Forming apparatus for flexible circuit board and forming method for flexible circuit board

Abstract

The present invention provides a flexible circuit board forming apparatus and a flexible circuit board forming method. The flexible circuit board forming apparatus includes a first forming jig that coholds, with a first carrying jig, a flexible circuit board carried by the first carrying jig, and performs preforming on the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; and a second forming jig that coholds, with a second carrying jig, the flexible circuit board on which the preforming is performed and which is carried by the second carrying jig, and performs forming on the flexible circuit board at a second temperature that is higher than the first temperature and at which the flexible circuit board plastically deforms.

Description

TECHNICAL FIELD

[0001] The present application relates to a flexible circuit board forming apparatus and a flexible circuit board forming method. BACKGROUND

[0002] Flexible circuit boards are widely used in electronic devices typified by smartphones and notebook computers.

[0003] In recent years, miniaturization of such electronic devices is required. In manufacturing the electronic devices, bending or assembly of the flexible circuit boards is performed. In manufacturing the miniaturized electronic devices, space saving of the flexible circuit boards is desired. That is, it is desired to arrange the flexible circuit boards in limited spaces.

[0004] Therefore, the flexible circuit boards are required to be formed into desired shapes. Thus, the requirements for forming such as bending of the flexible circuit boards are increasing. Specifically, forming with a smaller bending angle, bending radius, and springback is required. In view of these requirements, in Japanese Patent Application Publication No. 2012-023133 and Japanese Patent Application Publication No. 2005-096408, heating forming of a thermoplastic flexible circuit board is described. In detail, in Japanese Patent Application Publication No. 2012-023133, forming of a flexible circuit board by heating using an oven is described. In Japanese Patent Application Publication No. 2005-096408, a forming apparatus for bending a flexible circuit board is described.

[0005] In the existing heating forming of the flexible circuit board, in the case where the bending radius is small, internal damage such as wire breakage or interlayer peeling due to bending stress of the flexible circuit board sometimes occurs. In addition, in the case where the thickness of the flexible circuit board is thick due to a thick insulating layer or a large number of layers, internal damage or interlayer peeling due to the bending stress also occurs. SUMMARY

[0006] The present application is achieved based on the above-described technical knowledge. An object of the present application is to provide a flexible circuit board forming apparatus and a flexible circuit board forming method as described below. According to the forming apparatus and the forming method, in forming of the flexible circuit board, even in the case where the bending radius is small or the thickness of the flexible circuit board is thick, internal damage and interlayer peeling can be suppressed.

[0007] The first forming apparatus for a flexible circuit board of the present application forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin stacked one on another, and includes: a first forming jig that co-holds the flexible circuit board carried on a first carrying jig to pre-form the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; and a second forming jig that co-holds the flexible circuit board, on which the pre-forming has been performed, carried on a second carrying jig to form the flexible circuit board at a second temperature higher than the first temperature at which the flexible circuit board plastically deforms.

[0008] Further, it is preferable that, in the first forming apparatus, the second forming jig is warmed up to the second temperature before the forming is performed.

[0009] Further, it is preferable that, in the first forming apparatus, the first temperature is about 20°C to about 30°C, and the second temperature is about 120°C to about 200°C.

[0010] Further, it is preferable that, in the first forming apparatus, the second forming jig includes: a forming block that co-holds the flexible circuit board with the second carrying jig; a support portion that supports the forming block; a thermocouple that measures the temperature of the flexible circuit board held by the second carrying jig and the forming block; and a heater that heats the forming block.

[0011] Further, it is preferable that, in the first forming apparatus, the second carrying jig includes a heater.

[0012] Further, it is preferable that the first forming apparatus further includes a restriction jig that maintains the bent state of the flexible circuit board carried on the second carrying jig.

[0013] Further, the first forming apparatus further includes a restriction jig stopper portion that fixes the restriction jig that maintains the bent state of the flexible circuit board carried on the second carrying jig to the second carrying jig.

[0014] Further, it is preferable that, in the first forming apparatus, the restriction jig further includes an opening portion for abutting the second forming jig against the flexible circuit board.

[0015] Further, it is preferable that, in the first forming apparatus, the first carrying jig and the second carrying jig are different carrying jigs, respectively.

[0016] Further, it is preferable that, in the first forming apparatus, the first holding jig and the second holding jig are the same holding jigs as each other.

[0017] Further, it is preferable that, in the first forming apparatus, the thermoplastic resin contains a liquid crystal polymer.

[0018] The second forming apparatus of the second aspect of the present application is a forming apparatus for a flexible circuit board including a plurality of insulating layers each containing a thermoplastic resin and stacked one on another, the forming apparatus including: a first forming jig that coholds a flexible circuit board carried on a first holding jig with the first holding jig to form the flexible circuit board at a first temperature at which the flexible circuit board plastically deforms; and a second forming jig that coholds the flexible circuit board, on which the forming has been performed and which is carried on a second holding jig, with the second holding jig to perform a post-forming of the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board does not plastically deform.

[0019] Further, it is preferable that, in the second forming apparatus, the first forming jig is warmed up to the first temperature before the forming is performed, and the second forming jig is cooled down to the second temperature before the post-forming is performed.

[0020] Further, it is preferable that, in the second forming apparatus, the first temperature is about 120°C to about 200°C, and the second temperature is about 20°C to about 50°C.

[0021] The third forming apparatus of the third aspect of the present application is a forming apparatus for a flexible circuit board including a plurality of insulating layers each containing a thermoplastic resin and stacked one on another, the forming apparatus including: a first forming jig that coholds a flexible circuit board carried on a first holding jig with the first holding jig to perform a pre-forming of the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; a second forming jig that coholds the flexible circuit board, on which the pre-forming has been performed and which is carried on a second holding jig, with the second holding jig to form the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board plastically deforms; and a third forming jig that coholds the flexible circuit board, on which the forming has been performed and which is carried on a third holding jig, with the third holding jig to perform a post-forming of the flexible circuit board at a third temperature lower than the second temperature and at which the flexible circuit board does not plastically deform.

[0022] Further, it is preferable that, in the third molding device, the second molding jig is warmed up to the second temperature before the molding is performed, and the third molding jig is cooled down to the third temperature before the post-molding is performed.

[0023] Further, it is preferable that, in the third molding device, the first temperature is about 20°C to about 30°C, the second temperature is about 120°C to about 200°C, and the third temperature is about 20°C to about 50°C.

[0024] Further, it is preferable that, in the third molding device, at least one of the first carrying jig, the second carrying jig, and the third carrying jig is a carrying jig different from the other carrying jigs.

[0025] Further, it is preferable that, in the third molding device, the first carrying jig, the second carrying jig, and the third carrying jig are carrying jigs identical to each other.

[0026] Further, it is preferable that, in the first to third molding devices, the plurality of insulating layers of the flexible circuit board are laminated to each other with an adhesive layer.

[0027] A method of molding a flexible circuit board according to a first aspect of the present application molds a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated to each other, the method including: a first step of performing pre-molding on a flexible circuit board carried on a first carrying jig with the flexible circuit board not being plastically deformed at a first temperature using a first carrying jig and a first molding jig; and a second step of performing molding on the flexible circuit board on which the pre-molding has been performed and which is carried on a second carrying jig at a second temperature higher than the first temperature and at which the flexible circuit board is plastically deformed using a second carrying jig and a second molding jig.

[0028] A method of molding a flexible circuit board according to a second aspect of the present application molds a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated to each other, the method including: a first step of performing molding on a flexible circuit board carried on a first carrying jig at a first temperature at which the flexible circuit board is plastically deformed using a first carrying jig and a first molding jig; and a second step of performing post-molding on the flexible circuit board on which the molding has been performed and which is carried on a second carrying jig at a second temperature lower than the first temperature and at which the flexible circuit board is not plastically deformed using a second carrying jig and a second molding jig.

[0029] The third method of the present application is a method of forming a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin stacked one on another, the method of forming a flexible circuit board including: a first step of pre-forming the flexible circuit board carried by a first carrying jig with a first forming jig at a first temperature at which the flexible circuit board does not plastically deform; a second step of forming the flexible circuit board carried by a second carrying jig with a second forming jig at a second temperature higher than the first temperature at which the flexible circuit board plastically deforms; and a third step of post-forming the flexible circuit board carried by a third carrying jig with a third forming jig at a third temperature lower than the second temperature at which the flexible circuit board does not plastically deform.

[0030] According to the present application, a forming apparatus and a forming method of a flexible circuit board can be provided, which can suppress internal damage and interlayer peeling even in a case where a bending radius is small or a case where a board thickness is thick. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a configuration view of the forming apparatus of the flexible circuit board of the first embodiment.

[0032] Figure 2 is a configuration view of the first forming jig in the forming apparatus of the flexible circuit board of the first embodiment.

[0033] Figure 3 is a configuration view of the second forming jig in the forming apparatus of the flexible circuit board of the first embodiment.

[0034] Figure 4 is a configuration view of the first carrying jig in the forming apparatus of the flexible circuit board of the first embodiment.

[0035] Figure 5 is a flowchart showing a series of flows of the forming method of the flexible circuit board of the first embodiment.

[0036] Figure 6 (a) and (b) are views for explaining a method of carrying the flexible circuit board in the first embodiment by the first carrying jig.

[0037] Figure 7 is a view showing a state in which the flexible circuit board in the first embodiment is carried by the first carrying jig.

[0038] Figure 8Fig. 6 is a diagram for explaining the pre-molding of the flexible circuit board in the first embodiment, and is a view showing a state before the flexible circuit board is clamped with the first carrying jig and the first molding jig.

[0039] Figure 9 Fig. 7 is a diagram for explaining the pre-molding of the flexible circuit board in the first embodiment, and is a view showing a state where the flexible circuit board is clamped with the first carrying jig and the first molding jig.

[0040] Figure 10 Fig. 8 is a diagram for explaining the pre-molding of the flexible circuit board in the first embodiment, and is a view showing a state after the flexible circuit board is clamped with the first carrying jig and the first molding jig.

[0041] Figure 11 Fig. 9 is a diagram for explaining the molding of the flexible circuit board in the first embodiment, and is a view showing a state before the flexible circuit board is clamped with the second carrying jig and the second molding jig.

[0042] Figure 12 Fig. 10 is a diagram for explaining the molding of the flexible circuit board in the first embodiment, and is a view showing a state where the flexible circuit board is clamped with the second carrying jig and the second molding jig.

[0043] Figure 13 Fig. 11 is a diagram for explaining the molding of the flexible circuit board in the first embodiment, and is a view showing a state after the flexible circuit board is clamped with the second carrying jig and the second molding jig.

[0044] Figure 14 Fig. 12 is a configuration view of a molding apparatus of the flexible circuit board in the second embodiment.

[0045] Figure 15 Fig. 13 is a configuration view of the second molding jig in the molding apparatus of the flexible circuit board in the second embodiment.

[0046] Figure 16 Fig. 14 is a flowchart showing a series of flows of a molding method of the flexible circuit board in the second embodiment.

[0047] Figure 17 Fig. 15 is a diagram for explaining the post-molding of the flexible circuit board in the second embodiment, and is a view showing a state before the flexible circuit board is clamped with the second carrying jig and the second molding jig.

[0048] Figure 18 Fig. 16 is a diagram for explaining the post-molding of the flexible circuit board in the second embodiment, and is a view showing a state where the flexible circuit board is clamped with the second carrying jig and the second molding jig.

[0049] Figure 19is a view for explaining the post-molding of the flexible circuit board in the second embodiment, and is a view showing a state after the flexible circuit board is clamped by the second carrier jig and the second molding jig.

[0050] Figure 20 is a configuration view of a molding apparatus of the flexible circuit board of the third embodiment.

[0051] Figure 21 is a flowchart showing a series of flows of the molding method of the flexible circuit board of the third embodiment.

[0052] Figure 22 is a configuration view of a restriction jig of the flexible circuit board.

[0053] Figure 23 is a perspective view of the restriction jig for explaining the maintenance of the bent state of the flexible circuit board.

[0054] Figure 24 is a sectional view of the restriction jig for explaining the maintenance of the bent state of the flexible circuit board.

[0055] Figure 25 is a configuration view of the restriction jig of the flexible circuit board with a restriction jig stopper.

[0056] Figure 26 is a perspective view of the restriction jig with a restriction jig stopper for explaining the maintenance of the bent state of the flexible circuit board.

[0057] Figure 27 is a sectional view of the restriction jig with a restriction jig stopper for explaining the maintenance of the bent state of the flexible circuit board.

[0058] Figure 28 is a configuration view of the restriction jig of the flexible circuit board with an opening.

[0059] Figure 29 is a perspective view of the restriction jig with an opening for explaining the maintenance of the bent state of the flexible circuit board.

[0060] Figure 30 is a sectional view of the restriction jig with an opening for explaining the maintenance of the bent state of the flexible circuit board.

[0061] Figure 31 is a sectional view showing one example of the flexible circuit board.

[0062] Figure 32 is an image showing one example of the molded flexible circuit board.

[0063] Figure 33 is a coordinate graph showing one example of the change over time of the bending angle of the flexible circuit board. DETAILED DESCRIPTION

[0064] Embodiments of the present invention will now be described with reference to the accompanying drawings. Furthermore, in each drawing, components with equivalent functions are labeled with the same reference numerals. Also, the drawings are schematic depictions. Therefore, in each drawing, there may be differences from reality in the size of the components, the positional relationships between the components, dimensions, and ratios.

[0065] (First Implementation)

[0066] Reference Figures 1-4 The configuration of the flexible circuit board forming apparatus (FPC forming apparatus) 1 of this embodiment will be described. Figure 1 This is a structural diagram of the FPC forming device 1. Figure 2 This is a side view of the first forming fixture 10 of the FPC forming apparatus 1. Figure 3 This is a side view of the second forming fixture 20. Furthermore, Figure 4 This is a side view of the support fixture 40.

[0067] like Figure 1 As shown, the FPC forming apparatus 1 of this embodiment includes a first forming fixture 10, a second forming fixture 20, a support fixture 40, a housing 50, and a track 60.

[0068] As described below, the FPC forming apparatus 1 of this embodiment is configured to form a flexible circuit board FPC comprising multiple insulating layers, the multiple insulating layers being stacked on top of each other and containing thermoplastic resin. The insulating layers may also be formed to contain substantially only thermoplastic resin.

[0069] Furthermore, in this flexible printed circuit board (FPC), the thermoplastic resin can be formed to contain liquid crystal polymers or to contain essentially only liquid crystal polymers. For example, a low-melting-point liquid crystal polymer (LCP) material can also be used as the thermoplastic resin. That is, multiple low-melting-point LCP materials can be stacked on top of each other without the aid of an adhesive layer, but rather by thermally fusing them together. On the other hand, multiple insulating layers (insulators) of the flexible printed circuit board (FPC) can also be stacked on top of each other with the aid of an adhesive layer.

[0070] Figure 2 Indicates viewing from the positive Y-axis direction Figure 1 The first forming fixture 10 is shown as a side view. The first forming fixture 10 includes a support portion 11 movable along the Z-axis, a forming block 12 connected to the lower end of the support portion 11, and a thermocouple 13 fixed to the forming block 12. This first forming fixture 10, together with the carrier fixture 40, clamps the flexible printed circuit board (FPC) for pre-forming.

[0071] The support portion 11 extends in the Z-axis direction and supports the forming block 12. The support portion 11 is composed of a member made of aluminum, iron, stainless steel, or the like, which has rigidity. The forming block 12 abuts against the flexible circuit board FPC and forms the flexible circuit board FPC. The forming block 12 is also composed of a member made of aluminum, iron, stainless steel, or the like, which has rigidity capable of forming the flexible circuit board FPC, like the support portion 11.

[0072] The thermocouple 13 measures the temperature of the forming block 12. In the present embodiment, the temperature of the flexible circuit board FPC is grasped on the basis of the temperature of the forming block 12 measured by the thermocouple 13. Therefore, the thermocouple 13 is provided at one end of the forming block 12. However, the thermocouple 13 is not limited to being provided at one end of the forming block 12, but can be provided at any position suitable for measuring the temperature of the forming block 12.

[0073] Figure 3 With Figure 2 the first forming jig 10, a side view of the second forming jig 20 is shown as viewed in the positive direction of the Y-axis. The second forming jig 20 has a support portion 21 movable in the Z-axis direction, a forming block 22 connected to a lower end of the support portion 21, and a thermocouple 23 fixed to the forming block 22, like the first forming jig 10. In addition, the second forming jig 20 has a heater 24. The second forming jig 20 and the carrier jig 40 collectively hold the flexible circuit board FPC and form the flexible circuit board FPC.

[0074] The support portion 21 and the forming block 22 of the second forming jig 20 are composed of aluminum, iron, stainless steel, or the like. However, the second forming jig 20 is heated by the heater 24, and therefore the support portion 21 and the forming block 22 can be composed of a member having not only rigidity but also heat resistance. The thermocouple 23 also measures the temperature of the forming block 22, like the thermocouple 13 of the first forming jig 10. The temperature of the flexible circuit board FPC is grasped on the basis of the temperature of the forming block 22.

[0075] In Figure 3 the second forming jig 20, the heater 24 is assembled to the forming block 22. Further, the forming block 22 is heated by the heater 24 to a temperature at which the flexible circuit board FPC is plastically deformed. The heater 24 is, for example, an electric heater or the like. In addition, the position at which the heater 24 is provided is not limited to the central portion of the forming block 22. That is, the heater 24 can be provided at any position suitable for heating the flexible circuit board FPC so as to be plastically deformed.

[0076] Figure 4A side view of the carrier clamp 40 as viewed from the positive direction of the Y axis is shown. The carrier clamp 40 holds the flexible circuit board FPC in cooperation with the first or second forming clamp 10 or 20 described above. Therefore, the carrier clamp 40 has rigidity capable of holding the flexible circuit board FPC and heat resistance capable of withstanding heating by the heater 24 of the second forming clamp 20.

[0077] Therefore, the carrier clamp 40 can be made of a high-temperature resistant resin such as poly ether ether ketone (PEEK) in addition to a metal such as aluminum, iron, or stainless steel. That is, the carrier clamp 40 can be made of a metal or a resin material having heat resistance corresponding to a processing temperature. As the material of the carrier clamp 40, for example, in the case of processing at a low temperature of about 120°C or less, an acrylic resin can be selected, and on the other hand, in the case of processing at a high temperature of about 300°C or more, a metal such as aluminum can be selected. As shown in FIG. 6, the carrier clamp 40 has a slope 40F1 and a slope 40F2. These two slopes oppose the forming block 12 or 22 and hold the flexible circuit board FPC in cooperation therewith. Figure 4

[0078] Figure 1 As shown in FIG. 7, the housing 50 is provided so as to cover the first forming clamp 10, the second forming clamp 20, and the carrier clamp 40 present at a position opposite to each forming clamp. The housing 50 protects the flexible circuit board FPC from dust and the like. The housing 50 is made of a reinforced plastic or the like. The housing 50 has an inlet 50a and an outlet 50b. The inlet 50a is used for carrying the flexible circuit board FPC before forming into the inside of the housing. The outlet 50b is used for carrying the flexible circuit board FPC after forming out.

[0079] A drive device (not shown) for moving the support portions 11, 21 in the Z axis direction is provided in the housing 50. The upper ends of the support portions 11, 21 are connected to the drive device mechanism. Alternatively, the support portions 11, 21 can be moved up and down in the Z axis direction in linkage with each other.

[0080] As shown in FIG. 8, the rail 60 is provided along the Y axis direction. The rail 60 moves the carrier clamp 40 in the positive direction of the Y axis. In the present embodiment, the carrier clamp 40 is detachable with respect to the rail 60. Figure 1 Next, a method of forming a flexible circuit board using the FPC forming apparatus 1 described above will be described with reference to FIG. 9.

[0081] Figures 5-13

[0082] <Method of forming a flexible circuit board FPC>

[0083] Figure 5 ​​​​is a flowchart showing a series of flows of a molding method of a flexible circuit board FPC according to the present embodiment.

[0084] In the molding method of the flexible circuit board FPC according to the present embodiment, first, the flexible circuit board FPC is fixed to the carrier jig 40 (step S100). In detail, the flexible circuit board FPC is fixed to one of the inclined surfaces (inclined surface 40F1 or inclined surface 40F2) of the carrier jig 40.

[0085] In Figure 6 (a) of FIG. 10, the carrier jig 40 is shown as viewed from the negative direction of the X axis. Figure 4 In Figure 6 (a) of FIG. 10, the inclined surface 40F1 of the carrier jig 40 is shown. Further, the inclined surface 40F1 has the fixing guide pins 42a, 42b, 42c for fixing the flexible circuit board FPC.

[0086] On the other hand, in Figure 6 (a) of FIG. 10, the flexible circuit board FPC in the shape of an inverted T is shown. In Figure 6 (a) of FIG. 10, the fixing points P1, P2, P3 of the flexible circuit board FPC are also shown. When the flexible circuit board FPC is fixed to the carrier jig 40, the flexible circuit board FPC is carried in such a manner that the fixing points P1, P2, P3 described above correspond to the fixing guide pins 42a, 42b, 42c of the inclined surface 40F1 described above.

[0087] Thus, as shown in Figure 6 (b) of FIG. 10, the flexible circuit board FPC is fixed to the carrier jig 40 in such a manner that it does not slip off the inclined surface 40F1. Further, Figure 7 is a side view of the carrier jig 40 and the flexible circuit board FPC shown in Figure 6 (b) of FIG. 10 as viewed from the positive direction of the Y axis.

[0088] Further, the fixing method of the flexible circuit board FPC to the carrier jig 40 is not limited to the method described above. For example, the fixing guide pins 42 are not limited to three, but can be two, four, or five, or any number. Further, instead of providing the fixing guide pins 42, a counterbore machining corresponding to the shape of the flexible circuit board FPC can be implemented on the inclined surface of the carrier jig 40, or in addition to the fixing guide pins 42, a counterbore machining corresponding to the shape of the flexible circuit board FPC can be implemented on the inclined surface of the carrier jig 40. That is, the flexible circuit board FPC can be fixed to the carrier jig 40 by fitting the flexible circuit board FPC in the counterbore machining.

[0089] Referring again to Figure 5, the explanation of the forming method of the present embodiment will be continued. After the flexible circuit board FPC is fixed to the carrying jig 40 as described above, the carrying jig 40 carrying the flexible circuit board FPC is moved to a position corresponding to the first forming jig 10 (in the present embodiment, a position directly below the first forming jig 10) by the rail 60. Then, the flexible circuit board FPC carried on the carrying jig 40 is clamped by the carrying jig 40 and the first forming jig 10, and pre-formed at a first temperature (step S102).

[0090] In the present embodiment, the first temperature is a temperature at which the flexible circuit board FPC does not undergo plastic deformation. It is preferable that the first temperature be, for example, about 20°C to about 30°C. In addition, it is preferable that the clamping time (forming time) of the flexible circuit board FPC at the first temperature be, for example, about 120 seconds. Furthermore, the pre-forming described above includes processing of bending the flexible circuit board FPC by a desired angle at the first temperature.

[0091] Here, reference will be made to Figures 8-10 , the pre-forming of step S102 will be explained in detail. As described above Figures 8-10 , the first forming jig 10 is driven by a driving unit (not shown) to slide in the Z-axis direction. Figure 8 It is shown that the carrying jig 40 carrying the flexible circuit board FPC is positioned directly below the first forming jig 10. Furthermore, Figure 8 It is shown that a state before the flexible circuit board FPC is clamped by the carrying jig 40 and the first forming jig 10.

[0092] In Figure 9 , the first forming jig 10 is moved in the negative direction of the Z-axis from the state shown in Figure 8 , the flexible circuit board FPC is clamped by the carrying jig 40 and the first forming jig 10. The gap between the carrying jig 40 and the first forming jig 10 in this clamped state is controlled to a value set in advance. This gap is preferably set, for example, to the same degree as the thickness of the flexible circuit board FPC. Thus, the flexible circuit board FPC can be prevented from being pressed excessively.

[0093] In addition, in Figure 9 , the forming block 12 and the carrying jig 40 clamp the flexible circuit board FPC in such a manner that the bending processing portion (recessed portion) El of the forming block 12 and the bending processing portion (protruding portion) E2 of the carrying jig 40 are fitted to each other. Thus, the flexible circuit board FPC is bent by a bending angle Θ in the bending processing portions El, E2. By freely setting the bending angle Θ, the flexible circuit board FPC can be bent at an arbitrary angle.

[0094] In Figure 10 , it is shown that the first forming jig 10 is moved in the negative direction of the Z-axis from the state shown in Figure 9The state begins with the flexible printed circuit board (FPC) moving in the positive Z-axis direction, indicating a bent state. That is, in... Figure 10 The image shows the state after the flexible circuit board (FPC) is clamped by the support fixture 40 and the first forming fixture 10. This is the pre-forming of the flexible circuit board (FPC) involved in step S102.

[0095] Refer again Figure 5 The following steps will be explained after step S102. The flexible circuit board FPC, formed in step S102, is moved together with the carrier fixture 40 using the track 60 to a position corresponding to the second forming fixture 20 (in this embodiment, directly below the second forming fixture 20). Then, the flexible circuit board FPC, supported by the carrier fixture 40, is clamped by the carrier fixture 40 and the second forming fixture 20, and formed at a second temperature (step S104).

[0096] In this embodiment, the second temperature is a higher temperature than the first temperature described above. Specifically, the second temperature is the temperature at which the flexible printed circuit board (FPC) undergoes plastic deformation, and also the temperature at which the adhesive layer bonding the insulating layers together does not melt out of the insulating layers. Preferably, the second temperature is, for example, about 120°C to about 200°C. Furthermore, it is preferable that the clamping time of the flexible printed circuit board (FPC) at the second temperature is, for example, about 120 seconds. Moreover, the above-described forming process includes processing to cause plastic deformation of the flexible printed circuit board (FPC) at this second temperature and processing to maintain the bent shape.

[0097] Here, refer to Figures 11-13 The forming process of step S104 will be described in detail. Figures 11-13 As shown, the second forming jig 20 is driven by a drive unit (not shown) in the same way as the first forming jig 10, and slides along the Z-axis direction. Preferably, the forming block 22 is preheated to the second temperature described above by the heater 24.

[0098] Figure 11 This indicates the state before the carrier fixture 40 is located directly below the second forming fixture 20, and before the flexible circuit board FPC is clamped by the carrier fixture 40 and the second forming fixture 20.

[0099] exist Figure 12 In the state shown, the second forming fixture 20 is from Figure 11 The device moves in the negative Z-axis direction as shown, using the support clamp 40 and the second forming clamp 20 to hold the flexible circuit board (FPC). In this case, the gap between the support clamp 40 and the second forming clamp 20 is preset in the same way as the first forming clamp 10. Preferably, this gap is set to, for example, the same degree as the thickness of the flexible circuit board (FPC). This prevents the flexible circuit board (FPC) from being excessively pressed.

[0100] In addition, in Figure 12 the same manner as the first shaping jig 10, the shaping block 22 and the carrier jig 40 hold the flexible circuit board FPC in such a manner that the curved processed portion (recessed portion) E3 of the shaping block 22 and the curved processed portion (protruded portion) E2 of the carrier jig 40 are fitted to each other. Thus, the flexible circuit board FPC is bent at the bending angle Θ in the curved processed portions E3, E2. By freely setting the bending angle Θ, the flexible circuit board FPC can be bent at an arbitrary angle. In addition, it is preferable that the shape of the curved processed portion E1 of the first shaping jig 10 and the shape of the curved processed portion E3 of the second shaping jig 20 are identical to each other.

[0101] Figure 13 indicates that the second shaping jig 20 is moved in the positive direction of the Z-axis from the state shown in Figure 12 the flexible circuit board FPC is plastically deformed and maintained in the bent state. That is, in Figure 13 indicates a state after the flexible circuit board FPC is held by the carrier jig 40 and the second shaping jig 20. By completing this step S104, the shaping of the flexible circuit board FPC of the present embodiment is ended.

[0102] The above-described method for shaping a flexible circuit board in the present embodiment includes a first process (step S102) of holding the flexible circuit board FPC carried on the carrier jig 40 by the carrier jig 40 and the first shaping jig 10, and pre-shaping the flexible circuit board FPC at a first temperature, and a second process (step S104) of holding the pre-shaped flexible circuit board FPC carried on the carrier jig 40 by the carrier jig 40 and the second shaping jig 20, and shaping the flexible circuit board FPC at a second temperature higher than the first temperature at which the flexible circuit board FPC is plastically deformed.

[0103] In such a first embodiment, after the pre-shaping at the first temperature at which the flexible circuit board FPC is not plastically deformed, the shaping is performed at the second temperature at which the flexible circuit board FPC is plastically deformed. Thus, according to the present embodiment, the bending stress acting on the flexible circuit board FPC can be mitigated. As a result, in the case where the flexible circuit board FPC having a relatively thick thickness is shaped or in the case where the bending radius is small, the occurrence of internal damage and interlayer peeling can be suppressed.

[0104] Further, according to the first embodiment, the shaping block 22 of the second shaping jig 20 is pre-heated. Thus, the shaping at which the flexible circuit board FPC is plastically deformed can be performed immediately after the flexible circuit board FPC is held. Thus, the time required for the shaping of the flexible circuit board FPC can be shortened.

[0105] Further, in the pre-molding and molding of the flexible circuit board FPC in the present embodiment, the first molding jig 10 and the second molding jig 20 are caused to slide in a direction perpendicular to the moving direction of the rail 60. That is, the first molding jig 10 and the second molding jig 20 are caused to slide in the Z-axis direction. However, the present embodiment is not limited thereto, and the pre-molding and molding can be performed in a direction parallel to the rail 60. In this case, the first molding jig 10 and the second molding jig 20 can be configured to slide in the X-axis direction or the Y-axis direction.

[0106] Further, in the present embodiment, the support portion 11 of the first molding jig 10 and the support portion 21 of the second molding jig 20 are caused to slide in the Z-axis direction in linkage with each other. Therefore, the clamping time in the pre-molding performed at the first temperature and the clamping time in the molding performed at the second temperature are both the same time (about 120 seconds). On the other hand, in the present embodiment, the first molding jig 10 and the second molding jig 20 can not be caused to slide in linkage with each other. That is, the clamping time of the pre-molding and the clamping time of the molding can be set separately. For example, the respective clamping times (molding times) can be set independently according to any appropriate conditions for performing the pre-molding and the molding.

[0107] Further, in the pre-molding and molding of the flexible circuit board FPC in the present embodiment, the first molding jig 10 and the second molding jig 20 of the concave shape and the load jig 40 of the convex shape are fitted to each other. However, the structure described above is not essential to the pre-molding and molding of the flexible circuit board FPC in the present embodiment. For example, the pre-molding and molding of the flexible circuit board FPC can be performed using the first molding jig 10 and the second molding jig 20 of the convex shape and the load jig 40 of the concave shape. That is, the pre-molding and molding of the flexible circuit board FPC can be performed using the first molding jig 10, the second molding jig 20, and the load jig 40 of any appropriate shape.

[0108] Further, in the molding of the flexible circuit board FPC described above, the second molding jig 20 is heated using the heater 24. However, the present embodiment is not limited thereto, and the load jig 40 can also be heated at the time of molding. That is, the load jig 40 can be provided with a heater, and the load jig 40 can be heated at the time of molding of the flexible circuit board FPC.

[0109] Further, in the FPC molding apparatus 1 and the molding method of the present embodiment described above, the same carrier jig 40 is used. That is, the flexible circuit board FPC is carried in a state of being carried by the same carrier jig 40, and the carrier jig 40 is moved to positions corresponding to the first molding jig 10 and the second molding jig 20 in the positive direction of the Y axis by the rail 60. Then, at the respective positions, the flexible circuit board is clamped by the first molding jig 10 and the carrier jig 40, or by the second molding jig 20 and the carrier jig 40. Thus, the pre-molding and the molding are performed.

[0110] The present embodiment is not limited thereto, and can be realized even if different carrier jigs are used. That is, it can also be a pair of carrier jigs including a first carrier jig and a second carrier jig different from each other, which are respectively fixed at positions corresponding to the first molding jig 10 and the second molding jig 20. In this case, after the pre-molding is performed by clamping the flexible circuit board FPC by the first carrier jig and the first molding jig 10, the flexible circuit board FPC subjected to the pre-molding is detached from the first carrier jig. Then, the flexible circuit board FPC detached from the first carrier jig is carried by the second carrier jig. Then, the flexible circuit board FPC is clamped by the second carrier jig and the second molding jig 20 to perform the molding. The pre-molding and the molding of the flexible circuit board FPC can also be realized in this way.

[0111] (Second Embodiment)

[0112] Next, the second embodiment of the present application will be described. In the first embodiment described above, in the molding of the flexible circuit board FPC, the pre-molding is performed at a temperature at which the flexible circuit board FPC does not plastically deform, and the molding is performed at a temperature at which the flexible circuit board FPC plastically deforms. In the second embodiment, the pre-molding is not performed, and the post-molding is performed while cooling the flexible circuit board FPC after the molding is performed at a temperature at which the flexible circuit board FPC plastically deforms. Hereinafter, the description will be made focusing on the parts different from the first embodiment.

[0113] Figure 14 is a configuration view of the molding apparatus (FPC molding apparatus) 1A of the flexible circuit board of the present embodiment as a whole. In Figure 14 In the first embodiment, the same reference numerals are attached to the same configuration elements.

[0114] The FPC molding apparatus 1A of the present embodiment is provided with a first molding jig 20, a second molding jig 30, a carrier jig 40, a housing 50, and a rail 60.

[0115] The first molding jig 20 is the same as the second molding jig 20 in the first embodiment. That is, the first molding jig 20 of the present embodiment is as described in the first embodiment with reference to Figure 3As described, it includes a support 21, a forming block 22, a thermocouple 23, and a heater 24. Furthermore, the first forming jig 20 and the carrier jig 40 together hold the flexible circuit board FPC and form the flexible circuit board FPC.

[0116] Figure 15 From Figure 14 The second forming fixture 30 is viewed from the side along the positive Y-axis. The second forming fixture 30 includes a support portion 31 movable along the Z-axis, a forming block 32 connected to the lower end of the support portion 31, and a thermocouple 33 fixed to the forming block 32. Furthermore, the second forming fixture 30 includes: a cooling portion 34 for cooling the flexible circuit board (FPC) heated by the first forming fixture 20; an inlet pipe 35 for the inflow of cooling medium; and an outlet pipe 36 for the outflow of cooling medium. This second forming fixture 30, together with the carrier fixture 40, clamps the flexible circuit board (FPC) for post-forming.

[0117] The cooling section 34 of the second forming fixture 30 can be, for example, a water-cooled or air-cooled cooling section. Therefore, water or air, as the cooling medium, flows through the aforementioned inlet pipe 35 and outlet pipe 36. However, it is not limited to water-cooled or air-cooled cooling sections; a Peltier element can also be used as the cooling section 34. In this case, the inlet pipe 35 and outlet pipe 36 are not required.

[0118] The above describes the configuration of the FPC molding apparatus 1A according to this embodiment. Next, referring to... Figures 16-19 The forming method of the flexible circuit board according to this embodiment will be described.

[0119] <Forming Method of Flexible Printed Circuit Board (FPC)>

[0120] Next, the forming method of flexible circuit board FPC using the FPC forming apparatus 1A described above will be explained. Figure 16 This is a flowchart illustrating a series of processes in the forming method of the flexible printed circuit board (FPC) according to the second embodiment.

[0121] In the forming method of the flexible printed circuit board (FPC) of this embodiment, firstly, the flexible printed circuit board (FPC) is fixed to the support fixture 40 (step S200). This step is the same as step S100 of the first embodiment. That is, with Figure 6 and Figure 7 Similarly, the flexible circuit board (FPC) is fixed to an inclined surface of the support fixture 40.

[0122] Next, the carrier jig 40 carrying the flexible circuit board FPC is moved to a position corresponding to the first molding jig 20 (in this embodiment, a position directly below the first molding jig 20) by the rail 60. Then, the flexible circuit board FPC carried by the carrier jig 40 is clamped by the carrier jig 40 and the first molding jig 20, and molded at a first temperature (step S202).

[0123] In this embodiment, the first temperature is a temperature at which the flexible circuit board FPC is plastically deformed to a certain extent, and is a temperature at which the adhesive layer bonding the insulating layers to each other is not dissolved from the insulating layers to a certain extent. It is preferable that the first temperature be, for example, about 120°C to about 200°C. Further, it is preferable that the clamping time of the flexible circuit board FPC at the first temperature be, for example, about 120 seconds.

[0124] Further, the operation of the first molding jig 20 in this step S202 is the same as the operation described in the first embodiment. Figures 8-10

[0125] Next, the flexible circuit board FPC molded in step S202 is moved to a position corresponding to the second molding jig 30 (in this embodiment, a position directly below the second molding jig 30) by the rail 60, together with the carrier jig 40. Then, the flexible circuit board FPC carried by the carrier jig 40 is clamped by the carrier jig 40 and the second molding jig 30, and post-molded at a second temperature (step S204).

[0126] In this embodiment, the second temperature is a temperature lower than the first temperature. That is, the second temperature is a temperature at which the plastically deformed flexible circuit board FPC described above is cooled to a certain extent. It is preferable that the second temperature be, for example, about 20°C to about 50°C. Further, it is preferable that the clamping time of the flexible circuit board FPC at the second temperature be, for example, about 120 seconds.

[0127] There is a case where the flexible circuit board FPC contains a copper foil layer in addition to the insulating layers and the adhesive layer. There is a case where, in the case where the flexible circuit board FPC is cooled from the first temperature to the second temperature, springback occurs in the insulating layer due to the rigidity of the copper foil layer.

[0128] Therefore, in order to suppress springback in the copper foil layer of the flexible circuit board FPC, in this embodiment, the flexible circuit board FPC is clamped by the carrier jig 40 and the second molding jig 30 in the case where the flexible circuit board FPC is cooled from the first temperature to the second temperature. That is, the post-molding described above is processing for suppressing springback of the insulating layer by cooling the flexible circuit board FPC to the second temperature.

[0129] Here, reference is made to Figures 17-19 ​The post-shaping of step S204 is described in detail. As shown in Figures 17-19 The second shaping jig 30 is driven by a driving unit (not shown) to slide in the Z-axis direction. Further, the shaping block 32 is cooled by the cooling unit 34 to the second temperature described above.

[0130] Figure 17 A state in which the carrying jig 40 carrying the flexible circuit board FPC is positioned directly below the second shaping jig 30 is shown. Further, Figure 17 A state before the flexible circuit board FPC is clamped by the carrying jig 40 and the second shaping jig 30 is shown. In addition, the flexible circuit board FPC is in a state of having been bent in step S202.

[0131] In Figure 18 the state (clamped state), the second shaping jig 30 is moved in the negative direction of the Z-axis from Figure 17 the state to clamp the flexible circuit board FPC by the carrying jig 40 and the second shaping jig 30. The gap between the carrying jig 40 and the second shaping jig 30 in this clamped state is controlled to a value set in advance. It is preferable that this gap be set to, for example, the same degree as the thickness of the flexible circuit board FPC. Thus, the flexible circuit board FPC can be prevented from being pressed excessively.

[0132] In addition, in Figure 18 , the shaping block 32 and the carrying jig 40 clamp the flexible circuit board FPC in such a manner that the bent processing portion (recessed portion) E4 of the shaping block 32 and the bent processing portion (protruded portion) E2 of the carrying jig 40 are fitted to each other. Thus, the flexible circuit board FPC is bent at the bending angle θ in the bent processing portions E4, E2. By freely setting the bending angle θ, the flexible circuit board FPC can be bent at an arbitrary angle. In addition, it is preferable that the shape of the bent processing portion E3 of the first shaping jig 20 and the shape of the bent processing portion E4 of the second shaping jig 30 be the same as each other.

[0133] In Figure 19 the state, the second shaping jig 30 is moved in the positive direction of the Z-axis from Figure 18 the state to maintain the bent state of the flexible circuit board FPC. By completing this step S204, the shaping of the flexible circuit board of the present embodiment is ended.

[0134] The forming method of the flexible circuit board in the above-described embodiment includes a first process (step S202) of clamping the flexible circuit board FPC carried on the carrying clamp 40 with the carrying clamp 40 and the first forming clamp 20, and forming the flexible circuit board FPC at a first temperature at which the flexible circuit board FPC is plastically deformed, and a second process (step S204) of clamping the formed flexible circuit board FPC carried on the carrying clamp 40 with the carrying clamp 40 and the second forming clamp 30, and post-forming the flexible circuit board FPC at a second temperature lower than the first temperature.

[0135] According to the second embodiment, after the forming at the first temperature at which the flexible circuit board FPC is plastically deformed, the post-forming is performed at the second temperature at which the flexible circuit board FPC is cooled. Thus, it is possible to suppress the occurrence of springback in the insulating layer due to the rigidity of the copper foil layer of the flexible circuit board FPC.

[0136] Further, according to the second embodiment, like the first embodiment, the forming block 22 of the first forming clamp 20 is preheated. Thus, it is possible to perform the forming at which the flexible circuit board FPC is plastically deformed immediately after the flexible circuit board FPC is clamped. Thus, it is possible to shorten the time required for the forming of the flexible circuit board FPC.

[0137] Further, the forming block 32 of the second forming clamp 30 is pre-cooled. Thus, it is possible to perform the post-forming of the flexible circuit board FPC immediately after the flexible circuit board FPC is clamped. Thus, it is possible to shorten the time required for the post-forming of the flexible circuit board FPC.

[0138] Further, like the first embodiment, the forming and the post-forming in the present embodiment are not limited to the direction perpendicular to the rails 60, but can be performed in the direction parallel to the rails 60. In this case, the first forming clamp 20 and the second forming clamp 30 can be configured to slide in the X-axis direction or the Y-axis direction. Further, in the present embodiment, the time (clamping time) of the forming performed at the first temperature and the time (clamping time) of the post-forming performed at the second temperature are each about 120 seconds. On the other hand, the clamping time of the forming and the clamping time of the post-forming can each be independently set. For example, the respective forming times can be independently set according to any appropriate conditions for performing the forming and the post-forming. Further, the first forming clamp 20 and the second forming clamp 30 can be caused to slide independently of each other in accordance with the set times.

[0139] Further, in the above-described forming of the flexible circuit board FPC, the first forming clamp 20 is heated with the heater 24. However, this is not limiting, and the carrying clamp 40 can also be heated at the time of forming. That is, the carrying clamp 40 can be provided with a heater, and the carrying clamp 40 can be heated at the time of forming the flexible circuit board FPC.

[0140] In addition, in the FPC molding apparatus 1A and the molding method of the present embodiment described above, the same carrier jig 40 is used. However, the present embodiment is not limited to this, and can be implemented even if different carrier jigs 40 are used. That is, it can also be configured so that a pair of carrier jigs including first and second carrier jigs different from each other are fixed at positions corresponding to the first and second molding jigs 20 and 30, respectively.

[0141] In this case, as in the first embodiment, after the flexible circuit board FPC is molded while being gripped by the first carrier jig and the first molding jig 20, the molded flexible circuit board FPC is detached from the first carrier jig. Then, the flexible circuit board FPC detached from the first carrier jig is carried by the second carrier jig. Then, the flexible circuit board FPC is post-molded while being gripped by the second carrier jig and the second molding jig 30. The molding and post-molding of the flexible circuit board FPC can be implemented as such.

[0142] (Third Embodiment)

[0143] Next, the third embodiment of the present application will be described. In the first embodiment described above, in the molding of the flexible circuit board FPC, after the pre-molding is implemented at a temperature at which the flexible circuit board FPC does not undergo plastic deformation, the molding is implemented at a temperature at which the flexible circuit board FPC undergoes plastic deformation. In the third embodiment, after the pre-molding is implemented at a temperature at which the flexible circuit board FPC does not undergo plastic deformation, the molding is implemented at a temperature at which the flexible circuit board FPC undergoes plastic deformation, and then, the post-molding is implemented while cooling the flexible circuit board FPC. Hereinafter, the description will be made focusing on the parts different from the first embodiment.

[0144] Figure 20 is a configuration view of the molding apparatus (FPC molding apparatus) 1B of the flexible circuit board of the present embodiment as a whole. In Figure 20 the same components as those of the first embodiment are denoted by the same reference numerals.

[0145] The FPC molding apparatus 1B of the present embodiment is provided with a first molding jig 10, a second molding jig 20, a third molding jig 30, a carrier jig 40, a housing 50, and a rail 60.

[0146] The first molding jig 10 is the same as the first molding jig 10 in the first embodiment. That is, the first molding jig 10 of the present embodiment is provided with a support portion 11, a molding block 12, and a thermocouple 13, as described with reference to Figure 2 the first embodiment. Furthermore, the first molding jig 10 and the carrier jig 40 jointly grip the flexible circuit board FPC, and pre-mold the flexible circuit board FPC.

[0147] The second molding jig 20 is the same as the second molding jig 20 in the first embodiment. That is, the second molding jig 20 of the present embodiment has the support portion 21, the molding block 22, the thermocouple 23, and the heater 24 as described with reference to the first embodiment. Further, the second molding jig 20 coholds the flexible circuit board FPC in cooperation with the carrier jig 40, and performs molding on the flexible circuit board FPC. Figure 3

[0148] The third molding jig 30 is the same as the second molding jig 30 in the second embodiment. That is, the third molding jig 30 of the present embodiment has the support portion 31, the molding block 32, the thermocouple 33, the cooling portion 34, the inflow pipe 35, and the outflow pipe 36 as described with reference to the second embodiment. Further, the third molding jig 30 coholds the flexible circuit board FPC in cooperation with the carrier jig 40, and performs post-molding on the flexible circuit board FPC. Figure 15

[0149] The above is the configuration of the FPC molding apparatus IB of the present embodiment. Next, the molding method of the flexible circuit board of the present embodiment will be described with reference to Figure 21

[0150] <Molding method of flexible circuit board FPC>

[0151] Next, the molding method of the flexible circuit board FPC using the above-described FPC molding apparatus IB will be described. Figure 21 is a flowchart showing a series of flows of the molding method of the flexible circuit board FPC of the third embodiment.

[0152] In the molding method of the flexible circuit board FPC of the present embodiment, first, the flexible circuit board FPC is fixed to the carrier jig 40 (step S300). This step is the same as step S100 of the first embodiment. That is, the flexible circuit board FPC is fixed to one inclined surface of the carrier jig 40 as in Figure 6 and Figure 7

[0153] Next, the carrier jig 40 on which the flexible circuit board FPC is carried is moved to a position corresponding to the first molding jig 10 (in the present embodiment, a position directly below the first molding jig 10) by the rail 60. Then, the flexible circuit board FPC carried on the carrier jig 40 is coheld by the carrier jig 40 and the first molding jig 10, and is pre-molded at the first temperature (step S302).

[0154] ​​​​In the present embodiment, the first temperature is a temperature at which the flexible circuit board FPC does not undergo plastic deformation. It is preferable that the first temperature be, for example, from about 20°C to about 30°C. Further, it is preferable that the clamping time of the flexible circuit board FPC at the first temperature be, for example, about 120 seconds. The operation of the first forming jig 10 in the pre-forming of this step S302 is the same as that described using Figures 8-10 the same as that described using

[0155] Next, the carrying jig 40 carrying the flexible circuit board FPC subjected to the pre-forming is moved to a position corresponding to the second forming jig 20 (in the present embodiment, a position directly below the second forming jig 20) using the rails 60. Then, the flexible circuit board FPC subjected to the pre-forming carried by the carrying jig 40 is clamped by the carrying jig 40 and the second forming jig 20, and is subjected to forming at a second temperature (step S304).

[0156] In the present embodiment, the second temperature is a temperature higher than the first temperature described above. In detail, the second temperature is a temperature at which the flexible circuit board FPC undergoes plastic deformation, and is a temperature at which the adhesive layer bonding the insulating layers to each other does not dissolve from the insulating layers. It is preferable that the second temperature be, for example, from about 120°C to about 200°C. Further, it is preferable that the clamping time of the flexible circuit board FPC at the second temperature be, for example, about 120 seconds. The operation of the second forming jig 20 in this step S304 is the same as that described using Figures 11-13 the same as that described using

[0157] Next, the carrying jig 40 carrying the flexible circuit board FPC subjected to the forming is moved to a position corresponding to the third forming jig 30 (in the present embodiment, a position directly below the third forming jig 30) using the rails 60. Then, the flexible circuit board FPC subjected to the forming carried by the carrying jig 40 is clamped by the carrying jig 40 and the third forming jig 30, and is subjected to post-forming at a third temperature (step S306).

[0158] In the present embodiment, the third temperature is a temperature at which the flexible circuit board FPC subjected to the plastic deformation described above is cooled. In more detail, the third temperature is a temperature lower than the second temperature and at which the flexible circuit board FPC does not undergo plastic deformation. It is preferable that the third temperature be, for example, from about 20°C to about 50°C. Further, it is preferable that the clamping time of the flexible circuit board FPC at the third temperature be, for example, about 120 seconds. Further, the operation of the third forming jig 30 in this step S306 is the same as that described using Figures 17-19 the same as that described using. By completing this step S306, the forming of the flexible circuit board in the present embodiment is completed.

[0159] The forming method of the flexible circuit board in the above-described embodiment includes: a first process (step S302) of pre-forming the flexible circuit board FPC at a first temperature using the carrier jig 40 and the first forming jig 10 to hold the flexible circuit board FPC carried on the carrier jig 40; a second process (step S304) of forming the pre-formed flexible circuit board FPC at a second temperature higher than the first temperature at which the flexible circuit board FPC plastically deforms using the carrier jig 40 and the second forming jig 20 to hold the flexible circuit board FPC carried on the carrier jig 40; and a third process (step S306) of post-forming the formed flexible circuit board FPC at a third temperature lower than the second temperature using the carrier jig 40 and the third forming jig 30 having the cooling portion 34 to hold the flexible circuit board FPC carried on the carrier jig 40.

[0160] Thus, in the third embodiment, after the pre-forming at the first temperature at which the flexible circuit board FPC does not plastically deform, the forming is performed at the second temperature at which the flexible circuit board FPC plastically deforms. Then, the post-forming is performed at the third temperature while the flexible circuit board FPC is held and cooled.

[0161] Thus, according to the third embodiment, as in the first embodiment, the bending stress acting on the flexible circuit board FPC can be moderated. Therefore, even in the case where the flexible circuit board FPC having a thick board thickness is formed or in the case where the bending radius is small, the occurrence of internal damage and interlayer peeling can be suppressed. Also, as in the second embodiment, the occurrence of springback in the insulating layer due to the rigidity of the copper foil layer of the flexible circuit board FPC can be suppressed.

[0162] Further, according to the present embodiment, the forming block 22 of the second forming jig 20 is pre-heated. Therefore, the forming at which the flexible circuit board FPC plastically deforms can be performed immediately after the flexible circuit board FPC is held. Therefore, the time required for the forming of the flexible circuit board FPC can be shortened. In addition, according to the present embodiment, the forming block 32 of the third forming jig 30 is pre-cooled. Therefore, the post-forming of the flexible circuit board FPC can be performed immediately after the flexible circuit board FPC is held. Therefore, the time required for the post-forming of the flexible circuit board FPC can also be shortened.

[0163] In addition, as in the first embodiment, the forming and the post-forming in the present embodiment are not limited to the above-described direction perpendicular to the rail 60, but can be performed in the direction parallel to the rail 60. In this case, the first forming jig 10, the second forming jig 20, and the third forming jig 30 can also be configured to slide in the X-axis direction or the Y-axis direction.

[0164] In addition, in the molding of the flexible printed circuit board FPC described above, the second molding jig 20 is heated by the heater 24. However, this is not limiting, and the carrier jig 40 can also be heated at the time of molding. That is, the carrier jig 40 can also be provided with a heater, and the carrier jig 40 can be heated at the time of molding of the flexible printed circuit board FPC.

[0165] In addition, in the present embodiment, the clamping time of the pre-molding performed at the first temperature, the clamping time of the molding performed at the second temperature, and the clamping time of the post-molding performed at the third temperature are all the same time (about 120 seconds). On the other hand, the clamping time of the pre-molding, the clamping time of the molding, and the clamping time of the post-molding can each be independently set. For example, each of the clamping times can be independently set according to any appropriate conditions for performing the pre-molding, the molding, and the post-molding. Further, the first molding jig 10, the second molding jig 20, and the third molding jig 30 can be caused to independently slide from each other in accordance with the set times.

[0166] In addition, in the FPC molding apparatus IB and the molding method of the present embodiment described above, the same carrier jig 40 is used. However, the present embodiment is not limited to this, and the same can be achieved even if different carrier jigs 40 are used. That is, three carrier jigs including a first carrier jig, a second carrier jig, and a third carrier jig that are different from each other can be fixed to positions corresponding to the first molding jig 10, the second molding jig 20, and the third molding jig 30, respectively. In this case, after the pre-molding of the flexible printed circuit board FPC is performed by clamping the flexible printed circuit board FPC using the first carrier jig and the first molding jig 10, the flexible printed circuit board FPC subjected to the pre-molding is detached from the first carrier jig. Then, the flexible printed circuit board FPC subjected to the pre-molding is carried on the second carrier jig, and the molding is performed by clamping the flexible printed circuit board FPC using the second carrier jig and the second molding jig 20. Similarly, the flexible printed circuit board FPC subjected to the molding is detached from the second carrier jig and carried on the third carrier jig. Then, the post-molding is performed by clamping the flexible printed circuit board FPC subjected to the molding using the third carrier jig and the third molding jig 30. The pre-molding, the molding, and the post-molding of the flexible printed circuit board FPC can be achieved in this way.

[0167] (Restricting jig of carrier jig)

[0168] Reference Signs List Figures 22-24 The restricting jig 44 that can be applied to the first embodiment to the third embodiment described above will be described.

[0169] Figure 22is a configuration view of the restriction jig 44. The restriction jig 44 includes a restriction jig plate 44a and a restriction jig plate 44b. The restriction jig 44 is configured such that one end of the restriction jig plate 44a and one end of the restriction jig plate 44b are bonded to each other. The restriction jig plate 44a has a front surface 44aFl and a back surface 44aF2. Similarly, the restriction jig plate 44b also has a front surface 44bFl and a back surface 44bF2.

[0170] The restriction jig 44 is used in conjunction with the carrier jig 40. Also, the restriction jig 44 maintains the bent state of the flexible circuit board FPC carried by the carrier jig 40. In detail, the restriction jig 44 maintains the shape of the flexible circuit board FPC that is pre-formed by the first forming jig 10 and the carrier jig 40 and is in a bent state.

[0171] The restriction jig 44 has rigidity and heat resistance that can withstand forming by clamping. Therefore, like the carrier jig 40, the restriction jig 44 can also be composed of a high-temperature resistant resin such as poly ether ether ketone (PEEK: Poly Ether Ether Ketone), for example.

[0172] Figure 23 An example is shown in which the restriction jig 44 is used in order to maintain the bent state of the flexible circuit board FPC in the first embodiment to the third embodiment described above. In this example, the flexible circuit board FPC is clamped by two restriction jigs 44U, 44L.

[0173] As shown in Figure 23 , the restriction jig 44L is carried on the carrier jig 40. In detail, the restriction jig 44L is carried on the carrier jig 40 in such a manner that the inclined surface 40Fl of the carrier jig 40 opposes the back surface 44aF2 of the restriction jig plate 44a and the inclined surface 40F2 opposes the back surface 44bF2.

[0174] Also, the flexible circuit board FPC is fixed to the front surface 44aFl and the front surface 44bFl of the restriction jig 44L. Further, the restriction jig 44U is carried on the flexible circuit board FPC. In this way, the flexible circuit board FPC is clamped by the restriction jig 44L and the restriction jig 44U, and the bent shape of the flexible circuit board FPC is maintained.

[0175] As described above, the flexible circuit board FPC is carried on the carrier jig 40 in a manner clamped by the restriction jig 44U and the restriction jig 44L.

[0176] Figure 24 is a cross-sectional view as viewed from the positive direction of the Y axis. Figure 23 is a cross-sectional view as viewed from the positive direction of the Y axis. Figure 24As shown, the restriction jig 44L, the flexible circuit board FPC, and the restriction jig 44U are carried on the carrying jig 40 in a manner that the bent processed portion E2 of the carrying jig 40 and the bent processed portions E5 and E6 of the restriction jigs 44U and 44L are fitted to each other. Thus, the flexible circuit board FPC is bent at the bending angles Θ in the bent processed portions E2, E5, and E6. By freely setting the bending angles Θ, the flexible circuit board FPC can be bent at an arbitrary angle.

[0177] As described above, by applying the restriction jig 44 to the first to third embodiments, the bent state of the flexible circuit board FPC formed by the pre-forming can be securely maintained. Thus, the bending stress of the copper foil layer and the like can be mitigated, so that the internal damage of the flexible circuit board FPC and the breakage of the copper foil layer can be suppressed.

[0178] (Restriction jig stop portion in restriction jig)

[0179] Reference Figures 25-27 A restriction jig stop portion applicable to the above-described restriction jig 44 will be described. The restriction jig stop portion is a mechanism provided to enable the restriction jig 44 to more reliably restrict the flexible circuit board FPC.

[0180] Figure 25 The restriction jig 44 and the restriction jig stop pin 46 involved in the restriction jig stop portion are shown. In this example, the restriction jig stop portion has the restriction jig stop holes H1 to H4 provided to the restriction jig 44, and the restriction jig stop pin 46. Further, the restriction jig stop portion is realized by the restriction jig stop pin 46 being fixed to the carrying jig 40 by penetrating the restriction jig stop holes H1 to H4.

[0181] In addition, in Figure 25 , the restriction jig stop holes H1 to H4 provided to the restriction jig plate 44a are shown. Similarly, the restriction jig stop holes H1 to H4 can also be provided to the opposite restriction jig plate 44b. In addition, the restriction jig stop pin 46 can also be composed of a high-temperature resistant resin such as polyether ether ketone, like the restriction jig 44.

[0182] Figure 26 An example in which the above-described restriction jig stop portion is applied to the restriction jig 44 is shown. In Figure 26 , two restriction jigs 44U and 44L are employed to maintain the bent state of the flexible circuit board FPC, like Figure 23 . In addition, Figure 26 , the positional relationship of the restriction jig 44U and the restriction jig 44L, the flexible circuit board FPC, and the carrying jig 40 is the same as that shown in Figure 23 .

[0183] Figure 27 is a sectional view of the above-described Figure 26 from the Y-axis positive direction. As shown in this Figure 27 , the restriction jig stopper pin 46 penetrates the restriction jig 44U and the restriction jig 44L. Also, the restriction jig stopper pin 46 fixes the restriction jig 44 and the flexible circuit board FPC to the carrier jig 40.

[0184] Further, as shown in Figure 26 and Figure 27 , the restriction jig stopper pin 46 is provided to penetrate the restriction jig 44U and the restriction jig 44L. In detail, the positions of the restriction jig stopper hole H3U of the restriction jig 44U and the restriction jig stopper hole H1L of the restriction jig 44L are opposed to each other. Also, the restriction jig stopper pin 46a is provided to penetrate the above-described opposed pair of restriction jig stopper holes. Similarly, the positions of the restriction jig stopper hole H4U of the restriction jig 44U and the restriction jig stopper hole H2L of the restriction jig 44L are also opposed to each other. Also, the restriction jig stopper pin 46b is provided to penetrate the pair of restriction jig stopper holes.

[0185] The above-described example is an example in the case where the flexible circuit board FPC is fixed to each of the restriction jig plates 44a in the restriction jig 44U and the restriction jig 44L by the restriction jig stopper pin. The flexible circuit board FPC can also be fixed to the restriction jig plate 44b opposite to the restriction jig plate 44a in the same manner.

[0186] As described above, according to the restriction jig 44 to which the restriction jig stopper portion is applied, it is possible to firmly fix the restriction jig 44 and the flexible circuit board FPC to the carrier jig 40 by the restriction jig stopper pin 46. Therefore, the restriction jig 44 is more stably fixed to the carrier jig 40. Therefore, it is possible to maintain the bent state of the flexible circuit board FPC.

[0187] (Opening portion in restriction jig)

[0188] Referring to Figures 28-30 , the case where the above-described restriction jig 44 further has an opening portion Al will be described.

[0189] Figure 28 The restriction jig 44 having the opening portion Al is shown. The opening portion Al is provided to abut the second shaping jig 20 and the third shaping jig 30 to the flexible circuit board FPC. That is, the opening portion Al is provided to directly contact the heated shaping block 22 and the cooled shaping block 32 to the flexible circuit board FPC. Thereby, it is possible to more directly conduct the temperature of each shaping block to the flexible circuit board FPC. As a result, it is possible to shorten the processing time (shaping time) of each process.

[0190] The opening portion A1 has a size in which the molding blocks can abut against the flexible circuit board FPC. In other words, Figure 28 The opening portion A1 illustrated has a horizontal width in the Y-axis direction and a vertical width in the Z-axis direction that have sizes in which the horizontal width in the Y-axis direction and the vertical width in the Z-axis direction of the molding blocks 22 and 32 are included.

[0191] Figure 29 An example in which the restriction jig 44 having the opening portion A1 is applied in the first embodiment to the third embodiment described above is shown. The restriction jig 44U located at the upper portion of the flexible circuit board FPC has the opening portion A1. On the other hand, the restriction jig 44L located at the lower portion of the flexible circuit board FPC does not have the opening portion A1. The positional relationship of the restriction jig 44U and the restriction jig 44L, the flexible circuit board FPC, and the carrier jig 40 is the same as that illustrated in Figure 23 .

[0192] As shown in Figure 29 , since the restriction jig 44U has the opening portion A1, the bent portion of the flexible circuit board FPC is exposed. Thus, the molding blocks 22 and 32 can abut against the flexible circuit board FPC.

[0193] Figure 30 is a cross-sectional view as viewed from the positive direction of the Y-axis. Figure 29 As shown in this Figure 30 , the restriction jig 44U has the opening portion A1, and the flexible circuit board FPC is sandwiched by the restriction jig 44U and the restriction jig 44L. Thus, the restriction jig 44U can maintain the bent state of the flexible circuit board FPC. That is, the flexible circuit board FPC can be fixed by the portions of the restriction jig 44 other than the opening portion A1. Thus, the restriction jig 44U, like the restriction jig 44 that does not have the opening portion A1, can maintain the bent state of the flexible circuit board FPC.

[0194] Thus, according to the restriction jig 44 having the opening portion A1, the second molding jig 20 and the third molding jig 30 abut against the flexible circuit board FPC. Thus, the temperature of the molding blocks 22 and 32 can be directly conducted to the flexible circuit board FPC. Thus, the flexible circuit board FPC can be more effectively heated and cooled.

[0195] In addition, the restriction jig 44 having the opening portion A1 can also have the restriction jig stop portion described above. Thus, the restriction jig 44 can effectively heat and cool the flexible circuit board FPC, and can maintain the bent state of the flexible circuit board FPC by more stably fixing the flexible circuit board FPC to the carrier jig 40.

[0196] (Embodiment)

[0197] ReferringFigures 31-33 An example of actually forming the flexible circuit board FPC using the third embodiment described above will be described.

[0198] Figure 31 The configuration of the flexible circuit board FPC applied to the present example is shown. In the flexible circuit board FPC, the liquid crystal polymer LCP1 provided with the copper foil layer CF1 on one surface is adhered to the liquid crystal polymer LCP2 provided with the copper foil layer CF2 and the copper foil layer CF3 on both surfaces by the adhesive layer Ad. The upper surface of the copper foil layer CF1 is covered with the cover film Fl. The lower surface of the copper foil layer CF2 is covered with the cover film F2.

[0199] Figure 32 is an image of the flexible circuit board FPC after being formed using the third embodiment. The bending angle of the flexible circuit board FPC shown in the image is about 51°. In addition, the bending radius is about 0.64 mm. Furthermore, the board thickness is about 0.32 mm. As shown in the image, even under the bending conditions described above, no interlayer peeling occurs between the liquid crystal polymer LCP1 and the liquid crystal polymer LCP2.

[0200] Figure 33 is a graph showing the passage of the bending angle of the flexible circuit board FPC of Figure 32 In Figure 33 , the horizontal axis shows the number of days elapsed, and the vertical axis shows the bending angle. As Figure 33 shown, even after 30 days have elapsed from the date on which the flexible circuit board FPC was formed, the bending angle of the flexible circuit board FPC is maintained at about 51°. That is, even after 30 days have elapsed after being formed, no springback occurs in the flexible circuit board FPC.

[0201] As described above, according to the present example, using the forming method of the flexible circuit board of the third embodiment, it is confirmed that the flexible circuit board FPC can be formed in a manner that inhibits the occurrence of internal collapse and interlayer peeling, and no springback occurs.

[0202] From the above description, those skilled in the art will be able to conceive additional effects and various modifications of the present application. The modes of the present application are not limited to the respective embodiments described above. The constituent elements involved in different embodiments can be appropriately combined. Various additions, changes, and partial deletions can be made within the scope of the subject matter and the gist of the present application derived from the content defined by the claims and equivalents thereof, without departing from the subject matter and the gist of the present application.

[0203] Explanation of Reference Numerals

[0204] 1, 1A, 1B forming apparatus of a flexible circuit board

[0205] 10, 20, 30 forming jig

[0206] 11, 21, 31 support portion

[0207] 12, 22, 32 shaped block

[0208] 13, 23, 33 thermocouple

[0209] 24 heater

[0210] 34 cooling portion

[0211] 35 inflow pipe

[0212] 36 outflow pipe

[0213] 40 carrier clamp

[0214] 40F1, 40F2 inclined surface

[0215] 42a, 42b, 42c fixed guide pin

[0216] 44 restriction clamp

[0217] 44a, 44b restriction clamp plate

[0218] 44aF1, 44bF1 surface

[0219] 44aF2, 44bF2 back surface

[0220] 46, 46a, 46b, 46c restriction clamp stop pin

[0221] 50 case

[0222] 60 rail

[0223] FPC flexible circuit board

[0224] P1, P2, P3 fixed point of flexible circuit board

[0225] E1, E2, E3, E4, E5, E6 bending processing portion

[0226] H1, H2, H3, H4 restriction clamp stop hole

[0227] A1 opening portion

[0228] LCP1, LCP2 liquid crystal polymer

[0229] CF1, CF2, CF3 copper foil layer

[0230] F1, F2 cover film

[0231] Ad adhesive layer

[0232] θ bending angle

Claims

1. A forming apparatus of a flexible circuit board that forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin, which are laminated to each other, the forming apparatus of a flexible circuit board comprising: a first forming jig that coholds a flexible circuit board carried on a first carrying jig to perform a pre-forming on the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; and a second forming jig that coholds the flexible circuit board, on which the pre-forming has been performed and which is carried on a second carrying jig, to perform a forming on the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board plastically deforms. The second forming jig is warmed up to the second temperature before the forming is performed.

3. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein the first temperature is 20°C to 30°C, and the second temperature is 120°C to 200°C.

4. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein the second forming jig includes: a forming block that coholds the flexible circuit board with the second carrying jig; a support portion that supports the forming block; a thermocouple that measures a temperature of the flexible circuit board coheld by the second carrying jig and the forming block; and a heater that heats the forming block. The second carrying jig includes a heater.

2. The flexible circuit board forming apparatus according to claim 1, wherein A restriction jig that maintains a bent state of the flexible circuit board carried on the second carrying jig is further included. A restriction jig stopper that fixes the restriction jig that maintains the bent state of the flexible circuit board carried on the second carrying jig to the second carrying jig is further included. The restriction jig further includes an opening portion for abutting the second forming jig to the flexible circuit board. The first carrying jig and the second carrying jig are different carrying jigs, respectively. The first carrying jig and the second carrying jig are the same carrying jig. The thermoplastic resin contains a liquid crystal polymer. The plurality of insulating layers of the flexible circuit board are laminated to each other by means of an adhesive layer.

13. A forming apparatus of a flexible circuit board that forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin, which are laminated to each other, the forming apparatus of a flexible circuit board comprising: a first forming jig that coholds a flexible circuit board carried on a first carrying jig to perform a forming on the flexible circuit board at a first temperature at which the flexible circuit board plastically deforms; and a second forming jig that coholds the flexible circuit board, on which the forming has been performed and which is carried on a second carrying jig, to perform a post-forming on the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board does not plastically deform.

14. The forming apparatus of a flexible circuit board according to claim 13, wherein the first forming jig is warmed up to the first temperature before the forming is performed. ​ 5. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ 6. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ 7. The forming apparatus of a flexible circuit board according to claim 6, wherein ​ 8. The forming apparatus for a flexible circuit board according to claim 6, wherein ​ 9. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ 10. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ 11. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ 12. The forming apparatus of a flexible circuit board according to claim 1 or 2, wherein ​ ​ ​ ​ ​ ​ ​ ​ The second forming jig is cooled to the second temperature before the post-forming is performed.

15. The forming apparatus for a flexible circuit board according to claim 13 or 14, wherein the first temperature is 120°C to 200°C, the second temperature is 20°C to 50°C.

16. The forming apparatus of a flexible circuit board according to claim 13 or 14, wherein The plurality of insulating layers of the flexible circuit board are stacked on each other with an adhesive layer.

17. A forming apparatus for a flexible circuit board, the flexible circuit board including a plurality of insulating layers containing a thermoplastic resin stacked on each other, the forming apparatus for a flexible circuit board includes: a first forming jig that, in cooperation with a first carrying jig, holds a flexible circuit board carried by the first carrying jig to pre-form the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; a second forming jig that, in cooperation with a second carrying jig, holds the flexible circuit board, on which the pre-forming has been performed and which is carried by the second carrying jig, to form the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board plastically deforms; and a third forming jig that, in cooperation with a third carrying jig, holds the flexible circuit board, on which the forming has been performed and which is carried by the third carrying jig, to post-form the flexible circuit board at a third temperature lower than the second temperature and at which the flexible circuit board does not plastically deform.

18. The forming apparatus for a flexible circuit board according to claim 17, wherein the second forming jig is warmed to the second temperature before the forming is performed, the third forming jig is cooled to the third temperature before the post-forming is performed.

19. The forming apparatus for a flexible circuit board according to claim 17 or 18, wherein the first temperature is 20°C to 30°C, the second temperature is 120°C to 200°C, the third temperature is 20°C to 50°C.

20. The forming apparatus of a flexible circuit board according to claim 17 or 18, wherein, At least one of the first carrying jig, the second carrying jig, and the third carrying jig is a carrying jig different from the other carrying jigs.

21. The forming apparatus for a flexible circuit board according to claim 17 or 18, wherein, The first carrying jig, the second carrying jig, and the third carrying jig are carrying jigs identical to each other.

22. The forming apparatus for a flexible circuit board according to claim 17 or 18, wherein The plurality of insulating layers of the flexible circuit board are stacked on each other with an adhesive layer.

23. A forming method for a flexible circuit board, the flexible circuit board including a plurality of insulating layers containing a thermoplastic resin stacked on each other, the forming method for a flexible circuit board includes: a first step of holding a flexible circuit board carried by a first carrying jig with a first carrying jig and a first forming jig to pre-form the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; and a second step of holding the flexible circuit board, on which the pre-forming has been performed and which is carried by a second carrying jig, with the second carrying jig and a second forming jig to form the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board plastically deforms.

24. A forming method of a flexible circuit board, the forming method of a flexible circuit board forming a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated to each other, the forming method of a flexible circuit board including: a first step of clamping the flexible circuit board carried on a first carrying jig with a first carrying jig and a first forming jig, and forming the flexible circuit board at a first temperature at which the flexible circuit board plastically deforms; and a second step of clamping the flexible circuit board on which the forming has been performed and carried on a second carrying jig with a second carrying jig and a second forming jig, and performing post-forming of the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board does not plastically deform.

25. A forming method of a flexible circuit board, the forming method of a flexible circuit board forming a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated to each other, the forming method of a flexible circuit board including: a first step of clamping the flexible circuit board carried on a first carrying jig with a first carrying jig and a first forming jig, and performing pre-forming of the flexible circuit board at a first temperature at which the flexible circuit board does not plastically deform; a second step of clamping the flexible circuit board on which the pre-forming has been performed and carried on a second carrying jig with a second carrying jig and a second forming jig, and forming the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board plastically deforms; and a third step of clamping the flexible circuit board on which the forming has been performed and carried on a third carrying jig with a third carrying jig and a third forming jig, and performing post-forming of the flexible circuit board at a third temperature lower than the second temperature and at which the flexible circuit board does not plastically deform.

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