Wafer support apparatus, semiconductor process chamber, and wafer processing method

Abstract

The application discloses a wafer supporting device, a semiconductor process chamber and a wafer processing method, which are applied to the semiconductor field and include a wafer support frame, the wafer support frame includes a heating tray for supporting and heating a wafer; a plurality of lifting mechanisms, each lifting mechanism is arranged to be liftable relative to the heating tray, and a separate driving motor and a separate position sensor are arranged correspondingly for each lifting mechanism; and a controller, a signal output end of the controller is connected with a control signal input end of each driving motor, and a signal input end of the controller is connected with each position sensor; the controller controls the corresponding driving motor according to sensing data of each position sensor, so that the lifting mechanism corresponding to the driving motor is driven to lift. The application does not need manual adjustment, shortens the operation time, and is more accurate in adjustment.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more particularly to a wafer support device, a semiconductor process chamber, and a wafer processing method. Background Technology

[0002] With the increasing use of information media, the demand for semiconductor memory devices is also increasing significantly. Stable operation of production equipment and high-quality products are essential. Therefore, placing the wafer in the correct position on the heated tray within the process chamber is crucial. Accurate placement of the wafer on the heated tray ensures optimal process results. If the wafer is tilted on the heated tray, there will be insufficient contact between the tray and the wafer, leading to temperature and height differences that result in poor quality.

[0003] The cavity must now be opened and the height of the height adjustment mechanism must be manually adjusted to ensure the wafer is level and in close contact with the heating tray. However, manual adjustment is inaccurate and time-consuming. Summary of the Invention

[0004] In view of the above-mentioned problems in the prior art, the present invention provides a wafer support device, a semiconductor process chamber, and a wafer processing method.

[0005] In a first aspect, embodiments of the present invention provide a wafer support device, comprising:

[0006] A wafer carrier, the wafer carrier including a heating tray for supporting and heating wafers;

[0007] Multiple lifting mechanisms are provided, each of which is adjustable in height relative to the heating tray. Each lifting mechanism is equipped with a separate drive motor and a separate position sensor.

[0008] The controller has its signal output terminal connected to the control signal input terminal of each drive motor and its signal input terminal connected to each position sensor. The controller controls the corresponding drive motor according to the sensing data of each position sensor, so as to drive the lifting mechanism corresponding to the drive motor to lift.

[0009] Optionally, each of the plurality of lifting mechanisms includes:

[0010] A lifting pin, one end of which passes through the heating tray and extends to the upper surface of the heating tray;

[0011] A lifting support plate is connected to the other end of the lifting pin, wherein the drive motor correspondingly provided by the lifting mechanism is connected to the lifting support plate.

[0012] Optionally, the drive motor includes:

[0013] A lifting cylinder and a connecting rod are provided, wherein one end of the lifting cylinder is connected to the connecting rod, and the other end of the connecting rod is connected to the lifting support plate.

[0014] Optionally, the lifting pin includes:

[0015] A lifting rod, the upper end of which passes through an opening on the heating tray, and the lower end of which is connected to the lifting support plate;

[0016] A support block is disposed above the heating tray and connected to the upper end of the lifting rod.

[0017] Optionally, the wafer carrier further includes:

[0018] A rotary drive device connected to the heating tray, wherein the heating tray is supported by the rotary drive device;

[0019] A rotation sensor is provided for the wafer carrier.

[0020] Optionally, the number of the plurality of lifting mechanisms is three or four.

[0021] In a second aspect, embodiments of the present invention provide a semiconductor process chamber, comprising: a chamber body and a wafer support device as described in any of the first aspects, wherein the wafer support device is disposed within the chamber body.

[0022] Thirdly, embodiments of the present invention provide a wafer processing method performed in the semiconductor process chamber described in the second aspect, comprising:

[0023] The controller controls each drive motor to run in a first direction, so that each drive motor drives the corresponding lifting mechanism to move up to a preset high position and then stops.

[0024] After receiving the wafer to be processed at the preset high position, the controller controls each drive motor to run in the second direction, so that the drive motor drives the corresponding lifting mechanism to descend until the wafer to be processed contacts the upper surface of the heating tray.

[0025] Determine whether the contact between the wafer to be processed and the upper surface of the heating tray is accurate;

[0026] If so, the wafer to be processed is subjected to target processing; otherwise, the controller individually controls at least one drive motor to drive the corresponding lifting mechanism to lift and lower until the wafer to be processed makes accurate contact with the upper surface of the heating tray.

[0027] Optionally, the controller individually controls at least one drive motor to drive a corresponding lifting mechanism to move up and down until the wafer to be processed accurately contacts the upper surface of the heating tray, including:

[0028] The controller acquires the sensing data of the position sensor corresponding to each of the lifting mechanisms, and confirms whether the wafer to be processed is in a tilted state based on the sensing data.

[0029] If so, the controller controls the start and stop of the at least one drive motor according to the sensor data, so as to adjust the height of each lifting mechanism corresponding to the at least one drive motor relative to the heating tray, until the multiple lifting mechanisms are at the same height, indicating that the wafer to be processed is in a horizontal state;

[0030] The preset height is reset based on the height adjustment result, and the wafer to be processed is placed on the heating tray.

[0031] The embodiments of the present invention provide one or more technical solutions, in which each lifting mechanism is individually equipped with a drive motor and a position sensor, enabling each lifting mechanism to be driven independently and thus adjusted individually. When there is a height difference between the lifting mechanisms, the controller can determine the height difference based on the sensing data of each sensor and drive the corresponding drive motor independently to adjust the height of at least one lifting mechanism so that the height of each lifting mechanism is consistent. Therefore, manual adjustment is no longer required, shortening the operation time and making the adjustment more accurate. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the wafer support device in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram showing the layout of the lifting mechanism and drive motor in an embodiment of the present invention;

[0035] Figure 3 This is a schematic flowchart of the wafer processing method in an embodiment of the present invention. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Unless otherwise specified, the embodiments of the present invention and the technical features thereof can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] In a first aspect, embodiments of the present invention provide a wafer support device for semiconductor processes, with reference to... Figure 1 As shown, the wafer support device provided in this embodiment of the invention includes:

[0038] The wafer carrier includes a heating tray 1 for supporting and heating the wafers; multiple lifting mechanisms 2, each lifting mechanism 2 being height-adjustable relative to the heating tray 1, and each lifting mechanism 2 having a corresponding drive motor 3 and a corresponding position sensor 4, i.e., a one-to-one correspondence between the drive motor 3 and the lifting mechanism 2, and a controller (not shown), the controller's signal output terminal being connected to the control signal input terminal of each drive motor 3, and the controller's signal input terminal being connected to each position sensor 4, thereby enabling the controller to obtain the sensing data of each position sensor 4 and control the start and stop of each drive motor 3. Specifically, the controller controls the corresponding drive motor 3 based on the sensing data of each position sensor 4 to drive the lifting mechanism 2 corresponding to that drive motor 3 to move up and down.

[0039] refer to Figure 2 For example, there can be three lifting mechanisms 2: 2-1, 2-2, and 2-3. Among them, a drive motor 3-1 is provided for lifting mechanism 2-1, which is used to drive the lifting of lifting mechanism 2-1 to adjust the lifting height of lifting mechanism 2-1 relative to heating tray 1; a drive motor 3-2 is provided for lifting mechanism 2-1, which is used to drive the lifting of lifting mechanism 2-2 to adjust the lifting height of lifting mechanism 2-2 relative to heating tray 1; and a drive motor 3-3 is provided for lifting mechanism 2-3, which is used to drive the lifting of lifting mechanism 2-3 to adjust the lifting height of lifting mechanism 2-3 relative to heating tray 1.

[0040] Specifically, the number of lifting mechanisms 2 is generally three or four. However, more can be set in actual implementation. Each lifting mechanism 4 can be evenly distributed relative to the heating tray 1. For example, each lifting mechanism 2 is equidistant from the center of the heating tray 1, and the lifting mechanisms 2 are equally spaced. Thus, the lifting of each lifting mechanism 2 can more smoothly receive the wafers entering the process chamber. Of course, other layouts can also be used, such as setting multiple rows of lifting mechanisms 2.

[0041] Through the above technical solution, the controller controls each drive motor 3 separately, so that each lifting mechanism 2 is driven independently, rather than by the same drive motor. Thus, each lifting mechanism 2 can lift and lower independently relative to the heating tray 1, instead of just synchronously. When each lifting mechanism 2 rises to a preset high position, it receives the wafer to be processed, and then each drive motor 3 drives the corresponding lifting mechanism 2 to descend until it reaches a preset zero position, at which point the wafer to be processed is placed on the heating tray 1.

[0042] Because each lifting mechanism 2 is equipped with its own drive motor 3, each lifting mechanism 2 can be driven independently, allowing for individual height adjustment. Even when there are height differences between the lifting mechanisms 2, the controller can individually drive the corresponding drive motor 3 to adjust the height of at least one lifting mechanism 2 to achieve a uniform height. This eliminates the need for manual adjustment, reducing operation time and improving accuracy. Furthermore, since there is no need to disassemble and reassemble the lifting mechanisms 2, their service life is extended.

[0043] In this embodiment of the invention, the position sensor 4 corresponding to each lifting mechanism 2 can be a contact sensor located at the zero point. The zero point refers to the position of the lifting mechanism 2 when the wafer to be processed contacts the heating tray 1. The position sensor 4 senses whether the corresponding lifting mechanism 2 has descended to the zero point. If the position sensor 4 corresponding to at least one lifting mechanism 2 does not detect a contact signal, it indicates that there is a height difference between the lifting mechanisms 2. The wafer to be processed supported on each lifting mechanism 2 is in a tilted state, which results in no close contact between the wafer to be processed and the heating tray 1, that is, the wafer to be processed is not placed in the correct position on the heating tray 1.

[0044] Of course, the position sensor 4 can also be a distance sensor to sense the distance between the corresponding lifting mechanism 2 and the preset position. If the distance values ​​between each distance sensor and the preset position are not the same, it indicates that there is a height difference between each lifting mechanism 2, which will cause the wafer to be processed supported on each lifting mechanism 2 to be in a tilted state.

[0045] refer to Figure 1Each lifting mechanism 2 can adopt the following structure, including: a lifting pin 21, one end of which passes through the heating tray 1 and extends to the upper surface of the heating tray 1; a lifting support plate 22, which is connected to the other end of the lifting pin 21, wherein the drive motor 3 corresponding to the lifting mechanism 2 is connected to the lifting support plate 22.

[0046] Specifically, the lifting pin 21 includes: a lifting rod 211, which passes through an opening on the heating tray 1, and the lower end of the lifting rod 211 is connected to the lifting support plate 22;

[0047] A support block 212 is positioned above the heating tray 1 and connected to the upper end of the lifting rod 211. For example, the upper surface of the support block 212 is horizontal, which helps to keep the wafer under processing stable when it is passed over.

[0048] In an optional implementation, each drive motor 3 includes a lifting cylinder and a connecting rod, with the lifting cylinder connected to one end of the connecting rod and the other end of the connecting rod connected to the lifting support plate 22.

[0049] In an optional embodiment of the present invention, the wafer carrier further includes a rotation drive device 5 connected to the heating tray 1, the heating tray 1 being supported on the rotation drive device 5, and a rotation sensor 6 being provided for the wafer carrier to sense the rotation state of the heating tray 1.

[0050] Secondly, embodiments of the present invention provide a semiconductor process chamber, comprising: a chamber body and a wafer support device as described in any embodiment of the first aspect, wherein the wafer support device is disposed within the chamber body. The specific structure of the wafer support device has already been described in the embodiments of the first aspect and will not be repeated here. In this case, the semiconductor chamber can be used for processes that do not require spraying, such as sputtering deposition.

[0051] In an optional embodiment, a spray head 7 is also provided in the cavity. The spray head 7 is positioned above the heating tray 1 and is spaced a certain distance from the heating tray 1. In this case, the semiconductor process chamber can be used for processes such as etching and polishing of wafers.

[0052] Thirdly, embodiments of the present invention provide a wafer processing method based on a semiconductor process chamber according to the second aspect, with reference to... Figure 3 As shown, the method includes the following steps:

[0053] S301. Control each drive motor 3 to run in the first direction through the controller, so that the lifting mechanism 2 corresponding to each drive motor 3 stops when it reaches the preset high position.

[0054] After the semiconductor process equipment is started, and before the wafer to be processed enters the process chamber of the semiconductor process equipment, each drive motor 3 is started, so that each drive motor 3 runs in a first direction, which is the direction that causes the corresponding lifting mechanism 2 to move upward. The drive motor 3 stops when the corresponding lifting mechanism 2 is driven upward to a preset high position.

[0055] S302. After receiving the wafer to be processed at the preset high position, the controller controls each drive motor 3 to run in the second direction, so that the drive motor 3 drives the corresponding lifting mechanism 2 to descend until the wafer to be processed contacts the upper surface of the heating tray 1. Herein, the first direction is the direction in which the corresponding lifting mechanism 2 descends.

[0056] S303. Determine whether the contact between the wafer to be processed and the upper surface of the heating tray 1 is accurate;

[0057] S304. If yes, then the wafer to be processed is subjected to target processing, such as deposition or etching. If no, the controller individually controls at least one drive motor 3 to drive the corresponding lifting mechanism 2 to lift until the wafer to be processed is in accurate contact with the upper surface of the heating tray 1.

[0058] Specifically, the controller individually activates the drive motor 3 corresponding to the lifting mechanism 2 that requires height adjustment, driving the lifting mechanism 2 to move up and down. For example, refer to... Figure 2 As shown, if it is necessary to adjust the height of the lifting mechanism 2-2, the controller will independently control the drive motor 3-2 to start, so as to drive the corresponding lifting mechanism 2-2 to lift.

[0059] In an optional implementation, the controller individually controls at least one drive motor 3 to drive the corresponding lifting mechanism 2 to move up and down, including:

[0060] The controller acquires the sensing data from the position sensor 4 corresponding to each lifting mechanism 2, and confirms whether the wafer to be processed is in a tilted state based on the sensing data. If so, the controller controls the start and stop of at least one drive motor 3 based on the sensing data to adjust the height of each lifting mechanism 2 corresponding to at least one drive motor 3 relative to the heating tray 1 until multiple lifting mechanisms 2 are at the same height, indicating that the wafer to be processed is in a horizontal state. The preset height is reset according to the height adjustment result, and the wafer to be processed is placed on the heating tray.

[0061] Because the preset height is reset based on the height adjustment results, a height difference still exists between each lifting mechanism 2 when the next wafer is received. This eliminates the need for further adjustment, thus improving production efficiency.

[0062] The embodiments of the present invention provide one or more technical solutions, in which each lifting mechanism 2 is individually configured with a drive motor 3 and a position sensor 4, enabling each lifting mechanism 2 to be driven individually and thus adjusted individually. When there is a height difference between the lifting mechanisms 2, the controller can determine the height difference based on the sensing data of each sensor and drive the corresponding drive motor 3 individually to adjust the height of at least one lifting mechanism 2 so that the height of each lifting mechanism 2 is consistent. Therefore, manual adjustment is no longer required, shortening the operation time and making the adjustment more accurate.

[0063] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0064] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A semiconductor process chamber, characterized in that, include: A cavity and a wafer support device, wherein the wafer support device is disposed within the cavity, and the wafer support device includes: A wafer carrier, comprising a heating tray for supporting and heating wafers, the wafer carrier further comprising a rotation drive device connected to the heating tray, the heating tray being supported by the rotation drive device; and a rotation sensor configured for the wafer carrier. Multiple lifting mechanisms are provided, each of which is adjustable in height relative to the heating tray. Each lifting mechanism is equipped with a separate drive motor and a separate position sensor. Each of the multiple lifting mechanisms includes: a lifting pin, one end of which passes through the heating tray and extends to the upper surface of the heating tray; and a lifting support plate connected to the other end of the lifting pin. The drive motor of the lifting mechanism is connected to the lifting support plate. The controller has its signal output terminal connected to the control signal input terminal of each drive motor and its signal input terminal connected to each position sensor. The controller controls the corresponding drive motor according to the sensing data of each position sensor to drive the lifting mechanism corresponding to the drive motor to lift. The position sensor corresponding to each lifting mechanism is a contact sensor set at the zero point. If the position sensor corresponding to at least one lifting mechanism does not detect a contact signal, it indicates that the wafer to be processed is not placed in the correct position on the heating tray.

2. The semiconductor process chamber as described in claim 1, characterized in that, The drive motor includes: A lifting cylinder and a connecting rod are provided, wherein one end of the lifting cylinder is connected to the connecting rod, and the other end of the connecting rod is connected to the lifting support plate.

3. The semiconductor process chamber as described in claim 2, characterized in that, The lifting pin includes: A lifting rod, the upper end of which passes through an opening on the heating tray, and the lower end of which is connected to the lifting support plate; A support block is disposed above the heating tray and connected to the upper end of the lifting rod.

4. The semiconductor process chamber as described in claim 1, characterized in that, The number of the plurality of lifting mechanisms is 3 or 4.

5. A wafer processing method performed in a semiconductor process chamber according to any one of claims 1-4, characterized in that, include: The controller controls each drive motor to run in a first direction, so that each drive motor drives the corresponding lifting mechanism to move up to a preset high position and then stops. After receiving the wafer to be processed at the preset high position, the controller controls each drive motor to run in the second direction, so that the drive motor drives the corresponding lifting mechanism to descend until the wafer to be processed contacts the upper surface of the heating tray. Determine whether the contact between the wafer to be processed and the upper surface of the heating tray is accurate; If so, then the wafer to be processed is subjected to target processing; Otherwise, the controller individually controls at least one drive motor to drive the corresponding lifting mechanism to lift and lower until the wafer to be processed makes accurate contact with the upper surface of the heating tray.

6. The method as described in claim 5, characterized in that, The controller individually controls at least one drive motor, so that the at least one drive motor drives the corresponding lifting mechanism to move up and down until the wafer to be processed makes accurate contact with the upper surface of the heating tray, including: The controller acquires the sensing data of the position sensor corresponding to each of the lifting mechanisms, and confirms whether the wafer to be processed is in a tilted state based on the sensing data. If so, the controller controls the start and stop of the at least one drive motor according to the sensor data, so as to adjust the height of each lifting mechanism corresponding to the at least one drive motor relative to the heating tray, until the multiple lifting mechanisms are at the same height, indicating that the wafer to be processed is in a horizontal state; The preset height is reset based on the height adjustment result, and the wafer to be processed is placed on the heating tray.

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