Heat dissipation devices and electronic equipment
By designing a curved air guide channel in the heat dissipation device, the gas flow path and flow time are increased, which solves the problem of poor heat dissipation capacity of existing heat dissipation devices and achieves a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202210112789.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-01-29
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2042-01-29
AI Technical Summary
Existing heat dissipation devices have poor heat dissipation capabilities.
A heat dissipation device is designed, including a main body and a guide body. The guide body has a curved air channel, and gas flows through the opening, the air channel and the opening, increasing the flow path and flow time of the gas in the main body to improve the heat dissipation efficiency.
By increasing the flow path and flow time of the gas within the body, the heat dissipation capacity of the heat dissipation device is significantly improved.
Smart Images

Figure CN114599204B_ABST
Abstract
Description
Technical Field
[0001] This application relates to a heat dissipation device and an electronic device. Background Art
[0002] Heat dissipation devices are frequently used; however, current heat dissipation devices have poor heat dissipation capabilities. Summary of the Invention
[0003] In view of this, embodiments of this application aim to provide a heat dissipation device and an electronic device.
[0004] To achieve the above objectives, the technical solution of this application is implemented as follows:
[0005] This application embodiment provides a heat dissipation device, the heat dissipation device comprising:
[0006] The body has a first receiving cavity, a first opening, and a second opening for dissipating heat from the heat-generating components;
[0007] An air guide body is disposed within the first receiving cavity and has a first air guide channel; at least a portion of the first air guide channel is curved.
[0008] Gas can flow within the first opening, the first air guide channel, and the second opening.
[0009] In some alternative implementations, the ontology includes:
[0010] The first wall is connected to the air guide body and is used to connect to the heating element;
[0011] The second wall is spaced apart from the first wall;
[0012] The air guide is located between the first wall and the second wall, and forms a second air guide channel with the second wall.
[0013] In some alternative implementations, the ontology further includes:
[0014] The third wall is connected to the first wall and the second wall respectively, and forms a third air guiding channel with the air guide body;
[0015] The fourth wall is connected to the first wall and the second wall respectively, and is disposed opposite to the third wall, forming a fourth air guiding channel with the air guide body.
[0016] In some alternative implementations, the air guide body and the main body are formed into an integral structure by sintering;
[0017] The material of the main body and the air guide is copper.
[0018] In some alternative implementations, the air guide is formed from metal powder by sintering; and / or,
[0019] The air guide is formed by sintering metal wires.
[0020] In some alternative implementations, the air guide includes:
[0021] The first strip-shaped part,
[0022] The second strip has a different cross-section than the first strip and intersects with the first strip to form the air guide.
[0023] This application also provides an electronic device, which includes the heat dissipation device described in this application as having a heat-generating component:
[0024] The heat dissipation device is used to dissipate heat from the heat-generating components.
[0025] In some alternative implementations, the electronic device further includes:
[0026] The housing has a second receiving cavity, a first air outlet, and a second air outlet; the heat dissipation device and the heat-generating component are located within the second receiving cavity;
[0027] A fan is disposed in the second accommodating cavity and is used to drive a first portion of gas out of the first air outlet and to drive a second portion of gas out through the first opening, the first air guide channel, the second opening and the second air outlet.
[0028] The air guide is used to absorb noise from electronic devices.
[0029] In some alternative implementations, the electronic device further includes: a heat pipe, the first end of which is connected to both the heating element and the body, and the second end of which is located at the first air outlet; or,
[0030] The electronic device further includes: a heat pipe, the first end of which is connected to a first heating element in the heating assembly, and the second end of which is located at the first air outlet; the body is connected to a second heating element in the heating assembly.
[0031] In some alternative implementations, the electronic device further includes:
[0032] The housing has a second receiving cavity, a first air outlet, and a first air inlet; the heat dissipation device and the heat-generating component are located in the second receiving cavity;
[0033] A fan, disposed in the second receiving cavity, is used to drive gas to be introduced through the first air inlet, the second opening, the first air guide channel and the first opening, and to drive the introduced gas to be discharged from the first air outlet.
[0034] The heat dissipation device in this embodiment includes: a body having a first receiving cavity, a first opening, and a second opening for dissipating heat from a heat-generating component; a guide body disposed in the first receiving cavity and having a first air guide channel; at least a portion of the first air guide channel is curved; gas can flow within the first opening, the first air guide channel, and the second opening; the curved first air guide channel of the guide body increases the path and time of gas flow within the body, allowing the gas to exchange heat more fully with the body, thus greatly improving the heat dissipation capacity of the heat dissipation device. Attached Figure Description
[0035] Figure 1 This is a schematic diagram of an optional structure of the heat dissipation device in an embodiment of this application;
[0036] Figure 2 This is a schematic diagram of an optional structure of the heat dissipation device in an embodiment of this application;
[0037] Figure 3 This is a schematic diagram of an optional structure of the heat dissipation device in an embodiment of this application;
[0038] Figure 4 This is a schematic diagram of an optional structure of the heat dissipation device in an embodiment of this application;
[0039] Figure 5 This is a schematic diagram of an optional structure of the heat dissipation device in an embodiment of this application;
[0040] Figure 6 This is a schematic diagram of an optional structure of the electronic device in an embodiment of this application;
[0041] Figure 7 This is a schematic diagram of an optional structure of the electronic device in an embodiment of this application;
[0042] Figure 8 This is a schematic diagram of an optional structure of the electronic device in an embodiment of this application;
[0043] Figure 9 This is a schematic diagram of an optional structure of the electronic device in an embodiment of this application.
[0044] Reference numerals: 110, Body; 101, First receiving cavity; 102, Second air guide channel; 103, Third air guide channel; 104, Fourth air guide channel; 105, Fifth air guide channel; 106, Sixth air guide channel; 107, Seventh air guide channel; 111, First opening; 112, Second opening; 114, First wall; 115, Second wall; 116, Third wall; 117, Fourth wall; 118, Fifth wall; 119, Sixth wall; 120, Air guide body; 210, Shell; 201, Second receiving cavity; 211, First air outlet; 212, Second air outlet; 213, First air inlet; 220, Fan; 230, Heat pipe. Detailed Implementation
[0045] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0046] In the embodiments described in this application, it should be noted that, unless otherwise stated and limited, the term "connection" should be interpreted broadly. For example, it can be an electrical connection, or a connection between two internal components. It can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above term according to the specific circumstances.
[0047] It should be noted that the terms "first," "second," and "third" used in the embodiments of this application are merely used to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first," "second," and "third" can be interchanged in a specific order or sequence where permitted. It should be understood that the objects distinguished by "first," "second," and "third" can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in an order other than those illustrated or described herein.
[0048] The following combination Figures 1 to 5 The heat dissipation device described in the embodiments of this application will be described in detail.
[0049] The heat dissipation device includes a body 110 and a guide body 120. The body 110 has a first receiving cavity 101, a first opening 111, and a second opening 112, and is used to dissipate heat for the heat-generating components. The guide body 120 is disposed in the first receiving cavity 101 and has a first air guiding channel. At least a portion of the first air guiding channel is curved. Gas can flow within the first opening 111, the first air guiding channel, and the second opening 112. The curved first air guiding channel of the guide body 120 increases the path and time of gas flow within the body 110, allowing for more thorough heat exchange between the gas and the body 110, thus greatly improving the heat dissipation capacity of the heat dissipation device.
[0050] In this embodiment, the structure of the body 110 is not limited. For example, as Figure 1 As shown, the body 110 can be a cuboid structure. Alternatively, the body 110 can also have an irregular shape.
[0051] Here, the first opening 111 and the second opening 112 are respectively connected to the first receiving cavity 101, and the positions of the first opening 111 and the second opening 112 are not limited. For example, as Figure 1 As shown, the first opening 111 and the second opening 112 can be located on adjacent sides of the body 110. Of course, the first opening 111 and the second opening 112 can also be located on opposite sides of the body 110.
[0052] Here, the material of the body 110 is not limited. For example, the material of the body 110 can be copper, which is used to increase the thermal conductivity of the body 110.
[0053] In this embodiment, the structure of the air guide 120 is not limited. For example, the air guide 120 can be a mesh structure. As another example, the air guide 120 can be a foam structure; for instance, the air guide 120 can be foamed metal.
[0054] As an example, the air guide 120 may include a first strip-shaped portion and a second strip-shaped portion. The second strip-shaped portion and the first strip-shaped portion are interleaved to form the air guide 120.
[0055] Here, the cross-sectional shape of the second strip can be the same as or different from that of the first strip. For example, the cross-sections of the second strip and the first strip can both be circular or elliptical, and the diameter of the second strip is different from that of the first strip, so as to form a first air guide channel with a larger cross-sectional area between the second strip and the first strip.
[0056] Here, the air guide 120 may include a foam portion, which may be adhered to the surfaces of the second strip portion and the first strip portion to further increase the contact area between the gas and the second strip portion and the first strip portion, so that the gas can exchange heat more fully with the second strip portion and the first strip portion.
[0057] The structure of the foam section is not limited here. For example, the foam section can be foam metal.
[0058] Here, a first air guide channel is provided inside the air guide body 120. The first air guide channel can be entirely curved or partially curved. When the air guide body 120 is a mesh structure or a foam structure, a curved first air guide channel can be formed within the mesh structure or foam structure.
[0059] As an example, the air guide 120 may also have a fifth air guide channel 105.
[0060] Here, the cross-sectional area of the fifth air guide channel 105 is larger than that of the first air guide channel, so that more gas can be introduced into the air guide body 120 through the fifth air guide channel 105.
[0061] Here, the fifth air guide channel 105 can have a straight structure, such as... Figure 5 As shown. Of course, the fifth air guide channel 105 can also be a curved structure, such as... Figure 4 As shown.
[0062] Here, the fifth air guide channel 105 can be connected to the first opening 111 and the second opening 112 respectively, such as Figure 4 As shown, the first air guide channel can also be connected only to the first opening 111, such as... Figure 5 As shown; at this time, the gas can enter the fifth air guide channel 105 through the first opening 111, and then exit through the second opening 112 through the first air guide channel. Of course, the gas can also enter the fifth air guide channel 105 through the first air guide channel via the second opening 112, and then exit through the first opening 111.
[0063] Here, the manner in which the air guide 120 is disposed within the first receiving cavity 101 is not limited. For example, the air guide 120 may contact the wall forming the first receiving cavity 101, but the air guide 120 may not be connected to the wall forming the first receiving cavity 101. Another example is that the air guide 120 may be connected to the wall forming the first receiving cavity 101 by thermally conductive adhesive. Yet another example is that the air guide 120 and the body 110 may be formed as an integral structure by sintering, in which case the heat from the heating element can be transferred to the air guide 120 more quickly.
[0064] Here, the material of the air guide 120 is not limited. For example, the material of the air guide 120 can be copper.
[0065] In some optional implementations of the embodiments of this application, such as Figure 2 As shown, the main body 110 may include: a first wall 114 and a second wall 115. The first wall 114 is connected to the air guide 120 and is used to connect to the heating element; the second wall 115 is spaced apart from the first wall 114; the air guide 120 is located between the first wall 114 and the second wall 115, and the air guide 120 and the second wall 115 form a second air guide channel 102 so that gas can also flow in the second air guide channel, reducing the resistance of gas flow between the first opening 111 and the second opening 112.
[0066] In this implementation, the first wall 114 is connected to the air guide 120 so that the heat from the heating component can be quickly transferred to the air guide 120.
[0067] Here, the connection between the first wall 114 and the air guide 120 is the same as the connection between the air guide 120 and the wall forming the first receiving cavity 101, which will not be described again here.
[0068] Here, the second air guide channel 102 may be connected to at least one of the first opening 111 and the second opening 112, or the second air guide channel 102 may not be connected to either the first opening 111 or the second opening 112.
[0069] In this implementation, such as Figure 3 As shown, the main body 110 may further include a third wall 116 and a fourth wall 117. The third wall 116 is connected to the first wall 114 and the second wall 115 respectively, and the third wall 116 and the air guide body 120 form a third air guide channel 103; the fourth wall 117 is connected to the first wall 114 and the second wall 115 respectively, and the fourth wall 117 is disposed opposite to the third wall 116, and the fourth wall 117 and the air guide body 120 form a fourth air guide channel 104; so that gas can also flow in the third air guide channel 103 and the fourth air guide channel 104, reducing the resistance to gas flow between the first opening 111 and the second opening 112.
[0070] Here, the third air guide channel 103 may be connected to at least one of the first opening 111 and the second opening 112, or the third air guide channel 103 may not be connected to either the first opening 111 or the second opening 112.
[0071] Here, the fourth air guide channel 104 may be connected to at least one of the first opening 111 and the second opening 112, or the fourth air guide channel 104 may not be connected to either the first opening 111 or the second opening 112.
[0072] As an example, such as Figure 3 As shown, the main body 110 may further include a fifth wall 118 and a sixth wall 119. The fifth wall 118 is connected to the first wall 114 and the second wall 115 respectively, and is also connected to the third wall 116 and the fourth wall 117 respectively. The fifth wall 118 and the air guide body 120 form a sixth air guide channel 106. The sixth wall 119 is connected to the first wall 114 and the second wall 115 respectively, and is also connected to the third wall 116 and the fourth wall 117 respectively. The sixth wall 119 is disposed opposite to the fifth wall 118, and the sixth wall 119 and the air guide body 120 form a seventh air guide channel 107.
[0073] Here, the first opening 111 can be set in the fifth wall 118, and the second opening 112 can be set in the sixth wall 119.
[0074] Here, the second air guide channel 102, the third air guide channel 103, the fourth air guide channel 104, the sixth air guide channel 106 and the seventh air guide channel 107 are connected to each other in order to reduce the resistance to gas flow between the first opening 111 and the second opening 112.
[0075] Of course, only one or at least two of the second air guide channel 102, the third air guide channel 103, the fourth air guide channel 104, the sixth air guide channel 106 and the seventh air guide channel 107 may be provided; in this case, at least one or at least two of the second wall body 115, the third wall body 116, the fourth wall body 117, the fifth wall body 118 and the sixth wall body 119 may form a gap with the air guide body 120, and the remaining walls are connected to the air guide body 120.
[0076] The heat dissipation device of this application embodiment includes: a body 110 having a first receiving cavity 101, a first opening 111, and a second opening 112 for dissipating heat from a heat-generating component; a guide body 120 disposed in the first receiving cavity 101 and having a first air guide channel; at least a portion of the first air guide channel is curved; gas can flow within the first opening 111, the first air guide channel, and the second opening 112; the curved first air guide channel of the guide body 120 increases the path and time of gas flow within the body 110, enabling the gas to exchange heat more fully with the body 110, thus greatly improving the heat dissipation capacity of the heat dissipation device.
[0077] This application also describes an electronic device, which includes a heat-generating component of the heat dissipation device described in this application: the heat dissipation device is used to dissipate heat from the heat-generating component.
[0078] Here, the heat dissipation device can be in direct contact with the heat-generating component, or it can be in contact with the heat-generating component through a thermal pad.
[0079] In the embodiments of this application, the structure of the electronic device is not limited. For example, the electronic device can be a computer or a mobile phone.
[0080] In some optional implementations of the embodiments of this application, such as Figure 6As shown, the electronic device may further include a housing 210 and a fan 220. The housing 210 has a second receiving cavity 201, a first air outlet 211, and a second air outlet 212; the heat dissipation device and the heat-generating component are located within the second receiving cavity 201; the fan 220 is disposed within the second receiving cavity 201, and the fan 220 is used to drive a first portion of gas out through the first air outlet 211, and the fan 220 is used to drive a second portion of gas out through the first opening 111, the first air guide channel, the second opening 112, and the second air outlet 212; so that the fan 220 can both drive the first portion of gas to dissipate heat for other structures and drive the second portion of gas to dissipate heat for the heat-generating component through the heat dissipation device.
[0081] In this implementation, the structure of the housing 210 is not limited. For example, the housing 210 can be a cuboid structure.
[0082] In this implementation, the first air outlet 211 and the second air outlet 212 can be located on the same side of the housing 210, such as... Figure 6 As shown. Of course, the first air outlet 211 and the second air outlet 212 can also be located on different sides of the housing 210.
[0083] In this implementation, the structure of the fan 220 is not limited, as long as the fan 220 can drive the first part of the gas out of the first air outlet 211 and drive the second part of the gas out through the first opening 111, the first air guide channel, the second opening 112, and the second air outlet 212. For example, the fan 220 can be provided with a first outlet and a second outlet, the first outlet corresponding to the position of the first air outlet 211, and the second outlet corresponding to the position of the first opening 111. The first outlet and the second outlet can be provided on the same side of the fan 220 or on different sides of the fan 220.
[0084] In this implementation, such as Figure 8 As shown, the electronic device may further include: a heat pipe 230, the first end of which is connected to the first heating element in the heating assembly, and the second end of which is located at the first air outlet 211; the body 110 is connected to the second heating element in the heating assembly, so that the fan 220 can dissipate heat for the first heating element through the heat pipe 230, and can also dissipate heat for the second heating element through the body 110.
[0085] Of course, heat pipe 230 and body 110 can also dissipate heat for the same heat-generating component. For example... Figure 7As shown, the electronic device may further include a heat pipe 230, the first end of which is connected to the heating component and the body 110 respectively, and the second end of which is located at the first air outlet 211; at this time, the heat of the heating component can be transferred to both the heat pipe 230 and the body 110.
[0086] In some optional implementations of the embodiments of this application, such as Figure 9 As shown, the electronic device may further include a housing 210 and a fan 220. The housing 210 has a second receiving cavity 201, a first air outlet 211, and a first air inlet 213; the heat dissipation device and the heat-generating component are located within the second receiving cavity 201; the fan 220 is disposed within the second receiving cavity 201, and the fan 220 is used to drive gas to be introduced through the first air inlet 213, the second opening 112, the first air guide channel, and the first opening 111, and the fan 220 is used to drive the introduced gas to be discharged from the first air outlet 211; so that the fan 220 can guide gas into the heat dissipation device through the first air inlet 213 and dissipate heat for the heat-generating component based on the heat dissipation device; at the same time, the fan 220 can also dissipate heat for other structures through the first air outlet 211.
[0087] In this implementation, the structure of the housing 210 is not limited. For example, the housing 210 can be a cuboid structure.
[0088] In this implementation, the first air outlet 211 and the first air inlet 213 can be located on the same side of the housing 210, such as... Figure 9 As shown. Of course, the first air outlet 211 and the first air inlet 213 can also be located on different sides of the housing 210.
[0089] In this implementation, the structure of the fan 220 is not limited, as long as the fan 220 can drive gas from the first air inlet 213 into the heat dissipation device. For example, the housing 210 may also be provided with a second air inlet, and the fan 220 can drive gas from the first air inlet 213 and the second air inlet. The first air inlet 213 and the second air inlet may be located on the same side of the fan 220 or on different sides of the fan 220.
[0090] In this implementation, the electronic device may further include: a heat pipe 230, the first end of which is connected to the first heating element in the heating assembly, and the second end of which is located at the first air outlet 211; the body 110 is connected to the second heating element in the heating assembly, so that the fan 220 can dissipate heat for the first heating element through the heat pipe 230, and also dissipate heat for the second heating element through the body 110.
[0091] Of course, the heat pipe 230 and the body 110 can also dissipate heat for the same heat-generating component. For example, the electronic device may also include a heat pipe 230, the first end of which is connected to the heat-generating component and the body 110 respectively, and the second end of which is located at the first air outlet 211; in this case, the heat from the heat-generating component can be transferred to both the heat pipe 230 and the body 110.
[0092] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A heat dissipation device, the heat dissipation device comprising: The body has a first receiving cavity, a first opening, and a second opening for dissipating heat from the heat-generating components; An air guide body is disposed within the first receiving cavity and has a first air guide channel; at least a portion of the first air guide channel is curved; the air guide body is formed by sintering. Gas can flow within the first opening, the first air guide channel, and the second opening; The heat dissipation device includes: The fan has a first outlet and a second outlet; the second outlet corresponds to the position of the first opening. A heat pipe is installed at the first outlet; The fan is used to dissipate heat from the heat pipe through the first outlet, and the fan is used to dissipate heat from the body through the second outlet.
2. The heat dissipation device according to claim 1, wherein the body comprises: The first wall is connected to the air guide body and is used to connect to the heating element; The second wall is spaced apart from the first wall; The air guide is located between the first wall and the second wall, and forms a second air guide channel with the second wall.
3. The heat dissipation device according to claim 2, wherein the main body further comprises: The third wall is connected to the first wall and the second wall respectively, and forms a third air guiding channel with the air guide body; The fourth wall is connected to the first wall and the second wall respectively, and is disposed opposite to the third wall, forming a fourth air guiding channel with the air guide body.
4. The heat dissipation device according to claim 1, wherein the air guide body and the main body are formed into an integral structure by sintering; in, The body and the air guide are made of copper.
5. The heat dissipation device according to claim 4, wherein the air guide body is formed from metal powder by sintering; and / or, The air guide is formed by sintering metal wires.
6. The heat dissipation device according to any one of claims 1 to 5, wherein the air guide comprises: The first strip-shaped part, The second strip has a different cross-section than the first strip and intersects with the first strip to form the air guide.
7. An electronic device comprising a heat-generating component of the heat dissipation device according to any one of claims 1 to 6: The heat dissipation device is used to dissipate heat from the heat-generating components.
8. The electronic device according to claim 7, further comprising: The housing has a second receiving cavity, a first air outlet, and a second air outlet; the heat dissipation device and the heat-generating component are located within the second receiving cavity; A fan is disposed in the second accommodating cavity and is used to drive a first portion of gas out of the first air outlet and to drive a second portion of gas out through the first opening, the first air guide channel, the second opening and the second air outlet. The air guide is used to absorb noise from electronic devices.
9. The electronic device according to claim 8, further comprising: A heat pipe, the first end of which is connected to the heating element and the body respectively, and the second end of which is located at the first air outlet; or, The electronic device further includes a heat pipe, the first end of which is connected to the first heating element in the heating assembly, and the second end of which is located at the first air outlet. The main body is connected to the second heating element in the heating assembly.
10. The electronic device according to claim 7, further comprising: The housing has a second receiving cavity, a first air outlet, and a first air inlet; the heat dissipation device and the heat-generating component are located in the second receiving cavity; A fan, disposed in the second receiving cavity, is used to drive gas to be introduced through the first air inlet, the second opening, the first air guide channel and the first opening, and to drive the introduced gas to be discharged from the first air outlet.
Citation Information
Patent Citations
Air duct system
CN210959282U
Flat-heat-tube radiator
CN2869741Y