Detection device

Abstract

The present invention provides a detection device, including a carrier board, a plurality of telescopic probes, a locking component, and a conductive structure. The carrier board has a through hole and a ground pad corresponding to the through hole. The carrier board has a first surface and a second surface opposite to the first surface. The through hole penetrates from the first surface to the second surface, and the ground pad is disposed on the second surface. The plurality of telescopic probes are arranged in parallel on the first surface of the carrier board. The locking component passes through the through hole. The locking component includes a screw. The head of the screw has a first pitch and a second pitch, and the density of the first pitch is different from the density of the second pitch. The conductive structure is partially embedded in the locking component, wherein the conductive structure, the locking component, and the ground pad are electrically connected.

Description

Technical Field

[0001] The present invention relates to a detection device, and more particularly to a detection device capable of improving the power backflow path. Background Art

[0002] Generally, after a semiconductor chip is fabricated, a final test (FT) is performed on the semiconductor chip to ensure the quality of the semiconductor chip when it is shipped. During electrical detection, since the retractable probes of the detection device generate a reaction force when pressed, when the number of retractable probes is too large, the carrier board will warp. Currently, screws are often provided on the carrier board to reduce the warpage phenomenon.

[0003] However, since the screws replace the positions of some of the retractable probes, and the semiconductor chip floats on the screws without being electrically connected to them, the path of current backflow is reduced, the proportion of current backflow is decreased, and the unbackflowed current is discharged through other places, thereby having an adverse effect on the detection device. Summary of the Invention

[0004] The present invention provides a detection device that can improve the current backflow path while reducing the warpage phenomenon, increase the proportion of current backflow, and has better power integrity / signal integrity performance.

[0005] A detection device of the present invention includes a carrier board, a plurality of retractable probes, a locking assembly, and a conductive structure. The carrier board has through holes and ground pads corresponding to the through holes. The carrier board has a first surface and a second surface opposite to the first surface. The through holes penetrate from the first surface to the second surface, and the ground pads are disposed on the second surface. A plurality of retractable probes are disposed in parallel on the first surface of the carrier board. The locking assembly passes through the through holes. The locking assembly includes screws. The head of the screw has a first pitch and a second pitch, and the density of the first pitch is different from the density of the second pitch. The conductive structure is partially embedded in the locking assembly, and the conductive structure, the locking assembly, and the ground pad are electrically connected.

[0006] A detection device of the present invention is used to detect a semiconductor chip. The detection device includes a carrier board, a plurality of retractable probes, a locking assembly, and a conductive structure. The carrier board has through holes and ground pads corresponding to the through holes. The carrier board has a first surface and a second surface opposite to the first surface. The through holes penetrate from the first surface to the second surface, and the ground pads are disposed on the second surface. A plurality of retractable probes are disposed in parallel on the first surface of the carrier board. The locking assembly passes through the through holes. The locking assembly includes screws. The head of the screw has a first pitch and a second pitch, and the density of the first pitch is different from the density of the second pitch. The conductive structure is disposed in the locking assembly, and the detection device is used to return the current of the semiconductor chip to the ground pad through the conductive structure and the locking assembly.

[0007] Based on the above, a conductive structure is designed in the detection device of the present invention. Part of the conductive structure can be embedded in the locking component, and the conductive structure, the locking component and the grounding pad are electrically connected, so that the current of the semiconductor chip can flow back to the grounding pad through the conductive structure and the locking component during subsequent detection. Therefore, while reducing the warping phenomenon, the path of current reflux can be improved, the proportion of current reflux can be increased, and better power integrity / signal integrity performance can be achieved. In addition, the locking component can include screws with different pitch densities, reducing the probability that the detection device shakes during electrical detection and affects the detection result.

[0008] To make the above features and advantages of the present invention more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings. Description of the Drawings

[0009] Figure 1A is a partial cross-sectional schematic view of a detection device according to an embodiment of the present invention;

[0010] Figure 1B is an assembled schematic view of the locking component and the conductive structure of a detection device according to an embodiment of the present invention;

[0011] Figure 1C is a three-dimensional schematic view of the screw of the locking component of a detection device according to an embodiment of the present invention;

[0012] Figure 1D is a top view schematic view of the gasket of the locking component of a detection device according to an embodiment of the present invention;

[0013] Figure 1E is a top view schematic view of the threaded sleeve of the locking component of a detection device according to an embodiment of the present invention;

[0014] Figure 2 is a three-dimensional schematic view of the screw of the locking component of a detection device according to another embodiment of the present invention. Detailed Embodiments

[0015] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0016] The directional terms used herein (e.g., up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply absolute orientation.

[0017] The accompanying drawings of the present embodiment are referred to for a more comprehensive elaboration of the present invention. However, the present invention can also be embodied in various different forms and should not be limited to the embodiments described herein. The thickness, dimensions, or sizes of the layers or regions in the accompanying drawings are enlarged for clarity. Identical or similar reference numerals represent identical or similar elements, and will not be repeated in the following paragraphs.

[0018] Figure 1A is a partial cross-sectional schematic view of a detection device according to an embodiment of the present invention. Figure 1B is an assembled schematic view of a locking assembly and a conductive structure of a detection device according to an embodiment of the present invention. Figure 1C is a three-dimensional schematic view of a screw of a locking assembly of a detection device according to an embodiment of the present invention. Figure 1D is a top view schematic view of a gasket of a locking assembly of a detection device according to an embodiment of the present invention. Figure 1E is a top view schematic view of a threaded sleeve of a locking assembly of a detection device according to an embodiment of the present invention.

[0019] Please refer to Figures 1A to 1E , the detection device 100 of the present embodiment is used to detect a device under test, and the device under test is, for example, a semiconductor chip 10. The detection device 100 includes a carrier plate 110, a plurality of telescopic probes 120, a locking assembly 130, and a conductive structure 140. Further, the carrier plate 110 may have a through hole 112 and a ground pad 114 corresponding to the through hole 112. The carrier plate 110 has a first surface 110a and a second surface 110b opposite to the first surface 110a. The through hole 112 may penetrate from the first surface 110a to the second surface 110b, and the ground pad 114 may be disposed on the second surface 110b. And the through hole 112 may be used to accommodate the locking assembly 130. Herein, the carrier plate 110 may be any suitable circuit board, and the present invention is not limited thereto.

[0020] In the present embodiment, a plurality of telescopic probes 120 may be disposed parallel to the first surface 110a of the carrier plate 110. One end of each telescopic probe 120 may be connected to a contact point (not shown) on the carrier plate 110, and the other end may abut against the conductive terminal 12 of the semiconductor chip 10 to perform signal detection of the semiconductor chip 10. Herein, the conductive terminal 12 is a solder ball, but the present invention is not limited thereto, and the type of the conductive terminal 12 may be determined according to actual design requirements.

[0021] In one embodiment, the detection device 100 may further include a probe base 150, and the telescopic probes 120 may be located side by side inside the probe base 150 and pass through the probe base 150 in parallel with each other. For example, the probe base 150 may have an internal space and a plurality of columnar grooves (not shown), where the columnar grooves may be parallel to each other and connect the internal space so that the telescopic probes 120 can be respectively fixed in the columnar grooves.

[0022] In addition, the locking assembly 130 may be disposed between adjacent ones of the telescopic probes 120 through the through hole 112. Further, the locking assembly 130 may include a screw 132, and the screw 132 may include a head 1321 and an end 1322 connecting the head 1321. For example, the head 1321 may be the part of the screw 132 protruding from the first surface 110a of the carrier plate 110, and the end 1322 may be the part of the screw 132 passing through the through hole 112, but the present invention is not limited thereto.

[0023] In this embodiment, a conductive structure 140 is designed in the detection device 100. Part of the conductive structure 140 may be embedded in the locking assembly 130, and the conductive structure 140, the locking assembly 130, and the ground pad 114 are electrically connected, so that when subsequent detection is performed, the current of the semiconductor chip 10 can flow back to the ground pad 114 through the conductive structure 140 and the locking assembly 130. The current flow direction is as shown by the arrow in Figure 1A Therefore, while reducing the warping phenomenon, the path of current reflux can be improved, the proportion of current reflux can be increased, and better power integrity / signal integrity (PI / SI) performance can be achieved.

[0024] On the other hand, a locking assembly 130 is designed in the detection device 100, so that the head 1321 of the screw 132 has a pitch D11 and a pitch D21, and the density of the pitch D11 is different from the density of the pitch D21. Therefore, the locking assembly 130 may include screws 132 with different pitch densities, reducing the probability that the detection device 100 shakes during electrical detection and affects the detection result.

[0025] In one embodiment, the proportion of current reflux increased by the detection device 100 is, for example, 70%, but the present invention is not limited thereto.

[0026] In one embodiment, the density of the pitch D11 is less than the density of the pitch D21, and the pitch D11 is farther from the carrier plate 110 than the pitch D21. In other words, the pitch D11 has a sparser thread, while the pitch D21 has a denser thread, and the pitch D21 connects the pitch D11 and the end 1322. However, the present invention is not limited thereto. In other embodiments, the screw may have other pitch design manners.

[0027] In one embodiment, the conductive structure 140 may include conductive adhesive to make electrical connections by using the longitudinal conductivity of the conductive adhesive. However, the present invention is not limited thereto, and the conductive structure 140 may be any suitable conductive material.

[0028] In some embodiments, the top surface 140a of the conductive structure 140 may be coplanar with the top surfaces of the plurality of telescopic probes 120, so that the conductive terminals 12 of the semiconductor chip 10 can be surely abutted against the conductive structure 140 during subsequent detection, reducing the proportion of floating of the conductive terminals 12, and thus making effective electrical connections. However, the present invention is not limited thereto.

[0029] In one embodiment, the conductive structure 140 may have a protruding portion 142 on the locking assembly 130, and there may be a distance between the edge 142e of the protruding portion 142 and the edge 130e of the locking assembly 130. However, the present invention is not limited thereto.

[0030] In one embodiment, the protruding portion 142 may be arched. In other words, the top surface 140a of the conductive structure 140 may be arched. However, the present invention is not limited thereto.

[0031] In one embodiment, the locking assembly 130 may further include a gasket 134 and a threaded sleeve 136 stacked on the head 1321, and a part of the conductive structure 140 is located between the gasket 134 and the head 1321. Further, as Figure 1A 、 Figure 1B 、 Figure 1D and Figure 1E shown, the gasket 134 and the threaded sleeve 136 may respectively have a first hollow portion 1341 and a second hollow portion 1361, and the conductive structure 140 may be extruded from the first hollow portion 1341 and the second hollow portion 1361. However, the present invention is not limited thereto.

[0032] In one embodiment, the gasket 134 may be located between the threaded sleeve 136 and a part of the conductive structure 140 to reduce the friction generated between the threaded sleeve 136 and the conductive structure 140 when the threaded sleeve 136 is locked with the screw 132, thereby damaging the conductive structure 140. However, the present invention is not limited thereto.

[0033] In one embodiment, the top 136a of the threaded sleeve 136 may have a disassembly hole 1362 to facilitate separating the threaded sleeve 136 from the screw 132 by a corresponding jig (not shown) during subsequent maintenance or replacement. However, the present invention is not limited thereto.

[0034] In this embodiment, the locking assembly 130 may further include a nut 138. The nut 138 may be passed through the end portion 1322 of the screw 132 and disposed on the second surface 110b. Further, the detection device 100 may be configured to return the current of the semiconductor chip 10 to the ground pad 114 through the conductive structure 140, the screw 132, and the nut 138, and the current flow direction is as shown in Figure 1A the arrow shown, so in the case where the detection device 100 further includes a nut 138, the warping phenomenon can be reduced while improving the current return path, increasing the proportion of current return, and having better power integrity / signal integrity performance, but the present invention is not limited thereto.

[0035] In this embodiment, the detection device 100 further includes a support plate 160. The support plate 160 may be disposed on the second surface 110b, wherein the screw 132 may be passed through the support plate 160, and the support plate 160 may include a conductive material. Here, the conductive material may be any suitable material and is not limited by the present invention. Further, the detection device 100 may be configured to return the current of the semiconductor chip 10 to the ground pad 114 through the conductive structure 140, the screw 132, the nut 138, and the support plate 160, and the current flow direction is as shown in Figure 1A the arrow shown, so in the case where the detection device 100 further includes a support plate 160, the warping phenomenon can be reduced while improving the current return path, increasing the proportion of current return, and having better power integrity / signal integrity performance, but the present invention is not limited thereto.

[0036] In one embodiment, when the semiconductor chip 10 is a large-size package (such as a size greater than or equal to 60 mm x 60 mm), the warping phenomenon of the detection device will be more obvious. Therefore, the detection device 100 can achieve better effects when detecting the large-size packaged semiconductor chip 10, but the present invention is not limited thereto.

[0037] In one embodiment, the orthographic projection of the conductive structure 140 on the carrier 110 may overlap with the ground pad 114, but the present invention is not limited thereto.

[0038] In one embodiment, the orthographic projection of the locking assembly 130 on the carrier 110 may overlap with the ground pad 114, but the present invention is not limited thereto.

[0039] In one embodiment, the conductive structure 140 may be in direct contact with the screw 132, but the present invention is not limited thereto.

[0040] It must be noted here that the following embodiments follow the component numbers and some contents of the above embodiments, where the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted part, reference can be made to the foregoing embodiments, and the following embodiments will not be repeated.

[0041] Figure 2 is a three-dimensional schematic view of a screw of a locking component of a detection device according to another embodiment of the present invention. Please refer to Figure 2 , compared with the detection device 100, the density of the pitch D22 of the screw 232 of the detection device in this embodiment is less than the density of the pitch D12. The pitch D22 is closer to the carrier plate 110 than the pitch D12. In other words, the pitch D12 has denser threads, while the pitch D22 has sparser threads, and the pitch D22 connects the pitch D12 and the end 2322, but the present invention is not limited thereto.

[0042] In summary, a conductive structure is designed in the detection device of the present invention. Some conductive structures can be embedded in the locking component, and the conductive structure, the locking component and the grounding pad are electrically connected, so that the current of the semiconductor chip can flow back to the grounding pad through the conductive structure and the locking component during subsequent detection. Therefore, the warping phenomenon can be reduced while improving the current return path and increasing the proportion of current return, having better power integrity / signal integrity performance. In addition, the locking component can include screws with different pitch densities, reducing the probability that the detection device shakes during electrical detection and affecting the detection result.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A detection device for detecting semiconductor chips, characterized in that, Comprising: A carrier board having vias and ground pads corresponding to the vias, wherein the carrier board has a first surface and a second surface opposite the first surface, the vias penetrate from the first surface to the second surface, and the ground pads are disposed on the second surface; A plurality of telescopic probes disposed parallel to the first surface of the carrier board; A locking assembly passing through the vias, wherein the locking assembly includes a screw, and the head of the screw has a first pitch and a second pitch, and the density of the first pitch is different from the density of the second pitch; And A conductive structure partially embedded in the locking assembly, wherein the conductive structure, the locking assembly, the semiconductor chip and the ground pad are electrically connected.

2. The detection device according to claim 1, wherein The density of the first pitch is less than the density of the second pitch, and the first pitch is farther from the carrier board than the second pitch.

3. The detection device according to claim 1, wherein The density of the first pitch is less than the density of the second pitch, and the first pitch is closer to the carrier board than the second pitch.

4. The detection device according to claim 1, characterized in that, The conductive structure includes conductive adhesive.

5. The detection device according to claim 1, characterized in that, The top surface of the conductive structure is coplanar with the top surfaces of the plurality of telescopic probes.

6. The detection device according to claim 1, wherein, The locking assembly further includes a washer and a threaded sleeve stacked on the head, and a part of the conductive structure is located between the washer and the head.

7. The detection device according to claim 6, characterized in that, The washer and the threaded sleeve respectively have a first hollow portion and a second hollow portion, and the conductive structure is extruded from the first hollow portion and the second hollow portion.

8. The detection device according to claim 1, characterized in that, The locking assembly further includes a nut sleeved on the end of the screw relative to the head and disposed on the second surface.

9. The detection device according to claim 1, wherein Further included is a support plate disposed on the second surface, wherein the screw passes through the support plate, and the support plate includes a conductive material.

10. A detection device for detecting a semiconductor chip, wherein the detection device includes: A carrier board having vias and ground pads corresponding to the vias, wherein the carrier board has a first surface and a second surface opposite the first surface, the vias penetrate from the first surface to the second surface, and the ground pads are disposed on the second surface; A plurality of telescopic probes disposed parallel to the first surface of the carrier board; A locking assembly passing through the vias, wherein the locking assembly includes a screw, and the head of the screw has a first pitch and a second pitch, and the density of the first pitch is different from the density of the second pitch; And A conductive structure disposed on the locking assembly, wherein the detection device is used to return the current of the semiconductor chip to the ground pad through the conductive structure and the locking assembly.

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