Integrated device with electromagnetic shielding

Abstract

Improve EM coupling of wafer bonding process from a first wafer to a second wafer by shielding techniques. Examples may include building an EM shield implemented by BEOL stack / wiring, bonding contacts and TSVs for an integrated device closed-loop shielding platform to minimize eddy current-induced EM interference from active devices. The shield may be implemented in the active device layer during a wafer-to-wafer bonding process using two different device layers / wafers (active device layer / wafer and passive device layer / wafer). The shield may be designed by patterned wiring for both I / O ports and GND contacts.

Description

[0001] Priority claim

[0002] This patent application claims priority to application No. 16 / 706,167, filed on December 6, 2019, entitled “INTEGRATED DEVICE WITH ELECTROMAGNETIC SHIELD,” and which is assigned to the assignee of the present application and is expressly incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to integrated devices and, more particularly, but not exclusively, to integrated devices having electromagnetic (EM) shielding. Background Art

[0004] As electronic devices increase functionality while striving to maintain a small form factor, the need for more integrated devices becomes important. For example, integrating passive and active devices into a single package helps achieve greater integration while reducing the form factor of the integrated device compared to two separate devices. A conventional approach uses two devices arranged side by side on a common substrate. However, the lateral size of the integrated device still causes problems. Another conventional approach uses a device vertically arranged on top of another device on a common substrate. However, for example, lateral integration can cause problems with EM interference between active and passive devices.

[0005] Therefore, there is a need for systems, apparatus, and methods that overcome the deficiencies of conventional approaches including methods, systems, and apparatus provided herein. Summary of the invention

[0006] A simplified summary of one or more aspects and / or examples associated with the apparatus and methods disclosed herein is presented below. Therefore, the following summary of the invention should not be considered as a broad overview of all conceived aspects and / or examples, nor should the following summary of the invention be considered as identifying the key or main elements of all conceived aspects and / or examples, or describing the scope associated with any particular aspect and / or example. Therefore, the sole purpose of the following summary of the invention is to present certain concepts related to one or more aspects and / or examples of the apparatus and methods disclosed herein in a simplified form before the specific embodiments presented below.

[0007] In one aspect, an integrated device includes: a first device layer, including active devices and a first device bonding layer; a second device layer, including passive devices and a second device bonding layer, the second device layer being attached to the first device bonding layer; and a shielding member, which includes a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contacts in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane opposite to the first plane and parallel to the second plane, and a plurality of line end interconnects in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer interconnects to at least another of the plurality of bonding layer interconnects, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias.

[0008] In another aspect, an integrated device includes: a first device layer including active devices and a first device bonding layer; a second device layer including passive devices and a second device bonding layer, the second device layer being attached to the first device bonding layer; and a component for shielding electromagnetic (EM) waves, the component for shielding EM waves surrounding the active device, including a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contacts in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane opposite to the first plane and parallel to the second plane, and a plurality of line end interconnects in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer interconnects to at least another one of the plurality of bonding layer interconnects, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another one of the plurality of vias.

[0009] In yet another aspect, a method for manufacturing an integrated device includes forming a first device substrate; forming an active device in the first device substrate; forming a shield around the active device; forming a first device bonding layer on a first side of the first device substrate; forming a second device substrate; forming a passive device in the second device substrate; forming a second device bonding layer on a first side of the second device substrate; and bonding the first device bonding layer to the second device bonding layer.

[0010] Other features and advantages associated with the apparatus and methods disclosed herein will be apparent to those skilled in the art based on the drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] A more complete appreciation of the various aspects of the present disclosure and its many attendant advantages will be readily obtained when considered in conjunction with the accompanying drawings, as they may be better understood by reference to the following description of specific embodiments, the accompanying drawings being presented for purposes of illustration only and not limitation of the present disclosure, and in which:

[0012] Figure 1 illustrates an exemplary bonding process for an integrated device according to some examples of the present disclosure;

[0013] Figure 2 illustrates an exemplary bonding interface for an integrated device according to some examples of the present disclosure;

[0014] Figure 3 illustrates an exemplary VCO circuit for an integrated device according to some examples of the present disclosure;

[0015] Figure 4 illustrates exemplary integrated devices according to some examples of the present disclosure;

[0016] Figure 5 illustrates a plan view of an exemplary integrated device according to some examples of the present disclosure;

[0017] Figure 6 illustrates an exemplary shield for an integrated device according to some examples of the present disclosure;

[0018] Figure 7 illustrates an exemplary partial method for manufacturing an integrated device according to some examples of the present disclosure;

[0019] Figure 8 illustrates an exemplary mobile device according to some examples of the present disclosure; and

[0020] Fig. 9 Various electronic devices that may be integrated with any of the aforementioned integrated devices according to some examples of the present disclosure are illustrated.

[0021] As a rule of thumb, the features depicted in the drawings may not be drawn to scale. Therefore, the dimensions of the depicted features may be arbitrarily enlarged or reduced for clarity. As a rule of thumb, some drawings are simplified for clarity. Therefore, the drawings may not depict all components of a particular device or method. Further, throughout the specification and drawings, similar reference numerals denote similar features. DETAILED DESCRIPTION

[0022] The exemplary methods, apparatuses, and systems disclosed herein may alleviate the shortcomings of conventional methods, apparatuses, and systems as well as other previously unidentified needs.

[0023] Figure 12 illustrates an exemplary bonding process for an integrated device according to some examples of the present disclosure. Figure 1 As shown, a bonding process for an integrated device may include: a first wafer 100, the first wafer 100 including a plurality of first devices (e.g., active devices, such as transistors) in a first device layer 110 and a first device bonding layer 120; and a second wafer 130, including a plurality of second devices (e.g., passive devices, such as transformers and inductors) in a first second layer 140 and a second device bonding layer 150. The first wafer 100 and the second wafer 130 are mated together so that the first device bonding layer 120 is aligned with the second device bonding layer 150 to bond the first wafer 100 and the second wafer 130. The bonded wafers may then be singulated along singulation lines 102 to form individual integrated devices, each of which includes a first device layer 120, a first device bonding layer 130, a second device bonding layer 140, and a second device layer 150. The individual integrated devices may also include additional wiring, ground contacts, and input / output (I / O) pins for external communication.

[0024] Figure 2 illustratively illustrates an exemplary bonding interface for an integrated device according to some examples of the present disclosure. Figure 2 As shown, the bonding interface 160 is where the first device bonding layer 120 cooperates with the second device bonding layer 150. As shown, the first device bonding layer 120 may include a plurality of bonding contacts 122, a plurality of bonding layer contacts 124 (only one is shown), and a plurality of end of line (EL) contacts 126 (only one is shown). Similarly, the second device bonding layer 150 may include a plurality of bonding contacts 152, a plurality of bonding layer contacts 154 (only one is shown), and a plurality of end of line (EL) contacts 156 (only one is shown). The structure may be symmetrical about the bonding interface 160, or may be asymmetrical as shown.

[0025] Figure 3 2 illustrates an exemplary VCO circuit for an integrated device according to some examples of the present disclosure. Figure 3 As shown, exemplary circuit 300 may include at least one integrated device including a first device 112 (eg, a transistor) in a first device layer 110 (not shown) and a second device 142 (eg, an inductor) in a second device layer 140 (not shown).

[0026] Figure 4 illustratively illustrates exemplary integrated devices according to some examples of the present disclosure. Figure 4As shown, the integrated device 400 may include a first device 112, a plurality of ground contacts 170, and a plurality of I / O pins 180 (only one is shown) on a first side 106 of a first device layer 110. The integrated device 400 creates magnetic fields 104 during operation of active devices such as the first device 112. These magnetic fields may interfere with passive devices such as the second device 142. To reduce or eliminate interference, the integrated device 400 may use a shield 190 that includes a configuration of contacts, vias, and wiring in the first device layer 110 that surround the first device 112 to shield the second device 142 from electromagnetic interference from the first device 112.

[0027] Figure 5 FIG. 2 illustrates a plan view of an exemplary integrated device according to some examples of the present disclosure. Figure 5 As shown, the integrated device 500 may include a shield 190 around the first device 112 to shield the second device 142 from electromagnetic interference from the first device 112. The shield 190 may include one of the plurality of ground contacts 170 surrounding the first device 112 and the I / O pin 180, the first via 172, the bonding layer 120, the second via 174, and another of the plurality of ground contacts 170. As shown in Figure 5 As can be seen in the plan view of FIG. 1 , the shield 190 also surrounds at least one of the I / O pins 180 to shield the I / O pin 180 and the second device 142 from EM interference generated by the first device 112 .

[0028] Figure 6 FIG. 2 illustrates an exemplary shield of an integrated device according to some examples of the present disclosure. Figure 6 As shown, a portion of the shield 190 is in the first device bonding layer 120. The shield 190 may include a plurality of bonding contacts 122, a plurality of bonding layer contacts 124, a plurality of vias 176, a plurality of bonding layer interconnects 128 selectively coupled between some of the plurality of bonding layer contacts 124, and a plurality of EL interconnects 129 selectively coupled to some of the plurality of vias 176, such that the EM field 104 may be coupled to the shield 190 and grounded through a plurality of ground contacts 170 (not shown).

[0029] Figure 7 An exemplary partial method for manufacturing an integrated device according to some examples of the present disclosure is illustrated. Figure 7As shown, part of the method 700 may form a first device substrate in block 702. Part of the method 700 may continue in block 704 to form an active device in the first device substrate. Part of the method 700 may continue in block 706 to form a shield around the active device. Part of the method 700 may continue in block 708 to form a first device bonding layer on a first side of the first device substrate. Part of the method 700 may continue in block 710 to form a second device substrate. Part of the method 700 may continue in block 712 to form a passive device in the second device substrate. Part of the method 700 may continue in block 714 to form a second device bonding layer on the first side of the second device substrate. Part of the method 700 may end in block 716 to bond the first device bonding layer to the second device bonding layer.

[0030] Alternatively, part of the method 700 may continue in frame 718, forming a plurality of bonding contacts in a first plane of the first device bonding layer. Alternatively, part of the method 700 may continue in frame 720, forming a plurality of bonding layer contacts in a second plane parallel to the first plane. Alternatively, part of the method 700 may continue in frame 722, forming a plurality of bonding layer interconnects in the second plane. Alternatively, part of the method 700 may continue in frame 724, forming a plurality of vias in a third plane parallel to the second plane opposite to the first plane. Alternatively, part of the method 700 may continue in frame 726, forming a plurality of line end interconnects in a fourth plane parallel to the third plane opposite to the second plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer interconnects to at least another of the plurality of bonding layer interconnects, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias. Alternatively, the portion of method 700 may continue in block 728 with forming a plurality of I / O pins and a plurality of ground contacts at a first side of the first device layer, and wherein the first device bonding layer is at a second side of the first device layer opposite the first side of the first device layer.

[0031] Figure 8 An exemplary mobile device according to some examples of the present disclosure is illustrated. Figure 8, a block diagram of a mobile device configured according to exemplary aspects is depicted and generally designated as 800. In some aspects, the mobile device 800 can be configured as a wireless communication device. As shown, the mobile device 800 includes a processor 801, which can be configured to implement the methods described herein in some aspects. The processor 801 is shown to include an instruction pipeline 812, a buffer processing unit (BPU) 808, a branch instruction queue (BIQ) 811, and a throttle 810 as known in the art. For clarity, other well-known details of these blocks, such as counters, entries, confidence fields, weighted sums, comparators, etc., are omitted from this view of the processor 801.

[0032] The processor 801 may be communicatively coupled to the memory 832 via a link, which may be a die-to-die link or a chip-to-chip link. The mobile device 800 also includes a display 828 and a display controller 826 , wherein the display controller 826 is coupled to the processor 801 and the display 828 .

[0033] In some aspects, Figure 8 It may include a coder / decoder (CODEC) 834 (e.g., an audio and / or voice CODEC) coupled to the processor 801; a speaker 836 and a microphone 838 coupled to the CODEC 834; and a wireless controller 840 (which may include a modem) coupled to a wireless antenna 842 and the processor 801.

[0034] In certain aspects, where one or more of the above blocks are present, the processor 801, display controller 826, memory 832, CODEC 834, and wireless controller 840 may be included in a system-in-package or system-on-chip device 822. Input device 830 (e.g., a physical or virtual keyboard), power supply 844 (e.g., a battery), display 828, input device 830, speaker 836, microphone 838, wireless antenna 842, power supply 844 may be external to the system-on-chip device 822 and may be coupled to components of the system-on-chip device 822, such as an interface or controller.

[0035] It should be noted that although Figure 8 A mobile device is depicted, but the processor 801 and memory 832 may also be integrated into a set-top box, music player, video player, entertainment unit, navigation device, personal digital assistant (PDA), fixed location data unit, computer, laptop, tablet computer, communication device, mobile phone, or other similar device.

[0036] Fig. 9Various electronic devices that can be integrated with any of the aforementioned integrated devices, semiconductor devices, integrated circuits, dies, interposers, packages, or packages-on-package (PoP) according to some examples of the present disclosure are illustrated. For example, a mobile phone device 902, a laptop device 904, and a fixed location terminal device 906 can include an integrated device 900 described herein. The integrated device 900 can be, for example, any of the integrated circuits, dies, integrated devices, integrated device packages, integrated circuit devices, device packages, integrated circuit (IC) packages, and package-on-package devices described herein. Fig. 9 The illustrated devices 902, 904, 906 are merely exemplary. Other electronic devices may also feature the integrated device 900, including but not limited to the group of devices (e.g., electronic devices) including: mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, devices supporting global positioning systems (GPS), navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units such as meter reading devices, communication devices, smart phones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0037] It will be understood that the various aspects disclosed herein may be described as functional equivalents of structures, materials and / or devices described and / or recognized by those skilled in the art. In addition, it should be noted that the methods, systems, and devices disclosed in the specification or claims may be implemented by a device including components for performing the corresponding actions of the method. For example, in one aspect, an integrated device may include: a first device layer (e.g., first device layer 110) including active devices and a first device bonding layer (e.g., first device bonding layer 120); a second device layer (e.g., second device layer 150) including passive devices and a second device bonding layer (e.g., second device bonding layer 140), the second device layer being attached to the first device bonding layer; and a component for shielding EM waves (e.g., shield 190), the component for shielding EM waves surrounding the active devices, including a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contacts in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane opposite to the first plane and parallel to the second plane, and a plurality of line end interconnects in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer interconnects to at least another of the plurality of bonding layer interconnects, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias. It will be understood that the foregoing aspects are provided by way of example only, and that the various aspects claimed are not to be limited to the specific references and / or descriptions cited as examples.

[0038] Figures 1 to 9 One or more of the components, processes, features, and / or functions illustrated may be rearranged and / or combined into a single component, process, feature, or function, or incorporated into several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that the present disclosure Figures 1 to 9 and its corresponding description are not limited to die and / or IC. In some embodiments, Figures 1 to 9 and corresponding descriptions thereof can be used to manufacture, create, provide and / or produce an integrated device. In some embodiments, the device can include a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, and / or an interposer.

[0039] As used herein, the terms "user equipment" (or "UE"), "user device", "user terminal", "client device", "communication device", "wireless device", "wireless communication device", "handheld device", "mobile device", "mobile terminal", "mobile station", "handset", "access terminal", "subscriber device", "subscriber terminal", "subscriber station", "terminal" and variations thereof may interchangeably refer to any suitable mobile or stationary device that can receive wireless communications and / or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communication devices, smart phones, personal digital assistants, fixed location terminals, tablet computers, computers, wearable devices, laptop computers, servers, automotive devices in motor vehicles, and / or other types of portable electronic devices that are typically carried by a person and / or have communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms are also intended to include devices that can communicate with another device that can receive wireless communications and / or navigation signals, such as by short-range wireless, infrared, wired connections, or other connections, regardless of whether satellite signal reception, assistance data reception, and / or location-related processing occurs at the device or the other device. In addition, these terms are intended to include all devices capable of communicating with the core network via a radio access network (RAN), including wireless and wired communication devices, and the UE can be connected to external networks such as the Internet and other UEs through the core network. Of course, other mechanisms such as connecting to the core network and / or the Internet through wired access networks, wireless local area networks (WLAN) (e.g., based on IEEE802.11, etc.) can also be used for UEs. UEs can be implemented by any of a variety of types of devices, including but not limited to printed circuit (PC) cards, compact flash devices, external or internal modems, wireless or wired phones, smart phones, tablet computers, tracking devices, asset tags, etc. The communication link through which the UE can send a signal to the RAN is called an uplink channel (e.g., a reverse traffic channel, a reverse control channel, an access channel, etc.). The communication link through which the RAN can send a signal to the UE is called a downlink or forward link channel (e.g., a paging channel, a control channel, a broadcast channel, a forward traffic channel, etc.). As used herein, the term traffic channel (TCH) can refer to an uplink / reverse or downlink / forward traffic channel.

[0040] Wireless communication between electronic devices can be based on different technologies, such as code division multiple access (CDMA), W-CDMA, time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiplexing (OFDM), global system for mobile communications (GSM), 3GPP long term evolution (LTE), Bluetooth (BT), low energy Bluetooth (BLE), IEEE 802.11 (WiFi) and IEEE 802.15.4 (Zigbee / Thread), or other protocols that can be used in wireless communication networks or data communication networks. Low energy Bluetooth (also known as Bluetooth LE, BLE and smart Bluetooth) is a wireless personal area network technology designed and marketed by the Bluetooth Special Interest Group, designed to provide significantly reduced power consumption and cost while maintaining a similar communication range. BLE was merged into the main Bluetooth standard in 2010, adopting Bluetooth Core Specification Version 4.0 and updated in Bluetooth 5 (both of which are expressly incorporated herein in their entirety).

[0041] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not to be construed as being more advantageous than other examples. Likewise, the term "example" does not imply that all examples include the discussed features, advantages, or modes of operation. Furthermore, particular features and / or structures may be combined with one or more other features and / or structures. Moreover, at least a portion of the apparatus described herein may be configured to perform at least a portion of the methods described herein.

[0042] The terms used herein are only used to describe specific examples and are not intended to limit the examples of the present disclosure. As used herein, the singular forms "a", "an", and "the" are also intended to include plural forms unless the context clearly indicates otherwise. It will also be understood that when used herein, the terms "include", "comprise", "contain", and / or "have" specify the presence of the illustrated features, integers, actions, operations, elements, and / or components, but do not exclude the presence or addition of one or more other functions, integers, actions, operations, elements, components, and / or groups thereof.

[0043] It should be noted that the terms “connected”, “coupled” or any variations thereof refer to any direct or indirect connection or coupling between elements, and may encompass the presence of intermediate elements between two elements that are “connected” or “coupled” together via intermediate elements.

[0044] Any reference to an element using names such as "first," "second," etc. herein does not limit the quantity and / or order of these elements. Instead, these names are used as a convenient method of distinguishing two or more elements or instances of elements. Moreover, unless otherwise specified, a set of elements may include one or more elements.

[0045] Those skilled in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above specification may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0046] Nothing stated or illustrated in this application is intended to confer any component, act, feature, benefit, advantage, or equivalent to the public regardless of whether the component, act, feature, benefit, advantage, or equivalent is recited in the claims.

[0047] Further, it will be appreciated by those skilled in the art that the various illustrative logic blocks, modules, circuits, and algorithmic actions described in conjunction with the examples disclosed herein can be implemented as electronic hardware, computer software, or a combination of the two. In order to clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and actions have been generally described above with respect to their functionality. Whether such functionality is implemented as hardware or software depends on specific applications and the design constraints imposed on the overall system. The technician can implement the described functionality in different ways for each specific application, but such implementation decision should not be interpreted as causing a departure from the scope of the present disclosure.

[0048] Although some aspects have been described in conjunction with equipment, it goes without saying that these aspects also constitute the description of the corresponding method, and therefore the block or assembly of the equipment should also be understood as the corresponding method action or the feature of the method action. Similarly, the description of the corresponding block or details or features of the corresponding equipment is also constituted in conjunction with the method action or as the aspect described in the method action. Some or all of the method actions can be performed by hardware devices (or using hardware devices), such as, for example, microprocessors, programmable computers, or electronic circuits. In some examples, some or more of the most important method actions can be performed by such devices.

[0049] In the above specific embodiments, it can be seen that different features are grouped together in the examples. This disclosure should not be understood as the examples claimed are intended to have more features than the features explicitly mentioned in the corresponding claims. On the contrary, the present disclosure may include less than all the features of the disclosed individual examples. Therefore, the following claims should be deemed to be incorporated into the specification, wherein each claim itself can be used as a separate example. Although each claim itself can be used as a separate example, it should be noted that although the dependent claims can be cited in the claims in a specific combination with one or more claims, other examples may also cover or include the combination of the dependent claims with the subject matter of any other dependent claims, or any feature with other dependent and independent claims. Unless it is explicitly stated that a specific combination is not required, such a combination is proposed in this article. In addition, the features of a claim may also be included in any other independent claim, even if the claim is not directly subordinate to the independent claim.

[0050] In addition, in some examples, an individual action may be subdivided into or include multiple sub-actions. Such sub-actions may be included in the public content of the individual action and be part of the public content of the individual action.

[0051] Although the foregoing disclosure shows illustrative examples of the present disclosure, it should be noted that various changes and modifications may be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions and / or actions of the method claims according to the examples of the present disclosure described herein do not need to be performed in any particular order. In addition, well-known elements will no longer be described in detail or may be omitted so as not to make the relevant details of the various aspects and examples disclosed herein difficult to understand. In addition, although the elements of the present disclosure may be described or claimed in the singular, unless it is explicitly stated that it is limited to the singular, the plural form is also contemplated.

Claims

1. An integrated device comprising: a first device layer, comprising an active device and a first device bonding layer; a second device layer including passive devices and a second device bonding layer, the second device layer being attached to the first device bonding layer; as well as Shielding, including: a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contacts in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane opposite to the first plane and parallel to the second plane, and interconnecting a plurality of line ends in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer contacts to at least another of the plurality of bonding layer contacts, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias, wherein the shielding member is disposed between the active device and the passive device, and The plurality of bonding contacts, the plurality of bonding layer contacts, the plurality of bonding layer interconnects, the plurality of vias, and the plurality of line end interconnects are all formed within the first device bonding layer.

2. The integrated device of claim 1, wherein the shield is coupled to ground.

3. The integrated device of claim 1 , further comprising a plurality of I / O pins and a plurality of ground contacts at a first side of the first device layer, and wherein the first device bonding layer is at a second side of the first device layer opposite to the first side of the first device layer. 4 . The integrated device of claim 3 , wherein the shield is coupled to at least one of the plurality of ground contacts. 5 . The integrated device of claim 3 , wherein the shield is configured to surround at least one of the plurality of I / O pins at the first side of the first device layer. 6 . The integrated device of claim 1 , wherein the shield is configured to surround the active device and shield the passive device from electromagnetic interference from the active device.

7. An integrated device according to claim 1, wherein the integrated device is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and a device in a motor vehicle.

8. An integrated device comprising: a first device layer, comprising an active device and a first device bonding layer; a second device layer including passive devices and a second device bonding layer, the second device layer being attached to the first device bonding layer; as well as A component for shielding electromagnetic EM waves, wherein the component for shielding EM waves surrounds the active device and comprises: a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contacts in a second plane parallel to the first plane, a plurality of bonding layers in the second plane are interconnected, a plurality of vias in a third plane opposite to the first plane and parallel to the second plane, and interconnecting a plurality of line ends in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer contacts to at least another of the plurality of bonding layer contacts, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias, The component for shielding electromagnetic waves is located between the active device and the passive device, and The plurality of bonding contacts, the plurality of bonding layer contacts, the plurality of bonding layer interconnects, the plurality of vias, and the plurality of line end interconnects are all formed within the first device bonding layer.

9. The integrated device according to claim 8, wherein the means for shielding EM waves is coupled to ground.

10. The integrated device of claim 9, further comprising a plurality of I / O pins and a plurality of ground contacts at a first side of the first device layer, and wherein the first device bonding layer is at a second side of the first device layer opposite to the first side of the first device layer. 11 . The integrated device of claim 10 , wherein the means for shielding EM waves is coupled to at least one of the plurality of ground contacts. 12 . The integrated device of claim 10 , wherein the component for shielding EM waves is configured to surround at least one of the plurality of I / O pins at the first side of the first device layer. 13 . The integrated device according to claim 9 , wherein the component for shielding EM waves is configured to surround the active device and shield the passive device from electromagnetic interference from the active device.

14. The integrated device of claim 9, wherein the integrated device is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and a device in a motor vehicle.

15. A method for manufacturing an integrated device, the method comprising: forming a first device substrate; forming an active device in the first device substrate; forming a shield around the active device; forming a first device bonding layer on a first side of the first device substrate; forming a second device substrate; forming a passive device in the second device substrate; forming a second device bonding layer on the first side of the second device substrate; as well as bonding the first device bonding layer to the second device bonding layer, Wherein forming the shielding member comprises: forming a plurality of bonding contacts in a first plane of the first device bonding layer; forming a plurality of bonding layer contacts in a second plane parallel to the first plane; forming a plurality of bonding layer interconnects in the second plane; forming a plurality of via holes in a third plane opposite to the first plane and parallel to the second plane; and forming a plurality of line terminal interconnections in a fourth plane opposite to the second plane and parallel to the third plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer contacts to at least another of the plurality of bonding layer contacts, and the plurality of line end interconnects couple at least one of the plurality of vias to at least another of the plurality of vias, and The plurality of bonding contacts, the plurality of bonding layer contacts, the plurality of bonding layer interconnects, the plurality of vias, and the plurality of line end interconnects are all formed within the first device bonding layer.

16. The method of claim 15, further comprising forming a plurality of I / O pins and a plurality of ground contacts at a first side of the first device layer, and wherein the first device bonding layer is at a second side of the first device layer opposite the first side of the first device layer.

17. The method of claim 16, wherein the shield is coupled to at least one of the plurality of ground contacts. 18 . The method of claim 16 , wherein the shield is configured to surround at least one of the plurality of I / O pins at the first side of the first device layer.

19. The method of claim 15, wherein the shield is configured to surround the active device and shield the passive device from electromagnetic interference from the active device.

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