Electronic modules

Abstract

The present invention relates to an electronic module. The electronic module (101) comprises: a substrate (1) having a first surface (1a); a first component (3a) and a second component (3b) mounted on the first surface (1a); and a wire (4) configured to span both the first component (3a) and the second component (3b). One end and the other end of the wire (4) are both connected to the first surface (1a), and the wire (4) is grounded. When viewed from a direction perpendicular to the first surface (1a), the first component (3a) is located closer to the one end than the second component (3b), the portion (25) of the wire (4) farthest from the first surface (1a) is located closer to the one end than the other end, and the upper surface of the second component (3b) is located lower than the upper surface of the first component (3a).

Description

Technical Field

[0001] The present invention relates to an electronic module. Background Art

[0002] A structure for wire bonding for the purpose of shielding electromagnetic waves is described in U.S. Patent No. 9,761,537B2 (Patent Document 1). Figure 7 and Figure 9 , there is also described a structure in which wire bonding is performed in a manner that straddles a mounting component.

[0003] Wire bonding is typically performed in two stages: first bonding and second bonding. The following explanation assumes that a wire is used to electrically connect the first and second target parts. First, in the first bonding, the tip of the wire held by a tool is melted and formed into a ball, and then bonding is performed to the first target part. Next, in the second bonding, the wire, one end of which has already been bonded to the first target part in the first bonding, is routed and pressed against the second target part at a point midway, melting and bonding it. The subsequent wire is then cut.

[0004] Patent Document 1: U.S. Patent No. 9,761,537B2

[0005] Typically, the wire tilt differs between the first bonding site and the second bonding site. While the first bonding site allows for bonding with the wire extending nearly perpendicularly from the first target site, the second bonding site forms a smaller angle with the wire surface. In other words, the wire is tilted. When both the first and second target sites are on the substrate surface, additional space is required near the second bonding site for wire bonding, given the tilt of the wire at the second bonding site. Summary of the Invention

[0006] Therefore, an object of the present invention is to provide an electronic module that can realize cell shielding by wires and effectively utilize the space along the surface of a substrate.

[0007] To achieve the above-mentioned object, the electronic module according to the present invention comprises: a substrate having a first surface; a first component and a second component mounted on the first surface; and a conductive wire arranged to span both the first and second components. One end and the other end of the conductive wire are both connected to the first surface, and the conductive wire is grounded. When viewed perpendicular to the first surface, the first component is located closer to the first end than the second component, the portion of the conductive wire farthest from the first surface is located closer to the first end than the other end, and the top surface of the second component is located lower than the top surface of the first component.

[0008] According to the present invention, although the other end of the wire tends to become lower, the second component 3b, which is a component with a lower height, is located closer to the other end than the first component. Therefore, the space below the wire 4 can be efficiently utilized to achieve wire-based compartment shielding and effectively utilize the space along the surface of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a perspective view of the electronic module in accordance with the first embodiment of the present invention.

[0010] Figure 2 This is a plan view of the electronic module in accordance with the first embodiment of the present invention.

[0011] Figure 3 is with Figure 2 The cross-sectional view related to the III-III line in the figure.

[0012] Figure 4 This is a plan view of a state in which the upper surface portion of the shielding film and the sealing resin are removed from the electronic module in accordance with the first embodiment of the present invention.

[0013] Figure 5 This is an enlarged view of the vicinity of a first bonding end of a wire included in the electronic module according to the first embodiment of the present invention.

[0014] Figure 6 This is an enlarged view of the vicinity of the second bonding end of the wire included in the electronic module according to the first embodiment of the present invention.

[0015] Figure 7 This is a plan view of a state in which the upper surface portion of the shielding film and the sealing resin are removed from the electronic module in accordance with the second embodiment of the present invention.

[0016] Figure 8 This is a plan view of a state in which the upper surface portion of the shielding film and the sealing resin are removed from the electronic module in accordance with the third embodiment of the present invention.

[0017] Figure 9 This is a cross-sectional view of an electronic module in accordance with a third embodiment of the present invention.

[0018] Figure 10 This is a plan view of a state in which the upper surface portion of the shielding film and the sealing resin are removed from the electronic module in accordance with the fourth embodiment of the present invention.

[0019] Figure 11 This is a cross-sectional view of an electronic module in accordance with a fourth embodiment of the present invention.

[0020] Figure 12This is an explanatory diagram of the structure near the second component of a modified example of the electronic module according to the fourth embodiment of the present invention.

[0021] Figure 13 This is a cross-sectional view of an electronic module in accordance with a fifth embodiment of the present invention.

[0022] Figure 14 This is a partial side view of the vicinity of the second component of the electronic module according to the fifth embodiment of the present invention.

[0023] Figure 15 This is a partial perspective view of the vicinity of the second component of the electronic module according to the fifth embodiment of the present invention.

[0024] Figure 16 This is a cross-sectional view of an electronic module in accordance with a sixth embodiment of the present invention. DETAILED DESCRIPTION

[0025] The dimensional ratios shown in the drawings do not necessarily represent reality; for ease of explanation, they may be exaggerated. In the following description, the concepts of "up" and "down" do not necessarily imply absolute up or down; instead, they may refer to relative up or down in the illustrated posture. For ease of explanation, the following cross-sectional views sometimes show multiple components simultaneously in positions that would not normally appear in the same cross-section.

[0026] (Implementation 1)

[0027] Reference Figures 1 to 4 , an electronic module according to embodiment 1 of the present invention is described. Figure 1 A perspective view of the electronic module 101 in this embodiment is shown. The upper surface and side surfaces of the electronic module 101 are covered with a shielding film 8 . Figure 2 1 shows a top view of the electronic module 101. Figure 2 As shown, the electronic module 101 includes a first component 3a, a second component 3b, and components 3c, 3d, and 3e therein. Figure 3 Represents Figure 2 The cross-sectional view related to the III-III line in the figure.

[0028] The electronic module 101 includes: a substrate 1 having a first surface 1a; a first component 3a and a second component 3b mounted on the first surface 1a; and a wire 4 configured to span both the first component 3a and the second component 3b. The first component 3a is, for example, an IC component. More specifically, the first component 3a is, for example, an LNA (low noise amplifier). The first component 3a may also be, for example, a PA (power amplifier). The second component 3b is a chip component. Specifically, the second component 3b may be, for example, a chip capacitor or a chip resistor. In addition, the second component 3b, together with the first component 3a, forms a shielded object within the electronic module, that is, it may be, for example, a transmitting system circuit, a receiving system circuit, or the like.

[0029] Substrate 1 is a wiring substrate. Substrate 1 is formed by stacking multiple insulating layers 2. Substrate 1 can be a ceramic multilayer substrate or a resin multilayer substrate such as a printed circuit board. Substrate 1 has a second surface 1b as the surface opposite to the first surface 1a. One end and the other end of the wire 4 are both connected to the first surface 1a. The "one end" mentioned here is the first bonding end 41. The "other end" is the second bonding end 42. That is, the above-mentioned one end is the starting side of the wire bonding, and the above-mentioned other end is the end side of the wire bonding. The first bonding end 41 is connected to the pad electrode 18a. The second bonding end 42 is connected to the pad electrode 18b. The wire 4 is grounded.

[0030] A first sealing resin 6a is formed to cover all components mounted on the first surface 1a. A shielding film 8 is formed to cover the upper surface and side surfaces of the first sealing resin 6a, as well as the side surfaces of the substrate 1. The shielding film 8 is grounded. A conductor pattern 16 is disposed within the substrate 1. Conductor vias 15 are electrically connected to the conductor pattern 16. External terminals 17 are provided on the second surface 1b of the substrate 1.

[0031] Figure 4 The figure shows the state of being viewed from directly above with the upper surface portion of the shielding film 8 and the sealing resin 6a removed. When viewed from a direction perpendicular to the first surface 1a, the first component 3a is located closer to the above-mentioned end than the second component 3b. Figure 3 As shown, the portion 25 of the lead 4 that is farthest from the first surface 1a is located closer to the one end than to the other end. The upper surface of the second member 3b is located lower than the upper surface of the first member 3a.

[0032] In this embodiment, by configuring the conductor 4 to span both the first component 3a and the second component 3b, compartment shielding is achieved relative to the first component 3a and the second component 3. At this time, the portion 25 of the conductor 4 farthest from the first surface 1a is located closer to the above-mentioned one end than the above-mentioned other end, so the conductor 4 tends to become lower near the other end. However, when viewed from a direction perpendicular to the first surface 1a, the first component 3a, which is the taller component, is located closer to the above-mentioned one end than the second component 3b, and the second component 3b, which is the shorter component, is located closer to the other end than the first component 3a. As a result, the space below the conductor 4 can be efficiently utilized to configure the first component 3a and the second component 3b. Therefore, in this embodiment, compartment shielding based on the conductor 4 can be achieved, and the space along the surface of the substrate 1 can be effectively utilized.

[0033] The case where both ends of the lead wire 4 are connected to portions of the first surface 1 a will be described in further detail. Figure 5 An enlarged view shows the portion where the first bonding end 41, one end, is electrically connected to the first surface 1a. The first bonding end 41 is connected to the first surface 1a via the pad electrode 18a. A spherical portion is formed at the first bonding end 41. At the first bonding end 41, the wire 4 extends at an angle A relative to the first surface 1a.

[0034] Figure 6 This is an enlarged view of the portion where the second bonding end 42, the other end, is connected to the first surface 1a. The second bonding end 42 is connected to the first surface 1a via the pad electrode 18b. At the second bonding end 42, the wire 4 extends at an angle B relative to the first surface 1a. Here, angle A is greater than angle B. That is, the wire is tilted more on the second bonding side than on the first bonding side.

[0035] As shown here, it is preferred that the one end is connected to the first surface 1 a at a first angle A, and the other end is connected to the first surface 1 a at a second angle B smaller than the first angle A.

[0036] As shown in this embodiment, the electronic module 101 preferably includes a sealing resin that seals the first component 3a and the second component 3b, and a shielding film 8 formed to cover the sealing resin. Here, the first sealing resin 6a corresponds to the "sealing resin."

[0037] (Implementation Method 2)

[0038] Reference Figure 7 The electronic module according to the second embodiment of the present invention will be described. The basic structure of the electronic module 102 in this embodiment is the same as that of the electronic module 101 described in the first embodiment, but it has the following structure. Figure 7The figure shows the electronic module 102 in this embodiment, viewed from directly above, with the upper surface portion of the shielding film 8 and the sealing resin 6a removed. In the first embodiment, the plurality of conductive wires 4 were arranged parallel to the sides of the first component 3a. However, in this embodiment, the plurality of conductive wires 4 are arranged obliquely relative to the sides of the first component 3a. In other words, when viewed from a direction perpendicular to the first surface 1a, the conductive wires 4 are arranged obliquely relative to the sides of the first component 3a.

[0039] This embodiment also achieves the effects described in Embodiment 1. Furthermore, in this embodiment, since the plurality of conductors 4 are arranged obliquely relative to the sides of the first component 3 a, any end of the conductors 4 can be arranged along more sides of the first component 3 a. This further strengthens the cell shielding.

[0040] (Implementation 3)

[0041] Reference Figures 8 and 9 , an electronic module according to a third embodiment of the present invention is described. Figure 8 The electronic module 103 according to the present embodiment is shown as viewed from directly above in a state where the upper surface portion of the shielding film 8 and the sealing resin 6 a are removed. Figure 9 1 is a cross-sectional view of the electronic module 103. The basic structure of the electronic module 103 in this embodiment is the same as that of the electronic module 101 described in the first embodiment, but it has the following structure.

[0042] In electronic module 103, a first component 3a1 and a second component 3b1 are mounted on first surface 1a. Wire 4 is arranged to span both first and second components 3a1 and 3b1. When viewed from above, first component 3a1 is smaller than second component 3b1. The top surface of first component 3a1 is higher than the top surface of second component 3b1. Second component 3b1 is, for example, an IC. More specifically, first component 3a is, for example, an LNA (low-noise amplifier). First component 3a may also be, for example, a PA (power amplifier).

[0043] In this embodiment as well, the effects described in the first embodiment can be obtained.

[0044] (Implementation 4)

[0045] Reference Figures 10 and 11 , an electronic module according to a fourth embodiment of the present invention is described. Figure 10 1 and 2. The electronic module 104 of the present embodiment is shown as viewed from directly above in a state where the upper surface portion of the shielding film 8 and the sealing resin 6a are removed. Figure 111 is a cross-sectional view of the electronic module 104. The basic structure of the electronic module 104 in this embodiment is the same as that of the electronic module 101 described in the first embodiment, but it has the following structure.

[0046] In electronic module 104, wire 4 abuts and bends against second component 3b. It also abuts and bends against shoulder 63 of second component 3b. In the example shown here, shoulder 63 is an insulating portion, eliminating the possibility of a short circuit between wire 4 and second component 3b. Alternatively, even if the shoulder is a conductive portion, as long as it is a ground electrode, there is no possibility of a short circuit even if the wire abuts against the shoulder.

[0047] In this embodiment, the effects described in the first embodiment can also be obtained. In this embodiment, since the wire 4 abuts against the second component 3b and bends, the other end of the wire 4 can be connected to the first surface 1a at a steeper angle. Figure 6 The angle B of the portion shown. In this way, the limited space of the first surface 1a can be effectively utilized.

[0048] (Variation)

[0049] exist Figure 11 In the example, a general rectangular second component 3b is shown, but it can also be used Figure 12 The second component 3b2 shown in the figure is replaced by a component such as the second component 3b2. The second component 3b2 is a component having a rectangular parallelepiped structure and having electrodes formed at both ends in the longitudinal direction. The second component 3b2 includes electrodes 61a, 61b and a non-electrode portion 62. The non-electrode portion 62 is a portion sandwiched between the electrodes 61a, 61b. When such a second component 3b2 is installed, as shown in FIG. Figure 12 As shown, the lead wire 4 abuts against the shoulder 63 of the non-electrode portion 62 of the second component 3b2. If the lead wire 4 abuts against the shoulder 63 of the non-electrode portion 62, avoiding the electrode, an undesirable electrical connection is prevented, and the lead wire 4 can be bent. The structure of the second component 3b2 shown here is only an example.

[0050] (Implementation 5)

[0051] Reference Figures 13 to 15 , an electronic module according to a fifth embodiment of the present invention is described. Figure 13 A cross-sectional view of an electronic module 105 in this embodiment is shown. The basic structure of the electronic module 105 in this embodiment is the same as that of the electronic module 104 described in the fourth embodiment, but it has the following structure. Figure 14 and Figure 15 The second member 3 b includes a first electrode 61 as an electrode for connection to the substrate 1 .

[0052] The second component 3b has a first electrode 61. A second electrode 64 electrically connected to the first electrode 61 is disposed on the first surface 1a. The second electrode 64 extends along the first surface 1a to include a protruding portion 64e extending outward from the projection area of ​​the second component 3b relative to the first surface 1a. The second bonding end 42, which serves as the other end, is connected to the protruding portion 64e. Both the first electrode 61 and the second electrode 64 can be GND electrodes.

[0053] In this embodiment, the second electrode 64 includes the protruding portion 64 e , and the second bonding end 42 as the other end is connected to the protruding portion 64 e , thereby making the electrical connection of the second bonding end 42 of the wire 4 more reliable.

[0054] (Implementation 6)

[0055] Reference Figure 16 , an electronic module according to a sixth embodiment of the present invention is described. Figure 16 A cross-sectional view of an electronic module 106 in this embodiment is shown. The basic structure of the electronic module 106 in this embodiment is the same as that of the electronic module 101 described in the first embodiment, but it has the following structure.

[0056] The electronic module 106 has a double-sided mounting structure. Specifically, in the electronic module 106, the substrate 1 has a second surface 1b opposite the first surface 1a, and at least one component is mounted on the second surface 1b. Specifically, in the electronic module 106, as an example, components 3f and 3g are mounted on the second surface 1b of the substrate 1. Components 3f and 3g are sealed with a second sealing resin 6b. External terminals 24 are provided on the lower surface of the electronic module 104. In the example shown here, the lower surface of the columnar conductor 23 serves as the external terminal 24. The columnar conductor 23 is disposed on the second surface 1b. The columnar conductor 23 can be any of a pin, an electrode formed by plating, or a metal block. The columnar conductor 23 penetrates the second sealing resin 6b. A solder bump may also be connected to the lower end of the columnar conductor 23. The structure of the external terminal 24 shown here is merely an example and is not limited thereto. Bumps may also be provided in place of the columnar conductor 23.

[0057] This embodiment can also achieve the same effects as those described in Embodiment 1. In this embodiment, since a double-sided mounting structure is employed, more components can be mounted on the substrate 1 .

[0058] Furthermore, a plurality of the above-described embodiments may be appropriately combined and adopted.

[0059] The embodiments disclosed herein are by way of illustration only and are not restrictive in any respect. The scope of the present invention is defined by the appended claims and is intended to encompass all modifications within the scope and meaning of the appended claims.

[0060] Description of Reference Numerals

[0061] 1…substrate; 1a…first surface; 1b…second surface; 2…insulating layer; 3a, 3a1…first component; 3b, 3b1, 3b2…second component; 3c, 3d, 3e, 3f, 3g…component; 4…lead; 6a…first sealing resin; 6b…second sealing resin; 8…shielding film; 15…conductor via; 16…conductor pattern; 17, 24…external terminal; 18, 18a, 18b…pad electrode; 23…columnar conductor; 25…(furthest) portion; 41…first joining end; 42…second joining end; 61…first electrode; 61a, 61b…electrode (of the second component); 62…non-electrode portion (of the second component); 63…shoulder (of the second component); 64…second electrode; 64e…extending portion; 101, 102, 103, 104, 105, 106…electronic module.

Claims

1. An electronic module comprising: a substrate having a first surface; A first component and a second component are mounted on the first surface; and The conductive wire is arranged to cross both the first component and the second component. One end and the other end of the wire are both connected to the first surface. The above wire is grounded, When viewed from a direction perpendicular to the first surface, the first component is located closer to the one end than the second component. The portion of the wire farthest from the first surface is located closer to the one end than the other end. The upper surface of the second member is located lower than the upper surface of the first member.

2. The electronic module according to claim 1, wherein: The one end is connected to the first surface at a first angle, and the other end is connected to the first surface at a second angle, wherein the second angle is smaller than the first angle.

3. The electronic module according to claim 1, wherein: The one end is the starting point of wire bonding.

4. The electronic module according to claim 2, wherein: The one end is the starting point of wire bonding.

5. The electronic module according to any one of claims 1 to 4, wherein: The lead wire is bent while in contact with the second member. The electronic module according to claim 5 , wherein: The above-mentioned second component has a first electrode, and a second electrode electrically connected to the above-mentioned first electrode is arranged on the above-mentioned first surface. The above-mentioned second electrode extends along the above-mentioned first surface so as to include an extension portion extending outward from the projection area of ​​the above-mentioned second component relative to the above-mentioned first surface, and the above-mentioned other end is connected to the above-mentioned extension portion.

7. The electronic module according to any one of claims 1 to 4, wherein: The lead wire is arranged to be inclined with respect to a side of the first member when viewed from a direction perpendicular to the first surface.

8. The electronic module according to any one of claims 1 to 4, wherein: The device includes a sealing resin that seals the first member and the second member, and a shielding film formed to cover the sealing resin.

9. The electronic module according to any one of claims 1 to 4, wherein: The substrate has a second surface opposite to the first surface, and at least one component is mounted on the second surface.

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