Highly integrated intelligent power module and air conditioner

Abstract

The application discloses a high-integration intelligent power module and an air conditioner, and relates to the technical field of power modules, and in particular relates to a high-integration intelligent power module and an air conditioner. The high-integration intelligent power module comprises a mounting substrate, a compressor IPM module and a fan IPM module; three-phase compressor floating power supply pins and three-phase compressor output pins which are electrically connected with the compressor IPM module; three-phase fan floating power supply pins and three-phase fan output pins which are electrically connected with the fan IPM module; a plurality of compressor filter capacitors, at least one compressor filter capacitor being arranged in series between each-phase compressor floating power supply pin and the compressor output pin; and a plurality of fan filter capacitors, at least one fan filter capacitor being arranged in series between each-phase fan floating power supply pin and the fan output pin. The application can filter out interference introduced from the peripheral circuit from each-phase floating power supply pin, and avoid the interference from affecting the potential of each-phase floating power supply pin to each-phase output pin.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit technology, and in particular to a highly integrated intelligent power module and an air conditioner. Background Technology

[0002] Intelligent power modules (IPMs) are power drive products that combine power electronics and integrated circuit technology. They are typically used on the control boards of equipment such as fans and compressors. Currently, most driver chips in intelligent power modules use a single power supply. The low-voltage side is directly powered by the DC power supply VCC, while the high-voltage side is in a floating state, powered by a bootstrap circuit composed of external discrete components such as diodes, resistors, and capacitors to improve power utilization. Due to the high integration of intelligent power modules, they are also susceptible to external interference, especially from the floating power supply pins, which can affect the normal operation of the intelligent power module. Summary of the Invention

[0003] The main objective of this invention is to propose a highly integrated intelligent power module and an air conditioner, aiming to improve the electromagnetic interference resistance of the highly integrated intelligent power module.

[0004] To achieve the above objectives, the present invention proposes a highly integrated intelligent power module, the highly integrated intelligent power module comprising:

[0005] The mounting substrate has a high-voltage pin mounting side and a low-voltage pin mounting side arranged opposite to each other on both sides along the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions.

[0006] The compressor IPM module and the fan IPM module are respectively installed in the corresponding mounting positions;

[0007] The three-phase compressor floating power supply pin and the three-phase compressor output pin are installed on the high-voltage pin mounting side. The three-phase compressor floating power supply pin and the three-phase compressor output pin are respectively electrically connected to the compressor IPM module.

[0008] The three-phase fan floating power supply pin and the three-phase fan output pin are installed on the high-voltage pin mounting side. The three-phase fan floating power supply pin and the three-phase fan output pin are respectively electrically connected to the fan IPM module.

[0009] Multiple compressor filter capacitors are disposed at the mounting positions corresponding to the mounting substrate, and at least one compressor filter capacitor is connected in series between the floating power supply pin and the compressor output pin of each phase of the compressor; and...

[0010] Multiple fan filter capacitors are disposed at the mounting positions corresponding to the mounting base plate. At least one fan filter capacitor is connected in series between the floating power supply pin and the output pin of each phase of the fan.

[0011] Optionally, the compressor IPM module includes:

[0012] The compressor inverter power module and the compressor drive chip are installed in the corresponding mounting positions, and the compressor inverter power module and the compressor drive chip are electrically connected.

[0013] Optionally, the number of filter capacitors connected in series between the compressor floating power supply pin and the compressor output pin in each phase is two, namely a first filter capacitor and a second filter capacitor, and the first filter capacitor and the second filter capacitor are connected in parallel.

[0014] Optionally, the first filter capacitor is positioned close to the floating power supply pin and the output pin of the fan.

[0015] The second filter capacitor is positioned close to the compressor drive chip.

[0016] Optionally, the distance between the first filter capacitor and the floating power supply pin of the fan and the output pin of the fan is less than 5mm;

[0017] The distance between the second filter capacitor and the compressor drive chip is less than 10mm.

[0018] Optionally, the wind turbine IPM module includes:

[0019] The fan inverter power module and the fan drive chip are installed in the corresponding mounting positions, and the compressor inverter power module is electrically connected to the fan drive chip.

[0020] Optionally, the filter capacitor connected in series between the floating power supply pin and the output pin of each phase of the fan is located close to the floating power supply pin and the output pin of the fan.

[0021] And / or, located close to the fan drive chip.

[0022] Optionally, the highly integrated intelligent power module further includes:

[0023] The PFC inductor connection terminal is connected to one end of an external inductor.

[0024] The bus capacitor connection terminal is connected to the external bus capacitor.

[0025] The PFC power module includes a PFC power switch and a PFC diode. The input terminal of the PFC power switch is interconnected with the PFC inductor and the anode of the PFC diode. The output terminal of the PFC power switch is connected to the negative terminal of the PFC inductor. The cathode of the PFC diode is connected to the bus capacitor.

[0026] Optionally, the highly integrated intelligent power module further includes:

[0027] A rectifier bridge, the output of which is connected to a PFC inductor.

[0028] The present invention also proposes an air conditioner, including the highly integrated intelligent power module as described above.

[0029] This invention places at least one filter capacitor between the three-phase compressor floating power supply pins and the three-phase compressor output pins of the compressor inverter power module to filter out interference introduced from the external circuitry from each phase compressor floating power supply pin, preventing this interference from affecting the potential of each phase compressor floating power supply pin relative to its respective phase compressor output pin. Simultaneously, a fan filter capacitor is also placed between the three-phase fan floating power supply pins and the three-phase fan output pins of the fan inverter power module to filter out interference introduced from the external circuitry from each phase fan floating power supply pin, preventing this interference from affecting the potential of each phase fan floating power supply pin relative to its respective phase fan output pin. This embodiment can also use the filter capacitor to filter out electromagnetic interference generated by the internal leads of the highly integrated intelligent power module, preventing electromagnetic interference between adjacent traces from coupling to the phase compressor floating power supply pins and affecting the potential of each phase compressor floating power supply pin relative to its respective phase compressor output pin, thus improving the reliability of the intelligent power module. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 This is a functional module diagram of an embodiment of the highly integrated intelligent power module of the present invention;

[0032] Figure 2 This is a schematic diagram of the internal circuit structure of an embodiment of the highly integrated intelligent power module of the present invention;

[0033] Figure 3This is a schematic diagram of the circuit structure of an embodiment of the highly integrated intelligent power module of the present invention applied to an electronic control component;

[0034] Figure 4 This is a schematic diagram of another embodiment of the electronic control component of the present invention.

[0035] Explanation of icon numbers:

[0036] 10 Compressor IPM Module UVW- Compressor low voltage reference pin 20 Fan IPM Module ITRIP Compressor current detection pin 30 PFC power module FUVW- Fan low voltage reference pin 40 rectifier bridge FITRIP Fan current detection pin C1~C6 Compressor filter capacitor VSS3 Single-point grounding pin CF1~CF3 Fan filter capacitor

[0037] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] This invention proposes a highly integrated intelligent power module.

[0040] Reference Figures 1 to 4 In one embodiment of the present invention, the highly integrated smart power module includes:

[0041] The mounting substrate (not shown in the figure) has a high-voltage pin mounting side and a low-voltage pin mounting side arranged opposite to each other on both sides along the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;

[0042] The compressor IPM module 10 and the fan IPM module 20 are respectively installed in the corresponding mounting positions;

[0043] The three-phase compressor floating power supply pins VB1, VB2, VB3 and the three-phase compressor output pins U, V, W are installed on the high-voltage pin mounting side. The three-phase compressor floating power supply pins VB1, VB2, VB3 and the three-phase compressor output pins U, V, W are respectively electrically connected to the compressor IPM module 10.

[0044] The three-phase fan floating power supply pins FVB1, FVB2, FVB3 and the three-phase fan output pins FU, FV, FW are installed on the high-voltage pin mounting side. The three-phase fan floating power supply pins FVB1, FVB2, FVB3 and the three-phase fan output pins FU, FV, FW are respectively electrically connected to the fan IPM module 20; and...

[0045] Multiple compressor filter capacitors (C1~C6, CF1~CF3) are disposed on the mounting base plate. At least one compressor filter capacitor C1~C6 is connected in series between each phase of the compressor floating power supply pin and the compressor output pin.

[0046] Multiple fan filter capacitors are provided, with at least one fan filter capacitor CF1 to CF3 connected in series between the floating power supply pin and the output pin of each phase of the fan.

[0047] In this embodiment, the mounting substrate can be any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting substrate serves as the mounting carrier for the power switching transistors and driving devices. The shape of the mounting substrate can be determined according to the specific location, number, and size of the power switching transistors; it can be square, but is not limited to square. A circuit wiring layer is provided on the mounting substrate. Based on the circuit design of the highly integrated intelligent power module, the circuit wiring layer forms corresponding lines and corresponding mounting positions (pads) for mounting the electronic components in the power switching transistors on the mounting substrate.

[0048] When the mounting substrate is implemented using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When a mounting substrate made of metal material is used, the mounting substrate includes a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In this embodiment, the mounting substrate may be a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate. This insulating layer is used to achieve electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate, as well as to reflect external electromagnetic interference, thereby avoiding external electromagnetic radiation interference with the normal operation of the power switching transistor and reducing the interference effect of electromagnetic radiation in the surrounding environment on the electronic components in the highly integrated intelligent power module. The insulating layer may be made of materials such as thermoplastic or thermosetting adhesive to achieve a fixed connection and insulation between the mounting substrate and the circuit wiring layer. The insulating layer may be implemented as a high thermal conductivity insulating layer made of epoxy resin, alumina, high thermal conductivity filler material, or one or more of these materials. During the fabrication of the mounting substrate, after an insulating layer is set on the mounting substrate, copper foil is laid on the insulating layer, and the copper foil is etched according to the preset circuit design to form a circuit wiring layer.

[0049] The components in the highly integrated intelligent power module can be surface-mount electronic components or bare die wafers. The circuit routing layer has multiple mounting areas according to functional requirements, and multiple mounting positions are formed within each mounting area. Specifically, the circuit routing layer includes circuit wiring that forms current loops, and pads formed from the circuit wiring. The components of the highly integrated intelligent power module are mounted on the corresponding pads. The compressor IPM module 1030 and the fan IPM module 20 can be electrically connected through circuit wiring, metal bonding wires, etc. It is understood that when mounting electronic components on the mounting substrate 100, copper plating can also be applied to the entire circuitry of the mounting substrate 100 to meet interference voltage standards and improve interference immunity.

[0050] The compressor IPM module 10 is used to drive the compressor, and the fan IPM module 20 is used to drive the fan. The compressor IPM module 10 includes:

[0051] The compressor inverter power module 11 and the compressor drive chip IC1 are installed in the corresponding mounting positions, and the compressor inverter power module 11 and the compressor drive chip IC1 are electrically connected.

[0052] The wind turbine IPM module 20 includes:

[0053] The wind turbine inverter power module 21 and the wind turbine drive chip IC2 are installed in the corresponding mounting positions, and the wind turbine inverter power module 21 and the wind turbine drive chip IC2 are electrically connected.

[0054] In this embodiment, the compressor IPM module 10 also includes a compressor driver chip IC1. The number of compressor driver chips IC1 can be one, such as an HVIC driver chip. This compressor driver chip IC1 is an integrated chip, integrating four, six, or seven drive circuits for power switching transistors. The integration can be configured according to the number of power switching transistors being driven. The number of compressor driver chips IC1 can also correspond to the number of power switching transistors, meaning each compressor driver chip IC1 drives one power switching transistor. When the intelligent power module is working, the compressor driver chip IC1 outputs corresponding control signals to control the power switching transistors in the PFC power module 30 and the compressor inverter power module 11 to conduct, thereby outputting drive power to drive loads such as motors.

[0055] The compressor inverter power module 11 is equipped with multiple power switching transistors, which can be gallium nitride (GaN) power switching transistors, Si-based power switching transistors, or SiC-based power switching transistors. In practical applications, the number of power switching transistors can be four, or a multiple of four, or six, or a multiple of six. Six power switching transistors (T1 to T6) form an inverter circuit to drive the compressor.

[0056] The compressor drive chip IC1 includes a high-pressure side drive unit and a low-pressure side drive circuit. The input terminal of the compressor drive chip IC1 is connected to the main controller, i.e., the MCU. The MCU integrates a logic controller, memory, data processor, and software programs and / or modules stored in the memory and executable on the data processor. By running or executing the software programs and / or modules stored in the memory, and by calling the data stored in the memory, the MCU outputs corresponding control signals to the compressor drive chip IC1 to drive the power switch in the compressor inverter power module 11 to turn on / off according to the control signals of the main controller, thereby driving the compressor to work.

[0057] The wind turbine IPM module 20 also includes a wind turbine driver chip IC2. The number of wind turbine driver chips IC2 can be one, such as an HVIC driver chip. This wind turbine driver chip IC2 is an integrated chip, integrating four, six, or seven drive circuits for power switching transistors. The integration can be configured according to the number of power switching transistors being driven. The number of wind turbine driver chips IC2 can also correspond to the number of power switching transistors, meaning each wind turbine driver chip IC2 drives one power switching transistor. When the intelligent power module is operating, the wind turbine driver chip IC2 outputs corresponding control signals to control the power switching transistors in the wind turbine inverter power module 21 to conduct, thereby outputting drive power to drive the motor and other loads.

[0058] The wind turbine inverter power module 21 is equipped with multiple power switching transistors, which can be gallium nitride (GaN) power switching transistors, Si-based power switching transistors, or SiC-based power switching transistors. In practical applications, the number of power switching transistors can be four, or a multiple of four, or six, or a multiple of six. Six power switching transistors (TF1 to TF6) form an inverter circuit to drive the wind turbine.

[0059] The wind turbine drive chip IC2 includes both a high-voltage side drive unit and a low-voltage side drive circuit. The input terminal of the wind turbine drive chip IC2 is connected to the main controller, i.e., the MCU. The MCU integrates a logic controller, memory, data processor, and software programs and / or modules stored in the memory and executable on the data processor. The MCU outputs corresponding control signals to the wind turbine drive chip IC2 by running or executing the software programs and / or modules stored in the memory, and by calling data stored in the memory. This drives the power switching transistors in the wind turbine inverter power module 21 to turn on / off according to the control signals from the main controller, thereby driving the wind turbine to operate.

[0060] The main controller can be independent of the intelligent power module 100. In practical applications, the main controller and the highly integrated intelligent power module are mounted on an electronic control board and electrically connected via circuit wiring or wires. Alternatively, in other embodiments, the main controller can be highly integrated into the intelligent power module 100 to improve the integration level of the intelligent power module.

[0061] Reference Figure 3This embodiment uses IGBTs as the power switching transistors in the compressor inverter power module 11 and an HVIC chip as the driver chip 101 as an example. The VCC terminal of HVIC IC1 serves as the positive terminal VDD of the low-voltage power supply for the highly integrated intelligent power module, typically 15V. The HIN1 terminal of HVIC IC1 serves as the U-phase upper bridge arm input terminal HIN1 of the highly integrated intelligent power module. The HIN2 terminal of HVIC IC1 serves as the V-phase upper bridge arm input terminal HIN2 of the highly integrated intelligent power module. The HIN3 terminal of HVIC IC1 serves as the W-phase upper bridge arm input terminal HIN3 of the highly integrated intelligent power module. The LIN1 terminal of HVIC IC1 serves as the U-phase lower bridge arm input terminal LIN1 of the highly integrated intelligent power module. The LIN2 terminal of C1 serves as the V-phase lower bridge arm input terminal VLIN of the highly integrated intelligent power module; the LIN3 terminal of the HVIC transistor IC1 serves as the W-phase lower bridge arm input terminal LIN3 of the highly integrated intelligent power module; here, the six inputs of the U, V, and W phases of the highly integrated intelligent power module receive 0-5V input signals; the VSS terminal of the HVIC transistor IC1 serves as the negative terminals VSS1 and VSS3 of the low-voltage power supply of the highly integrated intelligent power module, wherein the VSS1 pin is on the logic side, adjacent to low-voltage pins such as VDD, and the VSS3 pin is on the high-voltage side, adjacent to UVW- and ITRIP pins; the ITRIP terminal of the HVIC transistor IC1 serves as the negative terminals VSS1 and VSS3 of the low-voltage power supply of the highly integrated intelligent power module. The RIP terminal serves as the overcurrent protection detection terminal VSS3 of the highly integrated intelligent power module; the VB1 terminal of the HVIC transistor IC1 serves as the positive terminal UVB of the U-phase high-voltage power supply of the highly integrated intelligent power module; the HO1 terminal of the HVIC transistor IC1 is connected to the gate of the U-phase upper bridge arm IGBT T1; the VS1 terminal of the HVIC transistor IC1 is connected to the emitter of the IGBT T1, the anode of the FRD transistor D1, the collector of the U-phase lower bridge arm IGBT T4, and the cathode of the FRD transistor T4, and serves as the negative terminal UVS of the U-phase high-voltage power supply of the highly integrated intelligent power module; the VB2 terminal of the HVIC transistor IC1 serves as the positive terminal UVB of the highly integrated intelligent power module. The high-voltage power supply positive terminal VVB of the U-phase high-voltage zone of the power module; the HO3 terminal of the HVIC transistor IC1 is connected to the gate of the upper bridge arm IGBT T3 of the V-phase; the VS2 terminal of the HVIC transistor IC1 is connected to the emitter of the IGBT T2, the anode of the FRD transistor D2, the collector of the lower bridge arm IGBT T5 of the V-phase, and the cathode of the FRD transistor D5, and serves as the negative terminal VVS of the high-voltage power supply of the W-phase high-voltage zone of the high-integration intelligent power module; the VB3 terminal of the HVIC transistor IC1 serves as the positive terminal WVB of the high-voltage power supply of the W-phase high-voltage zone of the high-integration intelligent power module; the HO3 terminal of the HVIC transistor IC1 is connected to the gate of the upper bridge arm IGBT T3 of the W-phase.The VS3 terminal of HVIC IC1 is connected to the emitter of IGBT T3, the anode of FRD D3, the collector of IGBT T6 in the lower bridge arm of phase W, and the cathode of FRD T6, and serves as the negative terminal WVS of the high-voltage power supply for the phase W of the highly integrated intelligent power module; the LO1 terminal of HVIC IC1 is connected to the gate of IGBT T4; the LO2 terminal of HVIC IC1 is connected to the gate of IGBT T5; the LO3 terminal of HVIC IC1 is connected to the gate of IGBT T6; the LO3 terminal of HVIC IC1 is connected to the gate of IGBT T6; the emitter of IGBT T4 is connected to the anode of FRD T4. The emitter of IGBT T5 is connected to the anode of FRD D5 and serves as the three-phase low-voltage reference pin UVW- of the highly integrated intelligent power module; the emitter of IGBT T6 is connected to the anode of FRD T6 and serves as the three-phase low-voltage reference pin UVW- of the highly integrated intelligent power module; the collector of IGBT T1, the cathode of FRD D1, the collector of IGBT T2, the cathode of FRD D2, the collector of IGBT T3, and the cathode of FRD D3 are connected and serve as the high-voltage input terminal P of the highly integrated intelligent power module, which is typically connected to 300V. The function of the HVIC transistor IC1 is to transmit the 0-5V logic signals from the input terminals HIN1, HIN2, HIN3 and LIN1, FLIN2, FLIN3 to the output terminals FHO1, FHO2, FHO3 and FLO1, FLO2, FLO3, respectively. FHO1, FHO2, FHO3 are logic signals from VS to VS+15V, while FLO1, FLO2, FLO3 are logic signals from 0 to 15V. Overcurrent protection is achieved by detecting the current output of UVW- via ITRIIP.

[0062] In the above embodiments, an RC filter circuit is also provided between each input terminal of the compressor IPM module 10 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current-limiting resistor and a pull-up resistor are also provided between the temperature feedback pin TH of the compressor IPM module 10 and the MCU. A current-limiting resistor and a pull-up resistor are also provided between the fault feedback pin and the MCU. A compressor filter capacitor is provided between the power supply terminal and the ground terminal of the compressor driver chip IC1 to filter out electromagnetic interference between the external power supply and the power supply terminal of the compressor driver chip IC1.

[0063] This embodiment uses IGBTs as the power switching transistors in the wind turbine inverter power module 21 and an FHVIC chip as the wind turbine driver chip IC2 as an example. The VCC terminal of the wind turbine HVIC IC2 serves as the positive terminal FVDD of the low-voltage power supply for the highly integrated intelligent power module, typically 15V; the HIN1 terminal of the HVIC IC2 serves as the upper U-phase bridge arm input FHIN1 of the highly integrated intelligent power module; the HIN2 terminal of the wind turbine HVIC IC2 serves as the upper V-phase bridge arm input VFHIN of the highly integrated intelligent power module; the HIN3 terminal of the wind turbine HVIC IC2 serves as the upper W-phase bridge arm input HIN2 of the highly integrated intelligent power module; and the LIN1 terminal of the wind turbine HVIC IC2 serves as the lower U-phase bridge arm input FLIN1 of the highly integrated intelligent power module. The LIN2 terminal of the fan HVIC transistor IC2 serves as the V-phase lower bridge arm input terminal FLIN2 of the highly integrated intelligent power module; the LIN3 terminal of the fan HVIC transistor IC2 serves as the W-phase lower bridge arm input terminal FLIN3 of the highly integrated intelligent power module; here, the six inputs of the U, V, and W phases of the highly integrated intelligent power module receive 0-5V input signals; the GND terminal of the fan HVIC transistor IC2 serves as the negative terminal VSS2 of the low-voltage power supply of the highly integrated intelligent power module, wherein the VSS2 pin is on the logic side, adjacent to low-voltage pins such as FVDD, and the VSS3 pin is on the high-voltage side, adjacent to UVW- and FITRIP pins; the fan HVI The ITRIP terminal of IC2 (C-type transistor) serves as the overcurrent protection detection terminal FITRIP of the highly integrated intelligent power module; the VB1 terminal of IC1 (HVIC-type transistor) serves as the positive terminal UVB of the U-phase high-voltage power supply of the highly integrated intelligent power module; the HO1 terminal of HVIC2 is connected to the gate of IGBT FT1 in the upper bridge arm of the U-phase; the VS1 terminal of HVIC2 is connected to the emitter of IGBT FT1, the anode of FRD D1, the collector of IGBT FT4 in the lower bridge arm of the U-phase, and the cathode of FRD FT4, and serves as the negative terminal UVS of the U-phase high-voltage power supply of the highly integrated intelligent power module; the VB2 terminal of IC2 (HVIC-type transistor) serves as the positive terminal UVB of the high-voltage power supply of the highly integrated intelligent power module. The U-phase high-voltage power supply positive terminal VVB of the integrated intelligent power module; the HO3 terminal of the fan HVIC tube IC2 is connected to the gate of the V-phase upper bridge arm IGBT FT3; the VS2 terminal of the HVIC2 is connected to the emitter of the IGBT FT2, the anode of the FRD tube, the collector of the V-phase lower bridge arm IGBT FT5, and the cathode of the FRD tube, and serves as the W-phase high-voltage power supply negative terminal VVS of the highly integrated intelligent power module; the VB3 terminal of the fan HVIC tube IC2 serves as the W-phase high-voltage power supply positive terminal WVB of the highly integrated intelligent power module; the HO3 terminal of the fan HVIC tube IC2 is connected to the gate of the W-phase upper bridge arm IGBT FT3.The VS3 terminal of the fan HVIC IC2 is connected to the emitter of the IGBT FT3, the anode of the FRD, the collector of the W-phase lower bridge arm IGBT FT6, and the cathode of the FRD FT6, and serves as the negative terminal WVS of the W-phase high-voltage power supply for the highly integrated intelligent power module; the LO1 terminal of the fan HVIC IC2 is connected to the gate of the IGBT FT4; the LO2 terminal of the fan HVIC IC2 is connected to the gate of the IGBT FT5; the LO3 terminal of the fan HVIC IC2 is connected to the gate of the IGBT FT6; the emitter of the IGBT FT4 is connected to the FRD... The anode of FT4 is connected and serves as the three-phase low-voltage reference pin UVW- of the highly integrated intelligent power module; the emitter of IGBT FT5 is connected to the anode of the FRD and serves as the three-phase low-voltage reference pin UVW- of the highly integrated intelligent power module; the emitter of IGBT FT6 is connected to the anode of the FRD FT6 and serves as the three-phase low-voltage reference pin UVW- of the highly integrated intelligent power module; the collector of IGBT FT1, the cathode of the FRD, the collector of IGBT FT2, the cathode of the FRD, the collector of IGBT FT3, and the cathode of the FRD are connected and serve as the high-voltage input terminal P of the highly integrated intelligent power module, which is typically connected to 300V. The function of the HVIC transistor IC2 in the fan is to transmit the 0-5V logic signals from the input terminals FHIN1, FHIN2, FHIN3 and FLIN1, FLIN2, LIN3 to the output terminals HO1, HO2, HO3 and LO1, LO2, LO3, respectively. HO1, HO2, HO3 are logic signals from VS to VS+15V, and LO1, LO2, LO3 are logic signals from 0 to 15V. Overcurrent protection is achieved by detecting the UVW-output current through the ITRIP.

[0064] In the above embodiments, an RC filter circuit is also provided between each input terminal of the fan IPM module 20 and the MCU, and each RC filter circuit is equipped with a capacitor R1 and a resistor R3. A current-limiting resistor and a pull-up resistor are also provided between the temperature feedback pin TH of the fan IPM module 20 and the MCU. A current-limiting resistor and a pull-up resistor are also provided between the fault feedback pin and the MCU. A fan filter capacitor is provided between the power supply terminal and the ground terminal of the fan driver chip IC2 to filter out electromagnetic interference between the external power supply and the power supply terminal of the fan driver chip IC2. A fan filter capacitor is provided between the power supply terminal and the ground terminal of the fan driver chip IC2 to filter out electromagnetic interference between the external power supply and the power supply terminal of the fan driver chip IC2.

[0065] The pins of the highly integrated intelligent power module can be implemented using gull-wing pins or through-hole pins. In this embodiment, through-hole pins are preferred. The pads on the mounting positions corresponding to the above pins are electrically connected to the compressor driver chip IC1 and the fan driver chip IC2 through metal wires.

[0066] It should be noted that, as microelectronic devices, considering the application environment of microelectronics, the area of ​​the mounting substrate should not be too large. That is, within a limited area, mounting the compressor IPM module 10 and the fan IPM module 20 on the mounting substrate involves numerous circuit lines. Therefore, it is necessary to consider signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between circuit lines, and the strong and weak current isolation between the driver ICs in the compressor IPM module 10 and the fan IPM module 20 and the power switching transistors in the inverter module, as well as the isolation between heat sources of high-power devices and non-heat sources such as the driver ICs. Therefore, when manufacturing highly integrated intelligent power modules, it is necessary to consider not only the size of the highly integrated intelligent power module, but also the strong and weak current isolation between devices, the isolation between heat sources and non-heat sources, and ensuring that the line spacing and line width meet safety specifications. Due to the dense circuitry and the long distances between devices and between devices and pins, the traces inevitably have many bends in order to avoid other parts, further increasing the distance. At the same time, parasitic inductance is easily formed on the leads, and parasitic capacitance is easily formed between the dense circuits.

[0067] In intelligent power modules, the compressor driver chip IC1 and fan driver chip IC2 mostly use a single power supply. The low-voltage side is directly powered by a DC power supply, while the high-voltage side is in a floating state. Therefore, a floating power supply is mostly used to power the high-voltage side drive circuit. Common floating power supply methods include bootstrap capacitor power supply and charge pump power supply. The bootstrap capacitor type uses a bootstrap circuit composed of external diodes, resistors, and capacitors to provide power, thereby improving the utilization rate of the power supply.

[0068] For example, when the lower arm power transistor of the half-bridge structure in the power inverter module is turned on and the upper arm power transistor is turned off, the high-side floating power supply decreases as the high-side floating ground voltage decreases. When the high-side floating power supply drops below the DC power supply voltage and the voltage difference between the two exceeds the forward voltage drop of the bootstrap diode, the DC power supply charges the bootstrap capacitor through the bootstrap diode. When the upper arm power transistor is turned on and the lower arm power transistor is turned off, the high-side floating power supply increases as the high-side floating ground voltage increases. The high-side floating power supply voltage far exceeds the DC power supply voltage, the bootstrap diode is cut off, and the bootstrap capacitor supplies power to the high-voltage side circuit. The bootstrap floating power supply pin VB is used to supply power to the gate of the upper bridge IGBT. If it is interfered with, it can easily lead to IGBT false triggering, and in severe cases, it can burn out the highly integrated intelligent power module. Furthermore, in highly integrated intelligent power modules, due to the increased power density and numerous circuit wirings, electromagnetic interference is aggravated, making VB particularly susceptible to interference.

[0069] Therefore, in this embodiment, at least one compressor filter capacitor is placed between the three-phase compressor floating power supply pins VB1, VB2, VB3 and the three-phase compressor output pins U, V, W of the compressor inverter power module 11 to filter out interference introduced from the external circuit from each phase compressor floating power supply pin, preventing these interferences from affecting the potential of each phase compressor floating power supply pin to its respective phase compressor output pin. Simultaneously, a fan filter capacitor is also placed between the three-phase fan floating power supply pins FVB1, FVB2, FVB3 and the three-phase fan output pins FU, FV, FW of the fan inverter power module 21 to filter out interference introduced from the external circuit from each phase fan floating power supply pin, preventing these interferences from affecting the potential of each phase fan floating power supply pin to its respective phase fan output pin. This embodiment can also filter out electromagnetic interference generated by the internal leads of the highly integrated intelligent power module through each filter capacitor, preventing electromagnetic interference between adjacent traces from coupling to the phase compressor floating power supply pins and affecting the potential of each phase compressor floating power supply pin to its respective phase compressor output pin, thus improving the reliability of the intelligent power module.

[0070] Reference Figure 2 and Figure 3 To further improve the filtering capability, in the above embodiment, the number of compressor filter capacitors connected in series between the compressor floating power supply pin and the compressor output pin of each phase is two. The two compressor filter capacitors are the first filter capacitor C1, C2, C3 and the second filter capacitor C4, C5, C6, respectively. The first filter capacitor C1, C2, C3 and the second filter capacitor C4, C5, C6 are connected in parallel.

[0071] The first filter capacitors C1, C2, and C3 are located on the mounting base plate near the floating power supply pins VB1, VB2, and VB3 of the fan and the output pins U, V, and W of the fan.

[0072] In this embodiment, one of the two filter capacitors connected in series between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pins U, V, W of each phase is located near the fan floating power supply pins VB1, VB2, VB3 and the fan output pins U, V, W, while the other of the two filter capacitors connected in series between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pins U, V, W of each phase is located near the compressor driver chip IC1.

[0073] The first filter capacitor is placed near the pins, with a distance of less than 5mm from the compressor floating power supply pin and the compressor output pin. The second filter capacitor is placed near the compressor driver chip IC1, with a distance of less than 10mm from the compressor driver chip IC1. The filter capacitors located near the pins are used to filter out interference from external circuits transmitted through the pins, preventing this interference from affecting the potential of the compressor floating power supply pin to the compressor output pin, or interfering with adjacent traces. Since there is a relatively long trace distance from the compressor floating power supply pin and the compressor output pin to the compressor driver chip IC1, this trace may be subject to electromagnetic interference from surrounding traces, leading to voltage instability. Therefore, the filter capacitors located near the compressor driver chip IC1 are used to filter out this interference, ensuring that it does not affect the normal operation of the compressor driver chip IC1. The second filter capacitors C4, C5, and C6 are positioned on the mounting substrate near the compressor driver chip IC1. Specifically, filter capacitors C1 and C4 are connected in series between the floating power supply pin VB1 of the U-phase compressor and the output pin U of the U-phase compressor. The first filter capacitor C1 is located near the floating power supply pin VB1 of the U-phase compressor and the output pin U of the U-phase compressor, and the second filter capacitor C4 is located near the compressor driver chip IC1. Filter capacitors C2 and C5 are connected in series between the floating power supply pin B1 of the V-phase compressor and the output pin V of the V-phase compressor. The second filter capacitor C2 is located near the floating power supply pin VB2 of the V-phase compressor and the output pin V of the V-phase compressor, and the second filter capacitor C5 is located near the compressor driver chip IC1. Filter capacitors C3 and C6 are connected in series between the floating power supply pin VB3 of the W-phase compressor and the output pin V of the W-phase compressor. The first filter capacitor C3 is located near the floating power supply pin VB3 of the W-phase compressor and the output pin V of the W-phase compressor, and the second filter capacitor C4 is located near the compressor driver chip IC1.

[0074] Reference Figure 2 and Figure 3In one embodiment, the fan filter capacitors CF1, CF2, and CF3, connected in series between the floating power supply pins FVB1, FVB2, and FVB3 of each phase of the fan and the output pins U, FV, and FW of the fan, are positioned close to the floating power supply pins FVB1, FVB2, and FVB3 of the fan and the output pins U, FV, and FW of the fan; and / or close to the fan driver chip IC2. That is, a fan filter capacitor CF1 is connected in series between the floating power supply pin FVB1 of the U phase fan and the output pin U of the U phase fan; a fan filter capacitor CF2 is connected in series between the floating power supply pin FVB2 of the V phase fan and the output pin U of the V phase fan; and a fan filter capacitor CF3 is connected in series between the floating power supply pin FVB3 of the W phase fan and the output pin W of the W phase fan.

[0075] In this embodiment, it is understood that the power of the compressor motor is greater than that of the fan motor. Therefore, when driving the compressor and fan, the power of the power devices in the compressor IPM module 10 is greater than that in the fan IPM module 20. Furthermore, compared to the compressor inverter power module 11, the drive current of the fan inverter power module 21 is also smaller, i.e., the operating current is smaller, resulting in relatively less interference. Therefore, only one set of fan filter capacitors is needed. This set of fan filter capacitors can be placed next to the pins to filter out interference from the external circuits transmitted through the pins, preventing these interferences from affecting the potential of the fan floating power supply pin to the fan output pin, or interfering with adjacent traces. Since there is a relatively long trace distance from the fan floating power supply pin and the fan output pin to the fan driver chip IC2, this trace may be subject to electromagnetic interference from surrounding traces, leading to voltage instability. The fan filter capacitors can also be placed on the fan driver chip IC2 to filter out these interferences and ensure that they do not affect the normal operation of the compressor driver chip IC1.

[0076] Reference Figure 2 and Figure 3 In one embodiment, the highly integrated smart power module further includes:

[0077] The PFC inductor connection terminal PFC+ is connected to one end of an external inductor.

[0078] Bus capacitor connection terminal P is connected to an external bus capacitor;

[0079] PFC power module 30, the PFC power module 30 includes a PFC power switch and a PFC diode, the input terminal of the PFC power switch is interconnected with the PFC inductor connection terminal and the anode of the PFC diode, the output terminal of the PFC power switch is connected to the negative terminal of the PFC inductor; the cathode of the PFC diode is connected to the bus capacitor connection terminal.

[0080] In this embodiment, one end of the external inductor is connected to the positive output terminal DC+ of the rectifier bridge 10, and the other end of the external inductor is connected to the negative output terminal DC- of the rectifier bridge 10 via the PFC power switch T7. The external inductor, bus capacitor, rectifier bridge 10, PFC diode D8, and PFC power switch T7 constitute a complete PFC circuit. The PFC circuit can be a boost PFC circuit, a buck PFC circuit, or a buck-boost PFC circuit. In this embodiment, a boost PFC circuit can be selected, that is, the PFC diode D8 is a boost diode. In the PFC power switch module 30, only the PFC power switch T7 and the PFC diode D8 can be integrated into the intelligent power module, or the PFC circuit composed of the bus capacitor, inductor, and other components can be integrated into the intelligent power module. In this embodiment, due to size and other factors, they are not integrated into the intelligent power module. The PFC circuit adjusts the power factor of the DC power, and the adjusted DC power is output to the power input terminal of the inverter bridge circuit 10 so that each power module drives the corresponding load. The adjusted DC power can also generate a 5V operating voltage to drive the chip, providing operating voltage for the main controller and other circuit modules.

[0081] During the operation of the PFC power module 30, there are two working processes: voltage boost and energy storage. During voltage boost, the PFC power switch T7 is off. The external inductor outputs the electrical energy from the rectifier bridge 10 and the stored electrical energy through the PFC diode D8 to the compressor inverter power module 11 and the fan inverter power module 21 for energy release, which is then used to charge the bus capacitor, thus achieving voltage boost. When the PFC power switch T7 is on, the external inductor is connected to the negative output terminal of the rectifier bridge 10 through the PFC power switch T7 for energy storage.

[0082] In the above embodiment, the PFC power switch T7 is positioned close to the rectifier bridge 10, while the PFC diode D8 is positioned close to the IPM module 30. This arrangement can shorten the lead length between the PFC power switch T7 and the rectifier bridge 10, as well as the lead length between the PFC diode D8 and the compressor inverter power module 11. It can also prevent the PFC power switch T7 from causing electromagnetic interference to the compressor inverter power module 11.

[0083] Reference Figure 2 and Figure 3 In one embodiment, the output terminal of the PFC power switch is electrically connected to the single-point ground pin VSS3;

[0084] And / or, the output terminal of the PFC power switch is electrically connected to the ground terminal of the compressor drive chip IC1.

[0085] In this embodiment, the output pin of the PFC power switch, i.e., the emitter of the PFC IGBT (T7), is located on the high-voltage pin mounting side. The output of the PFC power switch can be electrically connected to the single-point ground pin VSS3 via internal traces. Alternatively, the output of the PFC power switch can be directly electrically connected to the ground terminal VSS1 of the compressor driver chip IC1 via internal traces. This shortens the trace distance between the PFC power switch and the low-voltage ground pin of the compressor driver chip IC1, thereby reducing parasitic inductance on the traces. Due to the reduction in parasitic inductance, the problem of false triggering of highly integrated intelligent power modules can be solved. At the same time, the drive loop from HVIC to the IGBT gate, then to the emitter, and back to the HVIC ground terminal can be minimized, thereby improving the switching speed of the PFC power switch.

[0086] Reference Figure 2 and Figure 3 In one embodiment, the highly integrated smart power module further includes:

[0087] A rectifier bridge 40, the output of which is connected to a PFC inductor.

[0088] In this embodiment, the rectifier bridge 40 includes a first diode D9, a second diode D10, a third diode D11, and a fourth diode D12. The first diode D9 and the second diode D10 are disposed on one sub-mounting position; the third diode D11 and the fourth diode D12 are disposed on two different mounting positions; the anode of the first diode D9 is electrically connected to the cathode of the third diode D11, and the cathode of the first diode D9 is electrically connected to the cathode of the second diode D10; the anode of the second diode D10 is electrically connected to the cathode of the fourth diode D12. In this embodiment, the first diode D9 and the second diode D10 are two diodes with a common cathode, and the third diode D12 and the fourth diode D12 are two diodes with a common anode. The two diodes with a common anode are disposed on one sub-mounting position and electrically connected through this mounting position, while the two diodes with a common cathode are respectively mounted on two different sub-mounting positions and electrically connected through another mounting position. In this way, the number of mounting positions can be reduced, thereby reducing the area of ​​the rectifier bridge 40 on the mounting substrate 100, making the highly integrated intelligent power module structure compact and reducing the overall area. It can also reduce the number of wiring and soldering steps.

[0089] It is understandable that when the intelligent power module is applied to refrigeration equipment, such as air conditioners and refrigerators, the IPM module 30 can be used to drive components such as fans and compressors. That is, in this embodiment, the rectifier bridge 40, compressor IPM module 10, and PFC power module 30 are integrated into one unit to form a three-in-one compressor intelligent power module. Alternatively, the rectifier bridge 40, fan IPM module 20, and PFC power module 30 can be integrated into one unit to form a three-in-one fan intelligent power module. Of course, in other embodiments, the rectifier bridge 40, PFC power module 30, compressor IPM module 10, and fan IPM module 20 can also be integrated into one unit to form a four-in-one highly integrated intelligent power module. A surge current protection circuit is also provided between the output terminal of the rectifier bridge 40 and the PFC power module 30 to absorb the surge current between the output of the rectifier bridge 40 and the PFC power module 30, so as to avoid damaging the PFC diodes in the PFC power module 30.

[0090] Reference Figure 2 and Figure 3It should be noted that, in order to avoid damage to the motor and the highly integrated intelligent power module when the motor is overcurrent, an overcurrent protection function is integrated into the highly integrated intelligent power module. Specifically, on the mounting base of the highly integrated intelligent power module, there are compressor overcurrent detection pins (abbreviated as ITRIP) and fan overcurrent detection pins (FITRIP) for the compressor and fan, respectively, to detect the voltage drop across the external current sensing resistor 201. When the voltage drop exceeds a certain threshold, the level on the compressor overcurrent detection pin and the fan overcurrent detection pin (FITRIP) flips, for example, from high level to low level, or from low level to high level, thereby triggering the protection function of the internal IC of the IPM, and the module stops working to achieve the protection function. Furthermore, when highly integrated intelligent power modules are applied in electrical appliances such as air conditioners, refrigerators, and washing machines, or in frequency converters, both the highly integrated intelligent power modules and external sampling resistors are mounted on the control board (e.g., a PCB board). Considering the application environment of microelectronics, the area of ​​the mounting substrate should not be too large. That is, within a limited area, mounting the compressor IPM module 10 and the fan IPM module 20 on the mounting substrate requires consideration of signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between circuit wiring, and strong and weak current isolation between the driver IC in the compressor IPM module 10 and the fan IPM module 20 and the power switching transistor in the inverter module, as well as isolation between the heat source of high-power devices and non-heat sources such as the driver IC. Therefore, the wiring on the control board PCB should be grounded at a single point as much as possible. In particular, the strong ground (the emitter output of the lower bridge IGBT) and the weak ground (the VSS or COM pin of the IPM and the ground terminal of the MCU) should be connected through a single point. Usually, a single-point grounding point is set on the control board. Furthermore, in actual wiring, parasitic inductance is introduced into the lines, which can significantly affect current detection. However, the lower bridge emitter pins of the compressor IPM and fan IPM modules 20 are generally placed together with the high-voltage pins to shorten the high-voltage, high-current traces; the compressor current detection pin (ITRIP) and logic ground pins are generally placed together with other low-voltage logic pins to shorten the distance from other logic pins to logic ground. In addition, the lower bridge emitter pins between the compressor IPM and fan IPM modules 20 are usually positioned far apart, and a grounding pin is typically not provided on the high-voltage side. This increases the trace length and distance between the highly integrated intelligent power module and external components on the PCB, potentially increasing parasitic inductance, leading to inaccurate overcurrent protection, or making the logic ground susceptible to high-voltage ground interference.

[0091] Therefore, in this embodiment, the compressor low-voltage reference pin UVW-, the fan low-voltage reference pin FUVW-UVW-, the compressor current detection pin ITRIP, the fan current detection pin FITRIP, and the single-point grounding pin VSS3 are all located on the high-voltage pin mounting side. The compressor current detection pin ITRIP is electrically connected to the current feedback terminal of the compressor driver chip IC1 through wiring and binding on the internal circuit wiring layer of the highly integrated intelligent power module. Furthermore, two grounding terminals VSS are provided on the compressor driver chip IC1. The single-point grounding pin on the high-voltage side and the low-voltage grounding pin VSS1 on the low-voltage side are electrically connected within the compressor driver chip IC1. Thus, the single-point grounding pin VSS3 can be electrically connected to the low-voltage power supply of the compressor driver chip IC1 through wiring and binding on the internal circuit wiring layer of the highly integrated intelligent power module. When an external power supply powers the compressor driver chip IC1, the low-voltage power supply 302 located on the low-voltage pin mounting side can achieve electrical connection with the single-point grounding pin VSS3. When the compressor's low-voltage reference pin UVW is electrically connected to the high-voltage power supply 301 of the external power source via the external current sensing resistor 201, it is also electrically connected to the single-point grounding pin VSS3 via the external current sensing resistor 201. Similarly, the fan current sensing pin FITRIP is electrically connected to the current feedback terminal of the fan drive chip IC2 via traces and binding wires on the internal circuit wiring layer of the highly integrated intelligent power module. Two grounding terminals VSS are provided on the fan drive chip IC2, and the single-point grounding pin on the high-voltage side and the low-voltage grounding pin VSS2 on the low-voltage side are electrically connected within the fan drive chip IC2. Thus, the single-point grounding pin VSS3 can be electrically connected to the low-voltage power supply of the fan drive chip IC2 via traces and binding wires on the internal circuit wiring layer of the highly integrated intelligent power module. When the external power supply powers the fan drive chip IC2, it can be electrically connected to the single-point grounding pin VSS3 via the low-voltage power supply 302 located on the low-voltage pin mounting side. When the low-voltage reference pin FUVW of the wind turbine is electrically connected to the high-voltage power supply 301 of the external power supply through the external current sensing resistor 201, it is also electrically connected to the single-point grounding pin VSS3 through the external current sensing resistor 201. That is, the high-voltage ground (emitter output of the lower bridge IGBT) and the low-voltage ground (VSS1 and VSS2 pins) of the external power supply are single-point grounded on the single-point grounding pin VSS3 of the highly integrated intelligent power module, eliminating the need to set a separate single-point grounding point on the control board and shortening the wiring distance between the high-voltage ground and the low-voltage ground.Furthermore, when routing the PCB of the control board, the external current sensing resistor 201 is placed on the periphery of the high-voltage pin mounting side of the highly integrated intelligent power module, and the compressor current sensing pin ITRIP is also placed on the high-voltage pin mounting side. This can shorten the routing distance between the compressor current sensing pin ITRIP and the fan current sensing pin FITRIP and the external current sensing resistor 201, thereby reducing the parasitic inductance on the routing. Due to the reduction of parasitic inductance, the problem of false triggering of the highly integrated intelligent power module can be solved.

[0092] Understandably, the drive current of the compressor inverter power module 11 flows from the drive terminal of the compressor driver chip IC1 to the compressor low-voltage reference pin UVW- of the compressor inverter power module 11, then from the compressor low-voltage reference pin UVW- to the single-point grounding pin VSS3 outside the intelligent power module, and then back to the gate from the single-point grounding pin on the high-voltage side of the compressor driver chip IC1, forming a drive loop. Similarly, the drive current of the fan inverter power module 21 flows from the drive terminal of the fan driver chip IC2 to the fan low-voltage reference pin FUVW- of the fan inverter power module 21, then from the fan low-voltage reference pin FUVW- to the single-point grounding pin VSS3 outside the intelligent power module, and then back to the gate from the single-point grounding pin on the high-voltage side of the fan driver chip IC2, forming a drive loop. In this way, the distance between the two on the high-voltage pin mounting side is small, which can shorten the current loop.

[0093] This invention can also shorten the routing of the drive current loop, thereby reducing parasitic inductance on the routing and increasing the switching speed of the switching transistors in the power module 20. Furthermore, due to the reduction in parasitic inductance, it can also solve the problem of false triggering of the intelligent power module. In addition, in this embodiment, the grounding terminal of the power module 20 on the high-voltage installation side does not need to be routed externally. It can be directly connected inside the highly integrated intelligent power module (specifically, the compressor drive chip IC1 can be connected to the compressor low-voltage grounding pin VSS1 on the low-voltage installation side, or the fan drive chip IC2 can be connected to the fan low-voltage grounding pin VSS2 on the low-voltage installation side). There is no need to consider the safety requirements of the routing, which can facilitate the wiring of the peripheral electrical control of the intelligent power module, thereby reducing the wiring difficulty of the electrical control board of the electrical equipment.

[0094] Reference Figure 2 and Figure 3 In one embodiment, the compressor low voltage reference pin UVW-, compressor current detection pin ITRIP, single-point grounding pin VSS3, and fan low voltage reference pin FUVW- and fan current detection pin FITRIP are arranged adjacent to each other on the high-voltage pin mounting side.

[0095] It should be noted that, referring to Figure 4In the diagram, Ls1 to Ls4 represent the equivalent parasitic inductance in the circuit. When the connection between the compressor current sensing pin ITRIP and the external compressor current sensing resistor 201 and the compressor low voltage reference pin UVW- (lower bridge emitter pin) is at point A (closer to the lower bridge emitter pin), the voltage of the compressor current sensing pin ITRIP will be affected by Ls1 above the trace resistance. Similarly, when the connection between the fan current sensing pin FITRIP and the external fan current sensing resistor 201 and the fan low voltage reference pin FUVW- (lower bridge emitter pin) is at point A (closer to the lower bridge emitter pin), the voltage of the fan current sensing pin FITRIP will be affected by Ls1 above the trace resistance. The resistance of the aforementioned trace causes the switching level to drop because it is equivalent to adding a series resistance to the shunt resistor (current sensing resistor 201). When Ls1 flows through the reverse recovery current, it will generate voltage spikes, which can easily cause false triggering. Therefore, the connection point needs to be set at point B in the figure, that is, close to (external current sensing resistor 201). At this time, Ls1 is equivalent to a filter with a large time constant, which can filter out voltage spikes. The noise impact of Ls1 can be minimized by routing the compressor current sensing pin ITRIP. Therefore, in this embodiment, the compressor lower bridge emitter pin (UVW-), compressor current detection pin ITRIP (Itrip or ITRIP), fan low voltage reference pin FUVW-, fan current detection pin FITRIP, and single-point grounding pin VSS3 are placed as close as possible to minimize the routing distance in the external electrical control wiring of the IPM. Specifically, the routing distances from the compressor lower bridge emitter pin UVW- (fan lower bridge emitter pin FUVW-) to the sampling resistor, from the external sampling resistor to the compressor current detection pin ITRIP (fan current detection pin FITRIP), from the compressor current detection pin ITRIP (fan current detection pin FITRIP) to ground, and from the external current detection resistor 201 to ground are all minimized. Furthermore, Ls2 to Ls4 are minimized to reduce the impact of parasitic inductance on current detection, ensuring uninterrupted current detection and achieving reliable current protection and measurement performance. Simultaneously, by reducing the number of single-point grounding points, the compressor low-voltage reference pin UVW-, compressor current detection pin ITRIP, and fan low-voltage reference pin FUVW-, fan current detection pin FITRIP are positioned as close as possible, thereby reducing internal wiring distances. Since the low-voltage reference pin UVW-, compressor current detection pin ITRIP, and single-point grounding pin VSS3 are adjacent, the wiring distances from the low-voltage reference pin UVW- to the external current detection resistor 201, from the external current detection resistor 201 to the compressor current detection pin ITRIP, from the compressor current detection pin ITRIP to the single-point grounding pin VSS3, and from the external current detection resistor 201 to the single-point grounding pin are all minimized. This reduces the influence of parasitic inductance and ensures that current detection is not interfered with.

[0096] Reference Figure 2 and Figure 3 In one embodiment, the low-voltage pin mounting side is provided with a first low-voltage power supply positive terminal pin VDD, a second low-voltage power supply positive terminal pin FVDD, a first low-voltage power supply negative terminal pin VSS1, and a second low-voltage power supply negative terminal pin VSS2.

[0097] The power supply terminal of the compressor drive chip IC1 is electrically connected to the first low-voltage power supply positive terminal pin VDD;

[0098] The power supply terminal of the fan drive chip IC2 is electrically connected to the second low-voltage power supply positive terminal pin FVDD;

[0099] The ground terminal of the compressor drive chip IC1 is electrically connected to the first low-voltage power supply negative terminal pin VSS1;

[0100] The ground terminal of the fan drive chip IC2 is electrically connected to the second low-voltage power supply negative terminal pin VSS2.

[0101] It is understandable that the driving voltages of the two driver chips can be set to be the same or different. In this embodiment, two sets of low-voltage power supply positive and negative pins are set on the low-voltage pin mounting side, that is, the compressor driver chip IC1 and the fan driver chip IC2 are connected to different power supply pins and the same low-voltage grounding pin respectively. In this way, the distance from the two driver chips to the low-voltage power supply positive and negative pins can be shortened, the lead length can be shortened, and the complexity of external circuit wiring can be reduced. By setting two low-voltage grounding pins to connect to the low-voltage power supply, the low-voltage power supply and the high-voltage power supply can be grounded at a single point, which can reduce the circuit wiring complexity of the highly integrated intelligent power module.

[0102] Furthermore, in the above embodiments, the single-point grounding pin VSS3 is connected to the grounding terminals of the compressor drive chip IC1 and the fan drive chip IC2, respectively.

[0103] In this embodiment, both the single-point grounding pin VSS3 and the first low-voltage power supply negative terminal pin (compressor weak current grounding pin) VSS1 are connected to the ground terminal of the compressor driver chip IC1. The single-point grounding pin VSS3 and the second low-voltage power supply negative terminal pin (fan weak current grounding pin) VSS2 can be electrically connected through the fan driver chip IC2. The common point for single-point grounding is set on the highly integrated intelligent power module. The high-voltage side ground passes through the single-point grounding pin VSS3, through the module (specifically, inside the driver chip), and reaches the low-voltage side ground compressor weak current grounding pin VSS1 and fan weak current grounding pin VSS2, forming a convenient single-point grounding and reducing the length of the ground wire. This shortens the wiring required for single-point grounding of both high-voltage and low-voltage grounds. The grounding terminal on the high-voltage installation side and the compressor's low-voltage grounding pin VSS1 and the fan's low-voltage grounding pin VSS2 on the low-voltage installation side can be electrically connected directly on the highly integrated intelligent power module. This eliminates the need for additional grounding points on the control board and avoids compliance with wiring safety regulations. It also simplifies the wiring of the peripheral electrical control components of the highly integrated intelligent power module, reducing the wiring difficulty on the electrical control board and improving the reliability of the module. This invention also solves the problem of false triggering of overcurrent protection in highly integrated intelligent power modules, which leads to poor reliability.

[0104] The present invention also proposes an electronic control component.

[0105] Reference Figure 3 The electronic control assembly includes a main controller, a low-voltage power supply (not shown in the figure), a high-voltage power supply (not shown in the figure), a compressor current sensing resistor SR1, a fan current sensing resistor SR2, and the highly integrated intelligent power module described above.

[0106] One end of the compressor current sensing resistor SR1 is interconnected with the compressor low voltage reference pin and the compressor current sensing pin of the highly integrated intelligent power module, and the other end of the compressor current sensing resistor SR1 is connected to the single-point grounding pin of the highly integrated intelligent power module.

[0107] The compressor low-voltage reference pin is also connected to the negative terminal of the high-voltage power supply via the compressor current detection resistor SR1.

[0108] One end of the fan current sensing resistor SR2 is interconnected with the fan low voltage reference pin and the fan current sensing pin of the highly integrated intelligent power module, and the other end of the fan current sensing resistor SR2 is connected to the single-point grounding pin of the highly integrated intelligent power module.

[0109] The low-voltage reference pin of the fan is also connected to the negative terminal of the high-voltage power supply via the fan current detection resistor SR2.

[0110] In this embodiment, the compressor current sensing resistor SR1 is connected in series between the compressor's low-voltage reference pin UVW- and the single-point grounding pin VSS3. It can detect the current flowing through the compressor's three-phase lower bridge arm switching transistor and convert the current into a voltage signal, thereby achieving current detection of the motor. Similarly, the fan current sensing resistor SR2 is connected in series between the fan's low-voltage reference pin UVW- and the single-point grounding pin VSS3. It can also detect the current flowing through the compressor's three-phase lower bridge arm switching transistor and convert the current into a voltage signal, thereby achieving current detection of the motor.

[0111] Reference Figure 3 In some embodiments, the electronic control component further includes:

[0112] An electronic control board (not shown in the figure) is provided with a circuit wiring layer. The current sensing resistor 201 and the highly integrated intelligent power module are mounted on the electronic control board. The current sensing resistor 201 and the highly integrated intelligent power module are electrically connected through the leads corresponding to the circuit wiring layer.

[0113] In this embodiment, pads for a rectifier bridge, PFC circuit, DC bus capacitor, and highly integrated intelligent power module can be formed on the control board. The rectifier bridge, PFC circuit, DC bus capacitor, and highly integrated intelligent power module are electrically connected through leads on the circuit wiring layer. The current sensing resistor 201 is positioned on the same side as the high-voltage pin mounting side of the highly integrated intelligent power module. This shortens the distance between the low-voltage reference pin UVW- and the single-point grounding pin when connected via the external current sensing resistor 201. Furthermore, the compressor current sensing pin ITRIP is also positioned on the high-voltage pin mounting side, further reducing the distance between the low-voltage reference pin UVW- and the compressor current sensing pin ITRIP.

[0114] The present invention also proposes an air conditioner, including the highly integrated intelligent power module as described above;

[0115] The detailed structure of the highly integrated intelligent power module can be referred to in the above embodiments, and will not be repeated here. It is understood that since the above-mentioned highly integrated intelligent power module is used in the air conditioner of the present invention, the embodiments of the air conditioner of the present invention include all the technical solutions of all the embodiments of the above-mentioned highly integrated intelligent power module, and the technical effects achieved are exactly the same, and will not be repeated here.

[0116] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A highly integrated intelligent power module, characterized in that, The highly integrated intelligent power module includes: The mounting substrate has a high-voltage pin mounting side and a low-voltage pin mounting side arranged opposite to each other on both sides along the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions. The compressor IPM module and the fan IPM module are respectively installed in the corresponding mounting positions; The three-phase compressor floating power supply pin and the three-phase compressor output pin are installed on the high-voltage pin mounting side. The three-phase compressor floating power supply pin and the three-phase compressor output pin are respectively electrically connected to the compressor IPM module. The three-phase fan floating power supply pin and the three-phase fan output pin are installed on the high-voltage pin mounting side. The three-phase fan floating power supply pin and the three-phase fan output pin are respectively electrically connected to the fan IPM module. Multiple compressor filter capacitors are disposed at the mounting positions corresponding to the mounting substrate, and at least one compressor filter capacitor is connected in series between the floating power supply pin and the compressor output pin of each phase of the compressor; and... Multiple fan filter capacitors are disposed at the mounting positions corresponding to the mounting base plate, and at least one fan filter capacitor is connected in series between the floating power supply pin and the output pin of each phase of the fan. The compressor IPM module includes a compressor inverter power module and a compressor drive chip, which are installed in the corresponding mounting position. The compressor inverter power module and the compressor drive chip are electrically connected. The number of filter capacitors connected in series between the compressor floating power supply pin and the compressor output pin in each phase is two. The two filter capacitors are a first filter capacitor and a second filter capacitor, and the first filter capacitor and the second filter capacitor are connected in parallel. The first filter capacitor is positioned close to the floating power supply pin and the output pin of the fan, and the second filter capacitor is positioned close to the compressor drive chip; The highly integrated intelligent power module also includes: The PFC inductor connection terminal is connected to one end of an external inductor. The bus capacitor connection terminal is connected to the external bus capacitor. The PFC power module includes a PFC power switch and a PFC diode. The input terminal of the PFC power switch is interconnected with the PFC inductor and the anode of the PFC diode. The output terminal of the PFC power switch is connected to the negative terminal of the PFC inductor. The cathode of the PFC diode is connected to the bus capacitor.

2. The highly integrated intelligent power module as described in claim 1, characterized in that, The distance between the first filter capacitor and the floating power supply pin and the output pin of the fan is less than 5mm. The distance between the second filter capacitor and the compressor drive chip is less than 10mm.

3. The highly integrated intelligent power module as described in claim 2, characterized in that, The wind turbine IPM module includes: The wind turbine inverter power module and the wind turbine drive chip are installed in the corresponding mounting positions, and the wind turbine inverter power module is electrically connected to the wind turbine drive chip.

4. The highly integrated intelligent power module as described in claim 3, characterized in that, The filter capacitors connected in series between the floating power supply pin and the output pin of each phase of the wind turbine are located close to the floating power supply pin and the output pin of the wind turbine. And / or, located close to the fan drive chip.

5. The highly integrated intelligent power module as described in any one of claims 1 to 4, characterized in that, The highly integrated intelligent power module also includes: A rectifier bridge, the output of which is connected to a PFC inductor.

6. An air conditioner, characterized in that, Includes the highly integrated smart power module as described in any one of claims 1 to 5.

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