Probe head connection method

Abstract

The present application provides a probe head connection method, comprising the following steps. First, a carrier and a test fixture are set between the probe head and the probe tester, the test fixture is set in the probe tester, and the test fixture is used to accommodate the carrier. The vacuum suction function of the probe head is activated, and the probe head is moved to align the test fixture. Then, the probe head is moved to contact the carrier in the test fixture. Finally, at least one clamp is used to fix the probe head and the test fixture. The carrier is used to directly connect the wafer.

Description

Technical Field

[0001] The present application relates to a probe head connection method, and more particularly to a connection method for directly docking a probe head with a probe testing machine. Background Art

[0002] In the wafer testing stage, in order to properly move and carry the wafer, the wafer is usually placed in a probe tester, and the probe head performs subsequent testing on the wafer. Generally speaking, there are many test cards on the probe head, and the test cards are electrically connected to the load board, and the load board is then electrically connected to the wafer. Traditionally, the load board does not directly contact the wafer, but the load board must first be connected to the test socket (pogo tower), and then the test socket contacts the wafer. Here, since the test socket and the load board need to be placed between the probe head and the probe tester, it is obvious that the probe head will be farther away from the probe tester. In addition, a test socket is also set between the load board and the wafer, which makes the signal transmission path longer, and there will also be more interference and greater signal attenuation.

[0003] In order to solve the problem of the long signal transmission path mentioned above, some probe testers can now allow the carrier to contact the wafer. This connection method between the carrier and the wafer is called direct docking. Since the carrier is directly docked with the wafer, there is no need for a test socket, which can make the signal transmission path shorter, so it has gradually been adopted by the industry. However, for old or purchased probe testers, there is currently a lack of a mode that can remove the test socket and convert to direct docking. One reason is that the traditional carrier will be locked to the probe head first, and the test socket will be locked to the probe tester. When testing the wafer, the probe head and the probe tester will be fixed together by mechanical means to fix the relative position of the carrier and the test socket, and then the carrier can be electrically connected to the wafer through the test socket. However, the traditional probe tester must be designed with a relationship with the test socket, and the carrier and the wafer are far apart. In other words, after removing the test socket, the carrier is still some distance away from the wafer. If the carrier is still locked to the probe head, there is a problem that the carrier cannot contact the wafer. Therefore, the industry needs a new probe head connection method that allows the probe head and the probe tester to operate in a direct docking mode. Summary of the invention

[0004] The technical problem to be solved by the present application is to provide a probe head connection method, which can be used to connect the probe head to a probe tester. In the method, a carrier is arranged on the probe tester rather than on the probe head, and when the probe head contacts the carrier, the carrier can be sucked tightly by the vacuum suction function of the probe head to increase the stability between the probe head and the probe tester.

[0005] The present application proposes a probe head connection method, which includes the following steps. First, a carrier and a test fixture are set between the probe head and the probe tester. The test fixture is set in the probe tester, and the test fixture is used to accommodate the carrier. The vacuum suction function of the probe head is activated, and the probe head is moved to align the test fixture. Then, the probe head is moved to contact the carrier in the test fixture. Finally, at least one clamp is used to fix the probe head and the test fixture. The carrier is used to directly connect the wafer.

[0006] In some embodiments, the test fixture is defined with a first upper surface, and the first upper surface is defined with a first accommodation space, and the first accommodation space can be used to accommodate a carrier. Here, when the carrier is accommodated in the first accommodation space, the carrier and the first upper surface can form a coplanar surface. In addition, the probe head connection method can further include providing a test fixture fixing plate that can be removably locked to the probe tester, and the second upper surface of the test fixture fixing plate is defined with a second accommodation space, and the second accommodation space can be used to accommodate the test fixture. In addition, the first upper surface and the second upper surface may not be coplanar, and the test fixture can be removably locked in the second accommodation space of the test fixture fixing plate.

[0007] In some embodiments, the step of moving the probe head to align the test fixture may further include providing an alignment member, which is disposed on the test fixture to guide the probe head to align with the test fixture. Here, the probe head contacts the upper side of the carrier, the test fixture contacts the lower side of the carrier, and the carrier defines at least a vacuum area on the upper side, and the vacuum area is surrounded by a metal edge strip.

[0008] In summary, the probe head connection method provided in the present application can be used to connect the probe head to a needle testing machine, and the vacuum suction function of the probe head can be used to suck the carrier plate tightly, so that the carrier plate can be pressed more tightly against the probe head. In addition, since the carrier plate is set in the needle testing machine, the stability between the probe head and the needle testing machine can also be increased.

[0009] The details of other effects and embodiments of the present application are described below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 It is a schematic diagram of a probe head and a needle testing machine according to an embodiment of the present application;

[0012] Figure 2is a three-dimensional schematic diagram of a probe head according to an embodiment of the present application;

[0013] Figure 3 is a three-dimensional schematic diagram of a probe head according to an embodiment of the present application at another angle;

[0014] Figure 4 is a three-dimensional schematic diagram of a needle detection machine according to an embodiment of the present application;

[0015] Figure 5 is a structural schematic diagram of a carrier board according to an embodiment of the present application;

[0016] Figure 6 is a structural schematic diagram of a test fixture and a test fixture fixing plate according to an embodiment of the present application;

[0017] Figure 7 It is a flowchart of the steps of the probe head connection method according to one embodiment of the present application.

[0018] Explanation of symbols

[0019] 1: Probe head 10: Housing 10a: Bottom

[0020] 100: snap-fitting part 102: fixing part 104: alignment part

[0021] 12: seat 12a: test surface 120: opening

[0022] 122: Sealing strip 2: Needle tester 20: Casing

[0023] 22: Test fixture 22a: Upper surface 220: Engagement member

[0024] 222: Alignment member 224: Accommodation space 226: Test slot

[0025] 24: Test fixture fixing plate 24a: Upper surface 240: Accommodating space

[0026] 26: Carrier board 26a: Upper side 260: Pad

[0027] 262: Vacuum area 264: Metal edge strips W1, W2, W3: Width

[0028] S30~S38: Step Flow DETAILED DESCRIPTION

[0029] The positional relationships described in the following embodiments include: up, down, left and right. Unless otherwise specified, they are all based on the directions in which the components are drawn in the drawings.

[0030] See also Figure 1 , Figure 1Schematic diagram of a probe head and a needle testing machine according to an embodiment of the present application. Figure 1 As shown, the probe head connection method of the present application can be used to connect the probe head 1 to the probe test machine 2, the probe test machine 2 can be provided with a wafer to be tested (not shown in the figure), and the probe head 1 can be connected to the probe head 1 via a carrier board (not shown in the figure). Figure 1 ) is electrically connected to the wafer. In order to facilitate the description of the structure and components between the probe head 1 and the probe tester 2, this embodiment is Figure 1 The diagram shows a state where the probe head 1 is slightly away from the needle testing machine 2. It can be seen that the probe head 1 is located above the needle testing machine 2, and the probe head 1 is not yet connected to the needle testing machine 2. In practice, the probe head 1 can also be connected to a mechanical arm or a bracket (not shown), and the mechanical arm or bracket can allow the probe head 1 to move or flip, for example, the mechanical arm or bracket can allow the probe head 1 to vertically approach or move away from the needle testing machine 2, and can rotate the probe head 1 to adjust the components inside the probe head 1. Of course, the mechanical arm or bracket may also allow the probe head 1 to move horizontally to other positions, which is not limited in this embodiment. The structure and operation of the probe head 1 and the needle testing machine 2 will be described below.

[0031] Please also read Figure 1 , Figure 2 and Figure 3 , Figure 2 is a three-dimensional schematic diagram of a probe head according to an embodiment of the present application, Figure 3 FIG. 1 is a three-dimensional schematic diagram of a probe head according to an embodiment of the present application at another angle. As shown in the figure, the probe head 1 may include a housing 10, and in terms of appearance structure, may also include a base body 12 protruding from the housing 10. In one example, the housing 10 may be defined as having a bottom surface 10a, and the base body 12 may also be defined as having a test surface 12a, and both the bottom surface 10a and the test surface 12a face Figure 1 The base 12 is generally in the shape of a cube, and the width W2 of the base 12 in an axial direction is slightly narrower than the width W1 of the housing 10. The present embodiment does not limit the numerical value or ratio of the width W1 to the width W2. Since the base 12 protrudes from the bottom surface 10a, it can be understood by those with ordinary knowledge in the relevant technical field that the bottom surface 10a and the test surface 12a are not coplanar. Figure 1 For example, the test surface 12a is closer to the bottom surface 10a than the bottom surface 10a. Figure 1 In addition, various components for electrical testing and vacuum suction may be disposed inside the housing 10, for example, a plurality of probe cards may be disposed inside the housing 10, each probe card may have more than one probe group, and the probe group may protrude from the test surface 12a through the opening 120 on the test surface 12a.

[0032] In one example, not every opening 120 on the test surface 12a corresponds to a probe card. For example, there may be only a few probe cards inside the housing 10, so some openings 120 may not have protruding probe sets. Figure 2 and Figure 3 For example, the openings 120 on the test surface 12a can be divided into two rows, and the number of openings 120 in each row is the same. The present embodiment does not limit the number of openings 120 on the test surface 12a. In appearance, the openings 120 can be divided into two rows, and the openings 120 in each row can be surrounded by a sealing strip 122. In practice, one or more through holes for vacuum absorption are provided in the area surrounded by the sealing strip 122, that is, the area surrounded by the sealing strip 122 is associated with the vacuum absorption function of the probe head 1, which will be described later.

[0033] In addition, the housing 10 may also be provided with a locking member 100, a fixing member 102 and a positioning member 104. In order to understand how the locking member 100, the fixing member 102 and the positioning member 104 fix and measure the device 2, the following will be described. Figure 4 Please refer to the needle tester 2 shown in FIG. Figure 1 , Figure 3 and Figure 4 , Figure 4 2 is a three-dimensional schematic diagram of a needle tester according to an embodiment of the present application. As shown in the figure, the needle tester 2 may include a housing 20, and a test fixture 22 and a test fixture fixing plate 24 may be provided on one side of the housing 20 adjacent to the probe head 1. In one example, the test fixture fixing plate 24 is first provided on the housing 20, and the test fixture 22 is then fixed to the housing 20 via the test fixture fixing plate 24. In detail, the test fixture 22 is detachably locked to the test fixture fixing plate 24, for example, the test fixture 22 may be fixed to the test fixture fixing plate 24 by screws, which is not limited in this embodiment.

[0034] In addition, the test fixture 22 may be provided with a snap-fitting member 220 and a positioning member 222. The snap-fitting member 220 and the snap-fitting member 100 may correspond to each other in structure. For example, the snap-fitting member 100 may be a slot, and the snap-fitting member 220 may be a short column. The short column may slide into the slot to be snap-fitted and fixed. In order to assist the snap-fitting member 220 to enter the snap-fitting member 100, the positioning member 104 and the positioning member 222 may be used to position the probe head 1 and the probe tester 2. Figure 3 and Figure 4 As shown, the alignment member 104 can be a groove, the alignment member 222 can be a columnar body, and the alignment member 104 can accommodate the alignment member 222. This embodiment does not limit the shapes of the alignment member 104 and the alignment member 222. As long as the shape of the alignment member 222 can correspond to the alignment member 104, it should fall within the scope of the alignment member 104 and the alignment member 222 described in this embodiment. In addition, although Figure 4The engaging member 220 and the aligning member 222 are shown at the edge of the test fixture 22 and facing the Figure 1 The probe head 1 in the test fixture 22 is shown in FIG. 1 , but the engaging member 220 and the alignment member 222 may not be arranged on the test fixture 22 but may be arranged on the test fixture fixing plate 24 instead, and this embodiment does not limit this. In one example, after the engaging member 220 enters the engaging member 100, in order to firmly fix the engaging member 100 and the engaging member 220, the user may pull the fixing member 102 (such as a handle) on the probe head 1 to lock the relative relationship between the engaging member 100 and the engaging member 240, so that the position of the probe head 1 and the needle tester 2 can be roughly fixed. For example, the fixing member 102 may drive a stopping structure (not shown) to prevent the engaging member 220 from withdrawing or disengaging from the engaging member 100, and this embodiment does not limit the means of the stopping structure.

[0035] In the direct docking structure, the test surface 12a of the probe head 1 contacts the carrier, and then the carrier directly docks the wafer. Figure 5 and Figure 6 . Figure 5 is a schematic structural diagram of a carrier board according to an embodiment of the present application, Figure 6 Schematic diagram of the structure of a test fixture and a test fixture fixing plate according to an embodiment of the present application. Figure 6 In the illustrated example, it can be seen that the test fixture 22 and the test fixture fixing plate 24 are separable, so the test fixture 22 and the test fixture fixing plate 24 are illustrated separately. As shown in the figure, the test fixture 22 has an upper surface 22a (first upper surface), and the upper surface 22a defines a receiving space 224 (first receiving space). The test fixture fixing plate 24 defines an upper surface 24a (second upper surface), and there is a recessed space in the center of the upper surface 24a, and the recessed space can be defined as a receiving space 240 (second receiving space). Figure 6 In the illustrated example, the test fixture fixing plate 24 may be a hollow frame. The present embodiment does not limit the size of the test fixture fixing plate 24 , as long as the accommodating space 240 can be used to accommodate the test fixture 22 .

[0036] In addition to the aforementioned engaging member 220 and the aligning member 222, the test fixture 22 is a basin-shaped structure in appearance, and the edge of the basin-shaped structure of the test fixture 22 can be locked to the test fixture fixing plate 24, and the bottom of the basin-shaped structure of the test fixture 22 can be accommodated in the test fixture fixing plate 24. In an example, the test fixture 22 is locked to the upper surface 24a, so the edge of the test fixture 22 will be higher than the bottom, or the edge of the test fixture 22 will be closer to the test surface 12a of the probe head 1 than the bottom. In practice, the bottom of the test fixture 22 is the upper surface 22a (first upper surface), and when the test fixture 22 is accommodated in the test fixture fixing plate 24, the upper surface 22a is not coplanar with the upper surface 24a. In addition, the accommodating space 224 is a slightly recessed area in the upper surface 22a, and the accommodating space 224 can be used to accommodate the carrier 26. The accommodating space 224 may be formed integrally with the upper surface 22a, or may be a part of the upper surface 22a. The size of the carrier 26 should be smaller than or equal to the accommodating space 224, that is, the accommodating space 224 should be large enough for the carrier 26 to fit therein.

[0037] The upper side surface 26a (eg Figure 5 The carrier 26 may have a plurality of pads 260 and a vacuum region 262. Figure 2 and Figure 3 Similar to the illustrated example, the pads 260 on the carrier 26 can also be divided into two rows, and each row of pads 260 is located within a vacuum area 262. In one example, the carrier 26 is further provided with a metal edge strip 264 at the edge of the upper side surface 26a. The metal edge strip 264 can be viewed as a rectangle and surrounds two vacuum areas 262. The present embodiment does not limit the location and shape of the metal edge strip 264. For example, the metal edge strip 264 may not be provided at the edge of the upper side surface 26a, but may be provided at the edge of each vacuum area 262. It can be viewed as two rectangles and each surrounds a vacuum area 262. Of course, on the lower side surface of the carrier 26 away from the probe head 1 (for example Figure 5 As shown in the other side surface, the carrier 26 may have a plurality of probes (not shown) for connecting to the wafer, and the probes may pass through the upper surface 22a via the test slots 226 in the test fixture 22 and directly contact the wafer (not shown) disposed therebelow, which will not be described in detail in this embodiment.

[0038] In actual operation, in addition to the test fixture 22 being locked to the test fixture fixing plate 24, and the test fixture fixing plate 24 being fixed to the housing 20, the carrier plate 26 is also pre-locked in the accommodating space 224 of the test fixture 22. In one example, when the carrier plate 26 is locked in the accommodating space 224, the upper side surface 26a of the carrier plate 26 can be at the same height (coplanar) as the upper surface 22a of the test fixture 22, or the top of the metal side strip 264 located on the upper side surface 26a can be at the same height (coplanar) as the upper surface 22a of the test fixture 22, and this embodiment is not limited thereto. In other words, when the carrier plate 26 is locked in the accommodating space 224, at least a portion of the carrier plate 26 forms a coplanar surface with the upper surface 22a. In addition, since the carrier 26 and the test fixture 22 do not move relative to each other, when the probe head 1 and the probe tester 2 are close to each other, the base 12 of the probe head 1 is aligned with the test fixture 22, which also means that the opening 120 on the test surface 12a can be aligned with the pad 260 on the upper side 26a. In practice, the upper side 26a of the carrier 26 is used to contact the base 12 of the probe head 1, and a side (such as the lower side) of the carrier 26 relative to the upper side 26a is used to contact the test fixture 22.

[0039] Next, the probe head 1 and the probe tester 2 gradually approach each other until the test surface 12a of the base 12 is adjacent to the upper surface 22a of the test fixture 22 and the upper side surface 26a of the carrier 26. In order to more firmly allow the probe set protruding from the opening 120 to contact the pad 260, when the test surface 12a of the base 12 is pressed against the upper side surface 26a of the carrier 26, the probe head 1 can first activate the vacuum suction function to suck air from the position of the base 12 adjacent to the opening 120. In other words, when the test surface 12a is pushed toward the upper side surface 26a, the sealing strip 122 will be pressed against the edge of the vacuum area 262, so that the space surrounded by the test surface 12a, the upper side surface 26a and the sealing strip 122 is airtight, and then the base 12 is used to evacuate air from the test surface 12a. It is worth mentioning that when the probe head 1 and the needle tester 2 are close to each other, the probe head 1 and the needle tester 2 can perform the alignment step, such as aligning the alignment member 104 and the alignment member 222 with each other, and allowing the engaging member 220 to enter the engaging member 100. The present embodiment does not limit the probe head 1 and the needle tester 2 to be aligned first, or the probe head 1 can start the vacuum suction function first, and these two steps should be interchangeable. In addition, in order to prevent the sealing strip 122 from being overly pressed against the upper side 26a and damaging the probe group and the pad 260 of the protruding opening 120, the metal edge strip 264 can be used as a support to maintain the gap between the test surface 12a and the upper side 26a.

[0040] After the engaging member 220 enters the engaging member 100, as described above, the user can pull the fixing member 102 on the probe head 1 to lock the relative relationship between the engaging member 100 and the engaging member 240. At this step, the probe head 1 is said to be connected or fixed to the probe tester 2. It is worth mentioning that when the probe head 1 is connected to the probe tester 2, part of the seat body 12 will be pushed into the recessed basin structure of the test fixture 22. For example, the recessed basin structure of the test fixture 22 can be square in appearance and have a width W3 in an axial direction. At this time, as long as the width W2 of the seat body 12 in an axial direction is smaller than the width W3, part of the seat body 12 can be sunken into the upper surface 24a, so that the test surface 12a of the seat body 12 will be between the upper surface 22a (or the upper side surface 26a) and the upper surface 24a. Different from the conventional probe head and the probe tester, the test socket is originally designed. If the test socket is removed, the distance between the carrier and the wafer will be too large, and there is a problem that the carrier cannot contact the wafer. In this embodiment, the test fixture 22 is designed as a concave basin-shaped structure, so that the seat body 12 can be pushed into the probe tester 2 and closer to the carrier 26, thereby solving the problem that the carrier cannot contact the wafer.

[0041] On the other hand, the vacuum suction function of the probe head 1 mentioned in this embodiment can be used for other purposes besides being used to stabilize the electrical connection between the probe group and the pad 260. For example, the probe head 1 may be originally designed with a vacuum suction function, but it is not used to stabilize the electrical connection between the probe group and the pad 260. For example, the vacuum suction function may be designed to absorb the exhaust gas around the object to be tested or to absorb the replaced test socket, that is, this embodiment changes the application method of the vacuum suction function.

[0042] To illustrate the probe head connection method provided in this application, please refer to Figures 1 to 7 , Figure 7 1 is a flow chart of the steps of the probe head connection method of an embodiment of the present application. As shown in the figure, in step S30, a carrier 26 and a test fixture 22 are set between the probe head 1 and the probe tester 2, the test fixture 22 is set in the probe tester 2, and the test fixture 22 is used to accommodate the carrier 26. In step S32, the vacuum suction function of the probe head 1 is activated, and in step S34, the probe head 1 is moved to align the test fixture 22. Then, in step S36, the probe head 1 is moved to contact the carrier 26 in the test fixture 22. And in step S38, the clamping member 100 and the clamping member 220 are used to fix the probe head 1 and the test fixture 22. In the above steps, the probe head 1 and the probe tester 2 are connected in a direct probing manner, and the carrier 26 can directly contact the wafer. The other steps of the probe head connection method have been described in the previous embodiment, and this embodiment will not be repeated here.

[0043] In summary, the probe head connection method provided in the present application can be used for old-style needle test machines. As long as the test fixture is replaced with a recessed basin-shaped structure, the old-style needle test machine and the probe head can be connected to each other in a direct docking manner. This solves the problem that the traditional signal transmission path has to pass through the test socket and is long. In addition, the present application can also use the vacuum suction function of the probe head to suck the carrier board tightly, so that the carrier board can be pressed more tightly against the probe head. Since the carrier board is set in the needle test machine, the stability between the probe head and the needle test machine can also be increased.

[0044] The embodiments and / or implementation methods described above are only used to illustrate the preferred embodiments and / or implementation methods for realizing the technology of the present application, and are not intended to limit the implementation methods of the technology of the present application in any form. Any technical personnel in this field may make slight changes or modifications to other equivalent embodiments without departing from the scope of the technical means disclosed in the content of the present application, but they should still be regarded as technologies or embodiments that are essentially the same as the present application.

Claims

1. A probe head connection method for connecting a probe head to a probe testing machine, characterized in that: The connection method comprises: A carrier plate and a test fixture are arranged between the probe head and the probe tester. The test fixture is arranged in the probe tester and is used to accommodate the carrier plate. Activate a vacuum suction function of the probe head; Moving the probe head to align the test fixture; moving the probe head to contact the carrier in the test fixture; as well as Using at least one engaging member to fix the probe head and the test fixture; The carrier is used to directly connect with a wafer.

2. The probe head connection method according to claim 1, characterized in that: The test fixture is defined with a first upper surface, and the first upper surface is defined with a first accommodating space, and the first accommodating space is used to accommodate the carrier board.

3. The probe head connection method according to claim 2, characterized in that: When the carrier is accommodated in the first accommodation space, the carrier and the first upper surface form a coplanar surface.

4. The probe head connection method according to claim 2, characterized in that: Also includes: A test fixture fixing plate is provided and is detachably locked to the probe tester. A second upper surface of the test fixture fixing plate defines a second accommodating space for accommodating the test fixture.

5. The probe head connection method according to claim 4, characterized in that: The first upper surface and the second upper surface are not coplanar.

6. The probe head connection method according to claim 4, characterized in that: The test fixture is detachably locked in the second accommodating space of the test fixture fixing plate.

7. The probe head connection method according to claim 2, characterized in that: The carrier plate is detachably locked in the first accommodating space.

8. The probe head connection method according to claim 1, wherein in the step of moving the probe head to align the test fixture, it is characterized in that: Also includes: A positioning member is provided, which is arranged on the test fixture and is used to guide the probe head to align with the test fixture.

9. The probe head connection method according to claim 1, characterized in that: The probe head contacts an upper side of the carrier board, and the test fixture contacts a lower side of the carrier board.

10. The probe head connection method according to claim 9, characterized in that: The carrier plate defines at least one vacuum area on the upper side surface, and the vacuum area is surrounded by a metal edge strip.

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