A wafer positioning structure for reducing thin film defects

Through the combination of support disc, toggle structure, power components, visual positioning camera and negative pressure components, the film defects caused by inaccurate wafer positioning are solved, and the reliable positioning and simplified structure of the wafer are achieved.

CN114496879BActive Publication Date: 2025-08-05WU XI CHINSOR TECH CO LTD
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Patent Information

Application Number
CN202210133480.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-02-14
Publication Date
2025-08-05
Estimated Expiration
2042-02-14

AI Technical Summary

Technical Problem

Existing wafer positioning devices are unable to accurately locate the wafer, resulting in film defects and complex structure.

Method used

The combination of support disc, toggle structure, power components, visual positioning camera, elevation component and negative pressure component is adopted. The power components drive the toggle structure to be close or away, and the wafer is adjusted with the limit component and visual positioning camera, the height is adjusted by adjusting the height of the adjusting component, and the wafer is fixed by the negative pressure component.

Benefits of technology

It realizes reliable positioning of the wafer, reduces film defects, is simple in structure and convenient in operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a wafer positioning structure for reducing film defects. The key technical points of its technical solution are as follows: It includes a support plate. A support board is fixed to the bottom of the support plate. A first supporting plate and a second supporting plate are fixed to both sides of the support board. Two groups of拨动 structures are symmetrically arranged above the support board. A power component for controlling the two groups of拨动 structures to approach or move away from each other is arranged on the support board. A limiting component is arranged on the first supporting plate. A visual positioning camera is installed above the second supporting plate. An adjustment component for controlling and adjusting the height and rotational position of the visual positioning camera is also arranged on the second supporting plate. A U-shaped seat is fixed to the bottom of the support board. A fixing seat is fixed to the bottom of the U-shaped seat. A height adjustment component for driving the fixing seat to be raised is arranged at the bottom of the fixing seat; This wafer positioning structure for reducing film defects has the advantages of reliable and convenient positioning. It should be noted that the Chinese term "拨动结构" seems not to be a standard technical term. It may need to be further clarified and accurately translated according to its specific meaning in the context. The above translation is a literal translation for the time.
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Description

Technical Field

[0001] The present invention relates to the field of wafer production, and particularly to a wafer positioning structure for reducing film defects. Background Art

[0002] Wafer production includes multiple process steps. When circuit integration is performed on a wafer, it is necessary to ensure the positioning accuracy of the wafer on the fixture so as to reduce production defects.

[0003] The existing Chinese patent with the publication number CN111843253A discloses a precise optical positioning structure for laser cutting wafers, which includes a precise XY-axis two-dimensional workbench arranged on a frame for fixing the wafer, and a laser cutting device located above the precise XY-axis two-dimensional workbench on the frame. The laser cutting device includes a cutting laser generator, and the laser emitted by the cutting laser generator enters the focusing mirror of the laser cutting device. A fixed optical path plate is fixedly arranged above the precise XY-axis two-dimensional workbench on the frame, and a Z-axis moving frame moving along the Z-axis is arranged on the fixed optical path plate. The cutting laser generator is arranged on the fixed optical path plate.

[0004] The above patent has some disadvantages, such as: the positioning device cannot correct the circular wafer to be in the center position of the fixture, and the structure is complex. Summary of the Invention

[0005] Aiming at the problems mentioned in the background art, the purpose of the present invention is to provide a wafer positioning structure for reducing film defects to solve the problems mentioned in the background art.

[0006] The above technical purpose of the present invention is achieved through the following technical solutions:

[0007] A wafer positioning structure for reducing film defects includes a support disk. A support plate is fixed to the bottom of the support disk. A first support plate and a second support plate are fixed to both sides of the support plate. Two groups of拨动 structures are symmetrically arranged above the support plate. A power component for controlling the two groups of拨动 structures to approach or move away from each other is arranged on the support plate. A limiting component is arranged on the first support plate. A vision positioning camera is installed above the second support plate. An adjustment component for controlling and adjusting the height and rotation position of the vision positioning camera is also arranged on the second support plate. A U-shaped seat is fixed to the bottom of the support plate, and a fixed seat is fixed to the bottom of the U-shaped seat. A height adjustment component for driving the fixed seat to be raised is arranged at the bottom of the fixed seat. A negative pressure component is arranged at the bottom of the support disk.

[0008] By adopting the above technical solution, the wafer positioning structure for reducing thin film defects has the advantages of reliable and convenient positioning; by utilizing the power component, the toggle structure can be driven to move closer or farther away from each other, and then cooperating with the limit component, the purpose of toggling the wafer above the support plate to the center of the circle on the support plate can be achieved; by utilizing the adjustment component, the position of the visual positioning camera can be adjusted to detect whether the wafer is adjusted to the center of the circle; by utilizing the height adjustment component, the height of the support plate can be adjusted; and by utilizing the negative pressure component, the wafer above the support plate can be adsorbed and fixed.

[0009] Preferably, the toggle structure includes a sliding seat, a first vertical plate and a side push roller, the sliding seat is slidably connected above the support plate, the first vertical plate is fixed above the sliding seat, and the side push roller is rotatably connected in the first vertical plate through a bearing.

[0010] By adopting the above technical solution, the eccentric wafer can be adjusted and moved to a suitable position using the side push roller on the first vertical plate.

[0011] Preferably, the power assembly includes a sliding groove, a sliding block, a bidirectional screw, a first bevel gear, a second bevel gear, a support shaft, a bearing seat and a first servo motor, the sliding groove is opened at the top of the support plate, the sliding block is horizontally slidably connected in the sliding groove, the sliding block is fixed to the bottom of the sliding seat, the bidirectional screw is rotatably connected in the sliding groove, the bidirectional screw is threadedly connected to the sliding block, the first bevel gear is fixed to the outside of the bidirectional screw, the bearing seat is fixed to the bottom of the support plate, the second bevel gear is fixed to the outside of the support shaft, the support shaft is rotatably connected in the bearing seat, and the first servo motor is fixed on the support plate to drive the support shaft to rotate.

[0012] By adopting the above technical solution, when the first servo motor is started, it can drive the support shaft to rotate, thereby driving the second bevel gear to rotate, driving the first bevel gear and the bidirectional screw to rotate, thereby driving the sliding block outside the bidirectional screw to slide in the sliding groove, thereby adjusting the position of the two sliding seats, thereby adjusting the position of the side push roller.

[0013] Preferably, the limiting assembly includes a first sliding cylinder, a first cylinder, a limiting seat and a limiting wheel, the first sliding cylinder is horizontally slidably connected to the outside of the first supporting plate, the cylinder body of the first cylinder is fixed in the first sliding cylinder, the piston rod end of the first cylinder is fixed to the end of the first supporting plate, the limiting seat is fixed on the first sliding cylinder, and the limiting wheel is rotatably connected to the limiting seat through a bearing.

[0014] By adopting the above technical solution, when the first cylinder in the first sliding cylinder is started, the position of the limiting seat and the limiting wheel on the limiting seat can be adjusted, thereby adjusting the position of the limit.

[0015] Preferably, the adjustment assembly includes a second sliding cylinder, a second cylinder, a second servo motor, a side plate and a top fixing plate, the second sliding cylinder is horizontally slidably connected to the outside of the second supporting plate, the cylinder body of the second cylinder is fixed inside the second sliding cylinder, the piston rod end of the second cylinder is connected to the end of the second supporting plate, the second servo motor is fixed on the second sliding cylinder, the side plate is fixed to the motor shaft end of the second servo motor, the top fixing plate is fixed to the top of the side plate, and the visual positioning camera is fixed on the top fixing plate.

[0016] By adopting the above technical solution, when the second cylinder in the second sliding cylinder is started, the position of the second sliding cylinder can be adjusted, thereby adjusting the horizontal position of the side plate and the top fixing plate. When the second servo motor is started, the side plate can be driven to rotate, driving the top fixing plate and the visual positioning camera thereon to adjust their positions.

[0017] Preferably, the height adjustment assembly includes a fixed column, a fixed cylinder, a third servo motor and a screw, the fixed column is fixed at the bottom of the fixed column, the fixed cylinder is arranged outside the fixed column, the third servo motor is fixed inside the fixed cylinder, one end of the screw is connected to the motor shaft of the third servo motor through a coupling, and the screw is threadedly connected to the fixed column.

[0018] By adopting the above technical solution, when the third servo motor in the fixed cylinder is started, it can drive the screw to rotate, thereby driving the fixed column to slide vertically in the fixed cylinder, thereby adjusting the height of the support plate in the device.

[0019] Preferably, the negative pressure assembly includes a negative pressure suction hole, a negative pressure tube, an air pump and an electromagnetic control valve. The negative pressure suction hole is opened in the support plate, one end of the negative pressure tube is connected to the negative pressure suction hole, the other end of the negative pressure tube is connected to the air pump, and the electromagnetic control valve is arranged on the negative pressure tube.

[0020] By adopting the above technical solution, an air pump and an electromagnetic control valve can be used to generate negative pressure through the negative pressure tube and the negative pressure suction hole to adsorb and fix the wafer.

[0021] Preferably, a groove is provided in the fixing column, a protrusion is slidably connected in the groove, and the protrusion is fixedly connected to the fixing tube.

[0022] By adopting the above technical solution, with the cooperation of the groove and the protrusion, the sliding stability of the fixed column can be improved.

[0023] In summary, the present invention mainly has the following beneficial effects:

[0024] The wafer positioning structure for reducing thin film defects has the advantages of reliable and convenient positioning; by utilizing the power component, the toggle structure can be driven to move closer or farther away from each other, and then cooperating with the limit component, the purpose of toggling the wafer above the support plate to the center of the circle on the support plate can be achieved; by utilizing the adjustment component, the position of the visual positioning camera can be adjusted to detect whether the wafer is adjusted to the center of the circle; by utilizing the height adjustment component, the height of the support plate can be adjusted; and by utilizing the negative pressure component, the wafer above the support plate can be adsorbed and fixed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 This is one of the structural cross-sectional views of the present invention;

[0027] Figure 3 for Figure 2 A magnified view of point A in the figure;

[0028] Figure 4 This is the second structural cross-sectional view of the present invention;

[0029] Figure 5 for Figure 4 Enlarged view of point B in .

[0030] In the figure: 1. Support plate; 11. Support plate; 12. First supporting plate; 13. Second supporting plate; 2. Toggle mechanism; 3. Power assembly; 14. Visual positioning camera; 4. Limit assembly; 5. Adjustment assembly; 15. Socket seat; 16. Fixed seat; 6. Height adjustment assembly; 7. Negative pressure assembly; 21. Sliding seat; 22. First vertical plate; 23. Side push roller; 31. Sliding groove; 32. Sliding block; 33. Bidirectional screw; 34. First bevel gear; 35. Second bevel gear; 36 , support shaft; 37, bearing seat; 38, first servo motor; 41, first sliding cylinder; 42, first cylinder; 43, limit seat; 44, limit wheel; 51, second sliding cylinder; 52, second cylinder; 53, second servo motor; 54, side plate; 55, top fixing plate; 61, fixing column; 62, fixing cylinder; 63, third servo motor; 64, screw; 71, negative pressure suction hole; 72, negative pressure tube; 73, air pump; 74, electromagnetic control valve; 621, bump; 611, groove. DETAILED DESCRIPTION

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] Reference Figures 1 to 5 , a wafer positioning structure for reducing film defects, comprising a support plate 1. A support board 11 is fixed to the bottom of the support plate 1. A first support board 12 and a second support board 13 are fixed to both sides of the support board 11. Two groups of拨动 structures 2 are symmetrically arranged above the support board 11. A power component 3 for controlling the two groups of拨动 structures 2 to approach or move away from each other is arranged on the support board 11. A limiting component 4 is arranged on the first support board 12. A vision positioning camera 14 is installed above the second support board 13. An adjustment component 5 for controlling and adjusting the height and rotational position of the vision positioning camera 14 is also arranged on the second support board 13. A U-shaped seat 15 is fixed to the bottom of the support board 11. A fixing seat 16 is fixed to the bottom of the U-shaped seat 15. A height adjustment component 6 for driving the fixing seat 16 to be raised is arranged at the bottom of the fixing seat 16. A negative pressure component 7 is arranged at the bottom of the support plate 1.

[0033] Reference Figures 1 to 5 , this wafer positioning structure for reducing film defects has the advantages of reliable and convenient positioning. By using the power component 3, the拨动 structures 2 can be driven to approach or move away from each other, and then in cooperation with the limiting component 4, the wafer above the support plate 1 can be拨动 to the center of the support board 11. By using the adjustment component 5, the position of the vision positioning camera 14 can be adjusted to detect whether the wafer is adjusted to the center. The height of the support plate 1 can be adjusted by using the height adjustment component 6, and the wafer above the support plate 1 can be adsorbed and fixed by using the negative pressure component 7.

[0034] Reference Figures 1 to 5 , wherein the拨动 structure 2 includes a sliding seat 21, a first vertical plate 22 and a side push roller 23. The sliding seat 21 is slidably connected above the support board 11. The first vertical plate 22 is fixed above the sliding seat 21. The side push roller 23 is rotatably connected in the first vertical plate 22 through a bearing. The side push roller 23 on the first vertical plate 22 can be used to adjust and拨动 the eccentric wafer to a proper position.

[0035] Reference Figures 1 to 5 It should be noted that the term "拨动" in the original text may not be a standard technical term. It might be a misspelling or a very specific local term. Here, it is translated as "拨动" as accurately as possible according to the context. If there is a more appropriate technical term, it should be adjusted accordingly.The power assembly 3 includes a sliding groove 31, a sliding block 32, a bidirectional screw 33, a first bevel gear 34, a second bevel gear 35, a support shaft 36, a bearing seat 37 and a first servo motor 38. The sliding groove 31 is opened at the top of the support plate 11, the sliding block 32 is horizontally slidably connected in the sliding groove 31, the sliding block 32 is fixed to the bottom of the sliding seat 21, the bidirectional screw 33 is rotatably connected in the sliding groove 31, the bidirectional screw 33 is threadedly connected to the sliding block 32, the first bevel gear 34 is fixed to the outside of the bidirectional screw 33, and the bearing seat 37 is fixed to the bottom of the support plate 11. The second bevel gear 35 is fixed to the outside of the support shaft 36, and the support shaft 36 is rotatably connected to the bearing seat 37. The first servo motor 38 is fixed on the support plate 11 to drive the support shaft 36 to rotate. When the first servo motor 38 is started, it can drive the support shaft 36 to rotate, thereby driving the second bevel gear 35 to rotate, driving the first bevel gear 34 and the bidirectional screw 33 to rotate, thereby driving the sliding block 32 outside the bidirectional screw 33 to slide in the sliding groove 31, thereby adjusting the position of the two sliding seats 21, thereby adjusting the position of the side push roller 23.

[0036] refer to Figures 1 to 5 , wherein the limiting assembly 4 includes a first sliding cylinder 41, a first cylinder 42, a limiting seat 43 and a limiting wheel 44. The first sliding cylinder 41 is horizontally slidably connected to the outside of the first supporting plate 12, the cylinder body of the first cylinder 42 is fixed in the first sliding cylinder 41, the piston rod end of the first cylinder 42 is fixed to the end of the first supporting plate 12, the limiting seat 43 is fixed on the first sliding cylinder 41, and the limiting wheel 44 is rotatably connected to the limiting seat 43 through a bearing. When the first cylinder 42 in the first sliding cylinder 41 is started, the position of the limiting seat 43 and the limiting wheel 44 on the limiting seat 43 can be adjusted, thereby adjusting the position of the limit.

[0037] refer to Figures 1 to 5 , wherein the adjustment component 5 includes a second sliding cylinder 51, a second cylinder 52, a second servo motor 53, a side plate 54 and a top fixing plate 55. The second sliding cylinder 51 is horizontally slidably connected to the outside of the second supporting plate 13, the cylinder body of the second cylinder 52 is fixed inside the second sliding cylinder 51, the piston rod end of the second cylinder 52 is connected to the end of the second supporting plate 13, the second servo motor 53 is fixed on the second sliding cylinder 51, the side plate 54 is fixed to the motor shaft end of the second servo motor 53, the top fixing plate 55 is fixed to the top of the side plate 54, and the visual positioning camera 14 is fixed on the top fixing plate 55. When the second cylinder 52 in the second sliding cylinder 51 is started, the position of the second sliding cylinder 51 can be adjusted, thereby adjusting the horizontal position of the side plate 54 and the top fixing plate 55. When the second servo motor 53 is started, the side plate 54 can be driven to rotate, driving the top fixing plate 55 and the visual positioning camera 14 thereon to adjust the position.

[0038] refer to Figures 1 to 5 , wherein the height adjustment component 6 includes a fixed column 61, a fixed cylinder 62, a third servo motor 63 and a lead screw 64, the fixed column 61 is fixed at the bottom of the fixed column 61, the fixed cylinder 62 is arranged outside the fixed column 61, the third servo motor 63 is fixed inside the fixed cylinder 62, one end of the lead screw 64 is connected to the motor shaft of the third servo motor 63 through a coupling, and the lead screw 64 is threadedly connected to the fixed column 61. When the third servo motor 63 in the fixed cylinder 62 is started, it can drive the lead screw 64 to rotate, thereby driving the fixed column 61 to slide vertically in the fixed cylinder 62, thereby adjusting the height of the support plate 1 in the device.

[0039] refer to Figures 1 to 5 , wherein the negative pressure component 7 includes a negative pressure suction hole 71, a negative pressure tube 72, an air pump 73 and an electromagnetic control valve. The negative pressure suction hole 71 is opened in the support plate 1, one end of the negative pressure tube 72 is connected to the negative pressure suction hole 71, and the other end of the negative pressure tube 72 is connected to the air pump 73. The electromagnetic control valve is arranged on the negative pressure tube 72. The air pump 73 and the electromagnetic control valve can generate negative pressure through the negative pressure tube 72 and the negative pressure suction hole 71 to adsorb and fix the wafer; wherein a groove 611 is opened in the fixing column 61, and a protrusion 621 is slidably connected in the groove 611. The protrusion 621 is connected and fixed to the fixing cylinder 62. With the cooperation of the groove 611 and the protrusion 621, the sliding stability of the fixing column 61 can be improved.

[0040] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer positioning structure for reducing thin film defects, comprising a support plate (1), characterized in that: A support plate (11) is fixed to the bottom of the support disk (1). First support plates (12) and second support plates (13) are fixed to both sides of the support plate (11). Two groups of拨动 structures (2) are symmetrically arranged above the support plate (11). A power component (3) for controlling the two groups of拨动 structures (2) to approach or move away from each other is arranged on the support plate (11). A limiting component (4) is arranged on the first support plate (12). A visual positioning camera (14) is installed above the second support plate (13). An adjustment component (5) for controlling and adjusting the height and rotational position of the visual positioning camera (14) is also arranged on the second support plate (13). A C-shaped seat (15) is fixed to the bottom of the support plate (11). A fixed seat (16) is fixed to the bottom of the C-shaped seat (15). A height adjustment component (6) for driving the fixed seat (16) to be raised is arranged at the bottom of the fixed seat (16). A negative pressure component (7) is arranged at the bottom of the support disk (1); The拨动 structure (2) includes a sliding seat (21), a first vertical plate (22) and a side push roller (23). The sliding seat (21) is slidably connected above the support plate (11). The first vertical plate (22) is fixed above the sliding seat (21). The side push roller (23) is rotatably connected in the first vertical plate (22) through a bearing; The power component (3) includes a sliding groove (31), a sliding block (32), a bidirectional screw (33), a first bevel gear (34), a second bevel gear (35), a support shaft (36), a bearing seat (37) and a first servo motor (38). The sliding groove (31) is opened at the top of the support plate (11). The sliding block (32) is horizontally slidably connected in the sliding groove (31). The sliding block (32) is fixed to the bottom of the sliding seat (21). The bidirectional screw (33) is rotatably connected in the sliding groove (31). The bidirectional screw (33) is threadedly connected to the sliding block (32). The first bevel gear (34) is fixed to the outside of the bidirectional screw (33). The bearing seat (37) is fixed to the bottom of the support plate (11). The second bevel gear (35) is fixed to the outside of the support shaft (36). The support shaft (36) is rotatably connected in the bearing seat (37). The first servo motor (38) is fixed to the support plate (11) to drive the support shaft (36) to rotate; It should be noted that the term "拨动结构" in the original text seems to be a specific structure name in Chinese, and the translation here is a literal translation for the purpose of maintaining the integrity of the text. You may need to adjust it according to the actual situation and specific meaning in the relevant field. The limiting assembly (4) includes a first sliding cylinder (41), a first cylinder (42), a limiting seat (43) and a limiting wheel (44), wherein the first sliding cylinder (41) is horizontally slidably connected to the outside of the first supporting plate (12), the cylinder body of the first cylinder (42) is fixed in the first sliding cylinder (41), the end of the piston rod of the first cylinder (42) is fixed to the end of the first supporting plate (12), the limiting seat (43) is fixed on the first sliding cylinder (41), and the limiting wheel (44) is rotatably connected to the limiting seat (43) through a bearing; The adjustment assembly (5) includes a second sliding cylinder (51), a second air cylinder (52), a second servo motor (53), a side plate (54) and a top fixing plate (55), wherein the second sliding cylinder (51) is horizontally slidably connected to the outside of the second supporting plate (13), the cylinder body of the second air cylinder (52) is fixed inside the second sliding cylinder (51), the piston rod end of the second air cylinder (52) is connected to the end of the second supporting plate (13), the second servo motor (53) is fixed on the second sliding cylinder (51), the side plate (54) is fixed to the motor shaft end of the second servo motor (53), the top fixing plate (55) is fixed to the top of the side plate (54), and the visual positioning camera (14) is fixed on the top fixing plate (55); The height adjustment component (6) comprises a fixed column (61), a fixed cylinder (62), a third servo motor (63) and a lead screw (64); the fixed column (61) is fixed to the bottom of the fixed column (61); the fixed cylinder (62) is arranged outside the fixed column (61); the third servo motor (63) is fixed inside the fixed cylinder (62); one end of the lead screw (64) is connected to the motor shaft of the third servo motor (63) through a coupling; the lead screw (64) and the fixed column (61) are threadedly connected.

2. The wafer positioning structure for reducing thin film defects according to claim 1, characterized in that: The negative pressure assembly (7) comprises a negative pressure suction hole (71), a negative pressure tube (72), an air pump (73) and an electromagnetic control valve (74); the negative pressure suction hole (71) is opened in the support plate (1); one end of the negative pressure tube (72) is connected to the negative pressure suction hole (71); the other end of the negative pressure tube (72) is connected to the air pump (73); and the electromagnetic control valve is arranged on the negative pressure tube (72).

3. The wafer positioning structure for reducing thin film defects according to claim 1, wherein: A groove (611) is provided in the fixing column (61), a convex block (621) is slidably connected in the groove (611), and the convex block (621) is connected and fixed to the fixing cylinder (62).

Citation Information

Patent Citations

  • Precise optical positioning structure for laser cutting of wafer

    CN111843253A

  • Wafer centering mechanism, wafer transmission device and wafer thinning equipment

    CN112201607A

  • Automatic plate feeding machine

    CN213084710U