Display panel and manufacturing method thereof, and display device

Abstract

The embodiment of the present invention discloses a display panel and a manufacturing method thereof, and a display device; the display panel includes a substrate, a first circuit layer located on a first side of the substrate, a second circuit layer located on a second side of the substrate, and a plurality of metal side lines located on the side of the display panel, wherein two adjacent metal side lines are arranged with insulation intervals, and the metal side lines are electrically connected to the first circuit layer and the second circuit layer; the present invention bends the metal side lines on the side of the display panel to connect with the corresponding electric wires, without the risk of conductive particle overlap, and at the same time utilizes the advantage of the high ductility of the metal side lines to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In recent years, the development trend of display panels is towards borderless display, especially borderless display panels used in spliced ​​displays, which have better display effects and are favored by users. In order to reduce the borders, the current mainstream method is mainly to introduce a double-sided process, and use the side printing technology of conductive silver glue to achieve the conduction of the front and back wiring of the display panel. However, the pad printing or transfer process of the conductive silver glue is difficult, resulting in low precision of the conductive silver glue after side printing, or additional laser etching process is required on the side, or the conductive silver glue is easily oxidized and corroded, resulting in a low yield of the side conductive lines, thereby reducing the quality of the display panel.

[0003] Therefore, there is an urgent need for a display panel and a manufacturing method thereof, and a display device to solve the above technical problems. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, and a display device, which can alleviate the current technical problem of low yield of side conductive lines.

[0005] The present invention provides a display panel, comprising:

[0006] substrate;

[0007] A first circuit layer, located on a first side of the substrate;

[0008] A second circuit layer is located on the second side of the substrate; and

[0009] A plurality of metal side lines, located on the side of the display panel;

[0010] Wherein, two adjacent metal side lines are arranged with insulation intervals, and the metal side lines are electrically connected to the first circuit layer and the second circuit layer.

[0011] Preferably, the display panel also includes a plurality of first terminals located on the first side of the substrate, and a plurality of second terminals located on the second side of the substrate; the first circuit layer includes a plurality of first wires, and the second circuit layer includes a plurality of second wires; wherein, one of the first wires is electrically connected to the first terminal, one of the second wires is electrically connected to the second terminal, and one of the first terminals is electrically connected to one of the second terminals via one of the metal side wires.

[0012] Preferably, the first terminal is connected to the corresponding metal side line by solid-state diffusion welding, and the second terminal is connected to the corresponding metal side line by solid-state diffusion welding.

[0013] Preferably, an orthographic projection of an end portion of the metal side line corresponding to the first terminal on the first terminal is located within the first terminal, and an orthographic projection of an end portion of the metal side line corresponding to the second terminal on the second terminal is located within the second terminal.

[0014] Preferably, the diameter of the metal side wire is smaller than the distance between the geometric centers of two adjacent first terminals, and the diameter of the metal side wire is smaller than the distance between the geometric centers of two adjacent second terminals.

[0015] Preferably, the display panel further includes an insulating protection layer located on the metal side lines.

[0016] The present invention also provides a method for manufacturing a display panel, comprising:

[0017] providing a substrate;

[0018] forming a first circuit layer on a first side of the substrate, and forming a second circuit layer on a second side of the substrate;

[0019] A plurality of insulating and spaced metal side lines electrically connected to the first circuit layer and the second circuit layer are formed on the side surface of the substrate.

[0020] Preferably, the step of forming a first circuit layer on the first side of the substrate and forming a second circuit layer on the second side of the substrate includes: forming a first circuit layer including a plurality of first wires and a first terminal electrically connected to the first wires on the first side of the substrate, and forming a second circuit layer including a plurality of second wires and a second terminal electrically connected to the second wires on the second side of the substrate; the step of forming a plurality of insulated metal side lines electrically connected to the first circuit layer and the second circuit layer on the side of the substrate includes: forming a plurality of insulated metal side lines on the side of the substrate, one first wire electrically connected to the first terminal, and one second wire electrically connected to the second terminal.

[0021] Preferably, the steps of forming a plurality of metal side lines with insulating intervals on the side of the substrate, electrically connecting the first wire to the first terminal, and electrically connecting the second wire to the second terminal include: providing a plurality of metal material lines; aligning the plurality of metal material lines with the corresponding first terminals and the corresponding second terminals on the side of the substrate; contacting the metal material lines with the corresponding first terminals and the corresponding second terminals; connecting the metal material lines with the corresponding first terminals and the corresponding second terminals by solid-state diffusion welding; and removing the metal material lines extending from the first terminals to the center of the display panel and the metal material lines extending from the second terminals to the center of the display panel to form the metal side lines.

[0022] The present invention further provides a display device, comprising a plurality of spliced ​​screens, wherein the spliced ​​screens comprise any one of the above-mentioned display panels.

[0023] Beneficial effects of the present invention: The present invention bends the metal side wires on the side of the display panel to connect them to the corresponding wires, eliminating the risk of conductive particle overlap. At the same time, the high ductility of the metal side wires is utilized to reduce the risk of short circuits and open circuits, thereby improving the quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 is a structural schematic diagram of a first structure of a display panel provided by an embodiment of the present invention;

[0026] Figure 2 is a structural schematic diagram of a second structure of a display panel provided by an embodiment of the present invention;

[0027] Figure 3 yes Figure 2 A schematic diagram of the structure of the side C direction;

[0028] Figure 4 is a schematic structural diagram of a third structure of a display panel provided by an embodiment of the present invention;

[0029] Figure 5 is a flowchart of the steps of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0030] Figures 6A to 6B is a first flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0031] Figures 7A to 7B is a second flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0032] Figures 8A to 8D is a third flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0033] Fig. 9 It is a schematic diagram of the structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0035] In recent years, the development trend of display panels is towards borderless display, especially borderless display panels used in spliced ​​displays, which have better display effects and are favored by users. In order to reduce the borders, the current mainstream method is mainly to introduce a double-sided process, and use the side printing technology of conductive silver glue to achieve the conduction of the front and back wiring of the display panel. However, the pad printing or transfer process of the conductive silver glue is difficult, resulting in low precision of the conductive silver glue after side printing, or additional laser etching process is required on the side, or the conductive silver glue is easily oxidized and corroded, resulting in a low yield of the side conductive lines, thereby reducing the quality of the display panel.

[0036] See also Figures 1 to 4 , an embodiment of the present invention provides a display panel 100, including:

[0037] Substrate 200;

[0038] A first circuit layer 300 is located on a first side A of the substrate 200;

[0039] A second circuit layer 400 is located on the second side B of the substrate 200; and

[0040] A plurality of metal side lines 500 , located on a side surface C of the display panel 100 ;

[0041] Two adjacent metal side lines 500 are arranged with insulation intervals, and the metal side lines 500 are electrically connected to the first circuit layer 300 and the second circuit layer 400 .

[0042] The present invention bends the metal side wires at the side of the display panel to connect them to the corresponding electric wires, eliminating the risk of conductive particle overlap. At the same time, the high ductility of the metal side wires is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

[0043] The technical solution of the present invention is now described in conjunction with specific embodiments.

[0044] In this embodiment, please refer to Figure 1 The display panel 100 includes a substrate 200, a first circuit layer 300 located on a first side A of the substrate 200, a second circuit layer 400 located on a second side B of the substrate 200, and a plurality of metal side lines 500 located on a side C of the display panel 100, wherein two adjacent metal side lines 500 are insulated and spaced apart, and the metal side lines 500 are electrically connected to the first circuit layer 300 and the second circuit layer 400.

[0045] The front and back driving circuits are electrically connected at the side C of the substrate 200 of the display panel 100. Generally, side-printed silver paste is used, and the silver paste is pressed onto the side C of the substrate 200 using a silicone rod to achieve electrical connection. However, since the silver paste used in this method is micron-sized silver particles dispersed in a solvent, there are problems such as overlapping stability between the silver particles after drying, large resistance value, easy oxidation corrosion of silver, and easy short circuit. In the actual production process, the side printing yield is low and it is basically not mass-producible.

[0046] The metal side line 500 serves as a side C connection structure of the display panel 100, connecting the first circuit layer 300 and the second circuit layer 400. One metal side line 500 is an integral independent circuit without the risk of conductive particle overlap. At the same time, the high ductility of the metal side line 500 is utilized to reduce the risk of short circuit and open circuit, thereby achieving a narrow frame of the display panel 100 and improving the quality of the display panel 100.

[0047] In some embodiments, see Figure 2The display panel 100 also includes a plurality of first terminals 610 located on the first side A of the substrate 200, and a plurality of second terminals 620 located on the second side B of the substrate 200; the first circuit layer 300 includes a plurality of first wires 310, and the second circuit layer 400 includes a plurality of second wires 410; wherein, a first wire 310 is electrically connected to the first terminal 610, a second wire 410 is electrically connected to the second terminal 620, and a first terminal 610 is electrically connected to a second terminal 620 via a metal side line 500.

[0048] A first wire 310, a first terminal 610, a metal side line 500, a second terminal 620, and a second wire 410 constitute a signal. The first terminal 610 and the second terminal 620 facilitate the alignment and connection of the metal side line 500, connecting the first circuit layer 300 and the second circuit layer 400. The metal side line 500 is an integral independent circuit without the risk of overlapping conductive particles. At the same time, the high ductility of the metal side line 500 is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel 100.

[0049] In some embodiments, see Figure 2 The first terminal 610 is connected to the corresponding metal side line 500 by solid-state diffusion welding, and the second terminal 620 is connected to the corresponding metal side line 500 by solid-state diffusion welding.

[0050] The first terminal 610 and the metal side line 500, as well as the second terminal 620 and the metal side line 500, are connected by solid-state diffusion welding, which are fixed by alloying and have low contact resistance. The connection is made by solid-state diffusion welding technology, and the heating temperature is low, which does not need to reach the melting point of the metal. It is generally 0.5 to 0.8 times the lower melting point of the metal side line 500, the first terminal 610, and the second terminal 620. The specific temperature can be adjusted according to actual conditions. This is only an example and is not specifically limited. There is no remelted cast structure in the joint, and the physical and chemical properties of the raw materials are rarely changed, which avoids the metal side line 500 from bouncing open due to the large elastic modulus of the middle section of the metal side line 500 when the metal side line 500 is melted, thereby avoiding abnormal line connection.

[0051] In some embodiments, see Figure 2 The orthographic projection of the end of the metal side line 500 corresponding to the first terminal 610 on the first terminal 610 is located within the first terminal 610 , and the orthographic projection of the end of the metal side line 500 corresponding to the second terminal 620 on the second terminal 620 is located within the second terminal 620 .

[0052] During the manufacturing process, the connection ends between the metal side line 500 and the first terminal 610 and the second terminal 620 are modified using tools such as a clamp 810, so that the ends of the metal side line 500 are terminated inside the first terminal 610 and the second terminal 620, thereby avoiding the situation where the metal side line 500 extends too long from the terminal and causes abnormal connection with other circuits, thereby improving the stability of the electrical connection and the display effect.

[0053] In some embodiments, see Figure 3 The diameter of the metal side line 500 is smaller than the distance between the geometric centers of two adjacent first terminals 610 , and the diameter of the metal side line 500 is smaller than the distance between the geometric centers of two adjacent second terminals 620 .

[0054] The diameter of the metal side line 500 should not be too large, so as to reduce the resistance and avoid abnormal connection between two adjacent metal side lines 500 to avoid electrical abnormality.

[0055] In some embodiments, the material of the metal side line 500 can be a corrosion-resistant metal with low resistivity, such as any one of gold wire, tin wire or indium wire. The stability in air or water vapor environment is higher than that of silver. Even if the metal side line 500 is exposed, it is not easily corroded and broken. At the same time, the metal wire has high ductility and is not easy to break, which can ensure the connection stability and service life.

[0056] In some embodiments, the diameter of the metal side line 500 may be less than 100 microns. Preferably, for gold wire, the resistivity of gold is small, and the diameter of the gold wire may be about 10 microns or even smaller, which is conducive to the display of high-resolution display panel 100 .

[0057] In some embodiments, see Figure 4 , the display panel 100 further includes an insulating protective layer 700 located on the metal side line 500. The insulating protective layer 700 can protect the metal side line 500, extend the service life of the metal side line 500, and improve the electrical connection stability of the metal side line 500. The material of the insulating protective layer 700 can be transparent optical glue or light shielding glue, etc. The light shielding glue can also reduce the influence of light heat on the metal side line 500. The specific material can be adjusted according to the actual situation, which is only used as an example here without specific limitation.

[0058] In some embodiments, the display panel 100 further includes a light emitting device layer located on the first circuit layer 300 .

[0059] In some embodiments, the light-emitting device layer may include OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor) materials, or may include Micro LED or Mini LED, which are not specifically limited here. Among them, Micro LED or Mini LED has the advantages of high pixel display and large size display.

[0060] In some embodiments, the substrate 200 may be a glass substrate or a flexible substrate. The flexible substrate may be a polyimide substrate, etc., which is not specifically limited herein.

[0061] In some embodiments, the Micro LED or Mini LED can be a backlight or a direct display, which is not specifically limited here.

[0062] The present invention bends the metal side wires at the side of the display panel to connect them to the corresponding electric wires, eliminating the risk of conductive particle overlap. At the same time, the high ductility of the metal side wires is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

[0063] See also Figure 5 The embodiment of the present invention further provides a method for manufacturing a display panel 100, comprising:

[0064] S100, providing a substrate 200;

[0065] S200, forming a first circuit layer 300 on a first side A of the substrate 200, and forming a second circuit layer 400 on a second side B of the substrate 200;

[0066] S300 , forming a plurality of metal side lines 500 with insulation intervals and electrically connected to the first circuit layer 300 and the second circuit layer 400 on the side surface C of the substrate 200 .

[0067] The present invention bends the metal side wires at the side of the display panel to connect them to the corresponding electric wires, eliminating the risk of conductive particle overlap. At the same time, the high ductility of the metal side wires is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

[0068] The technical solution of the present invention is now described in conjunction with specific embodiments.

[0069] In this embodiment, the manufacturing method of the display panel 100 includes:

[0070] S100, providing a substrate 200, see Fig. 6A .

[0071] In some embodiments, the substrate 200 may be a glass substrate or a flexible substrate. The flexible substrate may be a polyimide substrate, etc., which is not specifically limited herein.

[0072] S200, forming a first circuit layer 300 on the first side A of the substrate 200, and forming a second circuit layer 400 on the second side B of the substrate 200, see Fig. 6A .

[0073] In some embodiments, step S200 includes:

[0074] S210, forming a first circuit layer 300 including a plurality of first wires 310 and a first terminal 610 electrically connected to the first wires 310 on the first side A of the substrate 200, and forming a second circuit layer 400 including a plurality of second wires 410 and a second terminal 620 electrically connected to the second wires 410 on the second side B of the substrate 200, see Fig. 7A .

[0075] The first terminal 610 and the second terminal 620 facilitate the connection between the first electric wire 310 and the second electric wire 410 .

[0076] S300, forming a plurality of metal side lines 500 electrically connected to the first circuit layer 300 and the second circuit layer 400 on the side surface C of the substrate 200, see Figure 6B .

[0077] In some embodiments, step S300 includes:

[0078] S310, forming a plurality of metal side wires 500 with insulation spacing on the side surface C of the substrate 200, a first wire 310 is electrically connected to the first terminal 610, a second wire 410 is electrically connected to the second terminal 620, see Figure 7B .

[0079] A first wire 310, a first terminal 610, a metal side line 500, a second terminal 620, and a second wire 410 constitute a signal. The first terminal 610 and the second terminal 620 facilitate the alignment and connection of the metal side line 500, connecting the first circuit layer 300 and the second circuit layer 400. The metal side line 500 is an integral independent circuit without the risk of overlapping conductive particles. At the same time, the high ductility of the metal side line 500 is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel 100.

[0080] In some embodiments, step S310 includes:

[0081] S311, provide a plurality of metal material wires 501, see Fig. 8A .

[0082] S312, aligning the plurality of metal material wires 501 on the side surface C of the substrate 200 with the corresponding first terminals 610 and the corresponding second terminals 620, see Figure 8B .

[0083] In some embodiments, step S312 includes:

[0084] S3121, using the clamp 810, straighten the plurality of metal material wires 501 and bring them close to the side surface C of the substrate 200, see Figure 8B .

[0085] S3122, align the plurality of metal material wires 501 on the side surface C of the substrate 200 with the corresponding first terminals 610 and the corresponding second terminals 620, see Figure 8B .

[0086] In some embodiments, in order to improve the connection efficiency, multiple metal material wires 501 can be fixed and aligned at a set interval at the same time.

[0087] S313, the metal material wire 501 is brought into contact with the corresponding first terminal 610 and the corresponding second terminal 620, see Figure 8C .

[0088] In some embodiments, step S313 includes:

[0089] S3131, using the clamp 810, the metal material wire 501 is wrapped around the side C of the substrate 200, and is in physical contact with the corresponding first terminal 610 and the corresponding second terminal 620, see Figure 8C .

[0090] S314, using solid diffusion welding, the metal material wire 501 is connected to the corresponding first terminal 610 and the corresponding second terminal 620 by solid diffusion welding, see Fig.8D .

[0091] In some embodiments, step S314 includes:

[0092] S3141, using the hot pressing head 820, solid-state diffusion welding is performed on the metal material wire 501 and the corresponding first terminal 610 and the corresponding second terminal 620, so that the metal material wire 501 and the corresponding first terminal 610 and the corresponding second terminal 620 are connected by solid-state diffusion welding. Fig.8D .

[0093] S315, removing the metal material line 501 extending from the first terminal 610 to the center of the display panel 100 and the metal material line 501 extending from the second terminal 620 to the center of the display panel 100 to form the metal side line 500, see Figure 7B .

[0094] The first terminal 610 and the metal side line 500, as well as the second terminal 620 and the metal side line 500, are connected by solid-state diffusion welding, which are fixed by alloying and have low contact resistance. The connection is made by solid-state diffusion welding technology, and the heating temperature is low, which does not need to reach the melting point of the metal. It is generally 0.5 to 0.8 times the lower melting point of the metal side line 500, the first terminal 610, and the second terminal 620. The specific temperature can be adjusted according to actual conditions. This is only an example and is not specifically limited. There is no remelted cast structure in the joint, and the physical and chemical properties of the raw materials are rarely changed, which avoids the metal side line 500 from bouncing open due to the large elastic modulus of the middle section of the metal side line 500 when the metal side line 500 is melted, thereby avoiding abnormal line connection.

[0095] The front and back driving circuits are electrically connected at the side C of the substrate 200 of the display panel 100. Generally, side-printed silver paste is used, and the silver paste is pressed onto the side C of the substrate 200 using a silicone rod to achieve electrical connection. However, since the silver paste used in this method is micron-sized silver particles dispersed in a solvent, there are problems such as overlapping stability between the silver particles after drying, large resistance value, easy oxidation corrosion of silver, and easy short circuit. In the actual production process, the side printing yield is low and it is basically not mass-producible.

[0096] The metal side line 500 serves as a side C connection structure of the display panel 100, connecting the first circuit layer 300 and the second circuit layer 400. One metal side line 500 is an integral independent circuit without the risk of conductive particle overlap. At the same time, the high ductility of the metal side line 500 is utilized to reduce the risk of short circuit and open circuit, thereby achieving a narrow frame of the display panel 100 and improving the quality of the display panel 100.

[0097] In some embodiments, see Figure 7B The orthographic projection of the end of the metal side line 500 corresponding to the first terminal 610 on the first terminal 610 is located within the first terminal 610 , and the orthographic projection of the end of the metal side line 500 corresponding to the second terminal 620 on the second terminal 620 is located within the second terminal 620 .

[0098] In some embodiments, see Figure 8BThe diameter of the metal side line 500 is smaller than the distance between the geometric centers of two adjacent first terminals 610 , and the diameter of the metal side line 500 is smaller than the distance between the geometric centers of two adjacent second terminals 620 .

[0099] In some embodiments, the method for manufacturing the display panel 100 further includes:

[0100] S400 , forming an insulating protective layer 700 on the metal lateral line 500 .

[0101] In some embodiments, the display panel 100 further includes an insulating protective layer 700 located on the metal side line 500. The insulating protective layer 700 can protect the metal side line 500, extend the service life of the metal side line 500, and improve the electrical connection stability of the metal side line 500. The material of the insulating protective layer 700 can be transparent optical glue or light shielding glue, etc. The light shielding glue can also reduce the influence of light heat on the metal side line 500. The specific material can be adjusted according to the actual situation, which is only used as an example here without specific limitation.

[0102] The present invention bends the metal side wires at the side of the display panel to connect them to the corresponding electric wires, eliminating the risk of conductive particle overlap. At the same time, the high ductility of the metal side wires is utilized to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

[0103] See also Fig. 9 The embodiment of the present invention further provides a display device 10, comprising a plurality of spliced ​​screens 20, wherein the spliced ​​screens 20 include any of the above-mentioned display panels 100.

[0104] The specific structure of the display panel 100 may be referred to any of the above embodiments and drawings of the display panel 100 , and will not be described in detail herein.

[0105] The display panel 100 has a narrow frame, which is beneficial to reducing the gap between two adjacent spliced ​​screens 20 and improving the display effect of the display device 10 .

[0106] The embodiment of the present invention discloses a display panel and a manufacturing method thereof, and a display device; the display panel includes a substrate, a first circuit layer located on a first side of the substrate, a second circuit layer located on a second side of the substrate, and a plurality of metal side lines located on the side of the display panel, wherein two adjacent metal side lines are arranged with insulation intervals, and the metal side lines are electrically connected to the first circuit layer and the second circuit layer; the present invention bends the metal side lines on the side of the display panel to connect with the corresponding electric wires, without the risk of conductive particle overlap, and at the same time utilizes the advantage of the high ductility of the metal side lines to reduce the risk of short circuit and open circuit, thereby improving the quality of the display panel.

[0107] The above is a detailed introduction to a display panel and a manufacturing method thereof, and a display device provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A display panel, characterized in that: include: substrate; A first circuit layer, located on a first side of the substrate; A second circuit layer, located on a second side of the substrate; and A plurality of metal side lines, located on the side of the display panel; Among them, two adjacent metal side lines are arranged with insulation intervals, and the metal side lines are electrically connected to the first circuit layer and the second circuit layer; the display panel also includes a plurality of first terminals located on the first side of the substrate, and a plurality of second terminals located on the second side of the substrate; a first terminal and a second terminal are electrically connected through a metal side line; the first terminal is connected to the corresponding metal side line by solid-state diffusion welding, and the second terminal is connected to the corresponding metal side line by solid-state diffusion welding; the orthographic projection of the end of the metal side line corresponding to the first terminal on the first terminal is located within the first terminal, and the orthographic projection of the end of the metal side line corresponding to the second terminal on the second terminal is located within the second terminal.

2. The display panel according to claim 1, characterized in that: The first circuit layer includes a plurality of first wires, and the second circuit layer includes a plurality of second wires; Among them, a first electric wire is electrically connected to the first terminal, and a second electric wire is electrically connected to the second terminal.

3. The display panel according to claim 2, characterized in that: The diameter of the metal side wire is smaller than the distance between the geometric centers of two adjacent first terminals, and the diameter of the metal side wire is smaller than the distance between the geometric centers of two adjacent second terminals.

4. The display panel according to claim 1, characterized in that: The display panel further includes an insulating protection layer located on the metal side lines.

5. A method for manufacturing a display panel, characterized in that: include: providing a substrate; Forming a first circuit layer and a plurality of first terminals on a first side of the substrate, and forming a second circuit layer and a plurality of second terminals on a second side of the substrate; Forming a plurality of insulating and spaced metal side lines electrically connected to the first circuit layer and the second circuit layer on the side surface of the substrate; The step of forming a plurality of insulating and spaced metal side lines electrically connected to the first circuit layer and the second circuit layer on the side surface of the substrate comprises: Provide multiple metal material lines; Aligning a plurality of the metal material wires with the corresponding first terminals and the corresponding second terminals on the side of the substrate; contacting the metal material wire with the corresponding first terminal and the corresponding second terminal; Using solid state diffusion welding, connecting the metal material wire to the corresponding first terminal and the corresponding second terminal; The metal material line extending from the first terminal to the center of the display panel and the metal material line extending from the second terminal to the center of the display panel are removed to form the metal side line.

6. The method for manufacturing a display panel according to claim 5, characterized in that: The steps of forming a first circuit layer and a plurality of first terminals on the first side of the substrate and forming a second circuit layer and a plurality of second terminals on the second side of the substrate include: The first circuit layer including a plurality of first wires and the first terminal electrically connected to the first wires are formed on the first side of the substrate, and the second circuit layer including a plurality of second wires and the second terminal electrically connected to the second wires are formed on the second side of the substrate.

7. A display device, characterized in that: The invention comprises a plurality of spliced ​​screens, wherein the spliced ​​screens comprise the display panel according to any one of claims 1 to 4.

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