Luminescent substrate and preparation method thereof, display panel, and display device

Abstract

The present invention relates to a light-emitting substrate and a method for preparing the same, a display panel, and a display device. The light-emitting substrate includes a base substrate, one side of which is provided with an electrical signal routing layer, a first reflective layer, and a light-emitting unit; the electrical signal routing layer is connected to the light-emitting unit and is used to provide an electrical signal to the light-emitting unit; the first reflective layer is used to reflect and emit light incident on the first reflective layer; the light-emitting substrate also includes a reflective layer upper structure formed on the first reflective layer, the reflective layer upper structure includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure is greater than a set value. The above-mentioned light-emitting substrate has an overall light transmittance of the reflective layer upper structure greater than a set value, which can ensure that the first reflective layer reflects and reuses, and more light is transmitted from the light-transmitting area, and more light will be emitted from the light-emitting surface of the light-emitting substrate.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a light-emitting substrate and a preparation method thereof, a display panel, and a display device. Background Art

[0002] Backlight is an indispensable component for liquid crystal display panels to realize display. Existing backlights can be divided into edge-type backlights and direct-type backlights according to the light input method.

[0003] The light emitted by the light-emitting unit in an edge-lit backlight source is incident from the side, forming a surface light source. Edge-lit backlights can also reduce the thickness of the backlight and LCD panel. However, edge-lit backlights cannot achieve dynamic local dimming, and the display effect is inferior to direct-lit backlights.

[0004] The direct-type backlight directly places the light-emitting unit under the light-emitting surface. The light emitted by the light-emitting unit is diffused and mixed over a certain distance and on the diffusion plate before being emitted as a surface light source.

[0005] However, direct-lit backlights have layers of resin materials in their optical path. Currently used resin materials have low light transmittance, which affects the brightness of light emitted from the light-emitting surface of direct-lit backlights. Furthermore, these resin materials absorb certain colors of light significantly more than other colors. For example, they absorb blue light significantly more than red, green, and other colors. This can cause color shift in the light emitted from the light-emitting surface of direct-lit backlights. Summary of the Invention

[0006] The present invention provides a light-emitting substrate and a preparation method thereof, a display panel and a display device, so as to solve at least one of the technical problems existing in the prior art, namely, low brightness and color deviation of light emitted from a light-emitting surface of a backlight source.

[0007] The light-emitting substrate provided by the present invention includes a base substrate, one side of which is provided with an electrical signal routing layer, a first reflective layer and a light-emitting unit; the electrical signal routing layer is connected to the light-emitting unit and is used to provide an electrical signal to the light-emitting unit; the first reflective layer is used to reflect and emit light incident on the first reflective layer; the light-emitting substrate also includes a reflective layer upper structure formed on the first reflective layer, the reflective layer upper structure includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure is greater than a set value.

[0008] The structure on the reflective layer includes a functional layer, which is a reflective protective layer, and the material of the reflective protective layer is an inorganic material.

[0009] The reflection protection layer is a single-layer structure, and the material of the reflection protection layer is any one of SiN, SiON and SiO; the reflection protection layer is a multi-layer stacked structure, and the material of each layer is any one of SiN, SiON and SiO.

[0010] There is one electrical signal routing layer; and the first reflective layer is formed above the electrical signal routing layer.

[0011] In which, an electrical signal routing protection layer is formed above the electrical signal routing layer, and the electrical signal routing protection layer covers the pattern of the electrical signal routing layer to protect the pattern of the electrical signal routing layer; a flattening layer for flattening the surface of the electrical signal routing layer is not provided above the electrical signal routing layer; the first reflective layer is formed above the electrical signal routing protection layer; or, the first reflective layer is formed between the electrical signal routing protection layer and the electrical signal routing layer.

[0012] A planarization layer for planarizing the surface of the electrical signal wiring layer is formed above the electrical signal wiring layer, and the material of the planarization layer is a resin material; the first reflective layer is formed above the planarization layer.

[0013] The electrical signal wiring layer is a multi-layer structure, which is stacked, and the first reflective layer is formed above the uppermost electrical signal wiring layer.

[0014] Among them, a corresponding electrical signal routing protection layer is formed above each of the electrical signal routing layers, and the electrical signal routing protection layer covers the pattern of the corresponding electrical signal routing layer to protect the pattern of the corresponding electrical signal routing layer; a flattening layer for flattening the surface of the electrical signal routing layer is not provided above the topmost electrical signal routing layer; the first reflective layer is formed above the topmost electrical signal routing protection layer, or the first reflective layer is formed between the topmost electrical signal routing protection layer and the corresponding electrical signal routing layer.

[0015] A planarization layer for planarizing the surface of the topmost electrical signal wiring layer is formed above the topmost electrical signal wiring layer, and the material of the planarization layer is a resin material; the first reflective layer is formed above the planarization layer.

[0016] The light-emitting substrate further includes a second reflective layer, which is formed above the other electrical signal routing layers except the uppermost electrical signal routing layer and is located between each electrical signal routing layer and the adjacent upper electrical signal routing layer.

[0017] In which, the light-emitting substrate includes a light-transmitting area and a non-light-transmitting area; the electrical signal routing layer, the pattern of the first reflective layer and the light-emitting unit are arranged in the non-light-transmitting area; the light-transmitting area allows light to pass through the first side of the light-emitting substrate and emit toward the second side of the light-emitting substrate, and the first side of the light-emitting substrate is the side where the electrical signal routing layer, the first reflective layer and the light-emitting unit are located; the light-emitting substrate includes a base substrate and a structure on the reflective layer in the light-transmitting area.

[0018] In which, the light-emitting substrate includes a light-transmitting area and a non-light-transmitting area; the pattern of the electrical signal routing layer, the first reflective layer and the light-emitting unit are arranged in the non-light-transmitting area; the light-transmitting area allows light to pass through the first side of the light-emitting substrate and emit toward the second side of the light-emitting substrate, and the first side of the light-emitting substrate is the side where the electrical signal routing layer, the first reflective layer and the light-emitting unit are located; an electrical signal routing protection layer is formed above each layer of the electrical signal routing layer, and the electrical signal routing protection layer covers the pattern of the electrical signal routing layer to protect the pattern of the electrical signal routing layer; the light-emitting substrate includes a base substrate and the electrical signal routing protection layer in the light-transmitting area.

[0019] Wherein, the light-emitting unit is LED, Mini LED or Micro LED.

[0020] The method for preparing a light-emitting substrate provided by the present invention comprises the following steps:

[0021] forming a pattern of a first reflective layer on a base substrate having an electrical signal wiring layer;

[0022] A reflective layer upper structure is formed on the pattern of the first reflective layer, wherein the reflective layer upper structure includes at least one functional layer, and an overall light transmittance of the reflective layer upper structure is greater than a set value.

[0023] Wherein, the structure on the reflective layer includes a functional layer, and the functional layer is a reflective protective layer;

[0024] The steps of forming the reflective protective layer include:

[0025] covering an inorganic material layer above the pattern of the first reflective layer;

[0026] The inorganic material layer is patterned to form a pattern of the reflective protection layer.

[0027] The number of the electrical signal routing layer of the light-emitting substrate to be prepared is one;

[0028] The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer:

[0029] forming an electrical signal wiring protection layer on the base substrate having the electrical signal wiring layer formed thereon;

[0030] The step of forming the first reflective layer includes:

[0031] A material layer covering the first reflective layer above the electrical signal routing protection layer;

[0032] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0033] or

[0034] The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer:

[0035] forming a planarization layer on the base substrate having the electrical signal wiring layer formed thereon;

[0036] The step of forming the first reflective layer includes:

[0037] a material layer covering the first reflective layer above the planarization layer;

[0038] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0039] or

[0040] The step of forming the first reflective layer includes:

[0041] Before forming the electrical signal routing protection layer, a material layer of the first reflective layer is covered on the electrical signal routing layer;

[0042] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0043] The method for preparing the light-emitting substrate further includes, after forming the first reflective layer:

[0044] The step of forming an electrical signal wiring protection layer above the formed first reflective layer belongs to the step of forming a structure on the reflective layer.

[0045] The number of electrical signal routing layers of the light-emitting substrate to be prepared is a multi-layer stacked structure;

[0046] The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer:

[0047] forming an electrical signal wiring protection layer above the uppermost electrical signal wiring layer on the base substrate;

[0048] The step of forming the first reflective layer includes:

[0049] a material layer covering the first reflective layer on the electrical signal routing protection layer formed above the uppermost electrical signal routing layer;

[0050] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0051] or

[0052] The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer:

[0053] forming a planarization layer on the uppermost electrical signal wiring layer on the substrate;

[0054] The step of forming the first reflective layer includes:

[0055] a material layer covering the first reflective layer on the planarization layer formed above the uppermost electrical signal wiring layer;

[0056] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0057] or

[0058] The step of forming the first reflective layer includes:

[0059] Before forming the electric signal wiring protection layer, a material layer of the first reflective layer is covered on the uppermost electric signal wiring layer;

[0060] performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer;

[0061] The method for preparing the light-emitting substrate further includes, after forming the first reflective layer:

[0062] The step of forming an electrical signal wiring protection layer above the formed first reflective layer belongs to the step of forming a structure on the reflective layer.

[0063] In the step of forming the pattern of the planarization layer, the material of the planarization layer formed in the light-transmitting area of ​​the light-emitting substrate is removed.

[0064] The method for preparing the light-emitting substrate further comprises:

[0065] Before forming the next electrical signal wiring layer, forming a second reflective layer on the formed electrical signal wiring layer;

[0066] The step of forming the second reflective layer comprises:

[0067] A material layer covering the second reflective layer above each formed electrical signal wiring layer;

[0068] The material layer of the formed second reflective layer is subjected to a patterning process to form a pattern of the second reflective layer.

[0069] The display panel provided by the present invention includes the above-mentioned light-emitting substrate.

[0070] The display device provided by the present invention includes the above-mentioned display panel.

[0071] The light-emitting substrate and its preparation method, display panel, and display device provided by the embodiments of the present invention have the following advantages over the prior art:

[0072] An embodiment of the present invention provides a light-emitting substrate, wherein one side of its base substrate is provided with an electrical signal routing layer, a first reflective layer, and a light-emitting unit, as well as a reflective layer upper structure formed on the first reflective layer; the reflective layer upper structure includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure is greater than a set value. By setting the overall light transmittance of light passing through the reflective layer upper structure to be greater than a set value, the set value is used as a standard value. A value greater than the set value indicates that the overall light transmittance of light passing through the reflective layer upper structure is high, which means that the reflective layer upper structure has a low light absorptivity. This ensures that more light is incident on the first reflective layer, and that more of the light reflected and emitted by the first reflective layer ultimately reaches the reflective device above the light-emitting substrate. This ultimately ensures that more light is reflected and reused by the first reflective layer, irradiating and transmitting the light-transmitting area of ​​the light-emitting substrate, and more light is emitted from the light-emitting surface of the light-emitting substrate, thereby enabling a display panel using the light-emitting substrate provided by the present invention to achieve higher display brightness and other better display effects.

[0073] In a method for preparing a light-emitting substrate provided by an embodiment of the present invention, the overall light transmittance of a structure on a reflective layer formed on a first reflective layer in the prepared light-emitting substrate is greater than a set value. By setting the overall light transmittance of light passing through the structure on the reflective layer to be greater than a set value, the set value serves as a standard value. A value greater than the set value indicates a higher overall light transmittance of light passing through the structure on the reflective layer, which means that the structure on the reflective layer has a lower light absorptivity. This ensures that more light is incident on the first reflective layer, and that more of the light reflected and emitted by the first reflective layer ultimately reaches the reflective device above the light-emitting substrate. This ultimately ensures that more light is reflected and reused by the first reflective layer, irradiating and transmitting the light-transmitting area of ​​the light-emitting substrate. Consequently, more light is emitted from the light-emitting surface of the light-emitting substrate, enabling a display panel using the light-emitting substrate to achieve higher display brightness and other better display effects.

[0074] The display panel provided by the embodiment of the present invention includes a light-emitting substrate, and the amount of light emitted from the light-emitting surface of the light-emitting substrate is greater and the brightness is higher, thereby improving the display brightness of the display panel and achieving a better display effect.

[0075] The display device provided by the embodiment of the present invention has the above-mentioned display panel and has the same beneficial effects as the above-mentioned display panel, which will not be described in detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0077] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0078] Figure 1 Schematic diagram of the structure of the light-emitting substrate in an embodiment of the present invention;

[0079] Figure 2 for Figure 1 A schematic structural diagram of the first electrical signal routing layer in the light-emitting substrate shown;

[0080] Figure 3 for Figure 1 A schematic structural diagram of the second electrical signal routing layer superimposed on the first electrical signal routing layer in the light-emitting substrate shown;

[0081] Figure 4 for Figure 1 A schematic structural diagram of the first reflective layer in the light-emitting substrate shown;

[0082] Figure 5 This is a structural diagram of a light-emitting substrate;

[0083] Figure 6 for Figure 1 A schematic diagram of a reflective protection layer and a second planarization layer in the light-emitting substrate shown;

[0084] Figure 7 for Figure 1 A schematic diagram of the state of the reflective protection layer and the second planarization layer on the peripheral side of the light-emitting unit in the light-emitting substrate shown;

[0085] Figure 8 for Figure 5 A schematic diagram of a second electrical signal routing protection layer and a second planarization layer in a light-emitting substrate shown;

[0086] Figure 9 for Figure 5 A schematic diagram of the state of the second electrical signal routing protection layer and the second planarization layer on the peripheral side of the light-emitting unit in the light-emitting substrate shown;

[0087] Figure 10for Figure 1 A schematic structural diagram of an alternative embodiment of the light-emitting substrate shown;

[0088] Figure 11 for Figure 1 A schematic structural diagram of another alternative embodiment of the light-emitting substrate shown;

[0089] Figure 12 This is a flow chart of a method for preparing a light-emitting substrate in one embodiment of the present invention;

[0090] Figure 13 A schematic diagram of a substrate for preparing a substrate layer on a substrate;

[0091] Figure 14 A flowchart of preparing the patterns of multiple electrical signal routing layers and related layer structures in step S12;

[0092] Figure 15 A schematic diagram of forming a first electrical signal routing layer;

[0093] Figure 16 A schematic diagram of forming a first electrical signal routing protection layer;

[0094] Figure 17 is a schematic diagram of forming a first planarization layer;

[0095] Figure 18 A schematic diagram of forming an interface performance improvement layer;

[0096] Figure 19 A schematic diagram of forming a second electrical signal routing layer;

[0097] Figure 20 A schematic diagram of forming a second electrical signal routing protection layer;

[0098] Figure 21 is a schematic diagram of forming a second planarization layer;

[0099] Figure 22 is a schematic diagram of forming a first reflective layer;

[0100] Figure 23 is a flow chart of forming the first reflective layer in step S14;

[0101] Figure 24 is a schematic diagram of forming a reflective protective layer;

[0102] Figure 25 Flowchart of forming a reflective protective layer in step S15;

[0103] Figure 26 A schematic diagram of installing a light-emitting unit;

[0104] Figure 27is a flow chart of a method for preparing a light-emitting substrate in another embodiment of the present invention;

[0105] Figure 28 is a flow chart of a method for preparing a light-emitting substrate in another embodiment of the present invention;

[0106] Figure 29 This is a flow chart of forming the first reflective layer in step S33;

[0107] Figure 30 for Figure 28 A flowchart of step S32 in an alternative embodiment of the method for preparing a light-emitting substrate is shown;

[0108] Figure 31 is a flow chart of a method for preparing a light-emitting substrate in another embodiment of the present invention;

[0109] Figure 32 This is a flow chart of forming the electrical signal routing layer and the electrical signal routing protection layer in step S42;

[0110] Figure 33 is a flow chart of forming the first reflective layer in step S44;

[0111] Figure 34 is a flow chart of a method for preparing a light-emitting substrate in another embodiment of the present invention;

[0112] Figure 35 Flowchart of a method for preparing a light-emitting substrate in another embodiment of the present invention.

[0113] In the picture:

[0114] 10 - substrate; 11 - signal routing layer; 12 - first reflective layer; 13 - light-emitting unit; 14 - structure on the reflective layer; 15 - planarization layer; 16 - signal routing protection layer; 17 - second reflective layer; 18 - interface performance improvement layer;

[0115] 100-substrate; 101-substrate layer;

[0116] 111-first electrical signal routing layer; 112-second electrical signal routing layer;

[0117] 140-reflective protective layer;

[0118] 151 - first planarization layer; 152 - second planarization layer;

[0119] 161 - a first electrical signal routing protection layer; 162 - a second electrical signal routing protection layer. DETAILED DESCRIPTION

[0120] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0121] The following describes embodiments of the light-emitting substrate and its preparation method, the display panel, and the display device provided by the present invention in conjunction with the accompanying drawings.

[0122] In the embodiment of the light-emitting substrate, the light-emitting substrate serves as a surface light source, specifically a backlight source for a display panel. When used as a backlight source, the light-emitting substrate is more specifically a direct-lit backlight source. In addition to being used as a backlight source, the light-emitting substrate can also serve other possible uses as a surface light source.

[0123] See Figure 1 The light emitting substrate includes a base substrate 10 . An electrical signal wiring layer 11 , a first reflective layer 12 and a light emitting unit 13 are provided on one side of the base substrate 10 .

[0124] Specifically, the substrate 10 includes a substrate 100 and a substrate layer 101 formed on the substrate 100, wherein the substrate 100 can be a glass substrate or can be made of other materials. The substrate layer 101 can be a single-layer structure or a multi-layer stacked structure. The material of each layer structure of the substrate layer 101 can be selected from silicon nitride (SiNx), silicon oxynitride (SiON) or silicon oxide (SiOx). The substrate layer 101 can serve as a reverse stress layer to prevent the substrate 100 from warping due to other layer structures formed on the substrate 100 (such as the electrical signal routing layer 11 made of Cu material, etc.).

[0125] The light-emitting substrate itself serves as a surface light source. As far as its light-emitting surface is concerned, the light-emitting substrate includes a light-transmitting area and a non-light-transmitting area. The pattern of the electrical signal routing layer 11, the first reflective layer 12 and the light-emitting unit 13 are arranged in the non-light-transmitting area (the electrical signal routing layer 11, the first reflective layer 12 and the light-emitting unit 13 themselves are not light-transmitting. In fact, the electrical signal routing layer 11, the first reflective layer 12 and the light-emitting unit 13 roughly define the area where they are located as the non-light-transmitting area within the light-emitting surface of the light-emitting substrate, and other areas besides these are roughly light-transmitting areas); the light-transmitting area allows light to enter and transmit from the first side of the light-emitting substrate and be emitted from the second side of the light-emitting substrate, that is, the second side of the light-emitting substrate is the light-emitting surface of the light-emitting substrate. Among them, the first side of the light-emitting substrate is the side where the electrical signal routing layer 11, the first reflective layer 12 and the light-emitting unit 13 are located (that is Figure 1 The second side is the other side opposite to the first side (i.e. Figure 1(shown below).

[0126] In the following description, unless otherwise specified, for ease of description, the first side of the light-emitting substrate is referred to as the upper side, and the second side of the light-emitting substrate is referred to as the lower side. In the corresponding drawings, the first side of the light-emitting substrate is also oriented upward, and the second side of the light-emitting substrate is oriented downward. Therefore, in the following description, expressions such as "A is above B" and "A is formed on B" indicate that A is located on the first side relative to B, and is located in the upper position in the drawings, while B is located on the second side relative to A, and is located in the lower position in the drawings.

[0127] The electrical signal routing layer 11 is connected to the light emitting unit 13 and is used to provide electrical signals to the light emitting unit 13. The number of electrical signal routing layers 11 can be one or more, and the plurality of electrical signal routing layers 11 are stacked up and down. Figure 1 In the embodiment shown, the number of the electrical signal routing layer 11 is multiple, specifically including a first electrical signal routing layer 111 and a second electrical signal routing layer 112, wherein the first electrical signal routing layer 111 is at the bottom and the second electrical signal routing layer 112 is at the top. The actual pattern of the first electrical signal routing layer 111 can be as follows: Figure 2 As shown, Figure 3 The actual pattern of the second electrical signal routing layer 112 superimposed on the first electrical signal routing layer 111 is shown; the first electrical signal routing layer 111 and the second electrical signal routing layer 112 are respectively as shown in FIG. Figure 2 、 Figure 3 There are identifiable features in the direction of the arrow shown in , and the identifiable features can specifically be graphic traces, gaps, and corresponding width parameters.

[0128] The electrical signal routing layer 11 is primarily made of Cu; it can be a single-layer structure or a multi-layer stacked structure. When the electrical signal routing layer 11 is a multi-layer stacked structure, in addition to the main Cu layer, it can also have additional layers, for example, to improve adhesion to adjacent layers. Depending on the type of adjacent layers, the electrical signal routing layer can be a two-layer stacked structure of MTD / Cu, a three-layer stacked structure of MTD / Cu / MTD, or a two-layer stacked structure of MTD / CuNi.

[0129] The first reflective layer 12 is used to reflect the light incident on the first reflective layer 12 and emit it out. The first reflective layer 12 is specifically arranged above the electrical signal wiring layer 11. When the number of the electrical signal wiring layer 11 is one, the first reflective layer 12 is arranged above the electrical signal wiring layer 11; when the electrical signal wiring layer 11 is, for example, Figure 1When there are multiple layers as shown, the first reflective layer 12 is arranged above the uppermost electrical signal routing layer 11, that is, above all electrical signal routing layers 11. The actual pattern of the first reflective layer 12 can be as follows: Figure 4 As shown, the first reflective layer 12 is Figure 4 There are identifiable features in the direction of the arrow shown, and the identifiable features may specifically be graphic traces, gaps, and corresponding width parameters.

[0130] The first reflective layer 12 can be a single-layer structure or a multi-layer stacked structure. When the first reflective layer 12 is a single-layer structure, the material of the first reflective layer 12 is selected to have high reflectivity in the visible light range, and specifically, it can be a metal material with high reflectivity such as Ag or Al. When the first reflective layer 12 is a multi-layer stacked structure, the main material of the first reflective layer 12 is selected to have high reflectivity in the visible light range, and specifically, it can be a metal material with high reflectivity such as Ag or Al. In one embodiment, the first reflective layer 12 is preferably a multi-layer stacked structure; specifically, it can be a three-layer stacked structure of ITO / Ag / ITO. In this three-layer stacked structure, the Ag layer is the main layer and plays the main reflective role, and the ITO layer is mainly used to improve the adhesion of the Ag layer and prevent oxidation of the Ag layer.

[0131] The light-emitting unit 13 is used to emit light according to the electrical signal provided by the electrical signal routing layer 11. Specifically, the light-emitting unit 13 can be a light-emitting diode (LED) type light-emitting device, such as an ordinary light-emitting diode device (the size of this type of LED device is relatively large, generally above 300 microns), a sub-millimeter light-emitting diode (MiniLight Emitting Diode, referred to as Mini LED, its size is generally between 100 microns and 300 microns) device or a micro light-emitting diode (Micro Light Emitting Diode, referred to as Micro LED, its size is generally less than 100 microns) device.

[0132] like Figure 1 As shown, the light-emitting substrate further includes a reflective layer upper structure 14 formed on the first reflective layer 12. The reflective layer upper structure 14 includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure 14 is greater than a set value. The so-called overall light transmittance refers to the transmittance of light passing through all functional layers when the reflective layer upper structure 14 has multiple functional layers, or the transmittance of light passing through only one functional layer when the reflective layer upper structure 14 has only one functional layer.

[0133] When the light emitting substrate in the above embodiment is used in a liquid crystal display panel to realize display, the second side of the light emitting substrate is the light emitting surface of the light emitting substrate, that is, the side that is connected to the liquid crystal cell of the liquid crystal display panel, and the first side is the side of the light emitting substrate that is opposite to the liquid crystal cell of the liquid crystal display panel. Figure 1 The light is emitted from the upper side of the light-emitting substrate shown in the figure. A reflective device (not shown in the figure) is provided above the light-emitting substrate. The reflective device reflects the light emitted upward by the light-emitting unit 13 and emits it downward. The light emitted downward is divided into two parts, wherein the first part of the light is irradiated on the light-transmitting area of ​​the light-emitting substrate. This part of the light can be transmitted from the light-transmitting area of ​​the light-emitting substrate and incident on the liquid crystal box located on the lower side, thereby being used to realize display. The other second part of the light is irradiated on the non-light-transmitting area of ​​the light-emitting substrate, wherein the light irradiated on the first reflective layer 12 is reflected by the first reflective layer 12 and reflected toward the reflective device located on the upper side of the light-emitting substrate, so that at least part of the second part of the light can be reflected by the reflective device and emitted to the light-transmitting area of ​​the light-emitting substrate, and then, like the above-mentioned first part of the light, is incident on the liquid crystal box located on the lower side of the light-emitting substrate for realizing display.

[0134] As can be seen from the above, providing the first reflective layer 12 can increase the amount of light emitted from the light-emitting surface of the light-emitting substrate, and accordingly can increase the amount of light incident from the light-emitting substrate into the liquid crystal box, thereby achieving higher display brightness and better display effects.

[0135] As for the light in the second portion of light that impinges on the light-emitting unit 13, since the light-emitting unit 13 itself can emit light, it is not convenient to reflect and reuse this portion of light. However, under normal circumstances, the first reflective layer 12 is disposed above the electrical signal routing layer 11, and there is a large overlap between the first reflective layer 12 and the electrical signal routing layer 11. It can be roughly assumed that the first reflective layer 12 covers the pattern of the electrical signal routing layer 11. Therefore, almost no or only a small amount of the light in the second portion of light impinges on the electrical signal routing layer 11. Overall, the first reflective layer 12 reflects the vast majority of the second portion of light that can be reflected and reused, thereby achieving light reuse.

[0136] Based on the above description, combined with Figure 1As shown, when the first reflective layer 12 reflects and reuses the second portion of light, both the light incident on the first reflective layer 12 and the light reflected and emitted from the first reflective layer 12 will pass through the reflective layer upper structure 14. In the above embodiment, the overall light transmittance of light passing through the reflective layer upper structure 14 is greater than a set value. This set value serves as a standard value. A value greater than this set value indicates a higher overall light transmittance through the reflective layer upper structure 14, which means that the reflective layer upper structure 14 has a lower light absorptivity. This ensures that more light is incident on the first reflective layer 12, and that more of the light reflected and emitted from the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate. This ultimately ensures that more light is reflected and reused by the first reflective layer 12, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting therethrough. Consequently, more light is incident on the liquid crystal cell, thereby achieving higher display brightness and other better display effects.

[0137] A structure of a light-emitting substrate such as Figure 5 As shown, the structure 14 on the reflective layer includes a planarization layer 15 located above the uppermost electrical signal routing layer 11 (i.e., the second electrical signal routing layer 112), i.e., a second planarization layer 152. The second planarization layer 152 covers the electrical signal routing layer 11 and the first reflective layer 12, and is used to form a flat surface, so as to facilitate the formation of good process conditions (including favorable factors such as forming a certain buffer and forming a flat surface) when installing the light-emitting unit 13. The planarization layer 15 is usually made of a resin material process (which can be called a resin layer). The resin material currently used to prepare the planarization layer 15 has a strong ability to absorb light. Therefore, in Figure 5 In the illustrated light-emitting substrate, the second planarization layer 152 has a low light transmittance. Based on the above description, both light incident on the first reflective layer 12 and light reflected and emitted from the first reflective layer 12 will pass through the second planarization layer 152. However, due to the low transmittance of light through the second planarization layer 152, a considerable amount of light will be absorbed by the second planarization layer 152 when it passes through the second planarization layer 152 and illuminates the first reflective layer 12, and when the light reflected from the first reflective layer 12 is emitted through the second planarization layer 152. As a result, less light is reflected from the first reflective layer 12, reflected by the reflective device, and ultimately illuminates the light-transmitting area of ​​the light-emitting substrate and transmits. As a result, the improvement in display brightness achieved by the first reflective layer 12 reflecting and reusing the second portion of light is relatively small.

[0138] Compared to Figure 5 In the above embodiment, the light emitting substrate also includes a planarization layer 15, and as shown in FIG. Figure 1As shown, the number of planarization layers 15 can be multiple, but no matter whether the number of planarization layers 15 is one or multiple, any planarization layer 15 is located below the first reflective layer 12, not above the first reflective layer 12, and does not belong to the structure 14 on the reflective layer.

[0139] For example, in Figure 1 In the embodiment shown, there are two planarization layers 15, namely a first planarization layer 151 and a second planarization layer 152. The first planarization layer 151 is formed above the first electrical signal routing layer 111 (not exceeding the second electrical signal routing layer 112, and between the first electrical signal routing layer 111 and the second electrical signal routing layer 112), and the second planarization layer 152 is formed above the second electrical signal routing layer 112. Figure 1 In the illustrated light-emitting substrate, both the first planarization layer 151 and the second planarization layer 151 are located below the first reflective layer 12. That is, the functional layers of the structure 14 on the reflective layer do not include any planarization layer 15. Thus, for the first reflective layer 12, neither the light incident on the first reflective layer 12 nor the light reflected and emitted by the first reflective layer 12 passes through any of the planarization layers 15. Consequently, a large amount of light is not absorbed and lost by the planarization layer 15. Instead, the first reflective layer 12 is able to reflect more light, ultimately illuminating the light-transmitting area of ​​the light-emitting substrate and transmitting it for display, achieving higher display brightness and other better display effects.

[0140] In one embodiment, the planarization layer 15 may be made of a resin material, and more specifically, may be a resin photoresist (resin photoresist).

[0141] exist Figure 1 In the light-emitting substrate shown, the structure 14 on the reflective layer includes a functional layer, which is a reflective protective layer 140. The reflective protective layer 140 covers the pattern of the first reflective layer 12 and is used to protect the first reflective layer 12 and prevent the first reflective layer 12 from being oxidized.

[0142] The material of the reflective protective layer 140 is an inorganic material, specifically silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO). The reflective protective layer 140 can specifically be a single-layer structure, in which case the material of the reflective protective layer 140 is any one of SiN, SiON, and SiO. Furthermore, the reflective protective layer 140 can also be a multi-layer stacked structure, in which case the material of each layer is any one of SiN, SiON, and SiO. Materials such as SiN, SiON, and SiO have low light absorption rates, thus ensuring that the light transmittance through the reflective protective layer 140 is high and higher than a set value, thereby satisfying the requirement that the overall light transmittance of the structure 14 on the reflective layer is greater than the set value.

[0143] In the above embodiment, if Figure 1 and Figure 6 As shown, the reflective protection layer 140 is formed on the second planarization layer 152. This relationship is reflected in the area connected to the peripheral side of the light emitting unit 13. Figure 7 As shown, the reflective protective layer 140 is located on the inner side adjacent to the light emitting unit 13, while the second planarization layer 152 is located on the outer side of the reflective protective layer 140. The reflective protective layer 140 is located between the second planarization layer 152 and the light emitting unit 13. Figure 5 In the light emitting substrate shown, see Figure 5 and Figure 8 The second planarization layer 152 is located above the second electrical signal routing protection layer 162, and is reflected in the area connected to the peripheral side of the light emitting unit 13. Figure 9 As shown, the second planarization layer 152 is located on the inner side adjacent to the light emitting unit 13, while the second electrical signal routing protection layer 162 is located on the outer side of the second planarization layer 152. The second planarization layer 152 is located between the light emitting unit 13 and the second electrical signal routing protection layer 162.

[0144] The number of the electrical signal routing layers 11 can be multiple, and the multiple electrical signal routing layers 11 are stacked. In this case, the first reflective layer 12 is formed above the uppermost electrical signal routing layer 11. For example, Figure 1 In the light-emitting substrate shown, the first reflective layer 12 is formed above the second electrical signal wiring layer 112 .

[0145] In the light-emitting substrate where the first reflective layer 12 is formed above the uppermost electrical signal wiring layer 11, the specific location of the first reflective layer 12 can be set as follows:

[0146] A planarization layer 15 is formed above the uppermost electrical signal wiring layer 11 to planarize the surface of the uppermost electrical signal wiring layer 11 . The planarization layer 15 is made of a resin material. The first reflective layer 12 is formed above the planarization layer 15 .

[0147] For example, in Figure 1 In the light-emitting substrate shown, a first electric signal routing protection layer 161 and a first planarization layer 151 are formed above the first electric signal routing layer 111, and further above are an interface performance improvement layer 18 and a second electric signal routing layer 112, wherein the interface performance improvement layer 18 is used to improve the interface contact performance of the second electric signal routing layer 112 to be formed subsequently, and its material can be the same as that of the electric signal routing protection layer 16. A second electric signal routing protection layer 162 and a second planarization layer 152 are formed above the second electric signal routing layer 112. The first reflective layer 12 is formed above the second planarization layer 152. As described above Figure 5Compared with the light-emitting substrate shown in Figure 1 In the light-emitting substrate of the structure shown, the setting position of the first reflective layer 12 is adjusted so that the first reflective layer 12 is located above the second planarization layer 152 instead of below the second planarization layer 152. At this time, the second planarization layer 152 does not belong to the reflective layer upper structure 14. When light is incident on the first reflective layer 12 and the first reflective layer 12 reflects and emits light, it will not pass through the second planarization layer 152, thereby avoiding the second planarization layer 152 from absorbing light. This allows the first reflective layer 12 to reflect and emit more light, which is ultimately irradiated on the light-transmitting area of ​​the light-emitting substrate and transmitted for display, thereby achieving higher display brightness and other better display effects.

[0148] Regarding the specific location of the first reflective layer 12, in addition to the above-mentioned location, it can also be located in the following manner:

[0149] Among the multiple electrical signal routing layers 11, at least the topmost electrical signal routing layer 11 is provided with a corresponding electrical signal routing protection layer 16 formed thereon. The electrical signal routing protection layer 16 covers the pattern of the corresponding electrical signal routing layer 11 to protect the pattern of the corresponding electrical signal routing layer 11. A planarization layer 15 for planarizing the surface of the electrical signal routing layer 11 is not provided above the topmost electrical signal routing layer 11. The first reflective layer 12 is formed above the topmost electrical signal routing protection layer 16.

[0150] For example, in Figure 10 In the light-emitting substrate shown, a first signal routing protection layer 161 and a first planarization layer 151 are formed above the first signal routing layer 111 of the light-emitting substrate, and an interface performance improvement layer 18 and a second signal routing layer 112 are formed above them. A second signal routing protection layer 162 is formed above the second signal routing layer 112. Figure 1 The difference between the light-emitting substrate shown is that Figure 10 In the light emitting substrate shown, the second planarization layer 152 is not formed on the second electrical signal line protection layer 162. In this case, the first reflective layer 12 is formed on the second electrical signal line protection layer 162.

[0151] With the above Figure 5 Compared with the light-emitting substrate shown in Figure 10In the illustrated light-emitting substrate, the second planarization layer 152 is eliminated, allowing the first reflective layer 12 to be located above the second electrical signal routing protection layer 162. With the second planarization layer 152 eliminated, the reflective layer upper structure 14 naturally also does not include the second planarization layer 152. Consequently, when light is incident on the first reflective layer 12 and reflected and emitted by the first reflective layer 12, it does not pass through the second planarization layer 152. This prevents light absorption by the second planarization layer 152, allowing the first reflective layer 12 to reflect more light, ultimately irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting for display, thereby achieving improved display brightness and other better display effects.

[0152] and Figure 1 Compared with the light-emitting substrate shown, Figure 10 The second planarization layer 152 is eliminated from the light-emitting substrate shown, which saves a process step and can achieve the effect of reducing costs. However, when installing the light-emitting unit 13, without the favorable factors of forming a buffer and a flat surface brought by the planarization layer, the second electrical signal wiring protection layer 162 is easily broken under the action of pressure, causing the first reflective layer 12 and the second electrical signal wiring layer 112 to short-circuit, resulting in defects. Therefore, in implementing the above embodiment, the embodiment is selected according to actual needs. Figure 1 The scheme of the light-emitting substrate shown, or choose to implement Figure 10 The scheme of the light-emitting substrate shown.

[0153] Regarding the specific location of the first reflective layer 12, in addition to the two aforementioned locations, it can also be located in the following manners:

[0154] A corresponding signal routing protection layer 16 is formed above each signal routing layer 11. The signal routing protection layer 16 covers the pattern of the corresponding signal routing layer 11 to protect the pattern of the corresponding signal routing layer 11. A planarization layer 15 for planarizing the surface of the signal routing layer 11 is not provided above the topmost signal routing layer 11. A first reflective layer 12 is formed between the topmost signal routing protection layer 16 and the corresponding signal routing layer 11.

[0155] For example, in Figure 11 In the light-emitting substrate shown, a first signal routing protection layer 161 and a planarization layer 15 are formed above the first signal routing layer 111 of the light-emitting substrate, and a second signal routing layer 112 is formed above the first signal routing layer 112. A first reflective layer 12 and a second signal routing protection layer 162 are formed above the second signal routing layer 112. Figure 1 The difference between the light-emitting substrate shown is that Figure 11 In the light emitting substrate shown in FIG, the second planarization layer 152 is not formed above the second electrical signal routing protection layer 162; Figure 10 The difference between the light-emitting substrate shown is that Figure 11 In the light-emitting substrate shown, the first reflective layer 12 is disposed below the second electrical signal routing protection layer 162 and between the second electrical signal routing layer 112 and the second electrical signal routing protection layer 162 .

[0156] With the above Figure 5 Compared with the light-emitting substrate shown in Figure 11 In the illustrated light-emitting substrate, the second planarization layer 152 is also eliminated, allowing the first reflective layer 12 to be located above the second electrical signal routing protection layer 162. With the second planarization layer 152 eliminated, the reflective layer upper structure 14 naturally also does not include the second planarization layer 152. Consequently, when light is incident on the first reflective layer 12 and reflected and emitted by the first reflective layer 12, it does not pass through the second planarization layer 152. This prevents light absorption by the second planarization layer 152, allowing the first reflective layer 12 to reflect more light, ultimately irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting for display, achieving better display effects, including improved display brightness.

[0157] And, with the above Figure 10 Compared with the luminous substrate shown in Figure 11 In the light emitting substrate shown, the second electrical signal routing protection layer 162 is located above the first reflective layer 12 and belongs to the reflective layer upper structure 14. Generally, the second electrical signal routing protection layer 162 and the reflective protection layer 140 are made of the same material and have the same function and can be substituted for each other. Figure 11 In the light-emitting substrate shown in FIG, the second electrical signal routing protection layer 162 also serves as the reflection protection layer 140, so there is no need to prepare a separate reflection protection layer 140. Figure 10 Compared with the light-emitting substrate shown in FIG, one process step is further reduced.

[0158] The first reflective layer 12 is formed in the light emitting substrate between the uppermost electrical signal wiring protection layer 16 and the corresponding electrical signal wiring layer 11 (for example, Figure 11In the light-emitting substrate shown in FIG, the first reflective layer 12 can be directly formed on the electrical signal wiring layer 11, that is, the first reflective layer 12 and the electrical signal wiring layer 11 are in direct contact. In this case, the pattern of the first reflective layer 12 overlaps with the electrical signal wiring layer 11 as much as possible. In other words, the pattern of the first reflective layer 12 should not protrude from the electrical signal wiring layer 11 as much as possible, especially it is not possible for part of the pattern of the first reflective layer 12 to protrude from the pattern of the electrical signal wiring layer 11 and connect with another part of the pattern of the first reflective layer 12 (that is, in the area where the pattern of the electrical signal wiring layer 11 appears as a gap, a connected pattern appears at the corresponding position of the first reflective layer 12. This situation should be avoided to prevent the two separated pattern areas in the electrical signal wiring layer 11 from being connected through the first reflective layer 12, thereby preventing the electrical signal wiring layer 11 from short-circuiting). Figure 11 The light emitting substrate shown in FIG. Figure 11 In the area B indicated by the dotted line, the first reflective layer 12 must be disconnected and cannot be connected, otherwise the second electrical signal routing layer 112 will be short-circuited. Figure 10 The light-emitting substrate shown in FIG. Figure 10 In the area A represented by the dotted box, the second electrical signal wiring layer 112 appears as a gap, while the first reflective layer 12 may be a connected wiring pattern in this area.

[0159] The first reflective layer 12 is formed in the light emitting substrate between the uppermost electrical signal wiring protection layer 16 and the corresponding electrical signal wiring layer 11 (for example, Figure 11 The light-emitting substrate shown in the figure) may further include a second reflective layer 17, which is formed above the other electrical signal routing layers 11 except the topmost electrical signal routing layer 11, and is located between each electrical signal routing layer 11 and the adjacent upper electrical signal routing layer 11.

[0160] For example, in Figure 11 In the illustrated light-emitting substrate, there are two electrical signal routing layers 11, namely a first electrical signal routing layer 111 and a second electrical signal routing layer 112, with the first electrical signal routing layer 111 being located below and the second electrical signal routing layer 112 being located above. In this case, in addition to the first reflective layer 12 formed above the second electrical signal routing layer 112, the light-emitting substrate also includes a second reflective layer 17, which is formed above the first electrical signal routing layer 111. Specifically, the first reflective layer 12 is formed on the second electrical signal routing layer 112, and the second reflective layer 17 is formed on the first electrical signal routing layer 111.

[0161] It is understandable that the pattern of the second electrical signal routing layer 112 will have gaps, and the pattern of the first electrical signal routing layer 111 will also have gaps, but the gaps between the two are not completely consistent. Therefore, there will be the following corresponding area between the first electrical signal routing layer 111 and the second electrical signal routing layer 112: in this area, the pattern of the second electrical signal routing layer 112 appears as a gap, while the pattern of the first electrical signal routing layer 111 appears as a continuous routing. The above-mentioned area is, for example, Figure 11 The C region in Figure 11 Taking region C in the figure as an example, the pattern of the first reflective layer 12 is necessarily absent in this region. However, the second reflective layer 17 can be provided in this region. In this case, when light reflected by the reflective device located above the light-emitting substrate strikes this region, it will pass through the gaps between the pattern of the first reflective layer 12 and the second electrical signal routing layer 112. The first reflective layer 12 will no longer reflect this portion of light for reuse. However, as this light continues to travel downward, it will strike the second reflective layer 17, which can reflect this portion of light upward. When this light reflected upward strikes the reflective device located above the light-emitting substrate, it will be reflected again. Some of this re-reflected light will strike the light-transmitting area of ​​the light-emitting substrate, be transmitted through, and ultimately strike the liquid crystal cell for display. Compared to a light-emitting substrate without the second reflective layer 17, this arrangement can increase the amount of light transmitted from the light-transmitting area of ​​the light-emitting substrate for display, thereby achieving higher display brightness and other better display effects.

[0162] When there is only one electrical signal routing layer 11, the first reflective layer 12 is formed above the electrical signal routing layer 11. Furthermore, the specific configuration of the first reflective layer 12 can be similar to the following configurations in the embodiment in which the electrical signal routing layer 11 is a multi-layer stacked structure:

[0163] In the first embodiment, a planarization layer 15 for planarizing the surface of the electrical signal wiring layer 11 is formed above the electrical signal wiring layer 11. The material of the planarization layer 15 can be a resin material. The first reflective layer 12 is formed above the planarization layer 15. Figure 5 As for the light-emitting substrate shown in the figure, in this setting method, the setting position of the first reflective layer 12 is adjusted so that the first reflective layer 12 is located above the planarization layer 15 instead of below the planarization layer 15. At this time, the planarization layer 15 does not belong to the reflective layer upper structure 14. When light is incident on the first reflective layer 12 and the first reflective layer 12 reflects and emits light, it will not pass through the planarization layer 15, thereby avoiding the absorption of light by the planarization layer 15, so that the first reflective layer 12 can reflect and emit more light, which is finally irradiated on the light-transmitting area of ​​the light-emitting substrate and transmitted for display, thereby achieving higher display brightness and other better display effects.

[0164] In the second embodiment, an electrical signal routing protection layer 16 is formed above the electrical signal routing layer 11. The electrical signal routing protection layer 16 covers the pattern of the electrical signal routing layer 11 to protect the pattern of the electrical signal routing layer 11. A flattening layer 15 for flattening the surface of the electrical signal routing layer 11 is not provided above the electrical signal routing layer 11. The first reflective layer 12 is formed above the electrical signal routing protection layer 16. Figure 5 As for the light-emitting substrate shown, in this arrangement, the planarization layer 15 is eliminated, so that the first reflective layer 12 is located above the electrical signal routing protection layer 16. After the planarization layer 15 is eliminated, the structure 14 on the reflective layer naturally does not include the planarization layer 15. In this way, when light is incident on the first reflective layer 12 and the first reflective layer 12 reflects and emits light, it will not pass through the planarization layer 15, thereby avoiding the absorption of light by the planarization layer 15, allowing the first reflective layer 12 to reflect and emit more light, which is finally irradiated on the light-transmitting area of ​​the light-emitting substrate and transmitted for display, achieving higher display brightness and other better display effects.

[0165] In the third method, an electric signal routing protection layer 16 is formed above the electric signal routing layer 11. The electric signal routing protection layer 16 covers the pattern of the electric signal routing layer 11 to protect the pattern of the electric signal routing layer 11. A flattening layer 15 for flattening the surface of the electric signal routing layer 11 is not provided above the electric signal routing layer 11. The first reflective layer 12 is formed between the electric signal routing protection layer 16 and the electric signal routing layer 11. Figure 5 As for the light-emitting substrate shown in the figure, in this arrangement, the planarization layer 15 is also eliminated, so that the first reflective layer 12 is located above the electrical signal routing protection layer 16. After the planarization layer 15 is eliminated, the structure 14 on the reflective layer will of course not include the planarization layer 15. In this way, when light is incident on the first reflective layer 12 and when the first reflective layer 12 reflects and emits light, it will not pass through the planarization layer 15, thereby avoiding the absorption of light by the planarization layer 15, so that the first reflective layer 12 can reflect and emit more light, which is finally irradiated on the light-transmitting area of ​​the light-emitting substrate and transmitted for display, achieving a higher display brightness and other better display effects. In addition, compared with the aforementioned Figure 10 Compared to the light-emitting substrate shown in FIG. , in a light-emitting substrate employing this configuration, the electrical signal trace protection layer 16 is located above the first reflective layer 12 and is part of the reflective layer upper structure 14. Generally, the electrical signal trace protection layer 16 and the reflective protection layer 140 are made of the same material and perform the same function, making them interchangeable. Therefore, in the light-emitting substrate, the electrical signal trace protection layer 16 also serves as the reflective protection layer 140, eliminating the need for a separate reflective protection layer 140. This further reduces one manufacturing process compared to the aforementioned light-emitting substrate.

[0166] In one embodiment, see Figure 1 The light-emitting substrate includes a base substrate 10 and a structure on the reflective layer 14 in the light-transmitting area. It is understood that the electrical signal routing layer 11, the second reflective layer 12, and the light-emitting unit 13 are not present in the light-transmitting area of ​​the light-emitting substrate. Therefore, the light-transmitting area of ​​the light-emitting substrate has the function of transmitting light and can be called a light-transmitting area. In this embodiment, on the basis of not having the electric signal routing layer 11, the second reflective layer 12 and the light-emitting unit 13, the light-transmitting area of ​​the light-emitting substrate includes a base substrate 10 and a structure 14 on the reflective layer. In other words, in the light-transmitting area of ​​the light-emitting substrate, there is no layer structure such as the electric signal routing protection layer 16 and the planarization layer 15, especially no planarization layer 15. It has been explained in the above content that the resin material commonly used to prepare the planarization layer 15 has a strong ability to absorb light. Therefore, after eliminating the planarization layer 15 and other structures in the light-transmitting area of ​​the light-emitting substrate, the loss of light in the process of being transmitted from the first side of the light-emitting substrate through the light-transmitting area to the second side of the light-emitting substrate can be reduced, and the light transmittance in this process can be improved, so that more light can be emitted from the light-emitting surface of the light-emitting substrate and incident on the liquid crystal box for display, so as to achieve higher display brightness and other better display effects. At the same time, in the case of Figure 5 In the light-emitting substrate shown, a planarization layer 15 and an electrical signal wiring protection layer 16 are provided in the light-transmitting area. This structure has a significantly higher absorption rate for blue light than for light of other colors. Therefore, Figure 5 The light emitted from the light emitting surface of the light emitting substrate shown in the figure will have a color cast. Figure 5 The display panel of the light-emitting substrate shown in the figure may also have color cast when displaying, resulting in poor display effect. In the above embodiment, the light-transmitting area of ​​the light-emitting substrate does not include the planarization layer 15, and the light-transmitting area of ​​the light-emitting substrate only includes the structure 14 on the reflective layer. Figure 1 Taking the structure 14 on the reflective layer shown as having a reflective protective layer 140 as an example, the material of the reflective protective layer 140 can be SiN; for a light-emitting substrate having SiN on the light-transmitting area base substrate 10 but not containing resin material, when light passes through, the SiN layer will not absorb blue light significantly more than the absorption of light of other colors, and the difference in absorption of light of different colors is small. Therefore, in the above embodiment, the light-emitting surface of the light-emitting substrate will not produce obvious color cast, and the display panel using the light-emitting substrate in the above embodiment will not have obvious color cast when displaying, thereby helping to achieve a good display effect.

[0167] In another embodiment of the light-emitting substrate, as an alternative to the embodiment in which the light-emitting substrate includes a base substrate 10 and a structure 14 on the reflective layer in the light-transmitting area, the light-emitting substrate may further include a base substrate 10 and an electrical signal routing protection layer 16 in the light-transmitting area. Generally, the electrical signal routing protection layer 16 and the reflective protection layer 140 that the structure 14 on the reflective layer usually has are made of the same optional materials. The electrical signal routing protection layer 16 can play the same role as the reflective protection layer 140, and the two are mutually replaceable. Therefore, in the light-transmitting area of ​​the light-emitting substrate, the electrical signal routing protection layer 16 may be provided without providing the reflective protection layer 140. Furthermore, in the case where there are multiple electrical signal routing layers 11 and, correspondingly, multiple electrical signal routing protection layers 16, the number of electrical signal routing protection layers 16 provided in the light-transmitting area may be one or more; and the electrical signal routing protection layer 16 provided in the light-transmitting area may be any one of the electrical signal routing protection layers 16. For example, it may be the uppermost electrical signal routing protection layer 16 (formed above the uppermost electrical signal routing layer 11), or it may be the electrical signal routing protection layer 16 located between two adjacent electrical signal routing layers 11. The technical effects achievable by the above-mentioned alternative embodiments are consistent with those of the above-mentioned embodiment in which the light-emitting substrate includes the base substrate 10 and the reflective layer upper structure 14 in the light-transmitting area, and are not further described.

[0168] In summary, the light-emitting substrate provided by the above-described embodiments of the present invention has an electrical signal routing layer 11, a first reflective layer 12, and a light-emitting unit 13 disposed on one side of its base substrate 10, as well as a reflective layer upper structure 14 formed on the first reflective layer 12. The overall light transmittance of the reflective layer upper structure 14 is greater than a set value. By setting the overall light transmittance of light passing through the reflective layer upper structure 14 to be greater than a set value, the set value serves as a standard value. A value greater than the set value indicates a higher overall light transmittance of light passing through the reflective layer upper structure 14, which means that the reflective layer upper structure 14 has a lower light absorptivity. This ensures that more light is incident on the first reflective layer 12, and that more of the light reflected and emitted by the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate. This ultimately ensures that more light is reflected and reused by the first reflective layer 12, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting therethrough. Consequently, more light is emitted from the light-emitting surface of the light-emitting substrate, thereby enabling a display panel using the light-emitting substrate provided by the above-described embodiments of the present invention to achieve higher display brightness and other better display effects.

[0169] In one embodiment of the method for preparing a light-emitting substrate, the light-emitting substrate to be prepared according to the method for preparing a light-emitting substrate has a plurality of electrical signal wiring layers 11. The method for preparing a light-emitting substrate includes the following steps S11 to S15: Figure 12 shown.

[0170] Step S11, forming a substrate layer 101 on the substrate 100 to prepare the substrate 10, such as Figure 13 shown.

[0171] In step S11, a substrate layer 101 is formed on a substrate 100 through a deposition process. The substrate 100 may be a glass substrate; the substrate layer 101 may be a single-layer structure or a multi-layer stacked structure. When the substrate layer 101 is a single-layer structure, the preparation of the substrate layer 101 pattern can be completed through a single deposition process; when the substrate layer 101 is a multi-layer stacked structure, the substrate layer 101 needs to be prepared through multiple deposition processes to achieve the preparation of the substrate layer 101 pattern. The material of each layer structure of the substrate layer 101 can be selected from silicon nitride (SiNx), silicon oxynitride (SiON) or silicon oxide (SiOx). The substrate layer 101 formed in this step S11 can serve as a reverse stress layer to prevent the substrate 100 from warping due to other layer structures subsequently deposited on the substrate 100 (such as the electrical signal routing layer 11 prepared using Cu materials, etc.).

[0172] Step S12 , forming patterns of a plurality of electrical signal wiring layers 11 on the base substrate 10 .

[0173] Specifically, in step S12 , patterns of each electrical signal routing layer 11 and the corresponding electrical signal routing protection layer 16 are formed respectively, and patterns of other layer structures located between or above the electrical signal routing layer 11 and the electrical signal routing protection layer 16 are formed.

[0174] Taking the light emitting substrate having two electrical signal wiring layers 11 and two electrical signal wiring protection layers 16 as an example, step S12 specifically includes the following steps S121 to S126: Figure 14 shown.

[0175] Step S121: forming a first electrical signal wiring layer 111 on the base substrate 10. Figure 15 shown.

[0176] In step S121, the main material of the first electrical signal routing layer 111 is Cu; it can be a single-layer structure or a multi-layer stacked structure. Preferably, the first electrical signal routing layer 111 has a multi-layer stacked structure, specifically a double-layer stacked structure of MTD / Cu or a triple-layer stacked structure of MTD / Cu / MTD, which can improve the adhesion between the Cu layer and the substrate layer 101.

[0177] The pattern forming process of the first electrical signal wiring layer 111 may specifically be to obtain the pattern of the first electrical signal wiring layer 111 by using a patterning process after deposition.

[0178] Step S122: forming a first electrical signal wiring protection layer 161 on the first electrical signal wiring layer 111. Figure 16 shown.

[0179] In step S122, the first electrical signal routing protection layer 161 may be a single-layer structure or a multi-layer stacked structure. When the first electrical signal routing layer 161 is a single-layer structure, its material may be silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO). When the first electrical signal routing layer 161 is a multi-layer stacked structure, the material of each layer may be silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO).

[0180] In the pattern forming process of each layer structure of the first electrical signal routing protection layer 161, only a deposition process may be performed in step S122. Through one or more deposition processes, a single-layer or multi-layer stacked structure of the first electrical signal routing protection layer 161 is finally formed.

[0181] The first electrical signal routing protection layer 161 can protect the first electrical signal routing layer 111 and prevent Cu in the first electrical signal routing layer 111 from being oxidized.

[0182] It should be noted that in step S122, regarding the relationship between the first electrical signal routing layer 111 and the first electrical signal routing protection layer 161, it includes two different method steps and two different structures brought about by the two different method steps. The first method step is to directly form the pattern of the first electrical signal routing protection layer 161 after forming the first electrical signal routing layer 111, and the formed first electrical signal routing protection layer 161 is in direct contact with the first electrical signal routing layer 111; the second scheme is to first form the pattern of other layer structures after forming the first electrical signal routing layer 111, and then prepare the pattern of the first electrical signal routing protection layer 161, and there may be other layer structures between the pattern of the formed first electrical signal routing protection layer 161 and the first electrical signal routing layer 111.

[0183] In the previous and following descriptions of the present invention, similarly, the expression that B is formed above A, or that B is formed above A, includes both the situation where B is formed directly after A is formed (the first situation, in the structure after formation, there is no other layer structure between A and B), and the situation where after A is formed, other layer structures are formed first and then B is formed (the second situation, in the structure after formation, there may be other layer structures between A and B).

[0184] Preferably, in step S122, the first electrical signal routing protection layer 161 is directly formed on the first electrical signal routing layer 111, such as Figure 16 shown.

[0185] Step S123: forming a first planarization layer 151 on the first electrical signal routing protection layer 161. Figure 17 shown.

[0186] In step S123 , the first planarization layer 151 is made of a resin material, specifically a resin photoresist.

[0187] The pattern formation process of the first planarization layer 151 can be specifically performed by coating a photoresist of a resin material and then performing a patterning process after exposure to form the pattern of the first planarization layer 151 .

[0188] The pattern of the formed first planarization layer 151 can planarize the first electrical signal wiring layer 111 , thereby facilitating the subsequent process of each layer structure.

[0189] Step S124, forming an interface performance improvement layer 18 on the first planarization layer 151, such as Figure 18 shown.

[0190] In step S124, the interface performance improvement layer 18 may be a single-layer structure or a multi-layer stacked structure. When the interface performance improvement layer 18 is a single-layer structure, its material may be SiN, SiON, or SiO. When the interface performance improvement layer 18 is a multi-layer stacked structure, the material of each layer may be SiN, SiON, or SiO.

[0191] The pattern formation process of the interface performance improvement layer 18 first forms a single-layer or multi-layer stacked structure of the interface performance improvement layer 18 through one or more deposition processes; then, after exposure, the interface performance improvement layer 18 and the first electrical signal wiring protection layer 161 are patterned through a dry etching process, thereby simultaneously forming the pattern of the first electrical signal wiring protection layer 161 and the pattern of the interface performance improvement layer 18.

[0192] The formed interface performance improvement layer 18 can improve the interface contact performance of the second electrical signal wiring layer 112 to be formed subsequently.

[0193] Step S125: forming a second electrical signal routing layer 112 on the interface performance improvement layer 18. Figure 19 shown.

[0194] In step S125 , the main material of the second electrical signal wiring layer 112 is Cu; it may specifically be a multi-layer stacked structure, specifically a double-layer stacked structure of MTD / Cu or MTD / CuNi.

[0195] The pattern forming process of the second electrical signal wiring layer 112 may specifically be to obtain the pattern of the second electrical signal wiring layer 112 by using a patterning process after deposition.

[0196] Step S126: forming a second electrical signal wiring protection layer 162 on the second electrical signal wiring layer 112. Figure 20 shown.

[0197] In step S126, the second electrical signal routing protection layer 162 may be a single-layer structure or a multi-layer stacked structure. When the second electrical signal routing layer 162 is a single-layer structure, its material may be SiN, SiON, or SiO. When the second electrical signal routing layer 162 is a multi-layer stacked structure, the material of each layer may be SiN, SiON, or SiO.

[0198] The pattern formation process for each layer of the second electrical signal routing protection layer 162 can specifically only involve a deposition process in step S126. Through one or more deposition processes, a single-layer or multi-layer stacked structure of the second electrical signal routing protection layer 162 is ultimately formed. The patterning process for the second electrical signal routing protection layer 162 to ultimately form the pattern of the second electrical signal routing protection layer 162 can be completed simultaneously with the subsequent step of forming the pattern of the reflective protection layer 140 in the reflective layer upper structure 14.

[0199] The second electrical signal routing protection layer 162 can protect the second electrical signal routing layer 112 and prevent Cu in the second electrical signal routing layer 112 from being oxidized.

[0200] Step S13, forming a planarization layer 15 on the uppermost electrical signal wiring layer 11 on the base substrate 10, as shown in FIG. Figure 21 shown.

[0201] The planarization layer 15 is made of resin material, and specifically can be a resin photoresist.

[0202] The pattern formation process of the planarization layer 15 can be specifically performed by coating a photoresist made of a resin material and then performing a patterning process after exposure to form the pattern of the planarization layer 15 .

[0203] The pattern of the formed planarization layer 15 can planarize the electrical signal wiring layer 11 , thereby facilitating the subsequent process of each layer structure.

[0204] When the light-emitting substrate to be prepared is the light-emitting substrate having two electrical signal routing layers 11 and two electrical signal routing protection layers 16 as described above, since the second electrical signal routing protection layer 162 has already been formed on the uppermost electrical signal routing layer 11, i.e., the second electrical signal routing layer 112, as described above, the pattern of the planarization layer 15 formed on the uppermost electrical signal routing layer 11 in step S13 is actually formed above the second electrical signal routing protection layer 162. Furthermore, since the first planarization layer 151 has already been formed, the planarization layer 15 formed in step S13 is referred to as the second planarization layer 152.

[0205] Step S14, forming a pattern of the first reflective layer 12 on the base substrate 10 on which the electrical signal wiring layer 11 is formed, such as Figure 22 shown.

[0206] Since the planarization layer 15 has been formed on the uppermost electrical signal wiring layer 11 in the above step S13 , the first reflective layer 12 formed in this step S14 is actually formed above the planarization layer 15 above the uppermost electrical signal wiring layer 11 .

[0207] In step S14, the first reflective layer 12 can be a single-layer structure or a multi-layer stacked structure. When the first reflective layer 12 is a single-layer structure, the material of the first reflective layer 12 is selected to have high reflectivity in the visible light range, specifically, Ag, Al, and other metal materials with high reflectivity. When the first reflective layer 12 is a multi-layer stacked structure, the main material of the first reflective layer 12 is selected to have high reflectivity in the visible light range, specifically, Ag, Al, and other metal materials with high reflectivity. In one embodiment, the first reflective layer 12 is preferably a multi-layer stacked structure; specifically, it can be a three-layer stacked structure of ITO / Ag / ITO. In this three-layer stacked structure, the Ag layer is the main layer and plays the main reflective role, and the ITO layer is mainly used to improve the adhesion of the Ag layer and prevent oxidation of the Ag layer.

[0208] The pattern forming process of the first reflective layer 12 may be performed by exposing after deposition and forming the pattern of the first reflective layer 12 through a patterning process. Specifically, step S14 may include the following steps S141-S142, such as Figure 23 shown.

[0209] In step S141 , a material layer of the first reflective layer 12 is formed on the planarization layer 15 formed on the uppermost electrical signal wiring layer 11 to cover the planarization layer 15 .

[0210] Step S142 , performing a patterning process on the material layer of the formed first reflective layer 12 to form a pattern of the first reflective layer 12 .

[0211] Step S15, forming a reflective layer upper structure 14 on the pattern of the first reflective layer 12, the reflective layer upper structure 14 includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure 14 is greater than a set value, such as Figure 24 shown.

[0212] In one embodiment, the reflective layer structure 14 includes a functional layer, which is a reflective protection layer 140, such as Figure 24 The reflective protection layer 140 is made of an inorganic material, from which a suitable material that meets the requirements can be selected, and the light transmittance of the material can meet the requirement that the overall light transmittance of the structure 14 on the reflective layer is greater than a set value.

[0213] The reflection protection layer 140 can be a single-layer structure or a multi-layer stacked structure. When the reflection protection layer 140 is a single-layer structure, its material can be selected from SiN, SiON, or SiO; when the reflection protection layer 140 is a multi-layer stacked structure, the material of each layer can be selected from SiN, SiON, or SiO.

[0214] In the process of forming the pattern of the reflective protection layer 140, first, a single-layer or multi-layer stacked structure of the reflective protection layer 140 is formed through one or more deposition processes; then, after exposure, the reflective protection layer 140 and the second electrical signal wiring protection layer 162 are patterned through a dry etching process (combined with the solution of only performing a deposition process on the second electrical signal wiring protection layer 162 in the above-mentioned step S126. Alternatively, a deposition process and a patterning process can be performed on the second electrical signal wiring protection layer 162 in step S126, so that in this step S15, only the reflective protection layer 140 needs to be patterned), thereby synchronously forming the pattern of the reflective protection layer 140 and the pattern of the second electrical signal wiring protection layer 162.

[0215] Specifically, the pattern forming process of the reflective protection layer 140 includes the following steps S151-S152: Figure 25 shown.

[0216] In step S151 , an inorganic material layer is covered on the pattern of the first reflective layer 12 .

[0217] In step S152 , the inorganic material layer is patterned to form a pattern of the reflective protection layer 140 .

[0218] The formed reflection protection layer 140 can protect the first reflection layer 12 and prevent Ag in the first reflection layer 12 from being oxidized.

[0219] In other embodiments, when the structure 14 on the reflective layer further includes other functional layers in addition to the reflective protective layer 140, and provided that the overall light transmittance of the structure 14 on the reflective layer including the reflective protective layer 140 and the other functional layers is greater than a set value, a known corresponding process is used to prepare and form the pattern of the other functional layers.

[0220] In step S15, as described above, the material selected for preparing and forming the reflective protective layer 140 is an inorganic material such as SiN, SiON, or SiO, rather than other materials such as resin. This is because these selected inorganic materials have low light absorptivity. Using these inorganic materials to prepare the reflective protective layer 140 and other layer structures that the reflective layer upper structure 14 may also have can result in an overall light transmittance greater than a set value, which is difficult to achieve with current resin materials. However, with the future development of material technology, if other materials such as resin materials meet the requirements, that is, if the reflective protective layer 140 and other layer structures that the reflective layer upper structure 14 may have prepared using these materials can result in an overall light transmittance greater than a set value, these other materials may also be selected to prepare the reflective protective layer 140 and other layer structures that the reflective layer upper structure 14 may have.

[0221] After step S15, the light emitting unit 13 is mounted on the light emitting substrate. Figure 26 The installed light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11 .

[0222] In the light-emitting substrate prepared according to the method for preparing the light-emitting substrate provided in the above embodiment, the overall light transmittance of the structure 14 on the reflective layer formed on the first reflective layer 12 is greater than a set value. The set value is used as a standard value. If it is greater than the set value, it indicates that the overall light transmittance of the structure 14 on the reflective layer is higher, which means that the structure 14 on the reflective layer has a lower light absorption rate. This can ensure that more light is incident on the first reflective layer 12, and that more light of the light reflected and emitted by the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate, thereby ultimately ensuring that the first reflective layer 12 reflects and reuses more light, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting more light, and more light will be emitted from the light-emitting surface of the light-emitting substrate, so that the display panel using the light-emitting substrate prepared by the above method can achieve higher display brightness and other better display effects.

[0223] In one embodiment, in the step of forming the pattern of the planarization layer 15, the material of the planarization layer 15 formed in the light-transmitting area of ​​the light-emitting substrate is removed, and the final structure is as follows: Figure 1 The figure shown in the light-transmitting area.

[0224] The planarization layer 15 removed in the light-transmitting area includes all the planarization layers 15 formed on the light-emitting substrate, that is, when there are multiple planarization layers 15, the material of each planarization layer 15 located in the light-transmitting area is removed (in terms of Figure 1 As shown in the example, the non-transparent region includes the first planarization layer 151 and the second planarization layer 152 , while the first planarization layer 151 and the second planarization layer 152 are both removed in the transparent region.

[0225] The removal of the material of the planarization layer 15 in the light-transmitting area can be completed during the patterning process of each planarization layer 15. For example, for the first planarization layer 151 in the light-emitting substrate having two planarization layers 15 mentioned in the above example, the material of the first planarization layer 151 formed in the light-transmitting area during the deposition process can be removed during the patterning process of the first planarization layer 151 in the above step S123; and for the second planarization layer 152, the material of the second planarization layer 152 formed in the light-transmitting area during the deposition process can be removed during the patterning process of the second planarization layer 152 in the above step S13.

[0226] By removing the material of the planarization layer 15 from the light-transmitting area, light can be prevented from being absorbed by the planarization layer 15 when passing through the light-transmitting area, reducing light loss during transmission through the light-transmitting area. This can increase the amount of light emitted from the light-emitting substrate's light-emitting surface, thereby improving the display brightness of the display panel. Furthermore, by removing the material of the planarization layer 15 from the light-transmitting area, color shift in the light emitted from the light-emitting substrate's light-emitting surface can be avoided due to the different absorption rates of the planarization layer 15 for different colors of light, thereby improving or preventing color shift in the display panel.

[0227] Furthermore, in the light-transmitting area of ​​the light-emitting substrate, there may be only one electrical signal routing protection layer 16, or one interface performance improvement layer 18, or one reflection protection layer 140, such as Figure 1That is, in the light-transmitting area of ​​the light-emitting substrate, not only the material of the planarization layer 15 is removed, but also the material of the electrical signal routing protection layer 16 and the material of the interface performance improvement layer 18 are removed, leaving only the material of the reflective protection layer 140; or the material of the electrical signal routing protection layer 16 and the material of the reflective protection layer 140 are removed, leaving only the material of the interface performance improvement layer 18; or the material of the reflective protection layer 140 and the material of the interface performance improvement layer 18 are removed, leaving only the material of the electrical signal routing protection layer 16 (when there are multiple electrical signal routing protection layers 16, only one of them is retained; taking the above-mentioned light-emitting substrate with two electrical signal routing protection layers 16 as an example, the material of the first electrical signal routing protection layer 161 is removed in the light-transmitting area, leaving only the second electrical signal routing protection layer 162, or the material of the second electrical signal routing protection layer 162 is removed in the light-transmitting area, leaving only the first electrical signal routing protection layer 161); thereby further reducing the loss of light due to absorption by the material when transmitting through the light-transmitting area, and further improving the light output from the light-emitting surface of the light-emitting substrate.

[0228] In another embodiment of the method for preparing a light-emitting substrate, similar to the embodiment of the method for preparing a light-emitting substrate described above, the light-emitting substrate to be prepared according to this method also has multiple electrical signal trace layers 11. However, unlike the embodiment of the method for preparing a light-emitting substrate described above, this embodiment of the method for preparing a light-emitting substrate does not include the step of forming a planarization layer 15 above the uppermost electrical signal trace layer 11 on the base substrate 10.

[0229] Specifically, a method for preparing a light-emitting substrate in an embodiment includes the following steps S21 to S24: Figure 27 As shown, the light-emitting substrate prepared according to the following steps can be, for example, Figure 10 The structure shown.

[0230] In step S21 , a base layer 101 is formed on the substrate 100 to prepare a base substrate 10 .

[0231] In step S21 , the step of preparing the base substrate 10 is the same as the step of preparing the base substrate 10 in step S11 , and will not be described in detail.

[0232] In step S22 , a plurality of electrical signal wiring layers 11 are formed on the base substrate 10 , and a pattern of an electrical signal wiring protection layer 16 is formed above the uppermost electrical signal wiring layer 11 .

[0233] Furthermore, in step S22, a pattern of an electrical signal routing protection layer 16 is preferably formed above each electrical signal routing layer 11. This arrangement ensures that the topmost electrical signal routing layer 11 and other electrical signal routing layers 11 below the topmost electrical signal routing layer 11 all have corresponding electrical signal routing protection layers 16, thereby protecting each electrical signal routing layer 11 from problems such as oxidation.

[0234] In this step S22, the steps of forming the pattern of a single electrical signal routing layer 11 and forming the pattern of a single electrical signal routing protection layer 16 are the same as the steps of forming the pattern of a single electrical signal routing layer 11 and forming the pattern of a single electrical signal routing protection layer 16 in the above-mentioned step S12, and will not be repeated.

[0235] In step S23 , a pattern of a first reflective layer 12 is formed on the base substrate 10 on which the electrical signal wiring layer 11 is formed.

[0236] After forming the patterns of each electrical signal routing layer 11 in step S22 and forming the electrical signal routing protection layer 16 above the top electrical signal routing layer 11, the pattern of the second reflective layer 12 is further formed in step S23. In essence, the pattern of the first reflective layer 12 is formed above the electrical signal routing protection layer 16 above the top electrical signal routing layer 11.

[0237] Different from the above-mentioned embodiment with a planarization layer 15, since there is no step of forming the planarization layer 15 above the topmost electrical signal wiring layer 11 before step S23, in this step S23, the first reflective layer 12 is formed above the electrical signal wiring protection layer 16 above the topmost electrical signal wiring layer 11, instead of being formed above the planarization layer 15 above the topmost electrical signal wiring layer 11. Compared with the other aforementioned embodiments, the above-mentioned embodiment reduces the step of forming the planarization layer 15 above the topmost electrical signal wiring layer 11, thereby simplifying the process.

[0238] However, reducing the step of forming the planarization layer 15 above the uppermost electrical signal wiring layer 11 will also bring corresponding problems. The planarization layer 15 above the uppermost electrical signal wiring layer 15 can play a buffering role when installing the light-emitting unit 13. In the above embodiment, the planarization layer 15 is no longer formed above the uppermost electrical signal wiring layer 15. When the process step of installing the light-emitting unit 13 is subsequently performed, the electrical signal wiring protection layer 16 and other layer structures are easily broken due to pressure, thereby causing a short circuit in the relevant layer structure (such as Figure 10When the second electrical signal wiring protection layer 162 is broken by the pressure of the light emitting unit 13, the first reflective layer 12 and the second electrical signal wiring layer 112 may be short-circuited, thereby causing defects).

[0239] Therefore, for the above-mentioned methods for preparing the light-emitting substrate with the step of forming the planarizing layer 15 and without the step of forming the planarizing layer 15, both have their own advantages and disadvantages, and in practice, they can be selected for implementation according to needs.

[0240] The unmentioned parts of the step of preparing the first reflective layer 12 in step S23 of the above embodiment are the same as the steps of preparing the first reflective layer 12 in step S14, and are not described again.

[0241] In step S24 , a reflective layer upper structure 14 is formed on the pattern of the first reflective layer 12 . The reflective layer upper structure 14 includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure 14 is greater than a set value.

[0242] The step of preparing the structure 14 on the reflective layer in step S24 of the above embodiment is the same as the step of preparing the structure 14 on the reflective layer in step S15 , and will not be described in detail.

[0243] After step S24 , the light emitting unit 13 is mounted on the light emitting substrate 12 . The mounted light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11 .

[0244] In the light-emitting substrate prepared according to the method for preparing a light-emitting substrate provided in the above embodiment, the overall light transmittance of the structure 14 on the reflective layer formed on the first reflective layer 12 is greater than a set value. The set value is used as a standard value. If it is greater than the set value, it indicates that the overall light transmittance of the structure 14 on the reflective layer is higher, which means that the structure 14 on the reflective layer has a lower light absorptivity. This ensures that more light is incident on the first reflective layer 12, and that more light of the light reflected and emitted by the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate. This ultimately ensures that more light is reflected and reused by the first reflective layer 12, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting more light. Consequently, more light is emitted from the light-emitting surface of the light-emitting substrate, thereby enabling a display panel using the light-emitting substrate prepared according to the above method to achieve higher display brightness and other better display effects.

[0245] In another embodiment of the method for preparing a light-emitting substrate, similar to the two embodiments of the method for preparing a light-emitting substrate described above, the light-emitting substrate to be prepared according to the method also has multiple electrical signal trace layers 11. The method for preparing a light-emitting substrate in this embodiment also does not include the step of forming a planarization layer 15 above the uppermost electrical signal trace layer 11 on the base substrate 10.

[0246] Specifically, the method for preparing the light-emitting substrate in one embodiment includes the following steps S31 to S34. Figure 28 As shown, the light-emitting substrate prepared according to the following steps can be, for example, Figure 11 The structure shown.

[0247] In step S31 , a base layer 101 is formed on the substrate 100 to prepare a base substrate 10 .

[0248] In step S31 , the step of preparing the base substrate 10 is the same as the step of preparing the base substrate 10 in step S11 , and will not be described in detail.

[0249] Step S32 , forming patterns of a plurality of electrical signal wiring layers 11 on the base substrate 10 .

[0250] In step S32 , a pattern of an electrical signal routing protection layer 16 may be formed between the multiple electrical signal routing layers 11 ; that is, a pattern of an electrical signal routing protection layer 16 may be prepared and formed before forming the next electrical signal routing layer 11 .

[0251] In this step S32, the steps of forming the pattern of a single electrical signal routing layer 11 and forming the pattern of a single electrical signal routing protection layer 16 are the same as the steps of forming the pattern of a single electrical signal routing layer 11 and forming the pattern of a single electrical signal routing protection layer 16 in the above-mentioned step S12, and will not be repeated.

[0252] In step S33 , a pattern of a first reflective layer 12 is formed on the base substrate 10 on which the electrical signal wiring layer 11 is formed.

[0253] Different from the above-mentioned embodiment, in step S32, the electrical signal routing protection layer 16 is not formed above the topmost electrical signal routing layer 11. Therefore, in step S33, the first reflective layer 12 is formed above the topmost electrical signal routing layer 11, and there is no electrical signal routing protection layer 16 between the first reflective layer 12 and the topmost electrical signal routing layer 11.

[0254] Specifically, the step of forming the pattern of the first reflective layer 12 in step S33 further includes the following steps S331-S332: Figure 29 shown.

[0255] Step S331 : Covering the uppermost electrical signal wiring layer 11 with a material layer of a first reflective layer 12 .

[0256] Step S332 , performing a patterning process on the material layer of the formed first reflective layer 12 to form a pattern of the first reflective layer 12 .

[0257] The unmentioned parts of the step of preparing the first reflective layer 12 in step S33 are the same as those of the step of preparing the first reflective layer 12 in the aforementioned step S14 and are not described again.

[0258] In step S34 , an electrical signal wiring protection layer 16 is formed on the formed first reflective layer 12 .

[0259] In step S34 , the formed electrical signal wiring protection layer 16 is located above the first reflective layer 12 . Therefore, the electrical signal wiring protection layer 16 belongs to the structure on the reflective layer 14 , and step S34 also corresponds to the step of forming the structure on the reflective layer 14 .

[0260] Therefore, for the electrical signal routing protection layer 16 formed in step S34, an inorganic material is selected during its preparation process, and suitable materials that meet the requirements can be selected from the inorganic materials, such as SiN, SiON or SiO, etc. The light transmittance of the material can meet the requirement that the overall light transmittance of the structure 14 on the reflective layer, including the electrical signal routing protection layer 16 located above the uppermost electrical signal routing layer 11, is greater than the set value.

[0261] Of course, as explained above, with the development of material technology in the future, when there are other materials such as resin materials that meet the requirements, that is, the electrical signal routing protection layer 16 and the structure 14 on the reflective layer may have other layer structures prepared using resin materials and other materials, and the overall light transmittance of the electrical signal routing protection layer 16 and the structure 14 on the reflective layer prepared in step S34 can be greater than the set value, these resin materials and other materials can also be selected to prepare the electrical signal routing protection layer 16 and the structure 14 on the reflective layer in step S34. Other layer structures may have.

[0262] As described above, the electrical signal trace protection layer 16 and the reflective protection layer 140 are made of the same material and perform the same function, making them interchangeable. Therefore, step S34 serves both as a step for forming the electrical signal trace protection layer 16 and as a step for forming the reflective protection layer 140 within the reflective layer upper structure 14. Consequently, a separate process step is not required for the reflective protection layer 140. Compared to the aforementioned other embodiments, this embodiment further reduces the number of process steps.

[0263] In the above-described embodiment, the step of forming a planarization layer 15 above the topmost electrical signal routing layer 11 is omitted, simplifying the process. However, eliminating the step of forming a planarization layer 15 above the topmost electrical signal routing layer 11 eliminates the buffering effect of the planarization layer 15. Consequently, during the subsequent process of installing the light-emitting unit 13, the related layer structures may also experience short circuits. Therefore, the preparation methods of the light-emitting substrates described in the various embodiments above should be selected and implemented according to actual needs.

[0264] The unmentioned parts of the step of preparing the electrical signal wiring protection layer 16 in step S34 are the same as the steps of forming the electrical signal wiring protection layer 16 mentioned in the aforementioned step S12, and the same as the steps of preparing the reflective protection layer 140 in the aforementioned step S15, and are not repeated here.

[0265] After step S34, when the structure 14 on the reflective layer further includes other functional layers in addition to the reflective protective layer 140, and provided that the overall light transmittance of the structure 14 on the reflective layer including the reflective protective layer 140 and the other functional layers is greater than a set value, a known corresponding process is used to prepare and form the pattern of the other functional layers.

[0266] Then, the light emitting unit 13 is mounted on the light emitting substrate. The mounted light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11.

[0267] In the light-emitting substrate prepared by the method for preparing the light-emitting substrate provided in the above embodiment, the electrical signal routing protection layer 16 formed on the first reflective layer 12 belongs to the reflective layer upper structure 14. The overall light transmittance of the reflective layer upper structure 14, including the electrical signal routing protection layer 16 formed above the first reflective layer 12, is greater than a set value, thereby ensuring that the first reflective layer 12 reflects and reuses light, irradiating and transmitting more light to the light-transmitting area of ​​the light-emitting substrate, and enabling more light to be emitted from the light-emitting surface of the light-emitting substrate. This further enables the display panel using the light-emitting substrate prepared by the above method to achieve higher display brightness and other better display effects.

[0268] On the basis of the above embodiment, further improvements and optimizations can be made. In a further embodiment, in step S32, when forming the patterns of the plurality of electrical signal routing layers 11, the following steps can be specifically included:

[0269] Before forming the next electrical signal wiring layer 11 , a second reflective layer 17 is formed on the already formed electrical signal wiring layer 11 .

[0270] Specifically, the second reflective layer 17 can be a single-layer structure or a multi-layer stacked structure. When the second reflective layer 17 is a single-layer structure, the material of the second reflective layer 17 is selected to have high reflective properties in the visible light range, and specifically, it can be a metal material with high reflectivity such as Ag, Al, etc. When the second reflective layer 17 is a multi-layer stacked structure, the main material of the second reflective layer 17 is selected to have high reflective properties in the visible light range, and specifically, it can be a metal material with high reflectivity such as Ag, Al, etc. In one embodiment, the second reflective layer 17 is preferably a multi-layer stacked structure; specifically, it can be a two-layer stacked structure of Ag / ITO. In this two-layer stacked structure, the Ag layer is the main body and plays the main reflective role, and the ITO layer is mainly used to improve the adhesion of the Ag layer and prevent oxidation of the Ag layer.

[0271] The pattern formation process of the second reflective layer 17 can be formed by exposing after deposition and forming the pattern of the second reflective layer 17 through a patterning process. Further, the steps of forming each second reflective layer 17 specifically include:

[0272] A material layer covering the second reflective layer 17 above each formed electrical signal wiring layer 11;

[0273] A patterning process is performed on the material layer of the formed second reflective layer 17 to form a pattern of the second reflective layer 17 .

[0274] In the above steps, when the second reflective layer 17 is formed directly on the electrical signal wiring layer 11, the pattern of the electrical signal wiring layer 11 can be first deposited and patterned, and then the pattern of the second reflective layer 17 can be deposited and patterned. Alternatively, the material of the electrical signal wiring layer 11 and the material of the second reflective layer 17 can be deposited sequentially, and then the pattern of the electrical signal wiring layer 11 and the pattern of the second reflective layer 17 can be formed at once through a patterning process (in this latter solution, it is only necessary to select a suitable etching solution that can etch both the material of the electrical signal wiring layer 11 and the material of the second reflective layer 17).

[0275] Take the number of the electrical signal wiring layers 11 in the light-emitting substrate to be prepared as two as an example. Figure 30 As shown, step S32 may include the following steps S321 to S326.

[0276] Step S321 , forming a pattern of a first electrical signal wiring layer 111 on the base substrate 10 .

[0277] In step S321 , the step of forming the first electrical signal wiring layer 111 is the same as the step of forming the first electrical signal wiring layer 111 in step S121 , and will not be described in detail.

[0278] Step S322 , forming a pattern of a second reflective layer 17 above the first electrical signal wiring layer 111 .

[0279] In step S322, the second reflective layer 17 may completely or partially overlap with the first electrical signal routing layer 111. When completely overlapping, the second reflective layer 17 completely covers the pattern of the first electrical signal routing layer 111; when partially overlapping, the area covered by the second reflective layer 17 includes the gaps in the pattern of the first reflective layer 12 (i.e., the non-routing area).

[0280] In step S323 , a pattern of a first electrical signal routing protection layer 161 is formed above the second reflective layer 17 .

[0281] In step S323 , the step of forming the first electrical signal wiring protection layer 161 is the same as the step of forming the first electrical signal wiring protection layer 161 in step S122 , and will not be described in detail.

[0282] In step S324 , a pattern of a first planarization layer 151 is formed on the first electrical signal routing protection layer 161 .

[0283] In step S324 , the step of forming the first planarization layer 151 is the same as the step of forming the first planarization layer 151 in step S123 , and will not be described again.

[0284] In step S325 , an interface property improving layer 18 is formed on the first planarization layer 151 .

[0285] In step S325 , the step of forming the interface performance improvement layer 18 is the same as the step of forming the interface performance improvement layer 18 in the above-mentioned step S124 , and will not be described in detail.

[0286] Step S326 , forming a pattern of the second electrical signal wiring layer 112 on the interface performance improvement layer 18 .

[0287] In step S326 , the step of forming the second electrical signal wiring layer 112 is the same as the step of forming the second electrical signal wiring layer 112 in step S125 , and will not be described in detail.

[0288] After step S326 , the process in subsequent step S33 is performed.

[0289] The light-emitting substrate having the second reflective layer 17 prepared according to the above steps can have the second reflective layer 17 reflect light passing through the first reflective layer 12 upward in the non-routing area of ​​the first reflective layer 12. When the light reflected upward is irradiated on the reflective device located above the light-emitting substrate, it will be reflected again. Part of the re-reflected light will be able to irradiate the light-transmitting area of ​​the light-emitting substrate and be transmitted and finally emitted to the liquid crystal box for display. Compared with the light-emitting substrate without the second reflective layer 17, this arrangement can increase the light transmitted from the light-transmitting area of ​​the light-emitting substrate for display, thereby achieving higher display brightness and other better display effects.

[0290] In another embodiment of the method for preparing a light-emitting substrate, the number of the electrical signal routing layer of the light-emitting substrate to be prepared is one. Specifically, the method for preparing a light-emitting substrate includes the following steps S41 to S45: Figure 31 shown.

[0291] In step S41 , a base layer 101 is formed on the substrate 100 to prepare a base substrate 10 .

[0292] In step S41 , the step of preparing the base substrate 10 is the same as the step of preparing the base substrate 10 in step S11 , and will not be described in detail.

[0293] Step S42 , forming patterns of the electrical signal wiring layer 11 and the electrical signal wiring protection layer 16 on the base substrate 10 .

[0294] Specifically, step S42 includes the following steps S421-S422: Figure 32 shown.

[0295] Step S421 , forming a pattern of the electrical signal wiring layer 11 on the base substrate 10 .

[0296] In step S421 , the step of forming the electrical signal wiring layer 11 is the same as the step of preparing and forming the single-layer electrical signal wiring layer 11 in the aforementioned other embodiments, and will not be repeated herein.

[0297] Step S422 , forming a pattern of the electrical signal wiring protection layer 16 on the electrical signal wiring layer 11 .

[0298] In step S422 , the step of forming the electrical signal wiring protection layer 16 is the same as the step of preparing and forming the single-layer electrical signal wiring protection layer 16 in the aforementioned other embodiments, and will not be repeated herein.

[0299] In step S43 , a planarization layer 15 is formed on the base substrate on which the electrical signal wiring layer 11 is formed.

[0300] Since the pattern of the electrical signal wiring protection layer 16 has been formed on the electrical signal wiring layer 11 in step S42 , the further formed planarization layer 15 in step S43 is actually formed above the electrical signal wiring protection layer 16 .

[0301] In step S43 , the step of forming the planarization layer 15 is the same as the step of preparing and forming the planarization layer 15 above the uppermost electrical signal wiring layer 11 in the aforementioned other embodiments, and is not described again.

[0302] In step S44 , a pattern of a first reflective layer 12 is formed on the base substrate 10 on which the electrical signal wiring layer 11 is formed.

[0303] Since the patterns of the electrical signal wiring protection layer 16 and the planarization layer 15 have been sequentially formed on the electrical signal wiring layer 11 in steps S42 and S43 , the first reflective layer 12 further formed in step S44 is actually formed above the planarization layer 15 .

[0304] Specifically, the step of forming the pattern of the first reflective layer 12 includes the following steps S441-S442: Figure 33 shown.

[0305] Step S441 : forming a material layer covering the first reflective layer 12 on the planarization layer 15 .

[0306] Step S442 , performing a patterning process on the material layer of the formed first reflective layer 12 to form a pattern of the first reflective layer 12 .

[0307] In step S44 , the steps of forming the first reflective layer 12 are the same as those of forming the first reflective layer 12 in step S14 , and are not described in detail.

[0308] In step S45 , a reflective layer upper structure 14 is formed on the pattern of the first reflective layer 12 . The reflective layer upper structure 14 includes at least one functional layer, and the overall light transmittance of the reflective layer upper structure 14 is greater than a set value.

[0309] In step S45 , the step of preparing the structure 14 on the reflective layer is the same as the step of preparing the structure 14 on the reflective layer in step S15 , and will not be described in detail.

[0310] Then, the light emitting unit 13 is mounted on the light emitting substrate. The mounted light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11.

[0311] According to the light-emitting substrate prepared by the method for preparing the light-emitting substrate provided in the above embodiment, the overall light transmittance of the structure 14 on the reflective layer formed on the first reflective layer 12 is greater than a set value. The set value is used as a standard value. If it is greater than the set value, it indicates that the overall light transmittance of the light passing through the structure 14 on the reflective layer is higher, which means that the structure 14 on the reflective layer has a lower light absorption rate. This can ensure that more light is incident on the first reflective layer 12, and that more light of the light reflected and emitted by the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate, thereby ultimately ensuring that the first reflective layer 12 reflects and reuses more light, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting more light, and more light will be emitted from the light-emitting surface of the light-emitting substrate, so that the display panel using the light-emitting substrate prepared according to the above method can achieve higher display brightness and other better display effects.

[0312] In another embodiment of the method for preparing a light-emitting substrate, the number of the electrical signal routing layer of the light-emitting substrate to be prepared is one. The method for preparing a light-emitting substrate does not include the step of forming a planarization layer 15 above the electrical signal routing layer 11 on the base substrate 10. Specifically, the method for preparing a light-emitting substrate includes the following steps S51 to S54, such as Figure 34 shown.

[0313] In step S51 , a base layer 101 is formed on the substrate 100 to prepare a base substrate 10 .

[0314] In step S51 , the step of preparing the base substrate 10 is the same as the step of preparing the base substrate 10 in step S11 , and will not be described in detail.

[0315] Step S52 , forming patterns of the electrical signal wiring layer 11 and the electrical signal wiring protection layer 16 on the base substrate 10 .

[0316] Specifically, step S52 includes the following steps S521 to S522.

[0317] Step S521 , forming a pattern of the electrical signal wiring layer 11 on the base substrate 10 .

[0318] In step S521 , the step of forming the electrical signal wiring layer 11 is the same as the step of preparing and forming the single-layer electrical signal wiring layer 11 in the aforementioned other embodiments, and will not be repeated herein.

[0319] Step S522 , forming a pattern of the electrical signal wiring protection layer 16 on the electrical signal wiring layer 11 .

[0320] In step S522 , the step of forming the electrical signal wiring protection layer 16 is the same as the step of preparing and forming the single-layer electrical signal wiring protection layer 16 in the aforementioned other embodiments, and will not be repeated herein.

[0321] Step S53 , forming a pattern of a first reflective layer 12 on the base substrate on which the electrical signal wiring layer 11 is formed.

[0322] Since the pattern of the electrical signal wiring protection layer 16 has been formed on the electrical signal wiring layer 11 in step S52 , the first reflective layer 12 further formed in step S53 is actually formed on the electrical signal wiring protection layer 16 .

[0323] Since there is no step of forming the planarization layer 15 above the electrical signal wiring layer 11 before step S53, in step S53, the first reflective layer 12 is formed above the electrical signal wiring protection layer 16 instead of being formed on the planarization layer 15. Compared with the other aforementioned embodiments, the above embodiment reduces the step of forming the planarization layer 15, thereby simplifying the process.

[0324] However, eliminating the step of forming the planarization layer 15 also presents corresponding problems. The planarization layer 15 serves as a buffer during the installation of the light-emitting unit 13. In the aforementioned embodiment, without forming the planarization layer 15, layers such as the electrical signal routing protection layer 16 are susceptible to fracture due to pressure during the subsequent process of installing the light-emitting unit 13, potentially causing short circuits and defects in related layers. For example, if the electrical signal routing protection layer 16 fractures due to pressure from installing the light-emitting unit 13, this could cause a short circuit between the first reflective layer 12 and the electrical signal routing layer 11, resulting in a defect.

[0325] Therefore, the methods for preparing the light-emitting substrate provided in the above different embodiments each have their own advantages and disadvantages, and in practice, one method is selected and implemented according to actual needs.

[0326] Specifically, the steps of forming the pattern of the first reflective layer 12 include:

[0327] S531 , forming a material layer covering the first reflective layer 12 on the planarization layer 15 .

[0328] S532 , performing a patterning process on the material layer of the formed first reflective layer 12 to form a pattern of the first reflective layer 12 .

[0329] In step S53 , the steps of forming the first reflective layer 12 are the same as those of forming the first reflective layer 12 in step S14 , and are not described in detail.

[0330] In step S54 , a structure 14 on the reflective layer is formed on the pattern of the first reflective layer 12 . The structure 14 on the reflective layer includes at least one functional layer. The overall light transmittance of the structure 14 on the reflective layer is greater than a set value.

[0331] In step S54 , the step of preparing the structure 14 on the reflective layer is the same as the step of preparing the structure 14 on the reflective layer in step S15 , and will not be described in detail.

[0332] Then, the light emitting unit 13 is mounted on the light emitting substrate. The mounted light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11.

[0333] According to the light-emitting substrate prepared by the method for preparing the light-emitting substrate provided in the above embodiment, the overall light transmittance of the structure 14 on the reflective layer formed on the first reflective layer 12 is greater than a set value. The set value is used as a standard value. If it is greater than the set value, it indicates that the overall light transmittance of the light passing through the structure 14 on the reflective layer is higher, which means that the structure 14 on the reflective layer has a lower light absorption rate. This can ensure that more light is incident on the first reflective layer 12, and that more light of the light reflected and emitted by the first reflective layer 12 ultimately reaches the reflective device above the light-emitting substrate, thereby ultimately ensuring that the first reflective layer 12 reflects and reuses more light, irradiating the light-transmitting area of ​​the light-emitting substrate and transmitting more light, and more light will be emitted from the light-emitting surface of the light-emitting substrate, so that the display panel using the light-emitting substrate prepared according to the above method can achieve higher display brightness and other better display effects.

[0334] In another embodiment of the method for preparing a light-emitting substrate, the number of the electrical signal routing layer of the light-emitting substrate to be prepared is one. The method for preparing a light-emitting substrate also does not include the step of forming a planarization layer 15 above the electrical signal routing layer 11 on the base substrate 10. Specifically, the method for preparing a light-emitting substrate includes the following steps S61 to S64, such as Figure 35 shown.

[0335] In step S61 , a base layer 101 is formed on the substrate 100 to prepare a base substrate 10 .

[0336] In step S61 , the step of preparing the base substrate 10 is the same as the step of preparing the base substrate 10 in step S11 , and will not be described in detail.

[0337] Step S62 , forming a pattern of the electrical signal wiring layer 11 on the base substrate 10 .

[0338] In step S62 , the step of forming the electrical signal wiring layer 11 is the same as the step of preparing and forming the single-layer electrical signal wiring layer 11 in the aforementioned other embodiments, and will not be repeated herein.

[0339] Step S63 , forming a pattern of a first reflective layer 12 on the base substrate on which the electrical signal wiring layer 11 is formed.

[0340] Since the electrical signal routing protection layer 16 is not formed above the electrical signal routing layer 11 in step S62, the first reflective layer 12 is formed above the electrical signal routing layer 11 in step S63, and there is no electrical signal routing protection layer 16 between the first reflective layer 12 and the electrical signal routing layer 11.

[0341] Specifically, the step of forming the pattern of the first reflective layer 12 further includes the following steps S631 - S632 .

[0342] Step S631 , forming a material layer covering the first reflective layer 12 above the electrical signal wiring layer 11 ;

[0343] Step S632 , performing a patterning process on the material layer of the formed first reflective layer 12 to form a pattern of the first reflective layer 12 .

[0344] The unmentioned parts of the step of preparing the first reflective layer 12 in step S63 are the same as those of the step of preparing the first reflective layer 12 in step S14 described above, and are not described again.

[0345] In step S64 , an electrical signal wiring protection layer 16 is formed on the formed first reflective layer 12 .

[0346] In step S64 , the formed electrical signal wiring protection layer 16 is located above the first reflective layer 12 . Therefore, the electrical signal wiring protection layer 16 belongs to the structure 14 on the reflective layer, and step S64 also corresponds to the step of forming the structure 14 on the reflective layer.

[0347] Therefore, for the electrical signal wiring protection layer 16 formed in step S64, an inorganic material is selected during its preparation process. Among the inorganic materials, suitable materials that meet the requirements can be selected, such as SiN, SiON or SiO, etc. The light transmittance of the material can meet the requirement that the overall light transmittance of the structure 14 on the reflective layer including the electrical signal wiring protection layer 16 is greater than the set value.

[0348] Of course, as explained above, with the development of material technology in the future, when there are other materials such as resin materials that meet the requirements, that is, the electrical signal routing protection layer 16 and the structure 14 on the reflective layer may have other layer structures prepared using resin materials and other materials, and the overall light transmittance of the electrical signal routing protection layer 16 and the structure 14 on the reflective layer prepared in step S64 is greater than the set value, these resin materials and other materials can also be selected to prepare the electrical signal routing protection layer 16 and the structure 14 on the reflective layer in step S64. Other layer structures may have.

[0349] As described above, the electrical signal trace protection layer 16 and the reflective protection layer 140 are made of the same material and serve the same function, making them interchangeable. Therefore, step S64 serves both as a step for forming the electrical signal trace protection layer 16 and as a step for forming the reflective protection layer 140 within the reflective layer upper structure 14. Consequently, a separate process step is not required for the reflective protection layer 140. Compared to the aforementioned other embodiments, this embodiment further reduces the number of process steps.

[0350] Compared to the other aforementioned embodiments, the above embodiment omits the step of forming a planarization layer 15 above the electrical signal routing layer 11, simplifying the process. However, eliminating the step of forming the planarization layer 15 above the electrical signal routing layer 11 eliminates the buffering effect provided by the planarization layer 15. Consequently, during the subsequent process of installing the light-emitting unit 13, the related layer structures may also experience short circuits. Therefore, the light-emitting substrate preparation methods described in the various embodiments above should be selected and implemented based on actual needs.

[0351] The unmentioned parts of the step of preparing the electrical signal wiring protection layer 16 in step S64 are the same as the steps of forming the electrical signal wiring protection layer 16 mentioned in the above step S12, and the same as the steps of preparing the reflective protection layer 140 in the above step S15, and are not repeated here.

[0352] After step S64, when the structure 14 on the reflective layer further includes other functional layers in addition to the reflective protective layer 140, and provided that the overall light transmittance of the structure 14 on the reflective layer including the reflective protective layer 140 and the other functional layers is greater than a set value, a known corresponding process is used to prepare and form the pattern of the other functional layers.

[0353] Then, the light emitting unit 13 is mounted on the light emitting substrate. The mounted light emitting unit 13 is connected to the electrical signal wiring layer 11 and emits light according to the electrical signal provided by the electrical signal wiring layer 11.

[0354] In the light-emitting substrate prepared by the method for preparing the light-emitting substrate provided in the above embodiment, the electrical signal routing protection layer 16 formed on the first reflective layer 12 belongs to the reflective layer upper structure 14. The overall light transmittance of the reflective layer upper structure 14, including the electrical signal routing protection layer 16 formed above the first reflective layer 12, is greater than a set value, thereby ensuring that the first reflective layer 12 reflects and reuses light, irradiating and transmitting more light to the light-transmitting area of ​​the light-emitting substrate, and enabling more light to be emitted from the light-emitting surface of the light-emitting substrate. This further enables the display panel using the light-emitting substrate prepared by the above method to achieve higher display brightness and other better display effects.

[0355] In an embodiment of the display panel, the display panel includes the light emitting substrate described in the above embodiment of the light emitting substrate.

[0356] In one embodiment, the display panel is a display panel that requires a backlight source to emit light to achieve display, such as a liquid crystal display (LCD) panel.

[0357] The display panel provided by the above embodiment includes the light-emitting substrate described in the above embodiment. The amount of light emitted from the light-emitting surface of the light-emitting substrate is greater and the brightness is higher, thereby improving the display brightness of the display panel and achieving better display effects.

[0358] In an embodiment of a display device, the display device includes the display panel described in the embodiment of the display panel.

[0359] In one embodiment, the display device may be, for example, a mobile phone, a tablet computer, an electronic watch, a sports bracelet, a laptop computer, or other device having a display panel.

[0360] The display device provided by the above embodiment includes the display panel described in the above embodiment and has the same beneficial effects as the above display panel, which will not be described in detail.

[0361] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0362] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A light-emitting substrate, characterized in that: The light-emitting substrate comprises a base substrate, and an electrical signal routing layer, a first reflective layer and a light-emitting unit are provided on one side of the base substrate; The electrical signal routing layer is connected to the light emitting unit and is used to provide electrical signals to the light emitting unit; The first reflective layer is used to reflect light incident on the first reflective layer and emit it outward; The light-emitting substrate further includes a reflective layer upper structure formed on the first reflective layer, the reflective layer upper structure including at least one functional layer, and the overall light transmittance of the reflective layer upper structure is greater than a set value; A reflective device is provided above the light-emitting substrate, and the reflective device reflects the light emitted upward by the light-emitting unit and emits it downward; among the light emitted downward, a portion passes through the structure on the reflective layer and irradiates the first reflective layer, and is reflected by the first reflective layer toward the reflective device located on the upper side of the light-emitting substrate, so that at least a portion of this portion of light can be reflected by the reflective device and emitted toward the light-transmitting area of ​​the light-emitting substrate.

2. The light-emitting substrate according to claim 1, wherein The structure on the reflective layer includes a functional layer, which is a reflective protective layer. The material of the reflective protective layer is an inorganic material.

3. The light-emitting substrate according to claim 2, wherein: The reflection protection layer is a single-layer structure, and the material of the reflection protection layer is any one of SiN, SiON and SiO; The reflection protection layer is a multi-layer stacked structure, and the material of each layer is any one of SiN, SiON, and SiO.

4. The light-emitting substrate according to any one of claim 1, wherein: The number of the electrical signal routing layer is one; the first reflective layer is formed above the electrical signal routing layer.

5. The light-emitting substrate according to claim 4, characterized in that An electrical signal routing protection layer is formed above the electrical signal routing layer, and the electrical signal routing protection layer covers the pattern of the electrical signal routing layer to protect the pattern of the electrical signal routing layer; and no planarization layer for planarizing the surface of the electrical signal routing layer is provided above the electrical signal routing layer; The first reflective layer is formed above the electrical signal routing protection layer; or, the first reflective layer is formed between the electrical signal routing protection layer and the electrical signal routing layer.

6. The light-emitting substrate according to claim 4, characterized in that A planarization layer for planarizing the surface of the electrical signal wiring layer is formed above the electrical signal wiring layer, and the material of the planarization layer is a resin material; the first reflective layer is formed above the planarization layer.

7. The light-emitting substrate according to any one of claim 1, wherein: The electrical signal routing layer is a multi-layer structure, which is stacked, and the first reflective layer is formed above the uppermost electrical signal routing layer.

8. The light-emitting substrate according to claim 7, wherein: A corresponding electric signal routing protection layer is formed above each of the electric signal routing layers, and the electric signal routing protection layer covers the pattern of the corresponding electric signal routing layer to protect the pattern of the corresponding electric signal routing layer; No planarization layer for planarizing the surface of the electrical signal routing layer is provided above the uppermost electrical signal routing layer; The first reflective layer is formed above the uppermost electrical signal routing protection layer, or the first reflective layer is formed between the uppermost electrical signal routing protection layer and the corresponding electrical signal routing layer.

9. The light-emitting substrate according to claim 7, wherein: A planarization layer for planarizing the surface of the uppermost electrical signal wiring layer is formed above the uppermost electrical signal wiring layer, and the material of the planarization layer is a resin material; the first reflective layer is formed above the planarization layer.

10. The light emitting substrate according to claim 7, wherein The light-emitting substrate further includes a second reflective layer formed above the other electrical signal routing layers except the uppermost electrical signal routing layer and located between each electrical signal routing layer and the adjacent upper electrical signal routing layer.

11. The light emitting substrate according to any one of claims 1 to 3, wherein: The light-emitting substrate includes a light-transmitting area and a non-light-transmitting area; the electrical signal routing layer, the pattern of the first reflective layer, and the light-emitting unit are arranged in the non-light-transmitting area; the light-transmitting area allows light to pass through the first side of the light-emitting substrate and emit toward the second side of the light-emitting substrate, and the first side of the light-emitting substrate is the side where the electrical signal routing layer, the first reflective layer, and the light-emitting unit are located; The light-emitting substrate includes a base substrate and a structure on the reflective layer in the light-transmitting area.

12. The light-emitting substrate according to claim 4 or 7, characterized in that: The light-emitting substrate includes a light-transmitting area and a non-light-transmitting area; the electrical signal routing layer, the pattern of the first reflective layer, and the light-emitting unit are arranged in the non-light-transmitting area; the light-transmitting area allows light to pass through the first side of the light-emitting substrate and emit toward the second side of the light-emitting substrate, and the first side of the light-emitting substrate is the side where the electrical signal routing layer, the first reflective layer, and the light-emitting unit are located; An electrical signal routing protection layer is formed above each electrical signal routing layer, and the electrical signal routing protection layer covers the pattern of the electrical signal routing layer to protect the pattern of the electrical signal routing layer; The light-emitting substrate includes a base substrate and the electrical signal wiring protection layer in the light-transmitting area.

13. The light-emitting substrate according to claim 1, wherein The light-emitting unit is LED, Mini LED or Micro LED.

14. A method for preparing a light-emitting substrate, characterized in that: The following steps are involved: forming a pattern of a first reflective layer on a base substrate having an electrical signal wiring layer; forming an upper reflective layer structure on the pattern of the first reflective layer, wherein the upper reflective layer structure includes at least one functional layer, and the overall light transmittance of the upper reflective layer structure is greater than a set value; A reflective device is provided above the light-emitting substrate, and the reflective device reflects the light emitted upward by the light-emitting unit of the light-emitting substrate and emits it downward; among the light emitted downward, a portion passes through the structure on the reflective layer and irradiates the first reflective layer, and is reflected by the first reflective layer toward the reflective device located on the upper side of the light-emitting substrate, so that at least a portion of this portion of light can be reflected by the reflective device and emitted toward the light-transmitting area of ​​the light-emitting substrate.

15. The method for preparing a light-emitting substrate according to claim 14, wherein: The structure on the reflective layer includes a functional layer, which is a reflective protective layer; The steps of forming the reflective protective layer include: covering an inorganic material layer above the pattern of the first reflective layer; The inorganic material layer is patterned to form a pattern of the reflective protection layer.

16. The method for preparing a light-emitting substrate according to claim 14, wherein: The number of the electrical signal routing layer of the light-emitting substrate to be prepared is one; The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer: forming an electrical signal wiring protection layer on the base substrate having the electrical signal wiring layer formed thereon; The step of forming the first reflective layer includes: A material layer covering the first reflective layer above the electrical signal routing protection layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; or The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer: forming a planarization layer on the base substrate having the electrical signal wiring layer formed thereon; The step of forming the first reflective layer includes: a material layer covering the first reflective layer above the planarization layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; or The step of forming the first reflective layer includes: Before forming the electrical signal routing protection layer, a material layer of the first reflective layer is covered on the electrical signal routing layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; The method for preparing the light-emitting substrate further includes, after forming the first reflective layer: The step of forming an electrical signal wiring protection layer above the formed first reflective layer belongs to the step of forming a structure on the reflective layer.

17. The method for preparing a light-emitting substrate according to claim 14, wherein: The number of electrical signal routing layers of the light-emitting substrate to be prepared is a multi-layer stacked structure; The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer: forming an electrical signal wiring protection layer above the uppermost electrical signal wiring layer on the base substrate; The step of forming the first reflective layer includes: a material layer covering the first reflective layer on the electrical signal routing protection layer formed above the uppermost electrical signal routing layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; or The method for preparing the light-emitting substrate further includes the following steps before forming the first reflective layer: forming a planarization layer on the uppermost electrical signal wiring layer on the substrate; The step of forming the first reflective layer includes: a material layer covering the first reflective layer on the planarization layer formed above the uppermost electrical signal wiring layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; or The step of forming the first reflective layer includes: Before forming the electric signal wiring protection layer, a material layer of the first reflective layer is covered on the uppermost electric signal wiring layer; performing a patterning process on the material layer of the formed first reflective layer to form a pattern of the first reflective layer; The method for preparing the light-emitting substrate further includes, after forming the first reflective layer: The step of forming an electrical signal wiring protection layer above the formed first reflective layer belongs to the step of forming a structure on the reflective layer.

18. The method for preparing a light-emitting substrate according to claim 16 or 17, wherein: In the step of forming the pattern of the planarization layer, the material of the planarization layer formed in the light-transmitting area of ​​the light-emitting substrate is removed.

19. The method for preparing a light-emitting substrate according to claim 17, wherein: The method for preparing the light-emitting substrate further includes: Before forming the next electrical signal wiring layer, forming a second reflective layer on the formed electrical signal wiring layer; The step of forming the second reflective layer comprises: A material layer covering the second reflective layer above each formed electrical signal wiring layer; The material layer of the formed second reflective layer is subjected to a patterning process to form a pattern of the second reflective layer.

20. A display panel, characterized in that the display panel comprises the light-emitting substrate according to any one of claims 1 to 13.

21. A display device, characterized in that: The display device includes the display panel according to claim 20.

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