High-speed optical waveguide switch chip packaging module

Abstract

The present invention discloses a high-speed optical waveguide switch chip packaging module, belonging to the field of optical packaging and radio frequency connection integrated modules, comprising a base; the optical waveguide chip includes an incident light port waveguide, two output light port waveguides, two grounding electrode coatings, and a radio frequency electrode coating; a metallized optical fiber, the first end of which passes through the first end of the base and penetrates into the accommodating cavity to be coupled with the incident light port waveguide; a fiber array with double-headed connectors includes two bare optical fibers; a first radio frequency connection ceramic substrate, which includes a first gold plating layer, a second gold plating layer, and a third gold plating layer located between the first gold plating layer and the second gold plating layer; a first SMA radio frequency connector is installed outside the base; a second radio frequency connection ceramic substrate includes a fourth gold plating layer, a fifth gold plating layer, and a sixth gold plating layer located between the fourth gold plating layer and the fifth gold plating layer; a second SMA radio frequency connector is installed outside the base. It has a simple structure and is convenient for directly inputting and outputting optical signals to the module.

Description

Technical Field

[0001] The present invention relates to the field of optical packaging and radio frequency connection integrated modules in optical fiber data communication and telecommunication, and mainly relates to a high-speed optical waveguide switch chip packaging module. Background Art

[0002] The application of the optical switch module is an indispensable and important part of the optical fiber communication system. At present, the optical switch module generally refers to the function of realizing the optical path conversion through an optical waveguide chip or a lens, an optical groove, etc. The optical switch is generally divided into two categories: mechanical and non-mechanical. One of the non-mechanical types is the optical waveguide switch, which mainly changes the waveguide refractive index or other properties through the electro-optic effect, magneto-optic effect, acousto-optic effect, and thermo-optic effect to change the optical path and realize the opening and closing of light. The mechanical type generally changes the optical path through some refractive lenses or grooves, etc., so as to realize the conversion and change of the optical path.

[0003] The existing optical switches generally have the following disadvantages:

[0004] In the form of a multi-direction optical path optical switch packaging module, this kind of module is generally mechanical, with a complex structure, a large number of components, high precision requirements for some components, high processing requirements, high procurement costs, and complex assembly, and the production cost is also very high; in the form of an optical waveguide switch chip packaging module, it is not easy to align and couple between the transmission optical fiber and the input optical port waveguide, and between the output optical fiber and the output optical port waveguide, with high assembly requirements and complex assembly. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-speed optical waveguide switch chip packaging module, which has a simple structure, is convenient for directly inputting and outputting optical signals to the module, has convenient connection, is convenient for plugging and unplugging, has simple and reliable operation, low assembly requirements, and simple assembly.

[0006] The present invention is realized through the following technical solutions:

[0007] A high-speed optical waveguide switch chip packaging module, comprising:

[0008] A base, which includes a concave accommodation cavity;

[0009] An optical waveguide chip, which is arranged in the accommodation cavity and includes an input optical port waveguide, two output optical port waveguides, two grounding electrode coatings, and a radio frequency electrode coating; wherein, the two grounding electrode coatings and the radio frequency electrode coating are arranged on the upper surface of the optical waveguide chip, the radio frequency electrode coating is located between the two grounding electrode coatings, there is a gap between the two grounding electrode coatings and the radio frequency electrode coating, the input optical port waveguide and the two output optical port waveguides are located in the waveguide layer, and the waveguide layer is located between the upper surface and the lower surface of the optical waveguide chip;

[0010] A metallized optical fiber, the first end of which penetrates into the accommodation cavity through the first end of the base and is coupled to the light input port waveguide, the first end of which is chamfered into a conical shape, and the second end of which is connected to an optical input connector;

[0011] A fiber optic array with double-headed connectors, which includes two bare optical fibers. The first ends of the two bare optical fibers penetrate into the accommodation cavity through the second end of the base. The distance between the first ends of the two bare optical fibers matches the distance between the two light output port waveguides and is respectively and correspondingly coupled to the two light output port waveguides. The two bare optical fibers are multimode optical fibers, and the diameters of the cores of the two bare optical fibers are larger than the diameters of the cores of the two light output port waveguides. The second ends of the two bare optical fibers are respectively connected to optical output connectors;

[0012] A first radio frequency connection ceramic substrate, which includes a first gold plating layer, a second gold plating layer, and a third gold plating layer located between the first gold plating layer and the second gold plating layer. There are gaps between the first gold plating layer, the second gold plating layer, and the third gold plating layer. The first gold plating layer and the second gold plating layer are respectively and correspondingly electrically connected to one end of two ground electrode plating layers, and the third gold plating layer is electrically connected to one end of the radio frequency electrode plating layer;

[0013] A first SMA radio frequency connector, which is installed outside the base, and its pin is electrically connected to the third gold plating layer of the first radio frequency connection ceramic substrate;

[0014] A second radio frequency connection ceramic substrate, which includes a fourth gold plating layer, a fifth gold plating layer, and a sixth gold plating layer located between the fourth gold plating layer and the fifth gold plating layer. There are gaps between the fourth gold plating layer, the fifth gold plating layer, and the sixth gold plating layer. The fourth gold plating layer and the fifth gold plating layer are respectively and correspondingly electrically connected to the other end of two ground electrode plating layers, and the sixth gold plating layer is electrically connected to the other end of the radio frequency electrode plating layer;

[0015] A second SMA radio frequency connector, which is installed outside the base, and its pin is electrically connected to the sixth gold plating layer of the second radio frequency connection ceramic substrate.

[0016] It also includes:

[0017] A semiconductor refrigerator, which is arranged in the accommodation cavity and includes two power supply leads, and an optical waveguide chip is placed on it;

[0018] Power supply feedthrough capacitors, there are two of them, which are installed outside the base and are respectively and correspondingly electrically connected to the two power supply leads.

[0019] It also includes:

[0020] Monitoring feedthrough capacitor connection ceramic substrates, there are two of them, which are arranged in the accommodation cavity and are connected to the optical waveguide chip;

[0021] Monitoring feedthrough capacitors, there are two of them, which are installed outside the base and are respectively and correspondingly electrically connected to the monitoring feedthrough capacitor connection ceramic substrates.

[0022] Further included are:

[0023] A first support block, which is disposed in the accommodation cavity, and the first end of the metallized optical fiber is placed thereon.

[0024] The first support block has a V-shaped groove, and the first end of the metallized optical fiber is located in the V-shaped groove.

[0025] Further included are:

[0026] Quartz glass, to which the first ends of two bare optical fibers are cured;

[0027] A second support block, which is disposed in the accommodation cavity, and the quartz glass is placed thereon.

[0028] The optical input connector is an ST type connector, an SC type connector, an LC type connector or an FC type connector.

[0029] The optical output connector is an ST type connector, an SC type connector, an LC type connector or an FC type connector.

[0030] Further included are:

[0031] An upper cover, which is disposed on the base to cover the accommodation cavity.

[0032] Compared with the prior art, the present invention has the following beneficial technical effects:

[0033] The present invention integrates optical packaging and RF connection, and uses a metallized optical fiber and a double-headed connector optical fiber array to complete the packaging of the optical part. The optical input connector can use a common ST type connector, an SC type connector, an LC type connector or an FC type connector. The input and output optical fibers can be selected as single-mode or multi-mode, which is compatible with different application scenarios, has a high integration degree, a simple structure, is convenient for directly inputting and outputting optical signals to the module, is convenient for connection, is convenient for plugging and unplugging, and has simple and reliable operation.

[0034] Both the RF interface and the power supply interface use common SMA RF connectors, namely the first SMA RF connector and the second SMA RF connector, which are convenient for electrical signal input. Since the connection distance between the RF connector and the optical waveguide chip is very short, the transmission rate can reach more than 3G. At the same time, the SMA RF connector has the function of processing signals, provides a good standing wave ratio, has less signal reflection, effectively transmits the electrical signal, is convenient for connection, and has simple and reliable operation.

[0035] When needed, a TEC (thermoelectric cooler) can also be placed for temperature monitoring and adjustment of the optical waveguide chip, realizing the temperature control function, ensuring the high and low temperature working performance of the module, and enabling the optical switch module to be applied in different ambient temperatures. A power supply feedthrough capacitor is used for the power supply and monitoring connection of the TEC, with a simple structure and convenient power supply input. It is possible to choose whether to have a TEC or not, and both cases can work properly.

[0036] The upper cover of the module is fixed to the base by screws, with a stable structure, convenient for disassembly, installation and inspection, better stability and strong vibration resistance.

[0037] The place where the optical fiber meets the housing window can be metallized and welded to the housing to maintain sealing. The cover plate and the base are sealed by high-voltage resistance welding, and the entire cavity is in a completely sealed state, improving reliability and environmental adaptability.

[0038] The materials of the module base and the upper cover are SUS304 stainless steel, with a gold-plated surface, beautiful appearance and strong corrosion resistance, and can be applied to a variety of usage environments. Description of the Drawings

[0039] Figure 1 It is a three-dimensional structure schematic diagram of the present invention.

[0040] Figure 2 It is a front view partial structure schematic diagram of the present invention.

[0041] Figure 3 It is a rear view structure schematic diagram of the present invention.

[0042] Figure 4 It is a main explosion structure schematic diagram of the present invention.

[0043] Figure 5 It is a structure schematic diagram of the optical waveguide chip of the present invention.

[0044] Figure 6 It is a connection structure schematic diagram among the first radio frequency connection ceramic substrate, the first SMA radio frequency connector, the second radio frequency connection ceramic substrate, the second SMA radio frequency connector and the optical waveguide chip of the present invention, and between them and the optical waveguide chip.

[0045] Figure 7 It is a relationship diagram of the output optical power and the input voltage of the present invention.

[0046] Meanings of the reference numerals in the drawings: 1, metallized optical fiber; 2, upper cover; 3, mounting screw; 4, fiber optic array with double-headed connectors; 5, base; 6, monitoring feedthrough capacitor; 7, power supply feedthrough capacitor; 8, first RF connection ceramic substrate; 9, optical waveguide chip; 10, monitoring feedthrough capacitor connection ceramic substrate; 11, first SMA RF connector; 12, first support block; 13, semiconductor cooler; 14, second support block; 15, first bonding wire; 16, ground electrode plating; 17, RF electrode plating; 18, input optical port waveguide; 19, output optical port waveguide; 20, second RF connection ceramic substrate; 21, second SMA RF connector; 22, second bonding wire. Detailed implementation manners

[0047] All features disclosed in this specification, or all steps in the disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined in any way. Unless specifically stated, they can be replaced by other equivalent or similar-purpose alternative features, that is, unless specifically stated, each feature is just one embodiment of a series of equivalent or similar features.

[0048] See Figure 1 、 Figure 2 , a high-speed optical waveguide switch chip packaging module in one of the numerous embodiments of the present invention, includes a metallized optical fiber 1, an upper cover 2, mounting screws 3, a fiber optic array with double-headed connectors 4, a base 5, a monitoring feedthrough capacitor 6, a power supply feedthrough capacitor 7, a first RF connection ceramic substrate 8, an optical waveguide chip 9, a monitoring feedthrough capacitor connection ceramic substrate 10, a first SMA RF connector 11, a first support block 12, a semiconductor cooler 13, a second support block 14, a second RF connection ceramic substrate 20, and a second SMA RF connector 21.

[0049] As Figure 1 shown, the present invention is a BOX package, and the frame structure includes a base 5 and an upper cover 2. The base 5 includes a receiving cavity, and the upper cover 2 is disposed on the base 5 to cover the receiving cavity. The base 5 and the upper cover 2 are fixed by 8 screws 3, with a firm structure, convenient for disassembly, installation and repair, and at the same time effectively improving the anti-vibration performance of the module.

[0050] See also Figure 2 、 5, the optical waveguide chip 9 is disposed in the receiving cavity of the base 5, and includes an incident light port waveguide 18, two output light port waveguides 19, two ground electrode coatings 16, and a radio frequency electrode coating 17; the two ground electrode coatings 16 and the radio frequency electrode coating 17 are disposed on the upper surface of the optical waveguide chip 9, the radio frequency electrode coating 17 is located between the two ground electrode coatings 16, and there is a gap between the two ground electrode coatings 16 and the radio frequency electrode coating 17. The incident light port waveguide 18 and the two output light port waveguides 19 are located in the waveguide layer, and the waveguide layer is located between the upper surface and the lower surface of the optical waveguide chip 8, that is, the incident light port waveguide 18, the two output light port waveguides 19 are not in the same plane as the two ground electrode coatings 16 and the radio frequency electrode coating 17, and the optical signal is transmitted in the waveguide layer.

[0051] The metallized optical fiber 1 is used for the input of the optical signal. The first end of the metallized optical fiber 1 penetrates into the receiving cavity through the first end through hole of the base 5. For example, the first end of the metallized optical fiber 1 penetrates into the receiving cavity through the through hole at the first end of the base 5. The first end of the metallized optical fiber 1 is chamfered into a cone shape, which can effectively prevent optical reflection, make the first end of the metallized optical fiber 1 easier to align and couple with the incident light port waveguide 18 of the optical waveguide chip 9, reduce the assembly requirements, and is easy to assemble. The first support block 12 is disposed in the receiving cavity. The first end of the metallized optical fiber 1 obtains the maximum input optical power by aligning and coupling with the incident light port waveguide 18 of the optical waveguide chip 9 inside the housing. The first end of the metallized optical fiber 1 is placed on the first support block 12, and after the optical power is stable, the first support block 12 is used to apply glue to fix and solidify the position of the metallized optical fiber 1. The second end of the metallized optical fiber 1 is connected to an optical input connector. The optical input connector can use a common ST type connector, SC type connector, LC type connector or FC type connector according to needs. The optical fiber can be selected as single mode or multi mode, which is compatible with different application scenarios. The upper surface of the first support block 12 is processed with a V-shaped groove. The first end of the metallized optical fiber 1 is located in the V-shaped groove, which can make the metallized optical fiber 1 easier to be fixed on the first support block 12, and make the glue easier to penetrate and flow onto the V-shaped groove to achieve a better effect of fixing the metallized optical fiber 1.

[0052] The fiber optic array 4 with a double - headed connector includes two bare optical fibers. The first ends of the two bare optical fibers penetrate into the accommodation cavity through the second end of the base 5. For example, the first ends of the two bare optical fibers penetrate into the accommodation cavity through the notch at the second end of the base 5. The distance between the first ends of the two bare optical fibers matches the distance between the two light - output port waveguides 19 of the optical waveguide chip 9 and are respectively and correspondingly coupled with the two light - output port waveguides 19 one by one. The second ends of the two bare optical fibers are respectively connected to optical output connectors. The two bare optical fibers are multimode optical fibers. The diameters of the cores of the two bare optical fibers are larger than the diameters of the cores of the two light - output port waveguides, which can make the first ends of the two bare optical fibers easier to be aligned and coupled to the light - output port waveguides 19, reduce the assembly requirements, and are easy to assemble. For example, the diameters of the cores of the two bare optical fibers can be 62.5 μm. The first ends of the two bare optical fibers are solidified on quartz glass. The second support block 14 is arranged in the accommodation cavity, and the quartz glass is placed on the second support block 14. The fiber optic array 4 with a double - headed connector is placed into the interior of the base 5 from the notch at the second end of the base 5. Move the quartz glass to make the first ends of the two bare optical fibers close to the two light - output port waveguides 19 of the optical waveguide chip 9 to obtain the maximum optical power for the two bare optical fibers. After the optical power is stable, use the second support block 14 to apply glue to fix the position of the fiber optic array 4 with a double - headed connector. The optical output connectors of the fiber optic array 4 with a double - headed connector can use common ST - type connectors, SC - type connectors, LC - type connectors or FC - type connectors according to needs. The two bare optical fibers can be selected as single - mode or multimode, which are compatible with different application scenarios.

[0053] As Figure 2 shown, the light - input port waveguide 18 of the optical waveguide chip 9 is aligned with the first end of the metallized optical fiber 1, and the two light - output port waveguides 19 of the optical waveguide chip 9 are aligned with the first ends of the two bare optical fibers of the fiber optic array 4 with a double - headed connector.

[0054] As Figure 6As shown in the figure, the first radio frequency connection ceramic substrate 8 includes a first gold plating layer, a second gold plating layer, and a third gold plating layer located between the first gold plating layer and the second gold plating layer. There are gaps between the first gold plating layer, the second gold plating layer, and the third gold plating layer. One end of the first gold plating layer and the second gold plating layer are respectively and electrically connected to one end of two ground electrode plating layers 16 in a one-to-one correspondence, and the third gold plating layer is electrically connected to one end of the radio frequency electrode plating layer 17; the first SMA radio frequency connector 11 is installed outside the base, and its pin is electrically connected to the third gold plating layer of the first radio frequency connection ceramic substrate 8; the second radio frequency connection ceramic substrate 20 includes a fourth gold plating layer, a fifth gold plating layer, and a sixth gold plating layer located between the fourth gold plating layer and the fifth gold plating layer. There are gaps between the fourth gold plating layer, the fifth gold plating layer, and the sixth gold plating layer. One end of the fourth gold plating layer and the fifth gold plating layer are respectively and electrically connected to the other end of two ground electrode plating layers 16 in a one-to-one correspondence, and the sixth gold plating layer is electrically connected to the other end of the radio frequency electrode plating layer 17; the second SMA radio frequency connector 21 is installed outside the base, and its pin is electrically connected to the sixth gold plating layer of the second radio frequency connection ceramic substrate. For example, the pin of the first SMA radio frequency connector 11 and the third gold plating layer of the first radio frequency connection ceramic substrate 8 are connected and fixed with solder paste. Then, the third gold plating layer of the first radio frequency connection ceramic substrate 8 is connected to the radio frequency electrode plating layer 17 on the optical waveguide chip 9 through the first bonding wire 15. The first gold plating layer and the second gold plating layer of the first radio frequency connection ceramic substrate 8 are respectively connected to the two ground electrode plating layers 16 of the optical waveguide chip 9 through the second bonding wire 22 in a one-to-one correspondence, so as to realize the electrical connection between the first SMA radio frequency connector 11 and the optical waveguide chip 9; the electrical connection between the second radio frequency connection ceramic substrate 20, the second SMA radio frequency connector 21 and the optical waveguide chip 9 is the same as that between the first SMA radio frequency connector 11 and the first radio frequency connection ceramic substrate 8. For the sake of simplicity, it will not be repeated here. The first SMA radio frequency connector 11 and the second SMA radio frequency connector 21 respectively realize the input and output of the radio frequency circuit. Moreover, the connection distance between the first SMA radio frequency connector 11, the second SMA radio frequency connector 21 and the optical waveguide chip 9 is very short, and the transmission rate can reach more than 3G. By applying a DC voltage to the first SMA radio frequency connector 11 and the second SMA radio frequency connector 21 with a DC power supply, it is equivalent to applying a DC voltage to the electrodes of the optical waveguide chip 9, and the light power magnitude and ratio of the two output optical ports of the optical waveguide chip 9, that is, the first output optical port and the second output optical port, can be adjusted, so as to realize the optical switch beam splitting and dimming functions. The specific implementation is as follows: Figure 7 In the figure, a is the relationship line between the output optical power of the first output optical port and the input voltage of the radio frequency connector, and b is the relationship line between the output optical power of the second output optical port and the input voltage of the radio frequency connector; as Figure 7As shown in the schematic diagram, a positive voltage of 0 to 40V is input to one of the RF connectors, such as the first SMA RF connector 11 or the second SMA RF connector 21. The optical power of one of the first light output ports is greater than that of the other second light output port, and the optical powers of the two light output ports change linearly at the same time. Then, a negative voltage of 0 to -40V is input to this RF connector. The optical power of the second light output port begins to be greater than that of the first light output port, and the optical powers of the two output light ports continue to change linearly. Therefore, the ratio of the optical powers of the two light output ports can be adjusted by adjusting the DC voltage input to the RF connector.

[0055] In one embodiment, a voltage of various functions or any waveform (such as sinusoidal alternating current) type can also be input to the RF connector, so that the response of the optical power of the light output port changes following the change of the electrical signal.

[0056] As Figure 4 shown, the thermoelectric cooler 13 (Thermo Electric Cooler, TEC) is placed in the accommodation cavity of the base 5. The support optical waveguide chip 9 is placed on the thermoelectric cooler 13 and is used to support the optical waveguide chip 9. At the same time, the TEC is used for temperature monitoring and adjustment of the optical waveguide chip 9. When needed, the optical waveguide chip 9 is kept working at a relatively stable temperature, so that the optical switch module can work stably when applied in different ambient temperatures and ensure the high and low temperature working performance of the module. The thermoelectric cooler 13 has two power supply leads, and there are two power supply core capacitors 7. The power supply core capacitors 7 are installed outside the base 5. The two power supply leads of the thermoelectric cooler 13 are respectively and correspondingly electrically connected to the two power supply core capacitors 7 by soldering, and the TEC is powered through the power supply through-hole capacitor 7. As Figure 2 shown, there are two monitoring through-hole capacitors connecting ceramic substrates 10, and they are both placed in the accommodation cavity of the base 5. They are connected to the optical waveguide chip 9 and are respectively and correspondingly connected to the two monitoring through-hole capacitors 6 by soldering. Among them, the two monitoring through-hole capacitors 6 are installed outside the base 5. The temperature of the optical waveguide chip 9 is monitored through the monitoring through-hole capacitors 6. When needed, a feedback signal is sent to the thermoelectric cooler 13 to control the temperature of the optical waveguide chip 9. It should be noted that the present invention can choose to have a TEC or not, and the present invention can work normally in both cases, and this function is selected according to the actual product requirements.

[0057] The through-hole at the first end of the metallized optical fiber 1 and the base 5, and the junction of the double-headed connector optical fiber array 4 and the notch at the second end of the base 5 are sealed with waterproof glue to prevent dust, dirt and moisture from entering. For a higher level of sealing, soldering can also be directly used for sealing. The upper cover 2 and the base 5 are directly fixed with screws. For a higher level of sealing, the upper cover 2 and the base 5 can also be directly connected together by high-voltage resistance welding. The monitoring feedthrough capacitor 6 and the power supply feedthrough capacitor 7 are fixed with waterproof glue. For a higher level of sealing, soldering can also be directly used; the first SMA radio frequency connector 11 and the second SMA radio frequency connector 21 can be mechanically fixed. For a higher level of sealing, soldering can also be directly used.

[0058] The present invention is small in volume, integrates optical packaging and radio frequency connection in one module, realizes the opening or closing of optical signals through the optical waveguide chip 9, the metallized optical fiber 1 and the double-headed connector optical fiber array 4, has a high degree of integration, diverse functions, a common connection operation joint, and is compatible with a variety of usage occasions and environments.

[0059] The above are only the preferred embodiments of the present invention, and do not impose any formal limitations on the present invention. Any simple modifications and equivalent changes made to the above embodiments based on the technical essence of the present invention all fall within the protection scope of the present invention.

Claims

1. A high-speed optical waveguide switch chip packaging module, characterized in that, Comprising: A base, which includes a concave receiving cavity; An optical waveguide chip, which is disposed in the receiving cavity and includes an input port waveguide, two output port waveguides, two ground electrode coatings, and a radio frequency electrode coating; wherein, the two ground electrode coatings and the radio frequency electrode coating are disposed on the upper surface of the optical waveguide chip, the radio frequency electrode coating is located between the two ground electrode coatings, there are gaps between the two ground electrode coatings and the radio frequency electrode coating, the input port waveguide and the two output port waveguides are located in the waveguide layer, and the waveguide layer is located between the upper surface and the lower surface of the optical waveguide chip; A metallized optical fiber, whose first end penetrates into the receiving cavity through the first end of the base and is coupled to the input port waveguide, the first end of the metallized optical fiber is chamfered into a conical shape, and the second end of the metallized optical fiber is connected to an optical input connector; A double-headed connector optical fiber array, which includes two bare optical fibers, the first ends of the two bare optical fibers penetrate into the receiving cavity through the second end of the base, the distance between the first ends of the two bare optical fibers matches the distance between the two output port waveguides and is respectively and correspondingly coupled to the two output port waveguides, the two bare optical fibers are multimode optical fibers, the diameters of the cores of the two bare optical fibers are larger than the diameters of the cores of the two output port waveguides, and the second ends of the two bare optical fibers are respectively connected to optical output connectors; A first radio frequency connection ceramic substrate, which includes a first gold plating layer, a second gold plating layer, and a third gold plating layer located between the first gold plating layer and the second gold plating layer, there are gaps between the first gold plating layer, the second gold plating layer, and the third gold plating layer, the first gold plating layer and the second gold plating layer are respectively and correspondingly electrically connected to one end of the two ground electrode coatings, and the third gold plating layer is electrically connected to one end of the radio frequency electrode coating; A first SMA radio frequency connector, which is installed outside the base, and its pin is electrically connected to the third gold plating layer of the first radio frequency connection ceramic substrate; A second radio frequency connection ceramic substrate, which includes a fourth gold plating layer, a fifth gold plating layer, and a sixth gold plating layer located between the fourth gold plating layer and the fifth gold plating layer, there are gaps between the fourth gold plating layer, the fifth gold plating layer, and the sixth gold plating layer, the fourth gold plating layer and the fifth gold plating layer are respectively and correspondingly electrically connected to the other end of the two ground electrode coatings, and the sixth gold plating layer is electrically connected to the other end of the radio frequency electrode coating; A second SMA radio frequency connector, which is installed outside the base, and its pin is electrically connected to the sixth gold plating layer of the second radio frequency connection ceramic substrate; Further comprising: A semiconductor refrigerator, which is disposed in the receiving cavity and includes two power supply leads, and the optical waveguide chip is placed on the semiconductor refrigerator; Two power supply feedthrough capacitors, which are installed outside the base and are respectively and correspondingly electrically connected to the two power supply leads; Further comprising: Two monitoring feedthrough capacitor connection ceramic substrates, which are disposed in the receiving cavity and are connected to the optical waveguide chip; Two monitoring feedthrough capacitors, which are installed outside the base and are respectively and correspondingly electrically connected to the monitoring feedthrough capacitor connection ceramic substrates.

2. The high-speed optical waveguide switch chip packaging module according to claim 1, characterized in that Further comprising: A first support block, which is disposed in the receiving cavity, and the first end of the metallized optical fiber is placed thereon.

3. The high-speed optical waveguide switch chip packaging module according to claim 2, wherein, The first support block has a V-shaped groove, and the first end of the metallized optical fiber is located in the V-shaped groove.

4. The high-speed optical waveguide switch chip packaging module according to claim 1, characterized in that, Further comprising: Quartz glass, on which the first ends of the two bare optical fibers are cured; The second support block is disposed in the accommodating cavity, and the fused silica glass is placed on the second support block.

5. The high-speed optical waveguide switch chip packaging module according to claim 1, characterized in that The optical input connector is an ST type connector, an SC type connector, an LC type connector or an FC type connector.

6. The high-speed optical waveguide switch chip packaging module according to claim 1, wherein The optical output connector is an ST type connector, an SC type connector, an LC type connector or an FC type connector.

7. The high-speed optical waveguide switch chip packaging module according to any one of claims 1-6, characterized in that, It further includes: An upper cover is disposed on the base to cover the accommodating cavity.

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