Resin-sealed electronic component and method for manufacturing the same

By designing a pair of resin components and a labyrinth structure within the resin housing, the problem of deformation and damage to the flexible substrate caused by the molding resin is solved, ensuring the stability and reliability of the torque sensor.

CN114434730BActive Publication Date: 2025-12-30PROTERIAL LTD
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Patent Information

Application Number
CN202111288885.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-11-04
Filing Date
2021-11-02
Publication Date
2025-12-30
Estimated Expiration
2041-11-02

AI Technical Summary

Technical Problem

When sealing torque sensors with multiple flexible substrates, the fluid pressure of the molding resin may cause deformation or damage to the flexible substrates, affecting the shape and reliability of the detection coil.

Method used

The design employs a resin housing, comprising a pair of resin components and a molded resin component. By forming an inhibitory structure, such as a labyrinth structure, between the resin components, molten resin is prevented from entering the storage space, ensuring the stability of the flexible substrate.

Benefits of technology

It effectively prevents the molding resin from deforming and damaging the flexible substrate, ensuring the proper shape of the detection coil and the reliable transmission of electrical signals.

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Abstract

The present application provides a resin-sealed electronic component and a manufacturing method thereof, which can seal an electronic component main body with a resin case including a sealing member made of a molded resin, and can suppress deformation, damage, or the like of the electronic component main body due to the melted molded resin. The solution is to seal a detection portion (2) with a resin case (3) in a torque sensor (1). The resin case (3) has: a first resin member (4) and a second resin member (5) arranged in a radial direction across a housing space (30) in which the detection portion (2) is housed; and a sealing member (6) made of a molded resin that is molded so as to cover at least a part of each of the first resin member (4) and the second resin member (5). A part of the first resin member (4) and a part of the second resin member (5) are arranged in an axial direction, forming a suppression structure that suppresses the molded resin from entering the housing space (30).
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Description

Technical Field

[0001] This invention relates to a resin-sealed electronic component formed by sealing the main body of an electronic component with a resin housing, and a method for manufacturing the same. Background Technology

[0002] Conventionally, resin-sealed electronic components, which utilize resin housings to seal the main body of electronic components, are used, for example, in automobiles as torque sensors for detecting the torque of shafts that transmit the driving force of a drive source. As such a torque sensor, the applicant has proposed the torque sensor described in Patent Document 1.

[0003] The torque sensor described in Patent Document 1 comprises: a coil member, which serves as the main body of the electronic component, formed by winding an insulated wire onto a resin spool; an inner mold formed by molding resin to cover the coil member; and an outer mold formed by molding resin to cover the inner mold. Multiple inclined grooves, intersecting each other and inclined at 45° to one side and the other side relative to the axial direction of the shaft being detected, are formed on the outer peripheral surface of the spool, and the insulated wire is housed in these inclined grooves. By covering the coil member with the inner and outer molds, environmental resistance is improved, allowing the torque sensor to be installed even in areas exposed to lubricating oil, mud, or water.

[0004] In addition, the applicant has proposed a torque sensor in which the detection coil is formed by wiring patterns respectively disposed on multiple stacked flexible substrates (see Patent Document 2). By forming the detection coil in this way, it is not necessary to wind insulated wires on a spool as described in Patent Document 1, thus achieving cost reduction.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2020-85814

[0008] Patent Document 2: Japanese Patent Application Publication No. 2017-49124 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] For example, if a torque sensor is constructed by sealing multiple flexible substrates described in Patent Document 2 using a sealing member made of molding resin, a low-cost torque sensor with excellent environmental resistance can be obtained. However, if multiple flexible substrates are directly sealed with molding resin, the flexible substrates may deform due to the fluid pressure of the molding resin during the molding of the sealing member, the detection coil may not be formed into an appropriate shape, or wire breaks may occur.

[0011] Alternatively, as a countermeasure, one could consider molding the resin in a manner that covers at least a portion of each of the pre-formed resin components, while housing multiple flexible substrates within a storage space formed by a pre-formed pair of resin components. However, even in this case, if a large amount of molten molding resin intrudes into the storage space from the gap between the pair of resin components during the molding of the sealing component, deformation or damage to the flexible substrates may occur.

[0012] Therefore, the object of the present invention is to provide a resin-sealed electronic component and a method for manufacturing the same, which can seal the electronic component body by means of a resin shell containing a sealing member made of molding resin, and can suppress deformation, damage, etc. of the electronic component body caused by the molten molding resin.

[0013] Methods for solving problems

[0014] To address the aforementioned issues, this invention provides a resin-sealed electronic component, which is formed by sealing the main body of the electronic component with a resin housing. The resin housing comprises: a pair of resin members arranged along a first direction, separated by a storage space for housing the main body of the electronic component; and a sealing member made of molding resin, molded to cover at least a portion of each of the pair of resin members. A portion of one resin member and a portion of the other resin member are arranged along a second direction intersecting the first direction, forming an inhibitory structure that prevents the molding resin from entering the storage space.

[0015] In addition, in order to solve the above-mentioned problems, the present invention provides a method for manufacturing a resin-sealed electronic component, which is the same method for manufacturing the above-mentioned resin-sealed electronic component, comprising: a configuration step, wherein the electronic component body is housed in the housing space thereby configuring the pair of resin components in a mold; and an injection molding step, wherein molten molding resin is injected into the mold and the sealing component is formed, wherein in the injection molding step, the portion of one resin component and the portion of the other resin component located on the side farther from the housing space in the second direction is pressed to the housing space side by the fluid pressure of the molten molding resin.

[0016] Invention Effects

[0017] According to the resin-sealed electronic component and its manufacturing method of the present invention, the electronic component body can be sealed by using a resin shell containing a sealing member made of molding resin, and deformation, damage, etc. of the electronic component body due to molten molding resin can be suppressed. Attached Figure Description

[0018] Figure 1 This is a perspective view of a torque sensor, which is an example of a resin-sealed electronic component according to an embodiment of the present invention.

[0019] Figure 2 It is Figure 1 A three-dimensional view of the cross-section of the torque sensor in the AA-line section, together with the shaft that is the object of torque detection.

[0020] Figure 3 (a) is an enlarged cross-sectional view showing a portion of the torque sensor. (b) is a top view showing the wiring pattern disposed on one side of the second flexible substrate. (c) is a top view showing the wiring pattern disposed on the other side of the second flexible substrate.

[0021] Figure 4 (a) is an overall perspective view showing the first resin component. (b) is a partial perspective view showing a portion of the first resin component.

[0022] Figure 5 (a) is a cross-sectional perspective view of the second resin component. (b) is a partial perspective view showing a portion of the second resin component.

[0023] Figure 6 (a) and (b) are illustrative diagrams showing the state before and after forming the sealing component using a mold with an upper mold and a lower mold.

[0024] Figure 7 This is a cross-sectional view showing the injection molding process of the torque sensor involved in the comparative example.

[0025] Figure 8 (a) and (b) are cross-sectional views showing a portion of the torque sensor involved in the first and second variations.

[0026] Figure 9 (a) to (c) are cross-sectional views showing a portion of the torque sensor involved in the third to fifth variations.

[0027] Symbol Explanation

[0028] 1. 1B-1F: Torque sensor (resin-sealed electronic component); 2: Detection unit (electronic component body); 3. 3B-3F: Resin housing; 30: Storage space; 4. 4A-4F: First resin component; 41: Inner cylindrical portion; 42. 42B-42F: First cover (part of the first resin component); 421: First protrusion (part of the first resin component); 5. 5A-5F: Second resin component; 51: Outer cylindrical portion; 52. 52A-52F: Second cover (part of the second resin component); 523: Second protrusion (part of the second resin component); 6: Sealing component; 9: Mold; S 01 S 02 SB 01 SC 01 SC 02 SC 03 SC 04 SD 01 SE 01 SE 02 SE 03 SF 01 SF 02 SF 03 : Bending section; S2, SC3, SE2, SF1: Gap. Detailed Implementation

[0029] [Implementation Method]

[0030] Figure 1 This is a perspective view of a torque sensor 1, which is an example of a resin-sealed electronic component according to an embodiment of the present invention. Figure 2 It is Figure 1 The cross-section of torque sensor 1 along line AA is shown in a perspective view together with shaft 8, which is the object of torque detection. Torque sensor 1 is mounted, for example, in an automobile, to detect the torque transmitted by shaft 8. Shaft 8 rotates about the rotation axis O, transmitting the driving force of a drive source such as an engine.

[0031] The torque sensor 1 is constructed by sealing the cylindrical detection unit 2, which is the main body of the electronic component, with a resin housing 3. Here, "sealed" means that when using the torque sensor 1, foreign objects such as liquids and dust will not enter from the outside of the resin housing 3 and come into contact with the detection unit 2. The detection unit 2 outputs an electrical signal corresponding to the magnitude of the torque transmitted by the shaft 8 to a control device (not shown) via a cable 7 extending from the resin housing 3. The cable 7 has multiple wires, including a pair of signal lines 71 and 72, which are covered by a sheath 73.

[0032] Shaft 8 is a strongly magnetic material exhibiting magnetostrictive effect. Magnetostriction refers to the phenomenon where the shape of a strongly magnetic material deforms (strains) when a magnetic field is applied to it and it is magnetized. Furthermore, by utilizing this phenomenon in reverse, the torque acting on shaft 8 can be detected by detecting the magnetic field generated due to the deformation of the shape using the detection unit 2. As shaft 8, a shaft made of chromium steel containing chromium, such as chromium steel, chromium-molybdenum steel, or nickel-chromium-molybdenum steel, can be suitable for carburizing, quenching, and tempering, followed by shot peening hardening.

[0033] The resin housing 3 includes first and second resin components 4 and 5, and a sealing component 6 made of molding resin, molded to cover at least a portion of each of the first and second resin components 4 and 5. The detection unit 2 is housed in a housing space 30 formed between the pair of resin components 4 and 5. The housing space 30 is formed in an annular shape around an axis 8.

[0034] Figure 3 (a) is an enlarged cross-sectional view showing a portion of the torque sensor 1. The detection unit 2 is configured to have stacked first to third flexible substrates 21 to 23. Wiring patterns 211, 231, 221, and 222 made of copper foil are respectively provided on one side of the first flexible substrate 21 and the third flexible substrate 23 and on both sides of the second flexible substrate 22. The second flexible substrate 22 is disposed between the first flexible substrate 21 and the third flexible substrate 23. The first to third flexible substrates 21 to 23 are bent into a ring shape and housed in the housing space 30.

[0035] Adhesive layers 241 and 242 are respectively provided between one side of the second flexible substrate 22 and the side of the first flexible substrate 21 without wiring pattern 211, and between the other side of the second flexible substrate 22 and the side of the third flexible substrate 23 without wiring pattern 231. These adhesive layers 241 and 242 integrate the first to third flexible substrates 21 to 23. In addition, cover layers 25 and 26, which serve as protective films, are bonded to the side of the first flexible substrate 21 with wiring pattern 211 and the side of the third flexible substrate 23 with wiring pattern 231, respectively, through adhesive layers 243 and 244.

[0036] The wiring patterns 211, 221, 222, and 231 of the first to third flexible substrates 21 to 23 are formed with coils for detecting the magnetic field generated by the deformation of the shaft 8. Multiple terminal portions are respectively provided on the first to third flexible substrates 21 to 23, and some of the terminal portions are connected to signal lines 71 and 72.

[0037] Figure 3 (b) is a top view showing the wiring pattern 221 disposed on one surface 22a of the second flexible substrate 22. Figure 3(c) is a top view showing the wiring pattern 222 disposed on the other side 22b of the second flexible substrate 22. On one side 22a of the second flexible substrate 22, 10 detection coils 221a to 221j are formed by the wiring pattern 221, and on the other side 22b of the second flexible substrate 22, 10 detection coils 222a to 222j are formed by the wiring pattern 222.

[0038] In addition, a second flexible substrate 22 is provided with Figure 3 In (b) and (c), a plurality of vias V, indicated by black dots, and a plurality of terminal portions 224a to 224d are shown. Each via V is used to connect the wiring pattern 221 on one side 22a of the second flexible substrate 22 to the wiring pattern 222 on the other side 22b, and is also used to connect these wiring patterns 221, 222 to the wiring patterns 211, 213 of the first and third flexible substrates 21, 23.

[0039] Figure 4 (a) is a perspective view showing the first resin component 4. Figure 4 (b) is a partial perspective view showing a portion of the first resin component 4. Figure 5 (a) is a three-dimensional cross-sectional view of the second resin component 5. Figure 5 (b) is a partial perspective view showing a portion of the second resin component 5. Figure 6 (a) and (b) are illustrative diagrams showing the state before and after forming the sealing member 6 using a mold 9 having an upper mold 91 and a lower mold 92.

[0040] The first and second resin components 4 and 5 are pre-formed by injection molding and are combined to form the housing space 30. When molding the sealing component 6, with the detection unit 2 housed in the housing space 30, the first and second resin components 4 and 5 are positioned between the upper mold 91 and the lower mold 92, and molten resin is injected into the cavity 90 through the injection hole 910 provided in the upper mold 91. In this embodiment, the upper mold 91 is provided with one or more injection holes 910. In this embodiment, three injection holes 910 are provided in the upper mold 91, and the end face 6a of the molded sealing component 6 (refer to...) Figure 1 Three injection marks 31-33 are formed corresponding to each injection hole 910 (see reference). Figure 1 ).

[0041] In the following description, the direction parallel to the rotation axis O of shaft 8 is referred to as the axial direction, and the direction perpendicular to the rotation axis O is referred to as the radial direction. In this embodiment, the radial direction corresponds to the "first direction" of the present invention, and the axial direction corresponds to the "second direction," with the axial direction (first direction) and the radial direction (second direction) intersecting each other perpendicularly. Furthermore, in the following description, for convenience, one side of the axial direction is referred to as "upper" and the other side as "lower," but this "upper" and "lower" do not necessarily refer to the vertical direction of the torque sensor 1 in its operating state.

[0042] The first resin component 4 integrally comprises: an inner cylindrical portion 41 formed in a cylindrical shape; a first cover portion 42 protruding radially outward from near the upper end of the inner cylindrical portion 41; a base plate portion 43 disposed below the inner cylindrical portion 41; and a first guide portion 44 for the signal lines 71 and 72 of the guiding cables 7. The inner peripheral surface 41a of the inner cylindrical portion 41 faces the shaft 8. The portion of the outer peripheral surface 41b of the inner cylindrical portion 41 located lower than the first cover portion 42 faces the detection portion 2. The first cover portion 42 and the base plate portion 43 protrude radially outward from the outer peripheral surface 41b of the inner cylindrical portion 41 in an annular shape. The first guide portion 44 is formed to protrude further radially outward from the outer edge of the base plate portion 43.

[0043] The first cover portion 42 and the base portion 43 are arranged axially across the storage space 30. For example... Figure 4 As shown in (b), the first cover portion 42 has a trapezoidal cross-sectional shape along its axial direction, and a portion thereof forms a first protrusion 421 protruding upward. A first recess 40 is formed annularly between the first protrusion 421 and the inner cylindrical portion 41. The lower surface 42a of the first cover portion 42, which is opposite to the bottom plate portion 43, is perpendicular to the outer peripheral surface 41b of the inner cylindrical portion 41. The axial thickness of the first cover portion 42 increases towards the outer diameter side, and the upper surface 42b, which is the opposite side of the axial direction of the lower surface 42a, is radially inclined such that the distance between it and the lower surface 42a increases towards the outer diameter side.

[0044] The outer peripheral surface 42c of the first cover portion 42 is parallel to the outer peripheral surface 41b of the inner cylindrical portion 41. The first protrusion 421, in a cross-section along the axial direction, is formed into a generally triangular shape with an acute angle θ1 between the upper surface 42b and the outer peripheral surface 42c. The preferred range of angle θ1 is 30° or more and 60° or less; in this embodiment, for example, angle θ1 is 45°.

[0045] The second resin component 5 integrally comprises an outer cylindrical portion 51 formed in a cylindrical shape, a second cover portion 52 disposed above the outer cylindrical portion 51, and a second guide portion 53 for the signal lines 71 and 72 of the guiding cable 7. The inner peripheral surface 51a of the outer cylindrical portion 51 faces the detection portion 2, and the outer peripheral surface 51b is covered by the sealing member 6. The second cover portion 52 protrudes radially inward from the inner peripheral surface 51a of the outer cylindrical portion 51 and is formed in a ring shape. The second guide portion 53 protrudes radially outward from the outer peripheral surface 51b of the outer cylindrical portion 51.

[0046] In the first resin component 4 and the second resin component 5, the inner cylindrical portion 41 and the outer cylindrical portion 51 are arranged radially across the receiving space 30. Furthermore, the first guide portion 44 and the second guide portion 53 are combined to clamp the sheath 73, guiding the signal lines 71 and 72 extending from the sheath 73 towards the receiving space 30. The first guide portion 44 and the second guide portion 53 are substantially entirely covered by the sealing member 6, except for the ends from which the cable 7 exits the resin housing 3.

[0047] The second cover portion 52 has an annular base 521 with a constant axial thickness, continuously formed with the outer cylindrical portion 51, and an annular weir portion 522 disposed radially inward of the base 521. The weir portion 522 has the function of intercepting molten resin from flowing from the gap with the first resin member 4 to the receiving space 30 side during the molding of the sealing member 6. The molten resin is the resin formed by heating and liquefying the molding resin constituting the sealing member 6.

[0048] Throughout the base 521 and weir 522, the upper surface 52a of the second cover 52 is formed as an annular plane perpendicular to the axial direction with no height difference. A plurality of injection holes 910 of the upper mold 91 open at positions opposite to the upper surface 52a, and molten resin forming the sealing member 6 is injected from the injection holes 910 toward the upper surface 52a.

[0049] like Figure 5 As shown in (b), the cross-sectional shape of the weir 522 along the axial direction is trapezoidal, and a portion of it forms a second protrusion 523 that protrudes downward.

[0050] The second protrusion 523 and the first protrusion 421 are arranged axially. The lower surface 522a of the weir portion 522, which corresponds to the opposite side of the upper surface 52a, is inclined radially such that the distance between it and the upper surface 52a increases as it approaches the inner diameter. The axial thickness of the base 521 is thicker than the axial thickness of the end of the second cover portion 52 on the inner diameter side (the maximum thickness of the weir portion 522). The lower surface 521a of the base 521 is an annular plane perpendicular to the inner circumferential surface 51a of the outer cylindrical portion 51, and the inner circumferential surface 521b of the base 521 is formed perpendicular to the radial direction. A second recess 50 is formed annularly between the second protrusion 523 and the base 521.

[0051] The inner circumferential surface 522b of the weir portion 522 is parallel to the inner circumferential surface 51a of the outer cylindrical portion 51. In a cross-section along the axial direction, the second protrusion 523 is formed into a roughly triangular shape with an acute angle θ2 between the lower surface 522a and the inner circumferential surface 522b. The angle θ2 is the same as the angle θ1 of the first protrusion 421 of the first cover portion 42. When assembling the first resin member 4 and the second resin member 5, the second protrusion 523 is received in the first recess 40, and the first protrusion 421 is received in the second recess 50. The upper surface 42b of the first cover portion 42 and the lower surface 522a of the weir portion 522 are parallel to each other. In addition, the portion of the inner circumferential surface 522b of the weir portion 522 and the portion of the outer circumferential surface 41b of the inner cylindrical portion 41 that is above the first cover portion 42, as well as the outer circumferential surface 42c of the first cover portion 42 and the inner circumferential surface 521b of the base portion 521 are parallel to each other radially. It should be noted that angle θ2 does not necessarily have to be the same angle as angle θ1. For example, angle θ2 can be within the range of angle θ1 ± 10°.

[0052] like Figure 6 As shown in (a), based on the dimensional tolerances of the first and second resin components 4 and 5, there are cases where the widths of the first gap S1 between the inner peripheral surface 522b of the weir portion 522 and the outer peripheral surface 41a of the inner cylindrical portion 41, the second gap S2 between the upper surface 42b of the first cover portion 42 and the lower surface 522a of the weir portion 522, and the third gap S3 between the outer peripheral surface 42c of the first cover portion 42 and the inner peripheral surface 521b of the base portion 521 are each such that the widths allow the molten resin to flow (e.g., 0.1 mm or more). Furthermore, if the molten resin penetrates into the receiving space 30, the pressure of the molten resin may cause the first to third flexible substrates 21 to 23 to deform, or cause broken lines around the through hole V, resulting in damage to the detection part 2.

[0053] In this embodiment, the second protrusion 523 and the first protrusion 421 overlap axially to form a labyrinth structure, thereby inhibiting the molten resin from entering the receiving space 30 via the flow path S, which includes the first gap S1, the second gap S2, and the third gap S3. This labyrinth structure is an inhibitory structure that complicates the path of the molten resin flowing towards the receiving space 30 in the flow path S. More specifically, in the axial cross-sections of the first and second resin components 4 and 5, the first gap S1 and the second gap S2 are bent at an acute angle θ2, and the second gap S2 and the third gap S3 are bent at an acute angle θ1 (the flow path S meanders). This increases the flow resistance of the molten resin flowing from the first gap S1 to the second gap S2 and from the second gap S2 to the third gap S3, thus inhibiting the molten resin from entering the receiving space 30. That is, in this embodiment, the flow path S of the molten resin flowing towards the receiving space 30 between the first resin component 4 and the second resin component 5 has two bends S that are bent at acute angles. 01 S 02 .

[0054] The upper surface 42b of the first cover portion 42 and the lower surface 522a of the weir portion 522 are opposing surfaces facing each other across a second gap S2. The second gap S2 is formed at an inclination such that it moves axially further away from the receiving space 30 as it approaches the downstream side of the molten resin flowing towards the receiving space 30. It should be noted that in this embodiment, the second gap S2 is incised such that it moves further away from the receiving space 30 as it approaches the third gap S3 located downstream. However, this is not a limitation, as long as at least a portion of the second gap S2 is incised such that it moves further away from the receiving space 30 as it moves from the first gap S1 side toward the third gap S3 side.

[0055] In addition, in this embodiment, such as Figure 6 As shown in (b), the second protrusion 523, located axially further from the receiving space 30 than the first protrusion 421, is pressed against the first protrusion 421 by the fluid pressure of the molten resin, thereby narrowing the second gap S2 and more reliably suppressing the flow of molten resin towards the receiving space 30. At least a portion of the injection hole 910, forming its opening, is axially aligned with the second cover 52, and the pressure of the molten resin injected through the injection hole 910 acts directly on the upper surface 52a of the second cover 52. Then, the second cover 52 deforms due to this pressure, and the second protrusion 523 is pressed against the upper surface 42b of the first cover 42.

[0056] exist Figure 6In (b), the diagram illustrates a state where the sealing member 6 is formed with the second protrusion 523 abutting against the upper surface 42b of the first cover 42. However, the second protrusion 523 may not contact the upper surface 42b of the first cover 42, and the second cover 52 may be restored to its original shape after the molten resin is injected. The molten resin in the injection hole 910 is removed after solidification, and its trace becomes the injection marks 31-33.

[0057] (Manufacturing method of torque sensor 1)

[0058] Next, the manufacturing method of the torque sensor 1 will be described. The torque sensor 1 is manufactured through the following steps: a preparation step, in which a first resin component 4, a second resin component 5, and a detection unit 2 are formed, and a cable 7 is connected to the detection unit 2; an arrangement step, in which the first and second resin components 4 and 5, in which the detection unit 2 is housed in the housing space 30, are arranged in the mold 9; and an injection molding step, in which molten resin is injected into the mold 9 to form the sealing component 6. In the injection molding step, as described above, the second protrusion 523 is pressed against the first protrusion 421 by the fluid pressure of the molten resin, blocking the flow path of the molten resin flowing towards the housing space 30.

[0059] (Comparative Example)

[0060] Figure 7 This is a cross-sectional view showing the injection molding process of the torque sensor involved in the comparative example. Figure 7 In this document, components that are common to those described in the above embodiments are marked with the same symbols as those in the original document. Figure 6 Symbols that are the same as those marked in the text are omitted and repeated descriptions are omitted.

[0061] The torque sensor has a first resin component 4A and a second resin component 5A. A detection unit 2 is housed in a storage space 30 between the inner cylindrical portion 41 of the first resin component 4A and the outer cylindrical portion 51 of the second resin component 5A. The first resin component 4A does not have a portion corresponding to the first cover portion 42 described in the above embodiment. The second resin component 5A has a cover portion 52A that protrudes radially inward from the upper end of the outer cylindrical portion 51. The cover portion 52A is formed in an annular and flat shape, with its inner circumferential surface 52Aa facing the outer circumferential surface 41b of the inner cylindrical portion 41 through an annular gap S0.

[0062] In this structure, molten resin injected through the injection hole 910 of the upper mold 91 can easily flow axially in the gap S0 and enter the receiving space 30, which can easily damage the detection part 2. In contrast, in the above embodiment, the second protrusion 523 and the first protrusion 421 are arranged axially to form a labyrinth structure, thereby preventing molten resin from entering the receiving space 30 through the flow path S, which includes the first gap S1, the second gap S2 and the third gap S3.

[0063] [Variation Example]

[0064] Next, refer to Figure 8 and Figure 9 The following describes variations of the implementation method. Figure 8 and Figure 9 In this document, components that are common to those described in the above embodiments are marked with the same symbols as those in the original document. Figure 6 Symbols that are identical in the same way are marked, and repeated descriptions are omitted. Additionally, in... Figure 8 and Figure 9 The illustration of the detection unit 2 housed in the storage space 30 is omitted. Figure 8 and Figure 9 The torque sensors 1B to 1F involved in the various modified examples shown use Figure 6 The mold 9 shown is used to form the sealing component 6.

[0065] Figure 8 (a) is a cross-sectional view showing a portion of the torque sensor 1B according to the first modified example. In the torque sensor 1B, the resin housing 3B is composed of first and second resin members 4B and 5B and a sealing member 6. The first resin member 4B has a first cover portion 42B that protrudes radially outward from the inner cylindrical portion 41, and the second resin member 5B has a second cover portion 52B that protrudes radially inward from the outer cylindrical portion 51. Both the first cover portion 42B and the second cover portion 52B are formed in annular and flat shapes.

[0066] The radial first gap SB1 between the inner cylindrical portion 41 of the first resin component 4B and the second cover portion 52B of the second resin component 5B, the axial second gap SB2 between the first cover portion 42B of the first resin component 4B and the second cover portion 52B of the second resin component 5B, and the radial third gap SB3 between the first cover portion 42B of the first resin component 4B and the outer cylindrical portion 51 of the second resin component 5B constitute the flow path SB when the molten resin flows toward the receiving space 30. The flow path SB has a right-angled bend SB at the corner of the first gap SB1 and the second gap SB2. 01 .

[0067] Figure 8 (b) is a cross-sectional view showing a portion of the torque sensor 1C according to the second modified example. In the torque sensor 1C, the resin housing 3C is composed of first and second resin components 4C and 5C and a sealing component 6. The first resin component 4C has a first cover portion 42C that protrudes radially outward from the inner cylindrical portion 41, and the second resin component 5C has a second cover portion 52C that protrudes radially inward from the outer cylindrical portion 51.

[0068] The first cover portion 42C has an annular and flat first annular plate portion 421C and a first protrusion 422C protruding upward from the outer diameter side of the first annular plate portion 421C. A first recess 40C is formed in an annular shape between the inner cylindrical portion 41 and the first protrusion 422C. The second resin member 5C has an annular and flat second annular plate portion 521C and a second protrusion 522C protruding downward from the inner diameter side of the second annular plate portion 521C. A second recess 50C is formed in an annular shape between the outer cylindrical portion 51 and the second protrusion 522C. It should be noted that the first protrusion 422C and / or the second protrusion 522C are located in... Figure 8 (b) is illustrated in a rectangular shape, but it can also be roughly triangular. The shapes of the second annular plate portion 521C and the first annular plate portion 421C can also be appropriately modified in accordance with the shapes of the first protrusion 422C and / or the second protrusion 522C.

[0069] The first protrusion 422C and the second annular plate portion 521C are arranged axially, and the second protrusion 522C and the first annular plate portion 421C are also arranged axially. Furthermore, the first protrusion 422C and the second protrusion 522C are arranged radially. When assembling the first resin component 4C and the second resin component 5C, the second protrusion 522C is received in the first recess 40C, and the first protrusion 422C is received in the second recess 50C.

[0070] The radial first gap SC1 between the inner cylindrical portion 41 of the first resin component 4C and the second protrusion 522C, the axial second gap SC2 between the first annular plate portion 421C and the second protrusion 522C, the radial third gap SC3 between the first protrusion 422C and the second protrusion 522C, the axial fourth gap SC4 between the first protrusion 422C and the second annular plate portion 521C, and the radial fifth gap SC5 between the first protrusion 422C and the outer cylindrical portion 51 of the second resin component 5C constitute the flow path SC when the molten resin flows toward the receiving space 30. The flow path SC has four bends SC at right angles at the corners of the first gap SC1 and the second gap SC2, the second gap SC2 and the third gap SC3, the third gap SC3 and the fourth gap SC4, and the fourth gap SC4 and the fifth gap SC5. 01 SC 02 SC 03 SC 04 .

[0071] In the torque sensors 1B and 1C of the first and second modifications, the first cover portions 42B and 42C and the second cover portions 52B and 52C are arranged axially to form a labyrinth structure. This labyrinth structure is an inhibitory structure that prevents molten resin from intruding into the receiving space 30 during the molding of the sealing member 6. Furthermore, the second cover portions 52B and 52C are located on the side axially farther from the receiving space 30 compared to the first cover portions 42B and 42C. During the molding of the sealing member 6, the fluid pressure of the molten resin presses the second cover portions 52B and 52C against the first cover portions 42B and 42C. This more reliably prevents molten resin from intruding into the receiving space 30.

[0072] Figure 9 (a) is a cross-sectional view showing a portion of the torque sensor 1D according to the third modified example. In the torque sensor 1D, the resin housing 3D is composed of first and second resin members 4D and 5D and a sealing member 6. The first resin member 4D has a first cover portion 42D that protrudes radially outward from the inner cylindrical portion 41, and the second resin member 5D has a second cover portion 52D that protrudes radially inward from the outer cylindrical portion 51. Both the first cover portion 42D and the second cover portion 52D are formed in annular and flat shapes, and are arranged axially to form a labyrinth structure (sealing structure).

[0073] The axial first gap SD1 between the first cover portion 42D of the first resin component 4D and the second cover portion 52D of the second resin component 5D, and the radial second gap SD2 between the inner cylindrical portion 41 of the first resin component 4D and the second cover portion 52D of the second resin component 5D, constitute the flow path SD when the molten resin flows toward the receiving space 30. The flow path SD has a bend SD at a right angle at the corner of the first gap SD1 and the second gap SD2. 01 .

[0074] The first cover portion 42D is located on the side that is axially farther from the receiving space 30 compared to the second cover portion 52D, and covers the entire second cover portion 52D and the outer cylindrical portion 51 from above. During the molding of the sealing member 6, the first cover portion 42D is pressed against the second cover portion 52D by the fluid pressure of the molten resin, thereby preventing the molten resin from flowing into the receiving space 30.

[0075] Figure 9 (b) is a cross-sectional view showing a portion of the torque sensor 1E according to the fourth modified example. In the torque sensor 1E, the resin housing 3E is composed of first and second resin components 4E and 5E and a sealing component 6. The first resin component 4E has a first cover portion 42E that protrudes radially outward from the inner cylindrical portion 41, and the second resin component 5E has a second cover portion 52E that protrudes radially inward from the outer cylindrical portion 51.

[0076] The first cover portion 42E has an annular and flat first annular plate portion 421E and a first protrusion 422E protruding downward from the outer diameter side of the first annular plate portion 421E. A recess 40E is formed annularly between the inner cylindrical portion 41 and the first protrusion 422E. The second resin member 5E has an annular and flat second annular plate portion 521E and a second protrusion 522E protruding upward from the inner diameter side of the second annular plate portion 521E. The first protrusion 422E and the second annular plate portion 521E are arranged axially, and the second protrusion 522E and the first annular plate portion 421E are also arranged axially. In addition, the first protrusion 422E and the second protrusion 522E are arranged radially. When the first resin member 4E and the second resin member 5E are assembled, the second protrusion 522E is housed in the recess 40E. It should be noted that the second protrusion 522E is located in... Figure 9 In (b), it is illustrated in a rectangular shape, but it can also be roughly triangular. Corresponding to the shape of the second protrusion 522E, the shape of the first annular plate portion 421E can also be appropriately changed.

[0077] The axial first gap SE1 between the first protrusion 422E and the second annular plate portion 521E, the radial second gap SE2 between the first protrusion 422E and the second protrusion 522E, the axial third gap SE3 between the first annular plate portion 421E and the second protrusion 522E, and the radial fourth gap SE4 between the inner cylindrical portion 41 of the first resin member 4E and the second protrusion 522E constitute the flow path SE when the molten resin flows toward the receiving space 30. The flow path SE has three bends SE at right angles at the corners of the first gap SE1 and the second gap SE2, the corners of the second gap SE2 and the third gap SE3, and the corners of the third gap SE3 and the fourth gap SE4. 01 SE 02 SE 03 .

[0078] The first cover portion 42E is located on the side that is axially farther from the receiving space 30 compared to the second cover portion 52E, and covers the entire second cover portion 52E and the outer cylindrical portion 51 from above. During the molding of the sealing member 6, the first cover portion 42E is pressed against the second cover portion 52E by the fluid pressure of the molten resin, thereby preventing the molten resin from flowing into the receiving space 30.

[0079] Figure 9 (c) is a cross-sectional view showing a portion of the torque sensor 1F according to the fifth modified example. In the torque sensor 1F, the resin housing 3F is composed of first and second resin members 4F and 5F and a sealing member 6. The first resin member 4F has a first cover 42F that protrudes radially outward from the inner cylindrical portion 41, and the second resin member 5F has a second cover 52F that protrudes radially inward from the outer cylindrical portion 51.

[0080] The first cover portion 42F has a base portion 421F continuously formed with the inner cylindrical portion 41 and an annular rim portion 422F disposed on the outer side of the base portion 421F. The base portion 421F is formed as an annular shape with a constant axial thickness. The rim portion 422F is a protrusion with a thinner axial thickness than the base portion 421F, and protrudes radially outward and downward from the upper end of the base portion 421F. The lower surface 422Fa of the rim portion 422F slopes downward towards the end closer to the outer diameter side. Between the base portion 421F and the rim portion 422F, an annular recess 40F is formed in an annular shape and opens downward.

[0081] The second cover portion 52F has a bulge portion 521F continuously disposed from the outer cylindrical portion 51 and an annular and flat plate portion 522F disposed inside the bulge portion 521F. The bulge portion 521F is formed such that its axial thickness increases towards the inner diameter end, and it is a protrusion extending upward from the annular plate portion 522F. When assembling the first resin member 4F and the second resin member 5F, the bulge portion 521F is received in the recess 40F, and the upper surface 521Fa of the bulge portion 521F is parallel to the lower surface 422Fa of the eaves portion 422F. The annular plate portion 522F is formed such that its axial thickness is thinner than the maximum thickness of the bulge portion 521F. The inner circumferential surface 521Fb and the upper surface 521Fa of the bulge portion 521F form an acute angle in the axial section of the second resin member 5F.

[0082] The first gap SF1 between the eaves 422F and the bulge 521F, the radial second gap SF2 between the base 421F and the bulge 521F, the axial third gap SF3 between the base 421F and the annular plate portion 522F, and the radial fourth gap SF4 between the inner cylindrical portion 41 of the first resin member 4F and the annular plate portion 522F constitute the flow path SF when the molten resin flows toward the receiving space 30. The flow path SF has a bend SF at the corner of the first gap SF1 and the second gap SF2, which is bent into an acute angle. 01 Furthermore, the corners of the second gap SF2 and the third gap SF3, and the corners of the third gap SF3 and the fourth gap SF4, each have two curved portions SF bent at right angles. 02 SF 03 .

[0083] In the third to fifth torque sensors 1D to 1F, the first cover portions 42D, 42E, 42F and the second cover portions 52D, 52E, 52F are arranged axially to form a labyrinth structure that inhibits molten resin from intruding into the receiving space 30 during the molding of the sealing member 6. This labyrinth structure is an inhibitory structure that prevents molten resin from intruding into the receiving space 30 during the molding of the sealing member 6. Furthermore, the first cover portions 42D, 42E, 42F are located on the side axially farther from the receiving space 30 compared to the second cover portions 52D, 52E, 52F. During the molding of the sealing member 6, the fluid pressure of the molten resin presses the first cover portions 42D, 42E, 42F against the second resin members 5D, 5E, 5F. This more reliably inhibits the intrusion of molten resin into the receiving space 30.

[0084] Furthermore, in the third to fourth torque sensors 1D to 1F, the first covers 42D, 42E, and 42F cover the second covers 52D, 52E, and 52F from above, as well as the entire outer cylindrical portion 51. Therefore, the gap between the first covers 42D, 42E, and 42F and the second covers 52D, 52E, and 52F opens radially, intersecting the flow direction of the molten resin, making it difficult for the molten resin to enter this gap. Particularly in the torque sensor 1F according to the fifth modification, the lower surface 422Fa of the eaves 422F and the upper surface 521Fa of the bulge 521F are inclined such that the downstream side of the molten resin flowing towards the receiving space 30 is axially further away from the receiving space 30, thus further reliably suppressing the intrusion of molten resin into the receiving space 30.

[0085] (Summary of implementation methods and their variations)

[0086] Next, the technical ideas grasped from the embodiments described above will be described using reference numerals from the embodiments. However, the reference numerals used in the following description do not limit the constituent elements in the claims to the components specifically shown in the embodiments.

[0087] [1] A resin-sealed electronic component (1, 1B to 1F) is formed by sealing an electronic component body (detection unit 2) with a resin housing (3), wherein the resin housing (3) includes: a pair of resin members (4, 4B to 4F, 5, 5B to 5F) arranged in a first direction (radial) across a storage space (30) for housing the electronic component body (2); and a cover for the pair of resin members (4, 4B to 4F, 5, 5B to 5F). A sealing member (6) made of molding resin, each at least a portion thereof, wherein a portion (42, 42B to 42F) of one of the pair of resin members (4, 4B to 4F, 5, 5B to 5F) and a portion (522, 52B to 52F) of the other resin member (5, 5B to 5F) are arranged along a second direction (axial direction) intersecting the first direction to form an inhibitory structure that inhibits the molding resin (6) from entering the receiving space (30).

[0088] [2] According to the resin-sealed electronic component (1, 1C, 1E, 1F) described above [1], at least a portion of the gap (second gap S2, third gap SC3, second gap SE2, first gap SF1) between the protrusion (first protrusion 421, first protrusion 422C, first protrusion 422E, bulge 422F) provided in one resin component (4, 4C, 4E, 4F) and the protrusion (second protrusion 523, second protrusion 522C, second protrusion 522E, bulge 521F) provided in another resin component (5, 5C, 5E, 5F) is formed such that the downstream side closer to the molding resin flowing towards the receiving space (30) is further away from the receiving space (30) in the second direction (axial direction).

[0089] [3] According to the resin-sealed electronic component (1, 1C, 1E, 1F) described above [2], wherein the protrusion (second protrusion 523, second protrusion 522C, second protrusion 522E, bulge 521F) of the other resin component (5, 5C, 5E, 5F) is received in the recess (first recess 40, first recess 40C, recess 40E, recess 40F) formed in the one resin component (4, 4C, 4E, 4F).

[0090] [4] The resin-sealed electronic component (1, 1B to 1F) according to any one of [1] to [3] above, wherein the flow path (S, SA to SF) of the molding resin flowing towards the receiving space (30) between a portion (42, 42B to 42F) of one resin component (4, 4B to 4F) and a portion (522, 52B to 52F) of another resin component (5, 5B to 5F) has a bend (S) that is bent at an acute angle or a right angle. 01 S 02 SB 01 SC 01 SC 02 SC 03 SC 04 SD 01 SE 01 SE 02 SE 03 SF 01 SF 02 SF 03 ).

[0091] [5] A method for manufacturing a resin-sealed electronic component (1, 1B-1F), which is the method for manufacturing a resin-sealed electronic component (1, 1B-1F) as described in any one of [1] to [4] above, wherein the method comprises: a configuration step in which the electronic component body (2) is housed in the housing space (30) and the pair of resin components (4, 4B-4F, 5, 5B-5F) are configured in a mold (9); and an injection molding step in which molten molding resin is injected into the mold (9) and the seal is formed. In the injection molding process, the portion (42, 42B to 42F) of one resin component (4, 4B to 4F) and the portion (522, 52B to 52F) of another resin component (5, 5B to 5F) that is located on the side farther from the receiving space (30) in the second direction are pressed to the receiving space (30) side by the fluid pressure of the molten molding resin.

[0092] The embodiments and variations thereof of the present invention have been described above, but the embodiments and variations described above do not limit the invention as defined in the claims. Furthermore, it should be noted that not all combinations of features described in the embodiments are necessary for the method to solve the inventive problem.

[0093] Furthermore, the present invention can be implemented with appropriate modifications without departing from its spirit. For example, in the above embodiments and their modifications, the application of the present invention to a torque sensor, which is an example of a resin-sealed electronic component, has been described. However, the invention is not limited to resin-sealed electronic components and can be applied to sensors that measure physical quantities through some electrical action, as well as resin-sealed electronic components that have some physical effect on an object.

Claims

1. A resin-sealed electronic component that is a resin-sealed electronic component in which an electronic component main body is sealed with a resin case, the resin case including: a pair of resin members arranged in a first direction across a housing space in which the electronic component main body is housed; and a sealing member composed of a molded resin that is molded so as to cover at least a portion of each of the pair of resin members, a portion of one of the pair of resin members and a portion of the other resin member are arranged in a second direction that crosses the first direction, forming a suppression structure that suppresses the molded resin from entering the housing space, at least a portion of a gap between a protrusion provided to the one resin member and a protrusion provided to the other resin member is formed so as to be farther from the housing space in the second direction the closer it is to a downstream side of a flow of the molded resin toward the housing space.

2. The resin-sealed electronic component according to claim 1, wherein the protrusion of the other resin member is housed in a recess formed in the one resin member.

3. The resin-sealed electronic component according to claim 1 or 2, wherein a flow path of the molded resin when flowing toward the housing space between the portion of the one resin member and the portion of the other resin member has a curved portion that is bent at an acute angle or a right angle.

4. A method of manufacturing a resin-sealed electronic component, the method being a method of manufacturing the resin-sealed electronic component according to any one of claims 1 to 3, the method including: a disposition step of housing the electronic component main body in the housing space so as to dispose the pair of resin members in a mold; and an injection molding step of injecting the molten molded resin into the mold and molding the sealing member, in the injection molding step, the portion of the one resin member and the portion of the other resin member that are on a side farther from the housing space in the second direction are pressed to the housing space side by a fluid pressure of the molten molded resin. ​ ​

Citation Information

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