Camera Module

Abstract

The camera module includes a lens barrel, a substrate, a housing, a heat transfer component, and a heat dissipation component, wherein the lens barrel is configured to receive a lens; an image sensor is disposed on the substrate; the housing is configured to receive the lens barrel and contact the substrate; the heat transfer component is configured to contact the housing; and the heat dissipation component is configured to contact the heat transfer component and dissipate heat from the heat transfer component in different lateral directions around the lens.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0152845 filed in the Korean Intellectual Property Office on November 16, 2020, the disclosure of which is incorporated herein in its entirety by reference for all purposes. Technical Field

[0003] The following description relates to a camera module configured to dissipate heat generated therein from the inside to the outside. Background Art

[0004] The camera module includes a lens unit and an optical signal conversion unit. Such a lens unit may include one or more lenses and may be configured to refract light reflected from an object so that the light can enter the optical signal conversion unit. The optical signal conversion unit includes a plurality of optical sensors and is configured to convert an optical signal incident through the lens unit into an electrical signal.

[0005] As the scope of use of camera modules increases and the functions of camera modules expand, the demand for camera modules with high resolution is increasing. In order to realize a high-resolution camera module, an optical signal conversion unit (e.g., an image sensor) and other electronic components (e.g., a passive device) capable of processing optical signals at high speed are required. However, since the optical signal conversion unit generates a considerable amount of heat in the process of processing optical signals at high speed, there is a problem of deteriorating the life and performance of the camera module.

[0006] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0007] The present summary is provided to introduce a selection of inventive concepts in a concise form, and these inventive concepts will be further described in the following detailed description. The present summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.

[0008] In a general aspect, a camera module includes a lens barrel, a substrate, a housing, a heat transfer member, and a heat dissipation member, wherein the lens barrel is configured to receive a lens; an image sensor is disposed on the substrate; the housing is configured to receive the lens barrel and contact the substrate; the heat transfer member is configured to contact the housing; and the heat dissipation member is configured to contact the heat transfer member and dissipate heat from the heat transfer member in different lateral directions around the lens.

[0009] The housing may include a heat dissipation unit configured to be in surface contact with the heat transfer member.

[0010] The heat dissipation member may be configured to radiate heat in a direction of an optical axis of the lens and in a direction perpendicular to the optical axis.

[0011] The heat dissipation member may include a first heat dissipation member extending in a length direction of the housing and a second heat dissipation member extending in a length direction of the substrate.

[0012] The camera module may further include a heat insulating member disposed between the substrate and the second heat dissipation member.

[0013] The heat dissipation member may include a first heat dissipation member disposed on a first side of the housing and a second heat dissipation member disposed on a second side of the housing.

[0014] The heat dissipation member may include a first heat dissipation member disposed on a first side of the housing, a second heat dissipation member disposed on a second side of the housing, and a third heat dissipation member disposed on a third side of the housing.

[0015] The heat dissipation member may include one or more heat dissipation fins to increase the heat dissipation surface area.

[0016] The heat transfer member may include a thermoelectric element.

[0017] In another general aspect, a camera module includes a substrate, a lens barrel, a housing, a first heat transfer member, a second heat transfer member, and a first heat dissipation member and a second heat dissipation member, wherein the substrate is provided with an image sensor; the lens barrel is configured to receive a lens; the housing is configured to receive the lens barrel; the first heat transfer member is configured to contact the substrate; the second heat transfer member is configured to contact the housing; and the first heat dissipation member and the second heat transfer member are configured to contact the first heat transfer member and the second heat transfer member, respectively, and are configured to dissipate heat from the first heat transfer member and the second heat transfer member.

[0018] The first heat dissipation member and the second heat dissipation member may be integrally provided.

[0019] At least one of the first heat transfer member and the second heat transfer member may be composed of a thermoelectric element.

[0020] In another general aspect, a camera module includes a lens barrel, a substrate, a housing, a heat transfer member, and a heat dissipation member, wherein the lens barrel is configured to receive a lens; an image sensor is disposed on the substrate; the housing is configured to receive the lens barrel and is in contact with the substrate; the heat transfer member is disposed in contact with the housing; and the heat dissipation member is in contact with the heat transfer member, is disposed on at least one side surface of the housing, and is configured to dissipate heat from the heat transfer member.

[0021] The camera module may further include a heat dissipation unit disposed between the housing and the heat transfer member and in contact with the housing and the heat transfer member.

[0022] The heat dissipation member may include a first heat dissipation member extending in the first direction and a second heat dissipation member extending in the second direction.

[0023] The first direction and the second direction may be different from each other.

[0024] The first direction or the second direction may be in the direction of the optical axis of the lens.

[0025] The first heat dissipation member and the second heat dissipation member may respectively have first and second fins extending away from the housing, and the first and second fins may be substantially parallel to each other or substantially perpendicular to each other.

[0026] The first heat dissipation member and the second heat dissipation member may be integral with each other or separate from each other.

[0027] The heat transfer member may include a thermoelectric element.

[0028] Other features and aspects will become apparent from the appended claims, the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a cross-sectional view of a camera module according to an example.

[0030] Figure 2 yes Figure 1 A plan view of the camera module shown in FIG.

[0031] Figure 3 is based on Figure 1 A cross-sectional view of a modified form of the camera module shown in FIG.

[0032] Figure 4 is a cross-sectional view of a camera module according to another example.

[0033] Figure 5 yes Figure 4 A plan view of the camera module shown in FIG.

[0034] Figure 6 is based on Figure 4 A plan view of another form of camera module is shown in FIG.

[0035] Figure 7 is an exploded perspective view of a camera module according to another example.

[0036] Figure 8 yes Figure 7 A perspective view of the camera module shown in FIG.

[0037] Fig. 9 yes Figure 8 A cross-sectional view of a camera module is shown in FIG.

[0038] In all drawings and detailed description, the same reference numerals refer to the same elements. For the purpose of clarity, illustration and convenience, the drawings may not be drawn to scale, and the relative sizes, proportions and depictions of elements in the drawings may be exaggerated. DETAILED DESCRIPTION

[0039] The following specific embodiments are provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent to those skilled in the art. Except for operations that must occur in a particular order, the order of operations described herein is merely an example and is not limited to the order set forth herein, but changes that will be apparent to those skilled in the art may be made. In addition, for greater clarity and brevity, descriptions of known functions and structures may be omitted.

[0040] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways to implement the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0041] Herein, it should be noted that use of the word “may” with respect to an embodiment or example (e.g., with respect to what an embodiment or example may include or implement) means that there is at least one embodiment or example that includes or implements such feature, and all embodiments and examples are not limited thereto.

[0042] Throughout the specification, when an element such as a layer, a region, or a substrate is described as being “on,” “connected to,” or “coupled to” another element, the element may be directly “on,” “connected to,” or “coupled to” another element, or one or more other elements may be present between the element and the other element. Conversely, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, no other elements may be present between the element and the other element.

[0043] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0044] Although the terms "first", "second" and "third" may be used herein to describe various members, components, regions, layers or parts, these members, components, regions, layers or parts are not limited by these terms. More specifically, these terms are only used to distinguish one member, component, region, layer or part from another member, component, region, layer or part. Therefore, without departing from the teachings of the examples described herein, the first member, first component, first region, first layer or first part mentioned in the examples may also be referred to as the second member, second component, second region, second layer or second part.

[0045] Spatially relative terms such as "above", "higher", "lower", and "lower" may be used herein for descriptive convenience to describe the relationship of one element relative to another element as shown in the accompanying drawings. In addition to covering the orientations depicted in the accompanying drawings, these spatially relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as being "above" or "higher" relative to another element will be "below" or "lower" relative to the other element. Therefore, depending on the spatial orientation of the device, the term "above" covers both "above" and "lower" orientations. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0046] The terms used herein are only used to describe various examples and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the articles "a", "an" and "the" are intended to include plural forms as well. The words "include", "comprise" and "have" illustrate the presence of stated features, numbers, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, components, elements and / or combinations thereof.

[0047] Due to manufacturing techniques and / or tolerances, the shapes shown in the drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include shape variations that occur during manufacturing.

[0048] The features of the examples described herein can be combined in various ways, which will be apparent after obtaining an understanding of the present disclosure. In addition, although the examples described herein have multiple configurations, it will be apparent after obtaining an understanding of the present disclosure that other configurations are also possible.

[0049] An aspect of the present disclosure is to provide a camera module configured to prevent a phenomenon in which resolution is degraded due to overheating of an optical signal conversion unit and electronic components.

[0050] The camera module described herein may be mounted on a device configured to observe or monitor the surrounding environment. For example, the camera module may be mounted on a security monitoring device, a vehicle speed detection device, etc. However, the scope of use of the camera module is not limited to the above-mentioned devices. For example, the camera module may be mounted on a vehicle with a front and rear collision avoidance function, a vehicle with an automatic driving function, etc.

[0051] The camera module includes a lens barrel and a substrate on which an image sensor is mounted. The lens barrel is configured to receive one or more lenses. For example, the lens barrel may be configured to accommodate four or more lenses. However, the number of lenses accommodated in the lens barrel is not limited to four. For example, the lens barrel may accommodate 3 or less or 5 or more lenses. In addition to the image sensor, the substrate may also be provided with electronic components. For example, passive components electrically connected to the image sensor may be installed inside or on one side of the substrate.

[0052] The camera module includes a housing configured to receive at least one of a lens barrel and a substrate. The housing may be configured to transfer heat of the substrate to the outside. For example, the housing according to the example may contact the substrate to absorb or transfer heat from the substrate.

[0053] The camera module may generate heat. For example, the substrate of the camera module (in detail, the image sensor) may generate a considerable amount of heat in the process of converting an optical signal into an electrical signal. The heat generated inside the camera module overheats the substrate and electronic components mounted on the substrate, and may cause malfunction of the camera module and degradation of resolution. The present disclosure is intended to prevent the above-mentioned problems and provide a camera module configured to release heat generated in the interior thereof to the outside.

[0054] For example, the camera module according to the example can dissipate heat from the substrate to the outside through a heat transfer member and a heat dissipation member. The heat transfer member is arranged to contact the housing. For example, the heat transfer member may be in surface contact with one surface of a housing of considerable size to absorb the heat of the substrate transferred to the housing or transfer the heat to the heat dissipation member. The heat dissipation member contacts the heat transfer member and is configured to dissipate the heat of the heat transfer member to multiple sides. For example, the heat dissipation member may be arranged on the side of the housing to release the heat transferred by the heat transfer member to the outside. Therefore, since the camera module according to this example heats the housing to a predetermined temperature using the heat generated by the substrate and releases the heat to the outside at the same time, the overheating phenomenon of the substrate can be suppressed while maintaining the constant optical performance of the camera module.

[0055] Hereinafter, examples will be described in detail based on the accompanying drawings.

[0056] First, refer to Figure 1 and Figure 2 A camera module according to an example is described.

[0057] The camera module 10 according to the example includes a lens barrel 100, a substrate 200, a housing 300, a heat transfer member 400, and a heat dissipation member 500. However, the configuration of the camera module 10 is not limited to the aforementioned members. For example, the camera module 10 may further include a shielding cover for protecting the lens barrel 100 and the substrate 200 from harmful electromagnetic waves or external impacts, etc. In addition, the camera module 10 may further include an airtight member to prevent the penetration of moisture.

[0058] The lens barrel 100 is configured to receive the lens 110. For example, the lens barrel 100 may contain one or more lenses 110 therein. The lens barrel 100 may be configured to significantly reduce deformation caused by heat. For example, the lens barrel 100 may be formed of a thermosetting plastic material. However, the material of the lens barrel 100 is not limited to plastic. For example, the lens barrel 100 may be formed of a metal material.

[0059] The lens 110 is disposed inside the lens barrel 100. For example, one or more lenses 110 may be sequentially disposed inside the lens barrel 100 in the direction of the optical axis C. The lens 110 is configured to refract light. For example, the lens 110 may have a convex or concave shape on one surface to converge or diverge incident light. The lens 110 may be formed of a plastic material to reduce the weight of the camera module 10. However, not all lenses 110 constituting the camera module 10 are formed of a plastic material. For example, one or more lenses 110 may be formed of a glass material to significantly reduce changes in optical properties according to temperature changes.

[0060] The substrate 200 provides a mounting space for electronic components required to drive the camera module 10. For example, the image sensor 210 may be mounted on one surface of the substrate 200. The image sensor 210 may be configured to convert an optical signal incident through the lens 110 into an electrical signal. The substrate 200 may also include electronic components required to drive the image sensor 210. For example, passive components may be provided on or inside one surface of the substrate 200. The substrate 200 may be configured to enable electrical connection between electronic components. For example, a circuit electrically connecting the image sensor 210 and the passive components may be formed on or inside one surface of the substrate 200.

[0061] The housing 300 is configured to accommodate at least one of the lens barrel 100 and the substrate 200. For example, the housing 300 may accommodate the lens barrel 100 therein. The housing 300 may be configured to absorb or transfer the heat generated by the substrate 200 outward. For example, the housing 300 may contact at least one surface of the substrate 200 to absorb the heat generated by the substrate 200 and / or the image sensor 210 and / or transfer the heat to another component. The housing 300 may be formed of a material with relatively high thermal conductivity so that heat transfer can be performed. For example, the housing 300 may be formed of a metal material. However, the material of the housing 300 is not limited to metal. One side of the housing 300 may be formed to facilitate contact with other component surfaces. For example, a heat dissipation unit 310 formed to be substantially flat may be formed on one side of the housing 300. The heat dissipation unit 310 may be extended in the direction of the optical axis C and in the direction intersecting the optical axis C. However, the surface of the heat dissipation unit 310 does not necessarily have to be formed to be flat. For example, in order to increase the surface area of ​​the heat dissipation unit 310 , the surface of the heat dissipation unit 310 may be formed in a corrugated shape.

[0062] The heat transfer member 400 is configured to contact the housing 300. For example, the heat transfer member 400 may be arranged to contact the heat dissipation unit 310 of the housing 300. The heat transfer member 400 may be fixed to the heat dissipation unit 310. For example, the heat transfer member 400 may be firmly fixed to the heat dissipation unit 310 by an adhesive. The adhesive may be configured to allow heat transfer. For example, the adhesive may include a material having a relatively high thermal conductivity. As a detailed example, the adhesive may include a metal powder having a high thermal conductivity, etc. However, the coupling method between the heat transfer member 400 and the heat dissipation unit 310 of the housing 300 is not limited to the adhesive. For example, the heat transfer member 400 and the heat dissipation unit 310 may be combined in a physical form such as a protrusion and a groove.

[0063] The heat transfer member 400 may be formed of a material having relatively high thermoelectricity. For example, the heat transfer member 400 may be formed of copper, aluminum, an alloy of copper and aluminum, etc. However, the material of the heat transfer member 400 is not limited to the above materials. For example, the heat transfer member 400 may be formed of a thermoelectric element.

[0064] The heat dissipation member 500 is configured to transfer the heat of the heat transfer member 400 to the outside. For example, the heat dissipation member 500 can absorb the heat of the heat transfer member 400 and release the heat into the air. The heat dissipation member 500 can be configured to facilitate heat dissipation. For example, the heat dissipation member 500 can be formed of a metal material. In addition, the heat dissipation member 500 can include a plurality of heat dissipation fins 502 to increase the surface area in contact with the atmosphere.

[0065] The heat dissipation member 500 may dissipate heat from the heat transfer member 400 in different lateral directions around the lens 110. For example, the heat dissipation member 500 may include a first heat dissipation member 510 configured to dissipate heat in a direction intersecting the optical axis C and a second heat dissipation member 520 configured to dissipate heat in the direction of the optical axis C. The first heat dissipation member 510 extends in the length direction of the housing 300, and the second heat dissipation member 520 extends in the length direction of the substrate 200.

[0066] The camera module 10 according to this example may further include a configuration for blocking heat from the second heat dissipation member 520 from being transferred to the substrate 200. For example, Figure 3 As shown in , the camera module 10 may further include a heat insulating member 600 disposed between the substrate 200 and the second heat dissipation member 520. The heat insulating member 600 may be adhered to the substrate 200 or the second heat dissipation member 520. However, the heat insulating member 600 does not necessarily have to be adhered to or in contact with the substrate 200 and the second heat dissipation member 520. For example, the heat insulating member 600 may be disposed in contact with the substrate 200 and spaced apart from the second heat dissipation member 520.

[0067] The camera module 10 configured as above can radiate heat generated by the substrate 200 and the image sensor 210 outward or into the atmosphere through the housing 300, the heat transfer member 400 and the heat dissipation member 500. Therefore, the problem of performance degradation of the camera module 10 due to overheating can be reduced.

[0068] Furthermore, since the camera module 10 according to this example can heat the lens barrel 100 to a substantially constant temperature through the housing 300 , a change in the optical performance of the lens 110 due to a temperature change can be suppressed.

[0069] Next, we will refer to Figures 4 to 6 A camera module according to another example is described.

[0070] The camera module 12 according to the example includes a lens barrel 100, a substrate 200, a housing 300, a heat transfer member 400, and a heat dissipation member 500. However, the configuration of the camera module 12 is not limited to the aforementioned members. For example, the camera module 12 may further include a shielding cover for protecting the lens barrel 100 and the substrate 200 from harmful electromagnetic waves or external impacts. In addition, the camera module 12 may also include an airtight member for blocking the penetration of moisture.

[0071] The lens barrel 100 is configured to receive the lens 110. For example, the lens barrel 100 may contain one or more lenses 110 therein. The lens barrel 100 may be configured to significantly reduce its deformation due to heat. For example, the lens barrel 100 may be formed of a thermosetting plastic material. However, the material of the lens barrel 100 is not limited to plastic. For example, the lens barrel 100 may also be formed of a metal material.

[0072] The lens 110 is disposed inside the lens barrel 100. For example, one or more lenses 110 may be sequentially disposed inside the lens barrel 100 in the direction of the optical axis C. The lens 110 is configured to refract light. For example, the lens 110 may have a convex or concave shape on one surface to converge or diverge incident light. The lens 110 may be formed of a plastic material to reduce the weight of the camera module 12. However, not all lenses 110 constituting the camera module 12 are formed of a plastic material. For example, one or more lenses 110 may be formed of a glass material to significantly reduce changes in optical properties according to temperature changes.

[0073] The substrate 200 provides a mounting space for the electronic components required to drive the camera module 12. For example, the image sensor 210 may be mounted on one surface of the substrate 200. The image sensor 210 may be configured to convert an optical signal incident through the lens 110 into an electrical signal. The substrate 200 may also include electronic components required to drive the image sensor 210. For example, passive components may be provided on or inside one surface of the substrate 200. The substrate 200 may be configured to enable electrical connection between electronic components. For example, a circuit for electrically connecting the image sensor 210 and the passive components may be formed on or inside one surface of the substrate 200.

[0074] The housing 300 is configured to accommodate at least one of the lens barrel 100 and the substrate 200. For example, the housing 300 may accommodate the lens barrel 100 therein. The housing 300 may be configured to absorb the heat generated by the substrate 200 or transfer the heat outward. For example, the housing 300 may contact at least one surface of the substrate 200 to absorb the heat generated by the substrate 200 or the image sensor 210 or transfer the heat to another member. The housing 300 may be formed of a material with high thermal conductivity to enable heat transfer. For example, the housing 300 may be formed of a metal material. However, the material of the housing 300 is not limited to metal. One or more side surfaces of the housing 300 may be formed to facilitate contact with one or more heat transfer members 400 (410, 420) surfaces. For example, a first heat dissipation unit 310 and a second heat dissipation unit 320 formed to be substantially flat may be formed on the first side and the second side of the housing 300, respectively. The heat dissipation units 310 and 320 may be extended in the direction of the optical axis C and in the direction intersecting the optical axis C. However, the surfaces of the heat dissipation units 310 and 320 are not necessarily formed to be flat. For example, in order to increase the surface areas of the heat dissipation units 310 and 320, the surfaces of the heat dissipation units 310 and 320 may be formed to be corrugated.

[0075] The heat transfer member 400 (410, 420) is configured to contact the housing 300. For example, the first heat transfer member 410 may be provided as the first heat dissipation unit 310 contacting the housing 300, and the second heat transfer member 420 may be provided as the second heat dissipation unit 320 contacting the housing 300. The first heat transfer member 410 and the second heat transfer member 420 may be firmly fixed to the first heat dissipation unit 310 and the second heat dissipation unit 320 by an adhesive. The adhesive may be configured to allow heat transfer. For example, the adhesive may include a material having high thermal conductivity. As a detailed example, the adhesive may include a metal powder having high thermal conductivity. However, the coupling method between the heat transfer members 410 and 420 and the heat dissipation units 310 and 320 is not limited to the adhesive. For example, the heat transfer members 410 and 420 and the heat dissipation units 310 and 320 may be combined in a physical form such as a protrusion and a groove.

[0076] The heat transfer member 400 (410, 420) may be formed of a material having relatively high thermoelectricity. For example, the heat transfer member 400 (410, 420) may be formed of copper, aluminum, an alloy of copper and aluminum, etc. However, the material of the heat transfer member 400 (410, 420) is not limited to the above materials.

[0077] The heat dissipation member 500 is configured to transfer the heat of the heat transfer member 400 (410, 420) to the outside. For example, the heat dissipation member 500 can absorb the heat of one or more heat transfer members 400 and release the heat into the air. The heat dissipation member 500 can be configured to facilitate heat dissipation. For example, the heat dissipation member 500 can be formed of a metal material. In addition, the heat dissipation member 500 may include a plurality of heat dissipation fins 502 to increase the surface area in contact with the atmosphere.

[0078] The heat dissipation member 500 may radiate heat from the heat transfer member 400 (410 and 420) in different lateral directions centered on the lens 110. Based on the main radiation direction, the heat dissipation member 500 may be divided into a first heat dissipation member 510 and a second heat dissipation member 520. The first heat dissipation member 510 may be disposed on a first side of the housing 300 to contact the first heat transfer member 410, and the second heat dissipation member 520 may be disposed on a second side of the housing 300 to contact the second heat transfer member 420.

[0079] The first heat dissipation member 510 may be configured to dissipate heat from the first heat transfer member 410 to one side of the camera module 12. The second heat dissipation member 520 may be configured to dissipate heat from the second heat transfer member 420 to the other side of the camera module 12. The first heat dissipation member 510 and the second heat dissipation member 520 may be integrally formed. However, the first heat dissipation member 510 and the second heat dissipation member 520 do not necessarily have to be integrally formed. For example, the first heat dissipation member 510 and the second heat dissipation member 520 may also be formed to be separated from each other.

[0080] On the other hand, Figure 6 As shown in , the heat dissipation member 500 may be configured to dissipate heat to three sides of the housing 300. For example, the heat dissipation member 500 may include a first heat dissipation member 510 disposed on a first side of the housing 300, a second heat dissipation member 520 disposed on a second side of the housing 300, and a third heat dissipation member 530 disposed on a third side of the housing 300. The first to third heat dissipation members 510 to 530 are respectively coupled to the first to third heat transfer members 410 to 430 disposed on the first to third sides of the housing 300.

[0081] In the camera module 12 configured as above, heat generated by the substrate 200 and the image sensor 210 may be quickly discharged outward or into the atmosphere through the housing 300 , the plurality of heat transfer members 410 , 420 , and 430 , and the plurality of heat dissipation members 510 , 520 , and 530 .

[0082] Next, we will refer to Figures 7 to 9 A camera module according to another example is described.

[0083] The camera module 14 according to the example includes a lens barrel 100, a substrate 200, a housing 300, a heat transfer member 400, and a heat dissipation member 500. However, the configuration of the camera module 14 is not limited to the foregoing members.

[0084] The lens barrel 100 is configured to receive the lens 110. For example, the lens barrel 100 may contain one or more lenses 110 therein. The lens barrel 100 may be configured to significantly reduce its deformation due to heat. For example, the lens barrel 100 may be formed of a thermosetting plastic material. However, the material of the lens barrel 100 is not limited to plastic. For example, the lens barrel 100 may be formed of a metal material.

[0085] The lens 110 is disposed inside the lens barrel 100. For example, one or more lenses 110 may be sequentially disposed inside the lens barrel 100 in the direction of the optical axis C. The lens 110 is configured to refract light. For example, the lens 110 may have a convex or concave shape on one surface to converge or diverge incident light. The lens 110 may be formed of a plastic material to reduce the weight of the camera module 14. However, not all lenses 110 constituting the camera module 14 are formed of a plastic material. For example, one or more lenses 110 may be formed of a glass material to significantly reduce changes in optical properties according to temperature changes.

[0086] The substrate 200 provides a mounting space for the electronic components required to drive the camera module 14. For example, the image sensor 210 may be mounted on one surface of the substrate 200. The image sensor 210 may be configured to convert an optical signal incident through the lens 110 into an electrical signal. The substrate 200 may also include electronic components required to drive the image sensor 210. For example, passive components may be provided on or inside one surface of the substrate 200. The substrate 200 may be configured to enable electrical connection between electronic components. For example, a circuit for electrically connecting the image sensor 210 and the passive components may be formed on or inside one surface of the substrate 200.

[0087] The housing 300 is configured to accommodate at least one of the lens barrel 100 and the substrate 200. For example, the housing 300 may accommodate the lens barrel 100 therein. The housing 300 may be configured to absorb the heat generated by the substrate 200 or the lens barrel 100 or to transfer the heat outward. For example, the housing 300 may absorb the heat generated by the lens barrel 100 or the substrate 200. The housing 300 may be formed of a material with high thermal conductivity to enable heat transfer. For example, the housing 300 may be formed of a metal material. However, the material of the housing 300 is not limited to metal. One side of the housing 300 may be formed to facilitate contact with the surface of the first heat transfer member 410. For example, one side of the housing 300 may be formed to be substantially flat.

[0088] As described at the outset, electronic components or the external environment may overheat the camera module 14. For example, light incident through the lens 110 may overheat the lens barrel 100 and the housing 300, and driving of electronic components including the image sensor 210 may overheat the substrate 200.

[0089] The camera module 14 according to this example includes a heat transfer member 400 to prevent the camera module 14 from being overheated due to heat generated by the lens barrel 100 , the substrate 200 , and the housing 300 .

[0090] The heat transfer member 400 is configured to quickly transfer the heat generated by the housing 300 and the substrate 200 to the outside. For example, the first heat transfer member 410 may be disposed on the side of the housing 300 to transfer the heat generated by the housing 300 to the first heat dissipation member 510, and the second heat transfer member 420 may be disposed below the substrate 200 to directly transfer the heat generated by the substrate 200 to the second heat dissipation member 520. The first heat transfer member 410 and the second heat transfer member 420 may be firmly coupled to the housing 300 and the substrate 200 by an adhesive. The adhesive may be configured to allow heat transfer. For example, the adhesive may include a material having high thermal conductivity. As a detailed example, the adhesive may include a metal powder having high thermal conductivity, etc.

[0091] The heat transfer member 400 (410, 420) may be formed of a material having a relatively high thermal conductivity. For example, the heat transfer member 400 (410, 420) may be formed of copper, aluminum, an alloy of copper and aluminum, etc. However, the material of the heat transfer member 400 (410, 420) is not limited to the above materials. The heat transfer member 400 may be configured to actively cool the heat generated by the lens barrel 100, the substrate 200, and the housing 300. For example, at least one of the first heat transfer member 410 and the second heat transfer member 420 may be configured as a thermoelectric element using the Peltier effect.

[0092] The heat dissipation member 500 is configured to transfer the heat of the heat transfer member 400 (410, 420) to the outside. For example, the heat dissipation member 500 can absorb the heat of the heat transfer member 400 and release the heat into the air. The heat dissipation member 500 can be configured to facilitate heat dissipation. For example, the heat dissipation member 500 can be formed of a metal material. In addition, the heat dissipation member 500 may include a plurality of heat dissipation fins 502 to increase the surface area in contact with the atmosphere.

[0093] The heat dissipation member 500 may radiate heat from the heat transfer member 400 (410, 420) in different lateral directions centered on the lens 110. Based on the main radiation direction, the heat dissipation member 500 may be divided into a first heat dissipation member 510 and a second heat dissipation member 520. For example, the first heat dissipation member 510 is disposed on the side of the housing 300 to contact the first heat transfer member 410, and the second heat dissipation member 520 may be disposed under the substrate 200 to contact the second heat transfer member 420.

[0094] The first heat dissipation member 510 is configured to dissipate heat from the first heat transfer member 410 to one side of the camera module 14, and the second heat dissipation member 520 may be configured to dissipate heat from the second heat transfer member 420 to the other side of the camera module 14. The first heat dissipation member 510 and the second heat dissipation member 520 may be integrally formed. However, the first heat dissipation member 510 and the second heat dissipation member 520 do not necessarily have to be integrally formed. For example, the first heat dissipation member 510 and the second heat dissipation member 520 may also be formed to be separated from each other.

[0095] The camera module 14 may further include an airtight member 700 and outer housings 810 and 820 .

[0096] The airtight member 700 is configured to block moisture from penetrating into the camera module 14. For example, the airtight member 700 is configured to block moisture from penetrating the coupling portion between the substrate 200 and the housing 300. In addition, the airtight member 700 may be configured to block moisture from penetrating the coupling portion between the lens barrel 100 and the housing 300. In this example, the airtight member 700 may be disposed on the coupling portion between the substrate 200 and the housing 300 and the coupling portions between the heat transfer members 410 and 420 and the heat dissipation members 510 and 520, respectively.

[0097] The outer shells 810 and 820 are configured to protect the lens barrel 100, the substrate 200 and the housing 300 from external impact. In addition, the outer shells 810 and 820 can be configured to align the positions of the lens barrel 100, the substrate 200 and the housing 300. The outer shells 810 and 820 can be composed of a first outer shell 810 and a second outer shell 820. The first outer shell 810 is used to align the positions of the lens barrel 100, the substrate 200 and the housing 300, and the second outer shell 820 can be used to protect the lens barrel 100, the substrate 200 and the housing 300 from external vibration. A lead-out portion 822 for leading out a connection terminal can be formed on one side of the second outer shell 820.

[0098] In the camera module 14 configured as above, since the heat generated by the substrate 200 and the housing 300 is quickly released to the outside of the camera module 14 through the heat transfer members 410 and 420 and the heat dissipation members 510 and 520, overheating of the camera module 14 can be significantly reduced.

[0099] As described above, in the camera module according to the example, a phenomenon in which resolution is degraded due to heat generated by internal components may be eliminated.

[0100] Furthermore, since the camera module according to the example can quickly discharge heat generated by internal components to the outside, it can process high-resolution imaging and photographing with constant quality.

[0101] Although specific exemplary embodiments have been shown and described above, it will be apparent after understanding the present disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein should be interpreted in a descriptive sense only, and not for limiting purposes. The description of the features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order, and / or if the components in the described system, architecture, device, or circuit are combined in a different manner and / or replaced or supplemented with other components or their equivalents. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in the present disclosure.

Claims

1. A camera module, comprising: A lens barrel configured to receive a lens disposed in the direction of the optical axis; a substrate on which an image sensor is disposed; a housing configured to receive the lens barrel and contact the substrate; a heat transfer member configured to contact an exterior of the housing; as well as A heat dissipation member is configured to contact the heat transfer member and dissipate heat from the heat transfer member in different lateral directions around the lens.

2. The camera module according to claim 1, wherein: The housing includes a heat dissipation unit configured to be in surface contact with the heat transfer member.

3. The camera module according to claim 1, wherein: The heat dissipation member is configured to radiate heat in a direction of an optical axis of the lens and in a direction perpendicular to the optical axis.

4. The camera module according to claim 1, wherein: The heat dissipation component comprises: A first heat dissipation member extending in the longitudinal direction of the housing; and The second heat dissipation member extends in the longitudinal direction of the substrate. 5 . The camera module according to claim 4 , further comprising a heat insulating member disposed between the substrate and the second heat dissipation member.

6. The camera module according to claim 1, wherein: The heat dissipation component comprises: a first heat dissipation member disposed on a first side of the housing; and The second heat dissipation component is disposed on the second side of the housing.

7. The camera module according to claim 1, wherein: The heat dissipation component comprises: a first heat dissipation member disposed on a first side of the housing; a second heat dissipation member disposed on a second side of the housing; and The third heat dissipation component is disposed on the third side of the housing.

8. The camera module according to claim 1, wherein: The heat dissipation member includes one or more heat dissipation fins to increase the heat dissipation surface area.

9. The camera module according to claim 1, wherein: The heat transfer member includes a thermoelectric element.

10. A camera module, comprising: a substrate on which an image sensor is disposed; A lens barrel configured to receive a lens disposed in the direction of the optical axis; a housing configured to receive the lens barrel; a first heat transfer member configured to contact the substrate; a second heat transfer member configured to contact the housing but not the substrate; as well as The first heat radiating member and the second heat radiating member are configured to contact the first heat transfer member and the second heat transfer member, respectively, and configured to radiate heat from the first heat transfer member and the second heat transfer member.

11. The camera module according to claim 10, wherein: The first heat radiating member and the second heat radiating member are integrally provided.

12. The camera module according to claim 10, wherein: At least one of the first heat transfer member and the second heat transfer member is composed of a thermoelectric element.

13. A camera module, comprising: A lens barrel configured to receive a lens disposed in the direction of the optical axis; a substrate on which an image sensor is disposed; a housing configured to receive the lens barrel and to contact the substrate; a heat transfer member arranged to contact the exterior of the housing; as well as The heat dissipation member contacts the heat transfer member, is disposed outside the housing and extends along at least one side surface of the housing, and is configured to dissipate heat from the heat transfer member. 14 . The camera module of claim 13 , further comprising a heat dissipation unit disposed between the housing and the heat transfer member and in contact with the housing and the heat transfer member.

15. The camera module according to claim 13, wherein: The heat dissipation member includes a first heat dissipation member extending in a first direction and a second heat dissipation member extending in a second direction.

16. The camera module according to claim 15, wherein: The first direction and the second direction are different from each other.

17. The camera module according to claim 16, wherein: The first direction or the second direction is in the optical axis direction of the lens.

18. The camera module according to claim 15, wherein: The first heat dissipation member and the second heat dissipation member include a first fin and a second fin extending away from the housing, respectively, and wherein the first fin and the second fin are parallel to each other or perpendicular to each other.

19. The camera module according to claim 15, wherein: The first heat radiating member and the second heat radiating member are integral with each other or separate from each other.

20. The camera module according to claim 13, wherein: The heat transfer member includes a thermoelectric element.

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