Resin supply device, resin sealing device, and method for manufacturing resin sealed product

Abstract

The present invention provides a resin supply device, a resin sealing device and a method for manufacturing a resin sealed product that can suppress the generation of defects. A resin supply device supplies resin to a workpiece that is configured with elements arranged in a first direction and a second direction intersecting the first direction, the resin supply device comprising: an acquisition unit that acquires configuration information of the elements on the workpiece; a supply unit that supplies resin to the workpiece; a calculation unit that calculates a resin supply pattern based on the configuration information; and a drive unit that moves at least one of the workpiece and the supply unit relative to the other along the resin supply pattern, the resin supply pattern having a plurality of linear paths extending along the first direction, and an area between mutually adjacent linear paths among the plurality of linear paths being open to the outside of the workpiece.

Description

Technical Field

[0001] The present invention relates to a resin supply device, a resin sealing device and a method for manufacturing a resin sealed product. Background Art

[0002] It is known to seal a workpiece with resin by compression molding. A resin sealing device using such compression molding generally includes a resin supply device for supplying resin onto the workpiece, and a resin sealing mold for spreading the resin on the workpiece and applying heat and pressure.

[0003] Here, Patent Document 1 discloses that regarding the resin supply pattern supplied by the resin supply device, a spiral or lattice-shaped resin supply pattern is formed in a chamber in a vacuum state.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-134846 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, even if the resin is supplied in a vacuum chamber as in the resin supply device described in Patent Document 1, if there is air or gas generated by the resin in the mold being molded, it will be drawn into the resin, sometimes causing defects such as air traps or voids due to poor filling.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects.

[0010] Technical means of solving problems

[0011] A resin supply device according to one embodiment of the present invention is a resin supply device for supplying resin to a workpiece having elements arranged in a first direction and in a second direction intersecting the first direction, and includes: an acquisition unit for acquiring configuration information of the elements on the workpiece; a supply unit for supplying resin to the workpiece; a calculation unit for calculating a resin supply pattern based on the configuration information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern, wherein the resin supply pattern has a plurality of linear paths extending along the first direction, and areas between mutually adjacent linear paths among the plurality of linear paths are open to the outside of the workpiece.

[0012] According to the above-described embodiment, the region between adjacent linear paths functions as a flow path for exhaust, so that the entrapment of air or gas during the development of the resin can be suppressed, and the occurrence of defects due to insufficient filling can be suppressed.

[0013] In the embodiment, the plurality of linear paths may extend parallel to the first direction.

[0014] In the embodiment, the plurality of linear paths may include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path, wherein the first linear path and the second linear path are connected to each other at one end side in the first direction, and the second linear path and the third linear path are connected to each other at the other end side in the first direction.

[0015] In the above embodiment, the resin supply pattern may be in the shape of a continuous line.

[0016] In the described embodiment, at least one of the plurality of linear paths may extend over a region between elements adjacent to each other in the second direction.

[0017] In the described embodiment, at least one of the plurality of linear paths may extend on the elements arranged in the first direction.

[0018] In the embodiment, mutually adjacent linear paths among the plurality of linear paths may extend to reach the outermost element on the workpiece.

[0019] In the above-described embodiment, mutually adjacent linear paths among the plurality of linear paths may extend to reach elements further inside the outermost element on the workpiece in addition to the outermost element.

[0020] In the embodiment, the components on the workpiece may include two or more components of different sizes, and the plurality of linear paths extend on components that are smaller than other components among the components on the workpiece.

[0021] In the above-described embodiment, the supply unit may be a dispenser for supplying liquid resin.

[0022] A resin sealing device according to an embodiment of the present invention comprises a resin supply device according to any one of the embodiments described above, and a resin sealing mold for resin sealing components on a workpiece, wherein the resin sealing mold comprises an upper mold having a mold cavity filled with resin, and a lower mold for placing the workpiece, and after the mold is closed, the resin sealing mold has a plurality of exhaust ports between the upper mold and the lower mold for exhausting air in the mold cavity.

[0023] In the above-described embodiment, at least one of the plurality of exhaust ports may be disposed on an extension line of a region between mutually adjacent linear paths on the plurality of linear paths.

[0024] According to the embodiment, when the mold is closed and the resin is heated and pressurized, the exhaust port provided on the extension line of the area between the linear paths will not be blocked before the area between the adjacent linear paths is filled with resin, and exhaust can be performed from the inside of the resin sealing mold.

[0025] A method for manufacturing a resin sealant according to an embodiment of the present invention is as follows: the method comprises supplying resin to a workpiece having elements arranged in a first direction and in a second direction intersecting the first direction, wherein supplying resin to the workpiece comprises: obtaining configuration information of the elements on the workpiece; calculating a resin supply pattern based on the configuration information; and supplying resin to the workpiece along the resin supply pattern, wherein the resin supply pattern comprises a plurality of linear paths extending along the first direction, and areas between mutually adjacent linear paths among the plurality of linear paths are open to the outside of the workpiece.

[0026] According to the above-described embodiment, the region between adjacent linear paths functions as a flow path for exhaust, so that the entrapment of air or gas during the development of the resin can be suppressed, and the occurrence of defects due to insufficient filling can be suppressed.

[0027] A resin supply device according to one embodiment of the present invention is a resin supply device for supplying resin for sealing purposes of a workpiece onto an isolation membrane, wherein the workpiece is configured with elements arranged in a first direction and a second direction intersecting the first direction, respectively, and the resin supply device includes: an acquisition unit for acquiring configuration information of the elements on the workpiece; a supply unit for supplying resin onto the isolation membrane; a calculation unit for calculating a resin supply pattern based on the configuration information; and a driving unit for moving at least one of the isolation membrane and the supply unit relative to the other along the resin supply pattern, wherein the resin supply pattern has a plurality of linear paths extending along the first direction, and an area between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the isolation membrane.

[0028] According to the above-described embodiment, the region between adjacent linear paths functions as a flow path for exhaust, so that the entrapment of air or gas during the development of the resin can be suppressed, and the occurrence of defects due to insufficient filling can be suppressed.

[0029] A resin sealing device according to an embodiment of the present invention includes a resin supply device according to the embodiment, and a resin sealing mold for resin-sealing components on a workpiece. The resin sealing mold has a lower mold having a mold cavity filled with resin and on which an isolation membrane is placed, and an upper mold on which the workpiece is placed. An exhaust port for discharging air from the mold cavity is formed between the upper mold and the lower mold.

[0030] According to the embodiment, when the mold is closed and the resin is heated and pressurized, the exhaust port provided on the extension line of the area between the linear paths will not be blocked before the area between the adjacent linear paths is filled with resin, and exhaust can be performed from the inside of the resin sealing mold.

[0031] A method for manufacturing a resin sealant according to an embodiment of the present invention is as follows: the method comprises supplying a resin for sealing a workpiece onto an isolation film, wherein the workpiece is configured with elements arranged in a first direction and in a second direction intersecting the first direction, respectively; supplying the resin onto the isolation film comprises: obtaining configuration information of the elements on the workpiece; calculating a resin supply pattern based on the configuration information; supplying the resin onto the isolation film along the resin supply pattern; and pressing the resin on the isolation film onto the workpiece, wherein the resin supply pattern comprises a plurality of linear paths extending along the first direction, and an area between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the workpiece.

[0032] According to the above-described embodiment, the region between adjacent linear paths functions as a flow path for exhaust, so that the entrapment of air or gas during the development of the resin can be suppressed, and the occurrence of defects due to insufficient filling can be suppressed.

[0033] Effects of the Invention

[0034] According to the present invention, a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a diagram schematically showing the structure of the resin sealing device according to the first embodiment.

[0036] Figure 2 This is a plan view schematically showing the workpiece and the resin supply pattern in the resin sealing mold.

[0037] Figure 3 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device of the first embodiment.

[0038] Figure 4 This is a cross-sectional view schematically showing the resin on the workpiece immediately after being placed inside the resin sealing mold.

[0039] Figure 5 This is a cross-sectional view schematically showing the resin in the process of spreading through the resin sealing mold.

[0040] Figure 6 This is a cross-sectional view schematically showing the resin filled into the cavity by heating and pressurizing.

[0041] Figure 7It is a plan view schematically showing a resin supply pattern according to a modified example.

[0042] Figure 8 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0043] Fig. 9 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0044] Fig.10 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0045] Fig.11 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0046] Fig.12 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0047] Fig.13 It is a diagram schematically showing the structure of a resin sealing device according to a second embodiment.

[0048] Fig.14 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device according to the second embodiment.

[0049] Explanation of symbols

[0050] 1, 8: Resin sealing device

[0051] 10, 20, 30, 40, 50, 60, 70: workpiece

[0052] 10A, 10B, 20B: External area

[0053] 11, 21, 71: substrate

[0054] 12, 22, 32, 42, 52A, 52B: Components

[0055] 13, 23, 53, 73: Resin

[0056] 14, 24, 34, 44, 54, 64, 74: Linear path

[0057] 14A: First linear path

[0058] 14B: Second linear path

[0059] 14C: Third linear path

[0060] 15, 25: Relay path

[0061] 15A: First relay path

[0062] 15B: Second relay path

[0063] 19, 39, 49, 69: Areas between linear paths

[0064] 19A: Area between the first linear path and the second linear path

[0065] 19B: Area between the second linear path and the third linear path

[0066] 100: Resin supply device

[0067] 110: Acquisition

[0068] 120: Supply Department

[0069] 121: Syringe

[0070] 122: Push rod (piston)

[0071] 122M: Fourth motor

[0072] 123: Pinch valve

[0073] 130: Calculation Department

[0074] 140: Drive unit

[0075] 141: Upper base

[0076] 142: First moving part

[0077] 142M: First Motor

[0078] 143: Second Mobile Unit

[0079] 143M: Second motor

[0080] 144: The Third Mobile Unit

[0081] 144M: Third motor

[0082] 150: Stage

[0083] 200, 800: Resin sealed mold

[0084] 201, 801: mold cavity

[0085] 203: Closed loop

[0086] 210, 810: Lower die

[0087] 220, 820: Upper mold

[0088] 221: Mold sleeve

[0089] 223, 813: Cavity block

[0090] 225, 815: Fixture

[0091] 226, 816: Exhaust port

[0092] 227: Chamber Block

[0093] 228: Exhaust hole

[0094] RF: Isolation Film

[0095] S11~S16, S81~S86: Steps DETAILED DESCRIPTION

[0096] The following describes embodiments of the present invention with reference to the drawings. The drawings of the embodiments are for illustration only, and the dimensions and shapes of the parts are schematic, and should not be construed as limiting the technical scope of the present invention to the embodiments.

[0097] <First embodiment>

[0098] Reference Figure 1 and Figure 2 , the structure of the resin sealing device 1 according to the embodiment of the present invention will be described. Figure 1 It is a diagram schematically showing the structure of the resin sealing device according to the first embodiment. Figure 2 This is a plan view schematically showing the workpiece and the resin supply pattern in the resin sealing mold.

[0099] In order to clarify the relationship between the drawings and help understand the positional relationship of the components, an orthogonal coordinate system including an X-axis, a Y-axis, and a Z-axis is sometimes marked for convenience. The direction pointed by the arrow of the Z-axis is set as the upward direction, and the direction opposite to the direction of the arrow of the Z-axis is set as the downward direction.

[0100] The resin sealing device 1 is a device for performing resin sealing (molding) on ​​a workpiece 10 using a resin 13. The resin sealing device 1 includes: a resin supply device 100 for applying (supplying) a resin 13 for resin sealing on a coated object (e.g., the workpiece 10 or the isolation film RF); and a resin sealing mold 200 for heating and pressurizing the resin to harden it. The workpiece 10 includes, for example, a substrate 11 and an element 12 disposed on the substrate 11, and the element 12 is arranged in a first direction X and a second direction Y, respectively.

[0101] The structures of the substrate 11 and the element 12 are not limited. For example, the substrate 11 is a semiconductor wafer, and the element 12 can be a semiconductor chip mounted on the substrate 11 by flip-chip. In the case, at the time of supplying the resin 13, there is a gap between the substrate 11 and the element 12, and the resin is filled into the gap by heating and pressurizing. The present invention is not limited to the above-mentioned form. For example, it can be a form in which there is no gap between the substrate 11 and the element 12 and only the element 12 is mounted on the substrate 11, or it can be applied to a form in which the bottom filling resin is filled between the substrate 11 and the element 12. In addition, the element 12 can be a multilayer body formed by stacking a plurality of semiconductor chips at intervals in the third direction Z, or it can be an element other than a semiconductor element (a micro-electromechanical system (MEMS) device or an electronic device, etc.). The configuration form of the element 12 on the substrate 11 is not limited. For example, the element 12 can be mounted on the substrate 11 by wire bonding, or the element 12 can be fixed on the substrate 11 so that it can be loaded and unloaded. The substrate 11 may be a resin substrate or a glass substrate, or an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, etc. When the workpiece 10 is viewed from the positive direction of the third direction Z (hereinafter referred to as the upper direction), for example, the planar shape of the substrate 11 is circular, and the planar shape of the element 12 is rectangular, but the planar shapes of the substrate 11 and the element 12 are not limited to these shapes. For example, the planar shape of the substrate may be rectangular, and the planar shape of the element may be polygonal or circular. Two or more elements of different shapes may be arranged on the workpiece.

[0102] The resin supply device 100 includes: an acquisition unit 110, which acquires configuration information of a component 12 on a workpiece 10 (more specifically, a substrate 11); a supply unit 120, which supplies resin to the workpiece; a calculation unit 130, which calculates a resin supply pattern based on the configuration information; a drive unit 140, which moves the supply unit 120 along the resin supply pattern; and a stage 150, on which the workpiece 10 is placed.

[0103] The acquisition unit 110, for example, photographs the workpiece 10 and acquires the configuration information of the component 12 by image analysis. The acquisition unit 110 may acquire the configuration information for each workpiece, or may acquire the configuration information for each batch of multiple workpieces. Furthermore, the acquisition unit 110 is not limited to the above, and may, for example, read a code assigned to the workpiece 10 and acquire the configuration information corresponding to the code from a pre-recorded database. In addition, the acquisition unit 110 may also acquire the configuration information by inputting from an external terminal or the like. In addition, the acquisition unit 110 may also detect the position of a V-notch or the like in a workpiece 10 such as a wafer and acquire the orientation of the workpiece 10. The resin supply device 100 may also align the orientation of the workpiece 10 based on the orientation of the workpiece 10 acquired by the acquisition unit 110, and then supply the resin 13 described later.

[0104] The supply unit 120 is, for example, a dispenser that ejects liquid resin 13. The supply unit 120 includes: a syringe 121 that stores resin 13; a push rod (piston) 122 that is inserted into the syringe 121 and can press the resin 13; and a pinch valve 123 that opens and closes the nozzle at the front end of the syringe 121. The supply unit 120 is provided with a structure that can replace the used syringe 121 with a new syringe 121 when the resin 13 stored in the syringe 121 is used up. Furthermore, the supply unit 120 is not limited to the above, and may also include an opening and closing valve instead of the pinch valve 123. In addition, the supply unit 120 may also be a structure that prepares two liquids separately and mixes them on the spot before supplying them. For example, the supply unit 120 may be a feeder that ejects powdery resin.

[0105] The resin supply pattern (the shape of the resin 13 drawn on the workpiece 10) calculated by the calculation unit 130 includes a plurality of linear paths 14 extending along the first direction X, and a relay path 15 connecting mutually adjacent linear paths 14 among the plurality of linear paths 14 arranged in the second direction Y. Figure 2 As shown, when the workpiece 10 is viewed from above, the regions 19 between adjacent linear paths 14 are open to the outside of the workpiece 10. The linear paths 14 extend parallel to the first direction X, for example, or may be inclined thereto.

[0106] The resin supply pattern is described by taking the first linear path 14A, the second linear path 14B adjacent to the first linear path 14A, and the third linear path 14C adjacent to the second linear path 14B as examples. The first linear path 14A and the second linear path 14B are connected to each other through the first relay path 15A at one end side (negative direction side) of the first direction X. The first linear path 14A and the second linear path 14B are not connected in the path other than the first relay path 15A, and when the workpiece 10 is viewed from the top, the area 19A between the first linear path 14A and the second linear path 14B is open to the outside of the workpiece 10 at the other end side (positive direction side) of the first direction X. The second linear path 14B and the third linear path 14C are connected to each other through the second relay path 15B at the other end side of the first direction X, and the area 19B between the second linear path 14B and the third linear path 14C is open to the outside of the workpiece 10 at one end side of the first direction X. The resin 13 can be supplied in one go along the first linear path 14A, the first relay path 15A, the second linear path 14B, the second relay path 15B, and the third linear path 14C. Furthermore, the resin supply pattern is a continuous linear shape, and the resin 13 can also be supplied in one go throughout the resin supply pattern. In other words, the resin supply pattern is formed into a linear pattern by repeatedly folding back in a manner that connects the parallel linear paths 14 using the relay path 15.

[0107] In the example shown in the figure, the first direction X( Figure 2 The up and down directions in the second direction Y ( Figure 2 The resin 13 is supplied along the linear path 14 so as to fill the gaps in the second direction Y between the elements 12 arranged in a matrix in the left-right direction (in the right direction of the linear path 14). Therefore, the left side portion of the linear path 14 is configured to cover the right end of the element 12 located on the left side of the linear path 14. In addition, the right side portion of the linear path 14 is configured to cover the left end of the element 12 located on the right side of the linear path 14.

[0108] Element 12 in Figure 2 The components 12 at the upper and lower ends of the workpiece 10 are arranged in a vertical arrangement, and are arranged near the outermost edge of the workpiece 10. In the following description, the area from the edge of the substrate 11 to the component 12 at the upper end of this figure and the area from the edge of the substrate 11 to the component 12 at the lower end of this figure are collectively referred to as the "external area of ​​the workpiece 10". Among the external areas of the workpiece 10, the area clamped by the resin sealing mold 200 is referred to as the "external area 10A", and the area closer to the component 12 side than the external area 10A is referred to as the "external area 10B".

[0109] Each linear path 14 extends from the element 12 at the upper end of the figure to the element 12 at the lower end of the figure. Therefore, the relay path 15 connecting the ends of the adjacent linear paths 14 is arranged so as to overlap on the element 12 at the upper end of the figure or the element 12 at the lower end of the figure. The upper relay path 15 in the figure may be arranged in the outer area 10B above the element 12 at the upper end of the figure. The lower relay path 15 in the figure may be arranged in the outer area 10B below the element 12 at the lower end of the figure.

[0110] Furthermore, the resin supply pattern is not limited to the example shown in the figure. For example, the area where the linear path 14 can be arranged is not limited to the gap between the elements 12. The linear path 14 can be arranged to pass through both the gap between the elements 12 and the center of the main surface of the element 12, or the linear path 14 can be arranged only in the center of the main surface of the element 12. In addition, the area where the relay path 15 can be arranged is not limited to the elements 12 at the upper and lower ends of the figure or the outer area 10B. A part or all of the relay path 15 can be arranged on the element 12 located on the inner side between the element 12 at the upper end and the element 12 at the lower end.

[0111] The corners of the resin supply pattern may have a sharp shape, or may also have an R shape.

[0112] The driving unit 140 moves at least one of the workpiece 10 and the supply unit 120 relative to the other along the resin supply pattern. In the present embodiment, the driving unit 140 moves the supply unit 120. Specifically, the driving unit 140 includes an upper base 141, a first motor 142M, a first moving unit 142, a second motor 143M, a second moving unit 143, a third motor 144M, a third moving unit 144, and a fourth motor 122M.

[0113] The first moving part 142 is configured to be movable in a first direction X relative to the upper base part 141, the second moving part 143 is configured to be movable in a second direction Y relative to the first moving part 142, and the third moving part 144 is configured to be movable in a third direction Z relative to the second moving part 143. Specifically, the upper base part 141 has a guide rail, and the first moving part 142 has a slider that slides on the guide rail of the upper base part 141 by driving the first motor 142M. The first moving part 142 has a guide rail, and the second moving part 143 has a slider that slides on the guide rail of the first moving part 142 by driving the second motor 143M. The second moving part 143 has a guide rail, and the third moving part 144 has a slider that slides on the guide rail of the second moving part 143 by driving the third motor 144M. The syringe 121 of the supply part 120 is fixed to the third moving part 144. The third moving part 144 has a guide rail, and the push rod 122 of the supply part 120 has a slider that slides on the guide rail of the third moving part 144 by the drive of the fourth motor 122M. That is, the first motor 142M controls the movement amount and movement speed of the supply part 120 in the first direction X, the second motor 143M controls the movement amount and movement speed of the supply part 120 in the second direction Y, and the third motor 144M controls the movement amount and movement speed of the supply part 120 in the third direction Z. In addition, the fourth motor 122M controls the ejection amount and ejection speed of the resin 13 from the supply part 120 by controlling the movement amount and movement speed of the push rod 122.

[0114] In this embodiment, the workpiece 10 is fixed when the resin 13 is supplied, and the drive unit 140 may fix the supply unit 120 and move the stage 150 on which the workpiece 10 is mounted relative to the supply unit 120. The drive unit 140 may move both the workpiece 10 and the supply unit 120.

[0115] The stage 150 includes, for example, a weight scale. The resin supply device 100 supplies the resin 13 while measuring the weight of the resin 13 supplied to the workpiece 10 by the weight scale of the stage 150. Specifically, the driving of the first motor 142M to the fourth motor 122M of the drive unit 140 is changed according to the measurement result of the weight scale. With this structure, the resin 13 is supplied at an arbitrary ejection speed while the syringe 121 is moved at an arbitrary moving speed, thereby supplying any amount of resin 13 to the workpiece 10 in any shape. For example, if the moving speed in the first direction X and the second direction Y is increased, the supply amount under a specified length can be reduced even if the ejection speed is the same, and if the moving speed in the first direction X and the second direction Y is slowed down, the supply amount under a specified length can be increased even if the ejection speed is the same.

[0116] The resin sealing mold 200 is a pair of molds (a lower mold 210 and an upper mold 220) for resin sealing the workpiece 10 using a compression molding technique. In the present embodiment, the resin sealing mold 200 is an upper mold cavity structure having a cavity 201 in the upper mold 220. In addition, the resin sealing mold 200 includes a closing ring 203 (e.g., an O-ring) that closes the interior of the resin sealing mold 200 (the space between the lower mold 210 and the upper mold 220). Furthermore, although not shown in the figure, the resin sealing device 1 includes a pressure regulating unit (e.g., a vacuum pump) for regulating the internal pressure of the resin sealing mold 200, or a temperature regulating unit (e.g., a heater) for regulating the internal temperature (molding temperature).

[0117] The upper mold 220 includes a chase 221, a cavity block 223, a clamper 225 surrounding the cavity block 223, and a cavity block 227 surrounding the clamper 225 at intervals. The cavity block 223 is fixed to the chase 221. The clamper 225 protrudes toward the lower mold 210 from the cavity block 223, and together with the cavity block 223, forms the cavity 201. The clamper 225 is connected to the chase 221 via a spring, and is configured to be slidable relative to the cavity block 223. When the mold is closed, the outer region 10A of the workpiece 10 is clamped between the clamper 225 and the lower mold 210. A plurality of concave exhaust ports 226 are provided on the lower surface (the surface facing the lower mold 210) of the clamper 225 to connect the space on the cavity block 227 side with the cavity 201. The plurality of exhaust ports 226 extend radially with the cavity 201 as the center. The air in the mold cavity 201 is exhausted through the exhaust port 226 between the upper mold 220 and the lower mold 210 after the mold is closed. In addition, in each of the drawings, the exhaust port 226 is illustrated in depth for ease of understanding, but in fact, the air or gas in the mold is exhausted to a depth (for example, about several μm) at which the resin 13 does not flow out. An exhaust hole 228 is provided in a part of the cavity block 227, and the exhaust hole 228 is connected to a pump to exhaust the air in the mold cavity 201. The exhaust hole 228 of the cavity block 227 extends radially with the mold cavity 201 as the center. The closed ring 203 is clamped by the cavity block 227 and the lower mold 210.

[0118] In the resin sealing mold 200 after mold closing, at least one of the plurality of exhaust ports 226 may be provided on an extension line of a region 19 between mutually adjacent linear paths 14 among the plurality of linear paths 14. Figure 2 As shown, an exhaust port 226 is provided on an extension line of the region 19A between the first linear path 14A and the second linear path 14B.

[0119] Secondly, refer to Figures 3 to 6 , a method for manufacturing a resin-sealed product using the resin sealing device 1 of the present embodiment will be described. Figure 3This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device of the first embodiment. Figure 4 This is a cross-sectional view schematically showing the resin on the workpiece immediately after being placed inside the resin sealing mold. Figure 5 This is a cross-sectional view schematically showing the resin in the process of spreading through the resin sealing mold. Figure 6 FIG. 1 is a cross-sectional view schematically showing the resin filled into the mold cavity by heating and pressurizing. Figures 4 to 6 The illustration of the chamber block 227 is omitted.

[0120] First, arrangement information of components on the workpiece 10 is acquired ( S11 ). For example, the acquisition unit 110 captures the workpiece 10 and analyzes the image of the workpiece 10 to acquire arrangement information of components 12 arranged in the first direction X and the second direction Y.

[0121] Next, the resin supply pattern is calculated based on the configuration information of the element 12 (S12). For example, the calculation unit 130 reads the configuration information registered by the acquisition unit 110, and calculates the desired movement path, movement speed, etc. of the supply unit 120 according to the pre-registered rules (for example, the linear path 14 passes through the area between the elements 12, the linear path 14 extends to the element 12 that reaches the outermost edge of the workpiece 10, etc.). Furthermore, when calculating the linear path 14, the structural information of the cavity 201 can also be used. As the structural information, the inner circumference size of the cavity or the depth of the cavity during final molding can be listed. The calculated resin supply pattern has a plurality of linear paths 14 extending along the first direction X. In addition, when looking down at the workpiece 10 from the upper side, the area 19 between the adjacent linear paths 14 among the plurality of linear paths 14 is open to the outside of the workpiece 10.

[0122] Next, the resin 13 is supplied onto the workpiece 10 along the resin supply pattern (S13). Here, in a state where the workpiece 10 is positioned in the first direction X, the second direction Y, and the rotation direction centered on the Z axis, the driving unit 140 is driven based on the resin supply pattern to move the supply unit 120. After the supply unit 120 moves to the supply start position (one end of the resin supply pattern), the push rod 122 is pressed on the syringe 121, and the clamping valve 123 is opened to start supplying the resin 13 from the supply unit 120. After the supply unit 120 that continuously supplies the resin 13 is moved and the supply unit 120 moves to the supply end position (the other end of the resin supply pattern), the push rod 122 of the syringe 121 is stopped, and the clamping valve 123 is closed to end the supply of the resin 13 from the supply unit 120.

[0123] Next, the isolation film RF is placed on the upper mold 220, and the workpiece 10 is placed on the lower mold 210. The isolation film RF is moved into the interior of the opened resin sealing mold 200 in a manner covering the mold cavity 201. The isolation film RF can also be supplied, for example, by sending it out from a roller of an unused film arranged in front of the mold and winding it up using a roller of a used film arranged behind the mold. The air is removed from the gap between the cavity block 223 and the clamp 225, or from the air intake hole in the upper mold 220 (not shown), so that the isolation film RF is adsorbed on the upper mold 220. In addition, the workpiece 10 supplied with the resin 13 is moved into the interior of the opened resin sealing mold 200. The air is removed from the air intake hole in the upper mold 220 (not shown), so that the workpiece 10 is adsorbed on the lower mold 210.

[0124] Next, the resin 13 is expanded by closing the mold (S15).

[0125] First, if Figure 4 As shown, for example, the outer area 10A of the workpiece 10 having the flip-chip mounted component 12 and the substrate 11 is clamped by the clamp 225 and the lower mold 210. At this time, although not shown in the figure, the closed ring 203 is clamped by the chamber block 227 and the lower mold 210. A shallow excavation provided on the lower surface of the clamp 225 forms an exhaust port 226 between the lower mold 210 and the clamp 225 (between the workpiece 10 and the clamp 225), and the exhaust port 226 connects the space inside the clamp 225 (the mold cavity 201) and the space outside the clamp 225. Thus, Figure 4 The air in the mold is shown being exhausted to the outside of the cavity block 227.

[0126] Secondly, if Figure 5 As shown, in the mold in a decompressed state, the resin 13 can be expanded through the cavity block 223. At this time, the resin 13 can be made to penetrate not only the gap between the component 12 and the isolation film RF, but also the gap between the workpiece 10 and the component 12 mounted on the flip chip to perform bottom filling. The area between the resin 13 of the paths adjacent to each other on the workpiece 10 is narrowed, but the resin 13 applied in a linear shape can be prevented from contacting each other before the filling of the resin 13 is completed, so that air can be exhausted from the exhaust port 226.

[0127] By further closing the mold, the mold cavity block 223 is relatively lowered, such as Figure 6 As shown, the resin 13 is filled in the cavity 201. Thus, the resin 13 is filled to the front of the exhaust port 226. Here, the resin 13 is softened while being heated by a heater (not shown), and pressurized by the cavity block 223, thereby filling (molding) the resin 13 in the cavity and filling the gap between the workpiece 10 and the flip-chip mounted component 12 at the bottom of the resin 13.

[0128] Finally, heating and pressurization (curing) are continued for a predetermined time to harden the resin 13 ( S16 ). In this way, the resin sealing of the workpiece 10 is completed.

[0129] According to the structure described in the above embodiment, the resin supply pattern has a plurality of linear paths 14 extending parallel to the first direction X, and the region 19 between the linear paths 14 adjacent to each other among the plurality of linear paths 14 is open to the outside from the upper side in the plan view of the workpiece 10. Accordingly, when the resin 13 is expanded by the resin sealing mold 200 to perform resin sealing on the workpiece 10, the air remaining inside the resin sealing mold 200 or the gas generated by the resin 13 can be discharged through the region 19. Therefore, the generation of defects (such as air pockets or non-filling) caused by the inclusion of air or the like generated by the resin 13 can be suppressed. Accordingly, in the case where the intrusion of the resin 13 into the details of the workpiece 10 is not easily hindered by air or the like, for example, the filling of the resin 13 into the gap between the flip-chip mounted component 12 and the substrate 11 can be promoted, thereby suppressing the generation of poor filling.

[0130] The first linear path 14A and the second linear path 14B are connected to each other at one end side in the first direction X on the workpiece 10, and the second linear path 14B and the third linear path 14C are connected to each other at the other end side in the first direction X on the workpiece 10. In addition, the resin supply pattern is a continuous linear shape. Accordingly, the resin 13 can be supplied in one go while the air is exhausted in a shape in which the adjacent linear paths are not connected to each other at least at any end side. Therefore, it is not necessary to stop the ejection of the resin 13 during the supply, and the resin 13 can be efficiently supplied to the workpiece 10 by continuously ejecting the resin 13.

[0131] The resin supply pattern extends over a region between adjacent elements 12 in the second direction Y. This allows the resin 13 to efficiently enter the gap between the substrate 11 and the element 12 or the gap between the elements 12, thereby suppressing the occurrence of sealing failure.

[0132] The linear path 14 extends to the outermost element 12 on the workpiece 10, and the relay path 15 extends on the outermost element 12. Thus, the occurrence of defects due to insufficient resin 13 in the space on the outer region 10B of the workpiece 10 where a large amount of resin 13 is required can be suppressed as if the element 12 does not exist.

[0133] The exhaust port 226 is provided on the extension line of the region 19 between the adjacent linear paths 14. Thus, the exhaust port is not clogged before the region 19 between the adjacent linear paths 14 is filled with the resin 13, and exhaust can be performed from the inside of the resin sealing mold 200.

[0134] Hereinafter, a modified example of the resin supply pattern and the structure of the resin sealing device of another embodiment of the present invention will be described. Furthermore, regarding matters common to the first embodiment, matters that are also applicable in the following forms are omitted, and only the differences are described. In particular, the same symbols are given to the same structures, and the same results and the same effects brought about by the same structures will not be described in sequence.

[0135] Figures 7 to 11 The following are schematic plan views showing resin supply patterns according to different modified examples. Figures 7 to 11 In the figure, the external areas 20A, 30A, 40A, 50A, and 60A represent areas clamped by a resin sealing mold; the external areas 20B, 30B, 40B, 50B, and 60B represent areas closer to the components 22, 32, 42, 52A, 52B, and 62 than the external areas 20A, 30A, 40A, 50A, and 60A; the symbols 21, 31, 41, 51, and 61 represent substrates; the symbols 23, 33, 43, 53, and 63 represent resins; the symbols 25, 35, 45, 55, and 65 represent relay paths; and the symbols 29, 39, 49, 59, and 69 represent areas between linear paths.

[0136] like Figure 7 As shown in FIG. 1 , when the components 22 are mounted separately from each other in the workpiece 20, the resin 13 may be applied on the substrate 21 between the components 22. Specifically, when the workpiece 20 is viewed from above, the linear path 24 extends on the area outside the components 22 between the components 22 adjacent in the second direction Y. Accordingly, since the resin 23 is supplied on the substrate 21, the resin 23 easily intrudes into a fine space such as a gap between the substrate 21 and the components 22.

[0137] The relay path 25 extends outside the element 22 and in the outer region 20B. Thus, even in the case of a workpiece 20 in which the density of the area occupied by the element 22 is low, for example, the occurrence of defects due to insufficient resin 23 in the space on the outer region 20B of the workpiece 20 in which a large amount of resin 23 is required can be suppressed as compared to the absence of the element 22.

[0138] like Figure 8 As shown in FIG. 1 , when the workpiece 30 is viewed from above, the linear path 34 extends on the elements 32 arranged in the first direction X. The linear path 34 extends so as to pass through the central portion of the element 32 in the second direction Y. Thus, the end of the element 32 on the second direction Y side is located in the region 39 between the adjacent linear paths 34. Accordingly, the region where no element 32 exists between the adjacent elements 32 in the second direction Y functions as a flow path for exhaust, so exhaust can be performed efficiently, and the occurrence of defects caused by poor filling can be suppressed.

[0139] like Fig. 9 As shown, the intervals of the linear paths 44 can also be set arbitrarily. For example, when looking down at the workpiece 40 from the upper side, the linear paths 44 are arranged in the second direction Y at intervals of more than one column of the elements 42, and extend on the elements 42 arranged in the first direction X. In other words, at least one column of elements 42 is arranged in the area 49 between the adjacent linear paths 44. The linear paths 44 can also extend in the area between the adjacent elements 42 in the second direction Y. For example, compared with a structure in which the resin 13 is shared by all the columns corresponding to the elements 42, the length of the path to which the resin 13 is supplied can be shortened and supplied in a short time. In addition, when the required amount of the resin 13 is small, the supply amount of the resin 13 can be adjusted by expanding the intervals of the linear paths 44.

[0140] like Fig.10 As shown in the figure, when a plurality of components 22 are mounted on the workpiece 20, the resin 13 may be applied according to the mounted components 22. Specifically, the component 52A and the component 52B larger than the component 52A are arranged on the workpiece 50. When the workpiece 50 is viewed from the upper side, the linear path 54 extends on the component 52A in the area between the components 52B. According to this, the resin 53 easily penetrates into the detail of the workpiece 50, and the generation of defects caused by poor filling can be suppressed.

[0141] like Fig.11 As shown in FIG. 1 , when the workpiece 60 is viewed from above, the region 69 between the adjacent linear paths 64 is open to the outside of the workpiece 60 toward both the positive direction side and the negative direction side of the first direction X. The width of the linear path 64 in the second direction Y is, for example, constant, and the width of the central portion of the linear path 64 in the first direction X may be greater than the width of the end portion in the first direction X. In addition, the adjacent linear paths 64 may be connected in the central portion in the first direction X.

[0142] Furthermore, the description Figure 2 and Figure 7 to Figure 11 The respective resin supply patterns can be appropriately combined and applied to one workpiece.

[0143] Fig.12 FIG. 7 is a modified example of a workpiece, and shows a rectangular workpiece 70 used in panel level packaging (PLP: Panel Level Packaging). Fig.12As shown, when the workpiece 70 is viewed from above, the substrate 71 is in a rectangular shape having a pair of short sides and a pair of long sides. The linear path 74 extends along the short sides of the substrate 71, and more specifically, extends parallel to the short sides of the substrate 71. Accordingly, compared with a structure in which the linear path 74 extends along the long sides of the substrate 71, the length of the region 79 between the adjacent linear paths 74 is shortened, and the resins 73 of the linear paths 74 contact and clog each other during the process of unfolding the resin 73 in the region 79, thereby preventing air from being drawn into the resin 73. Furthermore, Fig.12 The modified examples shown can be appropriately applied to the above-mentioned respective resin supply patterns. Fig.12 In FIG. 1 , the outer region 70A indicates a region sandwiched by the resin sealing mold; the outer region 70B indicates a region closer to the component 72 than the outer region 70A; and the reference numeral 75 indicates a relay path.

[0144] <Second embodiment>

[0145] Reference Fig.13 , the structure of the resin supply pattern of the second embodiment is described. Fig.13 It is a diagram schematically showing the structure of a resin sealing device according to a second embodiment.

[0146] In this embodiment, an isolation film RF is placed on the stage 150, and based on the configuration information of the element 12 on the workpiece 10 obtained by the acquisition unit 110, the driving unit 140 moves the supply unit 120, and the resin 13 is supplied to the isolation film RF. The resin sealing mold 800 is a lower mold cavity structure including a lower mold 810 having a cavity 801 and an upper mold 820. The isolation film RF is placed on the lower mold 810, and the workpiece 10 is placed on the upper mold 820. The lower mold 810 has a cavity block 813 and a clamp 815 constituting the cavity 801, and an exhaust port 816 is provided on the upper surface of the clamp 815 (the surface facing the upper mold 820) when the mold is closed.

[0147] Secondly, refer to Fig.14 , a method for manufacturing a resin sealed product using the resin sealing device 8 of the present embodiment will be described. Fig.13 It is a diagram schematically showing the structure of a resin sealing device according to a second embodiment. Fig.14 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device according to the second embodiment.

[0148] First, the configuration information of the component 12 on the workpiece 10 is obtained (S81). Next, the resin supply pattern is calculated based on the configuration information of the component 12 (S82). The resin supply pattern is calculated by reversing the configuration information of the component 12 in such a way that the resin 13 on the isolation film RF is placed on the area between the adjacent components 12 in the second direction Y and / or on the components 12 arranged in the first direction X when facing the workpiece 10. Next, the resin 13 is supplied to the isolation film RF along the resin supply pattern (S83). Next, the isolation film RF is placed on the lower mold 810, and the workpiece 10 is placed on the upper mold 820 (S84). At this time, by positioning the isolation film RF and the workpiece 10 in the first direction X, the second direction Y and the rotation direction centered on the Z axis, the same effect as when the resin 13 applied on the isolation film RF is supplied to the position corresponding to the component 12 in the workpiece 10 can be obtained. Next, by closing the mold, the resin 13 is brought into contact with the component 12 or the substrate 11 while exhausting air from the cavity of the mold, and the resin 13 is expanded by closing the mold (S85). The resin 13 placed on the isolation film RF of the lower mold 810 is pressed against the workpiece 10 placed on the upper mold 820, and the resin 13 is clamped and expanded by the workpiece 10 and the isolation film RF. Here, it is also considered that by exhausting the air before the resin 13 is brought into contact with the element 12 or the substrate 11, cavitation can be prevented even if a closed space is formed by the contact between the resins 13 on the isolation film RF. However, when the resin 13 is expanded, the gas generated by the heating of the resin 13 remains, which may cause poor filling. In contrast, by providing a path for exhausting the gas as in the present embodiment, the occurrence of adverse conditions such as cavitation caused by the gas can be suppressed. Next, the resin 13 is hardened by heating and pressurizing (S86). In this way, even a mold with a lower mold cavity structure can obtain the same effect as the above-described invention.

[0149] In addition, regarding the form described in this embodiment, any one or more of the resin supply patterns described in the first embodiment can be appropriately combined and applied.

[0150] As described above, according to one aspect of the present invention, it is possible to provide a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects.

[0151] The above-described embodiments are intended to facilitate the understanding of the present invention and are not intended to limit the interpretation of the present invention. The various elements and their configurations, materials, conditions, shapes, and sizes included in the embodiments are not limited to the illustrated contents and may be appropriately changed. In addition, the structures shown in different embodiments may also be partially replaced or combined with each other.

Claims

1. A resin supply device for supplying resin to a workpiece provided with elements arranged in a first direction and in a second direction intersecting the first direction, the resin supply device comprising: an acquiring unit, which acquires configuration information of components on the workpiece; a supplying unit for supplying resin onto the workpiece; a calculation unit that calculates a resin supply pattern based on the configuration information; as well as a driving unit that moves at least one of the workpiece and the supply unit relative to the other along the resin supply pattern, the resin supply pattern having a plurality of linear paths extending parallel to the first direction, The plurality of linear paths include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path. At one end side of the first direction, the first linear path and the second linear path are connected to each other in the second direction, On the other end side of the first direction, the second linear path and the third linear path are connected to each other in the second direction. The resin supply pattern is to supply in one go. A region between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the workpiece. 2 . The resin supply device according to claim 1 , wherein at least one of the plurality of linear paths extends over a region between elements adjacent in the second direction. 3 . The resin supply device according to claim 1 , wherein at least one of the plurality of linear paths extends on elements arranged in the first direction. 4 . The resin supply device according to claim 1 , wherein at least one of the plurality of linear paths extends to reach an outermost element on the workpiece.

5. The resin supply device according to claim 1 or 2, wherein mutually adjacent linear paths among the plurality of linear paths extend to reach components further inside than the outermost components except for the outermost components on the workpiece.

6. The resin supply device according to claim 1 or 2, wherein the components on the workpiece include two or more components of different sizes, The plurality of linear paths extend over elements on the workpiece that are smaller than other elements. 7 . The resin supply device according to claim 1 , wherein the supply unit is a dispenser that supplies liquid resin.

8. A resin sealing device, comprising: The resin supply device according to any one of claims 1 to 7; as well as A resin sealing mold is used to seal the components on the workpiece with resin. The resin sealing mold has an upper mold provided with a cavity filled with resin, and a lower mold for placing the workpiece. The resin sealing mold after mold clamping has a plurality of exhaust ports between the upper mold and the lower mold for exhausting air in the mold cavity. 9 . The resin sealing device according to claim 8 , wherein at least one of the plurality of exhaust ports is provided on an extension line of a region between mutually adjacent linear paths on the plurality of linear paths.

10. A method for manufacturing a resin sealed product, comprising supplying resin to a workpiece provided with elements arranged in a first direction and in a second direction intersecting the first direction, wherein supplying resin to the workpiece comprises: Obtaining configuration information of components on the workpiece; calculating a resin supply pattern based on the configuration information; as well as supplying resin onto the workpiece along the resin supply pattern, the resin supply pattern having a plurality of linear paths extending parallel to the first direction, The plurality of linear paths include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path. At one end side of the first direction, the first linear path and the second linear path are connected to each other in the second direction, On the other end side of the first direction, the second linear path and the third linear path are connected to each other in the second direction. The resin supply pattern is to supply in one go. A region between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the workpiece.

11. A resin supply device for supplying a resin for sealing a workpiece onto a separator, wherein the workpiece is provided with elements arranged in a first direction and in a second direction intersecting the first direction, the resin supply device comprising: an acquiring unit, which acquires configuration information of components on the workpiece; a supplying unit for supplying resin onto the isolation film; a calculation unit that calculates a resin supply pattern based on the configuration information; as well as a driving unit that moves at least one of the isolation film and the supply unit relative to the other along the resin supply pattern, the resin supply pattern having a plurality of linear paths extending parallel to the first direction, The plurality of linear paths include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path. At one end side of the first direction, the first linear path and the second linear path are connected to each other in the second direction, On the other end side of the first direction, the second linear path and the third linear path are connected to each other in the second direction. The resin supply pattern is to supply in one go. A region between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the separator.

12. A resin sealing device comprising: The resin supply device according to claim 11; as well as A resin sealing mold is used to seal the components on the workpiece with resin. The resin sealing mold has a lower mold having a mold cavity filled with resin and on which the isolation film is placed, and an upper mold on which the workpiece is placed. An exhaust port for exhausting air in the cavity is formed between the upper mold and the lower mold.

13. A method for manufacturing a resin-sealed product, comprising supplying a resin for sealing a workpiece onto a separator, the workpiece being provided with elements arranged in a first direction and in a second direction intersecting the first direction, Supplying resin onto the isolation film comprises: Obtaining configuration information of components on the workpiece; calculating a resin supply pattern based on the configuration information; supplying resin onto the isolation film along the resin supply pattern; as well as Pressing the resin on the isolation film against the workpiece, the resin supply pattern having a plurality of linear paths extending parallel to the first direction, The plurality of linear paths include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path. At one end side of the first direction, the first linear path and the second linear path are connected to each other in the second direction, On the other end side of the first direction, the second linear path and the third linear path are connected to each other in the second direction. The resin supply pattern is to supply in one go. A region between mutually adjacent linear paths among the plurality of linear paths is open to the outside of the workpiece.

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