Display substrate, display panel, and method for manufacturing display panel

Abstract

The present application discloses a display substrate, a display panel and a method for manufacturing a display panel, wherein the display substrate comprises: a driving substrate, comprising a first end and a second end arranged opposite to each other; a driving pad, arranged at the first end of the driving substrate; a plurality of micro-light emitting diodes, arranged in an array between the first end and the second end of the driving substrate; an encapsulation layer, arranged on the driving substrate and covering the micro-light emitting diodes, the encapsulation layer comprising a first region and a second region; wherein the transmittance of the encapsulation layer in the first region is less than the transmittance in the second region. The present application reduces the transmittance of the encapsulation layer near the driving pad end and increases the transmittance of the encapsulation layer far from the driving pad end by setting the transmittance of the encapsulation layer in the first region to be less than the transmittance in the second region, thereby making the brightness of the micro-light emitting diode near the driving pad end and the micro-light emitting diode far from the driving pad end uniform, thereby improving the uniformity of display brightness.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display substrate, a display panel and a method for manufacturing a display panel. Background Art

[0002] Major panel manufacturers are actively developing micro light-emitting diode display panels (MinLED panels or MicroLED panels), which are expected to become the core technology of the next generation of display panels.

[0003] However, after the driving signal of the micro-LED display panel is input from the driving pad, especially in a large-sized micro-LED display panel, there is a voltage drop (IRdrop) problem when the input signal is transmitted from the near driving pad end to the far driving pad end through the wiring, which makes the brightness of the micro-LED display panel near the driving pad end high, while the brightness of the far driving pad end is low, resulting in uneven display. Summary of the invention

[0004] The embodiments of the present application provide a display substrate, a display panel and a method for manufacturing a display panel, which can solve the problem of voltage drop (IRdrop) in a micro-light-emitting diode display panel, resulting in high brightness at the end near the driving pad and low brightness at the end far from the driving pad, resulting in uneven display brightness.

[0005] The present application provides a display substrate, including:

[0006] A driving substrate, comprising a first end and a second end arranged opposite to each other;

[0007] A driving pad, disposed at the first end of the driving substrate;

[0008] A plurality of micro light emitting diodes, an array is arranged between the first end and the second end of the driving substrate, and the driving pad is electrically connected to the micro light emitting diodes;

[0009] an encapsulation layer, disposed on the driving substrate and covering the micro-LED, the encapsulation layer comprising a first region and a second region, the first region being located on a side of the first end close to the second end and adjacent to the first end, and the second region being located on a side of the second end close to the first end and adjacent to the second end;

[0010] The transmittance of the encapsulation layer in the first region is lower than the transmittance in the second region.

[0011] Optionally, in some embodiments of the present application, the encapsulation layer further includes a third region located between the first region and the second region, and the transmittance of the encapsulation layer in the first region, the transmittance in the third region, and the transmittance in the second region increase sequentially.

[0012] Optionally, in some embodiments of the present application, the encapsulation layer includes an encapsulation body material and a black material doped in the encapsulation body material, and a concentration of the black material in the first region of the encapsulation layer is greater than a concentration of the black material in the second region of the encapsulation layer.

[0013] Optionally, in some embodiments of the present application, the encapsulation layer includes an encapsulation body material and a black material doped in the encapsulation body material, and the concentration of the black material in the first area of ​​the encapsulation layer, the concentration of the black material in the third area of ​​the encapsulation layer, and the concentration of the black material in the second area of ​​the encapsulation layer decrease successively.

[0014] Optionally, in some embodiments of the present application, the encapsulation layer includes a encapsulation body layer and an ink layer disposed on the encapsulation body layer, the ink layer covers the micro light emitting diode, and the transmittance of the ink layer in the first area of ​​the encapsulation layer, the transmittance in the third area of ​​the encapsulation layer, and the transmittance in the second area of ​​the encapsulation layer increase sequentially.

[0015] Optionally, in some embodiments of the present application, the thickness of the ink layer in the first area, the thickness in the third area, and the thickness in the second area decrease sequentially.

[0016] Optionally, in some embodiments of the present application, the ink layer includes a black material, and the concentration of the black material in the first area of ​​the ink layer, the concentration in the third area of ​​the ink layer, and the concentration in the second area of ​​the ink layer decreases sequentially.

[0017] Correspondingly, an embodiment of the present application also provides a display panel, comprising the display substrate described in one of the above items, wherein the display substrate is used as the backlight of the display panel, or the micro light emitting diodes of the display substrate are used as display pixels of the display panel.

[0018] Accordingly, the embodiment of the present application further provides a method for manufacturing a display panel, comprising the following steps:

[0019] Step S100: providing a driving substrate, on which a driving pad and a plurality of micro-light emitting diodes are disposed, the driving pad being electrically connected to the micro-light emitting diodes, the driving substrate comprising a first end and a second end that are oppositely disposed, the driving pad being disposed at the first end of the driving substrate, and the micro-light emitting diode array being disposed between the first end and the second end on the driving substrate;

[0020] Step S200: forming a layer to be packaged, providing a substrate, and forming a first portion and a second portion of the layer to be packaged on the substrate, wherein the transmittance of the first portion of the layer to be packaged is less than the transmittance of the second portion;

[0021] Step S300: forming a packaging layer, transferring the layer to be packaged onto the driving substrate to form the packaging layer, wherein the packaging layer covers the micro light emitting diode, wherein a first portion of the layer to be packaged forms a first region of the packaging layer, and a second portion of the layer to be packaged forms a second region of the packaging layer, the first region is located on a side of the first end close to the second end and adjacent to the first end, and the second region is located on a side of the second end close to the first end and adjacent to the second end.

[0022] Optionally, in some embodiments of the present application, the step S200 further includes: forming a third portion of the layer to be packaged on the substrate, the third portion being located between the first portion and the second portion, and the transmittance of the layer to be packaged at the first portion, the transmittance at the third portion, and the transmittance at the second portion increase in sequence;

[0023] The step S300 further includes: the third portion of the layer to be encapsulated forms a third region of the encapsulation layer, the third region is located between the first region and the second region, and the transmittance of the encapsulation layer in the first region, the transmittance in the third region, and the transmittance in the second region increase in sequence.

[0024] In an embodiment of the present application, a display substrate, a display panel and a method for manufacturing a display panel are provided, the display substrate comprising: a driving substrate comprising a first end and a second end arranged opposite to each other; a driving pad arranged at the first end of the driving substrate; a plurality of micro-light emitting diodes arranged in an array between the first end and the second end of the driving substrate, the driving pad being electrically connected to the micro-light emitting diodes; a packaging layer arranged on the driving substrate and covering the micro-light emitting diodes, the packaging layer comprising a first area and a second area, the first area being located on a side of the first end close to the second end and adjacent to the first end, and the second area being located on a side of the second end close to the first end and adjacent to the second end; wherein the transmittance of the packaging layer in the first area is less than the transmittance in the second area. The present application sets the transmittance of the encapsulation layer in the first area to be lower than the transmittance in the second area, thereby reducing the transmittance of the encapsulation layer at the near driving pad end and improving the transmittance of the encapsulation layer at the far driving pad end, so that the brightness of the micro-light emitting diode at the near driving pad end and the micro-light emitting diode at the far driving pad end are uniform, which can solve the problem of high brightness at the near driving pad end and low brightness at the far driving pad end caused by voltage drop (IRdrop) in the micro-light emitting diode display panel, thereby improving the uniformity of display brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of a first cross-sectional structure of a display substrate provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of a second cross-sectional structure of a display substrate provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of a third cross-sectional structure of a display substrate provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a first process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of a second process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0032] Figure 7 A schematic diagram of a third process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0033] Figure 8 A fourth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0035] The embodiment of the present application provides a display substrate, including: a driving substrate, including a first end and a second end arranged opposite to each other; a driving pad, arranged at the first end of the driving substrate; a plurality of micro-light emitting diodes, an array is arranged between the first end and the second end of the driving substrate, and the driving pad is electrically connected to the micro-light emitting diodes; an encapsulation layer is arranged on the driving substrate and covers the micro-light emitting diodes, the encapsulation layer includes a first area and a second area, the first area is located on a side of the first end close to the second end and adjacent to the first end, and the second area is located on a side of the second end close to the first end and adjacent to the second end; wherein the transmittance of the encapsulation layer in the first area is less than the transmittance in the second area. The embodiment of the present application also provides a display panel including the aforementioned display substrate, and a method for manufacturing the display panel. The following are described in detail respectively. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0036] Embodiment 1

[0037] See also Figure 1 , Figure 1 This is a schematic diagram of a first cross-sectional structure of a display substrate 100 provided in an embodiment of the present application.

[0038] The embodiment of the present application provides a display substrate 100, which includes a driving substrate 10, a driving pad 40, a plurality of micro-light emitting diodes 20, and an encapsulation layer 30; the driving substrate 10 includes a first end 11 and a second end 12 that are arranged opposite to each other; the driving pad 40 is arranged at the first end 11 of the driving substrate 10; a plurality of micro-light emitting diodes 20 are arrayed between the first end 11 and the second end 12 of the driving substrate 10, and the driving pad 40 is electrically connected to the micro-light emitting diodes 20; the encapsulation layer 30 is arranged on the driving substrate 10 and covers the micro-light emitting diodes 20, and the encapsulation layer 30 includes a first area 31 and a second area 32, the first area 31 is located on a side of the first end 11 close to the second end 12 and is adjacent to the first end 11, and the second area 32 is located on a side of the second end 12 close to the first end 11 and is adjacent to the second end 12; wherein the transmittance of the encapsulation layer 30 in the first area 31 is less than the transmittance in the second area 32.

[0039] Specifically, the driving substrate 10 is provided with structures such as wiring and circuits for driving the micro-LEDs 20 to emit light. The driving substrate 10 can be any array substrate in the prior art, and the structure of the driving substrate 10 is not described in detail here.

[0040] Specifically, the driving pad 40 is an external signal input terminal of the driving substrate 10 , and the driving pad 40 is electrically connected to a circuit board (FPC or COF, etc.) and an integrated circuit.

[0041] Specifically, the micro light emitting diode 20 may be a MinLED or a MicroLED, but is not limited thereto.

[0042] Specifically, the driving substrate 10 includes a first end 11 and a second end 12 that are oppositely arranged; the driving pad 40 is arranged at the first end 11 of the driving substrate 10, and the first end 11 and the second end 12 can be two opposite edge portions on the driving substrate 10, or the second end 12 can also be a side end of the driving substrate 10.

[0043] Specifically, the encapsulation layer 30 includes a first area 31 and a second area 32, the first area 31 is located on a side of the first end 11 close to the second end 12, and is adjacent to the first end 11; the second area 32 is located on a side of the second end 12 close to the first end 11, and is adjacent to the second end 12; the encapsulation layer 30 can also be arranged at other positions, for example, the encapsulation layer 30 can also be arranged at the second end 12, in which case the second end 12 can be a side end of the driving substrate 10. In order to facilitate the explanation of the inventive spirit of the present application, the embodiment of the present application is explained with reference to the position of the encapsulation layer 30 covering the micro light-emitting diode 20. It should be noted that the setting position of the encapsulation layer 30 is not limited to the setting method in the embodiment of the present application.

[0044] In some embodiments, the encapsulation layer 30 includes an encapsulation body material and a black material doped in the encapsulation body material, and a concentration of the black material in a first region 31 of the encapsulation layer 30 is greater than a concentration of the black material in a second region 32 of the encapsulation layer 30 .

[0045] Specifically, the concentration of the black material in the first region 31 of the encapsulation layer 30 is greater than that in the second region 32 of the encapsulation layer 30 , so that the transmittance of the encapsulation layer 30 in the first region 31 is less than that in the second region 32 .

[0046] Furthermore, the black material doped in the package body material may include at least one of carbon black, titanium oxide black, aniline black and the like, but is not limited thereto.

[0047] Furthermore, the packaging body material may include at least one of epoxy resin and silicone, but is not limited thereto.

[0048] Specifically, the first region 31 is a near driving pad end, and the second region 32 is a far driving pad end.

[0049] In this embodiment, by setting the transmittance of the packaging layer in the first area to be lower than the transmittance in the second area, the transmittance of the packaging layer at the near driving pad end is reduced, and the transmittance of the packaging layer at the far driving pad end is improved, so that the brightness of the micro light emitting diode at the near driving pad end and the micro light emitting diode at the far driving pad end are uniform, which can solve the problem of voltage drop in the micro light emitting diode display panel, resulting in high brightness at the near driving pad end and low brightness at the far driving pad end, thereby improving the uniformity of display brightness.

[0050] Embodiment 2

[0051] This embodiment is the same as or similar to the first embodiment, except that the encapsulation layer 30 further includes a third region 33 .

[0052] See also Figure 2 , Figure 2 This is a schematic diagram of a second cross-sectional structure of a display substrate 100 provided in an embodiment of the present application.

[0053] In the embodiment of the present application, the encapsulation layer 30 further includes a third region 33 located between the first region 31 and the second region 32 , and the transmittance of the encapsulation layer 30 in the first region 31 , the transmittance in the third region 33 and the transmittance in the second region 32 increase sequentially.

[0054] Specifically, the encapsulation layer 30 includes at least a third region 33 between the first region 31 and the second region 32 .

[0055] Furthermore, the encapsulation layer 30 may include a fourth region between the third region 33 and the second region 32 , and the transmittance of the encapsulation layer 30 in the first region 31 , the transmittance in the third region 33 , the transmittance in the fourth region and the transmittance in the second region 32 increase in sequence.

[0056] Furthermore, the encapsulation layer 30 may include a fifth region between the fourth region and the second region 32, and the transmittance of the encapsulation layer 30 in the first region 31, the transmittance in the third region 33, the transmittance in the fourth region, the transmittance in the fifth region and the transmittance in the second region 32 increase successively.

[0057] Furthermore, the encapsulation layer 30 may include a plurality of regions between the first region 31 and the second region 32 , and the transmittance increases sequentially from the first region 31 to the second region 32 .

[0058] In some embodiments, the encapsulation layer 30 includes an encapsulation body material and a black material doped in the encapsulation body material, and the concentration of the black material in the first area of ​​the encapsulation layer 30, the concentration of the black material in the third area 33 of the encapsulation layer 30, and the concentration of the black material in the second area 32 of the encapsulation layer 30 decrease successively.

[0059] Specifically, by setting the concentration of the black material in the first area of ​​the encapsulation layer 30, the concentration of the black material in the third area 33 of the encapsulation layer 30, and the concentration of the black material in the second area 32 of the encapsulation layer 30 to decrease in sequence, the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33, and the transmittance in the second area 32 can be increased in sequence.

[0060] Furthermore, when the first area 31 and the second area 32 of the encapsulation layer 30 include multiple areas, the concentration of the black material directed from the first area 31 to the second area 32 can be set to decrease successively, so as to achieve a transmittance increasing successively from the first area 31 to the second area 32.

[0061] In this embodiment, by setting the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33 and the transmittance in the second area 32 to increase successively, the transmittance of the encapsulation layer at the near driving pad end is reduced, and the transmittance of the encapsulation layer at the far driving pad end is improved, so that the brightness of the micro light emitting diode at the near driving pad end and the micro light emitting diode at the far driving pad end are uniform, which can solve the problem of high brightness at the near driving pad end and low brightness at the far driving pad end caused by voltage drop in the micro light emitting diode display panel, thereby improving the uniformity of display brightness.

[0062] Compared with the first embodiment, the encapsulation layer 30 in this embodiment includes at least a third region 33 between the first region 31 and the second region 32 , which can further improve the display brightness uniformity.

[0063] Embodiment 3

[0064] This embodiment is the same as or similar to the above embodiment, except that the encapsulation layer 30 includes an encapsulation body layer 301 and an ink layer 302 , and the change in transmittance of the encapsulation layer 30 is achieved by providing the ink layer 302 .

[0065] See also Figure 3 , Figure 3 This is a schematic diagram of a third cross-sectional structure of a display substrate 100 provided in an embodiment of the present application.

[0066] In this embodiment, the encapsulation layer 30 includes a encapsulation body layer 301 and an ink layer 302 arranged on the encapsulation body layer 301, the ink layer 302 covers the micro light-emitting diode 20, and the transmittance of the ink layer 302 in the first area 31 of the encapsulation layer 30, the transmittance in the third area 33 of the encapsulation layer 30, and the transmittance in the second area 32 of the encapsulation layer 30 increases successively.

[0067] In this embodiment, the encapsulation layer 30 includes an encapsulation body layer 301 and an ink layer 302 arranged on the encapsulation body layer 301. The transmittance of the encapsulation body layer 301 in the first area 31, the third area 33 and the second area 32 is the same, and the transmittance of the ink layer 302 in the first area 31 of the encapsulation layer 30, the transmittance in the third area 33 of the encapsulation layer 30 and the transmittance in the second area 32 of the encapsulation layer 30 increases successively. By setting the transmittance of the ink layer to be different, the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33 and the transmittance in the second area 32 increase successively. The transmittance of the encapsulation layer at the near driving pad end can also be reduced, and the transmittance of the encapsulation layer at the far driving pad end can be improved, so that the brightness of the micro light emitting diode at the near driving pad end and the micro light emitting diode at the far driving pad end are uniform, which can solve the problem of high brightness at the near driving pad end and low brightness at the far driving pad end caused by voltage drop in the micro light emitting diode display panel, thereby improving the display brightness uniformity.

[0068] Furthermore, in order to make the ink layer 302 have a certain light transmittance, the thickness of the ink layer 302 can be set to be less than or equal to 20 micrometers.

[0069] In some embodiments, the thickness of the ink layer 302 in the first region 31 , the thickness in the third region 33 , and the thickness in the second region 32 decrease sequentially.

[0070] Specifically, Figure 3As shown, by setting the thickness of the ink layer 302 in the first area 31, the thickness in the third area 33 and the thickness in the second area 32 to decrease in sequence, the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33 and the transmittance in the second area 32 can be increased in sequence.

[0071] In some embodiments, the ink layer 302 includes a black material, and the concentration of the black material in the first region 31 of the ink layer 302 , the concentration in the third region 33 of the ink layer 302 , and the concentration in the second region 32 of the ink layer 302 decreases in sequence.

[0072] Specifically, the ink layer 302 includes a black material. In this case, the ink layer 302 is black ink.

[0073] Specifically, by setting the concentration of the black material in the first area 31 of the ink layer 302, the concentration in the third area 33 of the ink layer 302, and the concentration in the second area 32 of the ink layer 302 to decrease in sequence, the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33, and the transmittance in the second area 32 can be increased in sequence.

[0074] Furthermore, the black material in the ink layer 302 may include at least one of carbon black, titanium oxide black, aniline black and the like, but is not limited thereto.

[0075] In this embodiment, the same beneficial effects as those of the above embodiment are achieved, which will not be described in detail herein.

[0076] Embodiment 4

[0077] In this embodiment, a display panel is provided, which includes the display substrate 100 of any one of the above embodiments, and the display substrate 100 is used as a backlight of the display panel, or the micro light emitting diodes 20 of the display substrate 100 are used as display pixels of the display panel.

[0078] Specifically, in some embodiments, the display panel includes a display substrate 100, the display substrate 100 is used as a backlight of the display panel 200, the display substrate 100 is used as a component in the backlight of the display panel, and a display panel body is also provided on the light emitting side of the display substrate 100 or the side of the encapsulation layer 30 away from the driving substrate 10, the display panel body is used to display images, and the display substrate 100 is used as a light source of the display panel body. The display panel body can be a liquid crystal display panel, and the type of the liquid crystal display panel is not limited here. For example, the liquid crystal display panel can be a vertical alignment liquid crystal display panel (VA mode liquid crystal display panel), a fringe field switching liquid crystal display panel (FFS mode or IPS mode liquid crystal display panel), or a twisted nematic liquid crystal display panel (TN mode liquid crystal display panel).

[0079] Specifically, in some embodiments, the micro-LEDs 20 of the display substrate 100 are used as display pixels of the display panel, and the display substrate 100 directly displays images. In this case, the micro-LEDs 20 may include a first LED chip, a second LED chip, and a third LED chip that emit light of different colors. For example, the first LED chip, the second LED chip, and the third LED chip may emit red light, green light, and blue light, respectively, so that the display panel can display color images.

[0080] In the display panel of the present embodiment, the transmittance of the packaging layer at the near driving pad end is reduced, and the transmittance of the packaging layer at the far driving pad end is increased, so that the brightness of the micro light emitting diode at the near driving pad end and the micro light emitting diode at the far driving pad end are uniform. This can solve the problem of high brightness at the near driving pad end and low brightness at the far driving pad end caused by voltage drop in the micro light emitting diode display panel, thereby improving the uniformity of display brightness.

[0081] Embodiment 5

[0082] See also Figures 4 to 8 , Figure 4 A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 5 A schematic diagram of a first process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 6 A schematic diagram of a second process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 7 A schematic diagram of a third process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 8 A fourth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application.

[0083] The embodiment of the present application provides a method for manufacturing a display panel, which can be used to manufacture a display panel including any display substrate 100 of the above embodiments. The method for manufacturing a display panel includes manufacturing steps: step S100, step S200, and step S300.

[0084] Step S100: Provide a driving substrate, on which a driving pad and a plurality of micro-light emitting diodes are disposed, the driving pad being electrically connected to the micro-light emitting diodes, the driving substrate comprising a first end and a second end disposed opposite to each other, the driving pad being disposed at the first end of the driving substrate, and the micro-light emitting diode array being disposed between the first end and the second end on the driving substrate.

[0085] Specifically, Figure 5As shown, a driving substrate 10 is provided, on which a driving pad 40 and a plurality of micro-light emitting diodes 20 are arranged, the driving pad 40 is electrically connected to the micro-light emitting diodes 20, the driving substrate 10 includes a first end 11 and a second end 12 arranged opposite to each other, the driving pad 40 is arranged at the first end 11 of the driving substrate 10, and the micro-light emitting diode 20 array is arranged between the first end 11 and the second end 12 on the driving substrate 10.

[0086] Step S200: forming a layer to be packaged, providing a substrate, and forming a first portion and a second portion of the layer to be packaged on the substrate, wherein the transmittance of the first portion of the layer to be packaged is less than the transmittance of the second portion.

[0087] Specifically, Figure 6 As shown, a layer 60 to be packaged is formed, a substrate 50 is provided, and a first portion 61 and a second portion 62 of the layer 60 to be packaged are formed on the substrate 50, wherein the transmittance of the first portion 61 of the layer 60 to be packaged is less than the transmittance of the second portion 62.

[0088] Step S300: forming a packaging layer, transferring the layer to be packaged onto the driving substrate to form a packaging layer, wherein the packaging layer covers the micro light emitting diode, wherein the first portion of the layer to be packaged forms a first region of the packaging layer, and the second portion of the layer to be packaged forms a second region of the packaging layer, the first region is located on a side of the first end close to the second end and adjacent to the first end, and the second region is located on a side of the second end close to the first end and adjacent to the second end.

[0089] Specifically, Figure 8 , Figure 1 As shown, a packaging layer 30 is formed, and the layer to be packaged 60 is transferred to the driving substrate 10 to form the packaging layer 30, and the packaging layer 30 covers the micro light emitting diode 20, wherein the first portion 61 of the layer to be packaged 60 forms the first region 31 of the packaging layer 30, and the second portion 62 of the layer to be packaged 60 forms the second region 32 of the packaging layer 30, the first region 31 is located on the side of the first end 11 close to the second end 12, and is adjacent to the first end 11, and the second region 32 is located on the side of the second end 12 close to the first end 11, and is adjacent to the second end 12.

[0090] In some embodiments, step S200 also includes: forming a third portion of the layer to be encapsulated on the substrate, the third portion is located between the first portion and the second portion, and the transmittance of the layer to be encapsulated in the first portion, the transmittance in the third portion, and the transmittance in the second portion increase sequentially; step S300 also includes: forming a third region of the encapsulation layer in the third portion of the layer to be encapsulated, the third region is located between the first region and the second region, and the transmittance of the encapsulation layer in the first region, the transmittance in the third region, and the transmittance in the second region increase sequentially.

[0091] Specifically, in some embodiments, Figure 7 As shown, step S200 also includes: forming a third portion 63 of the layer 60 to be encapsulated on the substrate 50, the third portion 63 is located between the first portion 61 and the second portion 62, and the transmittance of the layer 60 to be encapsulated in the first portion 61, the transmittance in the third portion 63, and the transmittance in the second portion 62 increases sequentially; step S300 also includes: the third portion 63 of the layer 60 to be encapsulated forms a third area 33 of the encapsulation layer 30, the third area 33 is located between the first area 31 and the second area 32, and the transmittance of the encapsulation layer 30 in the first area 31, the transmittance in the third area 33, and the transmittance in the second area 32 increases sequentially.

[0092] Specifically, Figure 8 As shown, in step S300 , the layer to be packaged 60 can be first peeled off from the substrate 50 , and then the layer to be packaged 60 is vacuum-adsorbed by the equipment table 70 , and the layer to be packaged 60 is heated, and then the layer to be packaged 60 is packaged on the driving substrate 10 through a molding process.

[0093] In some embodiments, the step S200 includes the following steps: step S210, step S220, and step S230.

[0094] Step S210 : providing a plurality of sub-substrates, forming a first sub-plastic layer to be packaged with a transmittance corresponding to the first portion 61 on one sub-substrate, and forming a second sub-plastic layer to be packaged with a transmittance corresponding to the second portion 62 on another sub-substrate.

[0095] Step S220 : cutting the first sub-glue layer to be encapsulated according to the size of the first area 31 , and cutting the second sub-glue layer to be encapsulated according to the size of the second area 32 .

[0096] Step S230 : providing a substrate 50 , and splicing a first sub-glue layer to be packaged corresponding to the size of the first area 31 and a second sub-glue layer to be packaged corresponding to the size of the second area 32 on the substrate 50 to form a glue layer to be packaged 60 .

[0097] It is easy to understand that through step S210, a third sub-layer of adhesive to be encapsulated with a transmittance corresponding to the third part 63 can be formed; through step S220, the third sub-layer of adhesive to be encapsulated can be cut according to the size of the third area 33; through step S220, the adhesive layer to be encapsulated 60 can also be spliced ​​to form the adhesive layer to be encapsulated, and at this time, the adhesive layer to be encapsulated 60 includes the first part 61, the third part 63 and the second part 62.

[0098] It is easy to understand that the transmittance setting of the first portion 61, the second portion 62, or the first portion 61, the third portion 63, and the second portion 62 can be achieved by any one of the methods in Embodiments 1 to 3.

[0099] The above is a detailed introduction to a display substrate, a display panel and a method for manufacturing a display panel provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display substrate, characterized in that: include: A driving substrate, comprising a first end and a second end arranged opposite to each other; A driving pad, disposed at the first end of the driving substrate; A plurality of micro light emitting diodes, an array is arranged between the first end and the second end of the driving substrate, and the driving pad is electrically connected to the micro light emitting diodes; an encapsulation layer, disposed on the driving substrate and covering the micro-LED, the encapsulation layer comprising a first region and a second region, the first region being located on a side of the first end close to the second end and adjacent to the first end, and the second region being located on a side of the second end close to the first end and adjacent to the second end; Among them, the transmittance of the encapsulation layer in the first area is less than the transmittance in the second area; the encapsulation layer includes an encapsulation body material and a black material doped in the encapsulation body material, and the concentration of the black material in the first area of ​​the encapsulation layer is greater than the concentration of the black material in the second area of ​​the encapsulation layer.

2. The display substrate according to claim 1, wherein: The encapsulation layer further includes a third region located between the first region and the second region, and the transmittance of the encapsulation layer in the first region, the transmittance in the third region, and the transmittance in the second region increase in sequence.

3. The display substrate according to claim 2, wherein: The encapsulation layer includes an encapsulation body material and a black material doped in the encapsulation body material, and the concentration of the black material in the first area of ​​the encapsulation layer, the concentration of the black material in the third area of ​​the encapsulation layer, and the concentration of the black material in the second area of ​​the encapsulation layer decreases sequentially.

4. The display substrate according to claim 2, wherein: The encapsulation layer includes an encapsulation body layer and an ink layer arranged on the encapsulation body layer, the ink layer covers the micro light emitting diode, and the transmittance of the ink layer in the first area of ​​the encapsulation layer, the transmittance in the third area of ​​the encapsulation layer, and the transmittance in the second area of ​​the encapsulation layer increases sequentially.

5. The display substrate according to claim 4, wherein: The thickness of the ink layer in the first area, the thickness in the third area, and the thickness in the second area decreases in sequence.

6. The display substrate according to claim 4, wherein: The ink layer includes a black material, and the concentration of the black material in the first region of the ink layer, the concentration in the third region of the ink layer, and the concentration in the second region of the ink layer decreases in sequence.

7. A display panel, characterized in that: It comprises the display substrate as described in any one of claims 1 to 6, wherein the display substrate is used as a backlight of the display panel, or the micro light emitting diodes of the display substrate are used as display pixels of the display panel.

8. A method for manufacturing a display panel, characterized in that: A display panel as claimed in any one of claims 1 to 6 is prepared, wherein the method for manufacturing the display panel comprises the following steps: Step S100: providing a driving substrate, on which a driving pad and a plurality of micro-light emitting diodes are disposed, the driving pad being electrically connected to the micro-light emitting diodes, the driving substrate comprising a first end and a second end that are oppositely disposed, the driving pad being disposed at the first end of the driving substrate, and the micro-light emitting diode array being disposed between the first end and the second end on the driving substrate; Step S200: forming a layer to be packaged, providing a substrate, and forming a first portion and a second portion of the layer to be packaged on the substrate, wherein the transmittance of the first portion of the layer to be packaged is less than the transmittance of the second portion; Step S300: forming a packaging layer, transferring the layer to be packaged onto the driving substrate to form the packaging layer, wherein the packaging layer covers the micro light emitting diode, wherein a first portion of the layer to be packaged forms a first region of the packaging layer, and a second portion of the layer to be packaged forms a second region of the packaging layer, the first region is located on a side of the first end close to the second end and adjacent to the first end, and the second region is located on a side of the second end close to the first end and adjacent to the second end.

9. The method for manufacturing a display panel according to claim 8, wherein: The step S200 further includes: forming a third portion of the layer to be packaged on the substrate, the third portion being located between the first portion and the second portion, and the transmittance of the layer to be packaged at the first portion, the transmittance at the third portion, and the transmittance at the second portion increasing in sequence; The step S300 also includes: the third part of the layer to be encapsulated forms a third region of the encapsulation layer, the third region is located between the first region and the second region, and the transmittance of the encapsulation layer in the first region, the transmittance in the third region and the transmittance in the second region increase successively.

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