A depth measurement system and method

Abstract

The present application provides a depth measurement system and method. The processor obtains a resolution requirement index and generates a corresponding liquid crystal state setting instruction. The emission module provides output light through a speckle projector and projects emission light onto a target object after triggering a corresponding physical state of the liquid crystal according to the liquid crystal state setting instruction. The acquisition module collects reflected light signals through a TOF pixel array and generates electrical signals based on the reflected light signals. The processor calculates the depth value of the target object based on the electrical signals. By implementing the solution of the present application, the physical state of the liquid crystal in the emission module is adaptively adjusted according to the resolution required by the depth measurement scenario to change the form of the emission light to make up for the limitation of the light signal acquisition of the TOF pixels, so that the depth measurement system can ensure high measurement accuracy both at close range and at long range.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular, to a depth measurement system and method. Background Art

[0002] A depth measurement system can be used to obtain the depth image of an object, and further can perform 3D modeling, skeleton extraction, face recognition, etc., and has very wide applications in the fields of 3D measurement and human-computer interaction. The current depth measurement technologies mainly include TOF ranging technology, structured light ranging technology, etc.

[0003] TOF ranging technology is a precise ranging technology that measures the round-trip flight time of light pulses between the transmitting / receiving device and the target object, and is divided into direct ranging technology and indirect ranging technology. Among them, the indirect ranging technology measures the phase delay of the reflected light signal relative to the transmitted light signal, and then calculates the flight time from the phase delay. According to the different modulation and demodulation types, it can be divided into continuous wave (CW) modulation and demodulation method and pulse modulation (PW) modulation and demodulation method.

[0004] However, the existing TOF ranging technology only has good ranging performance within a specific detection distance, and the ranging application scenarios are relatively limited. Summary of the Invention

[0005] The embodiments of this application provide a depth measurement system and method, which can at least solve the problem that the TOF ranging technology provided in the related art only has good ranging performance within a specific detection distance, and the ranging application scenarios are relatively limited.

[0006] The first aspect of the embodiments of this application provides a depth measurement system, including: a transmitting module, a collecting module, and a processor. The transmitting module includes a speckle projector and a liquid crystal.

[0007] The transmitting module is configured to provide output light through the speckle projector, and project transmitted light onto the target object after triggering the corresponding physical state according to the liquid crystal state setting instruction sent by the processor through the liquid crystal; wherein, the physical state includes a diffused state and a transparent state.

[0008] The collecting module is configured to collect the reflected light signal through a TOF pixel array and generate an electrical signal according to the reflected light signal.

[0009] The processor is configured to obtain a resolution requirement index and generate the corresponding liquid crystal state setting instruction, and calculate the depth value of the target object based on the electrical signal; wherein, the resolution requirement index is associated with the measurement distance.

[0010] The second aspect of the embodiments of the present application provides a depth measurement method, which is applied to a depth measurement system including a transmitting module, a collecting module, and a processor. The transmitting module includes a speckle projector and a liquid crystal. The depth measurement method includes:

[0011] The processor obtains a resolution requirement index and generates a corresponding liquid crystal state setting instruction; wherein, the resolution requirement index is associated with the measurement distance;

[0012] The transmitting module provides output light through the speckle projector, and projects the transmitted light onto the target object after triggering the corresponding physical state according to the liquid crystal state setting instruction sent by the processor through the liquid crystal; wherein, the physical states include a diffused state and a transparent state;

[0013] The collecting module collects the reflected light signal through a TOF pixel array and generates an electrical signal according to the reflected light signal;

[0014] The processor calculates the depth value of the target object based on the electrical signal.

[0015] As can be seen from the above, according to the depth measurement system and method provided by the solution of the present application, the processor obtains a resolution requirement index and generates a corresponding liquid crystal state setting instruction; the transmitting module provides output light through the speckle projector, and projects the transmitted light onto the target object after triggering the corresponding physical state according to the liquid crystal state setting instruction through the liquid crystal; the collecting module collects the reflected light signal through a TOF pixel array and generates an electrical signal according to the reflected light signal; the processor calculates the depth value of the target object based on the electrical signal. Through the implementation of the solution of the present application, the physical state of the liquid crystal in the transmitting module is adaptively adjusted according to the resolution required by the depth measurement scenario, so as to change the form of the transmitted light to make up for the limitation of the light signal collection of the TOF pixel, so that the depth measurement system can ensure a high measurement accuracy both at close range and at long range. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of a depth measurement system provided by the first embodiment of the present application;

[0017] Figure 2 It is a schematic diagram of a pixel array composed of multiple pixels provided by the first embodiment of the present application;

[0018] Figure 3 It is a schematic basic flow diagram of the depth measurement method provided by the second embodiment of the present application;

[0019] Figure 4 It is a schematic detailed flow diagram of the depth measurement method provided by the third embodiment of the present application;

[0020] Figure 5Schematic diagram of the terminal device provided in the fourth embodiment of this application. Detailed implementation manners

[0021] To make the objectives, features, and advantages of this application more obvious and understandable, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of this application.

[0022] In the description of the embodiments of this application, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0023] In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of this application, "a plurality" means two or more, unless otherwise specifically defined.

[0024] In the embodiments of this application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0025] The above are only the preferred embodiments of this application, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of this application shall be included in the protection scope of this application.

[0026] To solve the problem that the TOF ranging technology provided in the related art only has good ranging performance within a specific detection distance, and the ranging application scenarios are relatively limited, the first embodiment of this application provides a depth measurement system, asFigure 1 The following is a schematic structural diagram of a depth measurement system provided by this embodiment. The depth measurement system 10 mainly includes: a transmitting module 11, a collecting module 12, and a processor 13 respectively connected to the transmitting module 11 and the collecting module 12. The transmitting module includes a speckle projector and a liquid crystal; wherein,

[0027] The transmitting module 11 is configured to provide output light through the speckle projector, and project the transmitted light 30 onto the target object 20 after triggering the corresponding physical state according to the liquid crystal state setting instruction sent by the processor 13 through the liquid crystal; wherein, the physical states include a diffused state and a transparent state;

[0028] The collecting module 12 is configured to collect the reflected light signal 40 through a TOF pixel array and generate an electrical signal according to the reflected light signal 40; wherein, the collecting module 12 includes an image sensor 121 composed of a plurality of sub-pixel arrays;

[0029] The processor 13 is configured to obtain the resolution requirement index and generate the corresponding liquid crystal state setting instruction, and calculate the depth value of the target object 20 based on the electrical signal; wherein, the resolution requirement index is associated with the measurement distance.

[0030] In this embodiment, the speckle projector is configured to provide output light in a speckle pattern having a plurality of speckles, and the liquid crystal is configured to be controllably switched to receive the speckle pattern projected by the speckle projector and project the speckle pattern or floodlight pattern onto the target object. After the liquid crystal receives the speckle pattern projected by the speckle projector, it enters the corresponding physical state according to the liquid crystal state setting instruction sent by the processor 13, and then adaptively projects the speckle pattern or floodlight pattern onto the target object 20. Wherein, the processor 13 controls the liquid crystal to be in the transparent state so that the transmitting module 11 projects the speckle pattern onto the target object 20; the processor 13 controls the liquid crystal to be in the diffused state so that the transmitting module 11 projects the floodlight pattern onto the target object 20. It should be noted that the speckle pattern having a plurality of speckles in this embodiment may be a regular or irregular speckle pattern, and preferably a regular speckle pattern can be adopted to make the depth value distribution more uniform.

[0031] It should be understood that, in this embodiment, when the measurement distance is relatively short and the device 10 requires a high resolution, preferably control the liquid crystal to be in the diffused state, and the transmitting module 11 projects the floodlight pattern onto the target object 20 so that the TOF pixel can collect a depth value with higher accuracy. Similarly, for example, when the measurement distance is very far, preferably control the liquid crystal to be in the transparent state, and the transmitting module 11 projects the speckle pattern onto the target object 20, because speckle projection will concentrate the energy on the speckles and has a longer measurement distance compared to floodlight projection.

[0032] In practical applications, the depth measurement system 10 of this embodiment may further include a distance sensor 14 for detecting the real-time distance value of the target object 20. When the processor 13 executes the foregoing function of obtaining the resolution requirement index and generating the corresponding liquid crystal state setting instruction, it is specifically configured to: determine the resolution requirement index corresponding to the real-time distance value according to the preset mapping relationship between the distance value and the resolution requirement index, and generate the corresponding liquid crystal state setting instruction based on the determined resolution requirement index.

[0033] Specifically, in practical applications, the resolution requirement index of the system may be a preset parameter or an externally input parameter. In this embodiment, preferably, the distance of the object to be measured is collected in real time by the distance sensor, so as to realize the automatic perception of the depth measurement scenario, and then further adaptively adjust the beam emission state of the emission module, which is more convenient than the externally input parameter and has higher accuracy than the preset parameter.

[0034] In some embodiments of this embodiment, the emission module 11 includes a light source and a light source driver (not shown), etc. Among them, the light source can be implemented by light sources such as light-emitting diodes (LEDs), edge-emitting lasers (EELs), vertical-cavity surface-emitting lasers (VCSELs), or can also be implemented by a light source array composed of multiple light sources. In this embodiment, preferably, a VCSEL array is used as the light source. The VCSEL has the characteristics of small volume, small light source emission angle, good stability, etc. In practical applications, multiple VCSEL light sources can be arranged on a semiconductor substrate. The VCSEL light source array chip thus formed not only has a small size and low power consumption, but also is more conducive to generating a speckle pattern beam. It should be understood that the arrangement of multiple VCSEL light source arrays can be reasonably set according to requirements, such as regular arrangement or irregular arrangement. Different arrangement methods will correspondingly output speckle patterns in different regions, such as whether the arrangement of the speckles in the speckle pattern is regular or irregular, and whether the arrangement density of the speckles is dense. In this embodiment, preferably, an irregular arrangement method is adopted, which can increase the arrangement density of the speckles. In addition, the beam emitted by the light source of this embodiment can be visible light, infrared light, ultraviolet light, etc., and no special limitation is made in this embodiment.

[0035] In some embodiments of the present embodiment, the speckle projector includes a light source and an optical element; the optical element is configured to receive the light beam output by the light source, and perform optical modulation on the received light beam, such as diffraction, transmission, etc. modulation, and then emit the modulated light beam to the target object 20. The optical element may be one or a combination of a lens, a diffractive optical element (DOE), and a microlens array. In one embodiment, the diffractive optical element can diffuse a beam of light into multiple beams of light to increase the number of speckle projections, thereby increasing the projection density or expanding the field of view angle of the speckle projection.

[0036] In some embodiments of the present embodiment, the acquisition module 12 includes an image sensor 121 composed of a plurality of sub-pixel arrays, a lens unit, and may further include a filter (not shown). Among them, the lens unit receives and images at least a part of the reflected light reflected back by the target object 20 on the image sensor 121; the filter is a narrow-band filter matching the wavelength of the light source of the emission module, so as to suppress the background light noise in other bands. The image sensor may be an image sensor composed of a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), an avalanche diode (AD), a single-photon avalanche diode (SPAD), etc. The size of the sensor array represents the resolution of the camera, such as 320×240, etc. Generally, the readout circuit (not shown) composed of one or more of devices such as a signal amplifier, a time-to-digital converter (TDC), and an analog-to-digital converter (ADC) is also connected to the image sensor 121. It should be noted that the acquisition module 12 of the present embodiment may further include a fill light, and the fill light emits a light beam to supplement the light of the target object 20, so that the light reflected by the target object 20 meets the requirements of optical signal acquisition.

[0037] In some embodiments of the present embodiment, the processor 13 may be an independent dedicated circuit, such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc. composed of a CPU, a memory, a bus, etc., or may include a general-purpose processing circuit. For example, when the device is integrated into an intelligent terminal such as a mobile phone, a TV, a computer, etc., the processing circuit in the intelligent terminal may be at least a part of the processor 13.

[0038] In some embodiments of this embodiment, the acquisition module is specifically configured to: in the initial state, collect the reflected light signal reflected back by the target object through the EVS pixel array, generate an event signal according to the reflected light signal, and in response to the TOF pixel activation instruction sent by the processor, collect the reflected light signal through the TOF pixel array and generate an electrical signal according to the reflected light signal; the processor is specifically configured to: generate an event image according to the event signal, and when it is recognized that the target object in the event image is a valid measurement object, send a TOF pixel activation instruction to the acquisition module, and then calculate the depth value of the target object based on the electrical signal.

[0039] In practical applications, whether it is the existing TOF ranging technology or the structured light ranging technology, it is required that the depth measurement system is always in a working state, and the power consumption of its transmitting end and receiving end is relatively large, and the requirement for memory is also relatively high.

[0040] Based on this, in this embodiment, first, the event pixel array (i.e., the EVS pixel array) in the acquisition module 12 is used to capture the light intensity change of the scene to collect the event signal. The event pixel only outputs the event image when there is an event, and its data volume is very small. Then, after generating the event image based on the event signal, image recognition is performed to identify whether the target object in the current scene is a specific object that needs to be depth-measured (i.e., a valid measurement object, such as a person or a vehicle, etc.). If so, then select to activate the depth pixel array (i.e., the TOF pixel array) to trigger the depth measurement. It should be noted that the TOF (Time-of-Flight) pixel is the time-of-flight pixel. For example, in the field of face recognition, if it has been working in the traditional depth measurement mode, the power consumption of the transmitting module 11 and the acquisition module 12 is relatively large. However, in this embodiment, the EVS (Event-based Camera) pixel is first used to detect whether an event is generated, and determine whether it is a face, and then decide whether to turn on the depth measurement system 10. In this way, the power consumption of the transmitting module 11 and the acquisition module 12 can be reduced while reducing the data volume of the memory.

[0041] In some embodiments of this embodiment, the acquisition module 12 includes an EVS pixel array and a TOF pixel array separately provided on the same image sensor 121.

[0042] As Figure 2 shown is a schematic diagram of a pixel array provided in this embodiment. In this embodiment, the image sensor 121 composed of multiple pixels can be independently provided with two types of sub-pixel arrays, as Figure 2The first sub-pixel array 201 (i.e., the EVS pixel array) and the second sub-pixel array 202 (i.e., the TOF pixel array) therein, that is, different regions of the image sensor are respectively set as the EVS pixel array and the TOF pixel array. The two types of pixel arrays include, but are not limited to, arranged at intervals, regularly arranged, irregularly arranged, etc.

[0043] It should be noted that each pixel of the TOF pixel array includes two or more taps (taps, used to store, read, or output the electrical signal generated by incident photons under the control of the corresponding electrode), such as including two taps, three taps, four taps, etc. During a single frame period (or single exposure time), the taps are sequentially switched in a certain order to collect corresponding photons for receiving the optical signal and converting it into an electrical signal. Correspondingly, the processor 13 also provides the demodulation signal (acquisition signal) for each tap in the TOF pixel. The tap collects the electrical signal converted from the reflected light beam reflected back by the target object 20 under the control of the demodulation signal. It can be understood that this electrical signal is related to the intensity of the reflected light. The processor 13 processes this electrical signal and calculates the flight time of the emitted light / received light traveling to and from the target object to obtain the distance of the target object 20.

[0044] In some other embodiments of this embodiment, the acquisition module 12 includes a switchable pixel array, and the switchable pixel array is an EVS pixel array in the initial state. Correspondingly, when the acquisition module 12 executes the function of collecting the reflected light signal through the TOF pixel array in response to the TOF pixel activation instruction sent by the processor 13, it is specifically used for: in response to the TOF pixel activation instruction sent by the processor 13, controlling the EVS pixel array to switch to the TOF pixel array; collecting the reflected light signal through the TOF pixel array.

[0045] Specifically, in this embodiment, the image sensor 121 of the acquisition module 12 is configured with a switchable pixel array, which is an EVS pixel array in the initial state. When an event signal is collected through the EVS pixel array and it is determined that the event image includes a valid measurement object, the original EVS pixel array is switched to the TOF pixel array according to the TOF pixel activation instruction sent by the processor 13. By configuring the pixel array in a switchable mode, compared with independently setting different types of pixel array partitions, this embodiment supports global configuration as a single type of pixel array in different sensor working modes, which can ensure that as many pixels as possible sense the reflected light in different signal acquisition stages, thereby greatly improving the image resolution.

[0046] According to the depth measurement system provided by this embodiment, the processor obtains the resolution requirement index and generates a corresponding liquid crystal state setting instruction; the emission module provides output light through the speckle projector, and projects the emission light onto the target object after triggering the corresponding physical state of the liquid crystal according to the liquid crystal state setting instruction; the acquisition module acquires the reflected light signal through the TOF pixel array and generates an electrical signal according to the reflected light signal; the processor calculates the depth value of the target object based on the electrical signal. Through the implementation of the solution of this application, the physical state of the liquid crystal in the emission module is adaptively adjusted according to the resolution required by the depth measurement scenario, so as to change the form of the emission light to make up for the limitation of the light signal acquisition of the TOF pixel, so that the depth measurement system can ensure high measurement accuracy both in the near range and the far range.

[0047] In order to solve the problem that the TOF ranging technology provided in the related art only has good ranging performance within a specific detection distance and the ranging application scenario is relatively limited, the second embodiment of this application provides a depth measurement method, which is applied to a depth measurement system including an emission module, an acquisition module, and a processor. The emission module includes a speckle projector and a liquid crystal. As Figure 3 This is a schematic diagram of the basic process of the depth measurement system provided by this embodiment. The depth measurement method includes the following steps:

[0048] Step 301, the processor obtains the resolution requirement index and generates a corresponding liquid crystal state setting instruction;

[0049] Step 302, the emission module provides output light through the speckle projector, and projects the emission light onto the target object after triggering the corresponding physical state of the liquid crystal according to the liquid crystal state setting instruction sent by the processor;

[0050] Step 303, the acquisition module acquires the reflected light signal through the TOF pixel array and generates an electrical signal according to the reflected light signal;

[0051] Step 304, the processor calculates the depth value of the target object based on the electrical signal.

[0052] It should be noted that the physical state of the liquid crystal in this embodiment includes the diffused state and the transparent state, and the resolution requirement index is related to the measurement distance.

[0053] In an implementation manner of this embodiment, before the step that the acquisition module acquires the reflected light signal through the TOF pixel array and generates an electrical signal according to the reflected light signal, it further includes: the acquisition module acquires the reflected light signal reflected back by the target object through the EVS pixel array in the initial state and generates an event signal according to the reflected light signal; the processor generates an event image according to the event signal, and when it recognizes that the target object in the event image is a valid measurement object, it sends a TOF pixel activation instruction to the acquisition module.

[0054] Further, in an implementation manner of this embodiment, the acquisition module includes a switchable pixel array, and the switchable pixel array is an EVS pixel array in the initial state. Correspondingly, the step of the acquisition module acquiring the reflected light signal through the TOF pixel array includes: the acquisition module controls the EVS pixel array to switch to the TOF pixel array in response to the TOF pixel activation instruction sent by the processor; and acquires the reflected light signal through the TOF pixel array.

[0055] In an implementation manner of this embodiment, the depth measurement system further includes a distance sensor. Correspondingly, before the step of the processor obtaining the resolution requirement index and generating the corresponding liquid crystal state setting instruction, it further includes: the distance sensor detecting the real-time distance value of the target object. The step of the processor obtaining the resolution requirement index and generating the corresponding liquid crystal state setting instruction specifically includes: the processor determines the resolution requirement index corresponding to the real-time distance value according to the preset mapping relationship between the distance value and the resolution requirement index, and generates the corresponding liquid crystal state setting instruction based on the determined resolution requirement index.

[0056] It should be noted that the depth measurement systems in the first embodiment can all be implemented based on the depth measurement method provided in this embodiment. Those of ordinary skill in the art can clearly understand that for the convenience and conciseness of description, the specific working process of the depth measurement method described in this embodiment can refer to the corresponding implementation in the foregoing device embodiment, and will not be elaborated herein.

[0057] Based on the technical solution of the embodiment of the present application above, the processor obtains the resolution requirement index and generates the corresponding liquid crystal state setting instruction; the emission module provides the output light through the speckle projector, and projects the emission light to the target object through the liquid crystal after triggering the corresponding physical state according to the liquid crystal state setting instruction; the acquisition module acquires the reflected light signal through the TOF pixel array and generates an electrical signal according to the reflected light signal; the processor calculates the depth value of the target object based on the electrical signal. By implementing the solution of the present application, the physical state of the liquid crystal in the emission module is adaptively adjusted according to the resolution required by the depth measurement scenario, so as to change the form of the emission light to make up for the limitation of the light signal acquisition of the TOF pixel, so that the depth measurement system can ensure a high measurement accuracy both at close range and at long range.

[0058] Figure 4 The method in... is a refined depth measurement method provided in the third embodiment of the present application, and this depth measurement method includes:

[0059] Step 401, the emission module provides the output light through the speckle projector, and projects the emission light to the target object through the liquid crystal after triggering the corresponding physical state according to the resolution requirement index;

[0060] Step 402: The acquisition module collects the reflected light signal reflected by the target object through the EVS pixel array in the initial state, and generates an event signal according to the reflected light signal;

[0061] Step 403: The processor generates an event image according to the event signal, and when it recognizes that the target object in the event image is a valid measurement object, it sends a TOF pixel activation instruction to the acquisition module;

[0062] Step 404: In response to the TOF pixel activation instruction sent by the processor, the acquisition module controls the EVS pixel array to switch to the TOF pixel array;

[0063] Step 405: The acquisition module collects the reflected light signal through the TOF pixel array and generates an electrical signal according to the reflected light signal;

[0064] Step 406: The processor calculates the depth value of the target object based on the electrical signal.

[0065] It should be understood that the magnitudes of the sequence numbers of the steps in this embodiment do not mean the sequence of step execution. The execution sequence of each step should be determined by its function and internal logic, and should not uniquely limit the implementation process of the embodiments of the present application.

[0066] Through the depth measurement method provided in this embodiment, on the one hand, the physical state of the liquid crystal in the emission module is adaptively adjusted according to the resolution required by the depth measurement scenario to change the form of the emitted light to make up for the limitations of the light signal acquisition of the TOF pixel, so that the depth measurement system can ensure high measurement accuracy both at close range and far range; on the other hand, after generating an event image based on the event signal and performing image recognition, when the target object in the current scene is identified as a specific object that needs to perform depth measurement, the depth measurement is triggered, which can reduce the power consumption of the emission module and the acquisition module while reducing the data volume of the memory; on the other hand, by configuring the pixel array in a switchable mode, the image sensor can be globally configured as a single type of pixel array in different sensor working modes, which can ensure that as many pixels as possible sense the reflected light in different signal acquisition stages, thereby greatly improving the image resolution.

[0067] Figure 5 A terminal device provided in the fourth embodiment of the present application. This terminal device can be used to implement the depth measurement method in the foregoing embodiments, and mainly includes:

[0068] A memory 501, a processor 502, and a computer program 503 stored on the memory 501 and executable on the processor 502. The memory 501 and the processor 502 are communicatively connected. When the processor 502 executes the computer program 503, the methods in the foregoing Embodiment 2 or 3 are implemented. Among them, the number of processors can be one or more.

[0069] The memory 501 can be a high-speed random access memory (RAM) or a non-volatile memory, such as a disk memory. The memory 501 is used to store executable program codes, and the processor 502 is coupled to the memory 501.

[0070] Furthermore, an embodiment of the present application also provides a computer-readable storage medium, which can be disposed in the terminal device in the above embodiments. The computer-readable storage medium can be the memory in the foregoing Figure 5 illustrated embodiments.

[0071] A computer program is stored on the computer-readable storage medium. When the program is executed by the processor, the depth measurement method in the foregoing embodiments is implemented. Further, the computer-readable storage medium can also be various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a RAM, a magnetic disk, or an optical disc.

[0072] In several embodiments provided by the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of modules is only a logical function division. In actual implementation, there can be other division methods. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or modules can be in electrical, mechanical, or other forms.

[0073] The modules described as separate components may or may not be physically separated. The components shown as modules may or may not be physical modules, that is, they can be located in one place or distributed to multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0074] In addition, the functional modules in each embodiment of the present application can be integrated into one processing module, or each module can exist physically alone, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules.

[0075] When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a readable storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present application. The foregoing readable storage medium includes: various media such as USB flash drives, mobile hard disks, ROM, RAM, magnetic disks, or optical discs that can store program codes.

[0076] It should be noted that, for the foregoing method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present application is not limited by the described action sequence, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present application.

[0077] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0078] The above is the description of the depth measurement system and method provided by the present application. For those skilled in the art, according to the idea of the embodiments of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A depth measurement system, characterized in that, it includes: a transmitting module, a collecting module and a processor, wherein the transmitting module includes a speckle projector and a liquid crystal; the transmitting module is configured to provide output light through the speckle projector, and project transmitting light onto a target object after triggering a corresponding physical state according to a liquid crystal state setting instruction sent by the processor through the liquid crystal; wherein, the physical states include a diffused state and a transparent state; the collecting module is specifically configured to: collect a reflected light signal reflected back by the target object through an EVS pixel array in an initial state, generate an event signal according to the reflected light signal, and in response to a TOF pixel activation instruction sent by the processor, collect the reflected light signal through a TOF pixel array and generate an electrical signal according to the reflected light signal; the processor is specifically configured to: obtain a resolution requirement index and generate a corresponding liquid crystal state setting instruction, generate an event image according to the event signal, and when it is recognized that the target object in the event image is a valid measurement object, send the TOF pixel activation instruction to the collecting module, and calculate a depth value of the target object based on the electrical signal; wherein, the resolution requirement index is associated with a measurement distance.

2. The depth measurement system according to claim 1, characterized in that, the collecting module includes a switchable pixel array, and the switchable pixel array is the EVS pixel array in the initial state; when the collecting module performs the function of collecting the reflected light signal through the TOF pixel array in response to the TOF pixel activation instruction sent by the processor, it is specifically configured to: in response to the TOF pixel activation instruction sent by the processor, control the EVS pixel array to switch to the TOF pixel array; collect the reflected light signal through the TOF pixel array.

3. The depth measurement system according to claim 1, characterized in that, the collecting module includes an EVS pixel array and a TOF pixel array separately provided on the same image sensor.

4. The depth measurement system according to claim 1, characterized in that, the speckle projector includes a light source and an optical element; when the transmitting module performs the function of providing output light through the speckle projector, it is specifically configured to: output a light beam through the light source, and provide output light after optically modulating the light beam through the optical element.

5. The depth measurement system according to claim 1, characterized in that, when the transmitting module performs the function of providing output light through the speckle projector, it is specifically configured to: provide output light through the speckle projector in a regular speckle pattern having a plurality of speckles.

6. The depth measurement system according to any one of claims 1 to 5, characterized in that, the depth measurement system further includes a distance sensor; the distance sensor is configured to detect a real-time distance value of the target object; when the processor performs the function of obtaining the resolution requirement index and generating a corresponding liquid crystal state setting instruction, it is specifically configured to: Determine the resolution requirement index corresponding to the real-time distance value according to the mapping relationship between the preset distance value and the resolution requirement index, and generate the corresponding liquid crystal state setting instruction based on the determined resolution requirement index.

7. A depth measurement method applied to a depth measurement system including a transmitting module, a collecting module, and a processor, where the transmitting module includes a speckle projector and a liquid crystal. Characterized in that The depth measurement method includes: The processor obtains the resolution requirement index and generates the corresponding liquid crystal state setting instruction; wherein, the resolution requirement index is associated with the measurement distance. The transmitting module provides output light through the speckle projector, and projects the transmitted light onto the target object by triggering the corresponding physical state according to the liquid crystal state setting instruction sent by the processor through the liquid crystal; wherein, the physical state includes a diffused state and a transparent state. The collecting module collects the reflected light signal reflected back by the target object through the EVS pixel array in the initial state, and generates an event signal according to the reflected light signal. The processor generates an event image according to the event signal, and when it is recognized that the target object in the event image is a valid measurement object, sends a TOF pixel activation instruction to the collecting module. The collecting module responds to the TOF pixel activation instruction sent by the processor, collects the reflected light signal through the TOF pixel array, and generates an electrical signal according to the reflected light signal. The processor calculates the depth value of the target object based on the electrical signal.

8. The depth measurement method according to claim 7. Characterized in that The collecting module includes a switchable pixel array, and the switchable pixel array is the EVS pixel array in the initial state. The step of the collecting module collecting the reflected light signal through the TOF pixel array includes: The collecting module responds to the TOF pixel activation instruction sent by the processor, and controls the EVS pixel array to switch to the TOF pixel array. Collect the reflected light signal through the TOF pixel array.

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