A rapid design system and design method for a micro-assembly three-dimensional process

Abstract

The present invention provides a rapid design system and method for a micro-assembly three-dimensional process. The system includes a process knowledge ontology construction module, a typical process knowledge mining module, and a three-dimensional process rapid design module, which are integrated with an information system, a CAD modeling system, and a micro-assembly process simulation and optimization system. The process knowledge ontology construction module mainly performs structured definition and management of micro-assembly process data, completes the construction of the micro-assembly knowledge ontology, and through the typical process knowledge mining module, performs analysis and fusion to obtain typical micro-assembly process knowledge. Finally, the three-dimensional process rapid design module is used to complete the micro-assembly three-dimensional process design. The present invention effectively solves the problems of low efficiency and poor reliability existing in the two-dimensional mode of micro-assembly processes, reduces the error rate in the actual micro-assembly process, and shortens the development cycle.

Description

Technical Field

[0001] The present invention belongs to the technical field of micro-nano electronic devices and is applied in the design and production process of micro-assembly technology. Background Art

[0002] Micro-assembly technology is a new generation of electronic packaging technology developed on the basis of semiconductor integrated circuit technology, hybrid integrated circuit technology, and surface mount technology. Three-dimensional process manufacturing technology is a new technology in the field of intelligent manufacturing, mainly applied in the manufacturing and processing of large structural parts such as general assembly and machining. Currently, micro-assembly adopts a two-dimensional process design mode, that is, process technicians design the micro-assembly process based on the input two-dimensional drawing and their own technology and experience. The expressiveness of this design method is greatly limited, and it is easy to produce deviations between the entity and the abstraction. Moreover, the output micro-assembly process lacks verification. If the problems hidden in the process design are exposed to subsequent production, it will extend and increase the development cycle and cost of the entire electronic component. The micro-assembly two-dimensional process design has the following problems.

[0003] 1. The process design process cannot directly use the three-dimensional model of the product as input, and key data information is easily lost during the conversion between the three-dimensional model and the two-dimensional plan view;

[0004] 2. The micro-assembly two-dimensional process strongly depends on the design experience of process personnel and cannot form the accumulation of micro-assembly knowledge and data;

[0005] 3. The micro-assembly two-dimensional process design process is repeated, and the micro-assembly process design efficiency is low;

[0006] 4. The micro-assembly two-dimensional process design cannot effectively ensure the rationality of the design and needs to be verified through experiments, increasing the rework and repair process of micro-assembly products;

[0007] 5. The micro-assembly two-dimensional process design cannot visually express the process content and model, and it is difficult to evaluate the operability of tooling fixtures, which brings inconvenience to production. Summary of the Invention

[0008] In view of the above problems of the micro-assembly two-dimensional process design, the present invention provides an efficient, accurate, and highly confident micro-assembly three-dimensional process design method by building a micro-assembly three-dimensional process system.

[0009] The present invention provides a rapid design system and method for micro-assembly three-dimensional process, including a process knowledge ontology construction module, a typical process knowledge mining module, and a three-dimensional process rapid design module. The process knowledge ontology construction module mainly performs structured definition and management of micro-assembly process data, completes the construction of the micro-assembly knowledge ontology, and through the typical process knowledge mining module, performs parsing and fusion to obtain typical micro-assembly process knowledge. Finally, the three-dimensional process rapid design module is used to complete the micro-assembly three-dimensional process design. When performing micro-assembly process design, import the three-dimensional model of the microwave component / module housing in the CAD modeling system, and based on the component / module chip BOM data table provided by the information system interface, match it with the micro-assembly process database, and realize the rapid planning of the micro-assembly process sequence and path by calling the process library model; then use the micro-assembly process simulation and optimization system to simulate and optimize the micro-assembly process, and complete the review, approval and release of the process document after determining the optimal parameters.

[0010] Further, the process knowledge ontology construction module includes functions of knowledge entity modeling, knowledge instance addition, and attribute relationship definition.

[0011] The typical process knowledge mining module includes functions of ontology file parsing, similar entity fusion, and typical rule mining.

[0012] The three-dimensional process rapid design module includes functions of design file parsing, process rapid design, process tree generation, process temperature inspection, design information inspection, and process document output.

[0013] The present invention also provides a design method for a rapid design system of micro-assembly three-dimensional process, which is carried out according to the following steps:

[0014] (1) Micro-assembly process database management: Analyze and sort out micro-assembly process knowledge and data, establish and improve the chip information library, process model library, process knowledge library, and process rule library, and provide knowledge services for the formulation of the process flow;

[0015] (2) Micro-assembly process flow formulation: Extract typical processes in the micro-assembly two-dimensional process, and formulate the micro-assembly process flow according to the temperature gradient requirements;

[0016] (3) Rapid import of microwave component / module models: Import the geometric information of the parts, and display the three-dimensional models of the microwave components / modules by associating with the underlying parts library;

[0017] (4) Micro-assembly sequence and path planning: Import the chip BOM data table, and plan the assembly sequence and path of the chips based on the chip database and process temperature rules;

[0018] (5) Micro - assembly three - dimensional process simulation and optimization: Select micro - assembly process nodes, load the pose matrix for transformation, and simulate the process based on the interference check algorithm. Check and optimize the simulation results.

[0019] (6) Review, signature, and release of process documents: Check micro - assembly process information, export the process document after verification, and release the process document.

[0020] The present invention greatly improves the efficiency of micro - assembly process design, effectively solves the problems existing in the current two - dimensional micro - assembly process, such as low efficiency, poor reliability, and strong dependence on personnel experience, reduces the error rate in the actual micro - assembly process, shortens the micro - assembly process development cycle of microwave components / modules, and improves the first - pass yield rate of products. Description of the Drawings

[0021] Figure 1 It is the composition diagram of the three - dimensional process rapid design system for micro - assembly of the present invention.

[0022] Figure 2 It is the design flow chart of the three - dimensional process rapid design system for micro - assembly of the present invention. Detailed Embodiments

[0023] Figure 1 It is the basic composition diagram of the present invention. It has 3 basic modules, and their functions are: construction of process knowledge ontology, mining of typical process knowledge, and rapid three - dimensional process design.

[0024] The process knowledge ontology construction module mainly performs structured definition and management of micro - assembly process data. Based on the process database, the knowledge ontology is constructed by means of knowledge entity modeling, knowledge instance addition, and attribute relationship definition.

[0025] The typical process knowledge mining module parses the constructed knowledge ontology file to obtain a series of process knowledge instances, then fuses similar knowledge entities in the instances, and finally mines typical rules from the fused knowledge instances to obtain typical process knowledge.

[0026] The functions and steps of the three - dimensional process rapid design module are as follows: 1) Parse the design file to obtain product design requirements and the device BOM list; 2) Load the three - dimensional model of the device; 3) Then perform rule instance matching and process instance reuse based on process knowledge; 3) Perform process tree mapping based on the obtained process list, including process node mapping and work step node generation, generate the assembly process tree, and complete the three - dimensional micro - assembly process design; 4) Process personnel interactively check and improve the process information; 5) Perform process manufacturability analysis based on the temperature principle and the non - interference principle during the assembly process; 6) After verification, output the process document.

[0027] Figure 2 This is the design flow chart of the rapid design system for the micro-assembly three-dimensional process of the present invention. The micro-assembly three-dimensional process design is completed according to the following steps.

[0028] 1). Define the product, device, process, and resource entities in the micro-assembly process;

[0029] 2). Conduct specific concept definition and instance addition;

[0030] 3). Define the data attributes and object attributes of the concept instances based on the attribute descriptions of the entities and the mapping relationships between the entities;

[0031] 3). Fusion of similar entities;

[0032] 4). Mining of typical association rules;

[0033] 5). Parse the design file, load the device model according to the device list in the design file, and construct the design information instance;

[0034] 6). Quickly generate the process flow through the process association relationship and sorting rules, and generate the micro-assembly process tree based on the process node mapping rule and the assembly step generation technology;

[0035] 7). Subsequently, traverse the process nodes, conduct process temperature inspection based on the temperature rule, and conduct design information inspection based on the non-interference rule of the bonding head cartridge;

[0036] 8). After the inspection is error-free, output the process simulation animation and process card to guide on-site production.

Claims

1. A rapid design system for a micro-assembly three-dimensional process, characterized in that: It includes a process knowledge ontology construction module, a typical process knowledge mining module, and a 3D process rapid design module. Among them, the process knowledge ontology construction module conducts structured definition and management of micro-assembly process data, completes the construction of the micro-assembly knowledge ontology, and through the typical process knowledge mining module, it is parsed and fused to obtain typical micro-assembly process knowledge. Finally, the 3D process rapid design module is used to complete the 3D process design of micro-assembly. When conducting micro-assembly process design, import the 3D model of the microwave component / module housing into the CAD modeling system, and based on the component / module chip BOM data table provided by the information system interface, match it with the micro-assembly process database, and realize the rapid planning of the micro-assembly process sequence and path by calling the process library model; Then, use the micro-assembly process simulation and optimization system to simulate and optimize the micro-assembly process, and complete the review, signature, and release of the process document after determining the optimal parameters; Among them, the process knowledge ontology construction module includes functions of knowledge entity modeling, knowledge instance addition, and attribute relationship definition; the typical process knowledge mining module includes functions of ontology file parsing, similar entity fusion, and typical rule mining; the 3D process rapid design module includes functions of design file parsing, process rapid design, process tree generation, process temperature inspection, design information inspection, and process document output.

2. The design method of a 3D process rapid design system for micro-assembly according to claim 1, characterized in that: (1) Micro-assembly process database management: Analyze and sort out micro-assembly process knowledge and data, establish and improve the chip information library, process model library, process knowledge library, and process rule library to provide knowledge services for the formulation of the process flow; (2) Micro-assembly process flow formulation: Extract typical processes in the micro-assembly two-dimensional process and formulate the micro-assembly process flow according to the temperature gradient requirements; (3) Rapid import of microwave component / module models: Import the geometric information of the parts and display the 3D models of the microwave components / modules by associating with the underlying parts library; (4) Micro-assembly sequence and path planning: Import the chip BOM data table and plan the assembly sequence and path of the chips based on the chip database and process temperature rules; (5) Micro-assembly 3D process simulation and optimization: Select micro-assembly process nodes, load the pose matrix for transformation, and simulate the process based on the interference check algorithm, and check and optimize the simulation results; (6) Review, signature, and release of process documents: Check the micro-assembly process information, export the process document after verification, and release the process document.

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