Glass substrate processing method and display device

Abstract

The present application provides a glass substrate processing method and a display device. The glass substrate is applied to the display device. The glass substrate processing method includes: providing a glass substrate, the glass substrate having a first surface and a second surface disposed opposite to each other, the first surface and the second surface are both provided with metal traces; punching holes at the positions where the metal traces are disposed on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface, and forming via holes on the glass substrate; plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal traces on the first surface, and the cross section of the metal traces on the second surface to connect the metal traces on the first surface with the metal traces on the second surface. The glass substrate processing method provided by the present application can improve the line connectivity yield of the two sides of the glass substrate of the display device.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a glass substrate processing method and a display device. Background Art

[0002] With the development of display technology, more and more types of display devices have appeared on the market. After CRT (CathodeRay Tube) display and LCD (Liquid Crystal Display), LED (light-emitting diode) display appeared. With the development of semiconductor technology, LED display has gradually developed into MiniLED display and MicroLED display with better display effect.

[0003] In existing LED displays, Mini LED displays and Micro LED displays, LED / Mini LED / Micro LED circuits are attached to one side of the TFT AM glass substrate, and driver IC circuits are attached to the other side. The circuits on both sides of the glass substrate must be connected to make the display work. In related technologies, metal transfer is usually used at the edge of the glass substrate to achieve the connection of the circuits on both sides of the glass substrate, but this solution currently has many problems that are difficult to solve, resulting in a low connection yield of the circuits on both sides of the glass substrate.

[0004] Therefore, it is necessary to provide a new glass substrate processing method and a display device to solve the above technical problems. Summary of the invention

[0005] The embodiments of the present application provide a glass substrate processing method and a display device to improve the connection yield rate of circuits on both sides of a glass substrate of the display device.

[0006] The present application provides a glass substrate processing method, wherein the glass substrate is applied to a display device, and the glass substrate processing method includes:

[0007] Providing a glass substrate, the glass substrate having a first surface and a second surface disposed opposite to each other, and both the first surface and the second surface are provided with metal traces;

[0008] Punching holes at locations where metal traces are disposed on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface, and forming via holes on the glass substrate; and

[0009] Metal is plated on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface to connect the metal wiring on the first surface with the metal wiring on the second surface.

[0010] Optionally, there are multiple via holes, and the multiple via holes are arranged in a straight line on the glass substrate, and one via hole corresponds to a metal trace on the first surface and a metal trace on the second surface; after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, the step further includes:

[0011] The glass substrate is split to break the glass substrate into two pieces along the arrangement direction of the plurality of via holes.

[0012] Optionally, before the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, the step further includes:

[0013] A barrier material is disposed on the metal wiring on the first surface and the metal wiring on the second surface to protect the metal wiring on the first surface and the metal wiring on the second surface.

[0014] Optionally, the step of providing a barrier material on the metal traces on the first surface and the metal traces on the second surface specifically includes:

[0015] A reserved position is arranged at the periphery of each via hole, the size of the reserved position is larger than the size of the via hole, and the via hole is arranged within the range of the reserved position; and

[0016] A barrier material is applied to the metal wiring on the first surface except the reserved position and to the metal wiring on the second surface except the reserved position.

[0017] Optionally, the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface specifically includes:

[0018] The glass substrate provided with the barrier material is immersed in a metal liquid so that the metal is deposited on the cross section of the glass substrate at the via hole and on the reserved position to form a coating.

[0019] Optionally, after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, and before the step of splitting the glass substrate, the step further includes:

[0020] The barrier material on the metal traces on the first surface and the barrier material on the metal traces on the second surface are removed to expose the metal traces on the first surface and the metal traces on the second surface.

[0021] Optionally, the metal elements in the molten metal include any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium and aluminum.

[0022] Optionally, the via hole and the reserved position are both circular, and a diameter of the reserved position is at least 10 microns larger than a diameter of the via hole.

[0023] Optionally, the step of punching holes at positions where metal traces are provided on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface, and forming via holes on the glass substrate specifically includes:

[0024] The positions where the metal wirings are arranged on the glass substrate are punched with a laser to cut off the metal wirings on the first surface and the metal wirings on the second surface, and form via holes with a diameter of 100 to 300 microns on the glass substrate.

[0025] An embodiment of the present application further provides a display device, characterized in that the display device comprises a glass substrate, and the glass substrate is processed by using any of the above glass substrate processing methods.

[0026] In the glass substrate processing method provided in the embodiment of the present application, the glass substrate has a first surface and a second surface arranged opposite to each other, and metal traces are arranged on both the first surface and the second surface. The metal traces on the first surface and the second surface are cut off by punching holes at positions where the metal traces are arranged on the glass substrate, and via holes are formed on the glass substrate. Metal is plated to form a continuous metal plating layer between the cross section of the metal traces on the first surface, the cross section of the glass substrate at the via hole, and the cross section of the metal traces on the second surface. The metal traces on the first surface are electrically connected to the metal traces on the second surface through the continuous metal plating layer, thereby avoiding poor circuit connection caused by metal falling off due to insufficient metal adhesion in the traditional solution, and improving the circuit connection yield rate of the two sides of the glass substrate of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. In the following description, the same figure numerals represent the same parts. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative work.

[0028] Figure 1 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0029] Figure 2 A flow chart of a glass substrate processing method provided in an embodiment of the present application.

[0030] Figure 3 Another flow chart of the glass substrate processing method provided in the embodiment of the present application.

[0031] Figure 4 A front view of a glass substrate in a first state during processing provided by an embodiment of the present application.

[0032] Figure 5 A cross-sectional view of a glass substrate in a first state during processing provided by an embodiment of the present application.

[0033] Figure 6 This is a front view of a second state of a glass substrate during processing provided by an embodiment of the present application.

[0034] Figure 7 A cross-sectional view of a glass substrate in a second state during processing provided by an embodiment of the present application.

[0035] Figure 8 This is a front view of a glass substrate in a third state during processing provided by an embodiment of the present application.

[0036] Fig. 9 A cross-sectional view of a glass substrate in a third state during processing provided by an embodiment of the present application.

[0037] Fig.10 This is a front view of a glass substrate in a fourth state during processing provided by an embodiment of the present application.

[0038] Fig.11 This is a cross-sectional view of a glass substrate in a fourth state during processing provided by an embodiment of the present application.

[0039] Fig.12 This is a front view of the fifth state of the glass substrate processing process provided by the embodiment of the present application.

[0040] Fig.13This is a cross-sectional view of a glass substrate in a fifth state during processing provided by an embodiment of the present application.

[0041] Fig.14 This is a front view of a sixth state of the glass substrate processing process provided by an embodiment of the present application.

[0042] Fig.15 This is a cross-sectional view of a sixth state of the glass substrate processing process provided by an embodiment of the present application. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0044] The embodiments of the present application provide a glass substrate processing method and a display device to improve the connection yield rate of circuits on both sides of the glass substrate of the display device.

[0045] See also Figure 1 , Figure 1 A schematic diagram of the structure of the display device provided in the embodiment of the present application. The display device 1 can be any product or component with a display function, such as a mobile phone, a navigator, an electronic paper, a television, a digital photo frame, a tablet computer, a laptop computer, etc. The accompanying drawings of the embodiment of the present application illustrate the display device 1 by taking the display device 1 as a television as an example, but the embodiment of the present application does not limit the specific type of the display device 1. The display device 1 may include a housing 11 and a display 12. Among them, the display 12 may be a display such as an LED display, a Mini LED display or a MicroLED display. The display 12 is mounted on the housing 11 to realize the display function (and touch function) of the display device 1. When the display device 1 is a mobile terminal such as a smart phone or a tablet computer, the display 12 is used for both display and touch.

[0046] It should be noted that the structure of the display device 1 in the embodiment of the present application is not limited thereto, and the display device 1 may further include components such as a cover plate, a main board, a battery, a camera module, a speaker, and a sensor (all not shown in the figure). For the introduction of components such as the cover plate, the main board, the battery, the camera module, the speaker, and the sensor, please refer to the description of the above components in the relevant technology, which will not be repeated here.

[0047] The housing 11 can form the outer contour of the display device 1. At the same time, the housing 11 can serve as a protective shell for various internal components of the display device 1 to prevent the various internal components of the display device 1 from being damaged due to collision, falling, etc. of the display device 1. The housing 11 can be integrally formed. During the molding process of the housing 11, structures such as a microphone hole, a speaker hole, a receiver hole, an earphone hole, a USB interface hole, a rear camera hole, and a fingerprint recognition module installation hole can be formed on the housing 11.

[0048] The shell 11 can be a metal shell, such as magnesium alloy, stainless steel and other metals. It should be noted that the material of the shell 11 in the embodiment of the present application is not limited to this, and can also be other materials. For example: the shell 11 can be a plastic shell, the shell 11 can also be a ceramic shell, the shell 11 can also include a plastic part and a metal part at the same time, and the shell 11 can be a shell structure in which metal and plastic cooperate with each other. Specifically, the metal part can be formed first, such as forming a magnesium alloy substrate by casting, and then plastic is injection molded on the magnesium alloy substrate to form a plastic substrate to form a complete shell structure. It should be noted that the material and process of the shell 11 are not limited to this, and a glass shell can also be used. The embodiment of the present application does not limit the specific material and specific manufacturing process of the shell 11.

[0049] The display 12 can form an interactive interface of the display device 1. At the same time, the display 12 can serve as the display surface of the display device 1, and the user can see the text or image displayed by the display device 1 through the display surface. The display 12 may include a glass substrate and other components. Among them, metal traces are provided on both the upper and lower surfaces of the glass substrate. For the introduction of the glass substrate and other components, please refer to the description of the LED display, Mini LED display or MicroLED display in the relevant technology, which will not be repeated here.

[0050] It should be noted that in displays such as LED displays, Mini LED displays or MicroLED displays, one side of the TFTAM glass substrate is provided with LED / Mini LED / MicroLED circuits, and the other side is provided with driver IC circuits. The circuits on both sides of the glass substrate need to be connected for the display to work. In the related art, a metal transfer method is usually used at the edge of the glass substrate to achieve the connection of the circuits on both sides of the glass substrate, but the current problems of this solution are: high cost, uneven cross-section of the glass side, too thin transferred metal circuits, insufficient adhesion, resulting in low connection yield of the circuits on both sides of the glass substrate. Therefore, the embodiment of the present application provides a glass substrate processing method that can improve the connection yield of the circuits on both sides of the glass substrate of the display device.

[0051] See also Figure 2 and Figure 3 , Figure 2A flow chart of a glass substrate processing method provided in an embodiment of the present application, Figure 3 Another flow chart of the glass substrate processing method provided in the embodiment of the present application. The glass substrate processing method provided in the embodiment of the present application includes:

[0052] S110, providing a glass substrate, wherein the glass substrate has a first surface and a second surface disposed opposite to each other, and metal traces are disposed on both the first surface and the second surface.

[0053] See also Figure 4 and Figure 5 , Figure 4 A front view of a glass substrate in a first state during processing provided by an embodiment of the present application, Figure 5 This is a cross-sectional view of the first state of the glass substrate processing process provided by the embodiment of the present application. The glass substrate 2 has a first surface 21 and a second surface 22 arranged opposite to each other. The first surface 21 can be arranged close to the display surface of the display 12, and the second surface 22 can be arranged close to the non-display surface of the display 12. The first surface 21 can also be arranged close to the non-display surface of the display 12, and the second surface 22 can also be arranged close to the display surface of the display 12. Among them, metal traces 23 are arranged on both the first surface 21 and the second surface 22.

[0054] In some embodiments, the projection of the portion of the metal trace 23 located on the second surface 22 and the portion of the metal trace 23 located on the first surface 21 in the thickness direction of the glass substrate 2 coincides. In other words, the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 are arranged correspondingly.

[0055] In some embodiments, the projections of the portion of the metal trace 23 located on the second surface 22 and the portion of the metal trace 23 located on the first surface 21 in the thickness direction of the glass substrate 2 do not overlap. In other words, the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 are staggered.

[0056] S120, punching holes at positions where metal wiring is provided on the glass substrate to cut off the metal wiring on the first surface and the metal wiring on the second surface, and forming via holes on the glass substrate.

[0057] See also Figure 6 and Figure 7 , Figure 6 This is a front view of a second state of a glass substrate during processing provided by an embodiment of the present application. Figure 7The cross-sectional view of the second state of the glass substrate processing process provided in the embodiment of the present application. In the process of drilling, because the metal wiring 23 is arranged on the surface of the glass substrate 2, drilling at the position where the metal wiring 23 is arranged on the glass substrate 2 will inevitably cut off the metal wiring 23 first, and then hit the glass substrate 2 and even penetrate the glass substrate 2 to form the via 20.

[0058] If the glass substrate 2 is punched from the first surface 21 to the second surface 22 , the metal traces 23 on the first surface 21 are first cut off, then the vias 20 are formed on the glass substrate 2 , and finally the metal traces 23 on the second surface 22 are cut off.

[0059] If the glass substrate 2 is punched from the second surface 22 to the first surface 21 , the metal traces 23 on the second surface 22 are first cut off, then the vias 20 are formed on the glass substrate 2 , and finally the metal traces 23 on the first surface 21 are cut off.

[0060] If the glass substrate 2 is punched from the first surface 21 and the second surface 22 at the same time, the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are cut off at the same time, and then the vias 20 are formed on the glass substrate 2 .

[0061] It should be noted that if the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are arranged correspondingly, the glass substrate 2 needs to be vertically punched so that the axial direction of the formed via hole 20 is parallel to the thickness direction of the glass substrate 2. If the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are staggered, the glass substrate 2 needs to be obliquely punched so that the axial direction of the formed via hole 20 is inclined to the thickness direction of the glass substrate 2.

[0062] It should also be noted that there can be multiple metal traces 23 on the first surface 21 and multiple metal traces 23 on the second surface 22, and the multiple metal traces 23 can be arranged in parallel and spaced apart from each other on the glass substrate 2. Then, there can also be multiple vias 20, and the multiple vias 20 can be arranged in a straight line on the glass substrate 2.

[0063] In some embodiments, the step of punching holes at locations where metal traces are disposed on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface specifically includes:

[0064] S121, using a laser to punch holes at locations where metal traces are disposed on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface, and forming via holes with a diameter of 100 micrometers to 300 micrometers on the glass substrate.

[0065] There can be various specific tools for drilling holes in the glass substrate 2. The embodiment of the present application takes the use of laser to drill holes in the glass substrate 2 as an example for explanation. It can be understood that because the laser has the characteristics of directional light emission, extremely high brightness and great energy, the use of laser drilling can have high accuracy and efficiency. On the other hand, the use of laser drilling can well control the size of the holes. The diameter of the via 20 formed on the glass substrate can be micron-level, such as 100 microns to 300 microns, specifically 200 microns. Of course, the diameter of the via 20 can be adaptively adjusted according to specific needs, and the embodiment of the present application does not limit the specific diameter of the via 20.

[0066] S130, plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface to connect the metal wiring on the first surface with the metal wiring on the second surface.

[0067] After punching holes at the positions where the metal traces 23 are provided on the glass substrate 2 to cut off the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 and forming via holes 20 on the glass substrate 2, the glass substrate 2 forms a section at the via holes 20, and the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 also form sections at the cutoff positions. Metal is plated on the sections of the three, and a path can be formed through the metal plating layer to electrically connect the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22.

[0068] In some embodiments, before the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, the step further includes:

[0069] S131, setting a reserved position at the periphery of each via hole, wherein the size of the reserved position is larger than the size of the via hole, and the via hole is set within the range of the reserved position; and

[0070] S132, applying a barrier material to the metal wiring on the first surface except the reserved position and the metal wiring on the second surface except the reserved position, so as to protect the metal wiring on the first surface and the metal wiring on the second surface.

[0071] See also Figure 8 and Fig. 9 , Figure 8 This is a front view of a glass substrate in a third state during processing provided by an embodiment of the present application. Fig. 9A cross-sectional view of the third state during the processing of the glass substrate provided in an embodiment of the present application. Because the barrier material 25 is not coated within the range of the reserved position 24, the range of the reserved position 24 (including the via 20) is exposed to the outside. Then, when the metal is subsequently plated, all exposed parts can be covered with the metal coating. By setting the size of the reserved position 24 to be larger than the size of the via 20, the size of the metal coating formed at the reserved position 24 can be larger than the size of the metal coating formed in the via 20, so that the metal wiring 23 on the first surface 21 and the metal wiring 23 on the second surface 22 can have a larger contact area with the plated metal, which can ensure that the circuits on both sides of the glass substrate 2 have a higher connection yield.

[0072] The shape of the reserved position 24 can be a rectangle or a square, or a circle. The embodiment of the present application does not limit the specific shape of the reserved position 24. When the reserved position 24 is a circle, the diameter of the reserved position 24 is at least 10 microns larger than the diameter of the via 20. Of course, the difference between the diameter of the reserved position 24 and the diameter of the via 20 can be adaptively adjusted according to specific needs, and the embodiment of the present application does not limit the specific difference between the diameter of the reserved position 24 and the diameter of the via 20.

[0073] In some embodiments, the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface specifically includes:

[0074] S133, soaking the glass substrate after the barrier material is provided with a metal liquid, so that the metal is deposited on the cross section of the glass substrate at the via hole and on the reserved position to form a coating.

[0075] See also Fig.10 and Fig.11 , Fig.10 This is a front view of a fourth state of a glass substrate during processing provided by an embodiment of the present application. Fig.11 This is a cross-sectional view of the fourth state of the glass substrate processing process provided in the embodiment of the present application. The metal elements in the metal liquid may include any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium, and aluminum. Usually, the metal liquid containing a metal with good conductivity is used to immerse the glass substrate 2, so that the conductivity of the metal coating 26 can be better.

[0076] In some embodiments, after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, the step further includes:

[0077] S134, removing the barrier material on the metal wiring on the first surface and the barrier material on the metal wiring on the second surface to expose the metal wiring on the first surface and the metal wiring on the second surface.

[0078] See also Fig.12 and Fig.13 , Fig.12 This is a front view of a fifth state of the glass substrate processing process provided by an embodiment of the present application. Fig.13 This is a cross-sectional view of the fifth state of the glass substrate processing process provided in the embodiment of the present application. After the glass substrate 2 is immersed in the metal liquid, the via 20 and the reserved position 24 are filled with the metal coating 26, and the previously set barrier material 25 is removed to retain only the metal traces 23 and the metal coating 26 on the glass substrate 2.

[0079] In some embodiments, after removing the barrier material on the first surface and the barrier material on the second surface, the method further includes:

[0080] S135, splitting the glass substrate so that the glass substrate is broken along the arrangement direction of the plurality of via holes.

[0081] See also Fig.14 and Fig.15 , Fig.14 This is a front view of a sixth state of the glass substrate processing process provided by an embodiment of the present application. Fig.15 This is a cross-sectional view of the sixth state of the glass substrate processing process provided in the embodiment of the present application. The glass substrate 2 is split along the arrangement direction of the plurality of via holes 20 so that the glass substrate 2 is broken along the arrangement direction of the plurality of via holes 20. Then, a glass substrate circuit board with two glass edge traces connecting the upper and lower surface circuits and a flat glass edge cross section can be obtained through one processing.

[0082] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] The glass substrate processing method and display device provided in the embodiments of the present application are introduced in detail above. The principles and implementation methods of the present application are explained in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. For technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A glass substrate processing method, characterized in that: The glass substrate is applied to a display device, and the glass substrate processing method includes: Providing a glass substrate, the glass substrate having a first surface and a second surface disposed opposite to each other, and both the first surface and the second surface are provided with metal traces; Punching holes at locations where metal traces are disposed on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface, and forming via holes on the glass substrate; and Plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface to connect the metal wiring on the first surface with the metal wiring on the second surface; There are multiple via holes, and the multiple via holes are arranged in a straight line on the glass substrate, and one via hole corresponds to a metal trace on the first surface and a metal trace on the second surface; after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, the method further includes: The glass substrate is split to break the glass substrate into two pieces along the arrangement direction of the plurality of via holes.

2. The glass substrate processing method according to claim 1, characterized in that: Before the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, the step further includes: A barrier material is disposed on the metal wiring on the first surface and the metal wiring on the second surface to protect the metal wiring on the first surface and the metal wiring on the second surface.

3. The glass substrate processing method according to claim 2, characterized in that: The step of providing a barrier material on the metal traces on the first surface and the metal traces on the second surface specifically includes: A reserved position is provided at the periphery of each of the via holes, the size of the reserved position is larger than the size of the via hole, and the via hole is located within the range of the reserved position; and A barrier material is applied to the metal wiring on the first surface except the reserved position and to the metal wiring on the second surface except the reserved position.

4. The glass substrate processing method according to claim 3, characterized in that: The step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface specifically includes: The glass substrate provided with the barrier material is immersed in a metal liquid so that the metal is deposited on the cross section of the glass substrate at the via hole and on the reserved position to form a coating.

5. The glass substrate processing method according to claim 4, characterized in that: After the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wiring on the first surface, and the cross section of the metal wiring on the second surface, and before the step of splitting the glass substrate, the method further includes: The barrier material on the metal traces on the first surface and the barrier material on the metal traces on the second surface are removed to expose the metal traces on the first surface and the metal traces on the second surface.

6. The glass substrate processing method according to claim 4, characterized in that: The metal elements in the metal liquid include any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium and aluminum.

7. The glass substrate processing method according to claim 2, characterized in that: The via hole and the reserved position are both circular, and the diameter of the reserved position is at least 10 microns larger than the diameter of the via hole.

8. The glass substrate processing method according to any one of claims 1 to 7, characterized in that: The step of punching holes at positions where metal traces are arranged on the glass substrate to cut off the metal traces on the first surface and the metal traces on the second surface and forming via holes on the glass substrate specifically includes: The positions where the metal wirings are arranged on the glass substrate are punched with a laser to cut off the metal wirings on the first surface and the metal wirings on the second surface, and form via holes with a diameter of 100 to 300 microns on the glass substrate.

9. A display device, characterized in that: The display device comprises a glass substrate, and the glass substrate is processed by the glass substrate processing method according to any one of claims 1 to 8.

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