purpose of transferring the heat from the heat source to the fresh water circuit. Subsequently, the water in the fresh water circuit will transfer the heat to the external seawater through the ship's own cooler, thereby achieving the final heat extraction.

[0054] It should be noted that since the cooling water returns to the fresh water loop, the heat is eventually transferred to the external seawater by the ship's own cooler. Therefore, there is no need to set up a separate radiator for the micro-channel liquid cooling system, thereby achieving a functional integration design in the overall structure.

[0055] According to a second aspect of the present invention, a heat dissipation device for electronic devices for preventing condensation is provided, comprising: an acquisition module, a response module and an execution module;

[0056] The acquisition module is used to acquire the first medium flow in the first pipeline and the second medium flow in the second pipeline, and mix them in the water storage tank to form a mixed medium;

[0057] The response module is used to obtain the temperature of the mixed medium and make a judgment in response to the cooling signal of the electronic device;

[0058] The execution module is used to determine that the temperature of the mixed medium is higher than the ambient temperature, and then the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device.

[0059] The above one or more technical solutions in the present invention have at least one of the following technical effects: the present invention provides a method and device for heat dissipation of electronic devices for preventing condensation, which connects the liquid cooling plate loop of the electronic device with the cooling medium circulation loop, and obtains a mixed medium with a temperature higher than the ambient temperature from the circulation loop, thereby fundamentally solving the risk of condensation on the liquid cooling plate.

[0060] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0062] Figure 1 It is a schematic flow chart of a heat dissipation method for electronic devices for preventing condensation provided by the present invention;

[0063] Figure 2 This is one of the schematic diagrams of the arrangement relationship of various components in the heat dissipation method for electronic devices for preventing condensation provided by the present invention;

[0064] Figure 3This is the second schematic diagram of the arrangement relationship of various components in the heat dissipation method for electronic devices for preventing condensation provided by the present invention;

[0065] Figure 4 The figure is a schematic diagram of the arrangement of the heat dissipation device for electronic devices for preventing condensation provided by the present invention.

[0066] Reference numerals:

[0067] 10. Cooler; 11. First pipeline; 12. Second pipeline; 13. Third pipeline; 14. Fourth pipeline;

[0068] 20. User end;

[0069] 30. Water storage tank; 31. Liquid level gauge;

[0070] 40. Liquid cooling plate;

[0071] 50. first valve body; 51. first temperature sensor; 52. first flow sensor;

[0072] 60. Second valve body; 61. Second temperature sensor; 62. Second flow sensor;

[0073] 80. Control module;

[0074] 90. Circulation pump; 91. Third temperature sensor; 92. Third flow sensor;

[0075] 100, acquisition module; 110, response module; 120, execution module. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0077] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0078] In some specific embodiments of the present invention, Figures 1 to 3 As shown, the present solution provides a heat dissipation method for electronic devices for preventing condensation, comprising: a first pipeline 11, a second pipeline 12, a water storage tank 30 and a liquid cooling plate 40; the first pipeline 11 and the second pipeline 12 form a circulation loop of the cooling medium; the water storage tank 30 is respectively connected to the first pipeline 11, the second pipeline 12 and the liquid cooling plate 40; and the electronic devices are arranged on the liquid cooling plate 40.

[0079] The method comprises: obtaining a first medium flow in a first pipeline 11 and a second medium flow in a second pipeline 12, and mixing them in a water storage tank 30 to form a mixed medium;

[0080] Responding to the cooling signal of the electronic device, obtaining the temperature of the mixed medium and making a judgment;

[0081] If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank 30 to the liquid cooling plate 40 to achieve cooling of the electronic components.

[0082] In detail, the present invention provides a heat dissipation method for electronic devices for preventing condensation, which is used to solve the problem that the anti-condensation methods in the prior art mostly adopt dehumidification, blowing, surface heating, coating and the like. However, the dehumidification, blowing and surface heating methods require the additional installation of dehumidifiers, fans or electric heaters and other equipment, and the anti-condensation effect of the coating method is general. When the air humidity is high, condensation defects will still appear on the coating surface. By connecting the liquid cooling plate 40 circuit of the electronic device to the cooling medium circulation circuit, and obtaining a mixed medium with a temperature higher than the ambient temperature from the circulation circuit, the risk of condensation on the liquid cooling plate 40 is fundamentally solved.

[0083] In some possible embodiments of the present invention, the step of obtaining the first medium flow in the first pipeline 11 and the second medium flow in the second pipeline 12 and mixing them in the water storage tank 30 to form a mixed medium specifically includes:

[0084] Obtaining the liquid level of the mixed medium in the water storage tank 30 and making a judgment;

[0085] When it is determined that the liquid level of the mixed medium in the water storage tank 30 is lower than the preset liquid level, the first medium flow is continuously obtained from the first pipeline 11, and the second medium flow is continuously obtained from the second pipeline 12;

[0086] When it is determined that the liquid level of the mixed medium in the water storage tank 30 is greater than or equal to the preset liquid level, the acquisition of the first medium flow from the first pipeline 11 and the acquisition of the second medium flow from the second pipeline 12 are stopped.

[0087] Specifically, this embodiment provides an implementation method for mixing a mixed medium in a water tank 30. By obtaining the liquid level height in the water tank 30, it is convenient to provide sufficient mixed medium for cooling the liquid cooling plate 40. It is also convenient to replenish the mixed medium into the water tank 30 in time when the liquid level in the water tank 30 is too low.

[0088] In some possible embodiments of the present invention, the present invention further includes: a cooler 10 and a user end 20 .

[0089] The first pipeline 11 is connected to the liquid outlet of the cooler 10 and the liquid inlet of the user end 20 respectively.

[0090] The second pipeline 12 is connected to the liquid outlet of the user end 20 and the liquid inlet of the cooler 10 respectively.

[0091] Specifically, this embodiment provides an implementation method of a cooler 10 and a user end 20, by connecting the liquid cooling plate 40 circuit of the electronic device with the cooling medium circulation circuit of the cooler 10 and the user end 20, and obtaining a mixed medium with a temperature higher than the ambient temperature from the circulation circuit, thereby fundamentally solving the risk of condensation on the liquid cooling plate 40.

[0092] In a possible implementation, the user end 20 is a device that needs to be cooled in the water mechanical equipment. By coupling the anti-condensation electronic device heat dissipation system with the cooling system of the user end 20, and using the fresh water in the fresh water pipeline as the cooling water for the micro-channel liquid cooling plate 40, there is no need to design a separate cooling circuit for the micro-channel liquid cooling plate 40. The functional integration design of the equipment is realized in the design, making the system simpler and effectively saving the space for cooling equipment on the water mechanical equipment.

[0093] In some possible embodiments of the present invention, in response to the cooling signal of the electronic device, the step of obtaining the temperature of the mixed medium and making a judgment specifically includes:

[0094] If it is determined that the mixed medium temperature is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline 11 is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline 12 is increased until the mixed medium temperature is higher than the ambient temperature.

[0095] Specifically, this embodiment provides an implementation method for determining that the temperature of the mixed medium is less than or equal to the ambient temperature. When determining that the temperature of the mixed medium is less than or equal to the ambient temperature, there is a risk of condensation forming on the liquid cooling plate 40. Therefore, it is necessary to adjust the flow rate of the first medium flow in the first pipeline 11 and / or the flow rate of the second medium flow in the second pipeline 12 accordingly to ensure that the temperature of the mixed medium is higher than the ambient temperature.

[0096] In a possible embodiment, the temperature of the mixed medium is 1 to 2° C. above the ambient temperature.

[0097] In some possible embodiments of the present invention, after determining that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank 30 to the liquid cooling plate 40 to achieve the step of cooling the electronic device, specifically further comprising:

[0098] Continuously obtain the temperature of the mixed medium delivered to the liquid cooling plate 40 and make a judgment;

[0099] If it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline 11 is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline 12 is increased, and the mixed medium is continuously delivered to the liquid cooling plate 40;

[0100] If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline 11 and the flow rate of the second medium flow obtained from the second pipeline 12 are maintained, and the mixed medium is continuously delivered to the liquid cooling plate 40 .

[0101] Specifically, this embodiment provides an implementation method for continuously obtaining the temperature of the mixed medium delivered to the liquid cooling plate 40 and making a judgment. After the mixed medium is delivered to the liquid cooling plate 40, the temperature of the delivered mixed medium needs to be continuously obtained. When it is identified that the temperature of the mixed medium is higher than the ambient temperature, the flow rate of the first medium flow in the first pipeline 11 and / or the flow rate of the second medium flow in the second pipeline 12 is timely adjusted to achieve dynamic adjustment of the temperature of the mixed medium, thereby avoiding the formation of condensation on the surface of the liquid cooling plate 40.

[0102] In some possible embodiments of the present invention, after determining that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank 30 to the liquid cooling plate 40 to achieve the step of cooling the electronic device, specifically further comprising:

[0103] Obtaining a temperature difference parameter between the temperature of the mixed medium delivered to the liquid cooling plate 40 and the ambient temperature, and making a judgment;

[0104] If it is determined that the temperature value corresponding to the temperature difference parameter is higher than the preset temperature value, the flow rate of the first medium flow obtained from the first pipeline 11 is increased, and / or the flow rate of the second medium flow obtained from the second pipeline 12 is reduced, and the mixed medium is continuously delivered to the liquid cooling plate 40;

[0105] If it is determined that the temperature value corresponding to the temperature difference parameter is within the preset temperature value range, the flow rate of the first medium flow obtained from the first pipeline 11 and the flow rate of the second medium flow obtained from the second pipeline 12 are maintained, and the mixed medium is continuously delivered to the liquid cooling plate 40.

[0106] Specifically, this embodiment provides an implementation method for judging the temperature difference parameter between the mixed medium temperature of the liquid cooling plate 40 and the ambient temperature. After the mixed medium is transported to the liquid cooling plate 40, it is necessary to continuously obtain the temperature of the transported mixed medium. If the temperature of the mixed medium is higher than the ambient temperature and the temperature difference with the ambient temperature is too large, the cooling effect of the liquid cooling plate 40 cannot be achieved. Therefore, it is necessary to adjust the flow rate of the first medium flow and / or the second medium flow.

[0107] In some possible embodiments of the present invention, the system further includes: a circulation pump 90 , which is disposed on a path connecting the liquid outlet of the water storage tank 30 and the liquid cooling plate 40 .

[0108] When it is determined that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank 30 to the liquid cooling plate 40 to achieve the step of cooling the electronic device, which specifically includes:

[0109] Continuously obtain the operating parameters of the circulation pump 90 and make judgments;

[0110] If it is determined that the circulating pump 90 is in a stopped operation state or a faulty operation state, the second pipeline 12 is closed, the first medium flow is continuously obtained from the first pipeline 11, and the mixed medium is delivered to the liquid cooling plate 40.

[0111] Specifically, this embodiment provides an implementation of a circulation pump 90 , and the flow of the mixed medium is achieved by setting the circulation pump 90 .

[0112] In a possible implementation, the operating parameters of the circulation pump 90 are continuously obtained. When the circulation pump 90 fails and cannot provide circulation power for the mixed medium for the entire system, the second pipeline 12 is closed and the first pipeline 11 is continuously opened. The cooling medium is continuously obtained through the water inlet pipeline of the cooling medium to achieve cooling of the electronic components on the liquid cooling plate 40, thereby avoiding the problem of failure of the electronic component cooling system due to damage to the circulation pump 90.

[0113] It should be noted that, in the present embodiment, the first pipeline 11 is kept open and the second pipeline 12 is closed. Since the pressure in the first pipeline 11 is greater than the pressure in the second pipeline 12, that is, there is a pressure difference between the first pipeline 11 and the second pipeline 12, the cooling medium in the first pipeline 11 will continue to flow to the water storage tank 30 under the action of pressure, and then enter the liquid cooling plate 40 to realize automatic cooling of the electronic components, thereby realizing cooling of the electronic components on the liquid cooling plate 40 when the circulating pump 90 fails to work normally, and the cooling medium flowing out of the liquid cooling plate 40 enters the second pipeline 12 for circulation.

[0114] In a possible implementation, Figure 2 and Figure 3 As shown, it also includes: a fifth pipeline 15, a third valve body 130, a fourth valve body 140 and a fifth valve body 150; one end of the fifth pipeline 15 is connected to the first pipeline 11, and the other end of the fifth pipeline 15 is connected to the liquid cooling plate 40, the third valve body 130 is arranged between the circulating pump 90 and the water tank 30, the fourth valve body 140 is arranged between the circulating pump 90 and the liquid cooling plate 40, and the fifth valve body 150 is arranged in the fifth pipeline 15.

[0115] In a possible implementation manner, when the circulating pump 90 stops running or the flow rate is lower than 70% of the preset flow rate, the circulating pump 90 is deemed to be in a faulty state. At this time, the second valve body 60 is closed, the second pipeline 12 stops providing cooling medium to the water tank 30, the third valve body 130 and the fourth valve body 140 are switched from an open state to a closed state, and the fifth valve body 150 is switched from a closed state to an open state. After such adjustment, the cooling medium in the first pipeline 11 flows into the liquid cooling plate 40 through the fifth pipeline 15 to ensure the cooling of the electronic components on the liquid cooling plate 40. At this time, the maintenance personnel can maintain the circulating pump 90. If the water tank 30 also fails, the first valve body 50 can also be closed so that the water tank 30 can be maintained at the same time.

[0116] In a possible implementation, the circulating pump 90 draws cooling water that is 1 to 2°C higher than the ambient temperature from the water tank 30 and supplies it to the liquid cooling plate 40 with a micro-channel, so as to cool and dissipate heat of the liquid cooling plate 40 with a micro-channel. The micro-channel liquid cooling plate 40 is tightly fitted to the heat source through a high thermal conductivity interface material, and the heat of the heat source is absorbed and transferred to the cooling water inside the liquid cooling plate 40. The cooling water absorbs heat and its temperature rises, and finally flows out from the outlet of the micro-channel liquid cooling plate 40 and returns to the fresh water return pipeline of the ship.

[0117] In some possible embodiments of the present invention, a plurality of micro channels for the mixed medium to flow are disposed inside the liquid cooling plate 40 .

[0118] Specifically, this embodiment provides an implementation method of a liquid cooling plate 40. The micro-channel liquid cooling heat dissipation technology is an efficient heat exchange method. Compared with traditional air cooling and large-size pipe liquid convection heat exchange, the micro-channel has a large heat transfer area under the same volume due to its small channel size, and the heat exchange efficiency and heat exchange coefficient are significantly improved. However, since the micro-channel adopts liquid cooling, if the temperature of the coolant is lower than the ambient temperature, it is possible to cause the surface temperature of the liquid cooling plate 40 to be too low. In the case of high ambient humidity, condensation is very likely to occur on the surface of the liquid cooling plate 40. Condensation will not only cause corrosion to the material of the liquid cooling plate 40, but long-term condensation may also breed bacteria, etc., and it is even likely to cause more serious problems such as short circuits to the electronic components it cools.

[0119] In a possible implementation manner, since the temperature of the cooling water flowing into the micro-channels of the liquid cooling plate 40 is higher than the ambient temperature, there is no risk of condensation in the micro-channel liquid cooling plate 40, thereby fundamentally preventing the occurrence of condensation.

[0120] In some possible embodiments of the present invention, the system further includes: a third pipeline 13 and a fourth pipeline 14 .

[0121] The third pipeline 13 is connected to the cooler 10 to form a passage for seawater to enter the cooler 10 .

[0122] The fourth pipe 14 is connected to the cooler 10 to form a passage for the seawater to be discharged from the cooler 10 .

[0123] Specifically, this embodiment provides an implementation method of a third pipeline 13 and a fourth pipeline 14, wherein the third pipeline 13 forms a passage for seawater to enter the cooler 10, and the fourth pipeline 14 forms a pipeline for seawater to discharge the cooler 10. By utilizing the cooler 10 on water-based mechanical equipment, such as a ship, the heat of the heat source is transferred to the ship cooler 10 through cooling fresh water, and is uniformly cooled by external seawater, thereby reducing the cooler 10 of the micro-channel liquid cooling system and achieving a streamlined design in system design.

[0124] In a possible implementation, the existing cooling fresh water circuit on the ship is used to draw a stream of cooling fresh water with a lower temperature from the fresh water inlet passage, and at the same time draw a stream of fresh water with a higher temperature from the fresh water return passage, and the two streams of high and low temperature fresh water are fully mixed in the water storage tank 30, and finally obtain cooling water 1 to 2°C higher than the ambient temperature. The micro-circulation pump 90 extracts cooling water from the water storage tank 30 and supplies it to the micro-channel liquid cooling plate 40. The liquid cooling plate 40 with micro-channels fits tightly with the heat source, and finally achieves the purpose of cooling the heat source. The cooling water after absorbing the heat from the heat source flows out from the outlet of the micro-channel in the liquid cooling plate 40 and returns to the fresh water return pipeline, thereby achieving the purpose of transferring the heat from the heat source to the fresh water circuit. Subsequently, the water in the fresh water circuit will transfer the heat to the external seawater through the ship's own cooler 10, thereby achieving the final heat extraction.

[0125] It should be noted that since the cooling water returns to the fresh water loop, the heat is eventually transferred to the external seawater by the ship's own cooler 10. Therefore, there is no need to set up a separate radiator for the micro-channel liquid cooling system, thereby achieving a functional integration design in the overall structure.

[0126] In some specific embodiments of the present invention, Figure 4 As shown, the present solution provides an electronic device heat dissipation device for preventing condensation, including: an acquisition module 100 , a response module 110 and an execution module 120 .

[0127] The acquisition module 100 is used to acquire the first medium flow in the first pipeline 11 and the second medium flow in the second pipeline 12 , and mix them in the water storage tank 30 to form a mixed medium.

[0128] The response module 110 is used to respond to the cooling signal of the electronic device, obtain the temperature of the mixed medium, and make a judgment.

[0129] The execution module 120 is used to determine that the temperature of the mixed medium is higher than the ambient temperature, and then the mixed medium is transported from the water storage tank 30 to the liquid cooling plate 40 to achieve cooling of the electronic device.

[0130] In some specific embodiments of the present invention, Figure 2 and Figure 3As shown, the present solution provides an electronic device heat dissipation system for preventing condensation, comprising: a cooler 10, a user end 20, a first pipeline 11, a second pipeline 12, a water tank 30 and a liquid cooling plate 40; the first pipeline 11 is respectively connected to the liquid outlet of the cooler 10 and the liquid inlet of the user end 20; the second pipeline 12 is respectively connected to the liquid outlet of the user end 20 and the liquid inlet of the cooler 10; the liquid inlet of the water tank 30 is respectively connected to the first pipeline 11 and the second pipeline 12, and the liquid outlet of the water tank 30 is connected to the liquid inlet of the liquid cooling plate 40; the liquid outlet of the liquid cooling plate 40 is connected to the second pipeline 12, and the liquid cooling plate 40 is provided with an electronic device; wherein the first pipeline 11 and the second pipeline 12 form a circulation loop of the cooling medium; a containing space for containing a mixed medium is formed inside the water tank 30, and the mixed medium is a medium formed by mixing the cooling medium in the first pipeline 11 and the second pipeline 12; the temperature of the mixed medium at the liquid outlet of the water tank 30 is higher than the ambient temperature.

[0131] In some possible embodiments of the present invention, it also includes: a first valve body 50 and a second valve body 60; the first valve body 50 is arranged on the path connecting the liquid inlet of the water tank 30 and the first pipeline 11; the second valve body 60 is arranged on the path connecting the liquid inlet of the water tank 30 and the second pipeline 12.

[0132] Specifically, this embodiment provides an implementation of a first valve body 50 and a second valve body 60 . By providing the first valve body 50 and the second valve body 60 , the flow rate of the cooling medium flowing from the first pipeline 11 and the second pipeline 12 to the water storage tank 30 is regulated.

[0133] In some possible embodiments of the present invention, the system further includes: a first temperature sensor 51 , a second temperature sensor 61 , a third temperature sensor 91 , a first flow sensor 52 , a second flow sensor 62 , a third flow sensor 92 and a control module 80 .

[0134] The first temperature sensor 51 and the first flow sensor 52 are respectively connected to the control module 80 , and are disposed on a path where the liquid inlet of the water storage tank 30 is connected to the first pipeline 11 .

[0135] The second temperature sensor 61 and the second flow sensor 62 are respectively connected to the control module 80 , and are arranged on the path where the liquid inlet of the water storage tank 30 is connected to the second pipeline 12 .

[0136] The third temperature sensor 91 and the third flow sensor 92 are respectively connected to the control module 80 , and are disposed on a path connecting the liquid outlet of the water storage tank 30 and the liquid inlet of the liquid cooling plate 40 .

[0137] The control module 80 is connected to the first valve body 50 and the second valve body 60 respectively, and is used to control the opening of the first valve body 50 and the second valve body 60 according to the temperature parameter and the flow parameter.

[0138] Specifically, this embodiment provides an implementation method of a temperature control system. By setting a first temperature sensor 51, a second temperature sensor 61, a third temperature sensor 91, a first flow sensor 52, a second flow sensor 62, a third flow sensor 92 and a control module 80, the opening of the first valve body 50 and the second valve body 60 are adjusted, and the temperature of the mixed medium in the water tank 30 is controlled.

[0139] In a possible implementation manner, branch pipelines are respectively led out from the first pipeline 11 and the second pipeline 12, and each branch pipeline is merged into the water storage tank 30 after passing through a regulating valve. In the water storage tank 30, the colder water in the branch of the fresh water inlet pipeline and the high-temperature water in the branch of the fresh water return pipeline are mixed, and finally a mixed medium with a temperature 1 to 2°C higher than the ambient temperature is obtained.

[0140] In some possible embodiments of the present invention, the liquid level meter 31 is further included. The liquid level meter 31 is connected to the control module 80 and is disposed in the water tank 30 .

[0141] Specifically, this embodiment provides an implementation of a liquid level meter 31 , and the liquid level height in the water tank 30 is obtained by setting the liquid level meter 31 .

[0142] In some specific embodiments of the present invention, the present invention provides a water-based mechanical equipment having the above-mentioned electronic device heat dissipation system for preventing condensation.

[0143] In a possible implementation manner, the water-based mechanical equipment is a ship.

[0144] In a possible implementation manner, the water mechanical equipment is a water working platform.

[0145] In some possible embodiments of the present invention, the cooling medium is fresh water; the first pipeline 11 is a fresh water inlet passage, and the second pipeline 12 is a fresh water return passage.

[0146] Specifically, this embodiment provides an implementation method of a cooling medium, which utilizes the mixing of cold and hot fluids in the fresh water inlet passage and the fresh water return passage to obtain cooling water that is slightly higher than the ambient temperature by 1 to 2°C, which is used to cool the micro-channel liquid cooling plate 40, thereby fundamentally solving the risk of condensation in the micro-channel liquid cooling plate 40.

[0147] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0148] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or mode are included in at least one embodiment or mode of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or modes in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or modes described in this specification and the features of the different embodiments or modes, without contradiction.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and should be included in the scope of the claims of the present invention.

Claims

1. A method for heat dissipation of electronic devices for preventing condensation, characterized in that: include: A first pipeline, a second pipeline, a water storage tank and a liquid cooling plate; The first pipeline and the second pipeline form a circulation loop of the cooling medium; The water storage tank is respectively connected to the first pipeline, the second pipeline and the liquid cooling plate; The liquid cooling plate is provided with electronic components; The method comprises: obtaining a first medium flow in the first pipeline and a second medium flow in the second pipeline, and mixing them in the water storage tank to form a mixed medium; In response to the cooling signal of the electronic device, obtaining the temperature of the mixed medium and making a judgment; If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device; The step of obtaining the first medium flow in the first pipeline and the second medium flow in the second pipeline and mixing them in the water storage tank to form a mixed medium specifically includes: Obtaining the liquid level of the mixed medium in the water storage tank and making a judgment; Determining that the liquid level of the mixed medium in the water storage tank is lower than a preset liquid level, continuously obtaining a first medium flow from the first pipeline, and obtaining a second medium flow from the second pipeline; When it is determined that the liquid level of the mixed medium in the water storage tank is greater than or equal to a preset liquid level, obtaining the first medium flow from the first pipeline and obtaining the second medium flow from the second pipeline are stopped.

2. The method for heat dissipation of electronic devices for preventing condensation according to claim 1, characterized in that: Also includes: Cooler and user end; The first pipeline is respectively connected to the liquid outlet of the cooler and the liquid inlet of the user end; The second pipeline is respectively connected to the liquid outlet of the user end and the liquid inlet of the cooler.

3. The method for heat dissipation of electronic devices for preventing condensation according to claim 2, characterized in that: The step of obtaining the temperature of the mixed medium in response to the cooling signal of the electronic device and making a judgment specifically includes: If it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline is increased until the temperature of the mixed medium is higher than the ambient temperature.

4. The method for heat dissipation of electronic devices for preventing condensation according to claim 2, characterized in that: After the step of determining that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, the method further includes: Continuously obtaining the temperature of the mixed medium delivered to the liquid cooling plate and making a judgment; If it is determined that the temperature of the mixed medium is less than or equal to the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline is reduced, and / or the flow rate of the second medium flow obtained from the second pipeline is increased, and the mixed medium is continuously delivered to the liquid cooling plate; If it is determined that the temperature of the mixed medium is higher than the ambient temperature, the flow rate of the first medium flow obtained from the first pipeline and the flow rate of the second medium flow obtained from the second pipeline are maintained, and the mixed medium is continuously delivered to the liquid cooling plate.

5. The method for heat dissipation of electronic devices for preventing condensation according to claim 2, characterized in that: After the step of determining that the temperature of the mixed medium is higher than the ambient temperature, the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, the method further includes: Obtaining a temperature difference parameter between the temperature of the mixed medium delivered to the liquid cooling plate and the ambient temperature, and making a judgment; If it is determined that the temperature value corresponding to the temperature difference parameter is higher than a preset temperature value, the flow rate of the first medium flow obtained from the first pipeline is increased, and / or the flow rate of the second medium flow obtained from the second pipeline is reduced, and the mixed medium is continuously delivered to the liquid cooling plate; If it is determined that the temperature value corresponding to the temperature difference parameter is within a preset temperature value range, the flow rate of the first medium flow obtained from the first pipeline and the flow rate of the second medium flow obtained from the second pipeline are maintained, and the mixed medium is continuously delivered to the liquid cooling plate.

6. The method for heat dissipation of electronic devices for preventing condensation according to claim 2, characterized in that: Also includes: A circulation pump, the circulation pump being arranged on a path connecting the liquid outlet of the water storage tank and the liquid cooling plate; The step of determining that the temperature of the mixed medium is higher than the ambient temperature, then transferring the mixed medium from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device, specifically includes: Continuously obtaining the operating parameters of the circulation pump and making judgments; If it is determined that the circulating pump is in a stopped operation state or a faulty operation state, the second pipeline is closed, the first medium flow is continuously obtained from the first pipeline, and the mixed medium is transported to the liquid cooling plate.

7. A method for heat dissipation of electronic devices for preventing condensation according to any one of claims 1 to 6, characterized in that: A plurality of micro channels for the mixed medium to flow are arranged inside the liquid cooling plate.

8. A method for heat dissipation of electronic devices for preventing condensation according to any one of claims 2 to 6, characterized in that: Also includes: The third pipeline and the fourth pipeline; The third pipeline is connected to the cooler to form a passage for seawater to enter the cooler; The fourth pipeline is connected to the cooler to form a passage for the seawater to be discharged from the cooler.

9. A heat dissipation device for electronic devices for preventing condensation, characterized in that: include: A first pipeline, a second pipeline, a water storage tank, a liquid cooling plate, an acquisition module, a response module and an execution module; The acquisition module is used to acquire the first medium flow in the first pipeline and the second medium flow in the second pipeline, and mix them in the water storage tank to form a mixed medium; The response module is used to obtain the temperature of the mixed medium and make a judgment in response to the cooling signal of the electronic device; The execution module is used to determine that the temperature of the mixed medium is higher than the ambient temperature, and then the mixed medium is transported from the water storage tank to the liquid cooling plate to achieve cooling of the electronic device; The step of obtaining the first medium flow in the first pipeline and the second medium flow in the second pipeline and mixing them in the water storage tank to form a mixed medium specifically includes: Obtaining the liquid level of the mixed medium in the water storage tank and making a judgment; Determining that the liquid level of the mixed medium in the water storage tank is lower than a preset liquid level, continuously obtaining a first medium flow from the first pipeline, and obtaining a second medium flow from the second pipeline; When it is determined that the liquid level of the mixed medium in the water storage tank is greater than or equal to a preset liquid level, obtaining the first medium flow from the first pipeline and obtaining the second medium flow from the second pipeline are stopped.

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