A method for selecting a mass production test platform

Abstract

The present invention belongs to the field of electronic technology and relates to a method for providing a selection of mass production test platforms, including: S1: A client server collects user requirement information; S2: Determine whether there is a test platform that matches the user requirement information; S3: Match the platform that is closest to the user requirement information; S4: Determine whether to re-enter the user requirement information; S5: Determine whether to generate a configuration requirement file; S6: Determine whether to recommend a test factory; S7: Determine whether to outsource test development. Beneficial effects: It realizes the reasonable matching between semiconductor production-related enterprises and customers with test platforms and test factories, as well as the optimal docking with outsourcing cooperation units or individuals, and accelerates the mass production process of semiconductor products.

Description

Technical Field

[0001] The present invention belongs to the field of electronic technology, and particularly relates to a method for platform selection. Background Art

[0002] With the rapid development of the semiconductor industry and the strong investment of the country, the number of semiconductor design companies has increased exponentially. The semiconductor devices produced by these semiconductor design enterprises are an important support for the semiconductor industrial chain and lead the technological development of the entire semiconductor industry.

[0003] The technical problems existing in this field are as follows: Due to various reasons, many new design companies have incomplete architectures and a shortage of test engineers, resulting in difficulties in effectively promoting the work of mass production testing. Some semiconductor design companies do not know which mainstream test platforms are available, how to select a test platform, what the installed capacity of the test platform is, and what the production capacity is. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for selecting a mass production test platform, aiming to solve the above-mentioned existing technical problems.

[0005] A method for selecting a mass production test platform includes:

[0006] S1: A user-end server collects user requirement information;

[0007] S2: Judge whether there is a test platform that matches the user requirement information. If so, directly execute S5; if not, execute S3;

[0008] S3: Match the platform closest to the user requirement information, and display the test platform closest to the user requirement information and the device indicators in a database, and then execute S4;

[0009] S4: Judge whether to re-enter the user requirement information. If so, directly return to S1; if not, directly exit the program;

[0010] S5: Display the recommended test platform, and then judge whether to generate a configuration requirement file. If so, generate and save the specified format of the configuration requirement file, and then execute S6; if not, directly execute S6;

[0011] S6: Judge whether to recommend a test factory. If so, display all the recommended test factories that include the selected test platform, and then execute S7; if not, directly execute S7;

[0012] S7: Judge whether to outsource test development. If so, display the information of qualified units and individuals and exit the program; if not, directly exit the program.

[0013] Preferably, in step S1, the user requirement information includes an electrical parameter, and the electrical parameter includes:

[0014] At least one of a maximum operating frequency parameter, a working voltage range parameter, a typical operating current parameter, a digital channel parameter, and a vector depth parameter.

[0015] Preferably, the user requirement information further includes:

[0016] At least one of a wafer test information / package test information, a chip information / package type information, a simultaneous test number information, and a test environment information.

[0017] Preferably, the test environment information includes:

[0018] At least one of a normal temperature data, a low temperature data, and a high temperature data.

[0019] Preferably, in step S2, after receiving the user requirement information, the user-side server determines the test platform by successively comparing all the input user requirement information with the device indicators in the database, and the number of the test platforms is greater than or equal to 0.

[0020] Further, step S2 includes the following steps:

[0021] S21, determine to perform a wafer test or a package test. If it is the wafer test, select the product type of the wafer test, and then directly execute S24. If the package test is selected, select the product type of the package test, match the resources of a single station for the package test, and then execute S22;

[0022] S22, determine whether a matching result of the package test meets the user's single-station test requirements. If so, calculate the simultaneous test number of the user requirement information, and then execute S23. If not, save the matching result;

[0023] S23, determine whether a matched test platform meets the simultaneous test number of the user requirement. If so, generate the configuration file and feedback the matching result, and the process terminates. If not, feedback the matching result and prompt the reason;

[0024] S24, determine whether the chip test frequency is less than the maximum test frequency of the wafer test under the hardware conditions. If so, execute step S25. Otherwise, feedback the matching result and prompt the reason.

[0025] Further, after step S24, there is also:

[0026] S25. Determine whether the maximum operating current of the chip is less than its rated operating current. If so, perform resource matching for a single station of the wafer test, and determine whether the test platform after matching exists and meets the user's test requirements. If so, jump to S26; otherwise, feedback the matching result and prompt the reason.

[0027] S26. Determine whether the test board card resources of the test platform after matching meet the user's requirement for the number of concurrent tests, and then execute S27; otherwise, save the matching result.

[0028] S27. Generate the configuration file and return to the main program.

[0029] Further, in step S5, the user-side server extracts the model numbers of the resource board cards that meet the requirements of the test platform and a resource board card license corresponding to the test platform, and then generates a configuration information.

[0030] Further, in step S6, the user-side server feeds back the generated configuration information to the interface of the user-side server, and then asks the user whether to recommend the test factory or test development service provider.

[0031] Beneficial effects: The present invention realizes the reasonable matching between semiconductor production-related enterprises and customers and test platforms and test factories, as well as the optimal docking with outsourcing cooperation units or individuals, and accelerates the mass production process of semiconductor products. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following-described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0033] Figure 1 It is a general process schematic diagram of a method for providing a mass production test platform selection in a preferred embodiment of the present invention;

[0034] Figure 2 It is a general program schematic diagram of a method for providing a mass production test platform selection in a preferred embodiment of the present invention;

[0035] Figure 3 It is a step schematic diagram of step S2 in a method for providing a mass production test platform selection in a preferred embodiment of the present invention;

[0036] Figure 4 It is an algorithm flow chart of a matching platform when selecting a chip test in a preferred embodiment of the present invention. Detailed implementation manners

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments may be combined with each other.

[0039] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but it is not limited to the present invention.

[0040] As Figure 1 、 Figure 2 shown, preferably, the overall step logic of a method for providing a mass production test platform selection in the present invention is as follows:

[0041] S1: A user-end server collects user requirement information;

[0042] S2: Judge whether there is a test platform that matches the user requirement information. If so, directly execute S5; if not, execute S3;

[0043] S3: Match the platform closest to the user requirement information, and display the test platform closest to the user requirement information and the device indicators in a database, and then execute S4;

[0044] S4: Judge whether to re-enter the user requirement information. If so, directly return to S1; if not, directly exit the program;

[0045] S5: Display the recommended test platform, and then judge whether to generate a configuration requirement file. If so, generate and save the specified format of the configuration requirement file, and then execute S6; if not, directly execute S6;

[0046] S6: Judge whether to recommend a test factory. If so, display all the recommended test factories including the selected test platform, and then execute S7; if not, directly execute S7;

[0047] S7: Judge whether to outsource test development. If so, display the information of the eligible units and individuals and exit the program; if not, directly exit the program.

[0048] Specifically, for step S1, the user requirement information includes an electrical parameter, which includes: a maximum operating frequency parameter, a working voltage range parameter, a typical operating current parameter, a digital channel parameter, a vector depth parameter, etc. In addition, in addition to the electrical parameter, there are also: a wafer test (Chip Probing, CP) / package test (Final Test, FT) information, a wafer information / package type information, a co-test number information, a test environment information, etc.

[0049] Preferably, the test environment information includes: a normal temperature data, a low temperature data, a high temperature data, etc.

[0050] Preferably, for step S2, after receiving the user requirement information, the user-side server determines the test platform by successively comparing all the input user requirement information with the device indicators in the database, where the number of test platforms is 0 or several.

[0051] Preferably, for step S5, the user-side server extracts the model numbers of the resource boards required by the test platforms that meet the conditions and the vouchers corresponding to the test platforms, and then generates configuration information.

[0052] Preferably, for S6, the user-side server feeds back the generated configuration information to the interface of the user-side server, and then asks the user whether to recommend a test factory or a test development service provider.

[0053] As Figure 3 、 Figure 4 shown, preferably, an algorithm flow for matching platforms during chip testing applied in the present invention includes:

[0054] S21, first determine whether to perform wafer test (Chip Probing) or package test (Final Test). If wafer test (Chip Probing) is selected, select the product type of wafer test (Chip Probing) and switch the algorithm, then directly execute step 4. If package test (Final Test) is selected, select the product type of package test (Final Test) and switch the algorithm, perform single-station test resource matching for package test (Final Test), and then execute step 2;

[0055] S22, determine whether the package test (Final Test) result meets the user requirements. If so, perform the co-test number calculation of the user requirements, and then execute step 3. Otherwise, save the matching result of the platform;

[0056] S23, determine whether the matched test platform meets the user's co-test number requirements. If so, generate a configuration file and feedback the result, and the process terminates. Otherwise, feedback the reason for the matching result prompt;

[0057] S24. Determine whether the wafer test (Chip Probing) frequency is less than the rated frequency of the wafer test (Chip Probing). If so, execute step S25; otherwise, feedback the matching result and prompt the reason.

[0058] S25. Determine whether the maximum operating current of the chip is less than its rated operating current. If so, perform single-station resource matching for the chip wafer test (Chip Probing), and then execute step 4; otherwise, feedback the matching result and prompt the reason.

[0059] S26. Determine whether the single-station matching result of the wafer test (Chip Probing) meets the user's requirements. If so, calculate the number of chips tested simultaneously according to the user's requirements, and then execute step 5; otherwise, save the matching result of the platform.

[0060] S27. Determine whether the test board resources of the matched test platform meet the user's requirement for the number of chips tested simultaneously. If so, generate a configuration file and feedback the result, and the process terminates; otherwise, feedback the matching result and prompt the reason.

[0061] Preferably, the present invention abstracts the device performances of different device models of mainstream device manufacturers in the market such as Advantest, Teradyne, Chroma, Accotest, and SineTest, and enters them into the database.

[0062] Preferably, the present invention accepts registrations from development teams and individuals and enters their ability information.

[0063] Preferably, the present invention enters the installation quantities of major mainstream platforms in most domestic packaging and testing factories into the database.

[0064] Preferably, the present invention abstracts the evaluation methods for mass production test schemes of different types of products to process the information input by the user terminal.

[0065] Preferably, the present invention abstracts the bottlenecks of two hardware tests, namely wafer test CP and chip package test FT, to screen customer requirements.

[0066] Preferably, the present invention provides a set of user interfaces (Client) for users to input information and receive feedback. The interface includes information input controls, software general settings controls, etc.

[0067] Specifically, in a specific embodiment of the present invention, the above-mentioned wafer test (Chip Probing), namely CP test (Chip Probing), (die sort) / wafer sort. Its test object is each Die (i.e., "die", or wafer unit) in the whole wafer, and its purpose is to screen out each wafer unit (Die) in the whole wafer that meets the device characteristics or design specifications, usually including the verification of voltage, current, timing and function. It can be used to detect the process level of semiconductor manufacturing plants (Fabrication). The difficulty of wafer test (Chip Probing) / CP is how to pick out the wafer units that do not meet the technical requirements and reject or repair them in the shortest time.

[0068] Generally, in the process of wafer test (Chip Probing), commonly used equipment includes chip (integrated circuit) tester (IC Tester), prober (Prober) and the interface between the tester and the probe card (MechanicalInterface).

[0069] During the test, the wafer is fixed on a chuck with vacuum suction and aligned with very fine probe detectors (μm level). At the same time, the probes are in contact with each bonding pad of the chip. The detector tests the circuit under the drive of the power supply and records the results. The quantity, sequence and type of the test are controlled by a computer program. The tester is automated, so the test work does not require the assistance of an operator after the probe detector is aligned with the first wafer (manual alignment or using an automatic vision system).

[0070] Wafer test is one of the main methods for calculating the chip yield. As the area and density of chips increase, the cost of wafer test becomes higher and higher. As a result, chips require longer test times and more precise and complex power supplies, mechanical devices and computer systems to perform test work and monitor test results. The vision inspection system is also more precise and expensive as the chip size expands. Chip designers are required to introduce test patterns into the memory array. Test designers are exploring how to simplify and optimize the test process, such as using a simplified test program after the chip parameters are evaluated as qualified. In addition, the chips on the wafer can be tested alternately, or multiple chips can be tested simultaneously.

[0071] The above-mentioned FT test (Final Test) is used for the last interception before the chip leaves the factory. Its test object is the packaged chip. After wafer test (Chip Probing) / CP, the chip will be packaged and then the FT test will be carried out. This link can be used to detect the process level of the packaging factory.

[0072] The beneficial effects of the present invention are as follows: By means of a method for selecting models of a test platform provided by the present invention, suitable test platforms, test factories meeting mass production conditions are recommended to enterprises and customers related to semiconductor production, and the best outsourcing cooperation units or individuals are matched, effectively solving the problem that mass production testing is difficult due to incomplete company structures and scarce test engineers.

[0073] The above are only the preferred embodiments of the present invention, and do not limit the implementation manners and protection scope of the present invention accordingly. For those skilled in the art, it should be realized that all equivalent replacements and obvious changes made by using the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for selecting a mass production test platform, characterized in that, it includes: S1: A client server collects a user requirement information; S2: Judge whether there is a test platform that matches the user requirement information. If so, directly execute S5; if not, execute S3; S3: Match the platform closest to the user requirement information, and display the test platform closest to the user requirement information and the device indicators in a database, and then execute S4; S4: Judge whether to re-enter the user requirement information. If so, directly return to S1; if not, directly exit the program; S5: Display the recommended test platform, and then judge whether to generate a configuration requirement file. If so, generate and save the specified format of the configuration requirement file, and then execute S6; if not, directly execute S6; S6: Judge whether to recommend a test factory. If so, display all the recommended test factories that include the selected test platform, and then execute S7; if not, directly execute S7; S7: Judge whether to outsource test development. If so, display the information of qualified units and individuals and exit the program; if not, directly exit the program; The user requirement information further includes: at least one of a wafer test information / package test information, a chip information / package type information, a co-test number information, and a test environment information; Step S2 includes the following steps: S21: Judge to perform a wafer test or a package test. If it is the wafer test, select the product type of the wafer test, and then directly execute S24. If the package test is selected, select the product type of the package test and match the resources of a single station of the package test, and then execute S22; S22: Judge whether a matching result of the package test meets the user's single-station test requirements. If so, calculate the co-test number of the user requirement information, and then execute S23; if not, save the matching result; S23: Judge whether a matched test platform meets the co-test number required by the user. If so, generate a configuration file and feedback the matching result, and the process terminates; if not, feedback the matching result and prompt the reason; S24: Judge whether the chip test frequency is less than the maximum test frequency under the hardware conditions of the wafer test. If so, execute step S25; otherwise, feedback the matching result and prompt the reason.

2. The method for selecting a mass production test platform according to claim 1, characterized in that, in step S1, the user requirement information includes an electrical parameter, and the electrical parameter includes: at least one of a maximum operating frequency parameter, a working voltage range parameter, a typical working current parameter, a digital channel parameter, and a vector depth parameter.

3. The method for selecting a mass production test platform according to claim 1, characterized in that, the test environment information includes: at least one of a normal temperature data, a low temperature data, and a high temperature data.

4. The method for selecting a mass production test platform according to claim 1, characterized in that, In step S2, after receiving the user requirement information, the client server determines the test platform by successively comparing all the input user requirement information with the device metrics in the database, and the number of test platforms is greater than or equal to 0.

5. A method for providing a mass production test platform selection as claimed in claim 1, characterized in that, after step S24, there is also: S25: Determine whether the maximum operating current of the chip is less than its rated operating current. If so, perform resource matching for a single station of the wafer test, and determine whether the test platform after the matching exists and meets the user test requirements. If so, jump to S26; otherwise, feedback the matching result and prompt the reason; S26: Determine whether the test board card resources of the test platform after the matching meet the user's simultaneous test number requirement, and then execute S27; otherwise, save the matching result; S27: Generate the configuration file and return to the main program.

6. A method for providing a mass production test platform selection as claimed in claim 1, characterized in that, In step S5, the client server extracts the model numbers of the resource boards meeting the requirements of the test platform and a resource board license corresponding to the test platform, and then generates a configuration information.

7. A method for providing a mass production test platform selection as claimed in claim 1, characterized in that, In step S6, the client server feeds back the generated configuration information to the interface of the client server, and then asks the user whether to recommend the test factory or the test development service provider.

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