Display panel and display device

Abstract

The application relates to a display panel and a display device, the display panel comprising: a substrate comprising a display area and a non-display area surrounding the display area; a first metal layer arranged on one side of the substrate, the first metal layer comprising a plurality of first metal traces; and an encapsulation layer arranged on the side of the first metal layer away from the substrate; wherein, on the substrate, the orthographic projection of the plurality of first metal traces is located within an area surrounded by the orthographic projection of the outer edge of the encapsulation layer, and the distance between the outer edge of the orthographic projection of the plurality of first metal traces and the outer edge of the orthographic projection of the encapsulation layer is greater than or equal to 110 microns. Compared with the metal traces in the prior art, the first metal traces of the application are arranged inwardly, so that the first metal traces can be effectively prevented from being damaged by static electricity in the process of static electricity testing, and the encapsulation layer can be prevented from being damaged due to the discharge of the first metal traces, thereby effectively preventing the peeling of the encapsulation layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) has attracted much attention and development due to its flexibility, fast response time, wide color gamut, low energy consumption and other characteristics. The OLED device is composed of an anode, a cathode and one or more layers of organic material between the anode and the cathode. The holes and electrons injected from the anode and the cathode recombine in the light-emitting functional layer to form excitons, and the excitons emit light by radiation transition.

[0003] However, the metal cathode in the OLED device is easily affected by water vapor and oxygen. If the OLED device is eroded by oxygen and water vapor, it is likely to cause display abnormalities and affect the service life of the OLED device. Therefore, the OLED device has high requirements for water and oxygen isolation, and the packaging effect of the OLED device greatly affects the performance and service life of the OLED device.

[0004] In order to achieve the purpose of isolating water and oxygen, the current display panel usually adopts thin film packaging or Frit packaging for packaging. Among them, Frit packaging needs to coat glass frit on the periphery of the substrate and sinter, and then seal the substrate and the packaging cover plate by laser melting, so as to achieve the effect of isolating water and oxygen.

[0005] However, during the reliability test and actual assembly process of the OLED device after Frit packaging, ESD (Electro-Static discharge) damage problem is prone to occur, which causes the packaging layer to be peeled off, and then causes the water vapor in the external environment to invade, resulting in packaging failure, and finally leading to screen body display abnormalities. SUMMARY

[0006] Therefore, the present application provides a display panel and a display device to solve the problem of damage in the reliability test and actual assembly process, and avoid the packaging layer being peeled off by glass, resulting in water vapor in the external environment invading and causing packaging failure.

[0007] According to one aspect of the present application, a display panel is provided, comprising:

[0008] a substrate including a display area and a non-display area surrounding the display area;

[0009] a first metal layer disposed on one side of the substrate, the first metal layer including a plurality of first metal traces; and

[0010] a packaging layer, disposed on a side of the first metal layer away from the substrate;

[0011] The first metal traces are arranged in the display area and the non-display area of the substrate, and the first metal traces are arranged in the display area and the non-display area of the substrate.

[0012] Compared with the metal traces in the prior art, the first metal traces in the display panel are arranged inwardly, so that the first metal traces can be effectively prevented from being damaged by static electricity in the process of static electricity test, and the packaging layer can be effectively prevented from being damaged due to discharge of the first metal traces, thereby effectively preventing the packaging layer from being peeled off.

[0013] In one of the embodiments, the display panel further comprises:

[0014] The second metal layer comprises a plurality of second metal traces, and the first metal traces and the second metal traces are electrically connected by the via holes to form double-layer metal traces.

[0015] The substrate, the second metal layer, the first metal layer and the packaging layer are arranged in sequence, or the substrate, the first metal layer, the second metal layer and the packaging layer are arranged in sequence.

[0016] In one of the embodiments, the double-layer metal traces are at least partially arranged in the non-display area on the substrate.

[0017] In one of the embodiments, the distance between the outer edge of the projection of the second metal traces and the outer edge of the projection of the packaging layer is greater than or equal to 110 microns; or

[0018] The distance between the outer edge of the projection of the second metal traces and the outer edge of the projection of the packaging layer is less than or equal to 90 microns.

[0019] In one of the embodiments, the material of one of the second metal layer and the first metal layer comprises molybdenum, and the other metal layer comprises a titanium layer-aluminum layer-titanium layer arranged in sequence.

[0020] In one of the embodiments, the display panel further comprises:

[0021] The electrostatic protection element is arranged in the non-display area on the substrate.

[0022] In one of the embodiments, the static electricity protection element has a projection on the substrate, which is located outside the area surrounded by the projection of the outer edge of the packaging layer.

[0023] Optionally, the static electricity protection element comprises a metal element on the first metal layer.

[0024] In one of the embodiments, the static electricity protection element is arranged between the packaging layer and the substrate at a position where the first metal trace is not arranged.

[0025] In one of the embodiments, the static electricity protection element comprises at least one of the following: a ground wire, a ring-shaped structure connected to the ground.

[0026] According to one aspect of the present application, a display device is provided, comprising the display panel as described above. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 FIG. 1 is a schematic cross-sectional view of a partial structure of a display panel according to an embodiment of the present application;

[0028] Figure 2 FIG. 2 is a schematic cross-sectional view of a partial structure of a display panel according to another embodiment of the present application;

[0029] Figure 3 FIG. 3 is a schematic cross-sectional view of a partial structure of a display panel according to yet another embodiment of the present application;

[0030] Figure 4 FIG. 4 is a schematic cross-sectional view of a partial structure of a display panel according to still another embodiment of the present application.

[0031] DETAILED DESCRIPTION

[0032] 100, display panel; 110, substrate; 120, first metal layer; 130, second metal layer; 140, packaging structure; 141, packaging layer; 143, packaging cover plate; 150, static electricity protection element. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0034] It should be understood that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms since such terms are only used to distinguish one element from another. The terms "comprises", "comprising", "includes", "including" and "contains", "containing", where used herein, mean "including but not limited to".

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0036] In the case of using "include", "has", and "contains" in the description herein, unless an explicit limitation is used, another component can be added. Unless otherwise mentioned, the singular form of the term can include the plural form, and it cannot be understood as one number.

[0037] It should also be understood that, in interpreting the elements of the claims, although the claims are not explicitly described using the expression "means for", it is nevertheless intended to cover the equivalent of the means plus function claims. For example, if the claims recite a function of "detecting" then it is intended that a claim that recites "means for detecting" is within the scope of the claims.

[0038] Furthermore, in the specification, the phrase "plan view" refers to a drawing when the target portion is viewed from above, and the phrase "cross-sectional view" refers to a drawing when a section is taken by cutting the target portion vertically and the section is viewed from the side.

[0039] In addition, the drawings are not drawn to scale, and the relative sizes of the elements in the drawings are only drawn by way of example, and are not necessarily drawn in true proportion.

[0040] Embodiments of the present application provide a display device, which can be a display, a television, a digital camera, a mobile phone, a tablet computer, an electronic photo frame, or any product or component having any display function. The display device can be a liquid crystal display (LCD) or an electroluminescent display device. In the case where the display device is an electroluminescent display device, the electroluminescent display device can be an organic light-emitting diode (OLED) or a quantum dot light emitting diode (QLED). The display device includes a display panel for displaying an image.

[0041] As described in the background, during the reliability test and actual assembly of the display panel, it is easy to accumulate electric charges at the edge of the display panel. The inventors have found in research that when the impedance of the power signal line is large, or the ground end of the power signal line is in poor contact, etc., the accumulated electric charges on the power signal line will not be released in time, thereby causing the power signal line to be damaged, and the packaging layer to be peeled off during the damage process, and further causing the water vapor in the external environment to invade and cause packaging failure, and finally causing the screen body to have no display abnormalities.

[0042] As shown in Figure 1 To solve the above problems, an embodiment of the present application provides a display panel 100, which includes a substrate 110, a first metal layer 120, and a packaging layer 141, which are stacked and arranged in a direction from a non-light-emitting side to a light-emitting side.

[0043] The substrate 110 is a low-temperature polysilicon (LTPS) substrate 110, which has a display area and a non-display area surrounding the outside of the display area. In some embodiments, the display area is rectangular, and the non-display area is arranged around the display area. Specifically, the non-display area includes two first non-display areas and two second non-display areas, the two first non-display areas are located on opposite sides of the display area in the length direction and respectively extend along the width direction of the display area, and the two second non-display areas are located on opposite sides of the display area in the width direction and respectively extend along the length direction of the display area.

[0044] It can be understood that the shapes of the display area and the non-display area include but are not limited to the above examples. For example, when the display panel 100 is used for a wearable device worn on a user, the display area can have a circular shape like a watch; when the display panel 100 is used for a vehicle, the display area and the non-display area can adopt, for example, a circular shape, a polygonal shape, or other shapes.

[0045] The first metal layer 120 is disposed on one side of the substrate 110, and the first metal layer 120 includes a plurality of first metal traces. Specifically, the first metal layer 120 is an M1 metal layer or an M3 metal layer, one end of the first metal trace is connected to the pixel array circuit, the other end of the first metal trace is connected to the driving integrated circuit, and the first metal trace is a power signal line for providing a power signal to the pixel array circuit.

[0046] The encapsulation layer 141 is disposed on the side of the first metal layer 120 away from the substrate 110, and the encapsulation layer 141 surrounds the display area. The display panel 100 can further include an encapsulation cover plate 143, which is disposed on the side of the encapsulation layer 141 away from the substrate 110, and the normal projection of the encapsulation cover plate 143 on the substrate 110 is partially located in the display area and partially located in the non-display area. The encapsulation cover plate 143 and the encapsulation layer 141 form an encapsulation structure 140. The encapsulation structure 140 is used to isolate water and oxygen in the external environment.

[0047] In the reliability test and assembly process of the display panel 100, if the accumulated charge on the first metal layer 120 cannot be discharged in time, the first metal layer 120 will be damaged, and the encapsulation layer 141 located above the first metal layer 120 will be peeled off during the damage process. In order to avoid the problem of ESD damage causing the encapsulation layer 141 to be peeled off, and thus causing water vapor in the external environment to invade and cause encapsulation failure, on the substrate 110, the normal projection of the plurality of first metal traces of the first metal layer 120 is located within the area surrounded by the normal projection of the outer edge of the encapsulation layer 141, and the distance L between the outer edge of the normal projection of the plurality of first metal traces and the outer edge of the normal projection of the encapsulation layer 141 is greater than or equal to 110 microns. It should be noted that the distance L can be the distance between the first metal trace closest to the outer edge of the normal projection of the encapsulation layer 141 and the outer edge of the normal projection of the encapsulation layer 141.

[0048] In this way, compared with the metal layer in the prior art, the first metal layer 120 of the present application is inwardly recessed, and there is sufficient distance between the edge of the first metal layer 120 and the edge of the encapsulation layer 141, so that in the process of static electricity test and assembly, the first metal layer 120 can be effectively prevented from being damaged by static electricity, and thus the encapsulation layer 141 can be prevented from being damaged due to discharge of the first metal layer 120, thereby effectively preventing the encapsulation layer 141 from being peeled off.

[0049] When the impedance of the low-level power supply lead is high, or when there is poor contact at the grounding terminal of the low-level power supply lead, the accumulated charge on the low-level power supply lead may not have time to release, resulting in damage to the low-level power supply lead. Therefore, in one embodiment, multiple first metal traces may include low-level power supply leads. This can improve the problem of low-level power supply leads being easily damaged, thereby effectively preventing the encapsulation layer 141 from peeling off.

[0050] As one implementation, the distance L between the outer edge of the orthographic projection of the plurality of first metal traces and the outer edge of the orthographic projection of the encapsulation layer 141 is 150 micrometers. It is understood that the distance L between the outer edge of the orthographic projection of the plurality of first metal traces and the outer edge of the orthographic projection of the encapsulation layer 141 is not limited to this, and can be set to different dimensions depending on the material and arrangement of the first metal traces and other structures.

[0051] like Figure 2 and Figure 3 As shown, the display panel 100 further includes a second metal layer 130. The substrate 110, the first metal layer 120, the second metal layer 130 and the encapsulation layer 141 are stacked sequentially, or the substrate 110, the second metal layer 130, the first metal layer 120 and the encapsulation layer 141 are stacked sequentially.

[0052] In one embodiment, when the first metal layer 120 is an M1 metal layer, the second metal layer 130 is an M3 metal layer stacked on the side of the first metal layer 120 away from the substrate 110. Therefore, the substrate 110, the first metal layer 120, the second metal layer 130, and the encapsulation layer 141 are stacked sequentially. When the first metal layer 120 is an M3 metal layer, the second metal layer 130 is an M1 metal layer stacked on the side of the second metal layer 130 close to the substrate 110. Therefore, the substrate 110, the second metal layer 130, the first metal layer 120, and the encapsulation layer 141 are stacked sequentially.

[0053] The second metal layer 130 includes multiple second metal traces, the orthographic projections of which can lie within the area enclosed by the orthographic projection of the outer edge of the encapsulation layer 141. The second metal traces and the first metal traces on the first metal layer 120 can form a double-layer metal trace. Specifically, since the first metal layer 120 and the second metal layer 130 are insulated ( Figures 2 to 4 (The first metal layer 120 and the second metal layer 130 are not shown to be insulated), therefore, the first metal trace on the first metal layer 120 and the second metal trace on the second metal layer 130 are electrically connected through vias to form a double-layer metal trace.

[0054] Optionally, multiple second metal traces can be additionally formed on the second metal layer 130 based on the original structure of the second metal layer 130. The multiple first metal traces and multiple second metal traces are arranged in a one-to-one correspondence, and the distribution of the multiple first metal traces can be consistent with the distribution of the multiple second metal traces. For example, the orthographic projection of the corresponding first metal traces on the substrate 110 coincides with the orthographic projection of the second metal traces on the substrate 110.

[0055] Since the width of a metal trace per unit length is inversely proportional to its impedance, the inward setting of the metal layer will lead to a reduction in the width of the metal trace, which in turn will increase the impedance of the metal trace. Excessive impedance of the metal trace will cause uneven brightness in the image displayed on the display panel 100.

[0056] Therefore, in order to avoid increasing impedance while shrinking the first metal layer 120, this application forms a double-layer metal trace. Since the impedance of a unit length of double-layer metal trace is less than that of a unit length of single-layer metal trace when the width is the same, the double-layer metal trace can effectively prevent the impedance of the metal layer from increasing due to the shrinkage setting.

[0057] Optionally, the orthographic projection of the double-layer metal traces on the substrate 110 is at least partially located within the non-display area of ​​the substrate 110. Having double-layer metal traces within the non-display area effectively avoids increased impedance of the metal traces in the non-display area due to inward shrinkage.

[0058] Optionally, the orthographic projection of the double-layer metal traces on the substrate 110 is at least partially located within the display area of ​​the substrate 110. Having double-layer metal traces within the display area effectively avoids increased impedance of the metal traces in the display area due to inward shrinkage.

[0059] like Figure 2 As shown, in some embodiments, the distance between the outer edge of the orthographic projection of the multiple second metal traces and the outer edge of the orthographic projection of the encapsulation layer 141 is greater than or equal to 110 micrometers. Thus, both the first metal layer 120 and the second metal layer 130 are recessed, effectively preventing electrostatic discharge damage to the first metal layer 120 and the second metal layer 130 during electrostatic testing and assembly, thereby preventing damage to the encapsulation layer 141 due to discharge from the first metal layer 120 and the second metal layer 130, and effectively preventing peeling of the encapsulation layer 141.

[0060] In some other embodiments, the distance between the outer edge of the orthographic projection of the multiple second metal traces and the outer edge of the orthographic projection of the encapsulation layer 141 is less than or equal to 90 micrometers. Thus, only the first metal layer 120 is recessed inwards, while the second metal layer 130 can be normally positioned.

[0061] Specifically, in one embodiment, as shown in FIG. 1, the first metal layer 120 is an M3 metal layer, and the second metal layer 130 is an M1 metal layer. In this embodiment, the M1 metal layer is normally arranged, and the M3 metal layer is arranged inwardly. Figure 3

[0062] Specifically, in another embodiment, the first metal layer 120 is an M1 metal layer, and the second metal layer 130 is an M3 metal layer. In this embodiment, the M3 metal layer is normally arranged, and the M1 metal layer is arranged inwardly.

[0063] In some other embodiments, the material of the first metal layer 120 includes molybdenum, and the material of the second metal layer 130 includes a titanium layer-aluminum layer-titanium layer (Ti / Al / Ti) arranged in layers. In another embodiment, the material of the first metal layer 120 includes a titanium layer-aluminum layer-titanium layer (Ti / Al / Ti), and the material of the second metal layer 130 includes molybdenum. It can be understood that the materials of the first metal layer 120 and the second metal layer 130 are not limited to this, and can be arranged as needed.

[0064] As shown in FIG. 1, in some embodiments, the display panel 100 further includes an electrostatic protection element 150, and the orthographic projection of the electrostatic protection element 150 on the substrate 110 is located in the non-display area. The electrostatic protection element 150 can be electrically connected to the driving integrated circuit to release static electricity, thereby preventing the first metal layer 120 and the second metal layer 130 from being damaged by static electricity. Figure 4

[0065] In one embodiment, the orthographic projection of the electrostatic protection element 150 on the substrate 110 is located outside the area surrounded by the orthographic projection of the outer edge of the packaging layer 141. In this way, there is no packaging layer 141 above the electrostatic protection element 150, so even if the electrostatic protection element 150 is damaged by static electricity, it will not affect the packaging effect of the packaging layer 141.

[0066] In another embodiment, the electrostatic protection element 150 is arranged between the packaging layer 141 and the substrate 110 at a position where no first metal wiring is arranged, that is, the electrostatic protection element 150 is arranged in the space left by the inward arrangement of the first metal wiring.

[0067] Specifically, in one embodiment, the electrostatic protection element 150 includes a metal element located in the first metal layer 120, specifically at least one of a ground wire and a ring-shaped structure of ground. In some other embodiments, the electrostatic protection element 150 can include a metal element located in the first metal layer 120 and the second metal layer 130, or a metal element located in the second metal layer 130.

[0068] For example, in Figure 4 ​​In the shown embodiment, the electrostatic protection element 150 can be a ground trace on the first metal layer 120, or the electrostatic protection element 150 can be a ground trace on the second metal layer 130, or the electrostatic protection element 150 can be a ground trace on the first metal layer 120 and a ground trace on the second metal layer 130 arranged in a stack.

[0069] The display panel 100 and the display device described above, the inwardly retracted arrangement of the plurality of first metal traces increases the distance between the outer edges of the plurality of first metal traces and the outer edges of the display panel 100, thereby effectively avoiding the metal layer from being electrostatically damaged during electrostatic testing and assembly, and further preventing the encapsulation layer 141 from peeling off the metal layer to cause encapsulation failure, thereby improving the production yield of the display device. At the same time, the double-layer metal traces have smaller impedance than the single-layer metal traces, thereby avoiding the increase in the impedance of the metal traces due to the inwardly retracted arrangement of the metal layer. In addition, the electrostatic protection element 150 can further function to discharge static electricity, further improving the production yield of the display device.

[0070] The embodiments of the present application also provide a display device. On the basis of the above-described embodiments, the display device provided by the embodiments of the present application includes the display panel provided by any of the above-described embodiments, and has the beneficial effects of the display panel provided by the above-described embodiments, which will not be described herein again.

[0071] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0072] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, however, it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: A substrate, including a display area and a non-display area surrounding the display area; A first metal layer is disposed on one side of the substrate, and the first metal layer includes a plurality of first metal traces; and An encapsulation layer is disposed on the side of the first metal layer facing away from the substrate; The second metal layer includes multiple second metal traces; The substrate, the second metal layer, the first metal layer, and the encapsulation layer are stacked sequentially. The first metal traces and the second metal traces are electrically connected through vias to form a double-layer metal trace. On the substrate, the orthographic projections of the plurality of first metal traces are located within the area enclosed by the orthographic projection of the outer edge of the encapsulation layer, and the orthographic projections of the plurality of second metal traces are located within the area enclosed by the orthographic projection of the outer edge of the encapsulation layer. The distance between the outer edges of the orthographic projections of the plurality of first metal traces and the outer edges of the orthographic projection of the encapsulation layer is greater than or equal to 110 micrometers, and the distance between the outer edges of the orthographic projections of the second metal traces and the outer edges of the orthographic projection of the encapsulation layer is less than the distance between the outer edges of the orthographic projections of the first metal traces and the outer edges of the orthographic projection of the encapsulation layer.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the double-layer metal traces on the substrate is at least partially located within the non-display area.

3. The display panel according to claim 1, characterized in that, The distance between the outer edge of the orthographic projection of the plurality of second metal traces and the outer edge of the orthographic projection of the encapsulation layer is less than or equal to 90 micrometers.

4. The display panel according to claim 1, characterized in that, The material of one of the metal layers of the second metal layer and the first metal layer includes molybdenum, and the other metal layer includes a stacked titanium layer-aluminum layer-titanium layer.

5. The display panel according to claim 1, characterized in that, The display panel also includes: An electrostatic discharge (ESD) protection element, wherein the orthographic projection of the ESD protection element on the substrate is located within the non-display area.

6. The display panel according to claim 5, characterized in that, The orthographic projection of the electrostatic protection element on the substrate is located outside the area enclosed by the orthographic projection of the outer edge of the encapsulation layer.

7. The display panel according to claim 5, characterized in that, The electrostatic protection element includes a metal element located in the first metal layer.

8. The display panel according to claim 5, characterized in that, The electrostatic discharge protection element is disposed at the location between the encapsulation layer and the substrate where the first metal trace is not located.

9. The display panel according to claim 5, characterized in that, The electrostatic discharge protection element includes at least one of the following: a grounding wire, a grounded ring structure.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 9.

Images