System and method for determining whether a transfer robot is normal and substrate processing apparatus

Abstract

The present invention relates to a system and method for determining whether a transfer robot is normal and a substrate processing apparatus. Disclosed is a substrate processing apparatus including a transfer chamber for transferring a substrate. The transfer chamber can include a hand portion on which the substrate is placed, an arm portion connected to the hand portion, a first member supporting the hand portion and the arm portion and moving to transfer the substrate, a second member supporting the first member, a sensor detection member attached to the first member, a sensor member attached to the second member, and a determination unit determining whether the transfer in the transfer chamber is normal by a distance between the sensor detection member and the sensor member.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0178380, filed with the Korean Intellectual Property Office on December 18, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a system for determining whether a transfer robot is functioning properly, a method for determining whether a transfer robot is functioning properly, and a substrate processing apparatus. Background Technology

[0004] To manufacture semiconductor devices or liquid crystal displays, various processes are performed on a substrate, such as photolithography, etching, ashing, ion implantation, thin film deposition, and cleaning. Photolithography is the process of forming a desired circuit pattern on a substrate, and it sequentially involves application, exposure, and development. In the application process, a photosensitive solution, such as photoresist, is applied to the substrate; in the exposure process, the circuit pattern is exposed on the substrate, and a photosensitive film is formed on the substrate; and in the development process, the exposed areas on the substrate are selectively developed. Furthermore, in etching or cleaning processes on the substrate, chemical treatment, rinsing, and drying operations are generally performed sequentially. In the chemical treatment, chemicals for etching the thin film formed on the substrate or removing foreign matter from the substrate are supplied to the substrate, and in the rinsing operation, a rinsing liquid, such as pure water, is supplied to the substrate. The substrate handling apparatus uses a transfer robot to transport the substrate from one location to another.

[0005] However, various problems can arise during the operation of the transfer robot. One potential issue is that during operation, misalignment of the hardware reference point due to axis misalignment or sensor malfunction can lead to the wafer being transferred without aligning with the target point of each taught unit, resulting in inaccurate water delivery. Another problem is that the transfer robot measures the wafer's position, corrects for misalignment, and places the wafer on the unit's target point. In this case, if the wafer-measuring sensor is misaligned, errors occur due to the degree of reference point misalignment, leading to the wafer being incorrectly placed in the unit.

[0006] Therefore, there is a need for an apparatus and method for pre-identifying and detecting the aforementioned problems. Summary of the Invention

[0007] The embodiments of the present invention provide a system capable of periodically determining whether a conveying robot is functioning properly.

[0008] The problems to be solved by this invention are not limited to those described above. Other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0009] A determination system for determining whether a transfer robot for transferring a substrate is functioning properly, according to an embodiment of the present invention, is disclosed.

[0010] According to an embodiment, the system includes a sensor detection component attached to a moving component to transport the substrate; a sensor component attached to a support component that supports the moving component to transport the substrate; and a determination unit that determines whether the transport robot is functioning correctly based on the distance between the sensor detection component and the sensor component.

[0011] According to an embodiment, the moving member for conveying the substrate can be driven by a motor, and the determining unit can use the Z phase of the motor to determine whether the conveying robot is functioning properly.

[0012] According to an embodiment, the determining unit can set the position of the sensor detection component detected in the sensor component as a first position, and set the position where the moving part moves from the first position through the Z phase of the motor as a second position.

[0013] According to an embodiment, the determining unit can determine whether the conveying robot is functioning normally based on the difference between the second position and the first position.

[0014] According to an embodiment, the determining unit can perform control to periodically measure the difference between the second position and the first position using the difference between the second position and the first position as a reference value, and generate an alarm when the difference between the reference value and the measured difference exceeds a certain range.

[0015] A substrate processing apparatus comprising a transfer chamber for transferring substrates is disclosed according to another embodiment of the present invention.

[0016] According to the implementation scheme, the transfer chamber includes a hand on which a substrate is placed; an arm connected to the hand; a first member supporting the hand and the arm and movable to transfer the substrate; a second member supporting the first member; a sensor detection member attached to the first member; a sensor member attached to the second member; and a determination unit that determines whether the transfer in the transfer chamber is normal based on the distance between the sensor detection member and the sensor member.

[0017] A method for determining whether a transfer robot for a transfer substrate is functioning properly, according to another embodiment, is disclosed.

[0018] According to the implementation scheme, the method includes: measuring a reference value for determining whether the conveying robot is functioning properly; positioning the conveying robot at a reference position; moving the conveying robot by an amount corresponding to the Z phase of the motor driving the conveying robot; and comparing the reference value with the difference between the reference position and the position moved by the conveying robot.

[0019] According to an embodiment, positioning the conveying robot at the reference position may include: positioning the conveying robot at a position where a sensor component is detected in a sensor detection component, the sensor component being attached to a second component for supporting a first component, and the sensor detection component being attached to the first component for driving the conveying robot.

[0020] According to an embodiment, moving the transport manipulator by an amount corresponding to the Z-phase of the motor driving the transport manipulator may include positioning the transport manipulator in a position where the first member is driven by an amount corresponding to the Z-phase of the motor driving the first member.

[0021] According to an embodiment, comparing the reference value with the difference between the reference position and the position moved by the conveying robot may include generating an alarm when the difference deviates from the error range of the reference value.

[0022] According to an embodiment, the following steps can be repeated at a certain period: positioning the conveying robot at the reference position of the conveying robot, moving the conveying robot by an amount corresponding to the Z phase of the motor driving the conveying robot, and comparing the reference value with the difference between the reference position and the position moved by the conveying robot.

[0023] According to an embodiment, measuring the reference value used to determine whether the conveying robot is functioning properly may include setting a value obtained by measuring and averaging the difference between the reference position and the position moved by the conveying robot as the reference value. Attached Figure Description

[0024] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and in the figures:

[0025] Figure 1 This is a view of the substrate processing apparatus as seen from above;

[0026] Figure 2 It is along Figure 1 The view captured by the line AA of the equipment;

[0027] Figure 3 It is along Figure 1 The view captured by the BB line of the equipment;

[0028] Figure 4 It is along Figure 1 The view captured by CC of the equipment line;

[0029] Figure 5 A view of the conveying robot is shown;

[0030] Figure 6 A cross-sectional view of a transfer chamber conceived according to the present invention is shown;

[0031] Figures 7A to 7C A view conceived according to the present invention for describing the diagnostics of a robotic arm using a transfer chamber; and

[0032] Figure 8 A flowchart illustrating a robotic arm diagnostic method conceived according to the present invention is provided. Detailed Implementation

[0033] In the following description, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to the embodiments described herein. Furthermore, in the description of embodiments of the inventive concept, detailed descriptions of related known functions or configurations will be omitted where it is unnecessary to obscure the essence of the inventive concept. Additionally, throughout the drawings, components with similar functions and operations use the same reference numerals.

[0034] The expression “comprising” may mean that other elements may be further included without excluding them, unless there is a particularly contradictory description. The terms “comprising” and “having” are used to indicate the presence of the features, figures, steps, operations, elements, components or combinations thereof described in the specification, and can be understood to mean that one or more other features, figures, steps, operations, elements, components or combinations thereof may be added.

[0035] Unless explicitly stated in the context, singular expressions include plural expressions. Furthermore, in the accompanying drawings, the shape and size of elements may be exaggerated for clearer description.

[0036] Terms such as "first" and "second" may be used to describe different elements, but these elements should not be limited by the terms. These terms are only used to distinguish one component from another. For example, without departing from the scope and spirit of the inventive concept, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

[0037] Throughout this specification, the term "~cell" refers to a unit that performs at least one function or operation, and may refer to, for example, a software component or a hardware component, such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC). However, "~cell" is not limited to software or hardware. A "~cell" may reside in addressable memory media or be refreshed by one or more processors.

[0038] As an example, a "~unit" may include components (such as software components, object-oriented software components, class components, and task components), and may include processes, functions, performance, programs, subroutines, fragments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functionality provided by components and "~units" can be executed separately by multiple components and "~units," and can also be integrated with other additional components.

[0039] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. Embodiments of the inventive concept can be modified in various ways, and the scope of the inventive concept should not be construed as limited to the following embodiments. Embodiments of the inventive concept are provided to describe this disclosure more completely to those skilled in the art. Therefore, the shapes of the components in the drawings are exaggerated to emphasize their clearer description.

[0040] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. Embodiments of the inventive concept can be modified in various ways, and the scope of the inventive concept should not be construed as limited to the following embodiments. Embodiments of the inventive concept are provided to describe this disclosure more completely to those skilled in the art. Therefore, the shapes of the components in the drawings are exaggerated to emphasize their clearer description.

[0041] The apparatus according to this embodiment can be used to perform photolithography processes on substrates such as semiconductor wafers or flat panel display panels. Specifically, the apparatus of this embodiment can be connected to an exposure device to perform application and development processes on the substrate. Hereinafter, an example using a wafer as the substrate will be described.

[0042] Figure 1 This is a view of the substrate processing apparatus as seen from above. Figure 2 It is along Figure 1 The view captured by the line AA of the equipment. Figure 3 It is along Figure 1 The view captured by the BB line of the equipment, and Figure 4 It is along Figure 1 The view captured by CC of the equipment.

[0043] Reference Figures 1 to 4 The substrate processing apparatus 1 includes a loading port 100, an indexing module 200, a connection module 300, an application and development module 400, a buffer module 500, a pre-exposure or post-exposure processing module 600, and an interface module 700. The loading port 100, the indexing module 200, the connection module 300, the application and development module 400, the buffer module 500, the pre-exposure or post-exposure processing module 600, and the interface module 700 are arranged sequentially in one direction.

[0044] In the following text, the direction in which the loading port 100, index module 200, connection module 300, application and development module 400, buffer module 500, pre-exposure or post-exposure processing module 600 and interface module 700 are arranged is called the first direction 12, the direction perpendicular to the first direction 12 when viewed from above is called the second direction 14, and the direction perpendicular to the first direction 12 and the second direction 14 is called the third direction 16.

[0045] The substrate "W" is moved while it is housed in the box 20. In this case, the box 20 may have a structure that is sealed from the outside. For example, a front-open unified pod (FOUP) with a door on the front may be used as the box 20.

[0046] The following sections will describe in detail the loading port 100, indexing module 200, connection module 300, application and development module 400, buffer module 500, pre-exposure or post-exposure processing module 600, and interface module 700.

[0047] The loading port 100 has a mounting stage 120 on which a box 20 containing a substrate "W" is placed. The mounting stages 120 are configured as a plurality of mounting stages 120, and the mounting stages 120 are aligned in a second direction 14. Figure 2 Four mounting platforms 120 are set up in the middle.

[0048] The indexing module 200 transports substrate "W" between the connecting module 300 and the box 20 placed on the loading stage 120 of the loading port 100. The indexing module 200 has a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 is configured in a basic rectangular parallelepiped shape with an empty interior, and is positioned between the loading port 100 and the connecting module 300. The frame 210 of the indexing module 200 may be positioned lower than the frame 310 of the connecting module 300. The indexing robot 220 and the guide rail 230 are arranged within the frame 210. The indexing robot 220 picks up and places the substrate "W". The indexing robot 220 moves along the guide rail 230. Furthermore, the indexing robot 220 may be rotatable relative to the guide rail 230. Additionally, although not shown, a dooropener for opening or closing the door of the box 20 is further provided within the frame 210.

[0049] The connecting module 300 can be located in a path through which the substrate "W" to be processed is transported out of and then into the cassette 20, or the processed substrate "W" is transported out to the cassette 20, and the substrate "W" can be temporarily located in the connecting module 300. The connecting module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is configured in a rectangular parallelepiped shape with an empty interior, and the frame 310 is disposed between the indexing module 200 and the application and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located inside the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are arranged sequentially from the bottom in a third direction 16. The first buffer zone 320 is located at a height corresponding to the application module 401 of the application and developing module 400, which will be described below, while the second buffer zone 330 and the cooling chamber 350 are located at a height corresponding to the developing module 402 of the application and developing module 400, which will be described below. The first buffer zone robot arm 360 is positioned at a predetermined distance from the second buffer zone 330, the cooling chamber 350, and the first buffer zone 320 in the second direction 14.

[0050] First buffer 320 and second buffer 330 temporarily store multiple substrates "W". Second buffer 330 has a housing 331 and multiple supports 332. Supports 332 are arranged inside housing 331 and spaced apart from each other in a third direction 16. One substrate "W" is placed on each support 332. Housing 331 has openings (not shown) in the direction of setting index robot 220, setting first buffer robot 360, and setting developing unit robot 482 of developing module 402 (described below), so that index robot 220, first buffer robot 360, and developing robot 482 can move substrates "W" into or out of the supports 332 in housing 331. First buffer 320 has a structure substantially similar to that of second buffer 330. However, housing 321 of first buffer 320 has openings in the direction of setting first buffer robot 360 and in the direction of setting application unit robot 432 located in application module 401 (described below). The number of support members 322 provided in the first buffer zone 320 may be the same as or different from the number of support members 332 provided in the second buffer zone 330. According to an embodiment, the number of support members 332 provided in the second buffer zone 330 may be greater than the number of support members 322 provided in the first buffer zone 320.

[0051] A first buffer robot 360 transfers a substrate “W” between a first buffer 320 and a second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support 363. The hand 361 is fixedly mounted in the arm 362. The arm 362 may be configured as a telescopic structure to allow the hand 361 to be movable in a second direction 14. The arm 362 is coupled to the support 363 to be linearly movable along the support 363 in a third direction 16. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 may be configured to be longer than its length in the upward or downward direction. The first buffer robot 360 may be configured such that the hand 361 is simply driven only along two axes in the second direction 14 and the third direction 16.

[0052] The cooling chamber 350 cools the substrate "W". The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate "W" is placed and a cooling unit 353 for cooling the substrate "W". Various methods, such as cooling with cooling water and cooling using thermoelectric elements, can be used as the cooling unit 353. Furthermore, the cooling chamber 350 may be provided with a lifting pin assembly (not shown) for positioning the substrate "W" on the cooling plate 352. The housing 351 has openings (not shown) in the direction of setting the indexing robot 220 and the direction of setting the developing unit robot 482 of the developing module 402 (described below), allowing the indexing robot 220 and the developing robot 482 to move the substrate "W" into or out of the cooling plate 352. Furthermore, the cooling chamber 350 may be provided with a door (not shown) for opening or closing the aforementioned openings.

[0053] The application and development module 400 performs a process of applying photoresist to the substrate "W" before the exposure process, and a process of developing the substrate "W" after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The application and development module 400 has an application module 401 and a development module 402. The application module 401 and the development module 402 are arranged spaced apart from each other in a layer. According to one embodiment, the application module 401 is located above the development module 402.

[0054] The application module 401 performs a process of applying a photosensitive liquid, such as photoresist, to a substrate "W" before and after the resist application process, as well as a heat treatment process of heating or cooling the substrate "W". The application module 401 has a resist application chamber 410, a baking chamber 420, and a transfer chamber 430. The resist application chamber 410, baking chamber 420, and transfer chamber 430 are arranged sequentially along a second direction 14. Therefore, the resist application chamber 410 and baking chamber 420 are positioned spaced apart from each other in the second direction 14, with the transfer chamber 430 inserted between the resist application chamber and the baking chamber. The resist application chambers 410 are configured as a plurality of resist application chambers 410, and the plurality of resist application chambers 410 are disposed in a first direction 12 and a third direction 16. An embodiment with six resist application chambers 410 is shown in the figure. The plurality of baking chambers 420 are disposed in the first direction 12 and the third direction 16. The figure shows an embodiment with six baking chambers 420. However, unlike this, a greater number of baking chambers 420 can be provided.

[0055] The transfer chamber 430 is positioned parallel to the first buffer zone 320 of the connection module 300 in the first direction 12. The application unit robot 432 and guide rail 433 are located within the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The application unit robot 432 transfers substrate “W” between the baking chamber 420, the resist application chamber 410, the first buffer zone 320 of the connection module 300, and the first cooling chamber 520 of the buffer module 500, as will be described below. The guide rail 433 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the application unit robot 432 to move linearly along the first direction 12. The application unit robot 432 has a hand 434, an arm 435, a support 436, and a base 437. The hand 434 is fixedly mounted in the arm 435. The arm 435 may be configured as a telescopic structure to allow the hand 434 to be movable in the horizontal direction. The support member 436 is configured such that its length direction is oriented in the third direction 16. An arm 435 is coupled to the support member 436 to be linearly movable along the support member 436 in the third direction 363. The support member 436 is fixedly coupled to a base 437, and the base 437 is coupled to a guide rail 433 to be movable along the guide rail 433.

[0056] All resist application chambers 410 have the same structure. However, the type of photoresist used in the resist application chambers 410 can differ from each other. As an example, a chemically amplified resist can be used as the photoresist. The resist application chamber 410 applies photoresist to a substrate "W". The resist application chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located inside the housing 411 and supports the substrate "W". The support plate 412 is rotatably disposed. The nozzle 413 supplies photoresist to the substrate "W" placed on the support plate 412. The nozzle 413 has a cylindrical shape and can supply photoresist to the center of the substrate "W". Optionally, the length of the nozzle 413 can correspond to the diameter of the substrate "W", and the outlet of the nozzle 413 can be configured as a slit. In addition, the resist application chamber 410 may be additionally provided with a nozzle 414, which supplies a cleaning solution such as deionized water to clean the surface of the substrate "W" on which photoresist is applied.

[0057] Baking chamber 420 heats the substrate "W". For example, before applying photoresist, baking chamber 420 performs a pre-baking process to heat the substrate "W" to a predetermined temperature to remove organic matter or moisture from the surface of the substrate "W"; after applying photoresist to the substrate "W", a soft baking process is performed; and after the heating process, a cooling process is performed to cool the substrate "W". Baking chamber 420 has a cooling plate 421 or a heating plate 422. Cooling plate 421 is provided with a cooling unit 423, such as cooling water or a thermoelectric element. In addition, heating plate 422 is provided with a heating unit 424, such as a heating wire or a thermoelectric element. Cooling plate 421 and heating plate 422 can be provided in one baking chamber 420. Optionally, some baking chambers 420 may only have cooling plate 421, while other baking chambers 420 may only have heating plate 422.

[0058] The developing module 402 performs a developing process that supplies developer and removes a portion of the photoresist to obtain a pattern on the substrate "W", as well as a heat treatment process that heats or cools the substrate "W" before or after the developing process. The developing module 402 has a developing chamber 800, a baking chamber 470, and a transfer chamber 480. The developing chamber 800, baking chamber 470, and transfer chamber 480 are arranged sequentially along a second direction 14. Therefore, the developing chamber 800 and baking chamber 470 are positioned spaced apart from each other in the second direction 14, with the transfer chamber 480 inserted between the developing chamber and the baking chamber. The developing chamber 800 is configured as a plurality of developing chambers 800, and the plurality of developing chambers 800 are arranged in a first direction 12 and a third direction 16. An embodiment with six developing chambers 800 is shown in the figure. A plurality of baking chambers 470 are arranged in a first direction 12 and a third direction 16. An embodiment with six baking chambers 470 is shown in the figure. However, unlike this, a greater number of baking chambers 470 can be set.

[0059] The transfer chamber 480 is positioned parallel to the second buffer zone 330 of the connecting module 300 in the first direction 12. A developing unit robot 482 and a guide rail 483 are located within the transfer chamber 480. The transfer chamber 480 has a generally rectangular shape. The developing unit robot 482 transfers substrates "W" between the baking unit 470, the developing chamber 800, the second buffer zone 330 and cooling chamber 350 of the connecting module 300, and the second cooling chamber 540 of the buffer module 500. The guide rail 483 is configured such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing unit robot 482 to move linearly along the first direction 12. The developing unit robot 482 has a hand 484, an arm 485, a support 486, and a base 487. The hand 484 is fixedly mounted in the arm 485. The arm 485 may be configured as a telescopic structure to allow the hand 484 to be movable in the horizontal direction. Support member 486 is configured such that its longitudinal direction is positioned in the third direction 16. Arm 485 is coupled to support member 486 so as to be linearly movable along support member 486 in the third direction 363. Support member 486 is fixedly coupled to base 487. Base 487 is coupled to guide rail 483 so as to be movable along guide rail 483.

[0060] A buffer module 500 is configured as a channel through which the substrate "W" is transferred between the application and developing module 400 and the pre-exposure or post-exposure processing module 600. Additionally, the buffer module 500 performs predetermined processes on the substrate "W," such as a cooling process or an edge exposure process. The buffer module 500 has a frame 510, a buffer zone 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. The frame 510 has a rectangular parallelepiped shape. The buffer zone 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located inside the frame 510. The buffer zone 520, the first cooling chamber 530, and the edge exposure chamber 550 are arranged at a height corresponding to the application module 401. The second cooling chamber 540 is arranged at a height corresponding to the developing module 402. Buffer 520, first cooling chamber 530, and second cooling chamber 540 are sequentially aligned in the third direction 16. When viewed from above, buffer 520 is positioned together with the transfer chamber 430 of application module 401 in the first direction 12. Edge exposure chamber 550 is spaced a predetermined distance from buffer 520 or first cooling chamber 530 in the second direction 14.

[0061] A second buffer robot 560 transports a substrate "W" between a buffer chamber 520, a first cooling chamber 530, and an edge exposure chamber 550. The second buffer robot 560 is located between the edge exposure chamber 550 and the buffer chamber 520. The second buffer robot 560 can be configured to have a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform subsequent processes on the substrate "W" on which the process has already been performed in the application module 401. The first cooling chamber 530 cools the substrate "W" on which the process has already been performed in the application module 401. The first cooling chamber 530 has a structure similar to that of the cooling chamber 350 of the connection module 300. The edge exposure chamber 550 exposes the edges of the substrate "W" on which the cooling process has already been performed in the first cooling chamber 530. The buffer chamber 520 temporarily stores the substrate "W" before transporting it to the pre-processing module 601. Before the substrate "W", on which the process has been performed in the post-processing module 602 described below, is transported to the developing module 402, the second cooling chamber 540 cools the substrate "W". The buffer module 500 may further have a buffer added to a height corresponding to the developing module 402. In this case, the substrate "W", on which the process has been performed in the post-processing module 602, can be temporarily stored in the added buffer and then transported to the developing module 402.

[0062] When the exposure equipment performs an immersion exposure process, the pre-exposure or post-exposure processing module 600 can perform a process of applying a protective film, which protects the photoresist film applied to the substrate 'W' during the immersion exposure process. Additionally, the pre-exposure or post-exposure processing module 600 can perform a process of cleaning the substrate 'W' after exposure. Furthermore, when using a chemically amplified resist in the application process, the pre-exposure or post-exposure processing module 600 can perform a post-exposure baking process.

[0063] The pre- or post-exposure processing module 600 includes a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs the processing of the substrate "W" before the exposure process, while the post-processing module 602 performs the processing of the substrate "W" after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged separately from each other in a layer. According to one embodiment, the pre-processing module 601 is located above the post-processing module 602. The pre-processing module 601 is positioned at the same height as the application module 401. The post-processing module 602 is positioned at the same height as the developing module 402. The pre-processing module 601 includes a protective film application chamber 610, a baking chamber 620, and a transfer chamber 630. The protective film application chamber 610, the baking chamber 630, and the transfer chamber 620 are arranged sequentially along a second direction 14. Therefore, the protective film application chamber 610 and the baking chamber 620 are positioned spaced apart from each other in the second direction 14, wherein the transfer chamber 630 is inserted between the protective film application chamber and the baking chamber. A plurality of protective film application chambers 610 are provided, and the plurality of protective film application chambers 610 are arranged in a third direction 16 to form a layer therebetween. The protective film application chambers 610 may optionally be provided in the first direction 12 or the third direction 16. A plurality of baking chambers 620 are provided, and the plurality of baking chambers 620 are arranged in a third direction 16 to form a layer therebetween. The plurality of baking chambers 620 may optionally be provided in the first direction 12 or the third direction 16.

[0064] The transfer chamber 630 is positioned parallel to the first cooling chamber 530 of the buffer module 500 in a first direction 12. A pre-processing robot 632 is located inside the transfer chamber 630. The transfer chamber 630 has a generally square or rectangular shape. The pre-processing robot 632 transfers substrate “W” between the protective film application chamber 610, the baking chamber 620, the buffer zone 520 of the buffer module 500, and the first buffer zone 720 of the interface module 700, which will be described below. The pre-processing robot 632 has a hand 633, an arm 364, and a support 635. The hand 633 is fixedly mounted in the arm 634. The arm 634 is configured as a telescopic and rotatable structure. The arm 634 is coupled to the support 635 so that it is linearly movable along the support 635 in a third direction 363.

[0065] The protective film application chamber 610 applies a protective film, protecting the photoresist film, to the substrate "W" during immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 is cup-shaped with an open top. The support plate 612 is located inside the housing 611 and supports the substrate "W". The support plate 612 is rotatably disposed. The nozzle 613 supplies a protective liquid for forming the protective film to the substrate "W" placed on the support plate 612. The nozzle 613 has a cylindrical shape and can supply the protective liquid to the center of the substrate "W". Optionally, the length of the nozzle 613 can correspond to the diameter of the substrate "W", and the outlet of the nozzle 613 can be configured as a slit. In this case, the support plate 612 can be fixed. The protective liquid contains a foaming material. Materials with low affinity for photoresist and water can be used as the protective liquid. For example, the protective liquid can contain fluorinated solvents. When the substrate "W" is rotated and placed on the support plate 612, the protective film application chamber 610 supplies protective liquid to the center of the substrate "W".

[0066] Baking chamber 620 heat-treats a substrate "W" on which a protective film is applied. Baking chamber 620 has a cooling plate 621 or a heating plate 622. Cooling plate 621 is provided with a cooling unit 623, such as cooling water or a thermoelectric element. Alternatively, heating plate 622 is provided with a heating unit 624, such as a heating wire or a thermoelectric element. Heating plate 622 and cooling plate 621 can be disposed in one baking chamber 620. Optionally, some baking chambers 620 may only have heating plate 622, while other baking chambers 620 may only have cooling plate 621.

[0067] The post-processing module 602 includes a cleaning chamber 660, a post-exposure baking chamber 670, and a transfer chamber 680. The cleaning chamber 660, transfer chamber 680, and post-exposure baking chamber 670 are arranged sequentially along a second direction 14. Therefore, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned spaced apart from each other in the second direction 14, with the transfer chamber 680 inserted between the cleaning chamber and the post-exposure baking chamber. Multiple cleaning chambers 660 can be provided, and the multiple cleaning chambers 660 can be arranged in a third direction 16 to form a layer therebetween. The multiple cleaning chambers 660 can optionally be arranged in either the first direction 12 or the third direction 16. Multiple post-exposure baking chambers 670 can be provided, and the multiple post-exposure baking chambers 670 can be arranged in either the third direction 16 to form a layer therebetween. The multiple post-exposure baking chambers 670 can optionally be arranged in either the first direction 12 or the third direction 16.

[0068] The transfer chamber 680 is positioned parallel to the second cooling chamber 540 of the buffer module 500 in a first direction 12 when viewed from above. The transfer chamber 680 has a generally square or rectangular shape. The post-processing robot 682 is located inside the transfer chamber 680. The post-processing robot 682 transports the substrate "W" between the cleaning chamber 610, the post-exposure baking chamber 670, the second cooling chamber 540 of the buffer module 500, and the second buffer 730 of the interface module 700, which will be described below. The post-processing robot 682 disposed in the post-processing module 682 can be configured with the same structure as the pre-processing robot 632 disposed in the pre-processing module 601.

[0069] Cleaning chamber 660 cleans substrate "W" after the exposure process. Cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. Housing 661 is cup-shaped with an open top. Support plate 662 is located inside housing 661 and supports substrate "W". Support plate 662 is rotatably disposed. Nozzle 663 supplies cleaning liquid to substrate "W" placed on support plate 662. Water, such as deionized water, can be used as the cleaning liquid. When substrate "W" is rotated on support plate 662, cleaning chamber 660 supplies cleaning liquid to the center of substrate "W". Optionally, when substrate "W" is rotated, nozzle 663 can move linearly or rotationally from the center to the edge of substrate "W".

[0070] The post-exposure baking chamber 670 uses far-ultraviolet light to heat the substrate "W" on which the exposure process has been performed. In the post-exposure baking process, heating the substrate "W" amplifies the acid generated in the photoresist through exposure, thereby altering the properties of the photoresist. The post-exposure baking chamber 670 has a heating plate 672. The heating plate 672 is provided with heating units 674, such as heating wires or thermoelectric elements. The post-exposure baking chamber 670 may also include a cooling plate 671. The cooling plate 671 is provided with cooling units 673, such as cooling water or thermoelectric elements. Alternatively, a baking chamber having only a cooling plate 671 may be provided.

[0071] As described above, in the pre-exposure or post-exposure processing module 600, the pre-processing module 601 and the post-processing module 602 are configured to be completely separate from each other. Furthermore, the transfer chamber 630 of the pre-processing module 601 and the transfer chamber 680 of the post-processing module 602 can be configured to have the same size and can be configured to completely cover each other when viewed from above. Additionally, the protective film application chamber 610 and the cleaning chamber 660 can be configured to have the same size and can be configured to completely cover each other when viewed from above. Furthermore, the baking chamber 610 and the post-exposure baking chamber 670 can be configured to have the same size and can be configured to completely cover each other when viewed from above.

[0072] Interface module 700 transfers substrate "W" between pre-exposure or post-exposure processing module 600 and exposure equipment. Interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, second buffer 730, and interface robot 740 are located inside the frame 710. The first buffer 720 and second buffer 730 are spaced apart by a predetermined distance and arranged to stack on top of each other. The first buffer 720 is positioned higher than the second buffer 730. The first buffer 720 is located at a height corresponding to the pre-processing module 601, and the second buffer 730 is located at a height corresponding to the post-processing module 602. When viewed from above, the first buffer 720 is aligned in a first direction 12 with the transfer chamber 630 of the pre-processing module 601, while the second buffer 730 is aligned in the first direction 12 with the transfer chamber 680 of the post-processing module 602.

[0073] Interface robot 740 is positioned spaced apart from first buffer 720 and second buffer 730 in a second direction 14. Interface robot 740 transports substrate "W" between first buffer 720, second buffer 730 and exposure equipment. Interface robot 740 has a structure substantially similar to that of second buffer robot 560.

[0074] Before moving the substrate "W", on which the process has been performed in the post-processing module 601, to the exposure equipment 1, a first buffer 720 temporarily stores the substrate "W". Before moving the substrate "W", on which the process has been completed in the exposure equipment, to the post-processing module 602, a second buffer 730 temporarily stores the substrate "W". The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are arranged inside the housing 721 and are spaced apart from each other in a third direction 16. A substrate W is placed on each support 722. The housing 721 has openings (not shown) in the direction of setting the interface robot 740 and the direction of setting the pre-processing robot 632, so that the interface robot 740 and the pre-processing robot 632 can transport the substrate "W" into or out of the supports 722 within the housing 721. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 731 of the second buffer 730 has openings (not shown) in the direction of setting the interface robot 740 and in the direction of setting the post-processing robot 682. The interface module 700 may only be provided with the buffer and robot as described above without providing a chamber on the substrate "W" for performing the predetermined process.

[0075] The developing chamber 800 has the same structure. However, the types of developer used in the developing chamber 800 can be different from each other. The developing chamber 800 is configured as a device for developing a substrate "W". The developing chamber 800 removes the photoresist areas on the substrate "W" that are exposed to light. In this case, even the protective film areas that are exposed to light are removed together. Depending on the type of photoresist used selectively, only the areas of the photoresist and the protective film that are not exposed to light can be removed.

[0076] Figure 5 This is a view showing the transfer robot.

[0077] Like indexing robot 220, application unit robot 432, developing unit robot 482, pre-processing robot 632, post-processing robot 682, interface robot 740, etc., a transfer robot 1000 can be provided in the substrate processing apparatus 1 to transfer substrates S1 and S2 from one position to another.

[0078] Reference Figure 5 The conveying robot 1000 includes one or more hands 2210 and 2220, a base 2200, and a sensor 2230.

[0079] The transfer robot 1000 may include a first hand 2210 and a second hand 2220 positioned from top to bottom. The first hand 2210 and the second hand 2220 respectively pick up and place a first substrate S1 and a second substrate S2. The hands 2210 and 2220 are provided with vacuum holes 2300, which form a vacuum pressure for suction of substrates S1 and S2. Multiple vacuum holes 2300 may be provided.

[0080] The base 2200 supports the hands 2210 and 2220. For example, the base 2200 is configured as a block with a defined volume, and the first hand 2210 and the second hand 2220 are coupled to the base 2200 to be movable in the front-rear direction. The hands 2210 and 2220 may be configured as having an interior that is open in the vertical direction, and may be configured as the outer bottom surface supporting the substrates S1 and S2.

[0081] Sensor 2230 detects the positions of substrates S1 and S2 located in hands 2210 and 2220.

[0082] For example, four sensors 2230 can be arranged at positions facing each other. Each sensor 2230 includes a light emitting unit 2231 and a light receiving unit 2232. The light emitting unit 2231 and the light receiving unit 2232 can be arranged at positions corresponding to the outer edges of substrates S1 and S2, so that the sensors 2230 can detect the positions of the outer edges of substrates S1 and S2.

[0083] The light emitting unit 2231 can be located below the second hand 2220, and the light receiving unit 2232 can be located above the first hand 2210, vertically facing the light emitting unit 2231. For example, the light emitting unit 2231 can be located on the upper or side surface of the base 2200, and the light receiving unit 2232 can be located at a position spaced a predetermined distance upward from the first hand 2210. Similarly, the light receiving unit 2232 can be located below the second hand 2220, and the light emitting unit 2231 can be located above the first hand 2210, vertically facing the light receiving unit 2232. The hands 2210 and 2220 are not located in the space where the light emitting unit 2231 and the light receiving unit 2232 face each other, therefore, light emitted from the light emitting unit 2231 can be received by the light receiving unit 2232. Furthermore, when substrates S1 and S2 are located in hands 2210 and 2220, substrates S1 and S2 block light, and light receiving unit 2232 can detect the external position of substrates S1 and S2 by the area where light is received and the area where light is blocked.

[0084] The controller 900 can calculate the position information of substrates S1 and S2 using signals provided by sensor 2230. Furthermore, when placing substrates S1 and S2, the controller 900 uses the calculated position information of substrates S1 and S2 to control the indexing robot 220, ensuring that substrates S1 and S2 are placed in the correct positions. For example, the controller 900 can calculate the center position of substrates S1 and S2 located in hands 2210 and 2220 using signals provided by sensor 2230. Moreover, when placing substrates S1 and S2, the controller 900 can control the indexing robot 220 to place the calculated center at the set position.

[0085] According to an embodiment, the controller 900 can determine whether the substrate position is normal based on the value measured by the sensor 2230. The controller 900 can measure sensor data even when the wafer is absent and can process the measured sensor data into a reference value. According to an embodiment, the reference value can be 0.000. However, the sensor may be misaligned due to loose bolts, vibration, P / C, etc. During diagnosis, the sensor value is read in the absence of a wafer. When the value is higher or lower than a predetermined limit, it is considered that the sensor's reference point is misaligned, thereby generating an alarm.

[0086] According to the embodiment, when the limit value is set to 0.300 mm, if the measured value is 0.314 mm, it is considered that the value exceeds the limit value, thereby generating an alarm. When an alarm is generated, the sensor can be reset.

[0087] Figure 6 A cross-sectional view of a transfer chamber conceived according to the present invention is shown.

[0088] According to the present invention, a system is provided for diagnosing the condition of a conveyor robot and taking measures before problems occur. According to an embodiment, the condition of the conveyor robot can be determined by diagnosing whether the hardware is misaligned or whether the wafer measurement sensor reference is misaligned.

[0089] Reference Figure 6 An embodiment of a determination system for determining whether a conveying robot for conveying a substrate is functioning properly is disclosed.

[0090] Figure 6 An embodiment of the application unit robot 432 is shown. According to... Figure 6 The application unit manipulator 432 has a hand 434, an arm 435, a support 436, and a base 437. The configuration described above will be omitted, and the characteristic parts of the inventive concept will be described below.

[0091] Reference Figure 6 The determination system conceived according to the present invention may include a sensor detection member 1200, a sensor member 1100, and a determination unit (not shown). According to an embodiment, the sensor detection member 1200 may be attached to a moving member to transport the substrate "W". According to an embodiment, the sensor detection member 1200 may be attached to a hand 434. However, this is merely an embodiment, and the sensor detection member 1200 may be attached to any moving object other than the hand 434. According to an embodiment, the sensor detection member 1200 may be a dog bar. According to an embodiment, the sensor detection member 1200 may be attached to one end or the lower end of a moving object. According to an embodiment, the sensor detection member 1200 may be positioned at a location accessible to and detectable by the sensor member 1100, as will be described below.

[0092] According to an embodiment, sensor component 1100 may be attached to a support member that supports a moving member to transport the substrate "W". According to an embodiment, sensor component 1100 may be attached to support member 436. Sensor component 1100 may be fixed in a fixed state when attached to a fixing member. Sensor component 1100 may detect the presence of sensor detection member 1200. Sensor component 1100 may be a slotted sensor.

[0093] According to an embodiment, the determining unit (not shown) can determine whether the conveying robot is functioning correctly based on the distance between the sensor detection component 1200 and the sensor component 1100. According to an embodiment, the moving component of the conveying substrate "W" can be driven by a motor. The motor can be configured to be embedded in the conveying chamber. According to an embodiment, the motor can be configured to be embedded in a support component or a moving component.

[0094] According to an embodiment, the determining unit can use the Z-phase of the motor to determine whether the conveying robot is functioning correctly. The Z-phase refers to the origin output phase, and means that an encoder connected to the motor outputs a pulse each time it performs a rotation.

[0095] That is, when the Z phase is used for the motor, the encoder connected to the driven motor performs one rotation and outputs a pulse, and the moving component can move by an amount corresponding to one pulse.

[0096] According to the present invention, the determining unit can set the position where the sensor detection member 1200 can be detected in the sensor member 1100 as a first position. The position where the moving member moves from the first position by an amount corresponding to the Z-phase in the motor can be set as a second position. Therefore, the determining unit can determine whether the conveying robot is functioning correctly based on the difference between the second position and the first position.

[0097] More specifically, the determining unit according to the present invention can perform control to periodically measure the difference between the second position and the first position using the periodically measured difference between the second position and the first position as a reference value, and generate an alarm when the difference between the reference value and the measured difference exceeds a preset range. In this way, when the conveying robot malfunctions, the error can be quickly identified and corresponding measures taken.

[0098] According to the present invention, based on the initial measurement point, i.e., the distance between the first position and the sensor detection component 1200, the distance measured at the initial origin and the distance set as a reference are compared with each other, and an alarm can be generated when the comparison value deviates from a preset error range. Therefore, when a problem occurs, the recorded data can be used to identify the existence of trends and temporary phenomena.

[0099] That is, according to the concept of the present invention, by diagnosing the condition of the robotic arm in advance, equipment failure and wafer loss due to problems during operation can be prevented in advance.

[0100] exist Figure 6 In the case described, a transfer robot capable of moving along the Z-axis has been described as an example. However, the inventive concept is not limited to this and can be applied to transfer robots that move along various axes, as long as the transfer robot is driven by a motor. According to the example, the inventive concept can even be applied equally to transfer robots that move along the X-axis, Y-axis, and Z-axis.

[0101] According to the present invention, since diagnostics are performed periodically during operation, abnormalities can be identified more quickly when the condition of the transfer robot malfunctions. According to an embodiment, diagnostics can be performed every 24 hours. According to an embodiment, diagnostics can be performed every 12 hours. Alternatively, according to an embodiment, diagnostics can be performed while the robot is in standby mode. That is, in the present invention, the robot can be diagnosed by periodically performing Z-phase distance checks on the motors along their respective axes and misalignment checks on sensors used to detect wafer position.

[0102] This will be described in more detail below.

[0103] Figures 7A to 7C This is a view conceived according to the present invention for describing the diagnosis of a robotic arm using a transfer chamber.

[0104] Reference Figure 7A When the cycle for diagnosing the robotic arm (e.g., 24 hours) has elapsed, the sensor detection component 1200 can be controlled to move to a first position, such that the sensor detection component 1200 attached to the moving component can be detected by the sensor component 1100. This is achieved through... Figure 7B As shown. (Refer to...) Figure 7B The sensor component 1100, positioned in a fixed location, can detect the sensor detection component 1200 attached to the moving component and use the corresponding position as a reference position or reference point. Then, referring to... Figure 7C The moving component can be driven by driving the motor with a quantity corresponding to the Z-phase of the motor. Hereinafter, "d" represents the distance between sensor detection component 1200 and sensor component 1100. The value of "d" obtained herein is compared with a reference value; when the difference exceeds a predetermined error range, an alarm is generated, thus easily diagnosing whether the transfer robot is functioning correctly.

[0105] That is, in the concept of this invention, by converting the drive distance to the Z phase corresponding to the basic characteristics of the motor, it is easy to determine whether the conveying robot is working properly.

[0106] This will be described again by applying numerical values ​​as follows.

[0107] In this invention, the distance between the sensor component 1100 and the sensor detection component 1200 can be compared using the Z phase of the motor that provides the motion of the conveyed component.

[0108] When the transfer robot needs to begin diagnostics, the motor can move to detect sensor component 1100, and after detecting sensor component 1100, it moves to find the Z phase. The motor has a unique pulse, called the Z phase. One point can correspond to one rotation of the motor. It is assumed that, according to the embodiment, the corresponding pulse value from the first position to the second position is 10,000 pulses, corresponding to a reference value.

[0109] When measurements are performed via periodic diagnostics, assuming the corresponding pulse value from the first position to the second position is measured as 9000 pulses, a difference of 1000 pulses occurs. An alarm can be generated when it is determined that the 1000 pulses corresponding to this difference exceed a predetermined error range. According to embodiments, diagnostics can be performed by comparing motor-based pulses, and diagnostics can also be performed by comparing converted distances.

[0110] Figure 8 A flowchart illustrating a robotic arm diagnostic method conceived according to the present invention is provided.

[0111] Reference Figure 8 A diagnostic method is disclosed based on an embodiment where the diagnostic cycle is set to 24 hours. After 24 hours, the distance from the slot position (i.e., the first position) to a second position changed by the Z phase can be measured. A preset limit value is compared with the difference between the second and first positions; if the difference exceeds the limit value, an alarm can be generated.

[0112] This will be described in more detail below.

[0113] The diagnostic method for the robotic arm includes: measuring a reference value to determine whether the conveying robotic arm is functioning correctly; positioning the conveying robotic arm to a reference position; moving the conveying robotic arm by an amount corresponding to the Z-phase of the motor driving the conveying robotic arm; and comparing the reference value with the difference between the reference position and the position moved by the conveying robotic arm. According to an embodiment, positioning the conveying robotic arm to the reference position may include positioning the conveying robotic arm at a position where a sensor member 1100 is detected in a sensor detection member 1200, the sensor member 1100 being attached to a second member for supporting a first member, and the sensor detection member 1200 being attached to a first member for driving the conveying robotic arm. Then, moving the conveying robotic arm by an amount corresponding to the Z-phase of the motor driving the conveying robotic arm may include positioning the conveying robotic arm at a position when the first member is driven by an amount corresponding to the Z-phase of the motor driving the first member.

[0114] According to an embodiment, comparing the reference value with the difference between the reference position and the position moved by the conveying robot may include generating an alarm when the difference deviates from the error range of the reference value.

[0115] According to an embodiment, the following steps can be repeated periodically: positioning the conveying robot at a reference position, moving the conveying robot by an amount corresponding to the Z-phase of the motor driving the conveying robot, and comparing a reference value with the difference between the reference position and the position moved by the conveying robot. According to an embodiment, measuring the reference value used to determine whether the conveying robot is functioning correctly may include setting a value obtained by measuring and averaging the difference between the reference position and the position moved by the conveying robot as the reference value.

[0116] In addition, an alarm can be generated when the measurement value of the sensor that can check the position of the substrate is higher than the limit value.

[0117] According to the present invention, since the conveying robot is inspected periodically, measures can be taken before errors occur.

[0118] According to the present invention, by pre-diagnosing the condition of the transfer robot, equipment failure and wafer loss due to problems during operation can be prevented in advance.

[0119] The effects of this invention are not limited to those described above. Those skilled in the art will clearly understand from this specification and the accompanying drawings any effects not mentioned.

[0120] It should be understood that the above embodiments are presented to aid in understanding the inventive concept and not to limit its scope. Various embodiments that can be modified from these embodiments also fall within the scope of the inventive concept. The accompanying drawings provided in this inventive concept only show preferred embodiments of the inventive concept. It should be understood that the technical protection scope of the inventive concept should be determined by the technical spirit of the appended claims, and that the technical protection scope of the inventive concept is not limited to the textual description of the appended claims, but essentially includes inventive concepts with equivalent technical value.

Claims

1. A system for determining whether a transfer robot configured to transfer a substrate is normal, the system comprising: a sensor detection member attached to a moving member for transferring the substrate; a sensor member attached to a support member configured to support the moving member for transferring the substrate; and a determination unit configured to determine whether the transfer robot is normal by a distance between the sensor detection member and the sensor member, wherein the moving member for transferring the substrate is driven by a motor, and wherein the determination unit: determines whether the transfer robot is normal using a Z-phase of the motor; sets a position at which the sensor detection member is detected in the sensor member as a first position, and sets a position at which the moving member is moved from the first position by a Z-phase of the motor as a second position; and determines whether the transfer robot is normal by determining whether a difference between (i) a measured pulse value measured by an encoder connected to the motor when the moving member is driven from the first position to the second position by the motor and (ii) a preset reference value is within a preset error range. The determination unit performs control to generate an alarm when the difference between the measured pulse value and the preset reference value exceeds the preset error range.

2. The system of claim 1, wherein, 3. A substrate processing apparatus comprising a transfer chamber for transferring a substrate, wherein the transfer chamber comprises: a hand portion on which the substrate is placed; an arm portion connected to the hand portion; a first member configured to support the hand portion and the arm portion and configured to move to transfer the substrate; a second member configured to support the first member; a sensor detection member attached to the first member; a sensor member attached to the second member; and a determination unit configured to determine whether transfer in the transfer chamber is normal by a distance between the sensor detection member and the sensor member, wherein the first member is driven by a motor, and the determination unit determines whether the transfer chamber is normal using a Z-phase of the motor; wherein the determination unit sets a position at which the sensor detection member is detected in the sensor member as a first position, and sets a position at which the first member is moved from the first position by a Z-phase of the motor as a second position; wherein the determination unit determines whether the transfer chamber is normal based on a difference between the second position and the first position; the determination unit determines whether the transfer chamber is normal by determining whether a difference between (i) a measured pulse value measured by an encoder connected to the motor when the first member is driven from the first position to the second position by the motor and (ii) a preset reference value is within a preset error range. ​ ​ 4. The substrate processing apparatus according to claim 3, wherein The determination unit performs control to generate an alarm when a difference between the measured pulse value and the preset reference value exceeds the preset error range.

5. A method for determining whether a transfer robot configured to transfer a substrate is normal, the method comprising: measuring a reference value for determining whether the transfer robot is normal; positioning the transfer robot to a reference position of the transfer robot; moving the transfer robot by an amount corresponding to a Z-phase of a motor driving the transfer robot; comparing a measured pulse value measured by an encoder connected to the motor when the transfer robot is moved from the reference position to a position corresponding to the Z-phase with the reference value; and determining whether the transfer robot is normal based on whether a difference between the measured pulse value and the reference value is within a preset error range. Positioning the transfer robot to the reference position of the transfer robot includes positioning the transfer robot in a position in which a sensor member attached to a second member for supporting a first member is detected in a sensor detection member attached to the first member for driving the transfer robot.

6. The method of claim 5, wherein, Moving the transfer robot by an amount corresponding to a Z-phase of a motor driving the transfer robot includes positioning the transfer robot in a position when the first member is driven by an amount corresponding to the Z-phase of the motor driving the first member.

7. The method of claim 6, wherein, Generating an alarm when a difference between the measured pulse value and the reference value exceeds the preset error value.

8. The method of claim 7, wherein, Repeating the steps of positioning the transfer robot to the reference position of the transfer robot, moving the transfer robot by an amount corresponding to a Z-phase of a motor driving the transfer robot, and comparing the measured pulse value with the reference value at a predetermined period.

9. The method of any one of claims 5-8, wherein, Measuring the reference value for determining whether the transfer robot is normal includes setting a value obtained by measuring and averaging the pulse values between the reference position and a position to which the transfer robot is moved as the reference value.

10. The method of claim 9, wherein, ​

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