Infrared resistant visible light sensor encapsulation material and infrared resistant visible light sensor

Abstract

The application discloses an anti-infrared visible light sensor packaging material and an anti-infrared visible light sensor. The packaging material is a mixture of silica gel A, silica gel B and blue color glue. The silica gel A is a silicic acid gel; the silica gel B is methylphenyldiethoxysilane; and the blue color glue is formed by mixing blue tungsten oxide and alicyclic epoxy resin. The visible light sensor comprises a sensor frame, an IC chip and an infrared shielding layer. The IC chip is attached to the frame anode of the sensor frame. The anode of the IC chip is electrically connected to the frame anode through a metal wire. The cathode of the IC chip is electrically connected to the frame cathode through a metal wire. The packaging material is filled in the sensor frame to embed the IC chip, and the infrared shielding layer is formed by solidification. The anti-infrared packaging material and the specially designed visible light sensor structure make the visible light sensor have excellent anti-infrared interference capability, and can be popularized in small intelligent household appliances.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging materials and visible light sensor technology, specifically to an infrared-resistant visible light sensor packaging material and an infrared-resistant visible light sensor. Background Technology

[0002] Visible light sensors are a subfield of photoelectric sensors. Currently, visible light sensors can be categorized into low-end products (e.g., photoresistors, photodiodes / transistors), mid-range CMOS linear visible light sensors, and high-end digital visible light sensors based on their technological sophistication. Low-end photoresistors suffer from drawbacks such as high susceptibility to ambient temperature, slow response time, low sensitivity, and environmentally unfriendly manufacturing materials. Photodiodes and phototransistors offer better reliability, higher sensitivity, faster response, and are more environmentally friendly compared to photoresistors, but they have poor resistance to infrared interference. Anti-interference measures often involve external shielding materials, increasing costs and offering less than ideal shielding effectiveness. Furthermore, the use of external materials occupies space, limiting their market presence in small smart home appliances. Summary of the Invention

[0003] To address the problem of insufficient infrared interference resistance in existing infrared-resistant shielding materials used in visible light sensors, this invention provides a special visible light sensor encapsulation material with excellent infrared resistance, solving the problem of weak infrared resistance in existing shielding materials. Furthermore, to address the issue of large space occupation caused by the use of external shielding materials in existing visible light sensors, which hinders their widespread use in small smart home appliances, this invention provides a novel infrared-resistant visible light sensor, solving this technical problem.

[0004] This invention is achieved through the following technical solution:

[0005] An infrared-resistant visible light sensor encapsulation material, characterized in that the encapsulation material is a mixture of silicone A, silicone B, and blue adhesive; silicone A is silica gel; silicone B is methylphenyldiethoxysilane; and the blue adhesive is a mixture of blue tungsten oxide and alicyclic epoxy resin.

[0006] Specifically, the silicone A in the infrared-resistant visible light sensor encapsulation material provided by this invention is a colorless silicone with silicon-oxygen bonds as the main chain; the silicone B is a milky white silicone. The encapsulation material of this invention has strong infrared resistance, good sealing properties after curing, and excellent high-temperature resistance and electrical insulation properties.

[0007] Furthermore, an infrared-resistant visible light sensor encapsulation material comprises the following components in parts by weight: 6-8 parts blue adhesive, 20-30 parts silicone A, and 60-70 parts silicone B.

[0008] Furthermore, an infrared-resistant visible light sensor encapsulation material comprises the following components in parts by weight: 6 parts of blue adhesive, 24 parts of silicone A, and 60 parts of silicone B.

[0009] Furthermore, an infrared-resistant visible light sensor encapsulation material: the weight ratio of the blue tungsten oxide to the alicyclic epoxy resin in the blue adhesive is (2-5):(6-10).

[0010] Furthermore, an infrared-resistant visible light sensor encapsulation material: the weight ratio of the blue tungsten oxide to the alicyclic epoxy resin in the blue adhesive is 3:7.

[0011] An infrared-resistant visible light sensor, characterized in that the visible light sensor includes a sensor frame, an IC chip, and an infrared shielding layer; the IC chip is attached to the anode of the sensor frame; the anode of the IC chip and the anode of the frame are electrically connected through a metal wire; the cathode of the IC chip and the cathode of the frame are electrically connected through the metal wire; the aforementioned encapsulation material is filled in the sensor frame, and the IC chip is embedded in the encapsulation material, and the infrared shielding layer is solidified to form the infrared shielding layer.

[0012] Furthermore, an infrared-resistant visible light sensor: the infrared shielding layer is an infrared shielding layer with an arc-shaped surface.

[0013] Furthermore, an infrared-resistant visible light sensor includes a sensor frame with grooves forming a bowl-shaped frame; an IC chip is attached to the bottom of the bowl-shaped sensor frame; and an encapsulation material fills the grooves and cures to form an infrared shielding layer with an arc-shaped surface. Specifically, designing the surface of the infrared shielding layer as an arc-shaped curved surface can improve the stability of the sensor's measurement environment.

[0014] Furthermore, an infrared-resistant visible light sensor: the depth of the groove is at least three times the thickness of the IC chip.

[0015] The infrared-resistant visible light sensor provided by this invention incorporates a special infrared-resistant material during encapsulation, significantly improving the product's infrared resistance. Furthermore, the visible light sensor of this invention uses encapsulation material filled into the bottom of a recess in a bowl-shaped sensor frame, unlike traditional visible light sensors which use external infrared shielding materials. This results in a smaller footprint and solves the problem of its limited use in small smart home appliances.

[0016] This invention provides infrared-resistant packaging materials and a specially designed visible light sensor structure, enabling the visible light sensor designed in this invention to not only have excellent anti-infrared interference capabilities, but also to be widely used in small smart home appliances.

[0017] The beneficial effects of this invention are:

[0018] (1) This invention provides a visible light sensor encapsulation material with excellent infrared resistance, which solves the problem that the shielding materials of the prior art have low infrared resistance. This invention uses environmentally friendly encapsulation silicone material, including colorless silicone A with silicon-oxygen bonds as the main chain, milky white silicone B, and blue adhesive. The encapsulation material of this invention uses special components and proportions to make the encapsulation material resist infrared radiation by more than 90%. In addition, the encapsulation material of this invention has good sealing performance, high temperature resistance, and excellent electrical insulation after curing.

[0019] (2) The infrared-visible light sensor provided by the present invention uses a special design of IC chip to attach it to the bottom of the sensor frame, and then uses the prepared special encapsulation material to encapsulate it. It can achieve the dual functions of temperature compensation and infrared resistance. On the one hand, it can better resist the influence of ambient temperature on the sensor, and on the other hand, it improves the infrared resistance of the product.

[0020] (3) The infrared-visible light sensor of the present invention adopts a surface-mount packaging form, which has a better light-receiving area. The IC chip is attached to the bottom of the groove of the bowl-shaped sensor frame and connected to the anode and cathode of the sensor frame by metal wires respectively. During the packaging process, a special dispensing process is used to form an arc-shaped curved infrared shielding layer on the surface of the sensor frame, which increases the light-receiving area and angle, making the sensor measurement environment more stable and the sensor more adaptable to the environment. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a top view of the infrared-resistant visible light sensor of the present invention;

[0023] Figure 2 This is a cross-sectional view of the infrared-resistant visible light sensor of the present invention.

[0024] The markings in the diagram are: 1. Sensor frame, 2. IC chip, 3. Infrared shielding layer, 4. Metal wire, 11. Frame anode, 12. Frame cathode, 13. Groove. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0026] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "top," and "bottom," etc., indicating orientation or positional relationships, are merely for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein.

[0027] Example 1

[0028] An infrared-resistant visible light sensor encapsulation material, characterized in that: by weight, the encapsulation material is composed of a mixture of 24 parts of silicone A, 60 parts of silicone B, and 6 parts of blue adhesive; wherein: silicone A is silica gel; silicone B is methylphenyldiethoxysilane; the blue adhesive is composed of a mixture of blue tungsten oxide and alicyclic epoxy resin; and the mass ratio of blue tungsten oxide to alicyclic epoxy resin is 3:7.

[0029] Example 2

[0030] An infrared-resistant visible light sensor encapsulation material, characterized in that: by weight, the encapsulation material is composed of a mixture of 20 parts of silicone A, 65 parts of silicone B, and 8 parts of blue colorant; wherein: silicone A is silica gel; silicone B is methylphenyldiethoxysilane; the blue colorant is composed of a mixture of blue tungsten oxide and alicyclic epoxy resin; and the mass ratio of blue tungsten oxide to alicyclic epoxy resin is 2:6.

[0031] Example 3

[0032] An infrared-resistant visible light sensor encapsulation material, characterized in that: by weight, the encapsulation material is composed of a mixture of 30 parts of silicone A, 70 parts of silicone B, and 7 parts of blue adhesive; wherein: silicone A is silica gel; silicone B is methylphenyldiethoxysilane; the blue adhesive is composed of a mixture of blue tungsten oxide and alicyclic epoxy resin; and the mass ratio of blue tungsten oxide to alicyclic epoxy resin is 5:8.

[0033] Example 4

[0034] like Figure 1-2 As shown, an infrared-resistant visible light sensor is characterized in that the visible light sensor includes a sensor frame 1, an IC chip 2, and an infrared shielding layer 3; the sensor frame 1 has a groove 13 to form a bowl-shaped sensor frame 1; the IC chip 2 is attached to the bottom of the bowl-shaped sensor frame 1, that is, the IC chip 2 is attached to the frame anode 11 at the bottom of the sensor frame; the anode of the IC chip 2 and the frame anode 11 are electrically connected through a metal wire 4; the cathode of the IC chip 2 and the frame cathode 12 are electrically connected through the metal wire 4; the encapsulation material of the above embodiment 1 is filled in the groove 13, the IC chip 2 is embedded by the encapsulation material, and then cured to form the infrared shielding layer 3 with an arc-shaped surface, the arc-shaped surface increasing the light-receiving area.

[0035] Preferably, the depth of the groove 13 is at least three times the thickness of the IC chip 2.

[0036] The infrared-resistant packaging material provided by this invention can resist infrared radiation by more than 90%, and after it is cured to form an infrared shielding layer, it has good sealing performance, high temperature resistance and excellent electrical insulation.

[0037] The above-described preferred embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of the invention. Any obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. An infrared-reflective, visible light sensor encapsulant material, characterized by, The packaging material is a mixture of silica gel A, silica gel B and blue color glue, which comprises the following components in parts by weight: 6-8 parts of blue color glue, 20-30 parts of silica gel A and 60-70 parts of silica gel B. The silica gel A is a silicic acid gel; the silica gel B is methylphenyl diethoxysilane; the blue color glue is a mixture of blue tungsten oxide and alicyclic epoxy resin. The weight ratio of blue tungsten oxide to alicyclic epoxy resin in the blue color glue is (2-5):(6-10).

2. The infrared-reflective, visible light-transmissive encapsulant material of claim 1, wherein, The packaging material comprises the following components in parts by weight: 6 parts of blue color glue, 24 parts of silica gel A and 60 parts of silica gel B.

3. The infrared-reflective, visible light-transmissive encapsulant material of claim 1, wherein, The weight ratio of blue tungsten oxide to alicyclic epoxy resin in the blue color glue is 3:

7.

4. An infrared-opaque visible light sensor, characterized by The visible light sensor comprises a sensor frame (1), an IC chip (2) and an infrared shielding layer (3). The IC chip (2) is attached to the frame anode (11) of the sensor frame (1); the anode of the IC chip (2) is electrically connected to the frame anode (11) through a metal wire (4); the cathode of the IC chip (2) is electrically connected to the frame cathode (12) through the metal wire (4). The packaging material of any one of claims 1-3 is filled in the sensor frame (1) to embed the IC chip (2), and the infrared shielding layer (3) is formed by solidification.

5. The anti-infrared visible light sensor according to claim 4, wherein The infrared shielding layer (3) is an infrared shielding layer with an arc-shaped surface.

6. An infrared-reflective, visible light transmissive sensor according to claim 4 or 5, characterized in that The sensor frame (1) is provided with a groove (13) to form a bowl-shaped sensor frame; the IC chip (2) is attached to the bottom of the bowl-shaped sensor frame (1); the packaging material is filled in the groove (13) to form the infrared shielding layer (3) with an arc-shaped surface by solidification.

7. An infrared-reflective, visible light transmissive sensor according to claim 6, wherein The depth of the groove (13) is at least three times the thickness of the IC chip (2).

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