Semiconductor device test probe station

Abstract

The present invention belongs to the technical field of semiconductor devices, and discloses a semiconductor device test probe station, including a detection table. A detection groove is provided at the top of the detection table, and an operation table is provided at the top of the detection table. A working box is installed on the operation table. An adjusting device is installed at the bottom of the working box, and a test camera is fixedly installed at the bottom of the adjusting device. Two electric push rods are fixedly connected to the bottom of the working box, and the two electric push rods are respectively located on the left and right sides of the test camera. Mounting frames are installed at the opposite ends of the two electric push rods, and a probe rod is installed on the mounting frame. A probe head is provided at the bottom end of the probe rod. The present invention can protect the probe head and the wafer bidirectionally, avoid the bending of the probe head and the breakage of the wafer, ensure the normal use of the test probe station, improve its service life, and improve the accuracy of the test results of semiconductor devices.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more specifically, to a test probe station for semiconductor devices. Background Art

[0002] Probe stations are mainly applied to the testing of the semiconductor industry, optoelectronic industry, integrated circuits, and packaging. They are widely used in the research and development of precision electrical measurements of complex and high-speed devices, aiming to ensure quality and reliability, and reduce the cost of research and development time and device manufacturing processes.

[0003] When the existing semiconductor device test probe station is in use, it needs to contact the surface of the wafer multiple times. Once there is a slight deviation in the system program or a mistake in manual operation, it often leads to excessive displacement of the probe, resulting in scratches, damage to the surface of the wafer, or bending of the probe, which not only affects the detection accuracy but also delays the test efficiency, and the overall protection effect is insufficient, unable to meet the usage requirements of users. Summary of the Invention

[0004] Aiming at the related problems mentioned in the background art, the purpose of the present invention is to provide a test probe station for semiconductor devices.

[0005] To solve the above problems, the present invention adopts the following technical solutions.

[0006] A test probe station for semiconductor devices, including a detection table, a detection groove is provided at the top of the detection table, an operation table is provided at the top of the detection table, a work box is installed on the operation table, an adjusting device is installed at the bottom of the work box, a test camera is fixedly installed at the bottom of the adjusting device, two electric push rods are fixedly connected to the bottom of the work box, the two electric push rods are respectively located on the left and right sides of the test camera, mounting frames are installed at the opposite ends of the two electric push rods, a probe rod is installed on the mounting frame, a probe head is provided at the bottom end of the probe rod, annular grooves are fixedly connected to the opposite sides of the probe rod and the probe head, a rubber connecting block is provided between the probe rod and the probe head, and the two sides of the rubber connecting block respectively extend into the inner sides of the adjacent annular grooves and are clamped with the inner walls of the annular grooves.

[0007] As a further description of the above technical solution:

[0008] The adjusting device includes a servo motor, the servo motor is fixedly installed at the bottom of the work box, the output shaft of the servo motor is fixedly connected to a rotating disk, the top of the rotating disk is rotationally connected to the work box, two first electric guide rails are fixedly connected to the bottom of the rotating disk, a second electric guide rail is installed between the two first electric guide rails, a mounting plate is installed at the bottom of the second electric guide rail, and the electric push rod and the test camera are both installed at the bottom of the mounting plate.

[0009] As a further description of the above technical solution:

[0010] The mounting bracket includes a fixing plate. One side of the fixing plate is fixedly connected to the electric push rod by bolts. A movable plate is hinged on the fixing plate. A clamping plate is fixedly connected to the movable plate by screws. The probe rod is installed between the movable plate and the clamping plate. A return spring is fixedly installed at the hinge joint between the movable plate and the fixing plate.

[0011] As a further description of the above technical solution:

[0012] One end of the fixing plate away from the electric push rod is bent downward to form a limiting part, and the bent part of the limiting part is located at the hinge joint between the movable plate and the fixing plate.

[0013] As a further description of the above technical solution:

[0014] The cross-sectional shape of the annular groove is convex. Clamping rings are integrally formed on both sides of the rubber connecting block, and the shape of the clamping rings matches that of the annular groove.

[0015] As a further description of the above technical solution:

[0016] Through wire grooves are formed in both the rubber connecting block and the inner side of the probe rod, and two adjacent through wire grooves are communicated with each other.

[0017] As a further description of the above technical solution:

[0018] A protective cover is sleeved on the detection table, and a cavity is arranged inside the protective cover.

[0019] As a further description of the above technical solution:

[0020] A servo motor is fixedly installed on the detection table. The output shaft of the servo motor is fixedly connected to a threaded sleeve. A push rod is in threaded connection with the inner side of the threaded sleeve. The top end of the push rod penetrates through the detection table and extends to the inside of the detection groove. The top end of the push rod is fixedly connected to a top plate, and the push rod is slidably connected to the detection table.

[0021] Compared with the prior art, the advantages of the present invention are:

[0022] This solution places the wafer of the semiconductor device on the inner side of the detection tank, and then powers on the adjustment device to drive the test camera and the electric push rod at the bottom to move synchronously, thereby driving the two probe heads to move to the position to be detected on the wafer, and taking real-time pictures through the test camera, and uploading the pictures to the display to facilitate further adjustment of the position of the probe head. After the detection position is reached, the operating table drives the workbox downward to allow the probe head to contact the wafer, thereby completing the detection of the wafer. When the probe head is pressed down, damage to the wafer is avoided. The rubber connecting block and the annular groove are used to cooperate and clamp the probe head to the probe rod, so that the probe head and the probe rod can form a certain bend, ensuring contact while providing two-way protection for the probe head and the wafer, avoiding bending of the probe head and damage to the wafer, ensuring the normal use of the test probe station, increasing its service life, and improving the accuracy of the test results of semiconductor devices.

[0023] In this solution, the probe rod is clamped and fixed on the movable plate by a clamping plate, and the movable plate and the fixed plate are hinged to enable the probe rod to deflect at a certain angle. The elastic force of the reset spring is used to allow one end of the probe rod to deflect downward, thereby facilitating contact with the wafer and providing the probe rod with rotation space, which can further avoid damage to the wafer caused by excessive contact between the probe head and the wafer and bending damage to the probe head, thereby improving detection stability and the service life of the probe head. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the front cross-sectional structure of the present invention;

[0025] Figure 2 For the present invention Figure 1 A schematic diagram of the enlarged structure of the middle part A;

[0026] Figure 3 This is a schematic diagram of the connection structure between the probe head and the rubber connecting block of the present invention;

[0027] Figure 4 For the present invention Figure 1 A schematic diagram of the enlarged structure of the middle part B;

[0028] Figure 5 It is a structural schematic diagram of the rubber connecting block of the present invention.

[0029] Description of the numbers in the figure:

[0030] 1. Detection table; 2. Detection groove; 3. Operating table; 4. Working box; 5. Test camera; 6. Electric push rod; 7. Mounting frame; 71. Fixed plate; 711. Restriction part; 72. Movable plate; 73. Clamping plate; 74. Return spring; 8. Probe rod; 9. Probe head; 10. Annular groove; 11. Rubber connecting block; 111. Snap ring; 12. Adjusting device; 121. Servo motor; 122. Rotating disk; 123. First electric guide rail; 124. Second electric guide rail; 125. Mounting plate; 13. Wire trough; 14. Protective cover; 15. Cavity; 16. Servo motor; 17. Threaded sleeve; 18. Push rod; 19. Top plate. Detailed implementation manner

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention;

[0032] Embodiment 1

[0033] Please refer to Figures 1 to 5 , in the present invention, a semiconductor device test probe table includes a detection table 1. A detection groove 2 is provided at the top of the detection table 1. An operating table 3 is provided at the top of the detection table 1. A working box 4 is installed on the operating table 3. An adjusting device 12 is fixedly installed at the bottom of the working box 4. A test camera 5 is fixedly installed at the bottom of the adjusting device 12. Two electric push rods 6 are fixedly connected to the bottom of the working box 4. The two electric push rods 6 are respectively located on the left and right sides of the test camera 5. Mounting frames 7 are installed at the opposite ends of the two electric push rods 6. A probe rod 8 is installed on the mounting frame 7. A probe head 9 is provided at the bottom end of the probe rod 8. Annular grooves 10 are fixedly connected to the opposite sides of the probe rod 8 and the probe head 9. A rubber connecting block 11 is provided between the probe rod 8 and the probe head 9. The two sides of the rubber connecting block 11 respectively extend to the inner sides of the adjacent annular grooves 10 and are clamped with the inner walls of the annular grooves 10.

[0034] In the present invention, the wafer of the semiconductor device is placed inside the detection groove 2, and then the adjusting device 12 is powered on to drive the test camera 5 and the electric push rod 6 at its bottom to move synchronously, so as to drive the two probe heads 9 to move to the position to be detected on the wafer. The test camera 5 takes real-time pictures and uploads the pictures to the display, so as to further adjust the position of the probe head 9. After detecting the part, the operating table 3 drives the working box 4 to move downward, so that the probe head 9 contacts the wafer, thus completing the detection of the wafer. When the probe head 9 presses down, damage to the wafer is avoided. The probe head 9 is connected to the probe rod 8 by using the rubber connecting block 11 and the annular groove 10 to cooperate and engage, so that the probe head 9 and the probe rod 8 can form a certain bend, ensuring contact while protecting the probe head 9 and the wafer bidirectionally, avoiding the bending of the probe head 9 and the breakage of the wafer, ensuring the normal use of the test probe station, increasing its service life, and improving the accuracy of the test results of the semiconductor device.

[0035] Please refer to Figure 1 , wherein: The adjusting device 12 includes a servo motor 121, the servo motor 121 is fixedly installed at the bottom of the working box 4, the output shaft of the servo motor 121 is fixedly connected with a rotating disk 122, the top of the rotating disk 122 is rotatably connected with the working box 4, the bottom of the rotating disk 122 is fixedly connected with two first electric guide rails 123, a second electric guide rail 124 is installed between the two first electric guide rails 123, the bottom of the second electric guide rail 124 is installed with a mounting plate 125, and the electric push rod 6 and the test camera 5 are both installed at the bottom of the mounting plate 125.

[0036] In the present invention, the servo motor 121 drives the rotating disk 122 to rotate, so as to match the placement angle of the wafer. Then, according to the position of the detection chip on the wafer, the X-axis and Y-axis positions of the electric push rod 6 and the test camera 5 are adjusted through the first electric guide rail 123 and the second electric guide rail 124, so as to facilitate adjustment according to the detection requirements, without specifically positioning the placement angle of the wafer.

[0037] Please refer to Figure 1 and Figure 2 , wherein: The mounting bracket 7 includes a fixing plate 71, one side of the fixing plate 71 is fixedly connected with the electric push rod 6 by bolts, a movable plate 72 is hinged on the fixing plate 71, a clamping plate 73 is fixedly connected to the movable plate 72 by screws, the probe rod 8 is installed between the movable plate 72 and the clamping plate 73, and a return spring 74 is fixedly installed at the hinge joint of the movable plate 72 and the fixing plate 71.

[0038] In the present invention, the probe rod 8 is clamped and fixed on the movable plate 72 by the clamping plate 73. By using the hinge connection between the movable plate 72 and the fixed plate 71, the probe rod 8 can deflect at a certain angle. By using the elastic force of the return spring 74, one end of the probe rod 8 is deflected downward, so as to facilitate contact with the wafer. At the same time, a rotation space is given to the probe rod 8, which can further avoid the damage of the wafer caused by excessive contact between the probe head 9 and the wafer and the bending damage of the probe head 9, and improve the detection stability and the service life of the probe head 9.

[0039] Embodiment 2

[0040] Please refer to Figure 1 and Figure 2 , wherein: one end of the fixed plate 71 away from the electric push rod 6 is bent downward to form a limiting portion 711, and the bent portion of the limiting portion 711 is located at the hinge joint between the movable plate 72 and the fixed plate 71.

[0041] In the present invention, the downward turning angle of the movable plate 72 can be limited by the limiting portion 711, avoiding excessive downward inclination of the probe rod 8. The structure is reasonable and reliable, meeting the usage requirements of users.

[0042] Please refer to Figure 3 and Figure 5 , wherein: the cross-sectional shape of the annular groove 10 is convex, and clamping rings 111 are integrally formed on both sides of the rubber connecting block 11, and the shape of the clamping rings 111 matches the shape of the annular groove 10.

[0043] In the present invention, through the cooperation of the convex clamping rings 111 and the annular groove 10, it is convenient to dock the rubber connecting block 11 with the probe rod 8 and the probe head 9. It is convenient to use, ensuring the structural stability. When the bending angle of the probe rod 8 and the probe head 9 is too large, the rubber connecting block 11 falls off, thereby protecting the probe head 9.

[0044] Please refer to Figure 3 and Figure 5 , wherein: wire grooves 13 are formed on the inner sides of both the rubber connecting block 11 and the probe rod 8, and two adjacent wire grooves 13 are communicated with each other.

[0045] In the present invention, the wire of the probe head 9 can pass through the wire grooves 13 conveniently. The structure is scientific and reasonable, facilitating the uploading of test data.

[0046] Please refer to Figure 1 , wherein: a protective cover 14 is sleeved on the detection table 1, and a cavity 15 is arranged inside the protective cover 14.

[0047] In the present invention, the test probe table is protected by the protective cover 14, and at the same time, it is convenient to change the detection environment on the detection table 1, and heat insulation is carried out through the cavity 15, facilitating the testing of semiconductor devices in low-temperature and high-temperature environments.

[0048] Please refer to Figure 1 and Figure 4 , where: A servo motor 16 is fixedly installed on the detection table 1. The output shaft of the servo motor 16 is fixedly connected to a threaded sleeve 17. The inner side of the threaded sleeve 17 is threadedly connected to a push rod 18. The top end of the push rod 18 penetrates through the detection table 1 and extends to the inner side of the detection groove 2. The top end of the push rod 18 is fixedly connected to a top plate 19. The push rod 18 is slidably connected to the detection table 1.

[0049] In the present invention, when the servo motor 16 is powered on and operates, it can drive the threaded sleeve 17 to rotate. Utilizing the threaded connection between the threaded sleeve 17 and the push rod 18, it drives the top plate 19 on the push rod 18 to rise, thereby ejecting the wafer placed inside the detection groove 2, facilitating the picking and placing of the wafer, and making it convenient for the user to use.

[0050] Working principle: Place the wafer of the semiconductor device inside the detection groove 2. Drive the rotating disk 122 to rotate through the servo motor 121, thereby matching the placement angle of the wafer. Then, according to the position of the detection chip on the wafer, adjust the X-axis and Y-axis positions of the electric push rod 6 and the test camera 5 through the first electric guide rail 123 and the second electric guide rail 124, so as to facilitate adjustment according to the detection requirements. There is no need to specifically position the placement angle of the wafer. Then drive the two probe heads 9 to move to the position to be detected on the wafer, and take a real-time picture through the test camera 5 and upload the picture to the display, so as to further adjust the position of the probe head 9. After detecting its detection part, the operation table 3 drives the working box 4 to move downward, making the probe head 9 contact the wafer, thereby completing the detection of the wafer. When the probe head 9 presses down, to avoid damaging the wafer, use the rubber connecting block 11 and the annular groove 10 to cooperate and snap-connect to connect the probe head 9 and the probe rod 8, so that the probe head 9 and the probe rod 8 can form a certain bend, ensuring contact while protecting the probe head 9 and the wafer bidirectionally, avoiding the bending of the probe head 9 and the breakage of the wafer. Clamp the probe rod 8 on the movable plate 72 through the clamping plate 73. Utilize the hinge between the movable plate 72 and the fixed plate 71 to enable the probe rod 8 to deflect at a certain angle. Utilize the elastic force of the return spring 74 to make one end of the probe rod 8 deflect downward, thereby facilitating contact with the wafer and giving the probe rod 8 a turning space, which can further avoid excessive contact between the probe head 9 and the wafer resulting in wafer breakage and bending damage of the probe head 9, improve the detection stability and the service life of the probe head 9, ensure the normal use of the test probe station, improve its service life, and improve the accuracy of the test results of semiconductor devices.

[0051] The above are only the preferred specific embodiments of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its improved concept, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. A semiconductor device test probe station, comprising a detection stage (1), characterized in that: A detection groove (2) is provided at the top of the detection table (1). An operating table (3) is provided on the top of the detection table (1). A working box (4) is installed on the operating table (3). An adjusting device (12) is installed at the bottom of the working box (4). A test camera (5) is fixedly installed at the bottom of the adjusting device (12). Two electric push rods (6) are fixedly connected to the bottom of the working box (4). The two electric push rods (6) are respectively located on the left and right sides of the test camera (5). Mounting brackets (7) are installed at the opposite ends of the two electric push rods (6). A probe rod (8) is installed on the mounting bracket (7). A probe head (9) is provided at the bottom end of the probe rod (8). Annular grooves (10) are fixedly connected to the opposite sides of the probe rod (8) and the probe head (9). A rubber connecting block (11) is provided between the probe rod (8) and the probe head (9). The two sides of the rubber connecting block (11) respectively extend into the inner sides of the adjacent annular grooves (10) and are clamped with the inner walls of the annular grooves (10). The cross-sectional shape of the annular groove (10) is convex. Clamping rings (111) are integrally formed on both sides of the rubber connecting block (11). The clamping rings (111) are matched with the shape of the annular groove (10). The adjusting device (12) includes a servo motor (121). The servo motor (121) is fixedly installed at the bottom of the working box (4). The output shaft of the servo motor (121) is fixedly connected to a rotating disk (122). The top of the rotating disk (122) is rotatably connected to the working box (4). Two first electric guide rails (123) are fixedly connected to the bottom of the rotating disk (122). A second electric guide rail (124) is installed between the two first electric guide rails (123). A mounting plate (125) is installed at the bottom of the second electric guide rail (124). The electric push rod (6) and the test camera (5) are both installed at the bottom of the mounting plate (125). The mounting bracket (7) includes a fixing plate (71). One side of the fixing plate (71) is fixedly connected to the electric push rod (6) by bolts. A movable plate (72) is hinged to the fixing plate (71). A clamping plate (73) is fixedly connected to the movable plate (72) by screws. The probe rod (8) is installed between the movable plate (72) and the clamping plate (73). A return spring (74) is fixedly installed at the hinge joint of the movable plate (72) and the fixing plate (71). One end of the fixing plate (71) away from the electric push rod (6) is bent downward to form a limiting part (711). The bent part of the limiting part (711) is located at the hinge joint of the movable plate (72) and the fixing plate (71).

2. The semiconductor device test probe table according to claim 1, characterized in that: Through wire grooves (13) are provided inside the rubber connecting block (11) and the probe rod (8). The adjacent two through wire grooves (13) are communicated with each other.

3. The semiconductor device test probe station according to claim 1, characterized in that: A protective cover (14) is sleeved on the detection table (1). A cavity (15) is provided inside the protective cover (14).

4. The semiconductor device test probe station according to claim 1, wherein: A servo motor (16) is fixedly installed on the detection table (1). The output shaft of the servo motor (16) is fixedly connected to a threaded sleeve (17). A push rod (18) is threadedly connected to the inside of the threaded sleeve (17). The top end of the push rod (18) penetrates through the detection table (1) and extends to the inside of the detection groove (2). The top end of the push rod (18) is fixedly connected to a top plate (19). The push rod (18) is slidably connected to the detection table (1).

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