Display panel, display module and display device

Abstract

The present disclosure provides a display panel, a display module and a display device, the display panel comprising: a display panel, characterized in that it comprises a display area, a routing area and a binding area; the routing area comprises a display routing, a touch transmission routing and a touch reception routing introduced from the display area, and one end of the display routing introduced from the display area is located between the touch transmission routing and the touch reception routing; the binding area comprises a display binding area, a touch transmission binding area and a touch reception binding area, and the display binding area is located on the same side of the touch transmission binding area and the touch reception binding area; the display routing, the touch transmission routing and the touch reception routing are respectively led out to the display binding area, the touch transmission binding area and the touch reception binding area. The display routing and the touch routing in the flexible circuit board bound to the display panel can be made in the same layer, thereby reducing the number of layers of the flexible circuit board.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display module and a display device. Background Art

[0002] Currently, OLED display technology has been widely used in small and medium-sized products such as mobile phones and wearables, but its cost is still much higher than that of LCD displays. Among them, FPC is one of the more expensive materials in OLED modules, especially for multi-layer FPC.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] The purpose of the present disclosure is to provide a display panel, a display module and a display device, which can enable display wiring and touch wiring in a flexible circuit board bound to the display panel to be manufactured in the same layer, thereby reducing the number of layers of the flexible circuit board.

[0005] According to one aspect of the present disclosure, there is provided a display panel, the display panel comprising a display area, a wiring area and a binding area;

[0006] The routing area includes a display routing, a touch transmission routing and a touch reception routing introduced from the display area, and one end of the display routing introduced from the display area is located between the touch transmission routing and the touch reception routing;

[0007] The binding area includes a display binding area, a touch sending binding area and a touch receiving binding area, and the display binding area is located on the same side of the touch sending binding area and the touch receiving binding area; the display wiring, the touch sending wiring and the touch receiving wiring are respectively led out to the display binding area, the touch sending binding area and the touch receiving binding area.

[0008] In an exemplary embodiment of the present disclosure, the routing area includes:

[0009] substrate;

[0010] A first conductive layer, disposed on one side of the substrate;

[0011] an interlayer insulating layer, disposed on a side of the first conductive layer facing away from the substrate;

[0012] A source-drain conductive layer is provided on a side of the interlayer insulating layer away from the first conductive layer, the source-drain conductive layer includes a display wiring area, a touch transmission wiring area and a touch reception wiring area, and the display wiring area is located on the same side of the touch transmission wiring area and the touch reception wiring area;

[0013] A dielectric layer, disposed on a side of the source-drain conductive layer away from the interlayer insulating layer;

[0014] A touch layer, disposed on a side of the dielectric layer away from the source-drain conductive layer, the touch layer comprising the touch transmission wiring and the touch receiving wiring arranged at intervals;

[0015] a first via hole and a second via hole, wherein the first via hole and the second via hole are located at two sides of the display wiring area, one of the touch transmission wiring and the touch reception wiring is electrically connected to the first conductive layer through the first via hole, and the first conductive layer is electrically connected to the corresponding touch transmission wiring area or the touch reception wiring area in the source-drain conductive layer through the second via hole;

[0016] The third via hole and the second via hole are located on the same side of the display wiring area, and the other of the touch sending wiring and the touch receiving wiring is electrically connected to the corresponding touch sending wiring area or the touch receiving wiring area in the first source and drain conductive layer through the third via hole.

[0017] In an exemplary embodiment of the present disclosure, the routing area further includes:

[0018] A first insulating layer, disposed between the substrate and the first conductive layer;

[0019] a second insulating layer, disposed on a side of the first conductive layer away from the first insulating layer;

[0020] The second conductive layer is disposed between the second insulating layer and the interlayer insulating layer.

[0021] In an exemplary embodiment of the present disclosure, the display area includes:

[0022] the substrate;

[0023] A first gate layer is provided on one side of the substrate; the first gate layer and the first conductive layer are the same layer;

[0024] The interlayer insulating layer is provided on a layer of the first gate layer away from the substrate;

[0025] The source-drain conductive layer is disposed on a side of the interlayer insulating layer away from the first gate layer;

[0026] The pixel defining layer is arranged on a side of the source-drain conductive layer away from the interlayer insulating layer; the pixel defining layer and the dielectric layer are the same layer.

[0027] In an exemplary embodiment of the present disclosure, the display area further includes:

[0028] A first gate insulating layer is provided between the substrate and the first gate layer; the first gate insulating layer and the first insulating layer are the same layer;

[0029] A second gate insulating layer is provided on a side of the first gate layer away from the first gate insulating layer; the second gate insulating layer and the second insulating layer are the same layer;

[0030] The second gate layer is arranged between the second gate insulating layer and the interlayer insulating layer; the second gate layer and the second conductive layer are in the same layer.

[0031] In an exemplary embodiment of the present disclosure, the display area and the routing area further include:

[0032] a buffer layer, disposed between the substrate and the first insulating layer and the first gate insulating layer;

[0033] The planar layer is disposed between the source-drain conductive layer, the dielectric layer and the pixel defining layer.

[0034] In an exemplary embodiment of the present disclosure, the binding area includes:

[0035] the substrate;

[0036] The first conductive layer is disposed on one side of the substrate;

[0037] The interlayer insulating layer is provided on a side of the first conductive layer away from the substrate;

[0038] The source-drain conductive layer is disposed on a side of the interlayer insulating layer away from the first conductive layer; the source-drain conductive layer is formed with binding pins for the display wiring, the touch transmission wiring, and the touch reception wiring.

[0039] In an exemplary embodiment of the present disclosure, the display routing, the touch sending routing and the touch receiving routing respectively include a plurality of sub-routings, and at least one adjacent sub-routing between the display routing, the touch sending routing and the touch receiving routing is grounded.

[0040] According to another aspect of the present disclosure, a display module is provided, the display module comprising:

[0041] The above-mentioned display panel;

[0042] A flexible circuit board is bound to the display panel via the binding area.

[0043] According to another aspect of the present disclosure, a display device is provided, which includes the above-mentioned display module.

[0044] In the display panel provided by the present disclosure, one end of the display wiring introduced from the display area is located between the touch sending wiring and the touch receiving wiring, the display binding area of ​​the binding area is located on the same side of the touch sending binding area and the touch receiving binding area, and after the display wiring, the touch sending binding area and the touch receiving binding area are respectively led out to the display binding area, the touch sending binding area and the touch receiving binding area, the binding pins of the display wiring are located on the same side of the binding pins of the touch sending wiring and the touch receiving wiring; therefore, when the display panel is subsequently bound to a flexible circuit board, the display wiring and the touch sending wiring and the touch receiving wiring on the flexible circuit board will not overlap, so that the display wiring and the touch wiring in the flexible circuit board can be made in the same layer, thereby reducing the number of layers of the flexible circuit board.

[0045] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0047] Figure 1 A schematic diagram of the wiring of the display module in the related technology provided by the present disclosure;

[0048] Figure 2 A cross-sectional schematic diagram of a display panel wiring area in the related technology provided by the present disclosure;

[0049] Figure 3 A schematic diagram showing a panel binding area in the related art provided by the present disclosure;

[0050] Figure 4 A wiring diagram of another display module in the related technology provided by the present disclosure;

[0051] Figure 5 A schematic diagram of wiring of a display panel provided in an embodiment of the present disclosure;

[0052] Figure 6 A schematic cross-sectional view of a display panel wiring area provided by an embodiment of the present disclosure;

[0053] Figure 7 A schematic diagram of a display panel binding area provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0054] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0055] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0056] The terms "a", "an", "the", and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0057] The inventors have found that in the display panel of the existing display module, if Figure 1-Figure 3 As shown, the Touch TX (touch transmission) routing 210′ ​​and the Touch RX (touch reception) routing 220′ are located on both sides of the display routing 230′, the display routing area 730′ formed by the source and drain metal layer is located between the Touch TX routing area 710′ and the Touch RX routing area 720′, and the display routing binding area 133′ is located between the Touch TX binding area 131′ and the Touch RX binding area 132′.

[0058] After the display panel is bound to the FPC (flexible circuit board) 400', when the Touch TX line 210' and the Touch RX line 220' are connected to the Touch IC (touch chip) 410', the touch TX line 210' will vertically overlap with the display line 230'. Since both are high-frequency signal lines, they will interfere with each other, so a separate metal layer needs to be set to make the TX line, and a ground layer is usually introduced between the TX line and the display line to ensure that the signals of the two do not interfere with each other. However, this brings about problems such as an increase in the number of layers of the FPC and an increase in cost.

[0059] like Figure 4 As shown, in order to solve the above problems, it is proposed to make the Touch TX trace 210' separately on a Bridge FPC (bridge circuit board) 420', and then bind the Bridge FPC420' to the FPC400'. Although this method can reduce the FPC production cost to a certain extent, the degree of reduction is limited because there is an extra step of Bridge FPC production and binding process, and the thickness cannot be reduced.

[0060] In view of the above technical problems, the embodiments of the present disclosure first provide a display panel, such as Figure 5-Figure 7 As shown, the display panel 100 includes a display area 110, a routing area 120 and a binding area 130. The routing area 120 includes a display routing 300, a touch transmission routing 210 and a touch reception routing 220 introduced from the display area 110, and one end of the display routing 300 introduced from the display area 110 is located between the touch transmission routing 210 and the touch reception routing 220. The binding area 130 includes a display binding area 133, a touch transmission binding area 131 and a touch reception binding area 132, and the display binding area 133 is located on the same side of the touch transmission binding area 131 and the touch reception binding area 132; the display routing 300, the touch transmission routing 210 and the touch reception routing 220 are respectively led out to the display binding area 133, the touch transmission binding area 131 and the touch reception binding area 132.

[0061] In the display panel provided by the present disclosure, one end of the display wiring 300 introduced from the display area 110 is located between the touch sending wiring 210 and the touch receiving wiring 220, and the display binding area 133 of the binding area 130 is located on the same side of the touch sending binding area 131 and the touch receiving binding area 132. After the display wiring 300, the touch sending binding area 210 and the touch receiving binding area 132 are respectively led out to the display binding area 133, the touch sending binding area 131 and the touch receiving binding area 132, the binding pin of the display wiring 300 is located on the same side of the binding pins of the touch sending wiring 210 and the touch receiving wiring 220; therefore, when the display panel 100 is subsequently bound to the flexible circuit board 400, the display wiring on the flexible circuit board 400 will not overlap with the touch sending wiring and the touch receiving wiring, so that the display wiring and the touch wiring in the flexible circuit board can be made in the same conductive layer, thereby reducing the number of layers of the flexible circuit board.

[0062] For example, Figure 6 As shown, the routing area 120 includes: a substrate 510 , a first conductive layer 620 , an interlayer insulating layer 530 , a source-drain conductive layer 700 , a dielectric layer 550 , a touch layer, a first via hole 810 , and a second via hole 820 . The first conductive layer 620 is arranged on one side of the substrate 510; the interlayer insulating layer 530 is arranged on the side of the first conductive layer 620 away from the substrate 510; the source-drain conductive layer 700 is arranged on the side of the interlayer insulating layer 530 away from the first conductive layer 620, and the source-drain conductive layer 700 includes a display wiring area 730, a touch transmission wiring area 710 and a touch reception wiring area 720, and the display wiring area 730 is located on the same side of the touch transmission wiring area 710 and the touch reception wiring area 720; the dielectric layer 550 is arranged on the side of the source-drain conductive layer 700 away from the interlayer insulating layer 530; the touch layer is arranged on the side of the dielectric layer 550 away from the source-drain conductive layer 700, and the touch layer includes a touch transmission wiring 210 and a touch reception wiring 220 arranged at intervals.

[0063] Among them, the first via 810 and the second via 820 are located on both sides of the display wiring area 730, one of the touch sending wiring 210 and the touch receiving wiring 220 is electrically connected to the first conductive layer 620 through the first via 810, and the first conductive layer 620 is electrically connected to the corresponding touch sending wiring area 710 or the touch receiving wiring area 720 in the source and drain conductive layer 700 through the second via 820; the third via 830 and the second via 820 are located on the same side of the display wiring area 730, and the other of the touch sending wiring 210 and the touch receiving wiring 220 is electrically connected to the corresponding touch sending wiring area 710 or the touch receiving wiring area 720 in the first source and drain conductive layer 700 through the third via 830.

[0064] For example, the touch transmission line 210 is electrically connected to the first conductive layer 620 through the first via 810, and the touch receiving line 220 is electrically connected to the touch receiving line area 720 in the source-drain conductive layer 700 through the second via 820; or, the touch receiving line 220 is electrically connected to the first conductive layer 620 through the first via 810, and the touch transmission line 210 is electrically connected to the touch transmission line area 710 in the source-drain conductive layer 700 through the second via 820. For example, Figure 5 As shown, the touch transmission line 210 on the left side of the display panel 100 is electrically connected to the line of the first conductive layer 620 through the first via 810. The line is horizontally wired and connected to the right side of the display panel 100. On the right side of the display panel 100, it is also electrically connected to the line of the touch transmission line area 710 of the source-drain conductive layer 700 through the second via 820. In this way, the touch transmission line 210 and the touch receiving line 220 are both located on the right side of the display panel 100.

[0065] Through the above design, after the FPC 400 is bound to the panel 100, the touch transmission line and the touch receiving line will be connected to the Touch IC 410 on the FPC 400 in the vertical direction, so there will be no horizontal touch transmission line in the FPC 400. Therefore, in the FPC 400, the touch line and the display line can be located on the same layer without crosstalk, thereby reducing the number of layers and thickness of the FPC and reducing the cost.

[0066] Among them, the display line 300, the touch transmission line 210 and the touch receiving line 220 respectively include a plurality of sub-lines. Each sub-line in the touch transmission line 210 is electrically connected to the first conductive layer 620 through a first via 810, and the first conductive layer 620 is correspondingly formed with a plurality of lines, and the touch transmission line area 710 of the source-drain conductive layer 700 is correspondingly formed with a plurality of lines, and each sub-line in the touch transmission line 210 is connected to the line in the touch transmission line area 710 through the line in the first conductive layer 620. The touch receiving line 220 includes a plurality of sub-lines, and the touch receiving line area 720 of the source-drain conductive layer 700 is correspondingly formed with a plurality of lines, and each sub-line in the touch receiving line 220 is connected to the line in the touch receiving line area 720 through a second via 820.

[0067] Among them, the display routing 300, the touch transmitting routing 210 and the touch receiving routing 220 respectively include multiple sub-routings, and at least one adjacent sub-routing between the display routing 300, the touch transmitting routing 210 and the touch receiving routing 220 is grounded to avoid mutual influence between the display routing 300, the touch transmitting routing 210 and the touch receiving routing 220, thereby improving the reliability of wiring.

[0068] Among them, the material of the substrate 510 can be an inorganic material or an organic material. The inorganic material can be a glass material such as soda-lime glass, quartz glass, sapphire glass, or a metal material such as stainless steel, aluminum, nickel, or various metals or their alloys; the organic material can be, for example, polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyether sulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or a combination thereof; the material of the substrate 510 can also be a flexible material, such as polyimide (PI).

[0069] The conductive material of the first conductive layer 620 is, for example, a metal, a conductive metal oxide, a conductive polymer, a conductive composite material, or a combination thereof. For example, the metal may be platinum, gold, silver, aluminum, chromium, nickel, copper, molybdenum, titanium, magnesium, calcium, barium, sodium, palladium, iron, manganese, or a combination thereof; the conductive metal oxide may be InO2, SnO2, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), or a combination thereof; the conductive polymer may be polyaniline, polypyrrole, polythiophene, polyacetylene, poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid (PEDOT / PSS), or a combination thereof; the conductive composite material may be a conductive composite material dispersed with carbon black, graphite powder, metal particles, etc. The first conductive layer 620 is formed by, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), spin coating, or a combination thereof.

[0070] The interlayer insulating layer 530 may be made of silicon oxide, silicon oxynitride, silicon nitride or other suitable insulating materials (such as organic polymer compounds) or a combination thereof. The interlayer insulating layer 530 may be formed by PVD, CVD, spin coating or a combination thereof.

[0071] The material of the source-drain conductive layer 700 is, for example, a metal, a conductive oxide, or a combination thereof. For example, the metal may be titanium (Ti), platinum (Pt), ruthenium (Ru), gold (Au), silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), neodymium (Nd), chromium (Cr), tantalum (Ta), or an alloy thereof, or a combination thereof. The conductive oxide may be IZO, AZO, ITO, GZO, ZTO, or a combination thereof. The method of forming the source-drain conductive layer 700 is, for example, PVD, CVD, or a combination thereof.

[0072] The material of the dielectric layer 550 may be, for example, an insulating material with a lyophobic property, and the material may be, for example, a negative photoresist with a lyophobic property, such as a negative photoresist such as polyimide (PI), polymethyl methacrylate (PMMA) or silicone.

[0073] For example, Figure 6 As shown, the wiring area 120 also includes: a first insulating layer 610, a second insulating layer 630 and a second conductive layer 640. The first insulating layer 610 is disposed between the substrate 510 and the first conductive layer 620; the second insulating layer 630 is disposed on the side of the first conductive layer 620 away from the first insulating layer 610; and the second conductive layer 640 is disposed between the second insulating layer 630 and the interlayer insulating layer 530. By providing the second conductive layer 640, it is equivalent to forming a grounding layer at the position where the display wiring 300 overlaps with the touch transmission wiring 210 or the touch reception wiring 220, thereby avoiding the vertical overlap interference between the display wiring 300 and the touch transmission wiring 210 or the touch reception wiring 220.

[0074] The materials of the first insulating layer 610 and the second insulating layer 630 may be silicon oxide, silicon oxynitride, silicon nitride or other suitable insulating materials (such as organic polymer compounds) or a combination of the above materials. The first insulating layer 610 and the second insulating layer 630 may be formed by, for example, physical vapor deposition, chemical vapor deposition, spin coating or a combination thereof. The materials of the first insulating layer 610 and the second insulating layer 630 may be the same or different.

[0075] The conductive material of the second conductive layer 640 is, for example, a metal, a conductive metal oxide, a conductive polymer, a conductive composite material, or a combination thereof. For example, the metal may be platinum, gold, silver, aluminum, chromium, nickel, copper, molybdenum, titanium, magnesium, calcium, barium, sodium, palladium, iron, manganese, or a combination thereof; the conductive metal oxide may be InO2, SnO2, indium tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, or a combination thereof; the conductive polymer may be polyaniline, polypyrrole, polythiophene, polyacetylene, poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid, or a combination thereof; the conductive composite material may be a conductive composite material dispersed with carbon black, graphite powder, metal particles, etc. The second conductive layer 640 may be formed by, for example, physical vapor deposition, chemical vapor deposition, spin coating, or a combination thereof. The conductive materials of the second conductive layer 640 and the first conductive layer 620 may be the same or different.

[0076] By way of example, the display area 110 includes: a substrate 510, a first gate layer, an interlayer insulating layer 530, a source-drain conductive layer 700 and a pixel defining layer, wherein the first gate layer is arranged on one side of the substrate 510; the first gate layer and the first conductive layer 620 are the same layer; the interlayer insulating layer 530 is arranged on a layer of the first gate layer away from the substrate 510; the source-drain conductive layer 700 is arranged on a side of the interlayer insulating layer 530 away from the first gate layer; the pixel defining layer is arranged on a side of the source-drain conductive layer 700 away from the interlayer insulating layer 530; the pixel defining layer and the dielectric layer 550 are the same layer.

[0077] The various layers of material in the wiring area 120 and the various layers of material in the display area 110 are formed by the same process, thereby reducing the process steps. Specifically, there is a conductive first gate layer in the display area 110, and there is no need to add additional processes to set the first conductive layer 620 in the wiring area 120. It is only necessary to modify the mask of the first gate layer during the existing display panel 100 manufacturing process, and make the pattern of the touch transmission wiring 210 or the touch receiving wiring 220 on the first gate layer. The first gate layer and the first conductive layer 620 are the same physical layer, but are not electrically connected. The two layers are isolated by insulating materials in the display area 110 and the wiring area 120.

[0078] For example, Figure 6 As shown, the display area 110 further includes: a first gate insulating layer, a second gate insulating layer and a second gate layer. The first gate insulating layer is disposed between the substrate 510 and the first gate layer; the first gate insulating layer and the first insulating layer 610 are the same layer; the second gate insulating layer is disposed on the side of the first gate layer away from the first gate insulating layer; the second gate insulating layer and the second insulating layer 630 are the same layer; the second gate layer is disposed between the second gate insulating layer and the interlayer insulating layer 530; the second gate layer and the second conductive layer 640 are the same layer.

[0079] It can be seen that the various layers of materials in the wiring area 120 can be formed by the same process as the various layers of materials in the display area 110, thereby reducing the process steps. Specifically, there is a conductive second gate layer in the display area 110, and there is no need to add additional processes to set the second conductive layer 640 in the wiring area 120, and the second conductive layer 640 serves as a ground layer. Among them, the second gate layer and the second conductive layer 640 are the same physical layer, but are not electrically connected. The two layers are isolated by insulating materials in the display area 110 and the wiring area 120.

[0080] For example, Figure 6 As shown, the display area 110 and the wiring area 120 further include: a buffer layer 520 and a planar layer 540. The buffer layer 520 is disposed between the substrate 510 and the first insulating layer 610 and the first gate insulating layer; the planar layer 540 is disposed between the source-drain conductive layer 700 and the dielectric layer 550 and the pixel defining layer. The buffer layer 520 and the planar layer 540 of the wiring area 120 can be formed by the same process as the buffer layer 520 and the planar layer 540 of the display area 110, thereby reducing the process steps.

[0081] The buffer layer 520 may be a single-layer or multi-layer structure, and its material may be at least one of SiN (silicon nitride), SiOx (silicon oxide), A-Si (amorphous silicon), and ITO (indium tin oxide).

[0082] The material of the flat layer 540 is any one of butadiene rubber, polyurethane, polyvinyl chloride, polyamide, or any one of polycarbonate, polyimide, polyether vanadium resin, and epoxy resin.

[0083] For example, the binding area 130 includes: a substrate 510, a first conductive layer 620, an interlayer insulating layer 530 and a source-drain conductive layer 700. The first conductive layer 620 is disposed on one side of the substrate 510; the interlayer insulating layer 530 is disposed on the side of the first conductive layer 620 away from the substrate 510; the source-drain conductive layer 700 is disposed on the side of the interlayer insulating layer 530 away from the first conductive layer 620; the source-drain conductive layer 700 is formed with binding pins for the display wiring 300, the touch transmission wiring 210 and the touch reception wiring 220. Among them, the various layers of materials in the binding area 130 can be formed by the same process as the various layers of materials in the display area 110, i.e., the wiring area 120, thereby reducing the process steps.

[0084] In addition, the binding area 130 may further include a buffer layer 520 and a planar layer 540 . The buffer layer 520 and the planar layer 540 of the binding area 130 may be formed through the same process as the buffer layer 520 and the planar layer 540 of the display area 110 , i.e., the routing area 120 , thereby reducing the process steps.

[0085] The embodiment of the present disclosure also provides a display module, such as Figure 5As shown, the display module includes: a flexible circuit board 400 and the above-mentioned display panel 100 , and the flexible circuit board 400 and the display panel 100 are bound via a binding area 130 .

[0086] In the display module provided by the present disclosure, the display binding area of ​​the binding area in the display panel is located on the same side of the touch sending binding area and the touch receiving binding area. After the display wiring, the touch sending wiring and the touch receiving wiring are respectively led out to the display binding area, the touch sending binding area and the touch receiving binding area, the binding pins of the display wiring are located on the same side of the binding pins of the touch sending wiring and the touch receiving wiring; therefore, when the display panel is bound to the flexible circuit board, the display wiring and the touch sending wiring and the touch receiving wiring on the flexible circuit board will not overlap, so that the display wiring and the touch wiring in the flexible circuit board can be made in the same layer, without setting two wiring layers, thereby reducing the number of layers of the flexible circuit board, and there is no need to set a Bridge FPC, reducing the production process of the flexible circuit board, and reducing the thickness of the flexible circuit board.

[0087] The display module disclosed in the present invention has more beneficial effects, which can be found in the discussion in the above-mentioned display panel embodiment and will not be elaborated here.

[0088] The embodiment of the present disclosure further provides a display device, which includes the above display module. The display device can be a mobile phone, a tablet computer, a television, an e-reader, or other terminal equipment with a display panel. Its beneficial effects can refer to the beneficial effects of the above display panel, which will not be described in detail here.

[0089] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that: Includes display area, routing area and binding area; The routing area includes a display routing, a touch transmission routing and a touch reception routing introduced from the display area, and one end of the display routing introduced from the display area is located between the touch transmission routing and the touch reception routing; The binding area includes a display binding area, a touch sending binding area and a touch receiving binding area, wherein the display binding area is located on the same side of the touch sending binding area and the touch receiving binding area; the display wiring, the touch sending wiring and the touch receiving wiring are respectively led out to the display binding area, the touch sending binding area and the touch receiving binding area; Wherein, the routing area includes: substrate; A first conductive layer, disposed on one side of the substrate; an interlayer insulating layer, disposed on a side of the first conductive layer facing away from the substrate; A source-drain conductive layer is provided on a side of the interlayer insulating layer away from the first conductive layer, the source-drain conductive layer includes a display wiring area, a touch transmission wiring area and a touch reception wiring area, and the display wiring area is located on the same side of the touch transmission wiring area and the touch reception wiring area; A dielectric layer, disposed on a side of the source-drain conductive layer away from the interlayer insulating layer; A touch layer, disposed on a side of the dielectric layer away from the source-drain conductive layer, the touch layer comprising the touch transmission wiring and the touch receiving wiring arranged at intervals; a first via hole and a second via hole, wherein the first via hole and the second via hole are located at two sides of the display wiring area, one of the touch transmission wiring and the touch reception wiring is electrically connected to the first conductive layer through the first via hole, and the first conductive layer is electrically connected to the corresponding touch transmission wiring area or the touch reception wiring area in the source-drain conductive layer through the second via hole; a third via hole, located at the same side of the display wiring area as the second via hole, the other of the touch transmission wiring and the touch reception wiring being electrically connected to the corresponding touch transmission wiring area or the touch reception wiring area in the source-drain conductive layer through the third via hole; A first insulating layer, disposed between the substrate and the first conductive layer; a second insulating layer, disposed on a side of the first conductive layer away from the first insulating layer; The second conductive layer is disposed between the second insulating layer and the interlayer insulating layer.

2. The display panel according to claim 1, characterized in that: The display area includes: the substrate; A first gate layer is provided on one side of the substrate; the first gate layer and the first conductive layer are the same layer; The interlayer insulating layer is provided on a layer of the first gate layer away from the substrate; The source-drain conductive layer is disposed on a side of the interlayer insulating layer away from the first gate layer; The pixel defining layer is arranged on a side of the source-drain conductive layer away from the interlayer insulating layer; the pixel defining layer and the dielectric layer are the same layer.

3. The display panel according to claim 2, characterized in that: The display area also includes: A first gate insulating layer is provided between the substrate and the first gate layer; the first gate insulating layer and the first insulating layer are the same layer; A second gate insulating layer is provided on a side of the first gate layer away from the first gate insulating layer; the second gate insulating layer and the second insulating layer are the same layer; The second gate layer is arranged between the second gate insulating layer and the interlayer insulating layer; the second gate layer and the second conductive layer are in the same layer.

4. The display panel according to claim 3, characterized in that: The display area and the routing area also include: a buffer layer, disposed between the substrate and the first insulating layer and the first gate insulating layer; The planar layer is disposed between the source-drain conductive layer, the dielectric layer and the pixel defining layer.

5. The display panel according to claim 2, characterized in that: The binding area includes: the substrate; The first conductive layer is disposed on one side of the substrate; The interlayer insulating layer is provided on a side of the first conductive layer away from the substrate; The source-drain conductive layer is disposed on a side of the interlayer insulating layer away from the first conductive layer; the source-drain conductive layer is formed with binding pins for the display wiring, the touch transmission wiring, and the touch reception wiring.

6. The display panel according to claim 1, characterized in that: The display routing, the touch transmission routing and the touch reception routing respectively include a plurality of sub-routings, and at least one sub-routing adjacent to the display routing, the touch transmission routing and the touch reception routing is grounded.

7. A display module, characterized in that: include: The display panel according to any one of claims 1 to 6; A flexible circuit board is bound to the display panel via the binding area.

8. A display device, characterized in that: Comprising the display module described in claim 7.

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