Probe Card Device and Self-Aligning Probe
Through the design of the self-aligning probe, the structure of the guide projection and the narrow area of the arc-shaped part is solved, and the stability and life of the probe card device are improved.
Patent Information
- Application Number
- CN202011327852.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-24
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2040-11-24
AI Technical Summary
In the existing probe card devices, the gap between the conductive probe and the guide plate unit is too large, which affects the development and application of the device.
The self-aligning probe design is adopted, including an adapter end, a test end, a first connection, a second connection and an arc-shaped part. By forming a guide protrusion in the first connection, the gap between the probe and the guide plate unit is controlled, and a narrow area is designed in the arc-shaped part to disperse stress.
Effectively control the gap between the probe and the guide unit, improve the stability and service life of the device, and is suitable for more testing applications.
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Figure CN114545042B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a conductive probe, in particular to a probe card device and a self-aligning probe. Background Art
[0002] The existing probe card device includes a first guide plate unit, a second guide plate unit spaced apart from the first guide plate unit, and a plurality of conductive probes passing through the first guide plate unit and the second guide plate unit. The location of the existing conductive probes in the first guide plate unit is limited to a structural design of equal width, so a large gap (e.g., more than 10 microns) is formed between the existing conductive probes and the first guide plate unit, which is not conducive to the further development and application of the existing probe card device.
[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention
[0004] The embodiment of the present invention provides a probe card device and a self-aligning probe, which can effectively improve the defects that may be produced by the existing conductive probe.
[0005] The embodiment of the present invention discloses a probe card device, which includes a first guide plate unit and a second guide plate unit, which are arranged at intervals from each other; and a plurality of self-aligning probes, which are inserted through the first guide plate unit and the second guide plate unit, and any two adjacent self-aligning probes are separated by a spacing; wherein each self-aligning probe includes: a transfer end, which is located at an outer side of the first guide plate unit away from the second guide plate unit; a test end, which is located at an outer side of the second guide plate unit away from the first guide plate unit, and the test end is used to detachably press against a test object; wherein the transfer end and the test end jointly define a reference axis; a first connecting portion, which is located in the first guide plate unit; wherein the first connecting portion is formed with a guiding protrusion so that a gap of no more than 4 microns (μm) can be formed between the first connecting portion and the first guide plate unit; a second connecting portion, which is located in the second guide plate unit; and an arc portion, which connects the first connecting portion and the second connecting portion; wherein a maximum distance between the arc portion and the reference axis is greater than 75 microns and less than the spacing.
[0006] Preferably, each self-aligning probe defines a narrow area at a position where the arc portion with the maximum distance is formed; in each self-aligning probe, the cross-sectional area of the arc portion gradually increases from the narrow area toward the first connecting portion and the second connecting portion.
[0007] Preferably, in each self-aligned probe, a distance of the narrow region relative to the first connection portion is equal to a distance of the narrow region relative to the second connection portion.
[0008] Preferably, the narrow area and the guiding protrusion are respectively located on opposite sides of the reference axis.
[0009] Preferably, each self-aligning probe is formed with a rib adjacent to the first guide unit on the arc portion; the rib of each self-aligning probe and the guiding protrusion are respectively located on opposite sides of the reference axis, and the rib of each self-aligning probe does not contact the first guide unit.
[0010] Preferably, in each self-aligning probe, the maximum width of the first connecting portion is greater than the maximum width of the second connecting portion.
[0011] Preferably, the probe card device further includes a signal transfer board adjacent to the first guide unit; wherein, when the first guide unit and the second guide unit are obliquely displaced from each other, each self-aligning probe is formed with a guiding protrusion so that the transfer end abuts against the signal transfer board at an angle between 85 degrees and 95 degrees.
[0012] An embodiment of the present invention also discloses a self-aligning probe, which includes: a transfer end for abutting against a signal transfer board; a test end for separably abutting against a device under test; wherein, the transfer end and the test end jointly define a reference axis; a first connecting portion connected to the transfer end; wherein, the first connecting portion is formed with a guiding protrusion; a second connecting portion connected to the test end; and an arc portion connecting the first connecting portion and the second connecting portion; wherein, the maximum distance between the arc portion and the reference axis is greater than 75 microns and less than 150 microns.
[0013] Preferably, the position of the arc portion of the self-aligning probe where the maximum distance is formed is defined as a narrow area; the cross-sectional area of the arc portion gradually increases from the narrow area towards the first connecting portion and the second connecting portion.
[0014] Preferably, the distance from the narrow area to the first connecting portion is equal to the distance from the narrow area to the second connecting portion.
[0015] In summary, for the probe card device and the self-aligning probe disclosed in the embodiments of the present invention, the guiding protrusion is formed through the first connecting portion, so that the gap between the self-aligning probe and the first guide unit can be effectively controlled, thereby facilitating the development and application of the probe card device.
[0016] For a better understanding of the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not impose any limitation on the protection scope of the present invention. Description of the Drawings
[0017] Figure 1 It is a cross-sectional schematic view of the probe card device according to Embodiment 1 of the present invention.
[0018] Figure 2 The Figure 1 cross-sectional schematic view of the probe card device when the first guide plate unit and the second guide plate unit are arranged out of alignment.
[0019] Figure 3 The plan view of the self-aligning probe according to the first embodiment of the present invention.
[0020] Figure 4 The three-dimensional schematic view of the self-aligning probe according to the first embodiment of the present invention.
[0021] Figure 5 The Figure 1 magnified schematic view of part V in
[0022] Figure 6 The Figure 2 magnified schematic view of part VI in
[0023] Figure 7 The Figure 6 schematic view of the comparative example of Detailed implementation manners
[0024] The following are specific embodiments to illustrate the implementation manners of the present invention regarding "probe card device and self-aligning probe". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. The following implementation manners will further detail the relevant technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.
[0025] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. Additionally, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of more of the associated listed items.
[0026] Please refer to Figures 1 to 6 as shown, which is an embodiment of the present invention. As Figure 1 and Figure 2 shown, this embodiment discloses a probe card device 1000 (such as: a vertical probe card device), which includes a probe head 100 and is abutted against one side of the probe head 100 (such as: Figure 1a signal transfer board 200 on the top side of the probe head 100, and the other side of the probe head 100 (e.g., Figure 1 the bottom side of the probe head 100) is used to abut against and test a device under test (DUT) (not shown in the figure, e.g., a semiconductor wafer).
[0027] It should be noted that, for the convenience of understanding this embodiment, the accompanying drawings only show the partial structure of the probe card device 1000, so as to clearly present the component structures and connection relationships of the probe card device 1000. However, the present invention is not limited to the accompanying drawings. The following will separately introduce the component structures and connection relationships of the probe head 100.
[0028] As Figure 1 shown, the probe head 100 includes a first guide plate unit 1, a second guide plate unit 2 disposed at an interval from the first guide plate unit 1, a spacer 3 clamped between the first guide plate unit 1 and the second guide plate unit 2, and a plurality of self-aligning probes 4 passing through the first guide plate unit 1 and the second guide plate unit 2. Among them, there is a spacing D4 between any two adjacent self-aligning probes 4.
[0029] It should be noted that the self-aligning probes 4 are described in this embodiment in combination with the first guide plate unit 1, the second guide plate unit 2, and the spacer 3, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the self-aligning probes 4 can also be independently applied (e.g., sold) or used in combination with other components.
[0030] In this embodiment, the first guide plate unit 1 includes a first guide plate, and the second guide plate unit 2 includes a second guide plate. However, in other embodiments not shown in the present invention, the first guide plate unit 1 can include a plurality of first guide plates (and spacer sheets clamped between two adjacent first guide plates), and the second guide plate unit 2 can also include a plurality of second guide plates (and spacer sheets clamped between two adjacent second guide plates). The plurality of first guide plates can be arranged offset from each other, the plurality of second guide plates can also be arranged offset from each other, and the first guide plate unit 1 can be arranged offset from the second guide plate unit 2.
[0031] Furthermore, the spacer 3 can be an annular structure, and the spacer 3 is clamped at the corresponding peripheral parts of the first guide plate unit 1 and the second guide plate unit 2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the spacer 3 of the probe card device 1000 can also be omitted or replaced by other components.
[0032] It should be noted first that the multiple self-aligning probes 4 have substantially the same structure in this embodiment. Therefore, for the convenience of description, a single self-aligning probe 4 will be introduced first below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the structures of the multiple self-aligning probes 4 included in the probe head 100 may also be slightly different; or, the self-aligning probe 4 may only include some of the structures described below.
[0033] Furthermore, for the convenience of understanding the structure of the self-aligning probe 4, the structure of the self-aligning probe 4 will be described below in the case where the first guide plate unit 1 has not been misaligned relative to the second guide plate unit 2.
[0034] As Figure 1 and Figures 3 to 5 shown, the self-aligning probe 4 is an integrally formed one-piece structure, and the self-aligning probe 4 includes an adapter end 41 and a test end 42 located at both ends thereof, a first connecting portion 43 connected to the adapter end 41, a second connecting portion 44 connected to the test end 42, and an arc portion 45 connecting the first connecting portion 43 and the second connecting portion 44. That is to say, the self-aligning probe 4 sequentially includes the adapter end 41, the first connecting portion 43, the arc portion 45, the second connecting portion 44, and the test end 42, but the present invention is not limited thereto.
[0035] Among them, the adapter end 41 is located on an outer side (such as the upper side of the first guide plate unit 1) of the first guide plate unit 1 away from the second guide plate unit 2 and is used to abut against the signal adapter board 200 adjacent to the first guide plate unit 1; the test end 42 is located on an outer side (such as the lower side of the second guide plate unit 2) of the second guide plate unit 2 away from the first guide plate unit 1 and is used to separably abut against the object to be tested adjacent to the second guide plate unit 2. Furthermore, the first connecting portion 43 is located within the first guide plate unit 1, the second connecting portion 44 is located within the second guide plate unit 2, and the arc portion 45 is located between the first guide plate unit 1 and the second guide plate unit 2.
[0036] In more detail, the transition end 41 and the test end 42 jointly define a reference axis L; and in this embodiment, the reference axis L passes through the center of the transition end 41 and the center of the test end 42, but the present invention is not limited thereto. The maximum distance D between the arc portion 45 and the reference axis L is greater than 75 microns (μm) and less than the spacing D4 (or 150 microns), and the spacing D4 in this embodiment can be 150 microns, but the present invention is not limited thereto. In other words, any conductive probe (e.g., a linear conductive probe) that does not have the arc portion 45 is not the self-aligning probe 4 referred to in this embodiment.
[0037] In this embodiment, the self-alignment probe 4 is defined as a narrow area 451 at the position of the arc portion 45 where the maximum distance D is formed, and the cross-sectional area of the arc portion 45 gradually increases from the narrow area 451 toward the first connection portion 43 and the second connection portion 44, and the distance of the narrow area 451 relative to the first connection portion 43 is equal to the distance of the narrow area 451 relative to the second connection portion 44.
[0038] Accordingly, in this embodiment, the self-alignment probe 4 is designed with the arc portion 45 so that when the arc portion 45 is deformed, the stress can be dispersed more dispersedly in various parts of the arc portion 45 instead of being concentrated in a specific block of the arc portion 45, thereby effectively extending the service life of the self-alignment probe 4.
[0039] The first connecting portion 43 is formed with a guiding protrusion 431, and the guiding protrusion 431 may be at least partially located inside the first guide plate unit 1; that is, the guiding protrusion 431 may be partially located outside the first guide plate unit 1, but only the portion of the guiding protrusion 431 located inside the first guide plate unit 1 can realize the guiding function.
[0040] Furthermore, the self-aligning probe 4 is formed with the guiding protrusion 431 so that a gap G of no more than 4 micrometers (μm) can be formed between the first connecting portion 43 and the first guide plate unit 1, and the gap G in this embodiment refers to the minimum distance between the first connecting portion 43 and the first guide plate unit 1. That is, when the first connecting portion 43 is located in a through hole (not shown) of the first guide plate unit 1, the first connecting portion 43 is formed with the guiding protrusion 431 so that the gap G between the first connecting portion 43 and the inner wall surface of the through hole can be controlled to be no more than 4 micrometers.
[0041] In other words, the first connection portion 43 is formed with the guiding protrusion 431 so that a maximum width W43 of the first connection portion 43 can be greater than a maximum width W44 of the second connection portion 44, and the above width condition can effectively avoid increasing the difficulty of implanting the self-aligning probe 4 into the first guide plate unit 1 and the second guide plate unit 2. In addition, the cross-sectional area of the self-aligning probe 4 can be gradually increased from the narrow area 451 toward the guiding protrusion 431, so that the first connection portion 43 can also be used to assist the arc portion 45 in sharing stress.
[0042] Furthermore, the guiding protrusion 431 and the narrow area 451 are located on opposite sides of the reference axis L in this embodiment, so as to facilitate the implantation of the self-aligning probe 4 into the first guide plate unit 1 and the second guide plate unit 2 and help maintain the overall structural stability of the probe card device 1000, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the guiding protrusion 431 and the narrow area 451 can be located on the same side of the reference axis L.
[0043] In addition, each of the self-alignment probes 4 may be formed with a protruding rib 46 adjacent to the first guide plate unit 1 on the arc portion 45, and the protruding rib 46 and the guiding protrusion 431 are respectively located on opposite sides of the reference axis L, and the protruding rib 46 of each of the self-alignment probes 4 does not contact the first guide plate unit 1. In other words, any protrusion on the same side as the guiding protrusion 431 or in contact with the first guide plate unit 1 is different from the protruding rib 46 referred to in this embodiment.
[0044] According to the above, if Figure 2 and Figure 6 As shown, when the first guide plate unit 1 and the second guide plate unit 2 are obliquely misaligned with each other, the arc-shaped portions 45 of the plurality of self-alignment probes 4 are arranged toward the same side, and each of the self-alignment probes 4 is formed with the guide protrusion 431 so that the transition end 41 abuts against the signal adapter board 200 at an angle σ between 85 and 95 degrees. The transition end 41 preferably abuts against the signal adapter board 200 at an angle σ of approximately 90 degrees (e.g., 88 to 92 degrees), but the present invention is not limited thereto. From another perspective, when the self-alignment probe 4 is replaced by a conductive probe 4a without any guide protrusion 431 (e.g., Figure 7 ), the conductive probe 4a will press against the signal adapter board 200 at an angle α less than 85 degrees (eg, 70 degrees).
[0045] Accordingly, the probe card device 1000 in this embodiment can effectively control the gap G between the self-aligning probe 4 and the first guide plate unit 1 through the structural design of the self-aligning probe 4 (e.g., the first connecting portion 43 is formed with the guiding protrusion 431), thereby facilitating the development and application of the probe card device 1000. The self-aligning probe 4 can also be located at opposite sides of the reference axis L through the guiding protrusion 431 and the narrow area 451, so that the first connecting portion 43 can abut against the first guide plate unit 1 with the guiding protrusion 431, thereby sharing part of the stress and improving the service life of the self-aligning probe 4.
[0046] Furthermore, the gap G between the self-alignment probe 4 and the first guide plate unit 1 of the probe card device is controlled to be less than 4 microns, thereby reducing the offset of the transfer end 41 caused by the misalignment of the first guide plate unit 1 and the second guide plate unit 2; that is, the transfer end 41 can be corrected by the guide protrusion 431, and then abut against the signal transfer board 200 at an angle σ between 85 degrees and 95 degrees.
[0047] In addition, since the self-aligning probe 4 can align the transition end 41 through the guiding protrusion 431 , the transition end 41 of the self-aligning probe 4 can be further shortened, thereby making the self-aligning probe 4 suitable for more test applications.
[0048] [Technical Effects of Embodiments of the Invention]
[0049] In summary, the probe card device and the self-aligning probe disclosed in the embodiments of the present invention have the guiding protrusion formed through the first connecting portion, so that the gap between the self-aligning probe and the first guide plate unit can be effectively controlled, thereby facilitating the development and application of the probe card device.
[0050] Furthermore, the probe card device and the self-aligning probe disclosed in the embodiments of the present invention adopt the structural design of the arc portion so that when the arc portion is deformed, the stress can be dispersed in various parts of the arc portion instead of being concentrated in a specific block of the arc portion, thereby effectively extending the service life of the self-aligning probe.
[0051] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.
Claims
1. A probe card device, characterized in that, The probe card device includes: a first guide plate unit and a second guide plate unit, which are arranged at intervals from each other; and a plurality of self-aligning probes, which are inserted through the first guide plate unit and the second guide plate unit, and there is a spacing between any two adjacent self-aligning probes; wherein, each of the self-aligning probes includes: a transition end portion, located on an outer side of the first guide plate unit away from the second guide plate unit; a test end portion, located on an outer side of the second guide plate unit away from the first guide plate unit, and the test end portion is used to detachably abut against a device under test; wherein, the transition end portion and the test end portion jointly define a reference axis; a first connecting portion, located within the first guide plate unit; wherein, a guiding protrusion is formed on the first connecting portion so that a gap not greater than 4 microns can be formed between the first connecting portion and the first guide plate unit; a second connecting portion, located within the second guide plate unit; and a curved portion, connecting the first connecting portion and the second connecting portion; wherein, a maximum distance between the curved portion and the reference axis is greater than 75 microns and less than the spacing; wherein, a narrow area is defined at a position of the curved portion of each self-aligning probe where the maximum distance is formed, and the narrow area and the guiding protrusion are respectively located on opposite sides of the reference axis.
2. The probe card device according to claim 1, wherein In each self-aligning probe, the cross-sectional area of the curved portion gradually increases from the narrow area towards the first connecting portion and the second connecting portion.
3. The probe card device according to claim 2, wherein In each self-aligning probe, the distance of the narrow area relative to the first connecting portion is equal to the distance of the narrow area relative to the second connecting portion.
4. The probe card device according to claim 1, wherein, Each self-aligning probe forms a rib adjacent to the first guide plate unit on the curved portion; the rib and the guiding protrusion of each self-aligning probe are respectively located on opposite sides of the reference axis, and the rib of each self-aligning probe does not contact the first guide plate unit.
5. The probe card device according to claim 1, wherein In each self-aligning probe, a maximum width of the first connecting portion is greater than a maximum width of the second connecting portion.
6. The probe card device according to claim 1, wherein The probe card device further includes a signal transfer board adjacent to the first guide plate unit; wherein, when the first guide plate unit and the second guide plate unit are obliquely displaced relative to each other, each self-aligning probe forms a guiding protrusion so that the transition end portion abuts against the signal transfer board at an angle between 85 degrees and 95 degrees.
7. A self-aligning probe, characterized in that, The self-aligning probe includes: a transition end portion, used to abut against a signal transfer board; a test end portion, used to detachably abut against a device under test; wherein, the transition end portion and the test end portion jointly define a reference axis; a first connecting portion, connected to the transition end portion; wherein, a guiding protrusion is formed on the first connecting portion; a second connecting portion, connected to the test end portion; and a curved portion, connecting the first connecting portion and the second connecting portion; wherein, a maximum distance between the curved portion and the reference axis is greater than 75 microns and less than 150 microns; Wherein, the position of the self-aligning probe at the arc portion where the maximum distance is formed is defined as a narrow area, and the narrow area and the guiding protrusion are respectively located on opposite sides of the reference axis.
8. The self-aligning probe according to claim 7, wherein The cross-sectional area of the arc portion gradually increases from the narrow area toward the first connecting portion and the second connecting portion.
9. The self-alignment probe according to claim 7, wherein The distance from the narrow area to the first connecting portion is equal to the distance from the narrow area to the second connecting portion.
Citation Information
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