electronic devices

Abstract

The present application relates to an electronic device comprising an NFC chip, including a first differential port and a second differential port; a metal housing, the metal housing comprising a metal back cover and a metal frame connected to the metal back cover, the metal back cover being provided with a hollow area, the metal frame being provided with a first NFC radiator, the first NFC radiator being insulated from other metal areas of the metal housing other than the first NFC radiator; a second NFC radiator, the orthographic projection of the second NFC radiator on the metal back cover at least partially overlapping the hollow area; and a third NFC radiator. The first, second, and third NFC radiators collectively form a differential current loop connected to the NFC chip, and eddy currents generated by the third NFC radiator on the metal back cover are at least partially blocked by the hollow area. The electronic device provided by the embodiments of the present application can improve the communication quality of near-field communication in the electronic device.

Description

Technical Field

[0001] The present application relates to the field of wireless communication technology, and in particular to an electronic device. Background Art

[0002] With the rapid development of wireless communication technology, NFC (Near Field Communication) has been deeply studied and widely used. Electronic devices using NFC technology can exchange data when they are close to each other.

[0003] Taking mobile terminals as an example, installing an NFC coil in a mobile terminal can enable applications such as mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting. Currently, most mobile terminals use a metal battery cover design to enhance the quality of the mobile terminal.

[0004] However, the design of the metal battery cover may result in poor quality of near field communication of the mobile terminal. Summary of the Invention

[0005] An embodiment of the present application provides an electronic device that can improve the communication quality of near-field communication of the electronic device.

[0006] An electronic device, comprising:

[0007] An NFC chip comprising a first differential port and a second differential port;

[0008] A metal housing, the metal housing comprising a metal back cover and a metal frame connected to the metal back cover, the metal back cover being provided with a hollow area, the metal frame being provided with a first NFC radiator, the first NFC radiator being insulated from other metal areas of the metal housing except the first NFC radiator;

[0009] a second NFC radiator, wherein an orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, one end of the second NFC radiator is connected to one end of the first NFC radiator, and the other end of the second NFC radiator is connected to the first differential port;

[0010] a third NFC radiator, one end of the third NFC radiator being connected to the other end of the first NFC radiator, and the other end of the third NFC radiator being connected to the second differential port;

[0011] The first NFC radiator, the second NFC radiator, and the third NFC radiator jointly form a differential current loop connected to the NFC chip, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area.

[0012] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0013] The electronic device according to the embodiment of the present application includes an NFC chip, the NFC chip including a first differential port and a second differential port; a metal housing, the metal housing including a metal back cover and a metal frame connected to the metal back cover, the metal back cover being provided with a hollow area, the metal frame being provided with a first NFC radiator, the first NFC radiator being insulated from other metal areas of the metal housing except the first NFC radiator; a second NFC radiator, the orthographic projection of the second NFC radiator on the metal back cover at least partially overlapping with the hollow area, one end of the second NFC radiator being connected to one end of the first NFC radiator, and the other end of the second NFC radiator being connected to the first differential port; and a third NFC radiator, the third NFC radiator being provided with a metal back cover and a metal frame connected to the metal back cover. One end of the NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port; wherein the first NFC radiator, the second NFC radiator and the third NFC radiator together form a differential current loop connected to the NFC chip, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area; thus, during the near-field communication process of the electronic device, first, because the first NFC radiator is arranged on the metal frame, rather than the NFC coil being pressed under the metal back cover in the conventional technology, the metal back cover of the embodiment of the present application does not have an electromagnetic shielding effect on the first NFC radiator, and the metal back cover will not be excited by the working current of the first NFC radiator. The reverse eddy current is generated to weaken the working current, thereby improving the quality of near-field communication of the electronic device. Secondly, since the first NFC radiator is insulated from other metal areas in the metal shell except the first NFC radiator, even if the other metal areas in the metal shell are grounded, the first NFC radiator will not be grounded, thereby avoiding the loss of working current in the first NFC radiator due to grounding, thereby improving the quality of near-field communication of the electronic device. Furthermore, since the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, the magnetic field lines of the second NFC radiator can radiate through the hollow area without being blocked by the metal back cover, thereby improving the second NFC radiator. Radiation performance, thereby improving the communication quality of near-field communication of the electronic device; in addition, the third NFC radiator will stimulate reverse eddy currents on the metal back cover when working, but because the metal back cover is provided with a hollow area, the eddy currents generated by the third NFC radiator on the metal back cover are at least partially blocked by the hollow area, so that the reverse magnetic field generated by the reverse eddy currents on the metal back cover will be greatly weakened, and the effective magnetic field of the third NFC radiator is restored, thereby improving the communication quality of near-field communication of the electronic device; the embodiment of the present application improves the communication quality of near-field communication of the electronic device at the same time by providing the first NFC radiator, the second NFC radiator and the third NFC radiator, effectively ensuring the smooth progress of near-field communication of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 A schematic diagram of a traditional metal battery cover hollowing arrangement for a mobile terminal;

[0016] Figure 2 Schematic diagram of a traditional mobile terminal's metal battery cover and NFC coil connected in series;

[0017] Figure 3 This is a schematic diagram of the internal structure of an electronic device in one embodiment of the present application;

[0018] Figure 4 This is a schematic diagram of an exemplary arrangement position of a first NFC radiator in an upper metal frame in another embodiment of the present application;

[0019] Figure 5 This is a schematic diagram of an exemplary arrangement position of a first NFC radiator in an upper metal frame in another embodiment of the present application;

[0020] Figure 6 This is a schematic diagram of an exemplary arrangement position of a first NFC radiator in an upper metal frame in another embodiment of the present application;

[0021] Figure 7 This is a schematic diagram of an exemplary arrangement position of a first NFC radiator in an upper metal frame in another embodiment of the present application;

[0022] Figure 8 This is a schematic diagram of the internal structure of an electronic device in another embodiment of the present application;

[0023] Figure 9 This is a schematic diagram of the installation position of a flexible circuit board in another embodiment of the present application.

[0024] Description of reference numerals:

[0025] NFC chip: 100; metal back cover: 200; metal frame: 300; first NFC radiator: 400; first feeding point: 410; second feeding point: 420; second NFC radiator: 500; third NFC radiator: 600. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0027] Unless otherwise defined, all technical and scientific terms used in the embodiments of the present application have the same meanings as those commonly understood by those skilled in the art in the technical field of the embodiments of the present application. The terms used in the embodiments of the present application and in the description of the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application.

[0028] It will be understood that the terms "first," "second," and the like used in the embodiments of the present application may be used to describe various elements in the embodiments of the present application, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of the embodiments of the present application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0029] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0030] As used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include", "comprising", "having", etc. specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0031] With the rapid development of wireless communication technology, NFC (Near Field Communication) has been deeply studied and widely used. Electronic devices using NFC technology can exchange data when they are close to each other.

[0032] Taking mobile terminals as an example, installing an NFC coil in a mobile terminal enables applications such as mobile payment, electronic ticketing, access control, mobile identity verification, and anti-counterfeiting. In related technologies, the NFC coil is typically installed under the battery cover of the mobile terminal. The non-metallic battery cover has little effect on the magnetic field of the NFC coil, and the NFC coil has sufficient magnetic field strength to ensure the quality of near-field communication within the mobile terminal.

[0033] However, at present, most mobile terminals use a metal battery cover design to improve the texture of the mobile terminals. The design of the metal battery cover will cause the inductance of the NFC coil to drop significantly, and the Q value (Quality-value) will be reduced. In addition, when the NFC coil is working, the working current in the NFC coil will excite eddy currents on the metal battery cover. The direction of the eddy currents is opposite to the direction of the working current of the NFC coil, thereby forming a reverse magnetic field, which weakens the working current of the NFC coil, resulting in a significant decrease in the communication quality of the mobile terminal's near-field communication, or even inability to communicate.

[0034] In the related art, when a mobile terminal adopts a metal battery cover design, there are two solutions to improve the communication quality of near-field communication of the mobile terminal:

[0035] 1) Please see Figure 1 , partially or completely hollow out the NFC coil in the projection area of the metal battery cover (the hollowed area is as follows Figure 1 The portion indicated by the reference numeral "3" in the figure), thus, Figure 1 The eddy current on the metal battery cover shown by the figure mark "2" is blocked, the direction of the eddy current changes, and the magnetic lines of force generated by the NFC coil can radiate outward through the hollow area, thereby improving the communication quality of the near-field communication of the mobile terminal.

[0036] 2) Please see Figure 2 , the NFC coil is connected in series with the metal battery cover. In this way, the metal battery cover can be used as part of the NFC coil, thereby reducing the generation of eddy currents and improving the communication quality of near-field communication of the mobile terminal.

[0037] However, the first solution mentioned above has the following disadvantages: the slit in the metal battery cover affects the integrity of the metal battery cover and its aesthetics are poor; the second solution mentioned above has the following disadvantages: the assembly process of connecting the NFC coil and the metal battery cover in series is very complicated, and a weak current passes through the metal battery cover when the NFC coil is working, which poses safety issues. In addition, if the metal battery cover is grounded, the operating current in the NFC coil will flow to the ground, significantly reducing the performance of the NFC coil and failing to meet the quality requirements of near-field communication.

[0038] In view of this, an embodiment of the present application provides an electronic device, the electronic device including an NFC chip, including a first differential port and a second differential port; a metal housing, the metal housing including a metal back cover and a metal frame connected to the metal back cover, the metal back cover being provided with a hollow area, the metal frame being provided with a first NFC radiator, the first NFC radiator being insulated from other metal areas of the metal housing except the first NFC radiator; a second NFC radiator, the orthographic projection of the second NFC radiator on the metal back cover at least partially overlapping with the hollow area, one end of the second NFC radiator being connected to one end of the first NFC radiator, and the other end of the second NFC radiator being connected to the first differential port; and a third NFC radiator, One end of the third NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port; wherein the first NFC radiator, the second NFC radiator and the third NFC radiator together form a differential current loop connected to the NFC chip, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area; in this way, during the near field communication process of the electronic device, firstly, because the first NFC radiator is arranged on the metal frame, instead of the NFC coil being pressed under the metal back cover in the traditional technology, the metal back cover of the embodiment of the present application has no electromagnetic shielding effect on the first NFC radiator, and the metal back cover will not be affected by the working current of the first NFC radiator The current excites a reverse eddy current to weaken the working current, thereby improving the quality of near-field communication of the electronic device. Secondly, since the first NFC radiator is insulated from other metal areas in the metal shell except the first NFC radiator, even if the other metal areas in the metal shell are grounded, the first NFC radiator will not be grounded, thus avoiding the loss of working current in the first NFC radiator due to grounding, thereby improving the quality of near-field communication of the electronic device. Furthermore, since the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, the magnetic field lines of the second NFC radiator can radiate through the hollow area without being blocked by the metal back cover, thereby improving the second NFC radiator. The radiation performance of the body can improve the communication quality of the near-field communication of the electronic device; in addition, the third NFC radiator will excite a reverse eddy current on the metal back cover when in operation. However, since the metal back cover is provided with a hollow area, the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area. In this way, the reverse magnetic field generated by the reverse eddy current on the metal back cover will be greatly weakened, and the effective magnetic field of the third NFC radiator is restored, thereby improving the communication quality of the near-field communication of the electronic device; the embodiment of the present application improves the communication quality of the near-field communication of the electronic device at the same time by providing the first NFC radiator, the second NFC radiator and the third NFC radiator, thereby effectively ensuring the smooth progress of the near-field communication of the electronic device.

[0039] Furthermore, in the technical solution provided in the embodiments of the present application, since the first NFC radiator is insulated from other metal areas of the metal housing except for the first NFC radiator, no current will flow on the metal back cover of the electronic device when the first NFC radiator is in operation, thereby improving the safety of the electronic device.

[0040] To facilitate understanding of the embodiments of the present application, a more comprehensive description of the embodiments of the present application will be provided below with reference to the relevant drawings. The drawings provide examples of the embodiments of the present application. However, the embodiments of the present application can be implemented in many different forms and are not limited to the embodiments described in the embodiments of the present application. Rather, the purpose of providing these examples is to make the disclosure of the embodiments of the present application more thorough and comprehensive.

[0041] See also Figure 3 An embodiment of the present application provides an electronic device, which includes an NFC chip 100, a metal housing, a first NFC radiator 400, a second NFC radiator 500, and a third NFC radiator 600.

[0042] The NFC chip 100 includes a first differential port and a second differential port.

[0043] Among them, the metal shell includes a metal back cover 200 and a metal frame 300 connected to the metal back cover 200. The electronic device can be a mobile terminal such as a mobile phone or a tablet computer. The metal frame 300 can refer to the middle frame of the electronic device. The metal back cover 200 and the metal frame 300 can be integrally formed, or of course they can be assembled and connected.

[0044] A first NFC radiator 400 is disposed on the metal frame 300 . The first NFC radiator 400 is insulated from other metal regions of the metal housing except the first NFC radiator 400 . The first NFC radiator 400 is used to transmit NFC signals.

[0045] The metal frame 300 may include an upper metal frame 300 located at the top of the electronic device, a lower metal frame 300 located at the bottom of the electronic device, and two side metal frames 300 located on both sides of the electronic device. In the embodiments of the present application, the first NFC radiator 400 may be disposed in the upper metal frame 300. Several exemplary arrangements of the first NFC radiator 400 in the upper metal frame 300 will be described in detail in the embodiments below.

[0046] In this way, since an operating current will flow in the first NFC radiator 400 during the near-field communication process of the electronic device, by placing the first NFC radiator 400 in the upper metal frame 300 of the electronic device, the probability of a user touching the first NFC radiator 400 when holding the electronic device is low, thereby ensuring the safety of the electronic device.

[0047] Of course, in other optional implementations, the first NFC radiator 400 may also be located in the lower metal frame 300 or the side metal frame 300 of the electronic device, which is not specifically limited here.

[0048] The material of the first NFC radiator 400 can be the same as that of the metal frame 300, that is, both can be made of metal. The first NFC radiator 400 can be rectangular, or can have other regular or irregular shapes.

[0049] In the embodiment of the present application, the length of the first NFC radiator 400 may be greater than or equal to 30 mm. This is because the inventors of the present application discovered through extensive experiments during the research and development process that a length of the first NFC radiator 400 greater than or equal to 30 mm can meet the quality requirements of near-field communication of electronic devices and ensure the reliability of near-field communication of electronic devices.

[0050] One end of the second NFC radiator 500 is connected to one end of the first NFC radiator 400 , and the other end of the second NFC radiator 500 is connected to the first differential port. The second NFC radiator 500 is used to transmit NFC signals.

[0051] The second NFC radiator 500 may be a rectangle or other regular or irregular shape. Taking the rectangular shape as an example, one end of the first NFC radiator 400 may be connected to one short side of the second NFC radiator 500, and the first differential port may be connected to the other short side of the second NFC radiator 500.

[0052] The metal back cover 200 is provided with a hollowed-out area. The orthographic projection of the second NFC radiator 500 on the metal back cover 200 at least partially overlaps with the hollowed-out area. The hollowed-out area is an opening for the electronic device's camera assembly to be exposed from the metal housing. For example, the second NFC radiator 500 can be at least partially pressed under the camera assembly, for example, at least partially pressed between the camera assembly and the device body of the electronic device. Because the camera assembly is exposed from the metal housing, specifically the metal back cover 200, i.e., the camera assembly is not covered by the metal back cover 200, during near-field communication of the electronic device, the magnetic field lines of the second NFC radiator 500 can radiate through the camera assembly without being blocked by the metal back cover 200, thereby improving radiation performance and enhancing the communication quality of near-field communication of the electronic device.

[0053] In addition, since the hollow area is an opening area for the camera component of the electronic device to expose the metal shell, the embodiment of the present application does not need to open a seam on the metal back cover 200 of the electronic device, thereby improving the aesthetics of the metal back cover 200.

[0054] Of course, the hollow area may also be an opening on the metal back cover 200 specifically opened for exposing the magnetic lines of force of the second NFC radiator 500 , and the specific arrangement of the hollow area is not limited herein.

[0055] In the embodiment of the present application, the width of the second NFC radiator 500 may be greater than or equal to 6 mm, and the length of the second NFC radiator 500 may be greater than or equal to 30 mm. This is because the inventors of the present application discovered through extensive experiments during the research and development process that such a size setting of the second NFC radiator 500 can meet the quality requirements of near-field communication of electronic devices and ensure the reliability of near-field communication of electronic devices.

[0056] One end of the third NFC radiator 600 is connected to the other end of the first NFC radiator 400 , and the other end of the third NFC radiator 600 is connected to the second differential port. The third NFC radiator 600 is used to transmit NFC signals.

[0057] In the embodiment of the present application, the orthographic projection area of the third NFC radiator 600 in the metal back cover 200 is a metal area. For example, the third NFC radiator 600 can be disposed between the metal back cover 200 and the device body of the electronic device.

[0058] In one possible implementation, the second NFC radiator 500 and the third NFC radiator 600 are both NFC coils. In another possible implementation, the second NFC radiator 500 and the third NFC radiator 600 are both wires. By configuring the second NFC radiator 500 and the third NFC radiator 600 as wires, the cost of the electronic device can be reduced, which is beneficial to cost control.

[0059] The shape of the third NFC radiator 600 is not specifically limited herein. For example, the third NFC radiator 600 may be a rectangle, or other regular or irregular shapes.

[0060] The first NFC radiator 400 , the second NFC radiator 500 , and the third NFC radiator 600 together form a differential current loop connected to the NFC chip 100 , and the eddy current generated by the third NFC radiator 600 on the metal back cover 200 is at least partially blocked by the hollow area.

[0061] Thus, although the third NFC radiator 600 is pressed against the metal back cover 200 and stimulates a reverse eddy current on the metal back cover 200 during operation, the hollow area of the metal back cover 200 blocks the reverse eddy current, changing its direction. As a result, the reverse magnetic field generated by the reverse eddy current on the metal back cover 200 is greatly weakened, thereby restoring the effective magnetic field of the third NFC radiator 600 and ensuring the communication quality of near-field communication of the electronic device.

[0062] During near-field communication in the electronic device provided in the above embodiment, firstly, because the first NFC radiator 400 is disposed on the metal frame 300, rather than the NFC coil being pressed under the metal back cover 200 as in conventional technology, the metal back cover 200 in the embodiment of the present application does not provide electromagnetic shielding for the first NFC radiator 400, and the metal back cover 200 is not stimulated by the operating current in the first NFC radiator 400 to generate reverse eddy currents to weaken the operating current, thereby improving the quality of near-field communication in the electronic device. Secondly, because the first NFC radiator 400 is insulated from other metal regions in the metal housing other than the first NFC radiator 400, even if the other metal regions in the metal housing are grounded, the first NFC radiator 400 is not grounded, thereby avoiding the loss of the operating current in the first NFC radiator 400 due to grounding, thereby improving the quality of near-field communication in the electronic device. Thirdly, because the second NFC radiator 500 is disposed on the metal back cover 200, the metal back cover 200 is not insulated from the other metal regions in the metal housing other than the first NFC radiator 400. The orthographic projection at least partially overlaps with the hollow area, so that the magnetic lines of force of the second NFC radiator 500 can radiate through the hollow area without being blocked by the metal back cover 200, thereby improving the radiation performance of the second NFC radiator 500 and thus improving the communication quality of the near-field communication of the electronic device. In addition, when the third NFC radiator 600 is in operation, it will excite a reverse eddy current on the metal back cover 200. However, due to the hollow area provided on the metal back cover 200, the eddy current generated by the third NFC radiator 600 on the metal back cover 200 is at least partially blocked by the hollow area. In this way, the reverse magnetic field generated by the reverse eddy current on the metal back cover 200 is greatly weakened, and the effective magnetic field of the third NFC radiator 600 is restored, thereby improving the communication quality of the near-field communication of the electronic device. In this embodiment of the present application, by providing the first NFC radiator 400, the second NFC radiator 500, and the third NFC radiator 600, the communication quality of the near-field communication of the electronic device is simultaneously improved, effectively ensuring the smooth operation of the near-field communication of the electronic device.

[0063] In addition, the technical solution provided by the embodiment of the present application does not require a slit in the metal back cover 200 of the electronic device when the hollowed-out area is an opening area for the camera assembly of the electronic device to expose the metal housing. Instead, the metal housing structure itself is combined to significantly improve the performance of the near-field communication of the electronic device without affecting the appearance of the metal back cover 200, thereby ensuring the communication quality of the near-field communication of the electronic device. The technical solution provided by the embodiment of the present application has a simple structure and process, and only adjusts the area of the NFC coil and a shared radiator (the first NFC radiator 400 can also be used as a WiFi radiator or cellular antenna in actual application scenarios), which can reduce costs. Due to the insulation setting of the first NFC radiator 400, no current will flow on the metal back cover 200 of the electronic device when the first NFC radiator 400 is in operation, thereby improving the safety of the electronic device.

[0064] Several exemplary arrangements of the first NFC radiator 400 in the upper metal frame 300 are described below.

[0065] In the embodiment of the present application, an insulation gap exists between the first NFC radiator 400 and other metal regions in the metal housing except the first NFC radiator 400 .

[0066] As described above, the first NFC radiator 400 can be disposed in the upper metal frame 300 , or in the lower metal frame 300 or the side metal frame 300 of the electronic device. The first NFC radiator 400 can be rectangular or have other regular or irregular shapes.

[0067] In the following, the configuration of the first NFC radiator 400 in the upper metal frame 300 of the electronic device is described through several different embodiments, taking the case where the first NFC radiator 400 is rectangular and located in the upper metal frame 300 of the electronic device as an example.

[0068] In one possible implementation, the first NFC radiator 400 is completely suspended in the upper metal frame 300 , that is, the aforementioned insulating gap surrounds the first NFC radiator 400 , and the first NFC radiator 400 is completely isolated from other metal areas in the metal housing except the first NFC radiator 400 .

[0069] Optionally, combine Figure 4 , Figure 4The figure shows an exemplary arrangement of the first NFC radiator 400 in the upper metal frame 300. The length of the first NFC radiator 400 is shorter than that of the upper metal frame 300, and the width of the first NFC radiator 400 is shorter than that of the upper metal frame 300. The first NFC radiator 400 is arranged in the middle of the upper metal frame 300, and the centerline of the first NFC radiator 400 and the centerline of the upper metal frame 300 coincide with each other.

[0070] exist Figure 4 In the illustrated embodiment, the insulating gap surrounding the first NFC radiator 400 is connected to all four sides of the first NFC radiator 400 , and the insulating gap is entirely located in the upper metal frame 300 .

[0071] Optionally, combine Figure 5 , Figure 5 FIG. 1 is another exemplary schematic diagram of the arrangement of the first NFC radiator 400 in the upper metal frame 300. The length of the first NFC radiator 400 is less than the length of the upper metal frame 300, and the width of the first NFC radiator 400 is less than the width of the upper metal frame 300. The first NFC radiator 400 is arranged at a position on the upper metal frame 300 close to the screen of the electronic device. For example, Figure 5 As shown, one long side of the first NFC radiator 400 can coincide with side a of the upper metal frame 300 (side a is the side where the upper metal frame 300 is connected to the screen). Since there is an inherent insulating layer between side a of the upper metal frame 300 and the screen, the first NFC radiator 400 is not grounded through the screen, and the screen does not block the first NFC radiator 400, thereby not affecting the outward radiation of magnetic field lines by the first NFC radiator 400. Therefore, the connection between the first NFC radiator 400 and the screen does not affect the performance of the first NFC radiator 400.

[0072] exist Figure 5 In the illustrated embodiment, the insulating gap surrounding the first NFC radiator 400 is connected to three sides of the first NFC radiator 400 (excluding the long side where the first NFC radiator 400 is connected to the screen), and the insulating gap is entirely located in the upper metal frame 300.

[0073] Optionally, combine Figure 6 , Figure 6 This figure shows another exemplary arrangement of the first NFC radiator 400 within the upper metal frame 300. The length of the first NFC radiator 400 is shorter than that of the upper metal frame 300, and the width of the first NFC radiator 400 is equal to that of the upper metal frame 300. Thus, one long side of the first NFC radiator 400 can be connected to the screen of the electronic device.

[0074] exist Figure 6 In the embodiment shown, the insulating gap surrounding the first NFC radiator 400 is connected to three sides of the first NFC radiator 400 (i.e., excluding the long side where the first NFC radiator 400 is connected to the screen), wherein the insulating gap connected to the two short sides of the first NFC radiator 400 is located in the upper metal frame 300 (i.e., Figure 6 The insulating gap shown in FIG. 1 is located in the metal back cover 200 and the insulating gap adjacent to the other long side of the first NFC radiator 400 is located in the metal back cover 200 ( Figure 6 The insulating gap is not shown).

[0075] It should be noted that the manner in which the first NFC radiator 400 is completely suspended in the upper metal frame 300 is not limited to the above exemplary embodiment. For example, the entire upper metal frame 300 can also serve as the first NFC radiator 400, and the insulating gap is located in the two side metal frames 300 and the metal back cover 200 of the electronic device to isolate the upper metal frame 300 from the two side metal frames 300 and the metal back cover 200, and so on.

[0076] When the first NFC radiator 400 is completely suspended in the upper metal frame 300 , the first NFC radiator 400 is completely ungrounded, ensuring a good clearance environment for radiation, thereby greatly improving the quality of near-field communication of the electronic device.

[0077] In another possible implementation, the first NFC radiator 400 is partially suspended in the metal frame 300, that is, the first NFC radiator 400 is partially grounded. For example, one side of the first NFC radiator 400 is connected to other metal areas in the metal housing except the first NFC radiator 400, and an insulation gap exists between the remaining sides of the first NFC radiator 400 and other metal areas around the first NFC radiator 400, and so on.

[0078] For example, please combine Figure 7 , Figure 7 FIG. 1 is another exemplary schematic diagram of the arrangement position of the first NFC radiator 400 in the upper metal frame 300. A portion of one side of the first NFC radiator 400 is formed by Figure 7 The connector shown is connected to other metal areas of the upper metal frame 300 except the first NFC radiator 400 . The connector may be a metal connector, and an insulating gap exists between the remaining portion of the periphery of the first NFC radiator 400 and other metal areas around the first NFC radiator 400 .

[0079] It should be noted that the manner in which the first NFC radiator 400 is partially suspended in the metal frame 300 is not limited to the above exemplary embodiments. For example, only two or three sides of the first NFC radiator 400 may be connected to other metal areas of the metal housing other than the first NFC radiator 400, and so on.

[0080] When the first NFC radiator 400 is partially suspended in the metal frame 300, the first NFC radiator 400 is partially grounded. Although this may result in a certain decrease in communication quality compared to an implementation in which the first NFC radiator 400 is completely ungrounded, the partial grounding of the first NFC radiator 400 can still improve the quality of near-field communication of the electronic device compared to an implementation in which the entire metal back cover 200 is completely grounded when the entire metal back cover 200 serves as the NFC coil.

[0081] As an embodiment, the aforementioned insulating gap is filled with an insulating medium, which may be plastic, for example. This can improve the insulation reliability between the first NFC radiator 400 and other surrounding metal areas.

[0082] In this way, because the first NFC radiator 400 is insulated from other metal areas in the metal housing except the first NFC radiator 400, even if the other metal areas in the metal housing are grounded, the first NFC radiator 400 will not be grounded. This can avoid the loss of operating current in the first NFC radiator 400 due to grounding, thereby improving the quality of near-field communication of the electronic device.

[0083] In one embodiment, based on the electronic device described in any of the above embodiments, see Figure 8 In the embodiment of the present application, a first feeding point 410 and a second feeding point 420 are provided in the first NFC radiator 400. One end of the second NFC radiator 500 is connected to one end of the first NFC radiator 400 through the first feeding point 410. One end of the third NFC radiator 600 is connected to the other end of the first NFC radiator 400 through the second feeding point 420.

[0084] In this way, the first NFC radiator 400, the second NFC radiator 500, and the third NFC radiator 600 jointly form a differential current loop connected to the NFC chip 100. By providing the first NFC radiator 400, the second NFC radiator 500, and the third NFC radiator 600, the communication quality of the electronic device near-field communication is simultaneously improved, effectively ensuring the smooth operation of the electronic device near-field communication.

[0085] In the embodiment of the present application, the second NFC radiator 500 and the third NFC radiator 600 can be printed together on a flexible circuit board (FPC), and the orthographic projection of the flexible circuit board on the metal back cover 200 at least partially overlaps with the hollow area.

[0086] For example, see Figure 9 The second NFC radiator 500 can be printed on the portion where the orthographic projection of the flexible circuit board on the metal back cover 200 overlaps with the hollow area, and the third NFC radiator 600 is printed on the portion of the flexible circuit board except the overlapping portion.

[0087] The second NFC radiator 500 and the third NFC radiator 600 printed on the flexible circuit board can be connected to the first NFC radiator 400 via PCB traces (specifically, connected to the first NFC radiator 400 via the first feeding point 410 and the second feeding point 420), and can also be connected to the NFC chip 100 via PCB traces, thereby forming a differential current loop for near-field communication of the electronic device.

[0088] In this way, the embodiment of the present application connects the NFC radiator of the electronic device through the first NFC radiator 400, the second NFC radiator 500, and the third NFC radiator 600. Based on the eddy current generation mechanism and eddy current direction, the eddy current direction on the metal back cover 200 is changed, and a radiator (the first NFC radiator 400 and the second NFC radiator 500) is introduced to ensure communication quality.

[0089] As an embodiment, an inductor component is connected in series between one end of the third NFC radiator 600 and the other end of the first NFC radiator 400 .

[0090] As mentioned above, most mobile terminals use a metal battery cover design to enhance their quality. However, this design significantly reduces the inductance of the NFC coil, lowering its Q value. To address this, the present embodiment connects an inductor component in series between one end of the third NFC radiator 600 and the other end of the first NFC radiator 400 to increase the inductance of the third NFC radiator 600, thereby further improving the near-field communication quality of the electronic device.

[0091] As an embodiment, an inductor component is also connected in series between the second NFC radiator 500 and one end of the first NFC radiator 400 to increase the inductance of the second NFC radiator 500, thereby further improving the communication quality of the near-field communication of the electronic device.

[0092] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. An electronic device, characterized in that: include: An NFC chip comprising a first differential port and a second differential port; A metal housing, the metal housing comprising a metal back cover and a metal frame connected to the metal back cover; the metal back cover is provided with a hollow area, the hollow area being an opening area for the camera assembly of the electronic device to be exposed from the metal housing; a first NFC radiator is provided on the metal frame; an insulating gap is formed between the first NFC radiator and other metal areas of the metal housing other than the first NFC radiator, and the insulating gap surrounds the first NFC radiator; the first NFC radiator is reused as a WiFi radiator or a cellular antenna; a second NFC radiator, wherein an orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, one end of the second NFC radiator is connected to one end of the first NFC radiator, and the other end of the second NFC radiator is connected to the first differential port; a third NFC radiator, wherein the projection area of the third NFC radiator on the metal back cover is a metal area, one end of the third NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port; The first NFC radiator is provided with a first feeding point and a second feeding point. One end of the second NFC radiator is connected to one end of the first NFC radiator via the first feeding point, and one end of the third NFC radiator is connected to the other end of the first NFC radiator via the second feeding point. The first, second, and third NFC radiators together form a differential current loop connected to the NFC chip. The eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area, thereby restoring the effective magnetic field of the third NFC radiator.

2. The electronic device according to claim 1, wherein The insulating gap is filled with an insulating medium.

3. The electronic device according to claim 1, wherein The second NFC radiator and the third NFC radiator are both NFC coils.

4. The electronic device according to claim 1, wherein: The second NFC radiator and the third NFC radiator are both wires.

5. The electronic device according to claim 1, wherein The metal frame includes an upper metal frame, and the first NFC radiator is disposed in the upper metal frame.

6. The electronic device according to claim 1, wherein: An inductor component is connected in series between one end of the third NFC radiator and the other end of the first NFC radiator.

7. The electronic device according to claim 1, wherein: An inductor component is connected in series between one end of the second NFC radiator and one end of the first NFC radiator.

8. The electronic device according to claim 1, wherein: The second NFC radiator and the third NFC radiator are printed on a flexible circuit board, and an orthographic projection of the flexible circuit board on the metal back cover at least partially overlaps with the hollow area.

9. The electronic device according to claim 1, wherein: The length of the first NFC radiator is greater than or equal to 30 mm.

10. The electronic device according to claim 1, wherein The width of the second NFC radiator is greater than or equal to 6 mm, and the length of the second NFC radiator is greater than or equal to 30 mm.

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