Magnetic device with shield layer and method of manufacturing inductor

Abstract

The present invention provides a magnetic device with a shielding layer and a method for manufacturing an inductor. The magnetic device has a body, wherein a shielding layer is formed on the body to prevent magnetic field leakage to the outside of the magnetic device, thereby reducing electromagnetic interference and the size of the magnetic device.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 201910294619.0, filed on April 12, 2019, entitled "Shielding Magnetic Device and Manufacturing Method Thereof". Technical Field

[0002] This invention relates to a magnetic device, and more particularly to a magnetic device having a shielding layer for reducing electromagnetic interference. Background Technology

[0003] As electronic circuit applications move towards higher frequencies and miniaturization, the distance between multiple electronic components in a system is becoming increasingly closer, thus making electromagnetic interference (EMI) problems more and more serious.

[0004] Traditional magnetic devices are typically shielded by a metal housing made of folded metal plates, which results in higher costs and larger sizes.

[0005] Additionally, when using a metal folding plate to shield a magnetic device, gaps may exist around the corners of the metal folding plate. This can cause the internal magnetic field of the magnetic device to leak to the outside of the magnetic device through these gaps, resulting in electromagnetic interference problems for the system.

[0006] Therefore, a better solution is needed to address the above problems. Summary of the Invention

[0007] One object of the present invention is to form a shielding layer on the body of the magnetic device to prevent magnetic field leakage to the outside of the magnetic device, thereby reducing electromagnetic interference and the size of the magnetic device.

[0008] One object of the present invention is to form multiple shielding layers on the body of the magnetic device, thereby preventing magnetic field leakage to the outside of the magnetic device at both high operating frequencies above 3MHz and low operating frequencies below 3MHz, thereby reducing electromagnetic interference. Shielding layers made of highly conductive metals such as copper are beneficial for shielding high-frequency magnetic fields, while those made of highly permeable metals such as iron (Fe) and nickel (Ni) are beneficial for shielding low-frequency magnetic fields.

[0009] An embodiment of the present invention discloses a magnetic device with a shielding layer and a method for manufacturing an inductor. The magnetic device has a body, wherein a shielding layer is formed on the body to prevent magnetic field leakage to the outside of the magnetic device, thereby reducing electromagnetic interference and the size of the magnetic device.

[0010] An embodiment of the present invention discloses a magnetic device comprising: a body; and at least one conductive layer, wherein the at least one conductive layer is formed on the body, and wherein the at least one conductive layer covers at least the upper surface of the body to shield the magnetic device.

[0011] In one embodiment, the body includes a magnetic body, wherein a coil is disposed within the magnetic body.

[0012] In one embodiment, the at least one conductive layer covers the upper surface of the body and extends through one side surface of the body to a lower surface of the body.

[0013] In one embodiment, the at least one conductive layer covers the upper surface of the body and extends to the four side surfaces of the body.

[0014] In one embodiment, the at least one conductive layer is made of metal, wherein the metal is electroplated on the body to shield the magnetic device.

[0015] In one embodiment, the at least one conductive layer is made of metal, which is sputtered onto the body to shield the magnetic device.

[0016] In one embodiment, the at least one conductive layer is made of a conductive and adhesive material, wherein the conductive and adhesive material is coated on the body to shield the magnetic device.

[0017] In one embodiment, a lead frame is disposed on a first side surface of the magnetic body, wherein the sum of the extension length of the conductive layer on the first side surface of the magnetic body and the extension length of the lead frame on the first side surface of the magnetic body is greater than 40% of the length of the first side surface of the magnetic body.

[0018] In one embodiment, a first electrode, a second electrode, and a third electrode are all disposed on the lower surface of the magnetic body, wherein the first electrode and the second electrode are electrically connected to the coil, and the third electrode is electrically connected to the at least one conductive layer, wherein the width of the third electrode is greater than the width of the first electrode and the width of the second electrode, respectively.

[0019] In one embodiment, an insulating layer is disposed on the magnetic body, wherein at least one conductive layer is formed on the insulating layer to shield the magnetic device.

[0020] In one embodiment, the at least one conductive layer is made of metal, wherein the metal is electroplated or sputtered onto the insulating layer to shield the magnetic device.

[0021] In one embodiment, the at least one conductive layer is made of a conductive and adhesive material, wherein the conductive and adhesive material is coated on the insulating layer to shield the magnetic device.

[0022] In one embodiment, the at least one conductive layer comprises a metal layer, wherein the metal layer is made of at least one of the following metallic materials: copper, aluminum, nickel, iron, tin, and silver.

[0023] In one embodiment, the at least one conductive layer comprises a metal layer, wherein the metal layer is made of at least one of the following metallic materials: ferrite, iron, and nickel.

[0024] In one embodiment, the at least one conductive layer comprises a plurality of metal layers, wherein each pair of adjacent metal layers is made of a different metal material.

[0025] In one embodiment, the plurality of metal layers includes a metal layer made of copper.

[0026] In one embodiment, the plurality of metal layers includes a metal layer made of iron and nickel.

[0027] An embodiment of the present invention discloses a magnetic device comprising: a body and a coil disposed within the body, the body having an upper surface, a lower surface and a first side surface connecting the upper surface and the lower surface; and a conductive housing disposed on the body to shield the magnetic device, wherein the conductive housing covers the upper surface of the body and extends to a plurality of side surfaces of the body, wherein there is no gap between any two portions of the conductive housing.

[0028] In one embodiment, the conductive housing is made entirely of metal.

[0029] In one embodiment, the conductive housing includes a metal folded plate, wherein two portions of the metal folded plate are respectively disposed on two adjacent side surfaces of the body, and a conductive and adhesive material fills the gap between the two portions of the metal folded plate.

[0030] In one embodiment, the conductive and adhesive material comprises silver paste.

[0031] In one embodiment, the conductive and adhesive material comprises graphene adhesive.

[0032] In one embodiment of the present invention, a magnetic device is disclosed, the magnetic device comprising a body, wherein the body is shielded by at least a material comprising iron and nickel for shielding the magnetic device.

[0033] In one embodiment, the body is encapsulated by a metal layer comprising iron and nickel, wherein the metal layer is formed on the body.

[0034] In one embodiment, the body is encapsulated in a metal casing containing iron and nickel.

[0035] In one embodiment, the plurality of metal layers includes a first metal layer made of copper and a second metal layer made of iron and nickel.

[0036] An embodiment of the present invention discloses a magnetic device comprising: a coil; a body in which the coil is disposed, wherein the body has an upper surface, a lower surface and a first side surface connecting the upper surface and the lower surface; a conductive housing disposed on the body for shielding the magnetic device; and a lead frame disposed on the body, wherein the sum of the extension length of the conductive housing on the first side surface of the body and the extension length of the lead frame on the first side surface of the body is greater than 40% of the length of the first side surface of the body.

[0037] An embodiment of the present invention discloses a magnetic device comprising: a coil; a magnetic body, wherein the coil is disposed in the magnetic body, wherein the magnetic body has an upper surface, a lower surface and a first side surface connecting the upper surface and the lower surface; a conductive housing disposed on the magnetic body for shielding the magnetic device; and a lead frame disposed on the magnetic body, wherein the sum of the extension length of the conductive housing on the first side surface of the magnetic body and the extension length of the lead frame on the first side surface of the magnetic body is greater than 40% of the length of the first side surface of the magnetic body.

[0038] An embodiment of the present invention discloses a method for forming a magnetic device, wherein the method includes: providing a magnetic device having a body, and forming at least one conductive layer on the body of the magnetic device for shielding the magnetic device.

[0039] An embodiment of the present invention discloses a method for forming a magnetic device, wherein the method includes: providing a magnetic device having a body, and forming at least one first conductive layer on the body of the magnetic device for shielding the magnetic device, wherein the first conductive layer extends from the upper surface of the body to the lower surface of the body for forming an electrode electrically connected to a ground.

[0040] An embodiment of the present invention discloses a method for forming a magnetic device, the method comprising: providing a magnetic device having a body; forming at least one first conductive layer on the body of the magnetic device for shielding the magnetic device, wherein the first conductive layer extends from an upper surface of the body to a lower surface of the body for forming an electrode electrically connected to a ground; and forming two electrodes on the lower surface of the body, the two electrodes being electrically connected to a coil disposed within the body.

[0041] To make the above and other features and advantages of the present invention more readily understood, several embodiments of the invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0042] The following description, in conjunction with the accompanying drawings, is provided to provide a further understanding of the invention, and the drawings are included in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0043] Figure 1A An enlarged view of a magnetic device according to an embodiment of the present invention is shown. The magnetic device has a shielding layer that encapsulates a body of the magnetic device.

[0044] Figure 1B An enlarged view of a magnetic device according to an embodiment of the present invention is shown. The magnetic device has a shielding layer that encapsulates a body of the magnetic device.

[0045] Figure 1C A cross-sectional view of a plurality of shielding layers is shown in one embodiment of the present invention, the plurality of shielding layers encapsulating a body of a magnetic device;

[0046] Figure 1D An electrode structure of a magnetic device is shown in one embodiment of the present invention;

[0047] Figure 1E An electrode structure of a magnetic device is shown in one embodiment of the present invention;

[0048] Figure 2A A method for forming a magnetic device is shown in one embodiment of the present invention;

[0049] Figure 2B A method for forming a magnetic device is shown in one embodiment of the present invention;

[0050] Figure 2C A method for forming a magnetic device is shown in one embodiment of the present invention;

[0051] Figure 2D A method for forming a magnetic device is shown in one embodiment of the present invention;

[0052] Figure 3 A graph showing a comparison of the degree of magnetic field leakage of a magnetic device according to an embodiment of the present invention with different shielding layers;

[0053] Figure 4A An enlarged view of a magnetic device according to an embodiment of the present invention is shown, the magnetic device having a metal housing for encapsulating a body of the magnetic device;

[0054] Figure 4BAn enlarged view of a magnetic device according to an embodiment of the present invention is shown. The magnetic device has a metal housing for encapsulating a body of the magnetic device; and

[0055] Figure 5A A side view of a magnetic device according to an embodiment of the present invention is shown.

[0056] Figure 5B A front view of one side surface of a main body of a magnetic device according to an embodiment of the present invention is shown.

[0057] Explanation of reference numerals in the attached drawings: 100 - Magnetic device; 100S - Electrode structure; 100SL - Side surface; 101 - Body; 101a - Insulating layer; 102 - Conductive layer; 102a - Metal layer made of silver; 102b - Metal layer made of copper; 102c - Metal layer made of iron and nickel; 102d - Metal layer made of copper; 102e - Metal layer made of iron and nickel; 102S1, 102S2 - Multiple side surfaces of the body; 103 - First electrode; 104 - Second electrode; 105 - Third electrode; 106 - Fourth electrode; 107 - Coil; 108 - Conductive housing; 109 - Lead frame; 400 - Magnetic device; D1 - Extension length of the lead frame on the first side surface; D2 - Extension length of the conductive layer on the first side surface; T - Length of the first side surface. Detailed Implementation

[0058] Figure 1A An enlarged cross-sectional view of a magnetic device 100 according to an embodiment of the present invention is shown, wherein the magnetic device 100 includes a body 101; at least one conductive layer 102, wherein the at least one conductive layer 102 is formed on the body 101 for shielding the magnetic device 100 to reduce magnetic flux leakage generated by the magnetic device 100, thereby reducing electromagnetic interference in the system, wherein the at least one conductive layer 102 at least covers the upper surface of the body 101 of the magnetic device 100.

[0059] In one embodiment, at least one conductive layer 102 covers the upper surface of the body and extends to at least one side surface of the body 101.

[0060] In one embodiment, at least one conductive layer 102 covers the upper surface of the body 101 and extends to a plurality of side surfaces 102S1, 102S2 of the body 101, such as Figure 1B As shown.

[0061] In one embodiment, at least one conductive layer 102 is made of metal, wherein the metal is electroplated on the body 101 to shield the magnetic device 100.

[0062] In one embodiment, at least one conductive layer 102 is made of metal, wherein the metal is sputtered onto the body 101 to shield the magnetic device 100.

[0063] In one embodiment, at least one conductive layer 102 is made of a conductive and adhesive material, wherein the conductive and adhesive material is coated on the body 101 to shield the magnetic device 100.

[0064] In one embodiment, the conductive and adhesive material comprises silver paste.

[0065] In one embodiment, the conductive and adhesive material comprises graphene adhesive.

[0066] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least one conductive layer 102 is electroplated on the insulating layer to shield the magnetic device 100.

[0067] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least one conductive layer 102 is sputtered on the insulating layer to shield the magnetic device 100.

[0068] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least one conductive layer 102 is made of a conductive and adhesive material, wherein the conductive and adhesive material is coated on the insulating layer to shield the magnetic device 100.

[0069] In one embodiment, the at least one conductive layer comprises a metal layer, wherein the metal layer is made of at least one of the following metallic materials: copper, aluminum, nickel, iron, tin, and silver.

[0070] In one embodiment, the at least one conductive layer comprises a metal layer, wherein the metal layer is made of at least one of the following metallic materials: ferrite, iron, and nickel.

[0071] In one embodiment, the at least one conductive layer comprises a plurality of metal layers, wherein each pair of adjacent metal layers is made of a different metal material.

[0072] In one embodiment, the plurality of metal layers includes a metal layer made of copper.

[0073] In one embodiment, the plurality of metal layers includes a metal layer made of iron and nickel.

[0074] In one embodiment, the conductive and adhesive material comprises silver paste.

[0075] In one embodiment, the conductive and adhesive material comprises graphene adhesive.

[0076] In one embodiment, the thickness of the first metal layer comprising iron and nickel is from 2 μm to 30 μm.

[0077] In one embodiment, the thickness of the first metal layer is 10 μm to 20 μm.

[0078] In one embodiment, the permeability of the first metal layer is greater than 500.

[0079] In one embodiment, the at least one conductive layer comprises at least one of the following magnetic materials: ferrite, alloy, iron, and nickel.

[0080] In one embodiment, the thickness of the first metal layer made of copper is greater than 5 μm, and the thickness of the second metal layer made of iron and nickel is greater than 2 μm.

[0081] In one embodiment, the thickness of the first metal layer made of copper is between 5 μm and 30 μm, and the thickness of the second metal layer made of iron and nickel is between 2 μm and 30 μm.

[0082] In one embodiment, the thickness of the first metal layer made of copper is between 20 μm and 30 μm, and the thickness of the second metal layer made of iron and nickel is between 10 μm and 20 μm.

[0083] In one embodiment, a first electrode, a second electrode, and a third electrode are disposed on the lower surface of the body 101, wherein the first and second electrodes are electrically connected to a coil, and the third electrode is electrically connected to at least one conductive layer 102. In one embodiment, the third electrode is located between the first and second electrodes. In one embodiment, the third electrode includes an edge of the lower surface of the body 101.

[0084] Figure 1C An enlarged cross-sectional view of a magnetic device 100 is shown, wherein the magnetic device 100 includes a body 101; at least one conductive layer 102, wherein the at least one conductive layer 102 is formed on the body 101 of the magnetic device 100 for shielding the magnetic device 100 to reduce magnetic flux leakage generated by the magnetic device 100, thereby reducing electromagnetic interference in the system, wherein the at least one conductive layer 102 at least covers the upper surface of the body 101 of the magnetic device 100.

[0085] In one embodiment, the body 101 is a magnetic body, and an insulating layer 101a is disposed on the magnetic body 101, wherein at least one conductive layer 102 is formed on the insulating layer 101a for shielding the magnetic device 100.

[0086] In one embodiment, at least one conductive layer 102 includes multiple conductive layers, the body 101 is a magnetic body, wherein an insulating layer 101a is disposed on the magnetic body 101, and multiple conductive layers 102 are formed on the insulating layer 101a for shielding the magnetic device 100.

[0087] In one embodiment, a metal layer 102a made of silver (Ag) is disposed on an insulating layer 101a.

[0088] In one embodiment, a metal layer 102b made of copper is disposed on a metal layer 102a made of silver.

[0089] In one embodiment, a metal layer 102c made of iron and nickel is disposed on a metal layer 102b made of copper.

[0090] In one embodiment, a metal layer 102d made of copper is disposed on a metal layer 102c made of iron and nickel.

[0091] In one embodiment, a metal layer 102e made of iron and nickel is disposed on a metal layer 102d made of copper.

[0092] In one embodiment, a metal layer 102b made of copper is disposed on an insulating layer 101a.

[0093] In one embodiment, a metal layer 102c made of iron and nickel is disposed on a metal layer 102b made of copper.

[0094] In one embodiment, a metal layer 102d made of copper is disposed on a metal layer 102c made of iron and nickel.

[0095] In one embodiment, a metal layer 102e made of iron and nickel is disposed on a metal layer 102d made of copper (Cu).

[0096] In one embodiment, a metal layer 102c made of iron and nickel is disposed on an insulating layer 101a.

[0097] In one embodiment, a metal layer 102b made of copper is disposed on a metal layer 102c made of iron and nickel.

[0098] In one embodiment, a metal layer 102e made of iron and nickel is disposed on a metal layer 102b made of copper.

[0099] In one embodiment, a metal layer 102d made of copper is disposed on a metal layer 102e made of iron and nickel.

[0100] Figure 1D An electrode structure of a magnetic device according to an embodiment of the present invention is shown. In one embodiment, as... Figure 1DAs shown, the electrode structure 100S is disposed on the lower surface of the body 101 and includes a first electrode 103, a second electrode 104 and a third electrode 105, wherein the third electrode 105 is electrically connected to at least one conductive layer for shielding the magnetic device, and wherein the third electrode 105 is electrically connected to a ground, and the first electrode 103 and the second electrode 104 are electrically connected to a coil inside the body 101.

[0101] like Figure 1D As shown, the thickness of the third electrode 105 can be the same as the thickness of each of the first electrode 103 and the second electrode 104. In one embodiment, the width of the third electrode 105 is greater than the width of the first electrode 103 and the width of the second electrode 104, respectively, wherein each of the widths is measured on one side surface 100SL of the electrode structure 100S, as shown. Figure 1D As shown.

[0102] In one embodiment, the width of the third electrode 105 is at least three times the width of each of the first electrode 103 and the second electrode 104 to reduce electromagnetic interference. In another embodiment, the width of the third electrode 105 is at least four times the width of each of the first electrode 103 and the second electrode 104 to reduce electromagnetic interference.

[0103] In one embodiment, the width of each of the first electrode 103 and the second electrode 104 is between 0.1 mm and 0.3 mm, and the width of the third electrode 105 is between 0.6 mm and 1.0 mm. In another embodiment, the width of each of the first electrode 103 and the second electrode 104 is 0.2 mm, and the width of the third electrode 105 is 0.8 mm.

[0104] In one embodiment, the third electrode 105 is located between the first electrode 103 and the second electrode 104. In one embodiment, the thickness of each of the first electrode 103, the second electrode 104 and the third electrode 105 is 0.2 mm.

[0105] Figure 1E An electrode structure of a magnetic device according to an embodiment of the present invention is shown. In one embodiment, as... Figure 1E As shown, a first electrode 103 and a second electrode 104 are disposed on the lower surface of the body 101 and electrically connected to a coil disposed inside the body 101. At least one conductive layer 102 extends from the upper surface of the body 101 to the lower surface of the body 101 through the side surface of the body 101. The extension portion of the at least one conductive layer 102 disposed on the lower surface of the body 101 can be used to form a third electrode 105, which can be electrically connected to a ground.

[0106] In one embodiment, a first electrode, a second electrode, a third electrode, and a fourth electrode are disposed on the lower surface of the body 101, wherein the first electrode and the second electrode are electrically connected to a coil disposed inside the body 101, the third electrode and the second electrode are electrically connected to the coil, the third electrode and the fourth electrode are electrically connected to at least one conductive layer, and the third electrode and the fourth electrode may be electrically connected to a ground.

[0107] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least a conductive layer 102 is electroplated on the insulating layer to shield the magnetic device.

[0108] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least the conductive layer 102 is sputtered on the insulating layer to shield the magnetic device.

[0109] In one embodiment, the body 101 includes an insulating layer and a magnetic body, wherein the insulating layer is disposed on the magnetic body, and at least a conductive layer 102 is coated on the insulating layer to shield the magnetic device.

[0110] In one embodiment, such as Figure 5A As shown, a lead frame 109 is disposed on the body 101, wherein the sum of the extension length D2 of the conductive layer 102 on the first side surface of the body 101 and the extension length D1 of the lead frame 109 on the first side surface of the body 101 is greater than 40% of the length T of the first side surface of the body 101, as shown. Figure 5B As shown.

[0111] Figure 2A A method for forming a magnetic device according to an embodiment of the present invention is shown, wherein the method includes: step 201: providing a magnetic device having a body; step 202: forming at least one conductive layer on the body of the magnetic device for shielding the magnetic device, wherein the at least one conductive layer extends from the upper surface of the body of the magnetic device to the lower surface of the body of the magnetic device for forming an electrode electrically connected to a ground.

[0112] Figure 2B The present invention illustrates a method for forming a magnetic device according to an embodiment of the invention, wherein the method includes: step 301: providing a magnetic device having a body and a coil disposed in the body; step 302: forming at least one conductive layer on the body of the magnetic device for shielding the magnetic device, wherein the at least one conductive layer extends from the upper surface of the body to the lower surface of the body for forming an electrode for electrically connecting to a ground.

[0113] Figure 2CA method for forming a magnetic device according to an embodiment of the present invention is shown, wherein the method includes: step 401: providing a magnetic device having a body and a coil disposed in the body; step 402: forming at least one conductive layer on the body for shielding the magnetic device, wherein the at least one conductive layer extends from the upper surface of the body to the lower surface of the body of the magnetic device for forming an electrode electrically connected to a ground; step 403: forming two electrodes on the lower surface of the body, the two electrodes being electrically connected to the coil disposed in the body.

[0114] Figure 2D The present invention illustrates a method for forming a magnetic device according to an embodiment of the invention, wherein the method includes: step 501: providing a magnetic device having a magnetic body and a coil disposed in the magnetic body; step 502: forming an insulating layer on the magnetic body; step 503: forming at least one conductive layer on the insulating layer for shielding the magnetic device, wherein the at least one conductive layer extends from the upper surface of the magnetic body to the lower surface of the magnetic body for forming an electrode electrically connected to a ground; step 504: forming two electrodes on the lower surface of the body, the two electrodes being electrically connected to the coil disposed in the body.

[0115] Figure 3 A graph showing a comparison of the degree of magnetic field leakage of a magnetic device according to an embodiment of the present invention with different shielding layers is provided, wherein increasing the thickness of the conductive layer or increasing the number of conductive layers can improve the shielding effect.

[0116] Figure 4A An enlarged view of a magnetic device 400 according to an embodiment of the present invention is shown, wherein the magnetic device 400 includes: a coil 107; a body 101, wherein the coil 107 is disposed in the body 101, the body 101 having an upper surface, a lower surface and a plurality of side surfaces connecting the upper surface and the lower surface; and a conductive housing 108 disposed on the body 101 for shielding the magnetic device 400, wherein the conductive housing 108 covers the upper surface of the body and extends to cover the plurality of side surfaces of the body 101, wherein there is no gap between any two conductive portions of the conductive housing 108.

[0117] In one embodiment, the conductive housing 108 is made entirely of metal.

[0118] In one embodiment, the conductive housing 108 includes a metal folded plate, wherein two portions of the metal folded plate are respectively disposed on two adjacent side surfaces of the body, and a conductive and adhesive material fills the gap between the two portions of the metal folded plate.

[0119] In one embodiment, the conductive and adhesive material comprises silver paste.

[0120] In one embodiment, the conductive and adhesive material comprises graphene adhesive.

[0121] In one embodiment, the conductive housing is made entirely of metal.

[0122] Figure 4B This diagram shows an enlarged view of a magnetic device 400 according to an embodiment of the present invention. The magnetic device 400 includes: a coil 107; a body 101, wherein the coil 107 is disposed within the body 101, the body 101 having an upper surface, a lower surface, and a plurality of side surfaces connecting the upper and lower surfaces; a conductive housing 108 disposed on the body 101 for shielding the magnetic device 400, wherein the conductive housing 108 covers the upper surface of the body and extends to cover the plurality of side surfaces of the body 101; and a lead frame 109 disposed on the body 101, wherein the sum of the extension length D2 of the conductive housing 108 on a first side surface of the body 101 and the extension length D1 of the lead frame 109 on the first side surface of the body 101 is greater than 40% of the length T of the first side surface of the body 101. Figure 5B As shown.

[0123] In one embodiment, a conductive housing 108 extends from the upper surface of the body 101 to the lower surface to form an electrode 105 for electrical connection to a grounded electrode; a lead frame 109 disposed on the body extends from the side surface of the body to the lower surface to form electrodes 103 and 104, which are electrically connected to a coil 107.

[0124] In one embodiment, the conductive housing 108 is made of metal, which covers the upper surface of the body and extends to a plurality of side surfaces of the body, wherein there is no gap between any two portions of the conductive housing 108 made of metal.

[0125] In one embodiment, the conductive housing 108 is made of metal, wherein a first electrode 103, a second electrode 104, and a third electrode 105 are disposed on the lower surface of the body 101, wherein the first electrode 103 and the second electrode 104 are electrically connected to the coil 107, and the third electrode 105 is electrically connected to the conductive housing 108. In another embodiment, the conductive housing 108, made of metal, extends to the lower surface of the body to form a fourth electrode 106 for electrical connection to a ground, that is, both the third electrode 105 and the fourth electrode 106 are electrically connected to the conductive housing 108. The third electrode 105 and the fourth electrode 106 can be electrically connected to a ground.

[0126] In one embodiment, the conductive housing 108 is made of metal, wherein a first electrode, a second electrode, a third electrode, and a fourth electrode are disposed on the lower surface of the body, wherein the first and second electrodes are electrically connected to a coil, and each of the third and fourth electrodes is electrically connected to the conductive housing 108. In one embodiment, the conductive housing 108 extends to a first portion of the lower surface of the body to form the third electrode, and the conductive housing 108 extends to a second portion of the lower surface of the body to form the fourth electrode.

[0127] One embodiment of the present invention discloses a magnetic device comprising a body, wherein the body is encapsulated by a material comprising iron and nickel to shield the magnetic device.

[0128] In one embodiment, the body is encapsulated by a metal layer comprising iron and nickel, wherein the metal layer comprising iron and nickel is formed on the body.

[0129] In one embodiment, the body is encapsulated by a metal casing containing iron and nickel.

[0130] Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications can be made to the described embodiments without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the appended claims, not by the detailed description above.

Claims

1. A method of manufacturing a magnetic device having a shield layer, characterized by, The method includes: Provides a magnetic device with an integral component; A first metal layer is electroplated on the upper surface of the body to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after electroplating on the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

2. A method of manufacturing a magnetic device having a shield layer, characterized by, The method includes: Provides a magnetic device with an integral component; A first metal layer is sputtered onto the upper surface of the body to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after sputtering on the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

3. A method of manufacturing a magnetic device having a shield layer, characterized by, The method includes: A magnetic device having a magnetic body is provided; An insulating layer is disposed on the magnetic body; A first metal layer is electroplated on the upper surface of the insulating layer to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after electroplating on the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

4. A method of manufacturing a magnetic device having a shield layer, characterized by, The method includes: A magnetic device having a magnetic body is provided; An insulating layer is provided on the magnetic body of the magnetic device; A first metal layer is sputtered onto the upper surface of the insulating layer to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after sputtering on the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

5. A method of manufacturing a magnetic device having a shield layer, characterized by, The method includes: Provides a magnetic device with an integral component; A first metal layer is electroplated on the body to shield the magnetic device. The upper surface of the first metal layer is only visible after electroplating on the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

6. A method for manufacturing a magnetic device with a shielding layer, characterized in that, The method includes: Provides a magnetic device with an integral component; A first metal layer is sputtered onto the body to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after sputtering on the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body, and the thickness of the first metal layer is 10 μm to 20 μm; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

7. A method for manufacturing a magnetic device with a shielding layer, characterized in that, The method includes: A magnetic device having a magnetic body is provided; An insulating layer is provided on the magnetic body of the magnetic device; A first metal layer is electroplated on the upper surface of the insulating layer to shield the magnetic device. The upper surface of the first metal layer is only visible after electroplating on the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

8. A method for manufacturing a magnetic device with a shielding layer, characterized in that, The method includes: A magnetic device having a magnetic body is provided; An insulating layer is provided on the magnetic body of the magnetic device; A first metal layer is sputtered onto the upper surface of the insulating layer to shield the magnetic device. The upper surface of the first metal layer is only visible after sputtering onto the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

9. A method for manufacturing a magnetic device with a shielding layer, characterized in that, The method includes: Provides a magnetic device with an integral component; A first metal layer is deposited on the upper surface of the body to shield the magnetic device, wherein the upper surface of the first metal layer is only visible after the coating is applied to the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

10. A method for manufacturing an inductor with a shielding layer, characterized in that, The method includes: Provide an inductor with a single component; A first metal layer is electroplated on the body to shield the inductor. The upper surface of the first metal layer is only visible after electroplating on the body, and the first metal layer completely covers the upper surface of the body and extends from the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

11. A method for manufacturing an inductor with a shielding layer, characterized in that, The method includes: Provide an inductor with a single component; and A first metal layer is sputtered onto the body to shield the inductor, wherein the upper surface of the first metal layer is only visible after sputtering on the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body, and the thickness of the first metal layer is 10 μm to 20 μm; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

12. A method for manufacturing an inductor with a shielding layer, characterized in that, The method includes: Provide an inductor having a magnetic body; An insulating layer is disposed on the magnetic body; A first metal layer is electroplated on the upper surface of the insulating layer to shield the inductor. The upper surface of the first metal layer is only visible after electroplating on the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

13. A method for manufacturing an inductor with a shielding layer, characterized in that, The method includes: Provide an inductor having a magnetic body; An insulating layer is disposed on the magnetic body; A first metal layer is sputtered onto the upper surface of the insulating layer to shield the inductor. The upper surface of the first metal layer is only visible after sputtering onto the upper surface of the insulating layer, and the first metal layer completely covers the upper surface of the magnetic body and extends through the side surface of the body to the lower surface of the body. The thickness of the first metal layer is 10 μm to 20 μm. A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

14. A method for manufacturing an inductor with a shielding layer, characterized in that, The method includes: Provide an inductor with a single component; A first metal layer is deposited on the upper surface of the body to shield the inductor, wherein the upper surface of the first metal layer is only visible after the coating is applied to the upper surface of the body, and the first metal layer completely covers the upper surface of the body and extends through the side surface of the body to the lower surface of the body; and A first electrode and a second electrode are formed on the lower surface of the body, and the first metal layer has a closed path surrounding the first electrode and the second electrode without gaps on the lower surface of the body.

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