Silicon wafer wax sticking device and method

Abstract

The present invention discloses a silicon wafer wax sticking device and method, aiming to solve the problem of inconvenient operation of silicon wafer wax sticking. The invention includes a frame, a heating table, a conveying plate, and a cooling tray. The conveying plate is placed under the heating table, and the conveying plate can be movably arranged. The cooling tray and the heating table are staggered horizontally. A lifting platform is installed under the heating table, and a plurality of top blocks are arranged on the lifting platform. Avoidance grooves are correspondingly arranged on the conveying plate and the top blocks, and the top blocks can pass through the avoidance grooves; a cooling fan is installed on the cooling tray; and the cooling tray can be lifted and installed on the frame. This silicon wafer wax sticking device facilitates the heating operation of the quartz ingot disc, and the heated quartz ingot disc is easy to take and operate. The heating and cooling of the quartz ingot disc are realized on the same device, which is more convenient to operate and can speed up the cooling speed.

Description

Technical Field

[0001] The invention relates to a silicon wafer processing technology, and more specifically, to a silicon wafer wax sticking device and method. Background Art

[0002] At present, silicon parts are highly consumable in the semiconductor field. The processing and manufacturing of silicon parts are different from the processing of conventional metal parts. Metal fixtures cannot be used. The usual practice is to stick the raw materials, usually sheets, to the quartz ingot disk through special wax, and then perform subsequent machine tool processing after cooling. During operation, the quartz ingot disk is first heated, and the heated quartz ingot disk is waxed and bonded to the silicon wafer. After bonding, it needs to be cooled. During cooling, in order to prevent the silicon material from cracking due to internal stress caused by rapid cooling, rapid cooling cannot be used. Natural cooling is generally used, but the natural cooling speed is too slow. The current conventional operation method is inconvenient for heating the quartz ingot disk, and it is inconvenient to take the quartz ingot disk after heating. The cooling speed of the silicon wafer is slow after it is bonded to the quartz ingot disk. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides a silicon wafer wax sticking device and method, which facilitates the heating operation of the quartz ingot disk, and the heated quartz ingot disk is easy to take out and operate. The heating and cooling of the quartz ingot disk are realized on the same device, which is more convenient to operate and can accelerate the cooling speed.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: a silicon wafer wax sticking device, including a frame, a heating table, a conveying plate, and a cooling tray. The conveying plate is placed under the heating table, the conveying plate can be movably arranged, the cooling tray and the heating table are laterally staggered, a lifting platform is installed under the heating table, a plurality of top blocks are arranged on the lifting platform, avoidance grooves are arranged on the conveying plate and the top blocks correspondingly, and the top blocks can pass through the avoidance grooves; a cooling fan is installed on the cooling tray; the cooling tray can be lifted and lowered on the frame.

[0005] During operation, the quartz ingot disc is loaded on the upper surface of the heating table and the conveying plate, and the conveying plate moves to the bottom of the heating table so that the avoidance groove and the top block are aligned. The lifting table rises upward, and the top block on the lifting table passes through the avoidance groove and presses on the quartz ingot disc, so that the quartz ingot disc fits the lower surface of the heating table. The heating table heats the quartz ingot disc at a constant temperature. After the quartz ingot disc under the heating table is heated, the lifting table moves downward to support the quartz ingot disc under the heating table on the conveying plate, pulls the conveying plate outward to the top of the cooling tray, and sticks the waxed silicon wafer to the quartz ingot disc; after the quartz ingot disc above the heating table is heated, the cooling tray moves upward to a position flush with the upper surface of the heating table, pushes the quartz ingot disc on the upper surface of the heating table onto the cooling tray, and sticks the waxed silicon wafer to the quartz ingot disc. After the silicon wafer is stuck to the quartz ingot disc, the cooling fan is driven to cool it down, and the quartz ingot disc is removed after the cooling is completed. The upper and lower surfaces of the heating table can heat the quartz ingot disc, and the cooling support plate can be raised and lowered to receive the quartz ingot disc heated by the heating table on the upper and lower surfaces, which is conducive to improving work efficiency. This silicon wafer wax sticking device facilitates the heating operation of the quartz ingot disc, and the heated quartz ingot disc is easy to take and operate. The heating and cooling of the quartz ingot disc are realized on the same device, which is more convenient to operate and can speed up the cooling speed.

[0006] Preferably, a slide rail and a lifting screw are installed on the frame, the cooling tray can be lifted and lowered on the slide rail, the lifting screw is adaptively connected to the cooling tray, and the lifting screw rotates to drive the cooling tray to move up and down.

[0007] The lifting screw rotates to drive the cooling support plate to move up and down along the slide rail, and the lifting process is smooth and reliable.

[0008] Preferably, slide grooves are provided on both sides of the conveying plate on the frame, the slide grooves extend to the cooling support plate, and pulleys are installed on the conveying plate and corresponding to the slide grooves, and the pulleys are installed in the slide grooves.

[0009] During the movement of the conveying plate, the pulley moves in the slide groove, which is beneficial to improving the stability of the movement of the conveying plate, preventing deviation, and ensuring that the avoidance groove and the top block can be aligned.

[0010] Preferably, mounting bars are provided on both sides of the heating platform on the frame, and the heating platform is installed between the two mounting bars.

[0011] The installation of the mounting strip facilitates the installation of the heating table.

[0012] Preferably, a guide groove is provided on the mounting strip, and a convex strip is provided on the edge of the heating platform, and the convex strip is adaptively connected to the guide groove.

[0013] The convex strips on the heating table are installed in the guide grooves on the mounting strips, which makes assembly convenient.

[0014] Preferably, a lifting piston cylinder is installed on the frame, and a telescopic rod of the lifting piston cylinder is connected to the lifting platform.

[0015] The lifting piston cylinder drives the lifting platform to move up and down smoothly and reliably.

[0016] Preferably, handles are provided on both sides of the conveying plate, which facilitate the push and pull operation of the conveying plate.

[0017] Preferably, a feeding table is installed on the frame away from the cooling tray side, and a stacking frame for stacking quartz ingots is installed on the feeding table; a pushing frame is installed above the heating table, and the pushing frame includes two oppositely arranged pushing bars, and pushing grooves are provided on the stacking frame and corresponding to the pushing bars, the pushing bars are movably connected to the pushing grooves, and a one-way push rod is hinged on the pushing bar; a one-way push bar is hinged on the conveying plate, and the transmission plate can pass through the bottom of the stacking frame; an upper heating-in-place bar and a lower heating-in-place bar are hinged on the heating table near the end of the stacking frame, and an upper cooling-in-place bar and a lower cooling-in-place bar are hinged on the heating table near the end of the cooling tray.

[0018] After the quartz ingot disk under the heating table is heated, the lifting platform moves downward and returns to its original position so that the quartz ingot disk under the heating table is supported on the conveying plate, and the conveying plate moves toward the stacking frame. At this time, the lower heating position bar abuts against the side wall of the quartz ingot disk under the heating table for positioning. After the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame, the one-way toggle bar abuts against the side wall of the quartz ingot disk, and the conveying plate moves toward the cooling support plate. The quartz ingot disk that has completed heating moves with the movement of the conveying plate to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the bottom of the heating table. After that, the conveying plate moves toward the stacking frame, and the lower cooling position bar abuts against the side wall of the quartz ingot disk, causing the quartz ingot disk to slide onto the cooling support plate, until the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk.

[0019] After the quartz ingot disk on the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, and the push frame moves toward the stacking frame. At this time, the upper heating position bar abuts against the side wall of the quartz ingot disk on the heating table for positioning. After the one-way lever on the push bar slides over the quartz ingot disk in the stacking frame, the push frame moves toward the cooling support plate. The quartz ingot disk that has completed heating on the heating table moves with the push frame to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the heating table. After that, the push frame moves toward the stacking frame, and the upper cooling position bar abuts against the side wall of the quartz ingot disk to position the quartz ingot disk, until the one-way lever on the push bar slides over the stacking frame to prepare for the pulling of the next quartz ingot disk. Finally, the waxed silicon wafer is glued to the quartz ingot disk. This structural setting facilitates the feeding of quartz ingot disks. While sending out the heated quartz ingot disk, a new quartz ingot disk is pushed from the stacking frame to the heating table position, which facilitates operation and helps to improve work efficiency.

[0020] A method for waxing a silicon wafer, using a silicon wafer waxing device to perform a waxing operation on the silicon wafer, comprising the following steps:

[0021] S1, loading the quartz ingot plate on the upper surface of the heating table and the conveying plate, and moving the conveying plate to the bottom of the heating table so that the avoidance groove and the top block are aligned;

[0022] S2, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate fits onto the lower surface of the heating platform;

[0023] S3, the heating stage heats the quartz ingot plate at a constant temperature;

[0024] S4, after the quartz ingot disk under the heating table is heated, the lifting table moves downward to make the quartz ingot disk under the heating table supported on the conveying plate, the conveying plate is pulled outward to the top of the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk; after the quartz ingot disk above the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, the quartz ingot disk on the upper surface of the heating table is pushed onto the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk;

[0025] S5, after the silicon wafer is stuck to the quartz ingot plate, a cooling fan is driven to cool it down, and after the cooling is completed, the quartz ingot plate is removed.

[0026] A method for waxing a silicon wafer, using a silicon wafer waxing device to perform a waxing operation on the silicon wafer, comprising the following steps:

[0027] S1, stacking the quartz ingot discs in a stacking frame;

[0028] S2, the conveying plate and the pushing frame move toward the stacking frame direction, the one-way toggle bar on the conveying plate is pressed backward by the quartz ingot disk, the one-way toggle bar slides over the quartz ingot disk and returns to its original position, the conveying plate moves in the opposite direction, the one-way toggle bar abuts against the side wall of the lowest quartz ingot disk, the quartz ingot disk is pulled toward the heating table, the quartz ingot disk abuts against the lower heating-in-place bar, the lower heating-in-place bar is pressed backward, and after the quartz ingot disk slides over the lower heating-in-place bar, the conveying plate stops, and the lower heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk; the one-way lever on the pushing frame is pressed backward by the quartz ingot disk, the one-way lever slides over the quartz ingot disk and returns to its original position, the pushing frame moves in the opposite direction, the one-way lever abuts against a side wall of a quartz ingot disk, the quartz ingot disk is pulled toward the heating table, and the quartz ingot disk is supported on the upper surface of the heating table, and when the quartz ingot disk slides over the upper heating-in-place bar, the pushing frame stops, and the upper heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk;

[0029] S3, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate on the conveying plate fits onto the lower surface of the heating platform;

[0030] S4, the heating stage heats the quartz ingot plate at a constant temperature;

[0031] S5, after the quartz ingot disk under the heating table is heated, the lifting platform moves downward and returns to its original position so that the quartz ingot disk under the heating table is supported on the conveying plate, and the conveying plate is moved toward the stacking frame. At this time, the lower heating position bar abuts against the side wall of the quartz ingot disk under the heating table for positioning. After the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame, the one-way toggle bar abuts against the side wall of the quartz ingot disk, and the conveying plate moves toward the cooling support plate. The quartz ingot disk that has completed heating moves with the conveying plate to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the bottom of the heating table. After that, the conveying plate moves toward the stacking frame, and the lower cooling position bar abuts against the side wall of the quartz ingot disk, so that the quartz ingot disk slides onto the cooling support plate, until the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk;

[0032] After the quartz ingot disk on the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, and the pushing frame moves toward the stacking frame. At this time, the upper heating position bar abuts against the side wall of the quartz ingot disk on the heating table for positioning. After the one-way lever on the pushing bar slides over the quartz ingot disk in the stacking frame, the pushing frame moves toward the cooling support plate, and the quartz ingot disk that has completed heating on the heating table moves to the top of the cooling support plate with the pushing frame. At the same time, a new quartz ingot disk is pushed from the stacking frame to the heating table, and then the pushing frame moves toward the stacking frame, and the upper cooling position bar abuts against the side wall of the quartz ingot disk to position the quartz ingot disk, until the one-way lever on the pushing bar slides over the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk;

[0033] S6, after the silicon wafer is stuck to the quartz ingot plate, the cooling fan is driven to cool it down, and the quartz ingot plate is removed after the cooling is completed.

[0034] Compared with the prior art, the present invention has the following beneficial effects: (1) The heating operation of the quartz ingot during the wax bonding process of the silicon wafer is convenient for taking out the heated quartz ingot, and the heating and cooling of the quartz ingot can be realized on the same device, which is more convenient to operate and can speed up the cooling speed; (2) The quartz ingot feeding operation is convenient, and the heated quartz ingot is fed out while the new quartz ingot is pushed from the stacking frame to the heating table position, which facilitates the operation and helps to improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic structural diagram of embodiment 1 of the present invention;

[0036] Figure 2 is an exploded view of embodiment 1 of the present invention;

[0037] Figure 3 is a schematic structural diagram of Embodiment 2 of the present invention;

[0038] Figure 4 is a schematic structural diagram of a transmission plate according to Embodiment 2 of the present invention;

[0039] Figure 5 is a schematic diagram of the connection structure of the push frame of Example 2 of the present invention;

[0040] Figure 6 is a cross-sectional view of a stacking frame according to Embodiment 2 of the present invention;

[0041] In the figure: 1. frame, 2. heating table, 3. conveyor plate, 4. cooling support plate, 5. lifting table, 6. top block, 7. avoidance groove, 8. cooling fan, 9. slide rail, 10. lifting screw, 11. slide groove, 12. pulley, 13. mounting strip, 14. guide groove, 15. convex strip, 16. lifting piston cylinder, 17. handle, 18. feeding table, 19. quartz ingot plate, 20. stacking frame, 21. pushing frame, 22. pushing strip, 23. handle, 24. pushing groove, 25. one-way lever, 26. one-way toggle strip, 27. upper heating in place strip, 28. lower heating in place strip, 29. upper cooling in place strip, 30. lower cooling in place strip, 31. beam, 32. transition plate. DETAILED DESCRIPTION

[0042] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0043] Embodiment 1: A silicon wafer wax sticking device (see attached Figure 1 , Attachment Figure 2 ), including a frame 1, a heating table 2, a conveying plate 3, and a cooling pallet 4. The conveying plate is placed under the heating table and can be moved. The cooling pallet and the heating table are staggered horizontally. A lifting platform 5 is installed under the heating table. A plurality of top blocks 6 are arranged on the lifting platform. Avoidance grooves 7 are arranged on the conveying plate and the top blocks respectively, and the top blocks can pass through the avoidance grooves. A cooling fan 8 is installed on the cooling pallet. The cooling pallet can be lifted and installed on the frame. The conveying plate is arranged between the heating table and the lifting platform. There are gaps between the conveying plate and the heating table and between the conveying plate and the lifting platform.

[0044] Slide rails 9 and lifting screws 10 are installed on the frame. The cooling tray can be lifted and lowered on the slide rails. The lifting screws are connected to the cooling tray. The lifting screws rotate to drive the cooling tray to lift and move. The lifting screws are connected to the output shaft of the motor. Slide grooves 11 are provided on both sides of the conveying plate on the frame. The slide grooves extend to the cooling tray. Pulleys 12 are installed on the conveying plate and the slide grooves correspondingly. The pulleys are installed in the slide grooves. Mounting strips 13 are provided on both sides of the heating table on the frame, and the heating table is installed between the two mounting strips. Guide grooves 14 are provided on the mounting strips, and convex strips 15 are provided on the edge of the heating table. The convex strips are connected to the guide grooves. A lifting piston cylinder 16 is installed on the frame, and the telescopic rod of the lifting piston cylinder is connected to the lifting table. Handles 17 are provided on both sides of the conveying plate.

[0045] A method for waxing a silicon wafer, using a silicon wafer waxing device to perform a waxing operation on the silicon wafer, comprising the following steps:

[0046] S1, loading the quartz ingot plate on the upper surface of the heating table and the conveying plate, and moving the conveying plate to the bottom of the heating table so that the avoidance groove and the top block are aligned;

[0047] S2, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate fits onto the lower surface of the heating platform;

[0048] S3, the heating stage heats the quartz ingot plate at a constant temperature;

[0049] S4, after the quartz ingot disk under the heating table is heated, the lifting table moves downward to make the quartz ingot disk under the heating table supported on the conveying plate, the conveying plate is pulled outward to the top of the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk; after the quartz ingot disk above the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, the quartz ingot disk on the upper surface of the heating table is pushed onto the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk;

[0050] S5, after the silicon wafer is stuck to the quartz ingot plate, a cooling fan is driven to cool it down, and after the cooling is completed, the quartz ingot plate is removed.

[0051] Embodiment 2: A silicon wafer wax sticking device (see attached Figure 3 To Attachment Figure 6 ), its structure is similar to that of Example 1, the main difference being that in this embodiment, a feeding table 18 is installed on the frame away from the cooling tray side, and a stacking frame 20 for stacking quartz ingot plates 19 is installed on the feeding table; a pushing frame 21 is installed above the heating table, and the pushing frame includes two oppositely arranged pushing bars 22, a handle 23 is connected between the two pushing bars, and a pushing groove 24 is provided on the stacking frame and corresponding to the pushing bar, the pushing bar is movably connected to the pushing groove, and a one-way shifting rod 25 is hinged on the pushing bar; a one-way shifting bar 26 is hinged on the conveying plate, and the transmission plate can pass through the bottom of the stacking frame; an upper heating-in-place bar 27 and a lower heating-in-place bar 28 are hinged on the heating table near the end of the stacking frame, and an upper cooling-in-place bar 29 and a lower cooling-in-place bar 30 are hinged on the heating table near the end of the cooling tray.

[0052] Crossbeams 31 are installed on both sides of the front and rear of the heating table. The upper heating bar and the upper cooling bar are installed on the two crossbeams. Positioning torsion springs are installed between the upper heating bar and the upper cooling bar and the two crossbeams. The positioning torsion springs make the upper heating bar and the upper cooling bar in a vertical state. The lower heating bar and the lower cooling bar are installed on the front and rear ends of the lower surface of the heating table, respectively. Positioning torsion springs are installed between the lower heating bar and the lower cooling bar and the heating table. The positioning torsion springs make the lower heating bar and the lower cooling bar in a vertical state. The upper heating bar, the lower heating bar, the upper cooling bar and the lower cooling bar can all rotate from the stacking frame to the cooling support plate, but cannot rotate in the opposite direction, thereby realizing the positioning of the quartz ingot disk.

[0053] A positioning torsion spring is installed between the one-way lever and the push bar to keep the one-way lever in a vertical state. The one-way lever can rotate from the stacking frame to the cooling support plate, but cannot rotate in the opposite direction.

[0054] A positioning torsion spring is installed between the one-way toggle bar and the conveying plate to keep the one-way toggle bar in a vertical state. The one-way toggle bar can rotate from the stacking frame to the cooling support plate, but cannot rotate in the opposite direction.

[0055] A transition plate 32 is connected between the heating table and the stacking frame. After the quartz ingots are stacked in the stacking frame, the lower end surface of a quartz ingot near the transition plate is flush with the upper surface of the transition plate. An inclined guide surface is provided on the upper surface of the transition plate near the edge of the stacking frame. The other structures are the same as those in Example 1.

[0056] A method for waxing a silicon wafer, using a silicon wafer waxing device to perform a waxing operation on the silicon wafer, comprising the following steps:

[0057] S1, stacking the quartz ingot discs in a stacking frame;

[0058] S2, the conveying plate and the pushing frame move toward the stacking frame direction, the one-way toggle bar on the conveying plate is pressed backward by the quartz ingot disk, the one-way toggle bar slides over the quartz ingot disk and returns to its original position, the conveying plate moves in the opposite direction, the one-way toggle bar abuts against the side wall of the lowest quartz ingot disk, the quartz ingot disk is pulled toward the heating table, the quartz ingot disk abuts against the lower heating-in-place bar, the lower heating-in-place bar is pressed backward, and after the quartz ingot disk slides over the lower heating-in-place bar, the conveying plate stops, and the lower heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk; the one-way lever on the pushing frame is pressed backward by the quartz ingot disk, the one-way lever slides over the quartz ingot disk and returns to its original position, the pushing frame moves in the opposite direction, the one-way lever abuts against a side wall of a quartz ingot disk, the quartz ingot disk is pulled toward the heating table, and the quartz ingot disk is supported on the upper surface of the heating table, and when the quartz ingot disk slides over the upper heating-in-place bar, the pushing frame stops, and the upper heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk;

[0059] S3, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate on the conveying plate fits onto the lower surface of the heating platform;

[0060] S4, the heating stage heats the quartz ingot plate at a constant temperature;

[0061] S5, after the quartz ingot disk under the heating table is heated, the lifting platform moves downward and returns to its original position so that the quartz ingot disk under the heating table is supported on the conveying plate, and the conveying plate is moved toward the stacking frame. At this time, the lower heating position bar abuts against the side wall of the quartz ingot disk under the heating table for positioning. After the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame, the one-way toggle bar abuts against the side wall of the quartz ingot disk, and the conveying plate moves toward the cooling support plate. The quartz ingot disk that has completed heating moves with the conveying plate to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the bottom of the heating table. After that, the conveying plate moves toward the stacking frame, and the lower cooling position bar abuts against the side wall of the quartz ingot disk, so that the quartz ingot disk slides onto the cooling support plate, until the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk;

[0062] After the quartz ingot disk on the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, and the pushing frame moves toward the stacking frame. At this time, the upper heating position bar abuts against the side wall of the quartz ingot disk on the heating table for positioning. After the one-way lever on the pushing bar slides over the quartz ingot disk in the stacking frame, the pushing frame moves toward the cooling support plate, and the quartz ingot disk that has completed heating on the heating table moves to the top of the cooling support plate with the pushing frame. At the same time, a new quartz ingot disk is pushed from the stacking frame to the heating table, and then the pushing frame moves toward the stacking frame, and the upper cooling position bar abuts against the side wall of the quartz ingot disk to position the quartz ingot disk, until the one-way lever on the pushing bar slides over the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk;

[0063] S6, after the silicon wafer is stuck to the quartz ingot plate, the cooling fan is driven to cool it down, and the quartz ingot plate is removed after the cooling is completed.

[0064] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. A method for waxing a silicon wafer, characterized in that: The following steps are involved: S1, loading the quartz ingot plate on the upper surface of the heating table and the conveying plate, and moving the conveying plate to the bottom of the heating table so that the avoidance groove and the top block are aligned; S2, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate fits onto the lower surface of the heating platform; S3, the heating stage heats the quartz ingot plate at a constant temperature; S4, after the quartz ingot disk under the heating table is heated, the lifting table moves downward to make the quartz ingot disk under the heating table supported on the conveying plate, the conveying plate is pulled outward to the top of the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk; after the quartz ingot disk above the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, the quartz ingot disk on the upper surface of the heating table is pushed onto the cooling support plate, and the wax-coated silicon wafer is glued to the quartz ingot disk; S5, after the silicon wafer is stuck to the quartz ingot plate, a cooling fan is driven to cool it down, and after the cooling is completed, the quartz ingot plate is removed.

2. A silicon wafer wax sticking device used in the silicon wafer wax sticking method according to claim 1, characterized in that: It includes a frame, a heating table, a conveying plate, and a cooling tray. The conveying plate is placed under the heating table and can be movably arranged. The cooling tray and the heating table are laterally staggered. A lifting platform is installed under the heating table. A plurality of top blocks are arranged on the lifting platform. Avoidance grooves are arranged on the conveying plate and on the top blocks correspondingly, and the top blocks can pass through the avoidance grooves. A cooling fan is installed on the cooling tray. The cooling tray can be lifted and installed on the frame.

3. A silicon wafer wax sticking device according to claim 2, characterized in that: The frame is equipped with a slide rail and a lifting screw rod. The cooling support plate can be lifted and lowered on the slide rail. The lifting screw rod is adapted to be connected with the cooling support plate. The lifting screw rod rotates to drive the cooling support plate to move up and down.

4. The silicon wafer wax sticking device according to claim 2, characterized in that: Slide grooves are arranged on both sides of the conveying plate on the frame, and the slide grooves extend to the cooling support plate. Pulleys are arranged on the conveying plate and in correspondence with the slide grooves, and the pulleys are arranged in the slide grooves.

5. The silicon wafer wax sticking device according to claim 2, characterized in that: Both sides of the heating platform on the frame are provided with mounting bars, and the heating platform is installed between the two mounting bars.

6. A silicon wafer wax sticking device according to claim 5, characterized in that: A guide groove is arranged on the installation strip, and a convex strip is arranged on the edge of the heating platform, and the convex strip is adaptively connected with the guide groove.

7. The silicon wafer wax sticking device according to claim 2, characterized in that: A lifting piston cylinder is installed on the frame, and a telescopic rod of the lifting piston cylinder is connected with the lifting platform.

8. The silicon wafer wax sticking device according to claim 2, characterized in that: There are handles on both sides of the conveyor plate.

9. A silicon wafer wax sticking device according to any one of claims 2 to 8, characterized in that: A feeding table is installed on the frame away from the cooling tray side, and a stacking frame for stacking quartz ingots is installed on the feeding table; a pushing frame is installed above the heating table, and the pushing frame includes two oppositely arranged pushing bars, and pushing grooves are provided on the stacking frame and corresponding to the pushing bars, and the pushing bars are movably connected to the pushing grooves, and a one-way shifting rod is hinged on the pushing bar; a one-way shifting bar is hinged on the conveying plate, and the transmission plate can pass through the bottom of the stacking frame; an upper heating-in-place bar and a lower heating-in-place bar are hinged on the heating table near the stacking frame end, and an upper cooling-in-place bar and a lower cooling-in-place bar are hinged on the heating table near the cooling tray end.

10. A method for waxing a silicon wafer, characterized in that: The silicon wafer wax sticking operation is performed using the silicon wafer wax sticking device according to claim 9, comprising the following steps: S1, stacking the quartz ingot discs in a stacking frame; S2, the conveying plate and the pushing frame move toward the stacking frame direction, the one-way toggle bar on the conveying plate is pressed backward by the quartz ingot disk, the one-way toggle bar slides over the quartz ingot disk and returns to its original position, the conveying plate moves in the opposite direction, the one-way toggle bar abuts against the side wall of the lowest quartz ingot disk, the quartz ingot disk is pulled toward the heating table, the quartz ingot disk abuts against the lower heating-in-place bar, the lower heating-in-place bar is pressed backward, and after the quartz ingot disk slides over the lower heating-in-place bar, the conveying plate stops, and the lower heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk; the one-way lever on the pushing frame is pressed backward by the quartz ingot disk, the one-way lever slides over the quartz ingot disk and returns to its original position, the pushing frame moves in the opposite direction, the one-way lever abuts against a side wall of a quartz ingot disk, the quartz ingot disk is pulled toward the heating table, and the quartz ingot disk is supported on the upper surface of the heating table, and when the quartz ingot disk slides over the upper heating-in-place bar, the pushing frame stops, and the upper heating-in-place bar returns to its original position and abuts against the side wall of the quartz ingot disk; S3, the lifting platform rises upward, and the top block on the lifting platform passes through the avoidance groove and presses on the quartz ingot plate, so that the quartz ingot plate on the conveying plate fits onto the lower surface of the heating platform; S4, the heating stage heats the quartz ingot plate at a constant temperature; S5, after the quartz ingot disk under the heating table is heated, the lifting platform moves downward and returns to its original position so that the quartz ingot disk under the heating table is supported on the conveying plate, and the conveying plate is moved toward the stacking frame. At this time, the lower heating position bar abuts against the side wall of the quartz ingot disk under the heating table for positioning. After the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame, the one-way toggle bar abuts against the side wall of the quartz ingot disk, and the conveying plate moves toward the cooling support plate. The quartz ingot disk that has completed heating moves with the conveying plate to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the bottom of the heating table. After that, the conveying plate moves toward the stacking frame, and the lower cooling position bar abuts against the side wall of the quartz ingot disk, causing the quartz ingot disk to slide onto the cooling support plate, until the one-way toggle bar at the front end of the conveying plate slides over the quartz ingot disk at the lower end of the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk; After the quartz ingot disk on the heating table is heated, the cooling support plate moves upward to a position flush with the upper surface of the heating table, and the pushing frame moves toward the stacking frame. At this time, the upper heating position bar abuts against the side wall of the quartz ingot disk on the heating table for positioning. After the one-way lever on the pushing bar slides over the quartz ingot disk in the stacking frame, the pushing frame moves toward the cooling support plate, and the quartz ingot disk that has completed heating on the heating table moves with the pushing frame to the top of the cooling support plate. At the same time, a new quartz ingot disk is pushed from the stacking frame to the heating table. After that, the pushing frame moves toward the stacking frame, and the upper cooling position bar abuts against the side wall of the quartz ingot disk to position the quartz ingot disk, until the one-way lever on the pushing bar slides over the stacking frame to prepare for the pulling of the next quartz ingot disk, and finally the waxed silicon wafer is glued to the quartz ingot disk; S6, after the silicon wafer is stuck to the quartz ingot plate, the cooling fan is driven to cool it down, and the quartz ingot plate is removed after the cooling is completed.

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