A mechanism suitable for butterfly laser lead forming

Abstract

The present invention discloses a mechanism suitable for forming butterfly laser leads, comprising a base, a lower mold, a U-shaped fixed block, an upper mold and a pressing plate stacked in sequence from bottom to top, a stepped laser placement concave platform is provided in the middle of the lower mold, a first base and a second base of the same specification are provided on the lower molds on both sides of the laser placement concave platform, a group of lead guide holes whose center hole lines are perpendicular to the axis of the laser placement concave platform are provided in the lower mold between the first base and the second base and the laser placement concave platform, the fixed block is placed above the lead guide hole, the first base and the second base are provided on the edges of both sides of the upper mold, and the axis of the pressing plate is perpendicular to the axis of the laser placement concave platform. This mechanism effectively reduces the damage of components during lead forming and improves the coplanarity problem of device leads; and because this mechanism changes the welding method of the butterfly laser, the reliability of welding is effectively improved; and the structure is simple, easy to process, easy to operate, low in cost, and easy to carry.

Description

Technical Field

[0001] The invention relates to a lead forming tool in electronic assembly technology, in particular to a mechanism suitable for forming butterfly laser leads. Background Art

[0002] Butterfly laser is also called DFB laser or DFB butterfly laser. It is a specific wavelength laser, generally using a 14-pin butterfly tube sealed package, with built-in thermoelectric cooler, thermistor, monitoring photodiode, optical isolator, etc. This laser generally has the characteristics of ITU wavelength selectability, high output power, low temperature coefficient, precise wavelength selection, and built-in optical isolator. Due to the above advantages of lasers, they are generally used in long-distance dense wavelength division multiplexing systems, local area networks, wide area networks, and domain area networks.

[0003] The butterfly laser is a 14-pin butterfly tube sealed package component. The lead wires are reserved at the factory. The lead wires are relatively soft and usually need to be fastened to the structure before they can be welded. This makes it easy for the pins and pads to not fit completely. Therefore, the leads usually need to be formed before the device is installed. The traditional lead forming method is generally to clamp the butterfly laser device body with ordinary tools such as flat-nose pliers or tweezers, and then use tweezers to bend the leads on both sides to a certain point between the starting points to form them, and finally visually observe whether the pins meet the size of the pad. The disadvantages of this traditional method are:

[0004] ① Since the operation process uses flat-nose pliers and tweezers to clamp the device body and bend the device leads, this process often causes indentation or deformation damage to the device body or leads.

[0005] ② This method does not have a suitable measuring tool and only relies on traditional craftsmanship to form the shape. It is often impossible to ensure that the distance from the bending starting point to the terminal seal of the device body, the bending radius of the lead wire, and the installation height of the components meet the relevant process standard requirements;

[0006] ③ The butterfly laser leads are relatively soft and have a certain degree of elasticity. The traditional method will cause lead deformation and poor lead coplanarity after lead forming due to the lead characteristics of the device. This makes it difficult to control the matching requirements of the printed circuit board mounting pads after the device is formed.

[0007] Butterfly lasers are traditionally welded using a surface-mount device welding method, which does not produce good lead forming results for butterfly lasers, and over time can lead to poor device solder joint reliability. Summary of the invention

[0008] The purpose of the present invention is to improve the deficiencies of the prior art and provide a butterfly laser lead forming mechanism, which allows the butterfly laser to be converted from a device surface mount welding method to a device through-hole welding method. This mechanism effectively reduces the damage to components during lead forming and improves the coplanarity of device leads; and because this mechanism changes the welding method of the butterfly laser, the reliability of welding is effectively improved; and this structure is simple, easy to process, simple to operate, low in cost, and easy to carry.

[0009] The technical solution for achieving the purpose of the present invention is:

[0010] A mechanism suitable for forming butterfly laser leads comprises a base, a lower mould, a U-shaped fixing block, an upper mould and a pressing plate which are stacked in sequence from bottom to top, a stepped laser placement recess is provided in the middle of the lower mould, a first base and a second base of the same specification are provided on the lower mould on both sides of the laser placement recess respectively, the first base is in the same direction as the laser placement recess, a group of lead guide holes whose center hole lines are perpendicular to the axis of the laser placement recess are provided in the lower mould between the first base, the second base and the laser placement recess, the fixing block is placed above the lead guide holes, a first base and a second base are provided on the edges of both sides of the upper mould respectively, when the upper mould is placed on the lower mould, the first base and the second base are respectively extended into the first base and the second base to form a crimping area, and the axis of the pressing plate is perpendicular to the axis of the laser placement recess.

[0011] The number of the lead guide holes is the same as the number of the leads of the butterfly laser, so as to avoid inconsistency in the forming of the leads.

[0012] The inner sides of the first base and the second base are chamfered to avoid indentations on the leads.

[0013] The laser placement recess comprises a first step and two second steps symmetrical with the first step as the midline, and the first step penetrates the lower mold to avoid damaging the butterfly laser.

[0014] When the butterfly laser lead is formed, the base and the lower mold are fixed to form a forming lower mold by fasteners, the upper mold and the pressure plate are fixed to form a forming upper mold by fasteners, the butterfly laser is placed in the laser placement recess of the lower mold, the lead passes through the lead guide hole accordingly, the fixing block and the forming lower mold are fixed by fasteners, wherein the U-shaped mouth of the fixing block corresponds to the position of the butterfly laser pigtail.

[0015] The edges and corners of the first base, the second base, the first pedestal and the second pedestal are all polished.

[0016] Working process:

[0017] Step 1, fix the upper die and the pressing plate by fasteners to complete the preparation of the forming upper die;

[0018] Step 2, fix the lower die and the base by fasteners to prepare the lower die for forming;

[0019] Step 3, place the butterfly laser horizontally on the laser placement concave platform of the lower mold, place the butterfly laser lead wire into the lead wire guide hole, and then place the fixing block. The U-shaped opening of the fixing block corresponds to the butterfly laser pigtail to avoid damage to the butterfly laser pigtail due to incorrect installation. Finally, fix the fixing block and the lower mold with fasteners to complete the preparation of the forming lower mold;

[0020] Step 4, placing the forming lower die in a device that can apply stress, such as a bench vise or a bench drill press, and operating the device so that the forming upper die is facing the forming lower die, and pressing the forming lower die downward until it fits;

[0021] Step 5, loosen the crimping equipment, remove the forming upper die and the fixing block, and take out the butterfly laser, thus completing the forming of the butterfly laser lead.

[0022] Compared with ordinary forming tools, the more beneficial aspects of this technical solution are: the technical solution is novel and simple in structure. By forming the upper and lower molds, the butterfly laser is passed through the lead guide hole, and the device is converted from a surface mount welding device to a through-hole welding device by pressing and forming, which effectively improves the reliability of the solder joints after welding. Moreover, by using a model with good lead coplanar consistency and using the press-forming method, there will be no obvious indentation or deformation of the device and the lead, thereby improving the consistency and safety of device forming. Then, the tooling effectively increases the safety distance of the formed leads through the lead guide holes to avoid stress damage to the leads at the terminal seal of the device during the forming operation. Most importantly, the tooling can ensure that the formed lead spacing matches the printed circuit board mounting holes, reducing the occurrence of lead re-forming caused by mismatched forming spacing. Moreover, the tooling has a simple structure and is easy to process. Compared with large equipment, it is very low in cost and easy to carry.

[0023] This mechanism effectively reduces the damage to the device during lead forming and solves the problem of coplanarity of the device leads. It has a simple structure, is easy to process, easy to operate, low cost, and easy to carry. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of an embodiment;

[0025] Figure 2 It is a structural schematic diagram of the forming upper die in the embodiment;

[0026] Figure 3 It is a structural schematic diagram of the forming lower die in the embodiment;

[0027] Figure 4 It is a structural schematic diagram of the lower mold in the embodiment.

[0028] In the figure, 1. base 2. lower mold 21. laser placement recess 211. first step 212. second step 22. first base 23. second base 24. lead guide hole 3. fixing block 4. upper mold 41. first base 42. second base 5. pressing plate 6. butterfly laser. DETAILED DESCRIPTION

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

[0030] Example:

[0031] In this example, the butterfly laser 6 is a radial lead component. The device body is a rectangular structure with a length of 30 mm, a width of 15 mm, and a height of 8 mm. The lead length is 25 mm, the lead spacing is 2.5 mm, the lead diameter is 1.2 mm, the printed circuit board is provided with a welding hole diameter of 1.5 mm, the mounting hole spacing is 22.5 mm, and the distance from the component bending starting point to the terminal seal should be greater than 0.75 mm.

[0032] Reference Figure 1 A mechanism suitable for forming butterfly laser leads comprises a base 1, a lower die 2, a U-shaped fixing block 3, an upper die 4 and a pressing plate 5 which are stacked in sequence from bottom to top, wherein a stepped laser placement recess 21 is provided in the middle of the lower die 2, and a first base 22 and a second base 23 of the same specification are provided on the lower die 2 on both sides of the laser placement recess 21, respectively, and the first base 22 is in the same direction as the laser placement recess 21, and a group of lead guide holes 24 whose center hole lines are perpendicular to the axis of the laser placement recess are provided in the lower die 2 between the first base 22 and the second base 23 and the laser placement recess 21, such as Figure 4 As shown, the fixing block 3 is placed above the lead guide hole 24, and the first base 41 and the second base 42 are respectively provided on the edges of both sides of the upper mold 4. When the upper mold 4 is placed on the lower mold 2, the first base 41 and the second base 42 respectively extend into the first base 22 and the second base 23 to form a crimping area, and the axis of the pressing plate 5 is perpendicular to the axis of the laser placement recess 21.

[0033] The number of the lead guide holes 24 is the same as the number of the leads of the butterfly laser 6 .

[0034] The inner sides of the first base 41 and the second base 42 are chamfered.

[0035] The laser placement recess 21 includes a first step 211 and two second steps 212 symmetrical with the first step 211 as the center line. The first step 211 passes through the lower mold 2 .

[0036] When the butterfly laser lead is formed, the base 1 and the lower mold 2 are fixed as a forming lower mold by fasteners, the upper mold 4 and the pressure plate 5 are fixed as a forming upper mold by fasteners, and the butterfly laser 6 is placed in the laser placement recess 21 of the lower mold 2, and the lead passes through the lead guide hole 24 accordingly. The fixing block 3 and the forming lower mold are fixed by fasteners, wherein the U-shaped mouth of the fixing block 3 corresponds to the position of the butterfly laser 6 pigtail.

[0037] The edges and corners of the first base 41, the second base 42, the first pedestal 22 and the second pedestal 23 are all polished.

[0038] In this example, the laser placement recess 21 is used to horizontally place the butterfly laser 6, wherein the second step 212 of the laser placement recess 21 sinks 1.6mm, and the heights of the first base 41 and the second base 42 of the upper mold 4 are both 15mm, which can effectively prevent the butterfly laser 6 from being damaged by close contact with the upper mold 4, and the 14 lead guide holes 24 are used to place device leads. The lead guide holes 24 are set to have a length of 1.45mm and a width of 1.3mm. The chamfering distance of the first base 22 and the second base 23 is 2.3mm, and the distance from the starting point of the component bending to the terminal sealing is 1.45mm (greater than 0.75mm); in addition, the chamfering distance of the first base 22 and the second base 23 and the length of the lead guide hole 24 are set to 3.75mm to match the designed hole spacing of the printed circuit board.

[0039] Working process:

[0040] Step 1, fix the upper mold 4 and the pressing plate 5 by fasteners to complete the preparation of the upper mold, such as Figure 2 As shown;

[0041] Step 2, fix the lower mold 2 and the base 1 by fasteners to complete the preparation of the lower mold;

[0042] Step 3, place the butterfly laser 6 horizontally on the laser placement concave platform 21 of the lower mold 2, place the lead of the butterfly laser 6 into the lead guide hole 24, and then place the fixing block 3, wherein the U-shaped opening of the fixing block corresponds to the butterfly laser pigtail to avoid damaging the butterfly laser pigtail, fix the fixing block 3 and the lower mold 2 with fasteners, and complete the preparation of the forming lower mold, such as Figure 3 As shown;

[0043] Step 4: Place the lower die in a device that can apply stress, such as a bench vise or a bench drill press, and operate the device so that the upper die faces the lower die, and press the lower die downward until it fits. Figure 1 As shown;

[0044] Step 5, loosen the crimping device, remove the forming upper die and the fixing block, and take out the butterfly laser 6, thus completing the forming of the butterfly laser lead.

Claims

1. A mechanism suitable for butterfly laser lead forming, characterized in that: It comprises a base, a lower mold, a U-shaped fixing block, an upper mold and a pressing plate which are stacked in sequence from bottom to top, a stepped laser placement recess is provided in the middle of the lower mold, a first base and a second base of the same specification are provided on the lower mold on both sides of the laser placement recess respectively, the first base is in the same direction as the laser placement recess, a group of lead guide holes whose center hole lines are perpendicular to the axis of the laser placement recess are provided in the lower mold between the first base and the second base and the laser placement recess, the fixing block is placed above the lead guide holes, the first base and the second base are provided on the edges of both sides of the upper mold respectively, when the upper mold is placed on the lower mold, the first base and the second base are respectively extended into the first base and the second base to form a crimping area, and the axis of the pressing plate is perpendicular to the axis of the laser placement recess; The laser placement recess comprises a first step and two second steps symmetrical with the first step as the midline.

2. The mechanism for butterfly laser lead forming according to claim 1, characterized in that: The number of the lead guide holes is the same as the number of the leads of the butterfly laser.

3. The mechanism for butterfly laser lead forming according to claim 1, characterized in that: The inner sides of the first base and the second base are chamfered.

4. The mechanism for butterfly laser lead forming according to claim 1, characterized in that: When the butterfly laser lead is formed, the base and the lower mold are fixed to form a forming lower mold by fasteners, the upper mold and the pressure plate are fixed to form a forming upper mold by fasteners, the butterfly laser is placed in the laser placement recess of the lower mold, the lead passes through the lead guide hole accordingly, the fixing block and the forming lower mold are fixed by fasteners, and the U-shaped mouth of the fixing block corresponds to the position of the butterfly laser pigtail.

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