Display panel, manufacturing method thereof, and display device

Abstract

The present application discloses a display panel and its manufacturing method and display device, which belong to the field of display technology. The display panel includes: a substrate, a light-emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer. Since the first auxiliary metal layer and the second auxiliary metal layer are both prepared by using metal materials. Therefore, after the first auxiliary metal layer and the second auxiliary metal layer are overlapped, the tightness of the connection between the two is better. In this way, the tightness of the connection between the first inorganic layer and the second inorganic layer located between the first auxiliary metal layer and the second auxiliary metal layer can be improved by overlapping the first auxiliary metal layer and the second auxiliary metal layer. In this way, it is not easy for the first inorganic layer and the second inorganic layer in the non-display area to separate the film layer, which effectively reduces the probability of the first inorganic layer and the second inorganic layer separating the film layer, thereby effectively improving the yield rate of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, display devices are increasingly used. Commonly used display devices include smart phones, tablet computers, televisions, and monitors.

[0003] A display device typically includes a display panel and a driver chip. The display panel has a display area and a non-display area. The display panel may include: multiple light-emitting devices located in the display area; and signal leads located in the non-display area. The signal leads may be electrically connected to the light-emitting devices, and the driver chip may be bound to the non-display area and electrically connected to the signal leads. In this way, the driver chip can provide electrical signals to the light-emitting devices in the display area via the signal leads, enabling the display panel to display the corresponding image.

[0004] However, during the process of binding the driver chip to the non-display area of ​​the display panel, the inner film layer of the display panel is very likely to separate, resulting in a low yield rate of the display panel. Summary of the Invention

[0005] The embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device. These embodiments can address the low yield rate problem of display panels in the prior art. The technical solution is as follows:

[0006] In one aspect, a display panel is provided, the display panel having a display area and a non-display area located outside the display area, the display panel comprising:

[0007] a substrate; a light-emitting device located in the display area;

[0008] a first inorganic layer and a second inorganic layer stacked in the non-display area, wherein the first inorganic layer is disposed in the same layer as the inorganic layer located on a side of the light-emitting device facing away from the substrate, and the second inorganic layer is disposed in the same layer as the inorganic layer located on a side of the light-emitting device facing the substrate;

[0009] Also, a first auxiliary metal layer and a second auxiliary metal layer are located in the non-display area, the first auxiliary metal layer is located on the side of the first inorganic layer away from the second inorganic layer, the second auxiliary metal layer is located on the side of the second inorganic layer away from the first inorganic layer, the orthographic projection of the first auxiliary metal layer on the substrate and the orthographic projection of the second auxiliary metal layer on the substrate at least partially overlap, and the first auxiliary metal layer and the second auxiliary metal layer overlap.

[0010] Optionally, the first inorganic layer has a first via hole, the second inorganic layer has a second via hole connected to the first via hole, and the first auxiliary metal layer passes through the first via hole and the second via hole in sequence and then overlaps with the second auxiliary metal layer.

[0011] Optionally, there are multiple first via holes, and the orthographic projections of the multiple first via holes on the substrate are evenly distributed within the orthographic projection of the first auxiliary metal layer on the substrate.

[0012] Optionally, the second inorganic layer has a snap-fit ​​groove, and the first inorganic layer has a snap-fit ​​protrusion located in the snap-fit ​​groove.

[0013] Optionally, an orthographic projection of the clamping groove on the substrate does not overlap with an orthographic projection of an overlapping position of the first auxiliary metal layer and the second auxiliary metal layer on the substrate.

[0014] Optionally, the shape of the orthographic projection of the clamping groove on the substrate is at least one of a circle, a square, a bar and a ring.

[0015] Optionally, the display panel further includes: a third auxiliary metal layer located on a side of the second auxiliary metal layer facing away from the first auxiliary metal layer, and a third inorganic layer located between the third auxiliary metal layer and the second auxiliary metal layer;

[0016] An orthographic projection of the third auxiliary metal layer on the substrate at least partially overlaps with an orthographic projection of the second auxiliary metal layer on the substrate, and the third auxiliary metal layer overlaps with the second auxiliary metal layer.

[0017] Optionally, the third inorganic layer has a third via hole, and the second auxiliary metal layer passes through the third via hole and overlaps with the third auxiliary metal layer.

[0018] Optionally, a binding area is provided in the non-display area, and a first auxiliary area and / or a second auxiliary area are provided around the binding area;

[0019] The first auxiliary metal layer, the second auxiliary metal layer and the third auxiliary metal layer are simultaneously disposed in the first auxiliary region, and the first auxiliary metal layer and the second auxiliary metal layer are simultaneously disposed in the second auxiliary region.

[0020] Optionally, the binding area is a long rectangular area, the number of the first auxiliary areas is four, and the four first auxiliary areas are respectively arranged around the four corners of the binding area; the number of the second auxiliary areas is two, and the two second auxiliary areas are arranged around the two short sides of the binding area.

[0021] Optionally, an auxiliary removal area arranged around the binding area is further provided in the non-display area, the positive projection of the first inorganic layer on the substrate does not overlap with the auxiliary removal area, and the first auxiliary area and the second auxiliary area are both closer to the binding area than the auxiliary removal area.

[0022] Optionally, the display panel further includes: a pixel driving circuit electrically connected to the light-emitting device, an encapsulation layer for encapsulating the light-emitting device, and a touch layer located on a side of the encapsulation layer away from the light-emitting device;

[0023] The first auxiliary metal layer is provided in the same layer and made of the same material as the conductive layer in the touch layer, and the second auxiliary metal layer is provided in the same layer and made of the same material as part of the electrodes in the pixel driving circuit.

[0024] Optionally, a portion of the first inorganic layer is provided in the same layer and made of the same material as the inorganic encapsulation layer in the encapsulation layer, and another portion of the first inorganic layer is provided in the same layer and made of the same material as the insulating layer in the touch layer;

[0025] The second inorganic layer is provided on the same layer as the insulating layer in the pixel driving circuit and is made of the same material.

[0026] In another aspect, a method for manufacturing a display panel is provided, the method comprising:

[0027] forming a light emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer on a substrate;

[0028] The display panel has a display area and a non-display area located outside the display area, the light-emitting device is located in the display area, and the first inorganic layer, the second inorganic layer, the first auxiliary metal layer, and the second auxiliary metal layer are all located in the non-display area;

[0029] The first inorganic layer is provided in the same layer as the inorganic layer located on the side of the light-emitting device facing away from the substrate, and the second inorganic layer is provided in the same layer as the inorganic layer located on the side of the light-emitting device facing the substrate;

[0030] The first auxiliary metal layer is located on the side of the first inorganic layer facing away from the second inorganic layer, the second auxiliary metal layer is located on the side of the second inorganic layer facing away from the first inorganic layer, the orthographic projection of the first auxiliary metal layer on the substrate and the orthographic projection of the second auxiliary metal layer on the substrate at least partially overlap, and the first auxiliary metal layer and the second auxiliary metal layer overlap.

[0031] On the other hand, a display device is provided, comprising: a driver chip, and a display panel electrically connected to the driver chip, wherein the display panel is any one of the display panels described above.

[0032] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0033] A display panel includes: a substrate, a light-emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer, and a second auxiliary metal layer. Since the first auxiliary metal layer and the second auxiliary metal layer are both made of metal materials, the tightness of the connection between the first auxiliary metal layer and the second auxiliary metal layer is better after the first auxiliary metal layer and the second auxiliary metal layer are overlapped. In this way, the tightness of the connection between the first inorganic layer and the second inorganic layer located between the first auxiliary metal layer and the second auxiliary metal layer can be improved by overlapping the first auxiliary metal layer and the second auxiliary metal layer. In this way, in the subsequent process of binding the driver chip to the display panel, or in the process of tearing off the protective film adhered to the back of the display panel, it is not easy for the first inorganic layer and the second inorganic layer in the non-display area to separate from each other, which effectively reduces the probability of separation between the first inorganic layer and the second inorganic layer, thereby effectively improving the yield rate of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 This is a top view of a display device provided by the related art;

[0036] Figure 2 yes Figure 1 A schematic cross-sectional view of the display panel taken at AA' is shown;

[0037] Figure 3 This is an effect diagram showing the phenomenon of film separation between the first inorganic layer and the second inorganic layer;

[0038] Figure 4 is a top view of a display panel provided in an embodiment of the present application;

[0039] Figure 5 yes Figure 4 Schematic diagram of the film structure of the display panel at BB' is shown;

[0040] Figure 6 is a Figure 5A local enlarged view of R is shown;

[0041] Figure 7 is another Figure 5 A local enlarged view of R is shown;

[0042] Figure 8 This is a partial top view of a non-display area in a display panel provided by an embodiment of the present application;

[0043] Figure 9 It's another Figure 5 A local enlarged view of R is shown;

[0044] Figure 10 is a partial top view of a non-display area in another display panel provided by an embodiment of the present application;

[0045] Figure 11 This is a partial top view of a non-display area in another display panel provided by an embodiment of the present application;

[0046] Figure 12 yes Figure 11 Schematic diagram of the film structure at F-F' is shown;

[0047] Figure 13 Schematic diagram of a film structure of a display panel provided in an embodiment of the present application;

[0048] Figure 14 This is a top view of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0050] In related art, please refer to Figure 1 , Figure 1 This is a top view of a display device provided by related art. The display device generally includes a display panel 00 and a driver chip 11. The display panel 00 has a display area 0a and a non-display area 0b located outside the display area 0a. The display panel 00 may include a substrate 01, multiple light-emitting devices (not shown) located within the display area 0a, and multiple signal leads 02 located within the non-display area 0b.

[0051] Among them, one end of the signal lead 02 can be electrically connected to the light-emitting device. For example, one end of the signal lead 02 can be electrically connected to the light-emitting device through a signal line (for example, a data line and a power signal line); the other end of the signal lead 02 can be electrically connected to the driver chip 11. In this way, the driver chip 11 provides an electrical signal to the signal lead 02 so that the light-emitting device in the display area 0a emits corresponding light, thereby enabling the display panel 00 to display the corresponding image. Here, when the display device is a folding display device, in order to facilitate driving both sides of the folding display device, driver chips need to be provided on both sides of the display panel in the folding display device so that the brightness of the image displayed by the folding display device is more uniform.

[0052] To see the film structure of the display panel 00 more clearly, please refer to Figure 2 , Figure 2 yes Figure 1 A schematic cross-sectional view of the display panel at A-A' is shown. The display panel 00 may further include: a first inorganic layer 03 and a second inorganic layer 04 located in the non-display area 0b. The first inorganic layer 03 refers to an inorganic layer arranged on the same layer as the light-emitting device located in the display panel 00 on the side away from the substrate 01, and the second inorganic layer 04 refers to an inorganic layer arranged on the same layer as the light-emitting device located in the display panel 00 on the side close to the substrate 01. For example, the first inorganic layer 03 may be an inorganic layer arranged on the same layer as the inorganic encapsulation layer in the encapsulation layer in the display panel 00, and / or an inorganic layer arranged on the same layer as the insulating layer in the touch layer in the display panel 00. The second inorganic layer 04 may be an inorganic layer arranged on the same layer as the insulating layer in the pixel driving circuit in the display panel 00.

[0053] The display panel 00 may further include: a connection terminal 05 located within the non-display area 0b and electrically connected to the signal lead 02. The driver chip 11 may be fixed to the display panel 00 through a bonding process. After the driver chip 11 is bonded to the display panel 00, the signal terminal within the driver chip 11 may be electrically connected to the connection terminal 05 within the display panel 00. During the bonding process of the driver chip 11 within the non-display area 0b of the display panel 00, a certain pressing force needs to be applied to the driver chip 11 so that the signal terminal within the driver chip 11 and the connection terminal 05 can be electrically connected via the conductive particles L.

[0054] However, since the first inorganic layer 03 and the second inorganic layer 04 in the display panel 00 are located on either side of the light-emitting device, in order not to affect the light emission of the light-emitting device, the first inorganic layer 03 needs to be prepared using a different preparation process from the second inorganic layer 04 during the preparation of the display panel 00, resulting in a poor connection between the first inorganic layer 03 and the second inorganic layer 04. Thus, when the driver chip 11 is attached to the non-display area 0b of the display panel 00, after applying pressure to the driver chip 11, the first inorganic layer 03 and the second inorganic layer 04 in the non-display area 0b will both be subjected to a certain degree of pressure, causing the first inorganic layer 03 and the second inorganic layer 04 in the non-display area 0b to easily separate, thereby resulting in a low yield rate for the display panel 00.

[0055] Furthermore, a protective film is typically attached to the back of the display panel 00 (i.e., the side of the substrate 01 in the display panel 00 facing away from the light-emitting device). After the driver chip 11 is attached to the display panel 00, the protective film attached to the back of the display panel 00 needs to be removed. Because the area of ​​the non-display area 0b of the display panel 00 not attached to the driver chip 11 has relatively high toughness, the area of ​​the non-display area 0b not attached to the driver chip 11 is subjected to a greater force during the removal of the protective film. This force can also cause separation between the first inorganic layer 03 and the second inorganic layer 04 in the non-display area 0b.

[0056] like Figure 3 As shown, Figure 3 This is a rendering of the film separation phenomenon between the first inorganic layer and the second inorganic layer. Since the force at position P is relatively large during the process of binding the driver chip 11 to the non-display area 0b of the display panel 00, the probability of the film separation phenomenon occurring at position P between the first inorganic layer 03 and the second inorganic layer 04 is relatively high. In addition, since the force applied to position P is relatively large during the process of tearing off the protective film, the probability of the film separation phenomenon occurring at position P between the first inorganic layer 03 and the second inorganic layer 04 is further increased. Furthermore, since the terminal 05 in the non-display area 0b has multiple overlapping metal layers, the height at position Q is relatively large, causing the film separation phenomenon occurring at position P to extend to position Q, and thus causing the film separation phenomenon at position Q to also be very likely to occur.

[0057] In this case, when the film separation phenomenon occurs between the first inorganic layer 03 and the second inorganic layer 04 in the non-display area 0b of the display panel 00, the film separation phenomenon at position P and position Q will extend to the surrounding area, which may cause the film separation phenomenon to occur in the display area 0a of the display panel 00, and then cause the light-emitting device in the display panel 00 to be corroded by water and oxygen and damaged, resulting in a further lower yield of the display panel 00.

[0058] Please refer to Figure 4 , Figure 4 FIG1 is a top view of a display panel provided in an embodiment of the present application. The display panel 000 comprises a display area 00a and a non-display area 00b located outside the display area 00a.

[0059] To see the film structure of the display panel 000 more clearly, please refer to Figure 5 , Figure 5 yes Figure 4 The display panel 000 may include a substrate 100, a light-emitting device (not shown) located in a display area 00a, a stacked first inorganic layer 200 and a second inorganic layer 300 located in a non-display area 00b, and a first auxiliary metal layer 400 and a second auxiliary metal layer 500 located in the non-display area 00b.

[0060] The first inorganic layer 200 can be provided in the same layer as the inorganic layer located on the side of the light-emitting device facing away from the substrate 100, and the second inorganic layer 300 can be provided in the same layer as the inorganic layer located on the side of the light-emitting device facing the substrate 100. For example, when preparing the display panel 000, it is necessary to first prepare the second inorganic layer 300 on the substrate 100, then prepare the light-emitting device, and finally prepare the first inorganic layer 200. To this end, in order not to affect the normal light emission of the subsequent light-emitting device, the first inorganic layer 200 needs to be prepared using a different preparation process from the second inorganic layer 300. For example, the second inorganic layer 300 can be prepared using a high-temperature preparation method, while the first inorganic layer 200 can only be prepared using a low-temperature preparation method.

[0061] In order to more clearly see the positional relationship between the first inorganic layer 200, the second inorganic layer 300, the first auxiliary metal layer 400 and the second auxiliary metal layer 500, please refer to Figure 6 , Figure 6 is a Figure 5A partial enlarged view of R is shown. The first auxiliary metal layer 400 is located on the side of the first inorganic layer 200 facing away from the second inorganic layer 300, and the second auxiliary metal layer 500 is located on the side of the second inorganic layer 300 facing away from the first inorganic layer 200. The orthographic projection of the first auxiliary metal layer 400 on the substrate 100 and the orthographic projection of the second auxiliary metal layer 500 on the substrate 100 at least partially overlap, and the first auxiliary metal layer 400 and the second auxiliary metal layer 500 overlap. Here, the first auxiliary metal layer 400 and the second auxiliary metal layer 500 do not overlap with any electrically conductive layer within the display panel 000, that is, the first auxiliary metal layer 400 and the second auxiliary metal layer 500 do not participate in any conductive process within the display panel 000.

[0062] In this case, since both the first auxiliary metal layer 400 and the second auxiliary metal layer 500 are made of metal materials, the connection between the first auxiliary metal layer 400 and the second auxiliary metal layer 500 is relatively tight after being overlapped. Furthermore, since the first inorganic layer 200 and the second inorganic layer 300 are located between the first auxiliary metal layer 400 and the second auxiliary metal layer 500, the overlapping first auxiliary metal layer 400 and the second auxiliary metal layer 500 can improve the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300. Thus, in the subsequent process of bonding the driver chip to the display panel 000, or in the process of removing the protective film adhered to the back of the display panel 000, the first inorganic layer 200 and the second inorganic layer 300 in the non-display area 00b are unlikely to separate from each other, effectively reducing the probability of separation between the first inorganic layer 200 and the second inorganic layer 300, thereby effectively improving the yield rate of the display panel 000.

[0063] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a light-emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer. Since the first auxiliary metal layer and the second auxiliary metal layer are both prepared by using metal materials. Therefore, after the first auxiliary metal layer and the second auxiliary metal layer are overlapped, the tightness of the connection between the two is better. In this way, the tightness of the connection between the first inorganic layer and the second inorganic layer located between the first auxiliary metal layer and the second auxiliary metal layer can be improved by overlapping the first auxiliary metal layer and the second auxiliary metal layer. In this way, in the subsequent process of binding the driver chip to the display panel, or in the process of tearing off the protective film bonded to the back of the display panel, it is not easy for the first inorganic layer and the second inorganic layer in the non-display area to separate the film, which effectively reduces the probability of film separation between the first inorganic layer and the second inorganic layer, thereby effectively improving the yield rate of the display panel.

[0064] In the embodiments of this application, Figure 6 As shown, the first inorganic layer 200 has a first via V1, the second inorganic layer 300 has a second via V2 connected to the first via V1, and the first auxiliary metal layer 400 passes through the first via V1 and the second via V2 in sequence, and then overlaps with the second auxiliary metal layer 500. Here, the boundaries of the orthographic projection of the first via V1 on the substrate 100 and the orthographic projection of the second via V2 on the substrate 100 coincide. As a result, the overlapping area of ​​the first auxiliary metal layer 400 and the second auxiliary metal layer 500 does not change after passing through the first via V1 and the second via V2, resulting in a good overlapping effect between the first auxiliary metal layer 400 and the second auxiliary metal layer 500.

[0065] In the present application, there are multiple first vias V1, and the orthographic projections of the multiple first vias V1 on the substrate 100 are evenly distributed within the orthographic projection of the first auxiliary metal layer 400 on the substrate 100. Similarly, there are multiple second vias V2, and the orthographic projections of the multiple second vias V2 on the substrate 100 are evenly distributed within the orthographic projection of the first auxiliary metal layer 400 on the substrate 100. Furthermore, the multiple first vias V1 can be connected to the multiple second vias V2 in a one-to-one correspondence. In this way, when the first auxiliary metal layer 400 overlaps with the multiple second vias V2 and the second auxiliary metal layer 500 through the multiple first vias V1, the overlapping area between the first auxiliary metal layer 400 and the second auxiliary metal layer 500 is larger, and the overlapping positions between the first auxiliary metal layer 400 and the second auxiliary metal layer 500 are evenly distributed, further improving the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300 located between the first auxiliary metal layer 400 and the second auxiliary metal layer 500.

[0066] In the examples of this application, please refer to Figure 7 , Figure 7 is another Figure 5 The second inorganic layer 300 has a snap-in groove 30a, and the first inorganic layer 200 has a snap-in protrusion 20a located within the snap-in groove 30a. Thus, the snap-in groove 30a and the snap-in protrusion 20a are engaged with each other, thereby improving the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300, and further reducing the probability of separation between the first and second inorganic layers 200 and 300.

[0067] In this application, please refer to Figure 8 , Figure 8It is a partial top view of the non-display area in a display panel provided by an embodiment of the present application. The positive projection of the snap-in groove 30a on the substrate 100 does not coincide with the positive end of the overlapping position of the first auxiliary metal layer 400 and the second auxiliary metal layer 500 on the substrate 100. In this way, the snap-in groove 30a and the snap-in protrusion 20a will not affect the overlapping of the first auxiliary metal layer 400 and the second auxiliary metal layer 500, and the first auxiliary metal layer 400 and the second auxiliary metal layer 500 will not affect the snap-in of the snap-in groove 30a and the snap-in groove 20a. It should be noted that the above Figure 7 The film structure diagram shown can be Figure 8 The cross-sectional schematic diagram is shown along line CC'.

[0068] In the embodiment of the present application, the shape of the orthographic projection of the clamping groove 30 a in the second inorganic layer 300 on the substrate 100 is at least one of a circle, a square, a strip, and a ring. Figure 8 The schematic description is given by taking the shape of the orthographic projection of the clamping groove 30a on the substrate 100 as an annular shape as an example.

[0069] It should be noted that the shape of the orthographic projection of the engaging protrusion 20a in the first inorganic layer 200 on the substrate 100 needs to be the same as the shape of the orthographic projection of the engaging groove 30a on the substrate 100. For example, when the orthographic projection of the engaging groove 30a on the substrate 100 is annular, the orthographic projection of the engaging protrusion 20a on the substrate 100 is also annular. Furthermore, when the orthographic projections of the engaging groove 30a and the engaging protrusion 20a on the substrate 100 are both annular, the engagement between the annular engaging groove 40a and the engaging protrusion 20a can further enhance the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300.

[0070] In this application, please refer to Figure 9 , Figure 9 It's another Figure 5 A partial enlarged view of R is shown. The display panel 000 may further include: a third auxiliary metal layer 600 located on the side of the second auxiliary metal layer 500 facing away from the first auxiliary metal layer 400, and a third inorganic layer 700 located between the third auxiliary metal layer 600 and the second auxiliary metal layer 500. The orthographic projection of the third auxiliary metal layer 600 on the substrate 100 at least partially overlaps with the orthographic projection of the second auxiliary metal layer 500 on the substrate 100, and the third auxiliary metal layer 600 overlaps with the second auxiliary metal layer 500. Here, the third auxiliary metal layer 600 and the second auxiliary metal layer 500 also do not overlap with any electrically conductive layer within the display panel 000, that is, the third auxiliary metal layer 600 and the second auxiliary metal layer 500 do not participate in any conductive process within the display panel 000.

[0071] In this case, since the third auxiliary metal layer 600 is also made of a metal material, the connection between the second auxiliary metal layer 500 and the third auxiliary metal layer 600 is relatively tight after being overlapped. Thus, the third auxiliary metal layer 600 can prevent the second auxiliary metal layer 500 and the third inorganic layer 700 from separating, further improving the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300, which are located between the second auxiliary metal layer 500 and the first auxiliary metal layer 400.

[0072] In the embodiment of the present application, the third inorganic layer 700 has a third via V3, and the second auxiliary metal layer 500 passes through the third via V3 and overlaps the third auxiliary metal layer 600. Here, the number of third vias V3 is also multiple, and the orthographic projections of the multiple third vias V3 on the substrate 100 are evenly distributed within the orthographic projection of the second auxiliary metal layer 500 on the substrate 100. In this way, when the second auxiliary metal layer 500 overlaps the third auxiliary metal layer 600 through the multiple third vias V3, the overlapping area of ​​the second auxiliary metal layer 500 and the third auxiliary metal layer 600 is large, and the overlapping positions between the second auxiliary metal layer 500 and the third auxiliary metal layer 600 are evenly distributed, reducing the probability of film separation between the second auxiliary metal layer 500 and the third inorganic layer 700, and further improving the tightness of the connection between the first inorganic layer 200 and the second inorganic layer 300 between the second auxiliary metal layer 500 and the first auxiliary metal layer 400.

[0073] In this application, please refer to Figure 10 , Figure 10 This is a partial top view of the non-display area of ​​another display panel provided by an embodiment of the present application. A binding area 00b1 is provided within the non-display area 00b, and a first auxiliary area R1 and / or a second auxiliary area R2 are provided around the binding area 00b1. Here, the binding area 00b1 is used for bonding with the driver chip.

[0074] In an embodiment of the present application, the binding area 00b1 can be a long rectangular area, the number of the first auxiliary areas R1 is four, and the four first auxiliary areas R1 are respectively arranged around the four corners of the binding area 00b1, and the number of the second auxiliary areas R2 is two, and the two second auxiliary areas R2 are arranged around the two short sides of the binding area 00b1.

[0075] Since there is no structure in the first auxiliary region R1 that is electrically connected to any conductive structure in the display panel 000, the first auxiliary metal layer 400, the second auxiliary metal layer 500 and the third auxiliary metal layer 600 may be disposed in the first auxiliary region R1 at the same time. Figure 9 Can be Figure 10The cross-sectional view of the D-D' in the first auxiliary region is shown in FIG. Since the second auxiliary region R2 is provided with a conductive structure for detecting the display panel, and the conductive structure is usually provided in the same layer as the third auxiliary metal layer 600, the third auxiliary metal layer 600 cannot be provided in the second auxiliary region R2. The first auxiliary metal layer 400 and the second auxiliary metal layer 500 can be provided in the second auxiliary region R2 at the same time. For example, the above Figure 8 Can be Figure 10 The cross-sectional view at EE' in the second auxiliary region is shown.

[0076] In the examples of this application, please refer to Figure 11 , Figure 11 This is a partial top view of a non-display area in another display panel provided by an embodiment of the present application. An auxiliary removal area 00b2 is also provided within the non-display area 00b, surrounding the binding area 00b1. The orthographic projection of the first inorganic layer 200 on the substrate 100 does not overlap with the auxiliary removal area 00b2. Furthermore, both the first auxiliary area R1 and the second auxiliary area R2 are closer to the binding area 00b1 than the auxiliary removal area 00b2.

[0077] In order to see the film structure in the auxiliary removal area 00b2 more clearly, please refer to Figure 12 , Figure 12 yes Figure 11 A schematic diagram of the film structure at position F-F' is shown. Here, the first inorganic layer 200 is not present in the auxiliary removal area 00b2, thereby ensuring that film separation between the first inorganic layer 200 and the second inorganic layer 300 will not occur in the auxiliary removal area 00b2. For example, because the auxiliary removal area 00b2 is located one circle outside the binding area 00b1, even if the auxiliary removal area 00b2 is subjected to a large pressure during the process of binding the driver chip to the binding area 00b1, the first inorganic layer 200 and the second inorganic layer 300 will not separate in the auxiliary removal area 00b2.

[0078] Please refer to Figure 13 , Figure 13 Schematic diagram of the film layer structure of a display panel provided in an embodiment of the present application. The display panel 000 may also include: a pixel driving circuit 900 electrically connected to the light-emitting device 800, an encapsulation layer 1000 for encapsulating the light-emitting device, and a touch layer 1100 located on the side of the encapsulation layer 1000 facing away from the light-emitting device 800. Here, after the driver chip is attached to the display panel 00, the driver chip can apply an electrical signal to the light-emitting device 800 through the pixel driving circuit, causing the light-emitting device 800 to emit light, thereby enabling the display panel 000 to display an image.

[0079] The display panel 000 includes multiple pixel driving circuits 900. Each pixel driving circuit 900 may include a light shielding layer 901, an active layer 902, a first gate electrode 903, a second gate electrode 904, a source electrode 905, a drain electrode 906, and a transfer electrode 907. The multiple pixel driving circuits 900 may be electrically connected to the multiple light-emitting devices 800 in a one-to-one correspondence.

[0080] The light shielding layer 901 and the active layer 902 can be insulated by the first insulating layer 1200, and the orthographic projection of the active layer 902 on the substrate 100 is located within the orthographic projection of the light shielding layer 901 on the substrate 100. In this way, the light shielding layer 901 can shield the active layer 902 to prevent the voltage threshold shift of the active layer 902 when exposed to light.

[0081] The active layer 902 can be insulated from the first gate electrode 903 by a first gate insulating layer 1300, and from the second gate electrode 904 by a second gate insulating layer 1400. The active layer 902 is electrically connected to the source electrode 905 and the drain electrode 906, respectively. Typically, the source electrode 905 and the drain electrode 906 are provided on the same layer, that is, they are part of the same conductive pattern. The conductive pattern containing the source electrode 905 and the drain electrode 906 can be insulated from the second gate electrode 904 by a second insulating layer 1500.

[0082] Here, the active layer 902, the first gate electrode 903, the second gate electrode 904, the source electrode 905, and the drain electrode 906 can form a thin film transistor. In the embodiment of the present application, the thin film transistor is a top-gate thin film transistor as an example for schematic illustration. In other optional implementations, the thin film transistor can also be a bottom-gate thin film transistor, which is not limited in the embodiment of the present application.

[0083] The display panel 000 may further include gate lines and data lines located in the display area 00a. The gate lines may be electrically connected to one of the first gate electrode 903 and the second gate electrode 904, and the data lines may be electrically connected to one of the source electrode 905 and the drain electrode 906. The other of the source electrode 905 and the drain electrode 906 may be electrically connected to the light-emitting device 800 via a transition electrode 907. For example, the transition electrode 907 and the drain electrode 906 are insulated by a third insulating layer 1600.

[0084] The light-emitting device 800 may include: a plurality of stacked anode layers 801, a light-emitting layer 802, and a cathode layer 803. The light-emitting device 800 may be an organic light emitting display (OELD). Each pixel driving circuit 900 may be electrically connected to the anode layer 801 in the corresponding light-emitting device 800 via a switching electrode 907. For example, a first planar layer 1700 is provided between the switching electrode 907 and the anode layer 801.

[0085] The display panel 000 may further include a pixel defining layer 1800. The portion of the pixel defining layer 1800 located within the display area 00a has a plurality of pixel holes V4. Within each pixel hole V4, the portion of the anode layer 801 located within the pixel hole V4, the portion of the light-emitting layer 802 located within the pixel hole V4, and the portion of the cathode layer 803 located within the pixel hole V4 can form a light-emitting device 800.

[0086] The encapsulation layer 1000 may include a stacked first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The encapsulation layer 1000 is used to encapsulate the light-emitting device 800, protecting the light-emitting layer 802 from corrosion by atmospheric elements such as moisture and oxygen, which could damage it. This effectively increases the lifespan of the light-emitting device 800.

[0087] The touch layer 1100 may include: a first conductive layer 1101 and a second conductive layer 1102 stacked together, and a fourth insulating layer 1103 located between the first conductive layer 1101 and the second conductive layer 1102. The touch layer 1100 enables the display panel 000 to implement touch functionality. It should be noted that, in one embodiment, the first conductive layer 1101 may include touch drive electrodes, and the second conductive layer 1102 may include touch sensing electrodes. In another embodiment, the first conductive layer 1101 may include touch drive electrodes and touch sensing electrodes, and the second conductive layer 1102 may include a bridging electrode for bridging two adjacent touch drive electrodes or touch sensing electrodes.

[0088] In the embodiment of the present application, the first auxiliary metal layer 400 can be provided in the same layer and made of the same material as the conductive layer in the touch layer 1100. That is, the first auxiliary metal layer 400 can be formed through a single patterning process as the conductive layer in the touch layer 1100. For example, the first auxiliary metal layer 400 can be provided in the same layer and made of the same material as the first conductive layer 1101 and / or the second conductive layer 1102 in the touch layer 1100. That is, the first auxiliary metal layer 400 can be provided in the same layer and made of the same material as the first conductive layer 1101 and / or the second conductive layer 1102.

[0089] The second auxiliary metal layer 500 is formed in the same layer and made of the same material as some of the electrodes in the pixel driving circuit 900. That is, the second auxiliary metal layer 500 can be formed through a single patterning process as can some of the electrodes in the pixel driving circuit 900. For example, the second auxiliary metal layer 500 can be formed in the same layer and made of the same material as any one of the first gate electrode 903, the second gate electrode 904, the source electrode 905, the drain electrode 906, and the transfer electrode 907 in the touch layer 1100.

[0090] A portion of the first inorganic layer 200 is disposed on the same layer and made of the same material as the inorganic encapsulation layer within the encapsulation layer 1000, and another portion of the first inorganic layer 200 is disposed on the same layer and made of the same material as the insulating layer within the touch layer 1100. In this manner, the first inorganic layer 200 can be formed on the same layer as the inorganic encapsulation layer and / or the insulating layer within the touch layer 1100 through a single patterning process. For example, the first inorganic layer 200 can be disposed on the same layer and made of the same material as the fourth insulating layer 1103 within the touch layer 1100.

[0091] The second inorganic layer 300 can be provided in the same layer and made of the same material as the insulating layer in the pixel driving circuit 900. In this way, the second inorganic layer 300 can be formed through a single patterning process with the insulating layer in the pixel driving circuit 900. For example, the second inorganic layer 300 can be provided in the same layer and made of the same material as any one of the first insulating layer 1200, the first gate insulating layer 1300, the second gate insulating layer 1400, the second insulating layer 1500, and the third insulating layer 1600 in the pixel driving circuit 900.

[0092] It should be noted that when the second auxiliary metal layer 500 is provided in the same layer as the second gate electrode 904 in the touch layer 1100, the third auxiliary metal layer 600 can be provided in the same layer and made of the same material as the first gate electrode 903. Similarly, the second inorganic layer 300 can be provided in the same layer and made of the same material as the second insulating layer 1500, and the third inorganic layer 700 can be provided in the same layer and made of the same material as the second gate insulating layer 1400.

[0093] It should also be noted that the single patterning process here and the single patterning process in the following embodiments all include: photoresist coating, exposure, development, etching and photoresist stripping.

[0094] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a light-emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer. Since the first auxiliary metal layer and the second auxiliary metal layer are both prepared by using metal materials. Therefore, after the first auxiliary metal layer and the second auxiliary metal layer are overlapped, the tightness of the connection between the two is better. In this way, the tightness of the connection between the first inorganic layer and the second inorganic layer located between the first auxiliary metal layer and the second auxiliary metal layer can be improved by overlapping the first auxiliary metal layer and the second auxiliary metal layer. In this way, in the subsequent process of binding the driver chip to the display panel, or in the process of tearing off the protective film bonded to the back of the display panel, it is not easy for the first inorganic layer and the second inorganic layer in the non-display area to separate the film, which effectively reduces the probability of film separation between the first inorganic layer and the second inorganic layer, thereby effectively improving the yield rate of the display panel.

[0095] The present application also provides a method for manufacturing a display panel. The method for manufacturing the display panel 000 is used to manufacture Figure 5 The display panel 000 is shown. The manufacturing method of the display panel 000 may include:

[0096] A light emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer, and a second auxiliary metal layer are formed on a substrate.

[0097] The display panel has a display area and a non-display area located outside the display area. The light-emitting device is located in the display area. The first inorganic layer, the second inorganic layer, the first auxiliary metal layer and the second auxiliary metal layer are all located in the non-display area.

[0098] The first inorganic layer is arranged in the same layer as the inorganic layer located on the side of the light emitting device facing away from the substrate, and the second inorganic layer is arranged in the same layer as the inorganic layer located on the side of the light emitting device facing the substrate.

[0099] The first auxiliary metal layer is located on the side of the first inorganic layer facing away from the second inorganic layer, and the second auxiliary metal layer is located on the side of the second inorganic layer facing away from the first inorganic layer. The orthographic projection of the first auxiliary metal layer on the substrate at least partially overlaps with the orthographic projection of the second auxiliary metal layer on the substrate, and the first auxiliary metal layer overlaps with the second auxiliary metal layer.

[0100] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific principles of the display panel described above can refer to the corresponding contents in the aforementioned embodiment of the display panel structure, and will not be repeated here.

[0101] In summary, the manufacturing method of the display panel provided in the embodiment of the present application includes: forming a light-emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer on a substrate. Since the first auxiliary metal layer and the second auxiliary metal layer are both prepared by using metal materials. Therefore, after the first auxiliary metal layer and the second auxiliary metal layer are overlapped, the tightness of the connection between the two is better. In this way, the tightness of the connection between the first inorganic layer and the second inorganic layer located between the first auxiliary metal layer and the second auxiliary metal layer can be improved by overlapping the first auxiliary metal layer and the second auxiliary metal layer. In this way, in the subsequent process of binding the driver chip to the display panel, or in the process of tearing off the protective film bonded to the back of the display panel, it is not easy for the first inorganic layer and the second inorganic layer in the non-display area to separate the film, which effectively reduces the probability of film separation between the first inorganic layer and the second inorganic layer, thereby effectively improving the yield rate of the display panel.

[0102] The present application also provides a display device. Figure 14 , Figure 14 This is a top view of a display device provided in an embodiment of the present application. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The display device can include a driver chip 111 and a display panel 000. The display panel 000 can be an OLED display panel or an active matrix organic light emitting diode (AM-OLED) display panel.

[0103] In the embodiment of the present application, the display panel 000 may be the display panel 000 in the above embodiment. For example, it may be Figure 5 、 Figure 6 、 Figure 7 、 Figure 9 or Figure 12 The driving chip 111 is connected to the display panel 000 and is used to provide an electrical signal to the display panel 000 so that the display panel 000 can display an image.

[0104] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0105] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0106] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area located outside the display area, and the display panel includes: substrate; a light emitting device located in the display area; A first inorganic layer and a second inorganic layer are stacked in the non-display area, the first inorganic layer being co-located with the inorganic layer on the side of the light-emitting device facing away from the substrate, and the second inorganic layer being co-located with the inorganic layer on the side of the light-emitting device facing the substrate; the second inorganic layer having a snap-fit ​​groove, and the first inorganic layer having a snap-fit ​​protrusion located in the snap-fit ​​groove; Also, a first auxiliary metal layer and a second auxiliary metal layer are located in the non-display area, the first auxiliary metal layer is located on the side of the first inorganic layer away from the second inorganic layer, the second auxiliary metal layer is located on the side of the second inorganic layer away from the first inorganic layer, the orthographic projection of the first auxiliary metal layer on the substrate and the orthographic projection of the second auxiliary metal layer on the substrate at least partially overlap, and the first auxiliary metal layer and the second auxiliary metal layer overlap.

2. The display panel according to claim 1, wherein: The first inorganic layer has a first via hole, the second inorganic layer has a second via hole connected to the first via hole, and the first auxiliary metal layer passes through the first via hole and the second via hole in sequence and then overlaps with the second auxiliary metal layer.

3. The display panel according to claim 2, wherein: There are a plurality of first via holes, and the orthographic projections of the plurality of first via holes on the substrate are evenly distributed within the orthographic projection of the first auxiliary metal layer on the substrate.

4. The display panel according to claim 1, wherein: The orthographic projection of the clamping groove on the substrate does not overlap with the positive end of the overlapping position of the first auxiliary metal layer and the second auxiliary metal layer on the substrate.

5. The display panel according to claim 1, wherein: The orthographic projection of the clamping groove on the substrate is in a shape of at least one of a circle, a square, a bar and a ring.

6. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further includes: a third auxiliary metal layer located on a side of the second auxiliary metal layer facing away from the first auxiliary metal layer, and a third inorganic layer located between the third auxiliary metal layer and the second auxiliary metal layer; An orthographic projection of the third auxiliary metal layer on the substrate at least partially overlaps with an orthographic projection of the second auxiliary metal layer on the substrate, and the third auxiliary metal layer overlaps with the second auxiliary metal layer.

7. The display panel according to claim 6, wherein: The third inorganic layer has a third via hole, and the second auxiliary metal layer passes through the third via hole and overlaps with the third auxiliary metal layer.

8. The display panel according to claim 6, wherein: A binding area is provided in the non-display area, and a first auxiliary area and / or a second auxiliary area are provided around the binding area; The first auxiliary metal layer, the second auxiliary metal layer and the third auxiliary metal layer are simultaneously disposed in the first auxiliary region, and the first auxiliary metal layer and the second auxiliary metal layer are simultaneously disposed in the second auxiliary region.

9. The display panel according to claim 8, wherein: The binding area is a long rectangular area, the number of the first auxiliary areas is four, and the four first auxiliary areas are respectively arranged around the four corners of the binding area; the number of the second auxiliary areas is two, and the two second auxiliary areas are arranged around the two short sides of the binding area.

10. The display panel according to claim 8 or 9, characterized in that: An auxiliary removal area is also provided in the non-display area and is arranged around the binding area. The positive projection of the first inorganic layer on the substrate does not overlap with the auxiliary removal area, and the first auxiliary area and the second auxiliary area are both closer to the binding area than the auxiliary removal area.

11. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further includes: a pixel driving circuit electrically connected to the light emitting device, an encapsulation layer for encapsulating the light emitting device, and a touch layer located on a side of the encapsulation layer away from the light emitting device; The first auxiliary metal layer is provided in the same layer and made of the same material as the conductive layer in the touch layer, and the second auxiliary metal layer is provided in the same layer and made of the same material as part of the electrodes in the pixel driving circuit.

12. The display panel according to claim 11, wherein: A portion of the first inorganic layer is provided in the same layer and made of the same material as the inorganic encapsulation layer in the encapsulation layer, and another portion of the first inorganic layer is provided in the same layer and made of the same material as the insulating layer in the touch layer; The second inorganic layer is provided on the same layer as the insulating layer in the pixel driving circuit and is made of the same material.

13. A method for manufacturing a display panel, characterized in that: The method comprises: forming a light emitting device, a first inorganic layer, a second inorganic layer, a first auxiliary metal layer and a second auxiliary metal layer on a substrate; The display panel has a display area and a non-display area located outside the display area, the light-emitting device is located in the display area, and the first inorganic layer, the second inorganic layer, the first auxiliary metal layer, and the second auxiliary metal layer are all located in the non-display area; The first inorganic layer is provided on the same layer as the inorganic layer located on the side of the light-emitting device facing away from the substrate, and the second inorganic layer is provided on the same layer as the inorganic layer located on the side of the light-emitting device facing the substrate; the second inorganic layer has a snap-fit ​​groove, and the first inorganic layer has a snap-fit ​​protrusion located in the snap-fit ​​groove; The first auxiliary metal layer is located on the side of the first inorganic layer facing away from the second inorganic layer, the second auxiliary metal layer is located on the side of the second inorganic layer facing away from the first inorganic layer, the orthographic projection of the first auxiliary metal layer on the substrate and the orthographic projection of the second auxiliary metal layer on the substrate at least partially overlap, and the first auxiliary metal layer and the second auxiliary metal layer overlap.

14. A display device, characterized in that: include: A driving chip, and a display panel electrically connected to the driving chip, wherein the display panel is the display panel according to any one of claims 1 to 12.

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