Sealing method and bonding tooling

Abstract

The present invention provides a sealing method and a bonding tooling, which relate to the field of semiconductor manufacturing. This method is used to seal the gaps of lithography machine components and includes: die-cutting a tape to obtain a bonding tape that matches the shape of the gap to be bonded; laminating and bonding at least two support films, and then die-cutting the outermost support film to obtain a through groove for accommodating the tape and forming a bonding tooling; bonding the bonding tape into the through groove; bonding the bonding tape to the gap to be bonded, and removing the bonding tooling. In this method, the fabricated bonding tooling has at least two support films. After the bonding tape is bonded into the through groove of the bonding tooling, the support films play a supporting role on the bonding tape, making the bonding tape not easily deformed and maintaining flatness. Therefore, during sealing, each part of the bonding tape can contact the object to be bonded simultaneously, be flatly bonded to the object to be bonded, and strictly seal the gap to be bonded; the bonding tape maintaining flatness and not being deformed is also beneficial to avoid the generation of bubbles, thereby ensuring the sealing effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and more particularly, to a sealing method and a bonding tooling. Background Art

[0002] During the assembly of products in the production process, gaps may occur between various parts. When a liquid flows through, the liquid will flow into the gaps, resulting in liquid waste and affecting the use of the product. Therefore, it is necessary to seal the gaps.

[0003] In the prior art, the methods for sealing gaps mainly include two types: filling sealing and covering sealing. Among them, the steps of covering sealing are: making a tape with a corresponding shape according to the shape of the gap to be sealed, and then pasting the tape to the gap.

[0004] However, when using the methods in the prior art to seal gaps, it is easy to occur the situation that the gaps are not tightly sealed. Summary of the Invention

[0005] The first object of the present invention is to provide a sealing method to solve the technical problem that the gaps are not tightly sealed easily in the prior art when sealing gaps.

[0006] The sealing method provided by the present invention is used to seal the gaps of lithography machine components. The sealing method includes:

[0007] Die-cutting a tape to obtain a tape portion that matches the shape of the gap to be bonded, namely a bonding tape;

[0008] Stacking and bonding at least two support films, and then die-cutting the outermost support film to obtain a through groove for accommodating the tape, and at the same time forming a bonding tooling;

[0009] Bonding the back side of the tape into the through groove;

[0010] Bonding the side of the bonding tape with an adhesive to the gap to be bonded, and removing the bonding tooling.

[0011] Further, the sealing method further includes:

[0012] Before die-cutting the tape to obtain the bonding tape, bonding protective films on both sides of the tape respectively; when die-cutting, die-cutting the tape and the protective film on the side of the tape with an adhesive at the same time;

[0013] Bonding the protective film on the back side of the tape into the through groove, and then removing the protective film portion that has the same shape as the bonding tape on the side of the tape with an adhesive.

[0014] Further, the sealing method further includes:

[0015] Before bonding the protective film on the back of the tape to the through groove, a first positioning hole group is punched in the tape assembly, the tape assembly including the tape and the protective films on both sides thereof; a second positioning hole group is punched in the supporting film portion corresponding to the through groove, the positioning holes of the second positioning hole group corresponding to the positioning holes of the first positioning hole group one by one;

[0016] When the protective film on the back side of the adhesive tape is bonded into the through groove, the positioning holes of the first positioning hole group are aligned one by one with the positioning holes of the second positioning hole group.

[0017] Furthermore, when the through-slot is obtained by die-cutting, the shape of the through-slot is matched with the shape of the adhesive tape assembly.

[0018] Furthermore, the tape assembly is rectangular, the first positioning hole group includes two first positioning holes, the two first positioning holes are both located outside the adhesive tape and are arranged at opposite corners of the tape assembly;

[0019] The through slot is rectangular, and the second positioning hole group includes two second positioning holes, which are arranged at opposite corners of the through slot.

[0020] Furthermore, the sealing method further comprises:

[0021] A third positioning hole group is punched in the support film after the layers are stacked and bonded, and the positioning holes of the third positioning hole group correspond one to one with the positioning holes of the fourth positioning hole group of the object to be bonded;

[0022] Before bonding the side of the bonding tape with the adhesive to the gap to be bonded, the positioning holes of the third positioning hole group are aligned one by one with the positioning holes of the fourth positioning hole group of the object to be bonded.

[0023] Furthermore, the bonding tool is rectangular, and the third positioning hole group includes two third positioning holes. The two third positioning holes are both located outside the through groove and are arranged at opposite corners of the bonding tool.

[0024] The sealing method provided by the present invention can produce the following beneficial effects:

[0025] The sealing method provided by the present invention manufactures a bonding tool with at least two layers of supporting films. After the bonding tape is bonded into the through groove of the bonding tool, the supporting film of the bonding tool supports the bonding tape, so that the bonding tape is not easily deformed and remains flat. Therefore, when sealing the gap to be bonded, various parts of the bonding tape can contact the object to be bonded at the same time, and bond to the object to be bonded flatly, strictly sealing the gap to be bonded; in addition, the bonding tape remains flat and does not deform, which is also conducive to avoiding the generation of bubbles, thereby ensuring the sealing effect.

[0026] The second object of the present invention is to provide a bonding tool to solve the technical problem in the prior art that poor sealing easily occurs when sealing gaps.

[0027] The bonding tooling provided by the present invention includes at least two layers of bonded support films, and a through groove is provided in the outermost support film. The through groove is used to accommodate a bonding tape, and the bonding tape is a tape that matches the shape of the gap to be bonded.

[0028] Furthermore, the bonding tooling is provided with a second positioning hole group, and the positioning holes of the second positioning hole group correspond one by one to the positioning holes of the first positioning hole group of the tape assembly. The tape assembly includes a tape and protective films laminated and bonded on both sides of the tape.

[0029] Furthermore, the bonding tooling is further provided with a third positioning hole group, and the positioning holes of the third positioning hole group correspond one by one to the positioning holes of the fourth positioning hole group of the object to be bonded.

[0030] The bonding tooling provided by the present invention can produce the following beneficial effects:

[0031] The bonding tooling provided by the present invention includes at least two layers of support films. During use, first bond the back side of the tape to the through groove of the bonding tooling, then bond the side of the bonding tape with the adhesive to the gap to be bonded, and remove the bonding tooling, thus completing the sealing of the gap to be bonded.

[0032] The support films of the bonding tooling provided by the present invention play a supporting role for the bonding tape, making the bonding tape not easily deformed and maintaining flatness. Therefore, when sealing the gap to be bonded, each part of the bonding tape can contact the object to be bonded simultaneously, be flatly bonded to the object to be bonded, and strictly seal the gap to be bonded. In addition, the bonding tape maintaining flat and not deformed is also beneficial to avoid the generation of bubbles, thereby ensuring the sealing effect. Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0034] Figure 1 It is a flow chart of the sealing method provided by the embodiment of the present invention;

[0035] Figure 2 It is a schematic flow chart of making the bonding tape in the sealing method provided by the embodiment of the present invention;

[0036] Figure 3 It is an exploded structural schematic diagram of the tape assembly in the sealing method provided by the embodiment of the present invention;

[0037] Figure 4Schematic flow chart of manufacturing the bonding tooling in the sealing method provided by the embodiment of the present invention;

[0038] Figure 5 Exploded structure schematic diagram of the bonding tooling in the sealing method provided by the embodiment of the present invention;

[0039] Figure 6 Schematic flow chart of assembly in the sealing method provided by the embodiment of the present invention;

[0040] Figure 7 Schematic flow chart of bonding and sealing in the sealing method provided by the embodiment of the present invention.

[0041] Explanation of reference numerals:

[0042] 100 - Tape assembly; 110 - Tape; 111 - Bonding tape; 120 - Protective film; 130 - First positioning hole;

[0043] 200 - Bonding tooling; 210 - Support film; 211 - Through groove; 220 - Second positioning hole; 230 - Third positioning hole;

[0044] 300 - Object to be bonded; 310 - Gap to be bonded; 320 - Fourth positioning hole. Detailed implementation manners

[0045] To make the above - mentioned objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] Figure 1 Flow chart of the sealing method provided in this embodiment, Figure 2 Schematic flow chart of manufacturing the bonding tape 111 in the sealing method provided in this embodiment, Figure 4 Schematic flow chart of manufacturing the bonding tooling 200 in the sealing method provided in this embodiment, Figure 6 Schematic flow chart of assembly in the sealing method provided in this embodiment, Figure 7 Schematic flow chart of bonding and sealing in the sealing method provided in this embodiment.

[0047] This embodiment provides a sealing method for sealing the gaps of lithography machine components, such as Figure 1 , Figure 2 , Figure 4 , Figure 6 and Figure 7 shown. The sealing method includes:

[0048] Manufacturing the bonding tape 111: Die - cutting the tape 110 to obtain the tape part that matches the shape of the gap 310 to be bonded, namely the bonding tape 111;

[0049] Fabricate the bonding tooling 200: Stack and bond at least two layers of support films 210; then die-cut the outermost support film 210 to obtain a through groove 211 for accommodating the tape 110.

[0050] Assembly: Bond the back side of the tape 110 into the through groove 211.

[0051] Bonding and sealing: Bond the adhesive-side of the bonding tape 111 to the to-be-bonded gap 310, and remove the bonding tooling 200.

[0052] The sealing method provided in this embodiment includes steps such as fabricating the bonding tape 111, fabricating the bonding tooling 200, assembly, and bonding and sealing. Among them, the fabricated bonding tooling 200 has at least two layers of support films 210. After bonding the bonding tape 111 into the through groove 211 of the bonding tooling 200, the support films 210 of the bonding tooling 200 play a supporting role on the bonding tape 111, making the bonding tape 111 not easily deformed and maintaining flat. Thus, when sealing the to-be-bonded gap 310, each part of the bonding tape 111 can contact the to-be-bonded object 300 simultaneously, be flatly bonded to the to-be-bonded object 300, and strictly seal the to-be-bonded gap 310. In addition, the bonding tape 111 maintaining flat and not deformed is also beneficial to avoid the generation of bubbles, thereby ensuring the sealing effect.

[0053] It should be noted that in this embodiment, the "gap" is not limited to the narrow gap between parts, but can also include other-shaped gaps between parts and cracks or holes that need to be sealed in the parts themselves. In addition, the sealing method provided in this embodiment can be applied not only to the semiconductor manufacturing field but also to other fields that require precise sealing of gaps using the tape 110.

[0054] Specifically, in this embodiment, the steps of fabricating the bonding tape 111 include:

[0055] Before die-cutting the tape 110 to obtain the bonding tape 111, bond protective films 120 on both sides of the tape 110 to form a tape assembly 100.

[0056] When die-cutting, simultaneously die-cut the tape 110 and the protective film 120 on the adhesive-side of the tape 110.

[0057] The steps of assembly include: Bond the protective film 120 on the back side of the tape 110 into the through groove 211, and then remove the part of the protective film 120 on the adhesive-side of the tape 110 that has the same shape as the bonding tape 111.

[0058] The sealing method provided in this embodiment bonds protective films 120 on both sides of the tape 110. During assembly, instead of only bonding the bonding tape 111 into the through groove 211, the die-cut tape assembly 100 as a whole is bonded into the through groove 211 of the bonding tooling 200, making operations such as clamping the tape assembly 100 more convenient to implement; the protective film 120 plays a supporting role for the tape 110, thus being able to further ensure that the bonding tape 111 remains flat, and then facilitating the flat bonding of the bonding tape 111 to the object to be bonded 300 and strictly sealing the gap to be bonded 310; in addition, the protective film 120 plays a protective role for the tape 110, being able to effectively prevent damage to the bonding tape 111 caused by fixtures or the deformation of the bonding tape 111.

[0059] Specifically, in this embodiment, the steps of manufacturing the bonding tape 111 further include: punching a first set of positioning holes in the tape assembly 100.

[0060] The steps of manufacturing the bonding tooling 200 further include: punching a second set of positioning holes in the part of the support film 210 corresponding to the through groove 211, and the positioning holes of the second set of positioning holes correspond one-to-one with the positioning holes of the first set of positioning holes.

[0061] The encapsulation steps further include: before bonding the protective film 120 on the back side of the tape 110 into the through groove 211, aligning the positioning holes of the first set of positioning holes with the positioning holes of the second set of positioning holes one-to-one.

[0062] The sealing method provided in this embodiment improves the assembly accuracy of the tape assembly 100 and the bonding tooling 200 by punching a first set of positioning holes in the tape assembly 100, punching a second set of positioning holes in the bonding tooling 200, and aligning the positioning holes of the first set of positioning holes with the positioning holes of the second set of positioning holes when assembling the die-cut tape assembly 100 to the bonding tooling 200, which is beneficial to accurately bonding the bonding tape 111 to the object to be bonded 300, and thus can ensure the sealing effect on the gap to be bonded 310.

[0063] Specifically, in this embodiment, when die-cutting to obtain the through groove 211, the shape of the through groove 211 is made to match the shape of the tape assembly 100. Such an operation makes the through groove 211 also play a positioning role for the tape assembly 100, which is beneficial to the rapid and accurate assembly of the tape assembly 100 and the bonding tooling 200.

[0064] Specifically, in this embodiment, the tape assembly 100 is rectangular, the first set of positioning holes includes two first positioning holes 130, both of the two first positioning holes 130 are located outside the bonding tape 111 and are arranged at the diagonals of the tape assembly 100;

[0065] The through groove 211 is rectangular, the second set of positioning holes includes two second positioning holes 220, and the two second positioning holes 220 are arranged at the diagonals of the through groove 211.

[0066] Specifically, in this embodiment, the steps of manufacturing the bonding tooling 200 further include: punching a third set of positioning holes in the support film 210 after laminating and bonding, and the positioning holes of the third set of positioning holes correspond one-to-one with the positioning holes of the fourth set of positioning holes of the object to be bonded 300.

[0067] The steps of bonding and sealing further include: before bonding the adhesive side of the bonding tape 111 to the gap to be bonded 310, aligning the positioning holes of the third set of positioning holes with the positioning holes of the fourth set of positioning holes of the object to be bonded 300 one by one.

[0068] In the sealing method provided in this embodiment, before bonding the bonding tape 111 to the object to be bonded 300, the positioning holes of the third set of positioning holes of the bonding tooling 200 can be aligned with the positioning holes of the fourth set of positioning holes of the object to be bonded 300 first, so as to improve the positioning accuracy of the bonding tooling 200, and further facilitate the accurate bonding of the bonding tape 111 to the object to be bonded 300 and ensure the sealing effect on the gap to be bonded 310.

[0069] By punching the third set of positioning holes in the bonding tooling 200 and, when bonding the bonding tape 111 to the object to be bonded 300, first positioning the assembled tape assembly 100 and the bonding tooling 200 so that the positioning holes of the third set of positioning holes are aligned with the positioning holes of the fourth set of positioning holes one by one, it is beneficial to ensure the position accuracy of the bonding tooling 200, and further beneficial to accurately bonding the bonding tape 111 to the object to be bonded 300 and ensuring the sealing effect on the gap to be bonded 310.

[0070] Specifically, in this embodiment, the fourth set of positioning holes includes two fourth positioning holes 320.

[0071] Specifically, in this embodiment, the bonding tooling 200 is rectangular, the third set of positioning holes includes two third positioning holes 230, both of the two third positioning holes 230 are located outside the through groove 211 and are arranged at the diagonals of the bonding tooling 200. By operating like this, the distance between the third set of positioning holes and the tape assembly 100 in the through groove 211 is relatively far, and it can effectively avoid affecting the tape assembly 100 when positioning the bonding tooling 200 to the object to be bonded 300.

[0072] Figure 3 It is a schematic exploded view of the tape assembly 100 in the sealing method provided in this embodiment. Figure 5 It is a schematic exploded view of the bonding tooling 200 in the sealing method provided in this embodiment.

[0073] In summary, the sealing method provided in this embodiment may specifically include the following steps:

[0074] S100 Manufacture the bonding tape 111, asFigure 2 and Figure 3 As shown in Figure 3 , it may specifically include: S102 bonding protective films 120 on both sides of the adhesive tape 110 to form an adhesive tape assembly 100; S104 simultaneously die-cutting the adhesive tape 110 and the protective film 120 on the side of the adhesive tape 110 with an adhesive; punching a first set of positioning holes in the adhesive tape assembly 100.

[0075] S200 fabricate a bonding tooling 200, as Figure 4 and Figure 5 shown in Figure 5 , it may specifically include: S202 laminating and bonding at least two layers of support films 210; S204 die-cutting the outermost support film 210 to obtain a through groove 211 for accommodating the adhesive tape 110; punching a second set of positioning holes and a third set of positioning holes in the support films 210 after laminating and bonding.

[0076] S300 assemble, as Figure 6 shown in Figure 6 , align the positioning holes of the first set of positioning holes with the positioning holes of the second set of positioning holes one by one, and bond the back side of the adhesive tape 110 into the through groove 211.

[0077] S400 bond and seal, as Figure 7 shown in Figure 7 , align the positioning holes of the third set of positioning holes with the positioning holes of the fourth set of positioning holes of the object to be bonded 300, bond the side of the bonding tape 111 with an adhesive to the gap to be bonded 310, and remove the bonding tooling 200.

[0078] This embodiment also provides a bonding tooling 200, which can be used for the above sealing method. The bonding tooling 200 includes at least two layers of bonded support films 210, and a through groove 211 is provided in the outermost support film 210. The through groove 211 is used to accommodate the bonding tape 111, and the bonding tape 111 is an adhesive tape matching the shape of the gap to be bonded 310.

[0079] The bonding tooling 200 provided in this embodiment includes at least two layers of support films 210. When in use, first bond the back side of the adhesive tape 110 into the through groove 211 of the bonding tooling 200, then bond the side of the bonding tape 111 with an adhesive to the gap to be bonded 310, and remove the bonding tooling 200, that is, complete the sealing of the gap to be bonded 310.

[0080] For the bonding tooling 200 provided in this embodiment, the support film 210 plays a supporting role for the bonding tape 111, making the bonding tape 111 not easily deformed and maintaining flat. Thus, when sealing the gap to be bonded 310, each part of the bonding tape 111 can contact the object to be bonded 300 simultaneously, be flatly bonded to the object to be bonded 300, and strictly seal the gap to be bonded 310; in addition, the bonding tape 111 maintaining flat and not deformed is also beneficial to avoiding the generation of bubbles, thereby ensuring the sealing effect.

[0081] Specifically, in this embodiment, the bonding tooling 200 is provided with a second positioning hole group, and the positioning holes of the second positioning hole group correspond one-to-one to the positioning holes of the first positioning hole group of the tape assembly 100. The tape assembly 100 includes a tape 110 and protective films 120 laminated on both sides of the tape 110. Before bonding the die-cut and punched tape assembly 100 into the through groove 211 of the bonding tooling 200, the positioning holes of the first positioning hole group of the tape assembly 100 can be aligned with the positioning holes of the second positioning hole group of the bonding tooling 200 one by one, so as to improve the assembly accuracy of the tape assembly 100 and the bonding tooling 200, and further facilitate the accurate bonding of the bonding tape 111 to the object to be bonded 300, ensuring the sealing effect on the gap 310 to be bonded.

[0082] More specifically, the second positioning hole group includes two second positioning holes 220, and the two second positioning holes 220 correspond one-to-one to the two first positioning holes 130 of the tape assembly 100.

[0083] Specifically, in this embodiment, the bonding tooling 200 is further provided with a third positioning hole group, and the positioning holes of the third positioning hole group correspond one-to-one to the positioning holes of the fourth positioning hole group of the object to be bonded 300. Before bonding the bonding tape 111 to the object to be bonded 300, the positioning holes of the third positioning hole group of the bonding tooling 200 can be aligned with the positioning holes of the fourth positioning hole group of the object to be bonded 300 one by one, so as to improve the positioning accuracy of the bonding tooling 200, and further facilitate the accurate bonding of the bonding tape 111 to the object to be bonded 300, ensuring the sealing effect on the gap 310 to be bonded.

[0084] More specifically, the third positioning hole group includes two third positioning holes 230, and the two third positioning holes 230 correspond one-to-one to the two fourth positioning holes 320 of the object to be bonded 300.

[0085] Finally, it should also be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0086] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A sealing method for sealing the gaps of components of a lithography machine, characterized in that, the sealing method includes: die-cutting a tape to obtain a tape portion that matches the shape of the gap to be bonded, namely the bonding tape; laminating and bonding at least two support films, and then die-cutting the outermost support film to obtain a through groove for accommodating the tape, and simultaneously forming a bonding tooling; bonding the back side of the tape, i.e., the side of the tape without adhesive, into the through groove; bonding the side of the bonding tape with adhesive to the gap to be bonded, and removing the bonding tooling.

2. The sealing method according to claim 1, characterized in that, the sealing method further includes: before die-cutting the tape to obtain the bonding tape, bonding protective films on both sides of the tape respectively; when die-cutting, die-cutting the tape and the protective film on the side of the tape with adhesive simultaneously; bonding the protective film on the back side of the tape into the through groove, and then removing the part of the protective film on the side of the tape with adhesive that has the same shape as the bonding tape.

3. The sealing method according to claim 2, characterized in that, the sealing method further includes: before bonding the protective film on the back side of the tape into the through groove, punching a first set of positioning holes in the tape assembly, the tape assembly including the tape and the protective films on both sides of it; punching a second set of positioning holes in the part of the support film corresponding to the through groove, and the positioning holes of the second set of positioning holes correspond to the positioning holes of the first set of positioning holes one by one; when bonding the protective film on the back side of the tape into the through groove, aligning the positioning holes of the first set of positioning holes with the positioning holes of the second set of positioning holes one by one.

4. The sealing method according to claim 3, characterized in that, when die-cutting to obtain the through groove, making the shape of the through groove match the shape of the tape assembly.

5. The sealing method according to claim 4, characterized in that, the tape assembly is rectangular, the first set of positioning holes includes two first positioning holes, both of the two first positioning holes are located outside the bonding tape, and are arranged at the diagonals of the tape assembly; the through groove is rectangular, the second set of positioning holes includes two second positioning holes, and the two second positioning holes are arranged at the diagonals of the through groove.

6. The sealing method according to any one of claims 3-5, characterized in that, the sealing method further includes: punching a third set of positioning holes in the laminated and bonded support film, and the positioning holes of the third set of positioning holes correspond to the positioning holes of the fourth set of positioning holes of the object to be bonded one by one; before bonding the side of the bonding tape with adhesive to the gap to be bonded, aligning the positioning holes of the third set of positioning holes with the positioning holes of the fourth set of positioning holes of the object to be bonded one by one.

7. The sealing method according to claim 6, characterized in that, the bonding tooling is rectangular, the third set of positioning holes includes two third positioning holes, both of the two third positioning holes are located outside the through groove, and are arranged at the diagonals of the bonding tooling.

8. A bonding tooling, characterized in that, the bonding tooling (200) includes at least two bonded support films (210), and a through groove (211) is provided on the outermost support film (210), and the through groove (211) is used for accommodating the bonding tape (111), and the bonding tape (111) is a tape that matches the shape of the gap to be bonded (310).

9. The bonding tooling according to claim 8, Characterized in that, The bonding tooling (200) is provided with a second positioning hole group, and the positioning holes of the second positioning hole group correspond one-to-one with the positioning holes of the first positioning hole group of the tape assembly. The tape assembly (100) includes a tape (110) and protective films (120) laminated on both sides of the tape (110).

10. The bonding tooling according to claim 9, Characterized in that, The bonding tooling (200) is further provided with a third positioning hole group, and the positioning holes of the third positioning hole group correspond one-to-one with the positioning holes of the fourth positioning hole group of the object to be bonded (300).

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